JP2007258502A - Radiator and electronic instrument employing it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize a radiator for thin and flat liquid-cooling system, which is capable of being mounted on a wide back surface of a liquid crystal screen for a note-type personal computer or the like. <P>SOLUTION: The radiator is constituted of a structure wherein a bell-mouth type suction port 10 and an axial flow impeller 2 with a motor having no casing are arranged at the central part of a thin and flat box-type cabinet, while a first radiating unit 5 and a second radiating unit 6 are arranged near the left and right side surfaces. Further, a first header 8 and a second header 9 are arranged near the fore and rear side surfaces. Refrigerant such as water or non-frozen liquid is made to flow into the radiator 1 from an inflow port 11 during the inflow of cooling air from the suction port 10 and the outflow of the same from left and right radiating units 5, 6. Then the refrigerant is distributed into left-and-right direction in the first header 9 to flow in parallel through the first radiating unit 5 and the second radiating unit 6, and thereafter, to join in the second header 9. Then the outflow of it from the outflow part 12 is effected through a returning pipeline 13 whereby heat accumulated in the refrigerant is released into atmosphere. According to such constitution and effect, a thin radiator can be realized as mountable on the back surface of the liquid crystal screen for the note-type personal computer or the like and high in heat dissipating capacity. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention is an electronic device such as a personal computer (hereinafter referred to as a personal computer) or a server, and in particular, a semiconductor integrated circuit element, which is a heating element mounted therein, can be efficiently cooled with a high cooling capacity by a refrigerant. The present invention relates to a liquid cooling system and a heat radiating device therefor.

  For example, in a notebook computer, the heat generation amount of the central processing unit (hereinafter referred to as CPU) increases as the processing speed increases, and in the air-cooling method in which the CPU is directly cooled by a heat sink and blower fan, the cooling capacity is limited by the cooling space. Insufficient and increased fan noise has made it impossible to respond. As an alternative method, for example, a method of temporarily transporting the heat of the CPU to the atmosphere side by a heat pipe or a liquid cooling system and radiating the heat to the atmosphere side by a heat radiator has been used.

  In a notebook personal computer, it is conceivable to dissipate heat by using, for example, the back surface of a liquid crystal screen having a large surface area as the installation location of the radiator. In this case, the shape of the radiator is preferably a thin and flat box shape. The biggest problem in realizing this is to mount components such as a heat radiating fin, a blower fan, and a refrigerant flow path constituting the heat radiator in a thin and flat housing. In particular, it is difficult to realize a blowing means that allows a large amount of cooling air necessary for cooling to flow in a thin and flat flow path with low noise.

  In general, an axial fan that can produce a large air volume compared to static pressure with low noise is often used as the air blowing means of the radiator. However, since the axial flow fan has the same suction direction and discharge direction of the cooling air, it is not suitable as a blowing means for a thin and flat radiator.

  Moreover, the fan motor of patent document 1 is mention | raise | lifted as a structural example of the thin fan which sends cooling air to a thin flat flow path. In this publicly known document, only a centrifugal impeller and its driving unit are arranged in a box-shaped casing, and the amount of cooling air is increased by suction ports provided on the upper and lower surfaces, and the suction flow rate is adjusted by the size of the suction ports. However, when it is mounted on a notebook personal computer, the suction ports cannot be provided on both sides, so that the cooling air volume is reduced to half and the problem arises that the air volume necessary for cooling cannot be secured.

  Further, as a structural example of a radiator mounted on a liquid crystal screen of a notebook personal computer, for example, a heat radiating device of Patent Document 2 and an electronic device including the same are cited. In this known document, a suction port is provided on the upper and lower surfaces of the central portion of a flat radiator housing, a centrifugal impeller is disposed there, and a heat radiation fin is disposed in the vicinity of the discharge port. However, when it is mounted on a notebook personal computer, the suction ports cannot be provided on both sides, so that the cooling air volume is reduced to about half, and there is a problem that the air volume necessary for cooling cannot be secured.

JP-A-2005-223124 Japanese Patent No. 352143

  As described above, when the cooling device disclosed in Patent Documents 1 and 2 is mounted on a thin electronic device, the problem is that the cooling air volume is reduced to about half and the air volume necessary for cooling cannot be secured. . In particular, the shape of the radiator mounted on the back surface of the liquid crystal screen of the notebook personal computer needs to be as thin and flat as possible (for example, 200 to 300 mm in length and width and about 15 mm or less in thickness).

  An object of the present invention is to provide a cooling device for electronic equipment that can secure an air volume necessary for cooling even when mounted on a thin electronic equipment.

  An object of the present invention is to provide a flat housing that constitutes the radiator in a liquid cooling system that includes a heat receiving portion that receives heat from a refrigerant that circulates heat of an element mounted on the electronic device, and a radiator that dissipates the received heat. A cooling air suction port provided in the center of the upper surface of the housing, cooling air discharge ports provided on the left and right side surfaces of the housing, and the box-shaped housing located at the suction port. An axial flow impeller having a motor horizontally disposed on the lower surface of the body, first and second heat radiating portions provided in the vicinity of the discharge ports on both the left and right side surfaces, and the vicinity of both front and rear side surfaces of the box-type housing A first header and a second header provided in the housing, wherein the first heat radiating portion, the second heat radiating portion, the first header and the second header are connected, and the refrigerant flowing into the heat radiator After the first header is divided into two systems, the refrigerant flows in the first heat radiating portion and the second heat radiating portion. Are flown in parallel, merged at the second header and then flow out of the housing of the radiator, and cooling air flows through the flow path formed by the upper and lower surfaces of the box-shaped housing, the first header, and the second header. Is achieved by being a radiator that radiates the heat of the refrigerant to the atmosphere by flowing through the first heat radiating portion and the second heat radiating portion.

  Further, the object is to connect the first header and the second header with a plurality of thin tubes, to form the first heat radiating portion and the second heat radiating portion, so that the refrigerant flows in the plurality of thin tubes. This is achieved by using a radiator.

  Moreover, the said objective is achieved by the said 1st thermal radiation part and 2nd thermal radiation part being circular arc shape, and being the heat radiator arrange | positioned concentrically with the said axial flow impeller.

  The above object is achieved by mounting the radiator on the back surface of the liquid crystal screen.

  ADVANTAGE OF THE INVENTION According to this invention, even if it mounts in a thin electronic device, the cooling device for electronic devices which can ensure the air volume required for cooling can be provided.

  Hereinafter, an embodiment of a radiator of the present invention will be described with reference to the accompanying drawings.

First, an example of a thin electronic device provided with a general cooling device by circulation of a liquid medium will be described with reference to FIGS.
FIG. 1 is an exploded perspective view of a notebook computer.
2 is a side view of the notebook computer shown in FIG. 1 as viewed from the side.
1 and 2, generally on the main body 100 side of a notebook personal computer, a heating element 120, which is a heating element, is disposed at a position below the keyboard 110, for example. A liquid cooling system for efficiently cooling the heating element 120 is mounted.

  This liquid cooling system basically includes a heat receiving jacket 200, a circulation pump 300 for circulating and driving the refrigerant liquid, and a radiator 1 (shown in FIG. 2) mounted on the back surface of the liquid crystal panel 160. . The radiator 1 is disposed on the back side of the liquid crystal panel 160 on the lid 150 side that is rotatably attached to the main body 100.

  Moreover, the member 51 in FIG. 1 has shown the piping of the metal or elastic body for connecting a liquid refrigerant | coolant liquid-tightly between each component of the said liquid cooling system.

  More specifically, in FIG. 1, the heat receiving jacket 200 has a rectangular plate-like outer shape, and is formed of a metal having excellent thermal conductivity such as copper or aluminum. Further, the heat receiving jacket 200 is attached to the surface of the heating element 120, which is a heating element, in thermal connection (for example, via grease having high thermal conductivity). Note that, for example, a flow path is formed to meander inside the heat receiving jacket 200, and a liquid refrigerant is allowed to flow through the flow path. As a result, the heat generated from the heating element 120 is transmitted to the liquid refrigerant flowing in the jacket, thereby cooling the heating element with high efficiency.

Next, the structure of the heat radiator 1 of Example 1 in this invention is demonstrated using FIG.3, FIG.4 and FIG.5.
FIG. 3 is a plan view of the radiator 1 as viewed from the cooling air inlet 10 side.
FIG. 4 is a cross-sectional view taken along the line AA of the radiator 1 shown in FIG. 3.
FIG. 5 is a perspective view for explaining the shape of the refrigerant flow path of the radiator 1 and the structure of the first and second radiating portions 5 and 6.
In Example 1, in order to realize a thin and flat radiator that can be mounted on the back surface of a liquid crystal screen such as a notebook computer, a heat radiating section, a blower section, and piping are planarly provided in a thin and flat box-shaped housing. Arranged. In particular, with regard to the air blower part, in order to obtain a large air volume necessary for cooling the refrigerant, the casing of the axial fan is removed and a bell mouth for backflow prevention is arranged only on the suction side to achieve a thinner air blower part. did.

  In addition, with respect to the heat radiating section, by making it flat, the refrigerant flows through the two right and left refrigerant flow paths using a header so that the flow path of the refrigerant does not become long and the flow resistance does not increase. The function of the reserve tank was made using the volume. When a liquid cooling system is used for a long period of time, the refrigerant escapes from the piping and evaporates, and the amount of refrigerant decreases, so a reserve tank is usually provided in the liquid cooling system to replenish this amount of decrease. is there.

  As shown in FIGS. 3 and 4, the main components and elements constituting the radiator 1 are an axial-flow impeller 2 with a motor, an upper casing 3, a lower casing 4, a first heat radiating portion 5, and a second heat radiating portion 6. , First header 8, second header 9, suction port 10, inlet 11, outlet 12, and return pipe 13.

  In FIG. 4, the shape of the suction port 10 of the upper casing 3 is a bell mouth shape, and the bell mouth is arranged so as to cover a part on the suction side of the tip of the axial flow impeller 2 near the upper casing 3. There is no bell mouth on the discharge side on the lower casing 4 side. The area where the bell mouth portion covers the tip of the axial flow impeller 2 on the upper casing 3 side is desirably approximately half or less of the blade height of the axial flow impeller 2. Further, the cross-sectional shape of the bell mouth portion is preferably an arc shape or an elliptical shape, but is not particularly limited to this and may be appropriately determined.

  By adopting such a structure, the cooling air flowing in the vertical direction from the suction port 10 with respect to the lower casing 4 is smoothly horizontal (left and right in FIG. 2) as indicated by arrows in FIG. Since the flow is changed in direction, fluid noise such as pressure loss and impingement noise on the lower casing 4 is reduced, and a large flow rate required for cooling can be obtained with low noise.

  4 and 5, the first heat radiating portion 5 and the second heat radiating portion 6 are made of a refrigerant pipe 7 having a flat cross-sectional flow channel made of, for example, copper or aluminum, for example, a plurality of flat plate-like heat radiating fins made of copper or aluminum. 15. The flat plate-like heat radiating fins 15 are connected to the refrigerant pipe 7 by, for example, brazing or soldering. The shape of the flat radiating fin 15 is not limited to a flat plate, but may be any shape such as a corrugated shape. Similarly, the refrigerant pipe 7 is not limited to a flat cross-sectional flow path, but may be any shape such as a circle or an ellipse.

Next, the heat dissipation mechanism of the radiator 1 will be described.
As shown in FIG. 5, the refrigerant (for example, water, antifreeze liquid, etc.) warmed by the heat from the cooling target from the heating element 120 of the notebook computer is transferred from the inlet 11 into the radiator 1 by a circulation pump 300 (not shown). After flowing in, the vehicle decelerates rapidly in the first header 8 and divides in the horizontal direction (left and right in the figure). Thereafter, after flowing through the refrigerant pipes 7 of the first heat radiating section 5 and the second heat radiating section 6 respectively, they merge in the second header 9 and flow out from the outlet 12 through the return pipe 13. Here, the flow path cross-sectional area (volume) of the first header 8 and the second header 9 is made larger than the cross-sectional area of the refrigerant pipe 7, and the flow resistance of the refrigerant pipe 7 is set to the first header 8 and the second header 9. It is several times larger than the internal flow resistance. Therefore, the flow rate flowing through the refrigerant pipe 7 is determined by the pressure difference between the first header 8 and the second header 9 and the cross-sectional area of the refrigerant pipe 7. If the cross-sectional area is the same, the flow rate is almost the same.

  In this manner, as shown in FIG. 4 with the refrigerant circulating in the radiator 1, the cooling air is radiated from the suction port 10 by rotating the axial flow impeller 2 with a motor at a desired rotational speed. The flat plate of the left and right first heat dissipating parts 5 and the second heat dissipating part 6 through the diffusion flow path 16 formed by the first header 8, the second header 9, the upper casing 3 and the lower casing 4. It flows between the heat radiation fins 15 and flows out of the radiator 1 so as to flow out from the discharge port 17.

  Thereby, the heat of the heating element 120 absorbed by the refrigerant is transmitted to the refrigerant pipe 7 and is conducted to the plate-like heat radiation fins 15. Furthermore, by transmitting to cooling air, it is discharge | released to air | atmosphere, As a result, the heat generating body 120 can be kept at the temperature below an allowable value.

  As described above, according to the first embodiment, a thin and flat radiator with low noise and high heat dissipation capability that can be mounted on the back of the liquid crystal screen of a notebook computer can be realized. In the first embodiment, an example of mounting on a notebook personal computer has been shown. However, the radiator can also be mounted on another thin electronic device such as a side surface of a desktop personal computer.

  Here, since the mounting form to a notebook personal computer etc. is the same as Example 1, the description is abbreviate | omitted and only the structure and structure of the heat radiator 1 of Example 2 are demonstrated using FIGS. 6-9.

FIG. 6 is a plan view of the radiator 1 as viewed from the cooling air inlet 10 side.
7 is a cross-sectional view of the radiator 1 shown in FIG.
FIG. 8 is a perspective view illustrating the shape of the refrigerant flow path of the radiator 1 and the structure of the first heat radiating portion 5 and the second heat radiating portion 6.
FIG. 9 is an explanatory diagram of the thin tube group 18.
In Example 2, in order to realize a thin and flat radiator that can be mounted on the back of a liquid crystal screen such as a notebook computer, a heat radiating section, a blower section, piping, etc. are planarly provided in a thin and flat box-shaped housing. Arranged.

  As for the air blower, as in the first embodiment, in order to obtain a large air volume necessary for cooling the refrigerant, the airflow fan is removed by removing the casing of the axial fan and disposing a bellows for backflow prevention only on the suction side. Realized thinning.

  In addition, with respect to the heat radiating section, by making it flat, the refrigerant flows through the two right and left refrigerant flow paths using a header so that the flow path of the refrigerant does not become long and the flow resistance does not increase. The function of the reserve tank was made using the volume.

  6 and 7, the components and elements constituting the radiator 1 are an axial-flow impeller 2 with a motor 2, an upper casing 3, a lower casing 4, a first heat radiating portion 5, a second heat radiating portion 6, and a first header 8. , Second header 9, suction port 10, inlet 11, outlet 12 and return pipe 13.

  As shown in FIG. 7, the shape of the suction port 10 of the upper casing 3 is a bell mouth shape, and the bell mouth covers a part of the tip-side suction side of the axial impeller 2 near the upper casing 3. The bell mouth is not arranged on the discharge side on the lower casing 4 side. The area where the bell mouth portion covers the tip of the axial flow impeller 2 on the upper casing 3 side is desirably approximately half or less of the blade height of the axial flow impeller 2. Further, the cross-sectional shape of the bell mouth portion is preferably an arc shape or an elliptical shape, but is not particularly limited thereto. Reference numeral 16 denotes a diffusion channel formed by the upper casing 3 and the lower casing 4. Reference numeral 17 denotes a discharge port.

  By adopting such a structure, the cooling air flowing in from the suction port 10 in the vertical direction with respect to the lower casing 4 smoothly flows in the horizontal direction (left-right direction in FIG. 2) and flows. Fluid noise such as pressure loss and impact noise to the lower casing 4 is reduced, and a large flow rate required for cooling can be obtained with low noise.

  As shown in FIGS. 7 to 9, the first heat radiating portion 5 and the second heat radiating portion 6 include a plurality of gaps between the upper casing 3 and the lower casing 4, for example, a thin tube group 18 made of copper, aluminum or synthetic resin. It is the structure which provided and laminated | stacked. For example, as an example of the configuration of the thin tube group 18, as shown in FIG. 9, there is one in which a plurality of thin tubes 19 having an outer diameter of 1 mm or less are continuously arranged. The thin tubes 19 may be connected to each other by brazing or soldering, but not necessarily.

  With such a structure, the heat transfer rate is improved as compared with the first heat radiating part 5 and the second heat radiating part 6 formed by the refrigerant pipe 7 and the plate-like heat radiating fin 15 of the first embodiment. Can be downsized.

  Next, the heat dissipation mechanism of the radiator 1 will be described.

  As shown in FIG. 5, the refrigerant (for example, water, antifreeze liquid, etc.) warmed by heat from the heating element 120 of the notebook computer flows into the radiator 1 from the inlet 11 by the circulation pump 300 (not shown). After suddenly decelerating in the first header 8 and being shunted in the horizontal direction (left and right in the figure), after flowing through the refrigerant channels of the narrow tube group 18 of the first heat radiating part 5 and the second heat radiating part 6, respectively. , And merges in the second header 9 and flows out from the outlet 12 through the return pipe 13. Here, the flow path cross-sectional area (volume) of the first header 8 and the second header 9 is made larger than the total cross-sectional area of the refrigerant flow path of the narrow tube group 18, and the flow resistance of the refrigerant flow path is set to the first header. 8. Since the flow resistance in the second header 9 is several times larger than the flow resistance, the flow rate flowing in the refrigerant flow path is the pressure difference between the first header 8 and the second header 9 and the cross-sectional area of the refrigerant flow path. Determined by. If the cross-sectional area is the same, the flow rate is almost the same.

  In this manner, as shown in FIG. 7 in a state where the refrigerant is circulated in the radiator 1, the cooling air is radiated from the suction port 10 by rotating the motor-equipped axial flow impeller 2 at a desired rotational speed. The narrow tubes of the left and right first heat dissipating parts 5 and the second heat dissipating part 6 are passed through the diffusion flow path 16 formed by the first header 8, the second header 9, the upper casing 3 and the lower casing 4. It flows between the groups 18 so as to flow out from the discharge port 17 of the radiator 1.

  As a result, the heat of the heating element 120 absorbed by the refrigerant is transmitted to the narrow tube group 18 and further to the cooling air to be released to the atmosphere, and as a result, the heating element 120 is brought to a temperature below the allowable value. Can keep.

  As described above, according to the second embodiment, a thin and flat radiator with low noise and high heat dissipation capability that can be mounted on the back of the liquid crystal screen of a notebook computer can be realized. Similarly to the first embodiment, it can be mounted on other thin electronic devices.

Here, since the mounting form on a notebook computer or the like is the same as that of the first embodiment, the description thereof will be omitted, and only the structure and configuration of the radiator 1 of the third embodiment will be described with reference to FIG.
FIG. 10 is a plan perspective view of the radiator 1 as seen from the cooling air inlet 10 side.
Therefore, although the components in the radiator 1 should be displayed by broken lines, they are difficult to understand, and are shown here by solid lines for convenience.

  In FIG. 10, in Example 3, the side plate 30 and the partition plate 31 were provided in the radiator 1 of Examples 1 and 2. The reason why the tip of the partition plate 31 is bent is to meet the cooling air flow direction from the axial flow impeller 2. By doing so, the flow of the cooling air to the first heat radiating portion 5 and the second heat radiating portion 6 becomes smooth, and the pressure loss and fluid noise of the cooling air can be reduced. It is effective in improving.

Here, since the mounting form to a notebook personal computer etc. is the same as Example 1, the description is abbreviate | omitted and only the structure and structure of the heat radiator 1 of Example 4 are demonstrated using FIG.
FIG. 11 is a plan view of the radiator 1 as viewed from the cooling air inlet 10 side.
Therefore, parts in the radiator 1 should be indicated by broken lines, but parts that are difficult to understand are indicated by solid lines for convenience.

  In FIG. 11, in Example 4, the refrigerant flowing from the inlet flows through the pipe 40, flows through the first heat radiating section 5, flows out from the outlet 12 through the pipe 40, the reserve tank 41, the pipe 40, and the second heat radiating section 6. To do. This eliminates the need for the first header 8 and the second header 9 as shown in the first to third embodiments, and is effective in reducing the manufacturing cost of the radiator 1. The reserve tank is provided for replenishing the amount of decrease because the refrigerant is removed from the pipe and the like and evaporated when the liquid cooling system is used for a long period of time.

Here, since the mounting form to a notebook personal computer etc. is the same as Example 1, the description is abbreviate | omitted and only the structure and structure of the heat radiator 1 of Example 5 are demonstrated using FIG.
FIG. 12 is a plan view of the radiator 1 as viewed from the cooling air inlet 10 side.
Therefore, the parts in the radiator 1 should be indicated by broken lines, but the parts that are difficult to understand are indicated by solid lines for convenience.

  In FIG. 12, in Example 5, the refrigerant flowing in from the inlet 11 flows through the pipe 40, flows through the first heat radiating unit 5, and flows out from the outlet 12 through the pipe 40 and the second heat radiating unit 6. In this embodiment, the reserve tank function is eliminated by using the volume of the pipe 40 to give the pipe 40 a reserve tank function.

  In Example 5, since a reserve tank becomes unnecessary, it is effective in the cost reduction of the heat radiator 1. FIG.

Here, since the mounting form on a notebook computer or the like is the same as that of the first embodiment, the description thereof will be omitted, and only the structure of the radiator 1 of the sixth embodiment will be described with reference to FIG.
FIG. 13 is a plan view of the radiator 1 as viewed from the cooling air inlet 10 side.
In FIG. 13, in Example 6, the refrigerant flowing in from the inlet 11 flows through the pipe 40, flows through the first heat radiating unit 5, and flows out from the outlet 12 through the pipe 40 and the second heat radiating unit 6. The cooling air flows through a flow path formed by the side plate 32 and the partition plate 31. Since the cooling air that has passed through the axial flow impeller 2 has a swirling component in the rotational direction of the axial flow impeller 2, the tip of the side plate 32 has the cooling air from the axial flow impeller 2 as indicated by an arrow. It is shaped to accept the flow. The tip shape of the partition plate 31 is the same.

  In this way, the cooling air from the axial flow impeller 2 is smoothly divided into left and right, and the swirling component is removed and flows into the first heat radiating portion 5 and the second heat radiating portion 6, so that noise It is effective in reducing and improving heat dissipation capacity.

Here, since the mounting form to a notebook personal computer etc. is the same as Example 1, the description is abbreviate | omitted and only the structure and structure of the heat radiator 1 of Example 7 are demonstrated using FIGS. 14-16. To do.
FIG. 14 is a plan view of the radiator 1 as viewed from the cooling air inlet 10 side.
15 and 16 are plan views of the heat dissipating part.

  14 to 16, in the seventh embodiment, the refrigerant that flows in from the inlet 35 flows through the arc-shaped heat radiating portion 36 and flows out from the outlet 37. The cooling air flows from the axial flow impeller 2 between the heat radiating portions 38 of the heat radiating portion 36 and flows out as indicated by arrows. In this case, when the front end of the heat radiating portion 38 is linear as shown in FIG. 15, the flow of cooling air collides with the front end of the heat radiating portion 38, leading to an increase in noise and an increase in pressure loss. Therefore, in the case of Example 7, as shown in FIG. 16, the heat radiation part 38 front-end | tip is made into the structure bent alpha degree so that it might meet in the flow direction of cooling air.

  By doing in this way, the cooling air flowing symmetrically from the axial flow impeller 2 flows between the heat radiating portions 38 of the heat radiating portion 36 of the axially symmetric structure, and the cooling air in the heat radiating portion 38 is Since the ventilation loss at the time of passing can be reduced, a large air volume required for cooling can be flowed. Therefore, there is an effect for reducing noise and improving heat dissipation capability.

Here, since the mounting form to a notebook personal computer etc. is the same as Example 1, the description is abbreviate | omitted and only the structure structure of the heat radiator 1 of Example 8 is demonstrated using FIG.
FIG. 17 is a see-through plan view of the radiator 1 as viewed from the cooling air inlet 10 side.
In FIG. 17, in the eighth embodiment, the refrigerant flowing from the inlet 61 is divided into left and right in the first header 62, flows through the left and right first heat radiating portions 64 and the second heat radiating portions 65, and merges in the second header 63. Then, it flows through the return pipe 66 and flows out from the outlet 67. By doing in this way, compared with Example 7, the flow loss of the refrigerant | coolant in the 1st thermal radiation part 64 and the 2nd thermal radiation part 65 can be reduced. Therefore, the load on the pump for circulating the refrigerant can be greatly reduced. The cooling air flows in substantially the same manner as in the seventh embodiment.

  By doing in this way, the cooling air from the axial-flow impeller 2 comes to be divided | segmented into right and left smoothly, and it is effective in noise reduction and heat dissipation capability improvement.

As described above, according to the present invention, radiator components (radiation fins, refrigerant flow paths), blower fans, pipes, and other radiator components and elements are mounted in a thin and flat box-shaped housing in a plane, and are thin and flat. A thin, flat surface that can be mounted on the back of a laptop computer's LCD screen by realizing a blower (fan) that allows a large amount of cooling air (up to several m ³ / min) required for cooling to flow through a simple channel. A radiator can be provided.

1 is an exploded perspective view of a notebook computer according to Embodiment 1 of the present invention. It is a side view of the notebook computer shown in FIG. It is a top view which shows the structure structure of the heat radiator of Example 1 in this invention. It is AA arrow sectional drawing of the heat radiator shown in FIG. It is a perspective view which shows the structure of the thermal radiation part of the heat radiator shown in FIG. It is a top view which shows the structure structure of the heat radiator of Example 2 in this invention. It is AA arrow sectional drawing of the heat radiator shown in FIG. It is a perspective view which shows the structure of the thermal radiation part of the heat radiator shown in FIG. It is a perspective view which shows the structure of the thin tube group of the thermal radiation part of the heat radiator shown in FIG. It is a top view which shows the structure structure of the method heater of Example 3 in this invention. It is a top view which shows the structure structure of the method heater of Example 4 in this invention. It is a top view which shows the structure structure of the method heater of Example 5 in this invention. It is a top view which shows the structure structure of the method heater of Example 6 in this invention. It is a top view which shows the structure structure of the method heater of Example 7 in this invention. It is a top view explaining the shape of the radiation fin of the thermal radiation part in a radiator. It is a top view explaining the radiation fin shape of the thermal radiation part of the heat radiator shown in FIG. It is a top view which shows the structure structure of the method heater of Example 8 in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Radiator, 2 ... Axial-flow impeller, 3 ... Upper casing, 4 ... Lower casing, 5 ... 1st thermal radiation part, 6 ... 2nd thermal radiation part, 7 ... Refrigerant piping, 8 ... 1st header, 9 ... 1st 2 headers, 10 ... suction port,
DESCRIPTION OF SYMBOLS 11, 35, 61 ... Inlet, 12, 37, 67 ... Outlet, 13 ... Return piping, 15 ... Flat plate radiation fin, 16 ... Diffusion flow path, 17 ... Discharge port, 18 ... Narrow tube group, 19 ... Narrow tube, 30, 32 ... side plates, 31, 33 ... partition plates, 36, 38 ... heat radiating part, 40 ... piping, 41 ... reserve tank, 51 ... member, 62 ... first header, 63 ... second header, 64 ... first heat radiation Part, 65 ... second heat radiating part, 66 ... return pipe, 100 ... panel body, 110 ... keyboard, 120 ... heating element,
150 ... Lid, 160 ... Liquid crystal panel, 200 ... Heat receiving jacket, 300 ... Circulation pump.

Claims (4)

In a liquid cooling system including a heat receiving part that receives heat with a refrigerant that circulates heat of an element mounted on an electronic device, and a radiator that dissipates the received heat,
A flat housing constituting the radiator, a cooling air suction port provided in a central portion of the upper surface of the housing, a cooling air discharge port provided on both left and right side surfaces of the housing, and An axial-flow impeller having a motor positioned at the suction port and horizontally disposed on the lower surface of the box-shaped housing; a first heat radiating portion and a second heat radiating portion provided near the discharge ports on the left and right side surfaces; A first header and a second header provided in a casing in the vicinity of both front and rear side surfaces of the box-shaped casing;
The first heat radiating portion, the second heat radiating portion, the first header, and the second header are connected, and the refrigerant flowing into the heat radiator is divided into two systems by the first header, and then the first heat radiating portion and the second heat radiating portion. 2 flows in parallel through the refrigerant flow path of the heat radiating section, merges at the second header, and then flows out of the housing of the radiator, and is configured by the upper and lower surfaces of the box-shaped housing, the first header, and the second header The liquid cooling system is a radiator that radiates the heat of the refrigerant to the atmosphere by allowing cooling air to flow through the flow path and passing through the first heat radiating portion and the second heat radiating portion. The heat radiator according to claim 1.
The first header and the second header are connected by a plurality of thin tubes, the first heat dissipating part and the second heat dissipating part are formed, and the heat dissipator is configured such that the refrigerant flows in the plurality of thin tubes. Features a liquid cooling system. The heat radiator according to claim 1.
The liquid cooling system, wherein the first heat radiating portion and the second heat radiating portion are arc-shaped, and are heat radiators arranged concentrically with the axial flow impeller. The heat radiator according to claim 1.
An electronic apparatus, wherein the radiator is mounted on a back surface of a liquid crystal screen.

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