JP2007245708A - Metal mesh - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal mesh by which wettability and pass through property can be obtained and the metal mesh. <P>SOLUTION: The molecular bond of the surface of a wire material constituting the metal mesh 1 are surface reformed by a plasma P irradiated from a plasma irradiating device 4 to sufficiently uniformly form a plasma coating Pa with high wattability (affinity) on the whole surface of the wire material 2. Foreign materials E sticking to the surface of the wire material 2 is separated and removed from the surface of the wire material 2 by bonding the same to the molecules of the plasma P or making the plasma colliding against the same. The pass through property suitable fine screen printing or a filter for separating fine foreign objects can be obtained because the wettability is improved and the surface tension and contact resistance provided to objects to be contacted are reduced by forming a large number of fine unevenness on the whole surface of the wire material 2 and the plasma coating Pa. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for producing a metal mesh and a metal mesh used for, for example, a printing screen for printing a dense print pattern, a filter for filtering to separate fine foreign matters, and the like.

  Conventionally, as a method for printing the dense print pattern of the above-described example, there is a method for producing a mesh for screen printing described in Patent Document 1 in which a plasma polymerized film is formed on a polyester mesh surface, for example. However, when a photosensitive emulsion is applied on the mesh, or when transferring the transferred material, the polyester wire rods meander or the interval between the wire rods is easily displaced, so that a dense print pattern can be obtained. It is not suitable for printing work. Further, for example, there is a photo method suitable for an operation for forming a complicated circuit pattern on a transfer substrate. However, processing such as resist coating, exposure, development, etching, etc. must be performed, and the number of overall processes is large, and the work of printing the circuit pattern takes time and effort, resulting in poor work efficiency.

As an alternative method, for example, as shown in FIG. 14, after forming the screen mesh 1A with a metal or resin wire 2A, the emulsion 5A applied on the screen mesh 1A is exposed to light, and the unexposed portion of the emulsion. 5A is removed to form a plurality of openings 6A that are print patterns. After the screen mesh 1A on which the printing pattern is formed is superimposed on a transfer object (not shown), the transfer object supplied on the screen mesh 1A is printed on the transfer object through the opening 6A formed in the emulsion 5A. There is a screen printing method to do.
Japanese Patent No. 3090535

  However, in the screen printing method, since the surface of the wire 2A of the screen mesh 1A is smooth, the wettability (affinity) between the wire 2A and the emulsion 5A is poor, and the surface tension applied to the emulsion 5A is large. The emulsion 5A applied on the screen mesh 1A and the outline (edge) of the opening 6A formed by removing the emulsion 5A are distorted, and the printed pattern becomes unclear (see FIG. 14). In addition, when a transferred material such as ink passes through the opening 6A of the emulsion 5A and is printed on the transferred material, the printed pattern outline is blurred, so a precise printed pattern is printed. Is difficult. Also, if the wettability of the wire 2A and the emulsion 5A is poor, as shown in FIG. 15, the emulsion 5A hardly penetrates into the intersecting portion of the wire 2A and voids 5Aa are generated, so that the transferred material is a portion other than the opening 6A. Are also printed, and cannot be printed according to the pattern.

  Further, when manufacturing the metal screen mesh 1A, an organic material such as lubricating oil is an indispensable material, but the oil-based organic material is incompatible with the emulsion 5A and repels the emulsion 5A. If foreign matter E such as an oil-based organic substance adheres to the surface of 2A (see FIG. 15), the conformability of the wire 2A and the emulsion 5A deteriorates, and unevenness occurs in the print pattern. Since foreign substances E such as organic substances and inorganic substances that are generated during the production are likely to adhere, cleaning work for removing the foreign substances E adhering to the surface of the wire 2A is indispensable.

  Moreover, even if the screen mesh 1A is washed with a detergent using, for example, a washing brush or a cleaning tool instead of the brush, it is difficult to remove the foreign matter E adhering to the inside of the screen mesh 1A or the crossing portion of the wire 2A, and the cleaning work Therefore, it takes time and labor to slow down the penetration speed of the emulsion 5A into the screen mesh 1A.

  In view of the above problems, an object of the present invention is to provide a metal mesh manufacturing method and a metal mesh capable of improving wettability and pull-out property.

  The method for producing a metal mesh according to the first aspect of the present invention is characterized in that the molecular bond on the surface of the wire constituting the metal mesh is surface-modified so that the wettability is enhanced by the plasma generated by the plasma generating means, and the plasma The plasma coating having high wettability formed by surface modification by the method is characterized by being formed substantially uniformly over the entire surface of the wire.

  According to the present invention, the molecular bond on the surface of the wire is surface-modified so that the wettability is increased by the plasma, and the high wettability plasma coating formed by the surface modification by the plasma is substantially applied to the entire surface of the wire. Since it is uniformly formed, the surface tension and contact resistance applied to the contact object such as paste-like photosensitive emulsion, conductive paste-like or liquid transfer object, gas or liquid, etc. are reduced, and the object to be contacted. This improves the wettability of the wire and the ability to remove the contacted object.

  The metal mesh wire can be made of metal such as stainless steel or steel. The mesh of the metal mesh can be changed to a desired size and shape according to the purpose and application. The plasma generating means can be constituted by, for example, an air plasma irradiation device, a glow plasma irradiation device, or the like. Moreover, as an environment at the time of plasma generation, for example, an environment such as atmospheric pressure (normal pressure) or reduced pressure (vacuum) can be set.

  According to a second aspect of the present invention, there is provided a metal mesh manufacturing method in which the plasma generated by the plasma generating means is caused to collide with at least one surface of the wire and the plasma coating in combination with the configuration of the first aspect. It is characterized by the formation of many fine irregularities.

  According to this invention, since the fine irregularities are formed on at least one surface of the wire and the plasma coating, the surface tension and contact resistance applied to the contacted object are reduced, and the wire, the plasma coating and the contacted object are wetted. Sex (friendliness) is improved.

  According to a third aspect of the present invention, there is provided a method for producing a metal mesh, comprising: combining the structure according to the first or second aspect with a plasma generated by the plasma generating means in an environment where the plasma coating is at atmospheric pressure or reduced pressure. It is characterized by being formed.

  According to the present invention, since the plasma coating is formed under an atmospheric pressure environment, it is possible to simplify the configuration of the process and apparatus for forming the plasma coating. In addition, if formed in a reduced pressure environment, foreign substances such as organic and inorganic substances present in the environment are removed by suction together with the atmosphere (for example, air), for example, by the reduced pressure of the pressure reducing means, so that a plasma film is formed. It is possible to prevent foreign matters from adhering again to the portion to be formed.

  According to a fourth aspect of the present invention, there is provided a method for producing a metal mesh, wherein the plasma generating means is generated in an environment in which the fine irregularities are reduced to atmospheric pressure or reduced pressure in combination with the configuration of the first or second aspect. It is characterized by being formed by colliding with plasma.

  According to the present invention, since the fine irregularities are formed in an atmosphere of atmospheric pressure, for example, it is possible to save time and work such as housing in the decompression chamber or taking it out from the decompression chamber, thereby improving the efficiency of the operation. Further, if formed under a reduced pressure environment, foreign matter such as organic matter and inorganic matter existing in the environment is removed by suction together with the atmosphere (for example, air) by, for example, the reduced pressure of the pressure reducing means, so that fine irregularities are formed. Foreign matter can be prevented from adhering to the formed portion.

  According to a fifth aspect of the present invention, in the metal mesh manufacturing method, the plasma generated by the plasma generating means is brought into contact with or collided with the entire surface of the wire in combination with the configuration according to the first or second aspect. The foreign matter is separated and removed from the surface of the wire.

  According to this invention, the foreign matter adhering to the surface of the wire is combined with the plasma, or the foreign matter attached to the surface of the wire is collided with the plasma to separate and remove the foreign matter from the surface of the wire.

  In the metal mesh of the invention described in claim 6, a plasma coating with high wettability formed by modifying the molecular bonds of the surface of the wire with plasma is formed substantially uniformly on the entire surface of the wire constituting the metal mesh. It is characterized by.

  According to the present invention, the plasma coating with high wettability formed by surface modification with plasma is formed substantially uniformly over the entire surface of the wire, so the surface tension and contact resistance applied to the contacted object are small. In addition, the wettability (affinity) between the wire and the contacted object and the detachability of the contacted object are improved. In other words, the molecular bond on the surface of the wire is changed by the plasma to modify the plasma coating with high wettability.

  In the metal mesh of the invention described in claim 7, in combination with the structure described in claim 6, a large number of fine irregularities formed by colliding the plasma are formed on at least one surface of the wire and the plasma coating. It is characterized by.

  According to this invention, since the fine irregularities are formed on at least one surface of the wire and the plasma coating, the surface tension and contact resistance applied to the contacted object are small, and the wire, the plasma coating and the contacted object Improves wettability (friendly).

  The metal mesh of the invention described in claim 8 is formed when the plasma is generated in an environment of atmospheric pressure or reduced pressure in combination with the structure described in claim 6 or 7. It is characterized by that.

  According to the present invention, since the plasma coating is formed under an atmospheric pressure environment, it is possible to simplify the configuration of the process and apparatus for forming the plasma coating. Further, if formed under a reduced pressure environment, the foreign matter existing in the environment is removed by suction together with the atmosphere (for example, air) by the pressure reducing means of the pressure reducing means, for example. Can be prevented from reattaching.

  The metal mesh of the invention described in claim 9 is formed together with the structure described in claim 6 or 7 when the fine bumps are collided with the plasma in an environment of atmospheric pressure or reduced pressure. It is characterized by that.

  According to the present invention, since the fine irregularities are formed under an atmospheric pressure environment, the configuration of the process and apparatus for forming the fine irregularities can be simplified. Further, if formed in a reduced pressure environment, foreign substances existing in the environment are removed by suction together with the atmosphere (for example, air) by, for example, the reduced pressure of the pressure reducing means, so that the portion where fine irregularities are formed is formed. It is possible to prevent foreign matters from reattaching.

  A metal mesh screen according to a tenth aspect of the invention is characterized in that a printing screen is constituted by the metal mesh according to any one of the sixth to ninth aspects.

  According to the present invention, the metal mesh on which the plasma film is formed is used as a printing screen. For example, an emulsion having a viscosity necessary for forming a dense print pattern is applied to the metal mesh or applied to the metal mesh. When forming an opening as a printed pattern on a metal mesh by removing the emulsion, etc., the boundary between the emulsion and the opening is formed straight (linearity), and the outline (edge) of the opening is sharp. As a result, a dense printed pattern can be formed. Further, the wettability between the paste-like or liquid transfer product and the wire and the removal property of the transfer product are improved.

  A metal mesh filter according to an eleventh aspect of the present invention is characterized in that a filter for filtration is constituted by the metal mesh according to any one of the sixth to ninth aspects.

  According to the present invention, the metal mesh on which the plasma coating is formed is used as a filter for filtration. For example, even if the mesh of the metal mesh is small enough to prevent the passage of fine foreign matter, the passage of fluid is prevented. And the wettability between the fluid and the wire and the fluid detachability are improved. Further, since the passage of foreign matter is blocked and the passage of only the fluid is allowed, a filtration effect for separating and removing fine foreign matter from the fluid can be stably obtained.

  According to the present invention, the entire surface of the wire constituting the metal mesh is surface-modified by plasma, and a highly wettable plasma coating is formed substantially uniformly on the entire surface of the wire, so that it is applied to the contacted object. The surface tension and contact resistance are reduced, and the wettability between the wire and the contacted object and the detachability of the contacted object are improved. The time required to pass through the mesh of the metal mesh is shortened, and the processing speed such as printing and filtration can be improved. Since the pressure applied when passing through the mesh may be small, it is not necessary to install a large device or equipment for applying a large pressure, and the load on the device and equipment is reduced. The configuration can be simplified. In addition, foreign substances such as organic substances and inorganic substances are separated and removed from the surface of the wire by combining foreign substances adhering to the surface of the wire with the plasma or by colliding the plasma with foreign substances adhering to the surface of the wire. No cleaning work is required, and foreign matters can be reliably cleaned and removed from the surface of the wire.

  The object of the present invention is to improve the wettability and detachability of the metal mesh by plasma-modifying the entire surface of the wire constituting the metal mesh with a plasma so that a highly wettable plasma coating is applied to the wire. This was achieved by forming substantially uniform over the entire surface.

  An embodiment of the present invention will be described in detail with reference to the drawings.

  FIGS. 1-11 has shown the example which used the metal mesh 1 plasma-processed in the environment of atmospheric pressure as a printing screen which prints dense print patterns, such as an electronic circuit.

  As shown in FIG. 1, the metal mesh 1 is woven in a mesh shape by a plain weaving method using a wire rod 2 made of stainless steel for warp and weft. The frame 3 is attached.

  In the embodiment, the metal mesh 1 is attached to the frame 3 and then subjected to plasma treatment by a plasma irradiation device 4 described later. For example, the wire 2 of the metal mesh 1 is subjected to plasma treatment and then plain weave, or the metal mesh 1 is subjected to plasma treatment. Then, it may be attached to the frame 3 or the like. Further, instead of the plain weaving method, the metal mesh 1 may be woven by a weaving method such as twill weave, satin weave, or twist weave. Moreover, you may change the wire diameter and cross-sectional shape of the wire 2 into a desired wire diameter and cross-sectional shape according to the density of a printing pattern.

  When the metal mesh 1 is subjected to plasma treatment by the plasma irradiation apparatus 4, as shown in FIG. 2, the metal mesh 1 and the plasma irradiation unit 4a are moved relative to each other in the direction of the arrow under an atmospheric pressure environment. The plasma P such as oxygen and hydrogen emitted from the plasma irradiation unit 4a is irradiated substantially uniformly on the entire surface of the wire 2 constituting the wire. The environment at the time of plasma generation is an environment included in the range of, for example, vacuum pressure (0 mmHg) to atmospheric pressure (760 mmHg).

  At the time of plasma irradiation, the surface of the wire 2 irradiated with the plasma P is subjected to surface modification so that the wettability becomes high, and the plasma coating Pa having high wettability formed by surface modification with the plasma P is applied to the wire 2. Therefore, the entire surface of the wire 2 is activated and the surface can be modified to a good state suitable for screen printing.

  Further, the foreign matter E such as an organic substance or an inorganic matter adhering to the surface of the wire 2 is bonded to the molecules of the plasma P, or the foreign matter E adhering to the surface of the wire 2 is caused to collide with the plasma P. It can be surely removed by cleaning (see the plan view and the partially enlarged view of FIG. 3).

  In the case of forming a print pattern on the plasma-treated metal mesh 1, in the coating step shown in FIG. 4, a photosensitive emulsion 5 having a viscosity necessary for forming a dense print pattern is applied to the metal mesh 1, A metal mesh for screen printing is formed by forming a plurality of openings 6 (or holes) as a printing pattern on the metal mesh 1 by partially removing the emulsion 5 applied to the metal mesh 1. The screen 1B can be manufactured. Other methods for removing the emulsion 5 coated on the metal mesh 1 include a method of corroding with a solvent or cutting with a cutting tool.

  When the metal mesh 1 is not subjected to plasma treatment, the surface of the wire 2 is smooth, the wettability (affinity) between the wire 2 and the emulsion 5 is poor, and the surface tension applied to the conductive transfer product 7 is large. When the opening 6 which is a printing pattern is formed by applying the emulsion 5 to the metal mesh 1 or removing the emulsion 5 applied to the metal mesh 1, the outline (edge) of the opening 6 is distorted. The printed pattern becomes unclear.

  In addition, when the transferred product 7 is transferred to the transfer base material 8 such as a substrate through the opening 6 having a distorted contour, the transferred product 7 is distorted so that the contour of the transferred product 7 is blurred. It is not suitable for the work to form. In addition, since the space between adjacent transfer products 7 becomes narrower or wider, it is difficult to separate them at intervals that do not have an electrical influence, and the electrical characteristics between the transfer products 7 are deteriorated.

  On the other hand, when the metal mesh 1 is subjected to plasma treatment, the entire surface of the wire 2 and the plasma coating Pa is roughened at the molecular level by collision of the molecules of the plasma P, and the entire surface of the wire 2 and the plasma coating Pa is finely formed at the molecular level. Since many irregularities are formed, the surface tension applied to the emulsion 5 is reduced, and the wettability of the wire 2 and the emulsion 5 is improved. As a result, as shown in FIGS. 5 and 6, when forming the print pattern, the boundary between the emulsion 5 and the opening 6 is formed straight (linearity), and the outline (edge) of the opening 6 is sharp. As a result, the accuracy of the printing pattern is improved. Even if the surface area of the metal mesh 1 per unit area is increased, the boundary between the emulsion 5 and the opening 6 can be formed straight (linearity).

  In addition, when the conductive paste-like transfer material 7 is transferred to the transfer substrate 8 through the printed pattern opening 6 formed on the metal mesh 1, the contour (edge) of the transfer material 7 is changed. Since it becomes sharp, a precise printed pattern can be formed accurately and reliably. In addition, the outline of the printed pattern becomes sharp and the adjacent transfer products 7 are separated by an interval that does not have an electrical influence, so that the electrical characteristics between the transfer products 7 are improved.

  Since the interface between the emulsion 5 and the wire 2 is activated and the wettability is improved, the emulsion 5 can easily penetrate into the portion where the wire 2 of the metal mesh 1 intersects, and no void 5a is generated. The object 7 can be prevented from being transferred to a portion other than the opening 6 and can be printed in a pattern. In addition, the cleaning process required when the screen is manufactured, the cleaning process with a special solvent, and the like are not required, and the cleaning process can be performed only by water cleaning.

  When a desired print pattern is screen-printed on the transfer substrate 8 using the metal mesh screen 1B on which the print pattern is formed, the metal mesh screen 1B is applied to the transfer substrate 8 in the printing step shown in FIG. After being superimposed on the transfer surface, a paste-like transfer product 7 having a viscosity necessary for maintaining the target thickness is formed on the film-like (or resist-like) emulsion 5 formed on the metal mesh screen 1B. Supply. Further, the squeegee 9 having hardness or softness suitable for transfer is moved in the direction of the arrow while being pressed against the film-like emulsion 5.

  The transfer product 7 supplied on the film-like emulsion 5 is pushed into each opening 6 formed in the emulsion 5 by the squeegee 9 and made of a metal mesh near the opening 6 into which the transfer product 7 is pushed. A gap is formed between the opposed surfaces of the metal mesh screen 1B and the transfer substrate 8 by separating the screen 1B from the transfer surface of the transfer substrate 8 or by raising the screen 1B. The transfer product 7 that has passed through the openings 6 is left on the transfer surface of the transfer substrate 8, and the transfer product 7 is transferred to a size and shape substantially the same as the openings 6 to obtain a desired shape. Printing can be performed according to the printing pattern.

  After the metal mesh screen 1B is removed from the transfer surface of the transfer substrate 8, the transferred material 7 transferred to the transfer substrate 8 is heated and cured. By removing the binder component from the transfer 7, sintering the inorganic filler, and forming a print pattern consisting of the transfer 7 on the transfer substrate 8, the screen printing operation using the metal mesh screen 1B is completed. To do.

  Further, the wettability between the wire 2 and the transfer product 7 and the detachability of the transfer product 7 are improved, so that when the transfer product 7 is transferred to the transfer substrate 8, the transfer product 7 with respect to the opening 6 of the print pattern. Exists constantly (stationary). Since the presence of the transfer product 7 pushed into the opening 6 becomes steady, the transfer amount, transfer thickness, and the like of the transfer product 7 can be easily adjusted.

  When the transfer product 7 is pushed into the opening 6 by the squeegee 9, the transfer product 7 is uniformly present in the opening 6. Therefore, the transfer amount of the transfer product 7, the size and shape at the time of transfer are limited. The transfer product 7 can be printed in the same size and shape as the opening 6 in a stable manner. As shown in FIG. 8, if the opening 6 is formed to a desired depth by increasing the thickness of the metal mesh 1, the transferred material 7 can be printed to a desired thickness.

  In addition, since the surface of the wire 2 exposed in the opening 6 itself and the entire surface of the plasma coating Pa formed on the outer surface of the wire 2 have a large number of fine irregularities at the molecular level formed by the plasma treatment, The wettability is good, and the surface tension and contact resistance applied to the transfer product 7 are reduced. Since the time required to pass through the mesh exposed in the opening 6 is shortened, it is possible to improve the printing processing accuracy and increase the printing processing speed. Moreover, it is possible to apply to the process of manufacturing the electronic circuit of a precision instrument.

  Further, since the pressure applied when passing through the mesh exposed in the opening 6 is small and the contact resistance applied to the wire 2 exposed in the opening 6 is small, the linearity and spacing of the wire 2 are reduced. It is suitable for printing a dense print pattern without displacement. In addition, it is not necessary to install a large device or device for applying a large pressure, and the load on the device and the device is reduced. Therefore, the configuration of the entire device can be simplified.

  In addition, when the metal mesh 1 that has been subjected to plasma treatment is left for a long period of time, moved to the next process, or transported to another location, foreign matter E does not reattach to the metal mesh 1 that has been treated. Since the effect of irradiation lasts for a long time, it is not necessary to perform plasma treatment again.

  Further, since the entire metal mesh 1 is plasma-treated under an atmospheric pressure environment, the untreated metal mesh 1 is accommodated in the decompression chamber 10 (see FIG. 12) that is decompressed to a vacuum state, or the decompression chamber 10 Since the labor and work of taking out the treated metal mesh 1 from the inside can be saved and the time required for the plasma treatment can be shortened, a large number of metal meshes 1 can be subjected to plasma treatment continuously, saving labor of the treatment work and Efficiency can be improved. In addition, it is not necessary to install a decompression device or the like for decompressing to a vacuum state, and the entire configuration of the production line can be simplified.

  FIG. 9 is a graph showing the results of a non-metallic foreign matter E removal test by plasma treatment. The removal rate (%) of the foreign matter E when treated for a certain period of time under a certain environmental condition is displayed separately for 50 μm to 300 μm, and the removal rate is approximately 100% below 50 μm. Even if the removal rate varies depending on the component of the foreign matter E, the removal effect can be expected on a regular basis if conditions suitable for the removal can be determined.

  FIG. 10 shows the results of a titration test when a liquid in place of the transfer product 7 is dropped from a predetermined height onto a dropping portion subjected to plasma treatment, and by measuring the angle (θ) from the horizontal of the liquid, This is a quantification of the affinity (wetting properties) and looseness (non-wetting properties) of the liquid and the dropping part. The angle θ of the liquid dropped on the plasma-treated dropping part is smaller than the angle θ of the liquid dropped on the dropping part that has not been plasma-treated.

  When the result of the titration test is graphed as shown in FIG. 11, the angle θ becomes smaller as the processing time by the plasma P becomes longer. Therefore, the liquid corresponding to the transferred material 7 and the dropping portion corresponding to the transfer base material 8. It is clear that the friendliness of has improved.

  FIG. 12 shows another method in which the metal mesh 1 is subjected to plasma treatment in an environment where the pressure is reduced by the sealed plasma irradiation apparatus 10A. The metal mesh 1 is accommodated in the vacuum chamber 10 that can be sealed, and the vacuum chamber 10 It arrange | positions between the lower electrode 10a and the upper electrode 10b which were provided in the inside. The inside of the decompression chamber 10 is decompressed by the decompression device 11 which is an example of the decompression means, and decompressed to a state where no air or foreign matter exists at the molecular level. After the decompression device 11 is stopped, a plasma generating gas such as oxygen or hydrogen supplied from the gas supply unit 12 is released into the decompression chamber 10, and a high-frequency voltage is applied to the upper electrode 10 b by high-voltage power supplied from the power source 13. Is applied to generate plasma P between the lower electrode 10a and the upper electrode 10b.

  In a reduced pressure environment, plasma P molecules are separated from the surface of the wire 2 by contacting or colliding with the surface of the wire 2 of the metal mesh 1 or by binding foreign matter E adhering to the surface of the wire 2 to the plasma P molecules. Remove. Further, the molecular bond on the surface of the wire 2 is modified by the plasma P, and the plasma coating Pa having high wettability (affinity) is formed almost uniformly on the entire surface of the wire 2. Equivalent actions and effects can be achieved. In addition, since the foreign matter E separated from the surface of the wire 2 is sucked and removed together with the air in the decompression chamber 10, the separated foreign matter E can be prevented from reattaching to the surface of the wire 2 of the metal mesh 1. it can.

  FIG. 13 shows an example in which a metal mesh 1 that has been plasma-treated in an environment of atmospheric pressure (see FIG. 2) or reduced pressure (see FIG. 12) is used as a filter for filtration, and is made of a metal mesh 1 that has been plasma-treated. The metal mesh filter 1C is formed in such a size and shape that the mesh of the metal mesh 1B is allowed to pass through a fluid G such as gas or liquid and is prevented from passing through fine foreign matter E. Further, the plasma coating Pa is formed substantially uniformly on the entire surface of the wire 2 constituting the metal mesh 1B, and a large number of fine irregularities are formed on the entire surface of the wire 2 and the plasma coating Pa on the molecular level. Since the surface tension and contact resistance applied to the wire 2 are reduced, the wettability between the wire 2 and the fluid G and the fluid G can be improved, and the operation and effect substantially equivalent to those of the above embodiment can be achieved.

  In addition, by using the plasma-treated metal mesh 1 as a filter for filtration, the fluid G can be easily removed and the mesh of the metal mesh 1 can be made small enough to prevent the passage of fine foreign matter E. The passage of the fluid G is not hindered, and the filtration processing speed and the filtration processing capacity can be increased. Further, since the passage of the foreign matter E is blocked and the passage of only the fluid G is allowed, the fine foreign matter E can be reliably separated and removed from the fluid G.

  In addition, even if the transfer pressure applied when the mesh of the metal mesh 1 is passed is small, the removal performance of the fluid G is not deteriorated, and a large apparatus or device for applying a large transfer pressure is installed. There is no need, and it is not necessary to install a device or equipment for increasing the transfer pressure of the fluid G, and the load on the device and equipment is reduced. Therefore, the configuration of the entire filtration device can be simplified.

In the correspondence between the configuration of the present invention and the above-described embodiment,
The plasma generating means of the present invention corresponds to the plasma irradiation apparatus 4 of the embodiment,
The present invention is not limited to the configuration of the above-described embodiment, but can be applied based on the technical idea shown in the claims, and many embodiments can be obtained.

The front view which shows the sticking state of a metal mesh. The side view which shows the plasma processing in the environment of atmospheric pressure. The front view and partial enlarged view which show the metal mesh after a plasma process, and the expanded sectional view which shows the wire in which the plasma film was formed. The front view which shows the application | coating state of an emulsion, and the formation state of a printing pattern. The front view and partial enlarged view which show the boundary part of an emulsion. The elements on larger scale which show the wettability of a wire and an emulsion. Sectional drawing which shows the printing state by the screen made from a metal mesh. Sectional drawing which shows the printing state of the transcription | transfer material substantially congruent with an opening part. The graph which shows the removal rate of the nonmetallic foreign material by plasma processing. Explanatory drawing which shows the measuring method of the angle in a titration test. The graph which shows the relationship between the angle of FIG. 11, and irradiation time. The side view which shows the plasma processing in the pressure-reduced environment. The side view which shows the filtration state by the filter made from a metal mesh. The front view and partial enlarged view which show the wettability of the wire and emulsion of a prior art example. The front view which shows the state which the foreign material adhered to the screen mesh.

Explanation of symbols

P ... plasma Pa ... plasma coating E ... foreign matter G ... fluid 1 ... metal mesh 2 ... wire 3 ... frame 4 ... plasma irradiation device 5 ... emulsion 6 ... opening 7 ... transfer material 8 ... transfer base material 9 ... squeegee 10A ... Plasma irradiation device 10 ... Decompression chamber 10a ... Lower electrode 10b ... Upper electrode 11 ... Decompression device 12 ... Gas supply unit 13 ... Power supply

Claims (11)

Surface modification of the molecular bond on the surface of the wire constituting the metal mesh to a state where the wettability is increased by the plasma generated by the plasma generating means,
A method for producing a metal mesh, wherein a plasma coating with high wettability formed by surface modification with the plasma is formed substantially uniformly over the entire surface of the wire. The method for producing a metal mesh according to claim 1, wherein a number of fine irregularities are formed on at least one surface of the wire and the plasma coating by colliding with plasma generated by the plasma generating means. The method for producing a metal mesh according to claim 1 or 2, wherein the plasma coating is formed by generating plasma with the plasma generating means in an environment of atmospheric pressure or reduced pressure. The method for producing a metal mesh according to claim 1 or 2, wherein the fine irregularities are formed by colliding with plasma generated by the plasma generating means in an environment of atmospheric pressure or reduced pressure. The method for producing a metal mesh according to claim 1 or 2, wherein the foreign matter is separated and removed from the surface of the wire by causing the plasma generated by the plasma generating means to contact or collide with the entire surface of the wire. A metal mesh, characterized in that a high wettability plasma coating formed by surface modification of molecular bonds on the surface of the wire by plasma is formed substantially uniformly on the entire surface of the wire constituting the metal mesh. The metal mesh according to claim 6, wherein a number of fine irregularities formed by colliding the plasma are formed on at least one surface of the wire and the plasma coating. The metal mesh according to claim 6 or 7, wherein the plasma coating is formed when the plasma is generated in an environment of atmospheric pressure or reduced pressure. The metal mesh according to claim 6 or 7, wherein the fine irregularities are formed when the plasma is collided under an atmospheric pressure or a reduced pressure environment. A metal mesh screen comprising a printing screen made of the metal mesh according to any one of claims 6 to 9. The metal mesh filter which comprised the filter for filtration with the metal mesh as described in any one of the said Claims 6-9.

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