JP2007250972A - Low-heat invasion current lead device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-heat invasion current lead device which reduces electric resistance when an electrification current is large, or suppresses small heat invasion when there is no electrification, or when the electrification current is small. <P>SOLUTION: A low-heat invasion current lead device comprises: a turn-shaped current lead conductor 1 with a positive coefficient of linear expansion; and a material 2 with a negative coefficient of linear expansion, disposed not to be brought into contact with as a whole but to be connected with just partially the current lead conductor 1 in an axial direction via a heat conduction connection 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a low thermal intrusion current lead device used in a case where a high temperature superconducting cable is applied to a railway feeder, a superconducting application device, or the like.

  Conventionally, when a high-temperature superconducting cable is applied to a railway feeder, in order to connect the superconducting cable cooled with liquid nitrogen and a trolley wire, the low temperature region and the room temperature region must be connected by a current lead. In addition, in the conventional superconducting cable for electric power, there are few power outlets from the feeder, but when the superconducting cable is applied to the feeder, it is necessary to connect the feeder and the trolley wire every several hundred meters. Therefore, the superconducting cable cooled to a very low temperature and the trolley wire at room temperature are frequently connected.

  The performance required for a current lead when such a superconducting cable is applied to feeders is that a large current can be passed and heat penetration is small.

In addition, when superconducting cables are applied to feeders, the time that current flows through each current lead is only when the train is in that section, and is intermittent compared to power cables. There is a feature that the fluctuation of is said to be large. Therefore, a current lead is desired that has a small resistance when a current is flowing, can flow a large current, and can suppress heat penetration when the current is small or when no current is flowing.
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  However, in order to pass a large current through the current lead, the conductor cross-sectional area must be increased and the conductor length must be shortened to reduce the electrical resistance as much as possible. The conductor cross-sectional area must be reduced and the conductor lengthened. In other words, there was a problem that conflicting requirements had to be satisfied.

  In view of the above situation, an object of the present invention is to provide a low heat penetration current lead device that can reduce electrical resistance when an energization current is large and can suppress heat penetration to be small when no energization or an energization current is small. .

In order to achieve the above object, the present invention provides
[1] In the low heat penetration current lead device, a turn-shaped current lead conductor having a positive coefficient of linear expansion is connected to the current lead conductor through the heat conduction connecting portion in the axial direction and only partially connected. And a material having a negative coefficient of linear expansion.

  [2] The low heat penetration current lead device according to [1], wherein the current lead conductor is a spiral current lead conductor.

  [3] The low heat penetration current lead device according to [2], wherein the material is arranged on an outer periphery of the spiral current lead conductor.

  [4] The low heat penetration current lead device according to [2], wherein the material is arranged on an inner periphery of the spiral current lead conductor.

  [5] The low heat penetration current lead device according to [2], wherein the material is disposed on an outer periphery and an inner periphery of the spiral current lead conductor.

  [6] The low heat penetration current lead device according to [2], wherein the material is disposed on a part of an outer periphery of the spiral current lead conductor.

  [7] The low heat penetration current lead device according to [2], wherein the material is disposed on a part of an inner circumference of the spiral current lead conductor.

  [8] The low heat penetration current lead device according to [2], wherein the material is disposed on a part of an outer periphery and an inner periphery of the spiral current lead conductor.

  [9] The low heat penetration current lead device according to [1], wherein the current lead conductor is a meander-shaped current lead conductor.

  [10] The low heat penetration current lead device according to [9], wherein the material is disposed on one surface of the meander-shaped current lead conductor.

  [11] The low heat penetration current lead device according to [9], wherein the material is disposed on both surfaces of the meander-shaped current lead conductor.

  [12] The low heat penetration current lead device according to any one of [9] to [11], wherein the material is disposed on an outer periphery of the meander-shaped current lead conductor.

  [13] The low heat penetration current lead device according to [12], wherein the material is disposed on a part of an outer periphery of the meander-shaped current lead conductor.

  [14] The low thermal intrusion current lead device according to [1], wherein the heat conduction connecting portion has a cross-sectional shape so that a contact area with the material is reduced.

  [15] In the low heat penetration current lead device according to [1], the heat conduction connecting portion is configured by being fixed only at a central portion of the material and the current lead conductor, and other portions than the central portion are free. It is characterized by that.

  According to the present invention, when there is no energization or when the energization current is small, the turn (spiral or meander) shaped current lead conductor having a positive coefficient of linear expansion does not generate heat or is small, so the temperature is low, so the current lead conductor The material with a negative linear expansion coefficient expands, creating a gap between the turns of the current lead conductor and acting as one long conductor, and the cross-sectional area of the current lead conductor is also small, so the heat transfer distance As a long and thin conductor, heat penetration can be suppressed.

  On the other hand, when the energization current is large, current flows through the current lead conductor, and when the current value increases, the current lead conductor generates heat and the temperature rises because the cross section of the current lead conductor is small and the resistance value is large. As the temperature rises, the current lead conductor with a positive coefficient of linear expansion expands, and the material with a negative coefficient of linear expansion contracts. As a current lead conductor having a large cylindrical or rectangular cross-sectional area and a short length, electrical resistance is reduced, and heat generation due to electrical resistance is suppressed. That is, although a heat penetration amount increases, a large current can be passed.

  The low heat penetration current lead device of the present invention has a current lead conductor having a positive coefficient of linear expansion, and the current lead conductor is not entirely in contact with the current lead conductor in the axial direction via the heat conduction connecting portion, but only partially. And a material having a negative coefficient of linear expansion arranged to be connected.

  Hereinafter, embodiments of the present invention will be described in detail.

  FIG. 1 is a diagram showing a low thermal invasion current lead device according to the first embodiment of the present invention and its operation by an energized current. FIG. 1 (a) shows a low thermal invasion current when the current is small or when no current flows. FIG. 1B is a vertical cross-sectional view showing the state of the lead device, and FIG. 1B is a vertical cross-sectional view showing the state of the low heat penetration current lead device when current is flowing. FIG. 2 is a diagram showing a low thermal invasion current lead device according to the first embodiment of the present invention and the action of the energization current. FIG. 2 (a) shows a low thermal invasion current when the current is small or when no current flows. FIG. 2B is a cross-sectional view showing the state of the low heat penetration current lead device when current is flowing.

  In these figures, 1 is a current lead conductor having a positive coefficient of linear expansion such as copper formed in a spiral shape (for example, a turn-shaped copper conductor), and 2 is a heat conductor on the outer periphery of the spiral of the current lead conductor 1. A material having a negative linear expansion coefficient (for example, xylon) disposed in the current passing direction so that the entire current lead conductor 1 is not fixed to the current lead conductor 1 via the conductive connection portion 3. This is a heat conduction connecting portion for connecting the lead conductor 1 and the material 2 having a negative linear expansion coefficient. In addition, this heat conduction connection part 3 has a cross-sectional shape (a shape with a small tip of the heat conduction connection part 3, but better heat transfer is preferred) such that the contact area with the material 2 becomes smaller. desirable. For example, it is desirable that the connection shape be a protrusion shape or the like so that the connection area with the material 2 having a negative linear expansion coefficient is small. That is, it is important that the expansion / contraction of the current lead conductor 1 and the expansion / contraction of the material 2 having a negative linear expansion coefficient are not restricted as much as possible. Note that the current lead conductor 1 and the heat conduction connecting portion 3 may be integrated.

  In addition, it is desirable that the current lead conductor 1 has a large contact area between the turns so that a large current can be applied when the currents flow and the turns adhere to each other.

  With this configuration, as shown in FIGS. 1A and 2A, when the current is small or no current flows, the current lead conductor 1 does not generate heat and the material 2 extends. Therefore, a gap is generated between the turns of the spiral current lead conductor 1, so that the current lead conductor 1 is substantially small in cross-sectional area and long in length. That is, when the current is small or no current flows, the heat intrusion can be suppressed to a small value.

  On the other hand, when the current is flowing, as shown in FIGS. 1B and 2B, the current lead conductor 1 expands and the material 2 contracts due to heat generation, so that each turn of the spiral current lead conductor 1 occurs. As a result, the spiral current lead conductor 1 has a cylindrical shape, and as a result, the cross-sectional area of the current lead conductor 1 increases and its length decreases.

  In other words, when a large current is to be applied, the conductor cross-sectional area can be increased and the conductor length can be shortened to suppress the electrical resistance as much as possible. When the current is small or no current is flowing, the conductor is disconnected. By reducing the area and lengthening the conductor, heat intrusion can be reduced.

  FIG. 3 is a diagram showing a low thermal invasion current lead device according to a second embodiment of the present invention and the action of the energization current. FIG. 3A shows a low thermal invasion current when the current is small or when no current is flowing. FIG. 3B is a vertical cross-sectional view showing the state of the lead device, and FIG. 3B is a vertical cross-sectional view showing the state of the low heat penetration current lead device when current is flowing. FIG. 4 is a diagram showing a low thermal invasion current lead device according to a second embodiment of the present invention and the action of the energization current. FIG. 4A shows a low thermal invasion current when the current is small or when no current is flowing. FIG. 4B is a transverse cross-sectional view showing the state of the low heat penetration current lead device when current is flowing.

  In these drawings, 1 is a current lead conductor (for example, a turn-shaped copper conductor) having a positive linear expansion coefficient such as copper formed in a spiral shape, and 4 is an inner periphery of the spiral of the current lead conductor 1. A material (for example, xylon) 5 having a negative linear expansion coefficient disposed in the current passing direction is provided on the current lead conductor 1 so that the entire current lead conductor 1 is not contact-fixed to the current lead conductor 1 via the heat conducting connection portion 5. It is a heat conduction connecting part for connecting the current lead conductor 1 and the material 4 having a negative linear expansion coefficient. In addition, it is desirable that the heat conduction connecting portion 5 has a cross-sectional shape (a shape where the tip on the material 4 side of the heat conducting connecting portion 5 is small) so that the contact area with the material 4 is small. For example, it is desirable that the connection shape be a protrusion shape or the like so that the connection area with the material 4 having a negative linear expansion coefficient is small.

  In addition, it is desirable that the current lead conductor 1 has a large contact area between the turns so that a large current can be applied when the currents flow and the turns adhere to each other.

  With this configuration, as shown in FIGS. 3A and 4A, when the current is small or no current flows, the current lead conductor 1 does not generate heat and the material 4 extends. Therefore, a gap is generated between the turns of the spiral current lead conductor 1, so that the current lead conductor 1 is substantially small in cross-sectional area and long in length. That is, when the current is small or no current flows, the heat intrusion can be suppressed to a small value.

  On the other hand, when the current is flowing, as shown in FIGS. 3B and 4B, the current lead conductor 1 expands and the material 4 contracts due to heating, so that each turn of the spiral current lead conductor 1 occurs. As a result, the spiral current lead conductor 1 has a cylindrical shape, and as a result, the cross-sectional area of the current lead conductor 1 increases and its length decreases.

  FIG. 5 is a diagram showing a low thermal invasion current lead device according to a third embodiment of the present invention and the operation of the energization current. FIG. 5A shows a low thermal invasion current when the current is small or when no current is flowing. FIG. 5B is a longitudinal sectional view showing the state of the low heat penetration current lead device when a current is flowing. FIG. 6 is a diagram showing a low heat penetration current lead device according to a third embodiment of the present invention and the action of the energization current. FIG. 6A shows a low heat penetration current when the current is small or when no current flows. FIG. 6B is a cross-sectional view showing the state of the low heat penetration current lead device when current is flowing.

  In this embodiment, the current lead conductor 1 having a positive linear expansion coefficient in the first embodiment is arranged on the outer periphery of the spiral so as not to be fixed to the current lead conductor 1 as a whole via the heat conduction connecting portion 3. Not only the material 2 having a negative linear expansion coefficient (for example, xylon) 2 but also the inner periphery of the spiral of the current lead conductor 1 through the heat conducting connection 5 as in the second embodiment, the negative wire A material (for example, xylon) 4 having an expansion coefficient is arranged.

  Here, as in the first embodiment, the heat conduction connecting portions 3 and 5 have a cross-sectional shape (a shape where the tip of the heat conduction connecting portion is small) so that the contact area with the materials 2 and 4 is small. It is desirable. For example, it is desirable that the connection shape be a protrusion shape or the like so that the connection area with the material 2 having a negative linear expansion coefficient is small.

  In addition, it is desirable that the current lead conductor 1 has a large contact area between the turns so that a large current can be applied when the currents flow and the turns adhere to each other.

  In this way, the current lead conductor 1 is displaced from both the inner and outer peripheral surfaces of the spiral by the materials 2 and 4 having a negative linear expansion coefficient, so that the current lead conductor 1 can be displaced more reliably. it can.

  FIG. 7 is a diagram showing the arrangement of conductors made of a material having a negative linear expansion coefficient (for example, xylon) in the low thermal intrusion current lead device according to the fourth embodiment of the present invention, and FIG. 8 shows the fifth embodiment of the present invention. It is a figure which shows arrangement | positioning of the conductor which consists of material (for example, xylon) with a negative linear expansion coefficient in the low thermal penetration | invasion electric current lead apparatus shown.

  In these embodiments, instead of disposing a material (for example, xylon) 6, 8 having a negative linear expansion coefficient around the entire circumference of the spiral of the current lead conductor 1 as in the first and second embodiments. , It is arranged only in a part of the periphery (for example, 1/2). Further, the arrangement range may be arranged around 1/4 of the entire circumference.

  FIG. 9 is a diagram showing an arrangement of conductors made of a material having a negative linear expansion coefficient (for example, xylon) in the low thermal intrusion current lead device according to the sixth embodiment of the present invention.

  In this embodiment, as shown in FIG. 9, only a part of the material (for example, xylon) 6 and 8 having such a negative linear expansion coefficient is arranged on both the outer periphery and the inner periphery of the spiral of the current lead conductor 1. Also good.

  FIG. 10 is a plan view showing a low heat penetration current lead device according to a seventh embodiment of the present invention and the action of the energization current. FIG. 10 (a) shows a low heat penetration current when the current is small or no current flows. FIG. 10B is a plan view showing the state of the current lead device, and FIG. 10B is a plan view showing the state of the low heat penetration current lead device when current is flowing. FIG. 11 is a side view showing a low heat penetration current lead device according to a seventh embodiment of the present invention and the action of the energization current. FIG. 11A shows a low heat penetration current when the current is small or no current is flowing. FIG. 11B is a side view showing the state of the current lead device, and FIG. 11B is a side view showing the state of the low heat penetration current lead device when current flows.

  In this embodiment, the current lead conductor 11 having a positive linear expansion coefficient has a meander shape, its folded portion is flexible, and a material 12 having a negative linear expansion coefficient in the direction perpendicular to the direction of current application is arranged on one side. However, the material 12 is configured to be attached to the current lead conductor 11 by the heat conducting connection 13.

  With this configuration, as shown in FIGS. 10A and 11A, when the current is small or when no current flows, the current lead conductor 11 does not generate heat and the material 12 extends. Therefore, a gap is generated between each turn (turnback) of the meander-shaped current lead conductor 11, so that the cross-sectional area of the current lead conductor 11 is substantially small and the length is long. That is, when the current is small or no current flows, the heat intrusion can be suppressed to a small value.

  On the other hand, when the current is flowing, as shown in FIGS. 10B and 11B, the conductor 11 expands and the material 12 contracts due to heat generated by the meander-shaped current lead conductor 11, so that the meander-shaped current is reduced. The turns of the lead conductor 11 are in close contact with each other. As a result, the meander-shaped current lead conductor 11 has a rectangular shape, and the cross-sectional area of the current lead conductor 11 increases and its length decreases.

  In other words, when a large current is to be applied, the conductor cross-sectional area can be increased and the conductor length can be shortened to suppress the electrical resistance as much as possible. When the current is small or no current is flowing, the conductor is disconnected. By reducing the area and lengthening the conductor, heat intrusion can be reduced.

  FIG. 12 is a plan view showing a low heat penetration current lead device according to an eighth embodiment of the present invention and the action of the energization current. FIG. 12 (a) shows a low heat penetration current when the current is small or no current flows. FIG. 12B is a plan view showing the state of the current lead device, and FIG. 12B is a plan view showing the state of the low heat penetration current lead device when current is flowing. FIG. 13 is a side view showing a low heat penetration current lead device according to an eighth embodiment of the present invention and the action of the energization current. FIG. 13A shows a low heat penetration current when the current is small or when no current flows. FIG. 13B is a side view showing the state of the current lead device, and FIG. 13B is a side view showing the state of the low heat penetration current lead device when current is flowing.

  In this embodiment, the linear expansion coefficient is very small or negative in the direction perpendicular to the energizing current direction on both surfaces of the current lead conductor 11 having a positive linear expansion coefficient that is meander-shaped and flexible at its folded portion. The materials 12 and 14 having the coefficients are arranged, and the materials 12 and 14 are configured to be attached to the current lead conductor 11 by the heat conductive connection portions 13 and 15.

  With this configuration, the materials 12 and 14 are arranged on both sides of the meandering current lead conductor 11 as compared with the seventh embodiment in which the material 12 is arranged only on one side of the meandering current lead conductor 11. As a result, the displacement of the meandering current lead conductor 11 can be made more reliable.

  FIG. 14 is a schematic plan view of a confirmation test of the effect of the present invention. FIG. 14 (a) shows a state where the temperature of the conductor is low, and FIG. 14 (b) shows a state where the temperature of the conductor is high. . 15A and 15B are schematic side views of the confirmation test, in which FIG. 15A shows a state where the temperature of the conductor is low, and FIG. 15B shows a state where the temperature of the conductor is high.

  In these drawings, reference numerals 21 to 23 denote copper conductors, and 24 denotes a material made of zylon fibers having a negative linear expansion coefficient disposed on both surfaces of the conductors 21 to 23 via the heat conductive connection portions 25. Here, a resistance between the conductors 21 and 22 is a resistance 1, and a resistance between the conductors 22 and 23 is a resistance 2.

  Therefore, the resistance change was examined by measuring the resistance between the conductors 21 to 23 at room temperature and when the temperature was changed by cooling with liquid nitrogen.

  FIGS. 16A and 16B are diagrams showing the results of the confirmation test in FIGS. 14 and 15, FIG. 16A is a diagram showing a change in resistance 1, and FIG. 16B is a diagram showing a change in resistance 2.

In these figures, R represents resistance, T represents temperature, R _L represents a case where the conductor is in contact and the resistance is 0, and R _H represents a case where the conductor is not in contact and the resistance is ∞. ing.

  As is clear from these figures, when the temperature of the conductor increases, there is no gap between the conductors 21 and 22 and between the conductors 22 and 23, the conductors come into contact, and the resistances 1 and 2 are lowered accordingly. Was able to prove.

  Next, for example, as shown in FIG. 5, the contact portion between the material (for example, xylon) 2, 4 having a negative linear expansion coefficient and the heat conduction connecting portions 3, 5 has a quadrangular shape. Instead, the cross-sectional shape can be such that the contact area is further reduced.

  FIG. 17 is an enlarged view showing a cross-sectional shape in which the contact area between the heat conduction connecting portion and the material having a negative linear expansion coefficient according to the embodiment of the present invention becomes small.

  In FIG. 17 (a), the heat conductive connection portions 33 and 35 are made to have a semicircular cross section so that the contact areas of the materials 32 and 34 having a negative coefficient of linear expansion are reduced. As shown in FIG. 17 (b), the heat conductive connection portions 43 and 45 are in contact with the materials 42 and 44 having a negative linear expansion coefficient so that the contact area is reduced by making the cross section triangular. You may make it make it.

  FIG. 18 is an enlarged view showing a shape in which the contact area between the heat conduction connecting portion and the material having a negative linear expansion coefficient according to the embodiment of the present invention becomes small.

  In this embodiment, in the low heat penetration current lead device, the heat conduction connecting portion 51 is configured by being fixed only by the material 52 having a negative linear expansion coefficient and the central portion 54 of the current lead conductor 53. Except for 54, the free part 55 was used.

  By constituting in this way, it is fixed only at the central portion 54 and reliably contacts, and can move freely except at the central portion 54.

  In the above embodiment, a material having a negative linear expansion coefficient is used. However, even a material having a very small linear expansion coefficient can be appropriately applied.

  Further, the present invention is not limited to the above-described embodiments, and various modifications can be made based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

  The low heat penetration current lead device of the present invention is suitable for a current lead when a high temperature superconducting cable is applied to a railway feeder.

It is a figure which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 1st Example of this invention, and its energization current. It is a figure which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 1st Example of this invention, and its energization current. It is a figure which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 2nd Example of this invention, and its energization current. It is a figure which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 2nd Example of this invention, and its energization current. It is a figure which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 3rd Example of this invention, and its energization current. It is a figure which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 3rd Example of this invention, and its energization current. It is a figure which shows arrangement | positioning of the conductor which consists of a material (for example, xylon) with a negative linear expansion coefficient in the low thermal penetration | invasion electric current lead apparatus which shows 4th Example of this invention. It is a figure which shows arrangement | positioning of the conductor which consists of a material (for example, xylon) with a negative linear expansion coefficient in the low thermal penetration | invasion electric current lead apparatus which shows 5th Example of this invention. It is a figure which shows arrangement | positioning of the conductor which consists of a material (for example, xylon) with a negative linear expansion coefficient in the low thermal penetration | invasion electric current lead apparatus which shows 6th Example of this invention. It is a top view which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 7th Example of this invention, and its energization current. It is a side view which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 7th Example of this invention, and its energization current. It is a top view which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 8th Example of this invention, and its energization current. It is a side view which shows the effect | action by the low thermal penetration electric current lead apparatus which shows 8th Example of this invention, and its energization current. It is a plane schematic diagram of the confirmation test of the effect of the present invention. It is a side surface schematic diagram of the confirmation test of the effect of this invention. It is a figure which shows the result of the confirmation test in FIG.14 and FIG.15. It is an enlarged view which shows the cross-sectional shape that the contact area of the heat conductive connection part which shows the Example of this invention, and the material with a negative linear expansion coefficient becomes small. It is an enlarged view which shows the shape where the contact area of the heat conductive connection part which shows the Example of this invention, and the material with a negative linear expansion coefficient becomes small.

Explanation of symbols

1,11,53 Current lead conductor having a positive coefficient of linear expansion 2,4,6,8,12,14,24,32,34,42,44,52 Material having a negative coefficient of linear expansion (eg, xylon)
3, 5, 13, 15, 25, 33, 35, 43, 45, 51 Thermal conduction connection portion 21-23 Copper conductor 54 Central portion of current lead conductor 55 Free portion of current lead conductor

Claims (15)

(A) a turn-shaped current lead conductor having a positive coefficient of linear expansion;
(B) comprising a material having a negative linear expansion coefficient, which is arranged so as to be connected only partially with the current lead conductor in the axial direction through the heat conduction connecting portion. Low thermal intrusion current lead device.   2. The low heat penetration current lead device according to claim 1, wherein the current lead conductor is a spiral current lead conductor.   3. The low heat penetration current lead device according to claim 2, wherein the material is disposed on an outer periphery of the spiral current lead conductor.   3. The low heat penetration current lead device according to claim 2, wherein the material is arranged on an inner periphery of the spiral current lead conductor.   3. The low heat penetration current lead device according to claim 2, wherein the material is disposed on an outer circumference and an inner circumference of the spiral current lead conductor.   3. The low heat penetration current lead device according to claim 2, wherein the material is disposed on a part of an outer periphery of the spiral current lead conductor.   3. The low heat penetration current lead device according to claim 2, wherein the material is disposed on a part of an inner periphery of the spiral current lead conductor.   3. The low heat penetration current lead device according to claim 2, wherein the material is disposed on a part of the outer periphery and the inner periphery of the spiral current lead conductor.   2. The low heat penetration current lead device according to claim 1, wherein the current lead conductor is a meander-shaped current lead conductor.   10. The low heat penetration current lead device according to claim 9, wherein the material is disposed on one surface of the meander-shaped current lead conductor.   10. The low heat penetration current lead device according to claim 9, wherein the material is disposed on both surfaces of the meander-shaped current lead conductor.   The low heat penetration current lead device according to any one of claims 9 to 11, wherein the material is disposed on an outer periphery of the meander-shaped current lead conductor.   13. The low heat penetration current lead device according to claim 12, wherein the material is disposed on a part of the outer periphery of the meander-shaped current lead conductor.   2. The low thermal intrusion current lead device according to claim 1, wherein the heat conduction connecting portion has a cross-sectional shape that reduces a contact area with the material.   2. The low thermal intrusion current lead device according to claim 1, wherein the heat conduction connecting portion is formed by being fixed only at a central portion of the material and the current lead conductor, and the portions other than the central portion are made free. Low thermal intrusion current lead device.

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