JP2007258577A - Interconnection forming material, interconnection, and interconnection forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an interconnection forming material which is very reliable, high in performance, low in price, and applicable to a so-called super connection; and to provide interconnections and an interconnection forming method. <P>SOLUTION: The interconnection forming material is equipped with a support, at least, a foaming layer and an interconnection forming layer which are formed in this sequence on the support; and the interconnection forming layer contains, at least, metallic nanoparticles and a light-heat conversion material. In the interconnection forming material, a protrudent metal body can be formed in a region irradiated with a light beam when the light beam irradiates the interconnection forming material drawing a pattern-like form. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring forming material applicable to a novel super connect, a wiring formed using the wiring forming material, and a wiring forming method.

Recently, in response to the evolution of the digital network information society, a new three-dimensional packaging technology called system-in-package (SiP) has attracted attention. For example, a chip is fixed to an ultra-thin and small support called an interposer, and a plurality of these are combined to put the system in one package. In such a SiP, in addition to the semiconductor chip, coils, capacitors, crystal oscillators, etc. can be housed in one package, so the speed, power, mounting area, etc. are higher than those of electronic systems made with conventional printed circuit boards. In many cases, the performance can be improved several times, and performance comparable to that of a system LSI can be realized.
In such a SiP, it is strongly desired to provide a wiring technology with a width of several μm to several tens of μm, which is called a so-called super connect, but a high-reliability, high-performance and low-cost one has not yet been provided. is the current situation.

  An object of the present invention is to solve the above-described problems and achieve the following objects. That is, the present invention provides a highly reliable, high-performance, low-cost wiring forming material applicable to so-called super connect, and a wiring formed using the wiring forming material and a wiring forming method. Objective.

Means for solving the problems are as follows. That is,
<1> A wiring forming material having a support, and on the support, at least a foam layer and a wiring-forming layer in this order,
The wiring-forming layer contains at least metal nanoparticles and a photothermal conversion substance;
The wiring forming material is a wiring forming material characterized in that a projection-like metal body can be formed in a region irradiated with light by being irradiated with light in a pattern.
<2> The metal nanoparticle according to <1>, wherein the metal nanoparticle is a particle composed of at least one selected from a metal simple substance, an oxide semiconductor, a spinel compound, a conductive nitride, a conductive boride, and a mixture thereof. This is a wiring forming material.
<3> The wiring forming material according to any one of <1> to <2>, wherein the metal nanoparticles are particles made of any one of Au, Ag, and Cu.
<4> The wiring forming material according to any one of <1> to <3>, wherein the metal nanoparticles have a particle size of 30 nm or less.
<5> The wiring forming material according to any one of <1> to <4>, wherein the metal nanoparticles have a melting point of 300 ° C. or lower.
<6> The wiring forming material according to any one of <1> to <5>, wherein the photothermal conversion substance has a maximum absorption wavelength of 330 to 1300 nm.
<7> The wiring forming material according to any one of <1> to <6>, wherein the foam layer contains a foam material, and the foam material is a photosensitive foam material.
<8> The wiring forming material according to <7>, wherein the photosensitive foam material is at least one selected from a diazonium salt compound, a quinonediazide compound, and an azide compound.
<9> The wiring forming material according to any one of <7> to <8>, wherein the photosensitive foam material is encapsulated in a microcapsule.
<10> The wiring forming material according to any one of <1> to <9>, wherein the foamed layer contains a photothermal conversion substance.
<11> The wiring forming material according to any one of <1> to <10>, wherein the oxygen permeability coefficient of the foam layer is 1.0 ml · 25 μm / m ² · 24 h · atm or less.
<12> The above <1> to <11, wherein a gas barrier layer is provided in at least one of the upper layer and the lower layer of the foamed layer, and the oxygen permeability coefficient of the gas barrier layer is 0.5 ml · 25 μm / m ² · 24 h · atm or less. > The wiring forming material according to any one of the above.
<13> The wiring forming material according to any one of <1> to <12>, wherein light irradiation is performed in a pattern, and a protrusion-shaped metal body is formed in the light irradiated region. This is a wiring formation method.
<14> The wiring forming method according to <13>, wherein the energy intensity of light irradiation is 1 to 100 J / cm ² .
<15> A wiring obtained by the wiring forming method according to any one of <13> to <14>.
<16> The wiring according to <15>, wherein the metal body has a height of 200 nm or more.
<17> The wiring according to any one of <15> to <16>, which is used for a super connect.

  The wiring forming material of the present invention comprises a support, a foam layer on the support, and a wiring forming layer containing metal nanoparticles and a photothermal conversion substance in this order. By projecting light on the wiring forming material in a pattern, it is possible to form a protruding metal body in the region irradiated with the light. As a result, it is possible to provide a wiring forming material that has high reliability, high performance, and low price, can be applied to so-called super connect, and is useful for the electronics industry.

In the wiring forming method of the present invention, the wiring forming material of the present invention is irradiated with light in a pattern, and a protrusion-shaped metal body is formed in the light irradiated region.
The wiring of the present invention is formed by the wiring forming method of the present invention.
The wiring and wiring forming method of the present invention are highly reliable, high performance, and low in price, and can be applied to so-called superconnects.

  According to the present invention, it is possible to solve the problems in the prior art, high reliability, high performance, and low price, and a wiring forming material applicable to so-called super connect, and wiring formed using the wiring forming material In addition, a wiring formation method can be provided.

(Wiring forming material)
The wiring forming material of the present invention has a support, a foamed layer, and a wiring-forming layer on the support in this order, and further has other configurations as necessary.
By irradiating the wiring forming material with light in a pattern, it is possible to form a protrusion-shaped metal body (projection-shaped object) in the region irradiated with the light.

<Support>
The support (substrate) is preferably a dimensionally stable plate, for example, paper, paper laminated with plastic (eg, polyethylene, polypropylene, polystyrene, etc.), metal plate (eg, aluminum) Zinc, copper, etc.), plastic film (eg, cellulose diacetate, cellulose triacetate, cellulose propionate, cellulose butyrate, cellulose acetate butyrate, cellulose nitrate, polyethylene terephthalate, polyethylene, polystyrene, polypropylene, polycarbonate, polyvinyl acetal, etc.); Examples include a paper or plastic film on which a metal such as aluminum, zinc, or copper is laminated or vapor-deposited, a ceramic substrate such as a silicon wafer, and the like. Among these, a polyester film, an aluminum plate, or a ceramic substrate is particularly preferable.
The aluminum plate used as the substrate may be subjected to a known surface treatment such as roughening treatment or anodizing treatment as necessary. Moreover, when using plastic films, such as a polyester film which is another preferable aspect, it is preferable to use what was roughened from the viewpoint of the formability of a wiring formation layer and adhesiveness.
When the roughened support is used, the surface properties thereof preferably satisfy the following conditions. As a preferable state of the roughened support, the center line average roughness (Ra) of the two-dimensional roughness parameter is 0.1 to 1 μm, the maximum height (Ry) is 1 to 10 μm, and the ten-point average roughness. (Rz) is 1 to 10 μm, average interval between concaves and convexes (Sm) is 5 to 80 μm, average interval between local peaks (S) is 5 to 80 μm, maximum height (Rt) is 1 to 10 μm, centerline peak height (Rp) ) Is preferably 1 to 10 μm and the centerline valley depth (Rv) is 1 to 10 μm, preferably satisfying one or more of these conditions, more preferably satisfying all.

The support may be appropriately prepared or a commercially available product may be used.
There is no restriction | limiting in particular as thickness of the said support body, Although it can select suitably according to the objective, 0.01-1000 micrometers is preferable and 0.1-500 micrometers is more preferable.

<Wiring forming layer>
The wiring forming layer contains at least metal nanoparticles and a photothermal conversion substance, and further contains a binder and, if necessary, other components.

-Metal nanoparticles-
The metal nanoparticles are not particularly limited and may be appropriately selected depending on the purpose. For example, simple metals, oxide semiconductors, spinel compounds, conductive nitrides, conductive borides, or mixtures thereof Etc.

Examples of the simple metal include Au, Ag, Cu, Pt, Rh, Pd, Al, Cr, and alloys thereof, and among these, Au, Ag, and Cu are particularly preferable.
Examples of the oxide semiconductor include In ₂ O ₃ , SnO ₂ , ZnO, Cdo, TiO ₂ , CdIn ₂ O ₄ , Cd ₂ SnO ₂ , Zn ₂ SnO ₄ , In ₂ O ₃ —ZnO, and the like. It is also possible to use a material doped with an impurity compatible with the above.
Examples of the spinel compound include MgInO and CaGaO.
Examples of the conductive nitride include TiN, ZrN, HfN, and the like.
Examples of the conductive boride include LaB.

The metal nanoparticles have a particle size of preferably 30 nm or less, and more preferably 10 nm or less. When the particle diameter exceeds 30 nm, the melting point of the metal nanoparticles becomes high and may not be easily melted by heating.
The melting point of the metal nanoparticles is preferably 250 ° C. or less, and more preferably 80 to 220 ° C. When the melting point exceeds 250 ° C., it may be difficult to melt by heating.
10-95 mass% is preferable and, as for content in the said wiring formation layer of the said metal nanoparticle, 50-90 mass% is more preferable. When the content is less than 10% by mass, desired conductivity may not be obtained, and when it exceeds 95% by mass, stability may be deteriorated.

-Photothermal conversion material-
The photothermal conversion material is not particularly limited as long as it is a material that can absorb ultraviolet light, visible light, infrared light, white light, or the like and convert it into heat, and can be used, for example, carbon black, carbon graphite, organic pigment. , Iron powder, graphite powder, iron oxide powder, lead oxide, silver oxide, chromium oxide, iron sulfide, chromium sulfide and the like. Among these, dyes, pigments, or metal fine particles having a maximum absorption wavelength in the range of 330 nm to 1300 nm are particularly preferable.

As the dye, commercially available dyes and known dyes described in literature (for example, “Dye Handbook” edited by Organic Synthetic Chemical Society, published in 1970) can be used. Specific examples include azo dyes, metal complex salt azo dyes, pyrazolone azo dyes, anthraquinone dyes, phthalocyanine dyes, carbonium dyes, quinoneimine dyes, methine dyes, cyanine dyes, and metal thiolate complexes.
Examples of preferable dyes include cyanine dyes described in, for example, JP-A-58-125246, JP-A-59-84356, JP-A-59-202829, JP-A-60-78787, and the like. Methine dyes described in JP-A-58-173696, JP-A-58-181690, JP-A-58-194595, JP-A-58-112793, JP-A-58- Naphthoquinone dyes described in JP-A-224793, JP-A-59-48187, JP-A-59-73996, JP-A-60-52940, JP-A-60-63744, etc. Examples thereof include squarylium dyes described in JP-A-58-112792, and cyanine dyes described in British Patent No. 434,875.

  Further, near infrared absorption sensitizers described in US Pat. No. 5,156,938 are also preferably used, and substituted arylbenzo (thio) described in US Pat. No. 3,881,924. ) Pyrylium salt, trimethine thiapyrylium salt described in JP-A-57-142645 (US Pat. No. 4,327,169), JP-A-58-181051, JP-A-58-220143, No. 59-41363, 59-84248, 59-84249, 59-146063, 59-146061, and pyrium compounds described in JP-A-59-216146. The cyanine dyes described above, the pentamethine thiopyrylium salt described in US Pat. No. 4,283,475, and the like, and Japanese Patent Publication No. 5-13514, 5-1 Pyrylium compounds Nos disclosed in Japanese 702 also preferably used. Examples of other preferable dyes include near-infrared absorbing dyes described as formulas (I) and (II) in US Pat. No. 4,756,993. Among these, cyanine dyes, squarylium dyes, pyrylium salts, and nickel thiolate complexes are particularly preferable.

The pigment is not particularly limited and may be appropriately selected according to the purpose. However, commercially available pigments and color index (CI) manuals, “Latest Pigment Manual” (edited by Japan Pigment Technical Association, published in 1977). ), "Latest Pigment Applied Technology" (CMC Publishing, 1986), "Printing Ink Technology" CMC Publishing, 1984) can be used. Examples of the pigment include black pigments, yellow pigments, orange pigments, brown pigments, red pigments, purple pigments, blue pigments, green pigments, fluorescent pigments, metal powder pigments, and other polymer-bonded dyes. Specifically, insoluble azo pigments, azo lake pigments, condensed azo pigments, chelate azo pigments, phthalocyanine pigments, anthraquinone pigments, perylene and perinone pigments, thioindigo pigments, quinacridone pigments, dioxazine pigments, isoindolinone pigments In addition, quinophthalone pigments, dyed lake pigments, azine pigments, nitroso pigments, nitro pigments, natural pigments, fluorescent pigments, inorganic pigments, carbon black, and the like can be used. Among these, carbon black is particularly preferable.
In addition, the said pigment or dye may be used individually by 1 type, and may use multiple types together.

  The addition amount of these dyes or pigments is preferably 0.01 to 50% by mass, more preferably 0.1 to 10% by mass, based on the total solid content of the wiring-forming layer. In the case of the said dye, 0.5-10 mass% is especially preferable. In the case of the pigment, 0.1 to 10% by mass is particularly preferable. If the amount of the pigment or dye added is less than 0.01% by mass, the sensitivity may be low, and if it exceeds 50% by mass, the film strength of the photothermal conversion substance-containing layer may be weakened.

An infrared absorbing material is suitable as a material that efficiently causes photothermal conversion. The infrared absorbing material is not particularly limited as long as it absorbs infrared rays, and can be appropriately selected according to the purpose. Among inorganic compounds, carbon black is preferable. Of the organic compounds, infrared absorbing dyes and pigments are preferred. Among these, cationic dyes, complex salt-forming dyes, and quinone-based neutral dyes described below are preferable.
The infrared absorbing dye / pigment may be added to any of binder, microcapsule oil, and microcapsule wall. When added to the binder, it is preferable to use a water-soluble one, and when adding to the binder, an oil-soluble one is used.
The coating amount of the infrared absorbing dye / pigment is determined by the absorbance of the wavelength having the highest absorbance in the infrared region in the wiring forming material. As this light absorbency, the range of 0.1-4.0 is preferable and the range of 0.2-2.5 is more preferable.

The infrared absorbing dye / pigment used in the present invention will be described in detail below. As the cationic dye, a dye represented by the following structural formula (i) is preferable.
D ₁ ⁺ [X ₁ ^{−1 / m} ] _m. Structural formula (i)
However, in the structural formula (i), D ₁ ⁺ represents a cationic dye mother nucleus. X ₁ ^- represents a counter anion. m represents an integer of 1 to 4.

Examples of D ₁ ⁺ that is a cationic dye mother nucleus in the structural formula (i) include polymethine (including cyanine), azurenium, pyrylium, thiopyrylium, squarylium, triarylmethane, immonium, and diimmonium. .
X ₁ ^{-1 / m} is not particularly limited as long as it can form a counter anion, and can be appropriately selected according to the purpose. Examples thereof include ClO ₄ ⁻ , BF ⁻ , I ⁻ , Cl ⁻ , and the like. Is mentioned.

Examples of the cationic dye include specific dyes represented by the following structural formula.

  As the complex salt-forming dye, for example, a thiol nickel complex dye, a phthalocyanine dye, and a naphthalocyanine dye are preferable, and specific dyes can be mentioned as follows.

  The quinone neutral dye is preferably a naphthoquinone dye or an anthraquinone dye, and specific dyes such as the following can be exemplified.

Of the infrared absorbing dyes, those having an active group that reacts with the microcapsule wall material at the time of microcapsule formation are also effective.
There is no restriction | limiting in particular as said active group, According to the objective, it can select suitably, For example, an isocyanate group, a hydroxy group, a mercapto group, an amino group etc. are mentioned. Among these, an isocyanate group and a hydroxy group are particularly preferable, and a cationic dye having an active group, a complex salt-forming dye, and a quinone neutral dye as described below are particularly preferable.

The cationic dye having the active group is preferably a dye represented by the following structural formula (i).
D ₁ ⁺ [X ₁ ^{−1 / m} ] _m. Structural formula (i)
However, in the structural formula (i), D ₁ ⁺ represents a cationic dye mother nucleus. X ₁ ^- represents a counter anion. m represents an integer of 1 to 4.

As D ₁ ⁺ which is a cationic dye mother nucleus in the structural formula (i), for example, polymethine (including cyanine), azurenium, pyrylium, thiopyrylium, squarylium, triarylmethane, immonium, diimmonium, and the like are preferable.
X ₁ ^{−1 / m} is not particularly limited as long as it can form a counter anion.
The active group that reacts with the microcascel wall may be either D ₁ ⁺ or X ₁ ^{−1 / m} .

Preferred examples of the cationic dye having the active group include the following specific dyes.

  The complex-forming dye having an active group is preferably a thiol nickel complex-based dye, a phthalocyanine-based dye, or a naphthalocyanine-based dye, and examples thereof include the following specific dyes.

  As the quinone neutral dye having an active group, for example, naphthoquinone dyes and anthraquinone dyes are preferable, and the following specific dyes can be preferably exemplified.

  The infrared absorbing dye may be added to any of the polymer material, the microcapsule oil, and the microcapsule wall, and when added to the polymer material, the water-soluble one is added to the others. In this case, it is preferable to use an oil-soluble one.

  The content of the infrared absorbing dye is determined by the absorbance of the wavelength having the highest absorbance in the infrared region in the produced wiring forming material, and the absorbance is preferably 0.1 to 4.0, preferably 0.2 to 2.5 is more preferable.

  Moreover, it is preferable that the wiring-forming layer further contains nitrocellulose in the wiring-forming layer for the purpose of improving the photothermal conversion effect. The nitrocellulose can be decomposed by heat generated by absorption of near-infrared laser light by a light absorber to efficiently decompose a diazonium salt, or can be used for graft chain formation by gas generation from the nitrocellulose itself.

  The nitrocellulose is produced by converting a natural cellulose purified by a conventional method into a nitrate with a mixed acid, and introducing some or all of the nitro groups into the three hydroxyl groups present in the glucopyranose ring, which is a constituent unit of cellulose. Obtainable. The nitrification degree of the nitrocellulose is preferably 2 to 13, more preferably 10 to 12.5, and still more preferably 11 to 12.5. Here, the nitrification degree represents mass% of nitrogen atoms in nitrocellulose. When the nitrification degree is extremely high, the effect of promoting ablation is enhanced, but the room temperature stability tends to be lowered. In addition, nitrocellulose becomes explosive and there is a risk in handling nitrocellulose when producing a pattern forming material. On the other hand, if the degree of nitrification is extremely low, the effect of promoting ablation may not be sufficiently obtained.

The degree of polymerization of the nitrocellulose is preferably 20 to 200, more preferably 25 to 150. If the degree of polymerization is too high, the removal of the wiring formable layer may be incomplete, and if the degree of polymerization is too low, the film formability of the wiring formable layer may be poor.
There is no restriction | limiting in particular in content of the said nitrocellulose, According to the objective, it can select suitably, 0-80 mass% is preferable with respect to the said wiring formation layer whole quantity, 5-70 mass% is more preferable, 30 -70 mass% is still more preferable.

-Binder-
The binder in the wiring-forming layer is used for the purpose of enhancing the coating property, film strength, and ablation effect, and is considered compatible with the photothermal conversion material or dispersibility of the photothermal conversion material. Are appropriately selected. Examples of the binder include unsaturated acids such as (meth) acrylic acid and itaconic acid, alkyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, styrene, α-methylstyrene, and the like. A copolymer of alkyl methacrylate represented by polymethyl methacrylate or a copolymer of alkyl acrylate; copolymer of alkyl (meth) acrylate and acrylonitrile, vinyl chloride, vinylidene chloride, styrene, etc .; and acrylonitrile , Vinyl chloride or copolymer with vinylidene chloride; modified cellulose having a carboxyl group in the side chain; polyethylene oxide; polyvinyl pyrrolidone; phenol, o-, m-, p-cresol, or xylenol with aldehyde, acetone, etc. Novolak resin obtained by condensation reaction; Polyether of chlorohydrin and bisphenol A; soluble nylon; polyvinylidene chloride; chlorinated polyolefin; copolymer of vinyl chloride and vinyl acetate; polymer of vinyl acetate; copolymer of acrylonitrile and styrene; Copolymer with styrene; polyvinyl alkyl ether; polyvinyl alkyl ketone; polystyrene; polyurethane; polyethylene terephthalate isophthalate; acetyl cellulose; acetyl propoxy cellulose; acetyl butoxy cellulose; nitrocellulose; celluloid; polyvinyl butyral; Formalin resin; methyl cellulose, starch derivatives, casein, gum arabic, gelatin and the like. In this specification, when referring to both or one of “acrylic and methacrylic”, it may be expressed as “(meth) acrylic”.
5-95 mass% is preferable, as for content in the said wiring formation layer of the said binder, 10-90 mass% is more preferable, and 20-80 mass% is still more preferable.

In addition to the metal nanoparticles, the photothermal conversion substance, and the binder, the wiring-forming layer can contain other components as necessary.
There is no restriction | limiting in particular as said other component, According to the objective, it can select suitably, For example, a foaming material, a sensitizer, a solvent, surfactant, a ultraviolet absorber, a gelatinizer etc. are mentioned. .

  The wiring-forming layer is prepared, for example, by preparing a coating solution containing the metal nanoparticles, the photothermal conversion substance, the binder, and other components added as necessary. It can be formed by coating on top and drying.

The coating method can be appropriately selected from known coating methods, and examples thereof include bar coating, blade coating, air knife coating, gravure coating, roll coating coating, spray coating, dip coating, and curtain coating. It is done.
The dry coating amount of the wiring forming layer is preferably 2.5 to 30 g / m ² .
There is no restriction | limiting in particular as thickness of the said wiring formation layer, According to the objective, it can select suitably, 0.5-10 micrometers is preferable and 1-5 micrometers is more preferable.

<Foamed layer>
The wiring forming material preferably has a foam layer between the support and the wiring forming layer.
The foam layer contains a foam material, a binder, and further contains other components as required.

-Foam material-
There is no restriction | limiting in particular as said foaming material, According to the objective, it can select suitably, It is preferable to use the photosensitive foaming material from the point which can be fixed. By using the photosensitive foam material, there is no fear of foaming after pattern formation, and therefore it becomes easy to maintain the stability of the wiring.

  There is no restriction | limiting in particular as said photosensitive foaming material, According to the objective, it can select suitably, For example, a diazonium salt compound, a quinone diazide compound, an azide compound etc. are mentioned suitably. Among these, a diazonium salt compound is particularly preferable because of its high stability.

The diazonium salt compound is preferably a compound represented by the following structural formula (I).

In the structural formula (I), Ar represents a substitutable aromatic ring. X ⁻ represents a counter anion.
Ar may have a substituent Y, and as Y, various electron donating groups and electron withdrawing groups are preferable. Ar may have a plurality of substituents Y, and the substituents Y in this case may be the same or different.

As the substituent Y possessed by Ar, for example, a substituted amino group, an alkylthio group, an arylthio group, an alkoxy group, and an aryloxy group are preferable.
When Y represents a substituted amino group, the substituted amino group includes an alkylamino group having 1 to 20 carbon atoms, a dialkylamino group having 2 to 20 carbon atoms, an arylamino group having 6 to 10 carbon atoms, and a carbon number. A 7-20 N-alkyl-N-arylamino group and a C2-C20 acylamino group are preferable, and these groups may further have one or more substituents. Moreover, substituents, such as the said alkyl group, may couple | bond together and a cyclic amino group may be formed.
When Y represents an alkylthio group, an alkylthio group having 1 to 18 carbon atoms is preferable. When Y represents an arylthio group, an arylthio group having 6 to 10 carbon atoms is preferable, and when it represents an alkoxy group, an alkoxy group having 1 to 18 carbon atoms is preferable. When a group is preferable and represents an aryloxy group, an aryloxy group having 6 to 10 carbon atoms is preferable, and these groups may further have one or two or more substituents.

  Examples of the alkyl group and aryl group in the substituted amino group, alkylthio group, arylthio group, alkoxy group, or aryloxy group represented by Y include the following.

Furthermore, as said Y, a hydrogen atom, a C1-C8 alkyl group, a chlorine atom, a fluorine atom, a C1-C15 alkoxy group, a C1-C12 alkylsulfonyl group, C6-C18 An arylsulfonyl group, an acyl group having 1 to 18 carbon atoms, an alkoxycarbonyl group having 1 to 18 carbon atoms, a sulfonamide group having 1 to 12 carbon atoms, a carbonamido group having 2 to 13 carbon atoms, a nitro group, and a cyano group. preferable.
The alkyl group and alkylsulfonyl group may be branched and may be substituted with a halogen atom, an alkoxy group, an aryloxy group, a phenyl group, an alkoxycarbonyl group, an acyloxy group, or a carbamoyl group.
The arylsulfonyl group may be substituted with a halogen atom, an alkyl group, or an alkoxy group.

As said Y, what is shown below is mentioned suitably, for example.

  When Y represents a substituted amino group, examples of the cyclic amino group formed by bonding the substituents include the following.

In the structural formula (I), examples of the counter anion represented by X ⁻ include perfluoroalkyl carboxylic acids having 1 to 20 carbon atoms (for example, perfluorooctanoic acid, perfluorodecanoic acid, perfluorododecanoic acid), C1-C20 perfluoroalkylsulfonic acid (for example, perfluorooctanesulfonic acid, perfluorodecanesulfonic acid, perfluorohexadecanesulfonic acid), C7-50 aromatic carboxylic acid (for example, 4,4- Di-t-butylsalicylic acid, 4-t-octyloxybenzoic acid, 2-n-octyloxybenzoic acid, 4-t-hexadecylbenzoic acid, 2,4-bis-n-octadecyloxybenzoic acid, 4-n- Decylnaphthoic acid), aromatic sulfonic acids having 6 to 50 carbon atoms (for example, 1,5-naphthalenedisulfonic acid, 4-t Octyloxy benzenesulfonic acid, 4-n-dodecylbenzenesulfonic acid), 4,5-di -t- butyl-2-naphthoic acid, Tetorafu' boric acid, tetraphenyl borate, etc. hexafluorophosphate and the like. Among these, perfluoroalkyl carboxylic acids having 6 to 16 carbon atoms, aromatic carboxylic acids having 10 to 40 carbon atoms, aromatic sulfonic acids having 10 to 40 carbon atoms, tetrafluoroboric acid, tetraphenylboric acid, hexafluoro Phosphoric acid and the like are preferable.

  Specific examples of the diazonium salt compound include compounds represented by the following formulas (1) to (34), but are not limited thereto.

The content in the foam layer of the diazonium salt compound as a photosensitive foam material, preferably ^{0.05~10mmol / m 2, 0.1~3mmol / m} 2 is more preferable.

-Microencapsulation-
For the purpose of improving the raw shelf life before use of the photosensitive foam material, it is preferable to encapsulate the photosensitive foam material in a microcapsule. There is no restriction | limiting in particular as a formation method of this microcapsule, According to the objective, it can select suitably from well-known methods.
The polymer substance forming the capsule wall of the microcapsule has a glass transition temperature of 60 to 200 ° C. because it is necessary to have a property of being impermeable at normal temperature and permeable when heated. Preferred examples include polyurethane resin, polyurea resin, polyamide resin, polyester resin, urea-formaldehyde resin, melamine resin, polystyrene resin, styrene-methacrylate copolymer, styrene-acrylate copolymer, or a mixed system thereof. Can do.

  As the microcapsule forming method, for example, an interfacial polymerization method or an internal polymerization method is suitable. Details of the capsule formation method and specific examples of reactants are described in US Pat. No. 3,726,804, US Pat. No. 3,796,669, and the like. For example, when polyurea or polyurethane is used as the capsule wall material, polyisocyanate and a second substance that reacts therewith to form a capsule wall (for example, polyol or polyamine) are mixed in an aqueous medium or an oily medium to be encapsulated. Then, these are emulsified and dispersed in water and then heated to cause a polymer formation reaction at the oil droplet interface to form a microcapsule wall. Note that polyurea can also be produced when the addition of the second substance is omitted.

  The polymer substance forming the capsule wall of the microcapsule preferably contains at least one of polyurethane and polyurea as a component from the viewpoint of excellent production suitability and thermal response sensitivity.

Next, a method for producing a photosensitive foam material-encapsulated microcapsule (at least one of a polyurea wall and a polyurethane wall) will be described.
First, the photosensitive foam material is dissolved or dispersed in a hydrophobic organic solvent that becomes the core of the capsule to prepare an oil phase that becomes the core of the microcapsule. At this time, polyisocyanate is further added as a wall material.

  In the preparation of the oil phase, the hydrophobic organic solvent used for forming the core of the microcapsule by dissolving and dispersing the photosensitive foam material is preferably an organic solvent having a boiling point of 100 to 300 ° C., for example, alkyl naphthalene, alkyl Diphenylethane, alkyldiphenylmethane, alkylbiphenyl, alkylterphenyl, chlorinated paraffin, phosphate ester, maleate ester, adipate ester, phthalate ester, benzoate ester, carbonate ester, ether, sulfuric acid Examples include esters and sulfonic acid esters. You may use these in mixture of 2 or more types.

When the solubility of the photosensitive foam material to be encapsulated in the organic solvent is inferior, a low-boiling solvent having a high solubility of the diazonium salt compound to be used can be used in an auxiliary manner. Examples thereof include ethyl acetate, propyl acetate, isopropyl acetate, butyl acetate, methylene chloride, tetrahydrofuran, acetonitrile, acetone and the like.
For this reason, it is preferable that the photosensitive foam material has appropriate solubility in a high boiling hydrophobic organic solvent and a low boiling solvent. Specifically, it is preferable to have a solubility of 5% by mass or more with respect to the solvent. The solubility in water is preferably 1% by mass or less.

On the other hand, an aqueous solution in which a water-soluble polymer is dissolved is used for the aqueous phase to be used, and after the oil phase is added thereto, emulsification and dispersion are performed by means of a homogenizer or the like. It facilitates and acts as a dispersion medium for stabilizing the emulsified and dispersed aqueous solution. Here, in order to more uniformly emulsify and disperse and stabilize, a surfactant may be added to at least one of the oil phase and the aqueous phase. As the surfactant, a known emulsifying surfactant can be used.
As addition amount of the said surfactant, 0.1-5 mass% is preferable with respect to the oil phase mass, and 0.5-2 mass% is more preferable.

  The water-soluble polymer used in the water-soluble polymer aqueous solution in which the prepared oil phase is dispersed is preferably a water-soluble polymer having a solubility in water of 5% or more at the temperature to be emulsified, such as polyvinyl alcohol or its modification. , Polyacrylamide or derivatives thereof, ethylene-vinyl acetate copolymer, styrene-maleic anhydride copolymer, ethylene-maleic anhydride copolymer, isobutylene-maleic anhydride copolymer, polyvinylpyrrolidone, ethylene- Examples thereof include acrylic acid copolymers, vinyl acetate-acrylic acid copolymers, carboxymethyl cellulose, methyl cellulose, casein, gelatin, starch derivatives, gum arabic, and sodium alginate. In view of the oxygen permeability coefficient, it is preferable to use polyvinyl alcohol or a modified product thereof.

  The water-soluble polymer preferably has no or low reactivity with an isocyanate compound. For example, a polymer having a reactive amino group in a molecular chain such as gelatin reacts by being modified in advance. It is preferable to eliminate the property.

The polyvalent isocyanate compound is preferably a compound having a trifunctional or higher functional isocyanate group, but may be a bifunctional isocyanate compound. Specifically, xylene diisocyanate or hydrogenated product thereof, hexamethylene diisocyanate, tolylene diisocyanate or hydrogenated product thereof, and diisocyanates such as isophorone diisocyanate are used as the main raw materials, and these dimers or trimers (burette or isocyanate). Nurate), polyfunctional compounds as adducts of polyols such as trimethylolpropane and bifunctional isocyanates such as xylylene diisocyanate, adducts of polyols such as trimethylolpropane and bifunctional isocyanates such as xylylene diisocyanate Examples thereof include a compound in which a high molecular weight compound such as polyether having active hydrogen such as polyethylene oxide is introduced, a formalin condensate of benzene isocyanate, and the like.
Further, compounds described in JP-A-62-212190, JP-A-4-26189, JP-A-5-317694, JP-A-10-114153 and the like are preferable.

The amount of the polyvalent isocyanate used is determined so that the average particle size of the microcapsules is preferably 0.3 to 12 μm and the wall thickness is 0.01 to 0.3 μm. The dispersed particle diameter is generally about 0.2 to 10 μm.
In an emulsified dispersion in which an oil phase is added to an aqueous phase, a polyisocyanate polymerization reaction occurs at the interface between the oil phase and the aqueous phase to form a polyurea wall.

If at least one of a polyol and a polyamine is further added to the hydrophobic solvent in the aqueous phase or the oil phase, it can be used as one of the constituent components of the microcapsule wall by reacting with the polyvalent isocyanate. In the above reaction, it is preferable to keep the reaction temperature high or to add an appropriate polymerization catalyst from the viewpoint of increasing the reaction rate.
Examples of the polyol or polyamine include propylene glycol, glycerin, trimethylolpropane, triethanolamine, sorbitol, and hexamethylenediamine. When the polyol is added, a polyurethane wall is formed. The polyisocyanate, the polyol, the reaction catalyst, the polyamine for forming a part of the wall agent, and the like are well known in the literature (Polyurethane Handbook published by Nikkan Kogyo Shimbun, 1987).

  The emulsification can be carried out by appropriately selecting from known emulsifiers such as a homogenizer, a manton gorey, an ultrasonic disperser, a dissolver, and a teddy mill. After emulsification, the emulsion is heated to 30 to 70 ° C. in order to promote the capsule wall formation reaction. Further, during the reaction, in order to prevent aggregation between the capsules, it is necessary to add water to reduce the collision probability between the capsules or to perform sufficient stirring.

  Further, a dispersion for preventing aggregation may be added again during the reaction. As the polymerization reaction proceeds, the generation of carbon dioxide gas is observed, and its end can be regarded as the approximate end point of the capsule wall formation reaction. Usually, the target diazonium salt compound-containing microcapsules can be obtained by reacting for several hours.

-Binder-
There is no restriction | limiting in particular as said binder, It can select suitably from well-known water-soluble high molecular compounds, latex, etc., and can be used.
Examples of the water-soluble polymer compound include methyl cellulose, carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, starch derivatives, casein, gum arabic, gelatin, ethylene-maleic anhydride copolymer, styrene-maleic anhydride copolymer. , Epichlorohydrin-modified polyamide, isobutylene-maleic salicylic anhydride copolymer, polyacrylic acid, polyacrylic acid amide, or a modified product thereof.
Examples of the latex include styrene-butadiene rubber latex, methyl acrylate-butadiene rubber latex, and vinyl acetate emulsion.
Among these, hydroxyethyl cellulose, starch derivatives, gelatin, polyacrylic acid amide derivatives and the like are preferable.

The foam layer needs to have a gas barrier property from the viewpoint of the formation of the protrusion-shaped product. In the present invention, the gas barrier property in the foamed layer and the gas barrier layer described later refers to a property of suppressing permeation of nitrogen gas generated when the diazonium salt compound is decomposed. Therefore, although the gas barrier property is expressed by the permeability coefficient of nitrogen gas, since the molecular size is almost the same, it is expressed here by the oxygen permeability coefficient.
Various methods for measuring the oxygen transmission coefficient are known, but the high vacuum pressure difference method or the oxygen electrode method is typical.
As the gas barrier property of the foamed layer, specifically, the oxygen permeability coefficient is preferably 1.0 ml · 25 μm / m ² · 24 h · atm or less, preferably 0.5 ml · 25 μm / m ² · 24 h · atm or less. More preferably.
There is no restriction | limiting in particular as a formation method of the said foaming layer, According to the objective, it can select suitably, For example, the method similar to the case of the said wiring formation layer is applicable.
There is no restriction | limiting in particular as thickness of the said foaming layer, Although it can select suitably according to the objective, 0.2-5 micrometers is preferable and 0.5-3 micrometers is more preferable.

<Gas barrier layer>
In the present invention, it is preferable that a gas barrier layer is further provided as an upper layer and / or a lower layer of the foam layer.
When a gas barrier layer is provided as the upper layer and / or lower layer of the foam layer, the oxygen permeability coefficient of the gas barrier layer is preferably 0.5 ml · 25 μm / m ² · 24 h · atm or less, preferably 0.25 ml · 25 μm / m ^2.・ 24 h · atm or less is more preferable.
The thickness of the gas barrier layer is preferably 0.2 to 5 μm, and more preferably 0.5 to 3 μm.
As a method for forming the gas barrier layer, the same method as that for the foamed layer can be applied.
In order for the gas barrier layer to satisfy the oxygen permeability coefficient as described above, the gas barrier layer preferably contains polyvinyl alcohol (including modified products), ethylene vinyl alcohol copolymer, polyvinylidene chloride, mica-containing gelatin, and the like. From the viewpoint of handleability, it is particularly preferable to include polyvinyl alcohol. The gas barrier layer provided as the upper layer and / or lower layer of the foam layer preferably contains an ethylene vinyl alcohol copolymer (EVOH) or mica-containing gelatin.

In addition to the above, a binder, a pigment or the like may be mixed in the gas barrier layer.
The binder can be appropriately selected from known water-soluble polymer compounds and latexes.
Examples of the water-soluble polymer compound include methyl cellulose, carboxymethyl cellulose, hydroxyethyl cellulose, hydroxypropyl cellulose, starch derivatives, casein, gum arabic, gelatin, ethylene-maleic anhydride copolymer, styrene-maleic anhydride copolymer. , Polyvinyl alcohol, silanol-modified polyvinyl alcohol, carboxy-modified polyvinyl alcohol, epichlorohydrin-modified polyamide, isobutylene-maleic salicylic anhydride copolymer, polyacrylic acid, polyacrylic acid amide and the like, and modified products thereof.
Examples of the latex include styrene-butadiene rubber latex, methyl acrylate-butadiene rubber latex, and vinyl acetate emulsion.
Among these binders, hydroxyethyl cellulose, starch derivatives, gelatin, polyvinyl alcohol derivatives, and polyacrylamide derivatives are particularly preferable.

  Examples of the pigment include known organic pigments and inorganic pigments such as kaolin, calcined kaolin, talc, wax, diatomaceous earth, calcium carbonate, aluminum hydroxide, magnesium hydroxide, zinc oxide, and lithopone. Amorphous silica, colloidal silica, calcined stone, silica, magnesium carbonate, titanium oxide, alumina, barium carbonate, barium sulfate, mica, microballoon, urea-formalin filler, polyester particles, cellulose filler and the like.

(Wiring and wiring forming method)
A protruding wiring pattern can be obtained by the wiring forming method of the present invention. The exposure is usually performed from the surface side of the wiring-forming layer, but in the case of a transparent support, the exposure can also be performed from the support side.

Hereinafter, the formation mechanism of the protrusion-shaped wiring pattern will be described in detail.
When the wiring forming layer is irradiated with light in a pattern by laser light or the like that excites the infrared absorbing dye, the infrared absorbing dye absorbs the laser light, and the light energy is converted into thermal energy. This thermal energy melts and coalesces the metal nanoparticles. At about the same time, the foam layer is rapidly heated in the presence of the foaming agent such as diazonium salt and diazonium salt. The heated diazonium salt undergoes normal thermal decomposition and releases nitrogen gas. At the same time, the heated film becomes soft and expands with the generated nitrogen gas. As a result, a projecting bubble pattern (projection-shaped object) is formed. The conditions for forming the protruding bubble pattern are not clear, but the upper and lower membranes (gas barrier layer, etc.) of the foam layer and the hardness (viscoelasticity) of the support are involved and soft (viscous) It is considered that a nitrogen gas escapes in the direction of greater elasticity, thereby forming a protruding bubble pattern. As the foamed layer expands, the wiring-forming layer also expands into a protrusion, and as a result, a protrusion-shaped wiring is formed in the exposed portion.

As the light source used for the light irradiation, a visible light laser, a UV laser, or a light emitting diode corresponding to the absorption characteristic of the photothermal conversion substance can be used. When no photothermal conversion substance is used, a laser or light emitting diode corresponding to the wavelength of the diazonium salt can be used.
The oscillation wavelength of the laser or light emitting diode is preferably in the range of 300 to 1300 nm, and more preferably in the range of 400 to 1100 nm. Specific examples include a helium-neon laser, an argon laser, a carbon dioxide gas laser, a YAG laser, a semiconductor laser, and those obtained by converting these to a half wavelength by SHG. Of these, a laser light source capable of focusing and exposing at high illuminance is preferable. In the case of a laser light source, there is an effect that the metal nanoparticles are accumulated when they are melted and united, and as a result, there is an advantage that a wiring diameter having a size smaller than the irradiation spot diameter of the laser light can be obtained.

1-100 J / cm < ² > is preferable and, as for the energy intensity in the case of the said light irradiation, 1-30 J / cm < ² > is more preferable.
Although it is sufficient that the light irradiation is performed at least on the unexposed region of the wiring formable layer, it is preferable to irradiate the entire surface of the wiring formable layer from the viewpoint of work efficiency.

Fixing can be applied to the wiring forming material after the protruding metal body is formed. Fixing refers to photolysis of the diazonium salt, which no longer loses its ability to generate nitrogen gas, but the exposure energy per unit area is reduced so that the nitrogen gas generated from the diazonium salt due to fixing does not generate protrusions. It is necessary to suppress the light irradiation.
As a light source used for fixing, a fluorescent lamp, a high-pressure mercury lamp, a xenon lamp, and a light emitting diode are preferable. The energy intensity at the time of light irradiation is preferably less than 1 J / cm ² , and particularly preferably less than 300 mJ / cm ² .

(wiring)
The height (size, thickness) and shape of the metal body (wiring) can be arbitrarily controlled by adjusting the energy intensity of irradiated light, the beam diameter at the time of irradiation, and the like. The height of the wiring is preferably 200 nm or more from the flat portion, more preferably 500 nm to 10 μm, and still more preferably 500 nm to 5 μm. In addition, the form of the wiring can be arbitrarily set according to the purpose, such as a dot shape, a linear shape (such as a bowl shape), a planar shape, and the like.
Here, the size and shape of the wiring can be easily confirmed by observing the surface or cross section of the wiring forming material with a microscope.

  The wiring obtained by the wiring forming method of the present invention has high reliability, high performance and low cost, can be applied to so-called super connect, and is widely used in the electronics field.

  Examples of the present invention will be described below, but the present invention is not limited to the following examples.

Example 1
(1) Preparation of coating solution for wiring-forming layer Polyvinyl alcohol (trade name: PVA-102, manufactured by Kuraray Co., Ltd., saponification degree 98-99%) 165 parts by mass of aqueous solution, 105 parts by mass of water, metal nano Silver particles (made by Harima Kasei Co., Ltd., particle size = 3 to 7 nm, melting point less than 400 ° C. (but calcinable at 250 ° C. or less)), and infrared represented by the following structural formula as a photothermal conversion material 3.5 parts by mass of a dye (specific compound example: DYE-10) was mixed to prepare a coating solution for a wiring forming layer.

(2) Preparation of coating solution for foam layer In 16.2 parts by mass of ethyl acetate, 4.5 parts by mass of a diazonium salt compound (Exemplary Compound (17)) represented by the following structural formula, 4.8 parts by mass of monoisopropylbiphenyl Then, 4.8 parts by mass of diphenyl phthalate was added and heated to 40 ° C. to dissolve uniformly. A mixture of xylylene diisocyanate / trimethylolpropane adduct and xylylene diisocyanate / bisphenol A adduct as a capsule wall material (trade name: Takenate D119N (50% by mass ethyl acetate solution), Takeda Pharmaceutical Co., Ltd. 8.4 parts by mass was added and stirred uniformly to obtain a mixed solution (I).
Separately, 3.5 parts by weight of 10% by weight aqueous solution of sodium dodecylbenzenesulfonate is added to 85 parts by weight of 10% by weight aqueous solution of the polyvinyl alcohol (trade name: PVA-105, manufactured by Kuraray Co., Ltd., 98 to 99%) In addition, mixture (II) was obtained.

Next, the liquid mixture (I) was added to the liquid mixture (II), and the mixture was emulsified and dispersed at 40 ° C. using a homogenizer (manufactured by Nippon Seiki Seisakusho Co., Ltd.). After adding 20 parts by mass of water to the obtained emulsion and homogenizing it, the mixture was stirred at 40 ° C. to carry out an encapsulation reaction for 3 hours while removing ethyl acetate. Thereafter, 4.1 parts by mass of ion exchange resin Amberlite IRA68 (manufactured by Organo Corp.) and 8.2 parts by mass of Amberlite IRC50 (manufactured by Organo Corp.) were added and further stirred for 1 hour. Thereafter, the ion exchange resin was removed by filtration, and the concentration was adjusted so that the solid content concentration of the capsule liquid was 20.0% by mass to obtain a diazonium salt compound-encapsulated microcapsule liquid (a). The obtained microcapsules had a median diameter of 0.31 μm as a result of particle size measurement (LA-700, measured by Horiba, Ltd.).
The obtained microcapsule liquid (a) is mixed with 165 parts by mass of 10% by weight aqueous solution of polyvinyl alcohol (trade name: PVA-102, manufactured by Kuraray Co., Ltd., saponification degree 98 to 99%), and 105 parts by mass of water. A coating solution for the foam layer was obtained.

(3) Preparation of wiring forming material A diazonium salt compound (Exemplary Compound (17)) is a solid content of the coating liquid for foamed layer prepared above on a glass substrate (manufactured by Matsunami Glass, thickness 1 mm, width 5 cm × 5 cm). It apply | coated so that it might become 0.16 g / m < ² > by application quantity, It was made to dry and the foaming layer was coated. Next, the wiring-forming layer coating solution was applied onto the foamed layer so that the solid content was 2.2 g / m ² and dried to prepare a wiring-forming material.

<Wiring formation and evaluation>
Scanning exposure was performed at 150 mW and a linear velocity of 0.25 m / sec using a semiconductor laser having an oscillation wavelength of 830 nm (manufactured by Sanyo Electric Co., Ltd., DL-8032-001). The beam diameter of the laser beam was 6.0 μm.
After the laser light irradiation, the entire surface of the wiring forming layer was irradiated with a fluorescent lamp lamp (365 nm) to completely decompose the diazonium salt and fix it. In this way, a protruding pattern (wiring) was formed.
A protrusion-shaped object having a height of 5.43 μm from the surface of the glass substrate is formed on the exposed portion, and the radius of the protrusion-shaped object is 16.4 μm on the glass substrate surface, of which the wiring portion (that is, the metal portion) It was confirmed with a scanning electron microscope (SEM, manufactured by Hitachi, Ltd.) that the height (thickness) was about 1.4 μm.
When the surface resistance value of the formed wiring part was measured with a multimeter (27 multimeter, manufactured by FLUKE), the resistance value was about 2.7Ω.

(Example 2)
-Fabrication and evaluation of wiring forming materials-
In Example 1, except that 4.4 parts by mass of the diazonium salt compound (Exemplary Compound (17)) was changed to 4.1 parts by mass of the diazonium salt compound (Exemplary Compound (23)) represented by the following structural formula. In the same manner as in Example 1, a wiring forming material was prepared, exposed, and a protruding pattern (wiring) was formed by fixing.
It was confirmed by a scanning electron microscope (SEM, manufactured by Hitachi, Ltd.) that the height of the obtained protrusion-shaped product was 5.40 μm, and the height of the wiring part (metal part) was about 1.4 μm. . When the surface resistance value of the formed wiring part was measured with a multimeter (27 multimeter, manufactured by FLUKE), it was about 2.9Ω.

(Example 3)
-Fabrication and evaluation of wiring forming materials-
In Example 1, except that 3.5 parts by mass of the infrared absorbing dye (Exemplary Compound DYE-10) was changed to 3.8 parts by mass of the infrared absorbing dye (Exemplary Compound DYE-15) represented by the following structural formula, In the same manner as in Example 1, a wiring forming material was prepared, exposed, and a protruding pattern (wiring) was formed by fixing.
It was confirmed by a scanning electron microscope (SEM, manufactured by Hitachi, Ltd.) that the height of the obtained protrusion-shaped object was 5.44 μm, and the height of the wiring part (metal part) was about 1.4 μm. . When the surface resistance value of the formed wiring part was measured with a multimeter (27 multimeter, manufactured by FLUKE), it was about 2.8Ω.

Example 4
-Fabrication and evaluation of wiring forming materials-
In Example 1, except that 3.5 parts by mass of the infrared absorbing dye (exemplary compound DYE-10) was changed to 3.6 parts by mass of the infrared absorbing dye (exemplary compound DYE-23), the same as in Example 1, A wiring forming material was prepared, exposed, and a protruding pattern (wiring) was formed by fixing.
It was confirmed by a scanning electron microscope (SEM, manufactured by Hitachi, Ltd.) that the height of the obtained protrusion-shaped product was 5.45 μm, and the height of the wiring part (metal part) was about 1.4 μm. . When the surface resistance value of the formed wiring part was measured with a multimeter (27 multimeter, manufactured by FLUKE), it was about 3.1Ω.

(Comparative Example 1)
-Fabrication and evaluation of wiring forming materials-
In Example 1, a wiring forming material was produced in the same manner as in Example 1 except that no silver particles were used in the wiring forming layer coating solution. The obtained wiring forming material was exposed and a protrusion pattern was formed by fixing.
It was confirmed by a scanning electron microscope (SEM, manufactured by Hitachi, Ltd.) that the height of the protrusion-shaped object was about 4.0 μm (no wiring part).
When the surface resistance value of the formed protrusion was measured with a multimeter (27 Multimeter, manufactured by FLUKE), almost no conductivity was observed.

(Comparative Example 2)
-Fabrication and evaluation of wiring forming materials-
In Example 1, a wiring forming material was prepared and exposed in the same manner as in Example 1 except that no infrared dye (specific compound example: DYE-10) was used in the wiring-forming layer coating solution. However, the desired projection shape was not obtained.

The wiring by the wiring forming material and the wiring forming method of the present invention has high reliability, high performance, and low cost, can be applied to so-called super connect, and is widely used in the electronics field.

Claims (15)

A wiring forming material having a support, and at least a foam layer and a wiring forming layer in this order on the support,
The wiring-forming layer contains at least metal nanoparticles and a photothermal conversion substance;
The wiring forming material is characterized in that a projection-like metal body can be formed in a region irradiated with light by being irradiated with light in a pattern.   2. The wiring forming material according to claim 1, wherein the metal nanoparticles are particles composed of at least one selected from a single metal, an oxide semiconductor, a spinel compound, a conductive nitride, a conductive boride, and a mixture thereof. .   The wiring forming material according to claim 1, wherein the metal nanoparticles are particles made of any one of Au, Ag, and Cu.   The wiring forming material according to claim 1, wherein the metal nanoparticles have a particle size of 30 nm or less.   The wiring forming material according to claim 1, wherein the metal nanoparticles have a melting point of 300 ° C. or less.   The wiring forming material according to any one of claims 1 to 5, wherein the photothermal conversion substance has a maximum absorption wavelength of 330 to 1300 nm.   The wiring forming material according to claim 1, wherein the foam layer contains a foam material, and the foam material is a photosensitive foam material.   The wiring forming material according to claim 7, wherein the photosensitive foam material is at least one selected from a diazonium salt compound, a quinonediazide compound, and an azide compound.   The wiring forming material according to claim 7, wherein the photosensitive foam material is encapsulated in a microcapsule.   The wiring forming material according to claim 1, wherein the foam layer contains a photothermal conversion substance.   A wiring forming method according to claim 1, wherein the wiring forming material according to claim 1 is irradiated with light in a pattern and a protrusion-shaped metal body is formed in the irradiated region. The wiring formation method according to claim 11, wherein the energy intensity of light irradiation is 1 to 100 J / cm ² .   A wiring obtained by the wiring forming method according to claim 11.   The wiring according to claim 13, wherein the metal body has a height of 200 nm or more. The wiring according to any one of claims 13 to 14, which is used for a super connect.