JP2007261072A - Ejection releasing method for information recording disk substrate - Google Patents

Ejection releasing method for information recording disk substrate Download PDF

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JP2007261072A
JP2007261072A JP2006088918A JP2006088918A JP2007261072A JP 2007261072 A JP2007261072 A JP 2007261072A JP 2006088918 A JP2006088918 A JP 2006088918A JP 2006088918 A JP2006088918 A JP 2006088918A JP 2007261072 A JP2007261072 A JP 2007261072A
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mold
disk substrate
punch
runner
projecting
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JP4526502B2 (en
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Akira Iijima
彰 飯島
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Nissei Plastic Industrial Co Ltd
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Nissei Plastic Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent poor molding due to adhesion, on releasing, of flash waste produced by gate cutting to an information recording disk substrate molded with a mold or to the fixed stamper by means of specified ejection releasing operation after mold opening. <P>SOLUTION: In opening a mold to protrusion-release an extrusion-molded information recording disk substrate from a movable mold, mold opening is carried out after the punch protruding into the sprue bush is returned to the original position and gate-cut parts of the runner adhered to the surface of the tip of the punch are positioned within the central hole of the disk substrate. The ejection releasing after mold opening is carried out by ejection-releasing the disk substrate through the ejecting sleeve on the cavity mold surface and then ejection-releasing the runner from the surface of the tip of the punch through the sprue ejecting pin. After the ejection releasing of the runner, the ejecting sleeve is returned to the cavity mold surface, and the runner is positioned on the non-signal side of the disk substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、金型に樹脂を射出充填して成形した光ディスクなどの情報記録ディスク基板の突出離型方法に関する。   The present invention relates to a method for projecting and releasing an information recording disk substrate such as an optical disk formed by injection-filling a mold with resin.

樹脂を射出成形して製造した光ディスクなどの情報記録ディスクには、金型のキャビティ内のスタンパに刻設した信号溝・ピットをディスク基板の片面に転写して信号面となし、他面を非信号面としてレーザー光線による信号読取り面としたＣＤ−ＲＯＭディスクやＣＤ−Ｒディスク、片面が信号面のディスクと、レーザー光線による信号読取り面又は表示面とした非信号面のディスクの２枚を張り合わせたＤＶＤ−ＲＯＭディスク、ＤＶＤ−Ｒディスクなどがある。   For information recording discs such as optical discs manufactured by injection molding of resin, signal grooves and pits engraved in the stamper in the mold cavity are transferred to one side of the disc substrate to form a signal surface, and the other side is not A CD-ROM disc or CD-R disc with a signal reading surface by a laser beam as a signal surface, a DVD on which two discs of a signal reading surface by a laser beam and a non-signal surface disk as a display surface are bonded together -ROM disc, DVD-R disc, etc.

この情報記録ディスクのいずれも、固定型と可動型のパーティング面に形成したキャビティの中央に、固定型内のスプルブッシュに対設したポンチを可動型内に備えた金型を使用して成形しており、そのポンチを固定型内のスプルブッシュの先端穴内に突き出して、ディスク基板のゲートカットと中央穴の打抜形成とを行っている。   Both of these information recording disks are molded using a mold that has a punch in the center of the cavity formed on the parting surface of the fixed mold and the movable mold, and is provided with a punch in the movable mold. The punch is projected into the tip hole of the sprue bush in the fixed mold, and the gate cut of the disk substrate and the punching of the center hole are performed.

このポンチによる打抜形成は金型を閉じて行われるが、ポンチ先端とブッシュ先端穴とのクリアランスや僅かな心ずれ、ポンチ先端縁のエッジの僅かな摩耗などによって、スプルブッシュ側のランナとディスク基板とのゲートカット部位に薄膜状の小さなバリが所々に生ずることがある。このバリは以外に脆く、ディスク基板を離型する際の擦れにより剥がれ落ちてバリ屑となり、ディスク基板やスタンパに付着することが多々あった。   This punching is done by closing the mold. There are cases where small thin burrs in the form of a thin film are generated at the gate cut site with the substrate. The burrs are fragile, and the burrs are peeled off due to rubbing when the disk substrate is released to form burrs and often adhere to the disk substrate or stamper.

一般に情報記録ディスクでは、後加工によりディスク基板に保護膜やハードコートなどの成膜処理していることから、バリ屑が信号面に付着しているとその上から成膜処理が行われるので、それがピンホールの発生原因となったり、バリ屑によってはレーザー光線による信号読取りの障害ともなるなどのことから、バリ屑が付着したディスク基板は成形不良品として処分される。   In general, in information recording disks, since film processing such as a protective film and hard coat is performed on the disk substrate by post-processing, if burr scraps adhere to the signal surface, film forming processing is performed from there. This causes pinholes, and depending on burrs, it may cause an obstacle to signal reading by a laser beam. Therefore, the disk substrate to which burrs are attached is disposed as a molding defect product.

またスタンパにバリ屑が付着すると、キャビティに充填した樹脂の圧力によりバリ屑がスタンパに強く押し付けられるので、スタンパの表面に瑕疵が生じたり、あるいは表面に刻設した信号溝・ピットの形状が変形するなどして損傷し、高価なスタンパの交換を余儀なくされることもある。またスタンパの表面のバリ屑がディスク基板の成形時に信号面に移って成形不良となることもある。   Also, if burrs are attached to the stamper, the burrs are strongly pressed against the stamper by the pressure of the resin filled in the cavity, so that the surface of the stamper is wrinkled or the shape of the signal groove / pit formed on the surface is deformed. In some cases, damage may occur and the expensive stamper may be replaced. In addition, burrs on the surface of the stamper may move to the signal surface during molding of the disk substrate, resulting in molding defects.

このバリ屑による不良ディスクの発生を防止する手段として、中央部に貫通孔を有する光ディスク基板を金型側から外方へ突き出し、その光ディスク基板を取出側で吸着すると同時に、光ディスク基板の中央部付近の空気を吸引して中央貫通孔から飛散するバリ屑を除去することが行われている。
特許第３２４２２３０号公報 As a means to prevent the generation of defective discs due to this burr, an optical disc substrate having a through hole in the central portion is protruded outward from the mold side, and the optical disc substrate is adsorbed on the ejection side, and at the same time, near the central portion of the optical disc substrate. The air is sucked in to remove the burr debris scattered from the central through hole.
Japanese Patent No. 3242230

上記従来技術の吸引によるバリ屑の除去は、可動型側のキャビティ型面にスタンパを備えた金型で、スプルを除去した後でなければ行うことができない。スタンパを可動型のキャビティ型面に取り付けている場合には、ディスク基板の信号面がスタンパと密着して型開が行われるので、型開後にスプルを突き出して離型した際に、スプルとディスク基板のゲートカット部位に生じたバリが擦れによりバリ屑となって飛散しても、信号面にはディスク基板をスタンパから離型するまではバリ屑の付着はない。したがって、吸引によるバリ屑の除去は、スプルを離型した後の中央貫通孔内のバリ屑の除去に留まる。   The removal of burrs by suction according to the above prior art can be performed only after removing the sprue with a mold provided with a stamper on the cavity mold surface on the movable mold side. When the stamper is attached to the movable cavity mold surface, the signal surface of the disk substrate is in close contact with the stamper, and the mold is opened. Even if burrs generated at the gate cut portion of the substrate are rubbed and scattered as burrs, the burrs do not adhere to the signal surface until the disk substrate is released from the stamper. Therefore, the removal of the burr waste by suction is limited to the removal of the burr waste in the central through hole after releasing the sprue.

しかし、固定型側のキャビティ型面にスタンパを備えた金型では、型開によりディスク基板をスタンパから離型して、ゲートカットされたスプルとともに可動型側に移行している。このため型開後のディスク基板の信号面は取出側に露出しているので、吸引によりバリ屑を除去するには信号面側の全体を気密にカバーするマスクが必要となる。また吸引力がキャビティ型面とディスク基板の付着力よりも大きいと、ディスク基板が離型するので吸引力にも制限を受け、離型が生じない程度の吸引力では静電気により信号面に付着したバリ屑を完全に除去することは難しい。このようなことから固定型側にスタンパを備えた金型によるディスク基板の成形では、バリ屑の付着防止に吸引手段は採用し難いとされている。   However, in a mold having a stamper on the cavity mold surface on the fixed mold side, the disk substrate is released from the stamper by opening the mold and moved to the movable mold side along with the gate cut sprue. For this reason, since the signal surface of the disk substrate after the mold opening is exposed on the take-out side, a mask that covers the entire signal surface side in an airtight manner is required to remove the burr debris by suction. Also, if the suction force is greater than the adhesion between the cavity mold surface and the disk substrate, the disk substrate will be released, so the suction force will also be limited, and if the suction force does not cause release, it will adhere to the signal surface due to static electricity. It is difficult to completely remove burrs. For this reason, it is difficult to employ a suction means for preventing sticking of burrs when forming a disk substrate using a mold having a stamper on the fixed mold side.

本発明は、ディスク基板を金型から離型して取り出すまでの間にバリ屑が付着するのを防止するために考えられたものであって、その目的は、ディスク基板とスプルと一体のランナのゲートカット部位にバリが生じ、それがバリ屑となっても特別な除去装置を用いることなく、型開後の突出離型操作によりディスク基板への付着を防止できる新たな情報記録ディスク基板の突出離型方法を提供することにある。   The present invention has been conceived to prevent debris from adhering before the disk substrate is released from the mold and taken out. The purpose of the present invention is to provide a runner integrated with the disk substrate and the sprue. A new information recording disk substrate that can prevent sticking to the disk substrate by the projecting mold release operation after mold opening without using a special removal device even if burrs are generated at the gate cut site of It is to provide a protruding mold release method.

上記目的による本発明は、スプルブッシュ周囲のキャビティ型面にスタンパを有する固定型と、スプルブッシュに対設したポンチ及びポンチ周囲のキャビティ型面の突出スリーブを有する可動型とを型締し、両金型により形成されたキャビティに樹脂を充填して情報記録用のディスク基板を成形したのち、ポンチの突き出しによりゲートカットとディスク基板の中央穴の打抜形成とを行い、しかるのち型開してディスク基板の突出離型を行うにあたり、その型開を、スプルブッシュ内に突き出したポンチを元の位置に戻して、ポンチ先端面に付着したランナのゲートカット部位を、ディスク基板の中央穴内に位置させてから行い、型開後の突出離型を、キャビティ型面の突出スリーブによるディスク基板の突出離型、スプル突出ピンによるランナのポンチ先端面からの突出離型の順に行い、そのランナの突出離型後に突出スリーブをキャビティ型面に戻して、突出スリーブ内のランナをディスク基板の非信号面側に位置させてなる、というものである。   The present invention according to the above object clamps a fixed mold having a stamper on a cavity mold surface around a sprue bush, and a movable mold having a punch provided on the sprue bush and a protruding sleeve on the cavity mold surface around the punch. After filling the cavity formed by the mold with resin and molding the disk substrate for information recording, the gate is cut by punching and the center hole of the disk substrate is punched, and then the mold is opened. When projecting and releasing the disk substrate, the mold opening is returned to the original position of the punch protruding into the sprue bush, and the gate cut part of the runner adhering to the punch tip surface is positioned in the center hole of the disk substrate. After the mold is opened, the projecting mold release is performed by the projecting mold release of the disk substrate by the projecting sleeve on the cavity mold surface and the projecting mold by the sprue projecting pin. The projecting mold release from the front end surface of the punch is performed in order, and after the projecting mold release of the runner, the projecting sleeve is returned to the cavity mold surface, and the runner in the projecting sleeve is positioned on the non-signal surface side of the disk substrate. That's it.

上記突出離型方法では、型閉状態で突き出してゲートカットしたポンチを型開前に元の位置に戻して、ディスク基板から切り放したランナのゲートカット部位を、ディスク基板に打抜形成した中央穴内に位置させてから型開するので、型開時に生じ易いゲートカット部位からのバリ屑の飛散を防止することができる。
またバリ屑の飛散防止からディスク基板の信号面や固定型側のスタンパへのバリ屑の付着もなくなるので、バリ屑による成形不良やスタンパの損傷もなくなり、高価なスタンパの使用寿命も長くなる。しかも、バリ屑の飛散防止に吸引などの除去装置を要せず、突出離型操作のみをもって容易に行い得るので、除去装置の出入時間を考慮して型開時間を設定する必要もなく、これまでと同様な成形サイクル時間をもって情報記録ディスク基板の成形を効率良く行うことができる。 In the above-mentioned projecting mold release method, the punch cut out with the mold closed and gate cut is returned to its original position before the mold is opened, and the gate cut portion of the runner cut off from the disk substrate is punched into the disk substrate. Since the mold is opened after being positioned at the position, it is possible to prevent burrs from being scattered from the gate cut portion that is likely to occur when the mold is opened.
Further, since burr scraps are prevented from being scattered, there is no sticking of burr scraps to the signal surface of the disk substrate or the stamper on the fixed mold side, so that molding defects due to burr scraps and damage to the stamper are eliminated, and the service life of the expensive stamper is extended. In addition, no removal device such as suction is required to prevent burrs from being scattered, and it can be easily performed only by protruding mold release operation.Therefore, it is not necessary to set the mold opening time in consideration of the removal time of the removal device. The information recording disk substrate can be efficiently formed with the same forming cycle time as before.

図１は、固定型側にスタンパを備えた情報記録ディスク基板（以下ディスク基板という）の成形用金型の１例を示すものである。   FIG. 1 shows an example of a mold for forming an information recording disk substrate (hereinafter referred to as a disk substrate) having a stamper on the fixed mold side.

１は固定型、２は可動型で、両金型の型閉によりディスク基板を成形する円形のキャビティ３がパーティング面に形成される。このキャビティ３は両金型の対向面に埋設した鏡面盤４，５と、固定型１の鏡面盤中央に嵌装したスプルブッシュ６の周囲の内側スタンパ押え７と、鏡面盤４の外周囲の外側スタンパ押え８との間に形成されており、その鏡面盤４による固定型側のキャビティ型面に情報信号溝・ピットが刻まれたスタンパ９を取り付けている。またスプルブッシュ６の先端面には円形の凹所１０が形成してある。   Reference numeral 1 denotes a fixed die, 2 denotes a movable die, and a circular cavity 3 for forming a disk substrate is formed on the parting surface by closing both dies. The cavity 3 includes mirror plates 4 and 5 embedded in opposing surfaces of both molds, an inner stamper presser 7 around the sprue bush 6 fitted in the center of the mirror plate of the fixed die 1, and an outer periphery of the mirror plate 4. A stamper 9 formed between the outer stamper presser 8 and an information signal groove / pit is provided on the cavity mold surface of the fixed mold side by the mirror surface disc 4. A circular recess 10 is formed on the tip surface of the sprue bush 6.

上記可動型２は、鏡面盤５を埋設した前部金型２ａと後面内を凹部２ｃに形成した後部金型２ｂとからなり、その前部金型２ａと鏡面盤５の中央部にスリーブ１１が嵌着してある。このスリーブ１１の内部にはディスク基板の突出スリーブ１２が挿入してあり、その突出スリーブ１２にポンチ１３が挿入してある。このポンチ１３は先端内周面をアンダーカットに形成して中央に穿設した軸方向の挿通孔にスプル突出ピン１４を備えている。   The movable mold 2 includes a front mold 2a in which a mirror surface board 5 is embedded, and a rear mold 2b in which a rear surface is formed in a recess 2c. A sleeve 11 is provided at the center of the front mold 2a and the mirror surface board 5. Is inserted. A protruding sleeve 12 of a disk substrate is inserted into the sleeve 11, and a punch 13 is inserted into the protruding sleeve 12. This punch 13 is provided with a sprue projecting pin 14 in an axial insertion hole formed in the center by forming the inner peripheral surface of the tip into an undercut.

上記突出スリーブ１２の後端部はフランジ１２ａで金型凹部２ｃに位置し、そのフランジ１２ａの前面と凹部端壁とにわたり設けたばね部材１５により、フランジ１２ａを凹部内の受部材１６に当接して、突出スリーブ１２はスリーブ先端面がキャビティ型面と同一となるように支持されている。   The rear end portion of the protruding sleeve 12 is positioned in the mold recess 2c by a flange 12a, and the flange 12a is brought into contact with the receiving member 16 in the recess by a spring member 15 provided across the front surface of the flange 12a and the end wall of the recess. The protruding sleeve 12 is supported so that the front end surface of the sleeve is the same as the cavity mold surface.

上記ポンチ１３の前部は先端が上記スプルブッシュ６の凹所１０と嵌合する同径の軸部部材からなり、その後端部は突出スリーブ１２の後端から突出してフランジ１２ａより後の金型凹部２ｃに位置する盤体１３ａからなる。この盤体１３ａの前面と上記フランジ１２ａに穿設した貫通孔を通して凹部端壁とにわたり設けたばね部材１７により、該盤体１３ａを金型凹部２ｃの開口内に嵌合してボルト止めした座盤１８の内側凹部１８ａの内端に当接してある。これによりポンチ１３は先端面がパーティング面より設定寸法だけ突出して、スプルブッシュ先端の凹所１０とにより円形のランナとその周縁のゲートとを形成するように支持されている。   The front portion of the punch 13 is a shaft member having the same diameter that fits into the recess 10 of the sprue bush 6, and the rear end portion protrudes from the rear end of the protruding sleeve 12 and is a mold behind the flange 12a. It consists of the board 13a located in the recessed part 2c. A seat base in which the base body 13a is fitted into the opening of the mold concave portion 2c and bolted by a spring member 17 provided over the front surface of the base body 13a and a recess end wall through a through hole formed in the flange 12a. 18 is in contact with the inner end of the inner recess 18a. As a result, the punch 13 is supported so that the tip surface protrudes by a set dimension from the parting surface and forms a circular runner and a peripheral gate by the recess 10 at the tip of the sprue bush.

また盤体１３ａは後面中央に穴部１９を有し、その穴部１９に上記スプル突出ピン１４の後端を連結した突出駒２０の軸部がばね部材２１を介在させて進退自在に挿入してある。この突出駒２０の軸端はフランジ２０ａで、穴部内のばね部材２１により座盤１８の内側凹所１８ａの内段部に当接してある。また座盤１８と突出駒２０の間には突出駒２０と対称形状の作動駒２２が位置している。この作動駒２２は軸部を座盤１８の中央開口に挿入し、軸部前端に形成したフランジ２２ａを突出駒２０のフランジ２０ａと対向させて内側凹所１８ａに収容してある。   Further, the board 13a has a hole 19 in the center of the rear surface, and a shaft part of a protruding piece 20 connecting the rear end of the sprue protruding pin 14 to the hole 19 is inserted through a spring member 21 so as to be freely advanced and retracted. It is. The shaft end of the protruding piece 20 is a flange 20a, which is in contact with the inner step of the inner recess 18a of the seat 18 by a spring member 21 in the hole. In addition, a projecting piece 20 and a symmetrical operating piece 22 are positioned between the seat 18 and the projecting piece 20. The operating piece 22 has a shaft portion inserted into the central opening of the seat 18, and a flange 22 a formed at the front end of the shaft portion faces the flange 20 a of the protruding piece 20 and is accommodated in the inner recess 18 a.

この作動駒２２のフランジ２２ａの片側前面には、フランジ２０ａと上記ポンチ１３の盤体１３ａに穿設した貫通穴を通して、上記突出スリーブ１２のフランジ１２ａの後面に先端が達する長さのスリーブ突出ピン２３が取り付けてあり、そのスリーブ突出ピン２３の反対側に、ポンチ突出ピン２４が座盤１８の穴からフランジ２０ａ，２２ａに穿設した貫通孔を通して上記盤体１３ａに取り付けてある。   A sleeve projecting pin having a length that reaches the rear surface of the flange 12a of the projecting sleeve 12 through a through hole formed in the disk body 13a of the flange 20a and the punch 13 on one side front surface of the flange 22a of the operating piece 22. 23, and a punch projecting pin 24 is attached to the board body 13a on the opposite side of the sleeve projecting pin 23 through a through hole formed in the flange 20a, 22a from the hole of the seat board 18.

このポンチ突出ピン２４の外端と上記作動駒２２の軸部外端には、可動型２の背部に設けた突出ロッド２５，２６の先端がそれぞれ位置しており、その突出ロッド２５の前進作動によりポンチ１３が押されて先端がパーティング面から突き出される。また突出ロッド２６の前進作動により作動駒２２が押されてスリーブ突出ピン２３と共に移動し、突出スリーブ１２の先端をパーティング面から突き出す。さらに作動駒２２は突出駒２０を押圧してスプル突出ピン１４の先端をポンチ先端から突き出す。突出ロッド２５，２６を後退移動するとばね部材１５，１７，２１により全てが元の定位置に復帰する。   At the outer end of the punch projecting pin 24 and the outer end of the shaft portion of the operating piece 22, the tips of projecting rods 25, 26 provided on the back of the movable die 2 are positioned respectively. As a result, the punch 13 is pushed, and the tip protrudes from the parting surface. Further, the operating piece 22 is pushed by the forward movement of the protruding rod 26 and moves together with the sleeve protruding pin 23, and the tip of the protruding sleeve 12 protrudes from the parting surface. Further, the operating piece 22 presses the protruding piece 20 to protrude the tip of the sprue protruding pin 14 from the tip of the punch. When the protruding rods 25 and 26 are moved backward, the spring members 15, 17, and 21 return all of them to their original fixed positions.

以下、図２及び図３により上記構成の情報記録ディスク成形金型によるディスク基板の成形から突出離型までの工程を順に説明する。   Hereinafter, the steps from the formation of the disk substrate to the protruding mold release by the information recording disk forming mold having the above-described configuration will be described in order with reference to FIGS.

図２（Ａ）、固定型１と可動型２を型締し、溶融樹脂をスプルブッシュ６から凹所１０の開口周縁とポンチ先端周縁との間に形成したランナのゲートを経てキャビティ３に射出充填する。キャビティ３では樹脂の円形板が形成され、その円形板は固定型側の盤面にスタンパ９の信号溝・ピットが転写されてディスク基板３０となる。また凹所１０から溶融樹脂の一部がスプル突出ピン１４の先端のポンチ先端内に充填される。   2A, the fixed mold 1 and the movable mold 2 are clamped, and molten resin is injected from the sprue bush 6 into the cavity 3 through the runner gate formed between the opening periphery of the recess 10 and the periphery of the punch tip. Fill. A resin circular plate is formed in the cavity 3, and the signal groove / pit of the stamper 9 is transferred to the disk surface on the fixed mold side to form the disk substrate 30. Further, a part of the molten resin is filled from the recess 10 into the punch tip at the tip of the sprue projecting pin 14.

図２（Ｂ）、スプルブッシュ先端の凹所１０の樹脂が完全に固化しないうちにポンチ１３を前進移動して凹所内に押し込む。これによりゲートカットが行われて凹所内の樹脂とキャビティ内のディスク基板３０とが切り放される。またディスク基板３０の中央にポンチ１３と同径の中央穴が打抜形成される。切り放された凹所内の樹脂はスプル３１と一体の円盤状のランナ３１ａとなる。このゲートカットによりランナ３１ａのポンチ先端面と接する周縁と、ディスク基板３０の中央穴の周縁のゲートカット部位に薄膜状の小さなバリが部分的に生ずることがある。   2B, the punch 13 is moved forward and pushed into the recess before the resin in the recess 10 at the tip of the sprue bush is completely solidified. As a result, the gate is cut, and the resin in the recess and the disk substrate 30 in the cavity are separated. A central hole having the same diameter as the punch 13 is punched and formed in the center of the disk substrate 30. The resin in the cut-out recess becomes a disc-shaped runner 31a integrated with the sprue 31. This gate cut may cause small thin burrs in the form of a thin film at the periphery of the runner 31a in contact with the punch tip surface and at the gate cut site at the periphery of the center hole of the disk substrate 30.

図２（Ｃ）、ディスク基板３０が固化したらポンチ１３を元の位置に戻し、スプルブッシュ６とスプル３１の離型を行う。スプル３１はポンチ先端内のアンダカットにより、ポンチ先端面にランナ３１ａを付着した状態でポンチ後退分だけスプルブッシュ６から抜け出す。   2C, when the disk substrate 30 is solidified, the punch 13 is returned to the original position, and the sprue bush 6 and the sprue 31 are released. The sprue 31 is pulled out of the sprue bush 6 by the amount of retraction of the punch while the runner 31a is attached to the punch front end surface due to the undercut in the punch front end.

図３（Ａ）、可動型２を後退移動して型開する。ディスク基板３０は可動型２の鏡面盤５に付着して可動型側に残るので、型開後に突出スリーブ１２を突出作動し、ディスク基板３０をパーティング面から突き出して鏡面盤５から離型する。このときポンチ先端面のスプル３１はポンチ１３により拘束されているので、ランナ３１ａのゲートカット部位が突出スリーブ１２の先端部内に位置する。   3A, the movable mold 2 is moved backward to open the mold. Since the disk substrate 30 is attached to the mirror surface board 5 of the movable mold 2 and remains on the movable mold side, the protruding sleeve 12 is operated to protrude after the mold is opened, and the disk substrate 30 is protruded from the parting surface and released from the mirror surface board 5. . At this time, since the sprue 31 on the front end surface of the punch is restrained by the punch 13, the gate cut portion of the runner 31a is located in the front end portion of the protruding sleeve 12.

図３（Ｂ）、ディスク基板３０の突出離型に続いてスプル突出ピン１４を、ランナ３１ａのゲートカット部位が突出スリーブ１２の先端内に留まるところまで突出作動して、ポンチ先端面からランナ３１ａを離型する。突出スリーブ１２によるディスク基板３０の突出動作とスプル突出ピン１４によるランナ３１ａの突出作動と相前後して、製品取出機（図は省略）を固定型１と可動型２の間に挿入して、吸着パット（図は省略）によりディスク基板３０を押さえ、同時に製品取出機（図は省略）によりスプル３１を挟み持つ。   3B, following the protrusion release of the disk substrate 30, the sprue protrusion pin 14 is operated to protrude until the gate cut portion of the runner 31a stays within the tip of the protrusion sleeve 12, and the runner 31a from the punch tip surface. Release the mold. In parallel with the projecting operation of the disk substrate 30 by the projecting sleeve 12 and the projecting operation of the runner 31a by the sprue projecting pin 14, a product take-out machine (not shown) is inserted between the fixed mold 1 and the movable mold 2, The disk substrate 30 is pressed by a suction pad (not shown), and at the same time, the sprue 31 is held by a product take-out machine (not shown).

図３（Ｃ）、しかるのち、突出スリーブ１２を元に戻して先端内からランナ３１ａを抜き外す。これによりランナ３１ａはディスク基板３０の中央穴から信号面側に抜け出ることなく、ディスク基板３０の非信号面側に位置する。この状態でディスク基板３０とスプル３１を金型の型開閉エリアから外部に移送し、先にスプル３１を中央穴から非信号面側に抜き外してからディスク基板３０の収納を行う。   3C, after that, the protruding sleeve 12 is returned to the original position, and the runner 31a is removed from the tip. As a result, the runner 31a is positioned on the non-signal surface side of the disk substrate 30 without coming out from the central hole of the disk substrate 30 to the signal surface side. In this state, the disk substrate 30 and the sprue 31 are transferred to the outside from the mold opening / closing area of the mold, and the sprue 31 is first removed from the central hole to the non-signal surface side before the disk substrate 30 is stored.

上記突出離型方法によれば、スプル３１のランナ３１ａに生じたゲートカット部位が、型閉時にポンチ１３の戻しによりディスク基板３０の中央穴内に引き込まれるので、ゲートカット時に生じたバリが型開時にバリ屑となって信号面側に飛散したり、スタンパ９に付着するようなことがない。また型開後の突出離型はディスク基板３０の突出離型が先行するので、ランナ３１ａのゲートカット部位が成形されたディスク基板３０の転写面側に位置することはなく、ゲートカット部位にバリが生じていても、突出離型時又は取出途中にバリ屑となってディスク基板３０の転写面に付着するようなこともない。したがって、バリ屑の付着によるディスク基板３０の成形不良が防止される。   According to the protruding mold release method, the gate cut portion generated in the runner 31a of the sprue 31 is drawn into the central hole of the disk substrate 30 by the return of the punch 13 when the mold is closed. Sometimes it does not become burrs and fly to the signal surface side or adhere to the stamper 9. Further, since the projecting mold release after the mold opening is preceded by the projecting mold release of the disc substrate 30, the gate cut site of the runner 31a is not positioned on the transfer surface side of the molded disc substrate 30, and the gate cut site is not changed. Even if this occurs, it does not become burr scraps during sticking or during take-off and adhere to the transfer surface of the disk substrate 30. Therefore, molding defects of the disk substrate 30 due to the adhesion of burrs are prevented.

この発明の金型におけるディスク基板の突出離型方法を採用し得る金型の型締状態における断面図である。It is sectional drawing in the mold clamping state of the metal mold | die which can employ | adopt the protrusion mold release method of the disk substrate in the metal mold | die of this invention. この発明のディスク基板の突出離型方法の型閉状態での工程説明図である。It is process explanatory drawing in the mold closed state of the protrusion mold release method of the disc substrate of this invention. 同じく型開後の工程説明図である。It is process explanatory drawing after a mold opening similarly.

符号の説明Explanation of symbols

１ 固定型
２ 可動型
３ キャビティ
４，５ 鏡面盤
６ スプルブッシュ
９ スタンパ
１０ 凹所
１２ 突出スリーブ
１３ ポンチ
１４ スプル突出ピン
２０ 突出駒
１５，１７，２１ ばね部材
２２ 作動駒
２４ ポンチ突出ピン
２５，２６ 突出ロッド
３０ ディスク基板
３１ スプル
３１ａ スプルのランナ DESCRIPTION OF SYMBOLS 1 Fixed type 2 Movable type 3 Cavity 4,5 Mirror surface board 6 Sprue bush 9 Stamper 10 Recess 12 Protrusion sleeve 13 Punch 14 Sprue protrusion pin 20 Protrusion piece 15, 17, 21 Spring member 22 Actuation piece 24 Punch protrusion pin 25, 26 Protruding rod 30 Disc substrate 31 Spru 31a Sprue runner

Claims (1)

スプルブッシュ周囲のキャビティ型面にスタンパを有する固定型と、スプルブッシュに対設したポンチ及びポンチ周囲のキャビティ型面の突出スリーブを有する可動型とを型締し、両金型により形成されたキャビティに樹脂を充填して情報記録用のディスク基板を成形したのち、ポンチの突き出しによりゲートカットとディスク基板の中央穴の打抜形成とを行い、しかるのち型開してディスク基板の突出離型を行うにあたり、
その型開を、スプルブッシュ内に突き出したポンチを元の位置に戻して、ポンチ先端面に付着したランナのゲートカット部位を、ディスク基板の中央穴内に位置させてから行い、
型開後の突出離型を、キャビティ型面の突出スリーブによるディスク基板の突出離型、スプル突出ピンによるランナのポンチ先端面からの突出離型の順に行い、そのランナの突出離型後に突出スリーブをキャビティ型面に戻して、突出スリーブ内のランナをディスク基板の非信号面側に位置させてなることを特徴とする情報記録ディスク基板の突出離型方法。 Cavity formed by both molds by clamping a fixed mold having a stamper on the cavity mold surface around the sprue bush and a movable mold having a punch provided on the sprue bush and a protruding sleeve on the cavity mold surface around the punch. After forming a disk substrate for information recording by filling the resin, gate cutting and punching formation of the center hole of the disk substrate are performed by punching out, and then the mold is opened to release the disk substrate. In doing so,
The mold is opened after the punch protruding into the sprue bush is returned to its original position, and the gate cut portion of the runner attached to the tip of the punch is located in the center hole of the disk substrate.
After the mold is opened, the projecting mold release is performed in the order of the projecting mold release of the disk substrate by the projecting sleeve on the cavity mold surface, and the projecting mold release from the punch tip surface of the runner by the sprue projecting pin. And a runner in the projecting sleeve is positioned on the non-signal surface side of the disc substrate.
JP2006088918A 2006-03-28 2006-03-28 Method of protruding and releasing information recording disk substrate Expired - Fee Related JP4526502B2 (en)

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Citations (6)

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JPH0379322A (en) * 1989-08-23 1991-04-04 Meiki Co Ltd Disk molding die
JPH06198685A (en) * 1992-12-28 1994-07-19 Meiki Co Ltd Injection molding apparatus for disk
JPH08221813A (en) * 1995-02-16 1996-08-30 Mitsubishi Chem Corp Production of resin disk substrate
JPH11179762A (en) * 1997-12-24 1999-07-06 Mitsubishi Chemical Corp Mold for molding disc
JP2000076709A (en) * 1998-08-28 2000-03-14 Meiki Co Ltd Disk molding method
JP2002240101A (en) * 2000-12-15 2002-08-28 Sony Corp Disk board and mold apparatus for injection molding the same, robot for fetching disk board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0379322A (en) * 1989-08-23 1991-04-04 Meiki Co Ltd Disk molding die
JPH06198685A (en) * 1992-12-28 1994-07-19 Meiki Co Ltd Injection molding apparatus for disk
JPH08221813A (en) * 1995-02-16 1996-08-30 Mitsubishi Chem Corp Production of resin disk substrate
JPH11179762A (en) * 1997-12-24 1999-07-06 Mitsubishi Chemical Corp Mold for molding disc
JP2000076709A (en) * 1998-08-28 2000-03-14 Meiki Co Ltd Disk molding method
JP2002240101A (en) * 2000-12-15 2002-08-28 Sony Corp Disk board and mold apparatus for injection molding the same, robot for fetching disk board

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