JP2007242297A - Ic card connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a card connector capable of regulating wrong inserting operation of a prescribed IC card into a card storage part without using a shutter member as in the conventional case and without being influenced by the size of the IC card, and capable of avoiding incorrect reverse-insertion of the IC card. <P>SOLUTION: The dimension B from the lower surface of the bottom part of a base member 12 to the opening end of a guide surface 12Sa forming a first step part 12MR is set so as to become larger than the dimension C from the guide surface 12Sa to the inner surface of a cover member 10, and the dimension C is set to a value smaller than the maximum thickness of a SD card SMC. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC card connector capable of selectively mounting one of a plurality of IC cards having different shapes.

  In electronic devices, in general, various types of IC cards such as MMC (multi media card) cards (trademarks), SD (secure digital) cards, and memory sticks (trademarks) are attached to the respective devices via IC card connectors. The function has been expanded.

  In addition, in order to mount and use a plurality of IC cards having different shapes in one electronic device, in an IC card connector, for example, as shown in Patent Document 1, a common IC card can be attached and detached. There has been proposed a composite card accommodating portion having a slot provided on a common plane (see FIG. 45).

  In the IC card connector having such a composite card housing portion, the card housing portions are sequentially formed in a line along the IC card attaching / detaching direction. Each card accommodating portion is individually provided with a contact terminal group corresponding to the contact pad of each IC card. In such a configuration, a contact terminal that is not used by the front end portion of the IC card in the case of an erroneous insertion operation by a user into a card housing portion different from the regular card housing portion of the predetermined IC card or the insertion operation. It is necessary to allow the IC card to be smoothly attached and detached while avoiding group damage.

  As a necessary countermeasure, for example, as disclosed in Patent Document 1, a shutter member that restricts an erroneous insertion operation of a predetermined IC card is provided in the vicinity of a common slot. When each IC card is mounted via a common slot provided on one side of the card housing portion, the shutter member is, for example, a wrong type of IC card to be mounted in the card housing portion closer to the slot. It is assumed that the insertion operation into the card accommodating portion is restricted. The shutter member extends across the card housing portion so as to extend substantially orthogonal to the IC card attaching / detaching direction. Both end portions of the shutter member are rotatably supported. A narrow opening through which a relatively narrow IC card can pass is formed below the shutter member.

  In such a configuration, for example, when the card accommodating portion for the relatively narrow IC card is formed at a position close to the common slot, when the relatively narrow IC card is mounted through the slot, the shutter member The IC card is mounted in the card accommodating portion through the narrow opening below the. In other words, the operation of inserting the card into the card housing for a relatively wide IC card is restricted by the shutter member that is locked.

  On the other hand, when a relatively wide IC card is mounted, immediately after the tip of the IC card passes through the slot, the shutter member is unlocked and rotated so that the shutter member is pushed down. At the same time, the IC card passes over the shutter member and is mounted in a card housing for a relatively wide IC card.

JP 2004-193111 A

  As described above, when a shutter member that restricts the insertion operation of a predetermined IC card is provided, particularly when the total length in the longitudinal direction of both IC cards is relatively short, the eject mechanism for discharging each IC card is provided. When it is required to be provided in the IC card connector, it may be difficult to provide the eject mechanism while ensuring a space in which the shutter member rotates in the card accommodating portion. Further, as the size of the IC card connector and the IC card is further reduced, the space in which the shutter member as described above can be arranged in the IC card connector tends to be reduced.

  Further, in the case where the space for rotating the shutter member is formed in the card housing portion, when the common slot is formed at the opening end of the composite card housing portion, the opening area of the common slot becomes relatively large. . Thereby, for example, the so-called IC card reverse insertion, in which the electrode surface of the IC card is turned upside down in the direction opposite to the normal direction so that the electrode surface of the IC card does not contact the contact terminal group. May be mistakenly performed.

  In view of the above problems, the present invention is an IC card connector capable of selectively mounting a plurality of IC cards having different shapes, and without using a shutter member as in the prior art. An object of the present invention is to provide an IC card connector capable of restricting an insertion operation of a predetermined IC card into an incorrect card housing portion without depending on the size of the card and avoiding erroneous insertion of the IC card into the reverse side. And

  In order to achieve the above object, an IC card connector according to the present invention has a common card slot in which two types of IC cards having different shapes can be selectively attached and detached, and electrode portions of the two types of IC cards. And a plurality of contact terminal groups for electrically connecting the IC cards, and an IC card accommodating portion for accommodating the IC card, the first IC card having a narrow width of the two types of IC cards in the card slot passing therethrough The dimension of the first IC card in the thickness direction of the portion to be passed is that of the portion through which the second wide IC card of the two types of IC cards passes so as to regulate the reverse side of the first IC card. The second IC card is set to be smaller than the dimension in the thickness direction.

As is apparent from the above description, according to the IC card connector according to the present invention, the IC card is guided so that the advancing end of the IC card is directed to the regular contact terminal group in accordance with the attachment / detachment of different types of IC cards. A position control mechanism for controlling the position of the card guiding member
The dimension in the thickness direction of the first IC card at the portion through which the narrow first IC card of the two types of IC cards in the card slot passes restricts the reverse side of the first IC card. A conventional shutter member is used because it is set to be smaller than the dimension in the thickness direction of the second IC card where the wide second IC card of the two types of IC cards passes. Without being influenced by the size of the IC card, it is possible to restrict the insertion operation of the predetermined IC card into the wrong card accommodating portion, and to prevent the wrong insertion of the IC card from the reverse side.

  FIG. 2 shows the appearance of an example of an IC card connector according to the present invention.

  The IC card connector shown in FIG. 2 is arranged on a wiring board (not shown) in an electronic device such as a printer, a mobile phone, a PDA, or a digital camera. Further, as will be described later, there are three types of IC card connectors such as an SD (secure digital) card, an MMC (multi media card) card (trademark), and an xD-Picture Card (trademark) (hereinafter referred to as XD card). One IC card can be selectively installed.

  An IC card connector is, for example, a connection between an electrode portion of each IC card that is detachably accommodated in a direction indicated by an arrow and a substrate for signal input / output disposed inside a predetermined electronic device. The terminal portion is electrically connected.

  A plurality of contact pads are formed on one surface portion corresponding to the arrangement of contact terminals described later at the front end portion of the SD card SMC (see FIG. 6) whose one corner is chamfered. In addition, a notch part mca and a notch part mcb, which will be described later, are formed on both sides thereof so as to face each other. A write protect button WB is movably provided in a notch mcb having a wider notch than the notch of the notch mca. The MMC card not shown has the same overall length and width as the SD card SMC except for its thickness and the number of contact pads. The MMC card is slightly thinner than the SD card SMC and has a smaller number of contact pads.

  The XD card XMC (see FIG. 7) has a plurality of contact pads on one surface corresponding to the arrangement of contact terminals described later, and a notch mcb on one side thereof. The width of the XD card XMC is about 1 mm larger than the width of the SD card SMC. The overall length and thickness of the XD card XMC are considerably shorter and thinner than the overall length and thickness of the SD card SMC.

  As shown in FIG. 1 and FIG. 2, the IC card connector includes a base member 12 on which a plurality of contact terminals and the like for electrical connection to the SD card SMC, MMC card, and XD card XMC to be accommodated are arranged. A cover member 10 that forms a card accommodating portion in cooperation with the base member 12 is configured.

  The cover member 10 having a gate-shaped cross-sectional shape is formed of a thin metal material. On one side surface of the cover member 10, a plurality of engaging holes are formed corresponding to the claw portions of the claw portions of the base member 12 to be described later. A plurality of engagement holes are formed on the other side surface of the cover member 10 so as to be opposed to each of the claw portions of the base member 12.

  Therefore, the cover member 10 is fixed to the base member 12 by engaging the respective engagement holes with the respective claw portions of the base member 12.

  As shown in FIG. 2, a pressing spring 10CL for movably supporting a cam lever in an ejection mechanism to be described later is provided in the vicinity of one side surface of the upper surface connecting both side surface portions of the cover member 10. The base end portion of the holding spring 10CL having elasticity is formed integrally with the cover member 10. Since the pressing spring 10CL is formed by punching by pressing, an opening is formed in the surrounding portion.

  The card accommodating portion in the base member 12 is integrally formed of, for example, a molded resin material. As shown in FIG. 4, the upper and lower portions and the contact terminal fixing portion side to be described later are on the opposite side. The end is open. Accordingly, when the entire base member 12 is covered by the cover member 10 described above, one common card in which the SD card SMC, the MMC card, and the XD card XMC are selectively inserted into one end of the card housing portion. A slot 40 (see FIG. 1) is formed. The card accommodating portion is a composite card accommodating portion including a first portion for accommodating the XD card XMC formed on the side close to the card slot 40 and a second portion for accommodating the SD card SMC or the MMC card. It is said. The second part is formed so as to overlap with the upper part of the first part.

  As shown in FIG. 1, the card slot 40 is formed immediately below the pair of side wall end portions 12TR for guiding both sides of the SD card SMC or MMC card, and the bottom end portion of the SD card SMC. A pair of first step portions 12MR that guide both ends of the end portion or the XD card XMC, and a pair of second step portions 12NR that are formed below the first step portion 12MR and project toward the inside. Then, the second step portion 12NR is formed to be surrounded by the pair of side wall lower end portions 12LR formed directly from the lower end of the second step portion 12NR, the cover member 10, and the bottom portion of the base member 12. Further, a groove portion 12UR is formed between the side wall end portion 12TR and the first stepped portion 12MR.

As shown in FIG. 3, the lower wall surface 12Sc that forms the groove 12UR and the guide surface 12Sa that forms the first stepped portion 12MR are formed from the card slot 40 to the bottom wall of the first portion of the card accommodating portion. Are inclined parallel to each other with a predetermined gradient. The total dimension A from the inner surface of the cover member 10 to the lower surface of the bottom portion of the base member 12 is the opening of the guide surface 12Sa that forms the first step portion 12MR from the lower surface of the bottom portion of the base member 12, as shown in FIG. The sum of the dimension B to the end and the dimension C from the guide surface 12Sa to the inner surface of the cover member 10 is used. The dimension B from the lower surface of the bottom of the base member 12 to the opening end of the guide surface 12Sa forming the first stepped portion 12MR is larger than the dimension C from the end of the guide surface 12Sa to the inner surface of the cover member 10. It is set to be large. The dimension C is a value smaller than the maximum thickness of the SD card SMC.

  Further, as shown in FIG. 3, the lower wall surface 12Sb forming the second step portion 12NR extends parallel to the lower wall surface 12Sc with a predetermined gradient toward the bottom wall of the first portion of the card accommodating portion. Exist. The end of the lower wall surface 12Sb that forms the second stepped portion 12NR is separated so as to be farther from the card slot 40 than the position of the end of the lower wall surface 12Sc.

  As shown in FIG. 4 and FIG. 5, the second portion of the card accommodating portion includes side walls 12WR and 12WL that form both sides thereof, contact terminals 18ai (i = 1 to 9), and ground contact 18G. Etc. are formed by the contact terminal fixing wall portion 12WB.

  As shown in FIG. 4, claw portions 12Ra, 12Rb, 12Rc, 12Rd, 12Re, 12Rf, 12Rg, and 12Rh are formed on the outer surfaces of the side wall 12WR and the side wall 12WL, respectively. An opening is formed substantially in the center at the bottom that continues to the side walls 12WR and 12WL.

  The contact terminal fixing wall portion 12WB of the base member 12 is provided with a plurality of contact terminals 18ai (i = 1 to 9). For example, the nine contact terminals 18ai are arranged substantially parallel to the side walls 12WR and 12WL at a predetermined mutual interval.

  The contact terminal 18ai is elastically connected to the contact portion (electrode portion) of the SD card SMC or MMC card and is electrically connected to the contact portion 18a, and is electrically fixed by soldering to the electrode portion of the wiring board. A soldered terminal portion, a contact portion thereof and the soldered terminal portion are connected to each other, and a fixed portion fixed to the base member 12 is included.

  The fixing portion of the contact terminal 18ai made of a thin metal plate material, for example, phosphor bronze for a spring, is inserted into a groove formed in the bottom portion connected to the contact terminal fixing wall portion 12WB through a through hole formed in the contact terminal fixing wall portion 12WB. The SD card SMC is fixed to the base member 12 by being press-fitted from the side opposite to the insertion direction.

  As shown in FIG. 5, a guide wall 12BW for guiding the SD card SMC is formed around each groove into which the fixed portion of the contact terminal 18ai is press-fitted. Guide wall 12BW is engaged with a plurality of grooves formed in SD card SMC. A gap is formed between the adjacent guide walls 12BW. In the gap, each partition of the SD card SMC to be inserted and a comb-like piece 36ai (see FIG. 4) of an eject member described later are movably engaged.

  A detection contact unit 30 for detecting the above-mentioned write protect button is provided between the leftmost guide wall 12BW and the side wall 12WL. Further, a ground contact 18G is provided adjacent to the contact terminal 18ai at one end.

  The first portion of the card accommodating portion is formed by side walls 12WR and 12WL that form both sides thereof, and a bottom portion that connects the side walls 12WR and 12WL. A plurality of contact terminals 16ai (i = 1 to 20) are provided between the sidewall lower end portion 12LR of the sidewall 12WR and the sidewall lower end portion 12LR of the sidewall 12WL. The contact terminals 16ai are arranged substantially parallel to the side walls 12WR and 12WL at a predetermined mutual interval. The contact terminal 16ai is arranged at a predetermined distance from the contact terminal 18ai and the guide wall 12BW.

  The contact terminal 16ai is elastic and has a contact part that contacts and is electrically connected to a contact pad (electrode part) of the XD card XMC, and soldering that is soldered and fixed to the electrode part of the wiring board. The terminal portion is configured to include a fixing portion that connects the contact portion and the soldered terminal portion to each other and is fixed to the base member 12.

  A fixing portion of the contact terminal 16ai made of a thin plate metal material, for example, phosphor bronze for a spring, is press-fitted into a groove formed in the bottom portion of the base member 12 from the insertion direction side of the XD card XMC. It is fixed to. The soldered terminal portion of the contact terminal 16 ai protrudes from the end of the bottom portion toward the card slot 40.

  The SD card SMC, MMC card, or XD card XMC is held in the first part or the second part of the card accommodation part and selectively directed outward from the card accommodation part on the inner side of the side wall 12WR. An ejection mechanism for discharging is provided.

  As shown in FIG. 4 and FIG. 5, the eject mechanism is supported so as to be movable relative to the base member 12 in accordance with the operation of attaching / detaching the SD card SMC, and selectively selects the SD card SMC or MMC card. Between the inner peripheral portion of the base member 12 and the end portions of the ejector member 20. The ejector member 20 held by the ejector member 20, the ejector member 36 that is formed integrally with the ejector member 20 and selectively holds the XD card XMC, The coil spring 28 for urging the ejector member 20 in the discharge direction of the SD card SMC and the like, and the inner peripheral portion of the base member 12 and the end portion of the ejector member 36 are interposed between the ejector member 36 and the XD card XMC. Installation / removal operation of the coil spring 32 biased in the discharging direction and the SD card SMC, MMC card, or XD card XMC It is configured to include a selectively each IC card common ejector member controller 24 for holding or releasing control to the base member 12 the ejector member 20 and 36, the depending on.

  One end of the coil spring 28 is supported by the inner peripheral portion of the base member 12, and the other end of the coil spring 28 is connected to the ejector member 20.

  The ejector member 20 is formed of, for example, a resin material, and is supported on the base member 12 by the inner peripheral portion of the base member 12 so as to be slidable along the attaching / detaching direction of the SD card SMC or the like.

  In addition, the ejector member 20 has an engaged portion that is engaged with a tip portion of the inserted SD card SMC or the like. The engaged portion includes a card receiving portion 20R that supports one corner and a side surface portion at the front end portion of the SD card SMC, etc., a slope portion 20I that is connected to the card receiving portion 20R and supports the slope portion, and an SD card SMC. The arm portion 20L is connected to the inclined surface portion 20I so as to be substantially orthogonal to the attaching / detaching direction of the SD card SMC and holds the front end surface of the SD card SMC or the like.

  A leaf spring 52 having a curved portion that engages with the cutout portion mca of the inserted SD card SMC is provided in an extending portion that is continuous with the card receiving portion 20R and extends toward the card slot 40 side. A support surface for guiding and supporting the side surface of the SD card SMC or the like in cooperation with the extended portion is formed on the inner side portion of the side wall 12WL so as to face the extended portion.

  The arm portion 20L is formed with a plurality of grooves that are engaged with the guide walls 12BW described above when the ejector member 20 is moved. Comb-like portions 36ai of the ejector member 36 are integrally connected to the partition walls between the grooves.

  The ejector member 36 is formed with a predetermined distance from the ejector member 20 toward the card slot 40 side. The ejector member 36 is formed in a substantially groove shape so as to surround and hold the front end portion of the XD card XMC.

  On the side of the ejector member 36 facing the arm portion 20L of the ejector member 20, a plurality of comb-like portions 36ai (i = 1 to 5) extend corresponding to the partition walls of the arm portion 20L described above. . In addition, a holding portion 36R that holds the tip of the inserted XD card XMC is formed on the side facing the contact terminal 16ai in the portion having the comb-like portion 36ai.

  Thereby, when the SD card SMC or the like is inserted into the second portion of the card accommodating portion, the tip of the SD card SMC or the like is pushed while contacting the inclined surface portion 20I and the arm portion 20L, and the ejector member 20 is moved a predetermined distance, Moved. At that time, the curved portion of the leaf spring 52 is engaged with the notch mca of the SD card SMC. On the other hand, when the SD card SMC or the like is ejected from the second portion of the card accommodating portion, the ejector member 20 is moved toward the card slot 40 and the SD card SMC or the like is forcibly pulled out from the eject member 20. Thus, the SD card SMC or the like is taken out.

  Further, when the XD card XMC is inserted into the first portion of the card accommodating portion, the tip of the XD card XMC is pushed while contacting the holding portion 36R of the ejector member 36, and the ejector member 36 is moved by a predetermined distance. . On the other hand, when the XD card XMC is ejected from the first portion of the card accommodating portion, the ejector member 36 is moved toward the card slot 40, and the XD card XMC is forcibly pulled out from the eject member 36. The XD card XMC is taken out.

  As shown in FIG. 4, the eject member control unit 24 includes a substantially heart-shaped cam element (heart cam) 24C integrally formed on the side wall 12WR side of the ejector member 20, and a plurality of cam members formed around the heart cam 24C. A lever guide groove 24G composed of a stepped portion, and a cam member 26 having a substantially portal shape whose one end is coupled to the hole of the contact terminal fixing wall 12WB and the other end is slid along the lever guide groove 24G. And the pressing spring 10CL (see FIG. 2) of the cover member 10 described above.

  The presser spring 10CL biases the cam lever 26 so that the bent end of the cam lever 26 is in sliding contact with the guide surface of the lever guide groove 24G.

  The heart cam 24 </ b> C formed of resin has a substantially V-shaped cam surface with which one end of the cam lever 26 is selectively engaged.

  The lever guide groove 24G, for example, branches from one side of the heart cam 24C linearly along the side wall 12WR and the other side of the heart cam 24C from the middle of the first guide groove. After extending obliquely toward the side wall 12WR, the second guide groove extending parallel to the first guide groove, one end of the first guide groove facing the cam surface, and the second guide groove A third guide groove is formed between the one end and the portion facing the cam surface.

  Thus, one end of the cam lever 26 is guided through the first guide groove, the third guide groove, and the second guide groove sequentially following the operation of the eject member 20 or 36. Become.

  Further, as shown in FIG. 5, an SD card SMC or the like inserted through the card slot 40 is placed in the vicinity of the pair of side wall end portions 12TR forming a part of the card slot 40. Guide blocks 44 and 48 as guide members for guiding to the first or second portion are provided. Further, adjacent to the guide blocks 44 and 48, the lock springs 46 and 50 for bringing the postures of the guide blocks 44 and 48 into the locked state or the unlocked state at predetermined positions, respectively, and the postures of the guide blocks 44 and 48 at the initial positions. A guide return spring 54 (see FIG. 1) for biasing the guide blocks 44 and 48 is provided so as to return them.

  The guide block 44 provided on the side wall 12WR side includes a guide surface that guides a surface on which an electrode portion is formed in the SD card SMC or XD card XMC that is slidably contacted, and a guide return spring 54 at one end connected to the guide surface. And a hole into which a support shaft (not shown) fixed to the side wall 12WR of the base member 12 is inserted.

  The guide block 44 is provided between the rib 42 formed integrally with the side wall 12WR and the side wall end portion 12TR and surrounded by the flat portion 12T connected to the inner peripheral portion thereof. The guide block 44 is rotatably provided by a predetermined angle by its support shaft.

  The aforementioned guide surface is formed so as to be substantially orthogonal to both side surfaces facing the side wall 12WR and to face the cover member 10. A protrusion for guiding the side surface of the slidable XD card XMC is formed on the guide surface. A protrusion 44 </ b> S that is selectively engaged with the engaging portion 46 </ b> S at one end of the lock spring 46 is formed on one end of the guide block 44 that faces the depression on one side surface.

  The guide block 48 provided on the side wall 12WL side includes a guide surface that guides the surface on which the electrode portion of the SD card SMC or XD card XMC that is slidably contacted, and a guide return spring 54 at one end connected to the guide surface. And a hole into which a support shaft (not shown) fixed to the side wall 12WL of the base member 12 is inserted.

  The guide block 48 is provided between the rib 42 formed integrally with the side wall 12WL and the side wall end portion 12TR and surrounded by the flat portion 12T connected to the inner peripheral portion. The guide block 48 is provided so as to be rotatable by a predetermined angle by a support shaft.

  The above-described guide surface is formed so as to be substantially orthogonal to both side surfaces facing the side wall 12WL and to face the cover member 10. A protrusion for guiding the side surface of the slidable XD card XMC is formed on the guide surface. The protrusion is provided at a position facing the protrusion of the guide block 44. A protrusion 48 </ b> S that is selectively engaged with an engaging portion (not shown) at one end of the lock spring 50 is formed on one end side of the guide block 48 that faces the depression on one side surface.

  Since the lock springs 46 and 50 have the same structure, the lock spring 46 will be described, and the description of the lock spring 50 will be omitted.

  The lock spring 46 includes, for example, a fixing portion that is press-fitted in a recess formed inside the side wall 12WR, and an engaging portion 46S that selectively engages with the protrusion 44S of the guide block 44, and is connected to the fixing portion and is elastic. It consists of a movable part that can be displaced. FIG. 5 shows a locked state of the lock spring 46.

  The movable portion is formed with a curved portion 46B that is continuous with the engaging portion 46S and curved in a direction away from the inside of the side wall 12WR. The distance between the curved portions 46B and 50B of the lock springs 46 and 50 is set to a value that is slightly larger than the width of the SD card SMC or a value that is substantially the same as the width thereof.

  Each guide return spring 54 is disposed in a recess 12k formed immediately below the groove 12UR of the side wall 12WR and 12WL of the base member 12. One end of a guide return spring 54, which is a leaf spring, is fixed in the recess 12k, and the other end of the guide return spring 54 is locked in a recess of the guide block 44. Thereby, the guide return spring 54 is urged so as to return the position of the recess of the guide block 44 to the initial position. Therefore, the position control mechanism for the guide blocks 44 and 48 is formed by the guide return spring 54 and the lock springs 46 and 50.

  Further, since the guide return spring 54 is disposed in the recess 12k, the IC card connector can be reduced in size and thickness without narrowing the card accommodating portion.

When the curved portion 46B of the lock spring 46 is pressed in the direction approaching the side wall 12WR by the side surface portion of the inserted XD card XMC, the engaging portion 46S is separated from the protrusion 44S of the guide block 44. . Therefore, the guide block 44 in the unlocked state is tilted so that the guide surface and the right-angled surface formed on the rib 42 coincide. As a result, both side portions of the XD card XMC can slide on the right-angle surfaces of the ribs 42. On the other hand, when the curved portion 46B of the lock spring 46 is not pressed, the engaging portion 46S is the protrusion 44S of the guide block 44. Will be held. Therefore, the guide block 44 in the locked state is separated from a plane parallel to the contact terminal 16ai so as to face the contact terminal 18ai so that its guide surface intersects with a right angle surface of the rib 42 at a predetermined angle. The operation in the guide block 48 is the same as the operation in the guide block 44.

  In such a configuration, when the SD card SMC or MMC card is mounted, as shown in FIG. 6, first, the leading end of the SD card SMC passes through the card slot 40 through the first portion in the card accommodating portion. Inserted into the second part. At that time, both side portions of the SD card SMC pass between the lock spring 46 and the lock spring 50 without pushing the curved portions 46B and 50B of the lock springs 46 and 50 apart. Further, both side surface portions of the SD card SMC are guided by the pair of side wall end portions 12TR, respectively, and are guided by the guide surfaces of the guide blocks 44 and 48 in a locked state inclined upward by a predetermined angle with respect to the traveling direction. The Therefore, it is forcibly avoided that the SD card SMC or the like is erroneously attached to the first portion of the card accommodating portion without using a shutter member as in the prior art. At this time, since the SD card SMC is prevented from being erroneously inserted into the first portion, there is no possibility of damaging the contact terminal 16ai.

  Next, after the inserted SD card SMC is pressed against the urging force of the coil springs 28 and 32 together with the eject member 20 while the tip portion of the SD card SMC is held by the arm portion 20L of the eject member 20, When the pressing force is released, one end of the cam lever 26 is detached from the first guide groove and engaged with the cam surface of the third guide groove.

  At that time, the eject member control unit 24 puts the ejector member 20 into a holding state. As a result, the SD card SMC is held in the second portion of the card accommodating portion, and the contact pad of the SD card SMC and the contact terminal 18ai are brought into contact with each other and electrically connected.

  On the other hand, when the SD card SMC is removed, first, the inserted SD card SMC is slightly pushed further. At this time, when the eject member 20 is advanced, one end portion of the cam lever 26 is released from the cam surface and is released and moved to the second guide groove, so that it is retracted by the urging force of the coil springs 28 and 32. I'm damned. Then, the end portion of the SD card SMC exposed to the outside is further pulled in the card ejection direction, whereby the SD card SMC is taken out.

  Further, when the XD card XMC is mounted, as shown in FIG. 7, first, the leading end portion of the XD card XMC is inserted through the card slot 40 toward the first portion in the card housing portion. At that time, as shown in FIG. 9, both side portions of the XD card XMC are inserted obliquely by being guided by the lower wall surface 12Sb forming the second step portion 12NR, and the curved portions of the lock springs 46 and 50 are inserted. 46B and 50B are spread and passed between the lock spring 46 and the lock spring 50. Thereby, as shown in FIG. 3, the guide blocks 44 and 48 in the locked state that are inclined upward by a predetermined angle with respect to the traveling direction are in the unlocked state.

  Next, when the XD card XMC is further inserted, the guide blocks 44 and 48 are pressed by the tips of the XD card XMC so that the guide surfaces of the guide blocks 44 and 48 are substantially parallel to the flat portion 12T. Therefore, the guide return spring 54 is tilted against the urging force.

  Therefore, it is forcibly avoided that the XD card XMC is erroneously attached to the second portion of the card accommodating portion without using a conventional shutter member.

  Next, the inserted XD card XMC is pressed against the urging force of the coil springs 28 and 32 together with the eject member 36 in a state where the tip portion of the XD card XMC is held by the holding portion 36R of the eject member 36. When the pressing force is released, one end of the cam lever 26 is detached from the first guide groove and engaged with the cam surface of the third guide groove.

At that time, the eject member control unit 24 puts the ejector member 36 into a holding state. As a result, the XD card XMC is held in the first portion of the card accommodating portion, and the contact pad of the XD card XMC and the contact terminal 16ai are brought into contact with each other and electrically connected.
On the other hand, when the XD card SMC is removed, first, the inserted XD card SMC is further pushed in slightly. At this time, when the eject member 36 is advanced, one end of the cam lever 26 is released from the cam surface and is released and moved to the second guide groove, so that it is retracted by the urging force of the coil springs 28 and 32. To be sedated. Then, the end portion of the XD card XMC exposed to the outside is further pulled out in the card ejection direction, whereby the XD card XMC is taken out.

  As shown in FIG. 8, if the SD card SMC is inserted by mistake, that is, one surface portion on which the plurality of contact pads of the SD card SMC are formed faces the inner surface of the cover member 10. In the state, when the leading end of the SD card SMC is inserted into the second part through the first part in the card accommodating part through the card slot 40, as described above, the dimension C is the maximum of the SD card SMC. Since it is set to a value smaller than the thickness and smaller than the dimension B, the leading end of the SD card SMC contacts the end of the cover member 10, and therefore wrong insertion of the SD card SMC in the wrong direction is prevented. It will be regulated.

  The card slot 40 in the above-described example is formed directly below the side wall end portion 12TR, and includes a pair of first step portions 12MR that guides the end portion of the bottom surface portion of the SD card SMC or both side portions of the XD card XMC, The second step portion 12NR is formed to include a pair of second step portions 12NR that are formed below the step portion 12MR and project toward the inside. However, the present invention is not limited to such an example. For example, FIG. As shown, the card slot 61 includes a pair of side wall end portions 62TR for guiding both sides of the SD card SMC or MMC card, and an end portion of the bottom surface portion of the SD card SMC formed directly under the side wall end portion 62TR. A pair of stepped portions 62NR for guiding both side portions of the XD card XMC, a pair of side wall lower end portions 62LR formed from the lower end of the stepped portion 62NR directly below, the cover member 10, Or it may be formed by being surrounded by the bottom of the over scan member 12. Further, a groove portion 62UR may be formed between the side wall end portion 62TR and the stepped portion 62NR. As in the example shown in FIG. 1, the lower wall surface 62Sc that forms the groove 62UR and the guide surface 62Sb that forms the stepped portion 62NR are formed from the card slot 61 to the bottom of the first portion of the card accommodating portion. They are inclined parallel to each other with a predetermined gradient toward the wall. The dimension B from the lower surface of the bottom of the base member 62 to the opening end of the lower wall surface 62Sc that forms the groove 62UR is set to be larger than the dimension C from the lower wall surface 62Sc to the inner surface of the cover member 10. Yes. The dimension C is set to a value smaller than the maximum thickness of the SD card SMC.

  In the above-described example, an example of the present invention is applied to an IC card connector mounted in a combination of an SD card or the like and an XD card XMC. However, the present invention is not limited to such an example. Applied to other types of IC card combinations, for example, an IC card connector that is mounted in a combination of an SD card and a Memory Stick (trademark), or a combination of an XD card XMC and a Memory Stick Duo (trademark). Of course, it is also good.

  FIG. 11 shows another example of the IC card connector according to the present invention.

  The IC card connector shown in FIG. 11 is arranged on a wiring board (not shown) in an electronic device such as a printer, a mobile phone, a PDA, or a digital camera. As will be described later, the IC card connector includes an xD-Picture Card (trademark) (hereinafter referred to as an XD card) as a first IC card, an SD card and an MMC card (trademark) as a second IC card. Four types of IC cards such as a Memory Stick (registered trademark) as a third IC card can be selectively mounted one by one.

  The width of the memory stick MS (see FIG. 17) is narrower than the width of the SD card SMC described above, and the length of the memory stick MS in the vertical direction is larger than that of the SD card SMC. The

  The IC card connector cooperates with the base member 70 in which a plurality of contact terminals and the like for electrical connection to the memory stick MS, SD card SMC, MMC card, and XD card XMC to be accommodated are arranged. And a cover member 72 that forms a card accommodating portion.

  As shown in FIG. 12, the cover member 72 having a gate-like cross-sectional shape is formed of a thin metal material, and a plurality of engagement holes on the side surface and each claw portion on the side wall of the base member 70 are formed. By being engaged with each other, the base member 70 is fixed.

  The card accommodating portion in the base member 70 is integrally formed of, for example, a molded resin material. As shown in FIG. 11, the upper and lower portions and the contact terminal fixing portion side to be described later are on the opposite side. The end is open. Accordingly, when the entire base member 10 is covered with the cover member 72 described above, the memory stick MS, the SD card SMC, the MMC card, and the XD card XMC are selectively inserted into one end of the card accommodating portion 71. One common card slot 71CS (see FIG. 12) is formed as a card insertion slot.

  As shown in FIG. 12, the card slot 71CS includes a pair of side wall ends 72TR for guiding both sides of the memory stick MS, and a pair of side wall ends 70UR for guiding both sides of the SD card SMC or MMC card. A pair of groove portions 70MR which are formed directly below the side wall end portion 70UR and guide the end portion of the bottom surface portion of the SD card SMC or both side portions of the XD card XMC; The pair of projecting step portions 70NR, the cover member 72, and the bottom portion of the base member 70 are surrounded.

  The lower wall surface 70Sc forming the groove portion 70MR and the guide surface 70Sb forming the step portion 70NR are directed from the card slot 71CS toward the bottom wall of the first portion of the card accommodating portion 71 as shown in FIG. Are inclined in parallel with each other at a predetermined gradient.

  The card accommodating portion 71 is formed on the side closest to the card slot 71CS and accommodates the XD card XMC, and is partially overlapped with the first portion to accommodate the SD card SMC or MMC card. A composite card accommodating portion including a second portion and a third portion that extends and overlaps the first portion and the second portion and accommodates the memory stick MS is formed.

  In other words, the first to third portions are partially overlapped in a line along the direction in which each card is attached / detached.

  The first and second portions of the card accommodating portion 71 are formed by a cover member 72, side walls 70WR and 70WL that form both sides thereof, and a bottom wall that connects the side walls 70WR and 70WL. The third portion is formed by the cover member 72, the side walls 70WR and 70WL, the bottom wall, and the contact terminal fixing wall portion 70WB described later.

  The contact terminal fixing wall portion 70WB that forms the third portion of the base member 70 is provided with a plurality of contact terminals 78ai (i = 1 to 10). The contact terminals 78ai are arranged substantially parallel to the side walls 70WR and 70WL at a predetermined mutual interval.

  The contact terminals 78ai as the third contact terminal group are made of a thin metal material, for example, phosphor bronze for springs, have elasticity, and are in contact with and electrically connected to the contact pads (electrode portions) of the memory stick MS. A contact portion, a soldered terminal portion that is soldered and electrically connected to the electrode portion of the wiring board, and a fixed portion that connects the contact portion and the soldered terminal portion to each other and is fixed to the base member 70 It is comprised including.

  As shown in FIG. 14, when the wrong memory stick MS is inserted in the reverse direction at the position adjacent to the contact terminal 78ai, the tip of the memory stick MS is abutted to restrict the reverse insertion. A protruding piece 70P is provided.

  A plurality of contact terminals 76ai (i = 1 to 20) are provided in the first portion of the card accommodating portion. The contact terminals 76ai are arranged substantially parallel to the side walls 70WR and 70WL at a predetermined mutual interval. Further, the contact terminal 76ai is arranged at a predetermined distance from the contact terminal 78ai.

  The contact terminals 76ai as the first contact terminal group are made of a thin metal material, for example, phosphor bronze for springs, have elasticity, and are in contact with and electrically connected to contact pads (electrode portions) of the XD card XMC. A contact portion, a soldered terminal portion that is soldered and electrically connected to the electrode portion of the wiring board, and a fixed portion that connects the contact portion and the soldered terminal portion to each other and is fixed to the base member 10 It is comprised including.

  The height from the bottom of the contact portion of the contact terminal 76ai is the same height as the guide surface 70Sb on the side walls 70WR and 70WL or a position slightly lower than that. Thereby, when the memory stick MS, the SD card SMC, or the MMC card accommodated in the second and third portions is mounted, the contact portion of the contact terminal 76ai is guided by the guide surface 70Sb. There is no risk of collision with the tip of the card SMC or MMC card.

  A plurality of contact terminals 74ai (i = 1 to 9) are provided substantially parallel to each other in the width direction in the second portion of the composite card accommodating portion. The contact terminal 74ai is disposed at an intermediate position between the contact terminal 78ai and the contact terminal 76ai. An opening through which the contact portion passes is formed at the bottom of the base member 70 at a position below the contact portion of the contact terminal 74ai.

  The contact terminal 74ai as the second contact terminal group has an elastically displaceable contact portion that is in contact with and electrically connected to a contact pad (electrode portion) of the SD card SMC or MMC card, and an electrode portion of the wiring board. A soldered terminal portion that is fixed by soldering and electrically connected, and a contact portion and a soldered terminal portion that are connected to each other and fixed to the base member 70 are included. The fixed portion of the contact terminal 74ai made of a thin metal material, for example, phosphor bronze for a spring, is fixed to the base member 70 by being press-fitted into the groove formed in the bottom portion from the insertion direction side of the SD card SMC or the like. ing. The soldered terminal portion protrudes to the outside from the contact terminal fixing wall portion 70WB so as to be aligned with the soldered terminal portion of the contact terminal 78ai. When the memory stick MS and the SD card SMC are not inserted, the tip of the contact portion protrudes into a passage through which the memory stick MS and the SD card SMC pass as shown in FIG.

  In addition, a peripheral portion of a slit 80ai (i = 1 to 9) of a contact pressing plate 80 described later is engaged with an intermediate portion of the contact portion of each contact terminal 74ai.

  When the memory stick MS is inserted, the contact press plate 80 protects the contact 74ai so that the tip of the memory stick MS abuts against the contact terminal 74ai and the contact terminal 74ai is not deformed or buckled. It is a member for doing.

  The contact pressing plate 80 has a substantially rectangular shape, and includes a front-side base end portion 80F, a rear-side end portion 80R, and slits 80ai corresponding to the plurality of contacts 74ai. The contact presser plate 80 moves in the front-rear direction on the bottom wall 70B of the base member 70 via a support shaft extending in a direction orthogonal to the attaching / detaching direction indicated by the arrow at the front end of the front base end portion 80F. It is supported so as to be rotatable on the bottom wall 70B.

  The contact presser plate 80 further includes a spring member support arm 81 positioned below the eject member 82 (see FIG. 15) on the eject member 82 side (see FIG. 11) constituting an eject mechanism described later. The spring member support arm 81 extends in parallel with the contact pressing plate 80 and is formed so as to be integrated in the middle of the rear end portion 80R. A support protrusion 81S around which one end of the second spring member 87 is wound is formed at the rear end of the spring member support arm 81 (see FIG. 15).

  A locking protrusion 80P that protrudes toward the side wall 70WR is formed at the left end portion of the contact pressing plate 80 and closer to the front side. The locking protrusion 80P can be selectively engaged with or disengaged from an engagement hole 94 formed corresponding to a free end of a lock / unlock fitting 90 described later.

  The second spring member 87 biases the contact pressing plate 80 toward the card slot. The other end of the second spring member 87 is wound around a support protrusion 70 </ b> S protruding from the fixed wall 70 </ b> WB of the base member 70.

  The second spring member 87 is preferably a compression coil spring, and extends to the support protrusion 70S described above via a recess 82R formed on the lower surface of an eject member 82 described later.

  When the contact presser plate 80 is moved rearward and rotated counterclockwise in FIG. 14, the locking claw that can be locked to the stepped portion provided on the bottom wall 70 </ b> B is the lower surface of the rear end of the spring member support arm 81. Alternatively, it may be formed. With this configuration, when the corresponding SD card SMC is mounted and the contact pad is in contact with the contact portion of the contact 74ai, the return or displacement of the contact pressing plate 80 by the second spring member 87 is ensured. Can be prevented.

  When no IC card is inserted, the contact presser plate 80 is moved forward of the contact presser plate 80 by the biasing force of the second spring member 87 via the spring member support arm 81 as shown in FIG. The base end portion 80F is pressed against the first step portion 70E formed on the bottom wall 70B formed at a predetermined position (initial position of the contact pressing plate 80).

  At that time, the contact pressing plate 80 is disposed to be inclined from the front base end portion 80F to the rear end portion 80R (initial posture of the contact pressing plate 80). Accordingly, the rear end portion 80R is located in the card accommodation space.

  When the contact pressing plate 80 is in this state, the contact portion of the contact 74ai is accommodated in the slit 80ai of the contact pressing plate 80.

  In addition, a part of the bottom wall 70B of the base member 70 located immediately below the recess 82R of the eject member 82 in which the second spring member 87 is extendably disposed is fixed as shown in FIG. It is preferable that a portion closer to the wall 70WB is formed higher than the other portion to the vicinity of the second spring member 87. Furthermore, it is preferable that the bottom wall 70B is provided with an inclined surface 70Ba that is inclined downward toward the front. It is more preferable that the inclined surface 70Ba is an inclined surface partially having a downwardly convex circular arc surface so as to guide the circular outer peripheral portion of the second spring member 87.

  By providing such an inclined surface 70Ba, when the corresponding SD card SMC is inserted, it is contracted when the contact pressing plate 80 is moved backward against the biasing force of the second spring member 87. Since the second spring member 87 is guided by the inclined surface 70Ba, the contact pressing plate 80 can be rotated counterclockwise in FIG. 16 and easily pushed down in the substantially horizontal direction.

  On the other hand, when the SD card SMC is removed from the IC card connector, the contact pressing plate 80 is rotated clockwise in FIG. 16 by the biasing force of the second spring member 87.

  As a result, the second spring member 87 returns the contact pressing plate 80 to the initial inclined state by its urging force (returning force), and the front side base end portion 80F of the contact pressing plate 80 has a bottom wall. The contact pressing plate 80 is returned to the initial position so as to contact the stepped portion 70E of 70B.

  The XD card XMC, SD card SMC, MMC card, or memory stick MS is held in the first part, the second part, and the third part of the card housing portion and is selected on the inner part of the side wall 70WR. In particular, an eject mechanism is provided for discharging the card from the card accommodating portion toward the outside.

  As shown in FIG. 11, the eject mechanism is supported so as to be movable relative to the base member 70 in accordance with the attachment / detachment operation of each IC card, and selectively selects one of the IC cards. An eject member 82 held between the inner peripheral portion of the base member 70 and an end portion of the eject member 82. The coil spring 88 biases the eject member 82 in the discharge direction of the SD card SMC or the like, and SD. And an eject member control unit common to each IC card for performing control to selectively hold or release the eject member 82 with respect to the base member 70 in accordance with an attaching / detaching operation of the card SMC or the like.

  The eject member 82 is formed of, for example, a resin material, and is supported by the inner peripheral portion of the side wall 70WR so as to be slidable on the base member 70 along the attaching / detaching direction of the SD card SMC or the like.

  Further, as shown in an enlarged view in FIG. 13, the eject member 82 has a contact surface 82 </ b> E at one end portion with which a part of the tip end portion of the inserted memory stick MS is engaged. The eject member 82 has a groove 82ga for guiding the inserted XD card XMC and a groove 82gb for guiding the inserted SD card SMC at the other end. On one side of the groove 82ga, a stepped portion 82a with which a part of the tip of the XD card XMC is engaged is formed. A contact surface 82b is formed between the contact surface 82E and the stepped portion 82a. The contact surface 82b engages with a part of the tip of the inserted SD card SMC.

  As a result, the eject member 82 is configured so that each IC card is in a state where a part of the tip of the memory stick MS, XD card XMC, SD card SMC is in contact with the contact surface 82E, the stepped portion 82a, and the contact surface 82b, respectively. When it is inserted, it is moved toward the contact terminal fixing wall portion 70WB. At that time, since the SD card SMC and the XD card XMC to be inserted are partly in contact with the stepped portion 82a and the contact surface 82b, respectively, the SD card SMC and the XD card XMC are mistakenly inserted into the card storage portion. Insertion into the second part and the third part is avoided.

  The eject member control unit includes a substantially heart-shaped cam element (heart cam) 82CA integrally formed on the upper surface of the eject member 82 facing the cover member 72, and a lever composed of a plurality of step portions formed around the heart cam 82CA. The guide groove 82CM, a substantially portal cam lever 84 whose one end is connected to the hole of the side wall 70WR and the other end is slid along the lever guide groove 82CM, and the pressing spring of the cover member 72 described above (Not shown).

  The presser spring biases the cam lever 84 so that the bent end of the cam lever 84 is in sliding contact with the guide surface of the lever guide groove 82CM.

  The heart cam 82CA molded from resin has a substantially V-shaped cam surface with which one end of the cam lever 84 is selectively engaged.

  The lever guide groove 82CM, for example, branches from one side of the heart cam 82CA linearly along the side wall 70WR and the other side of the heart cam 82CA from the middle of the first guide groove. Of the second guide groove extending parallel to the first guide groove, one end of the first guide groove facing the cam surface, and the second guide groove A third guide groove is formed between the one end and the portion facing the cam surface.

  Thus, when one end of the cam lever 84 is guided sequentially through the first guide groove, the third guide groove, and the second guide groove following the operation of the eject member 82, the eject member In 82, an entry state, a holding state, and a discharge state are sequentially taken with each IC card.

  The lock / unlock metal fitting 90 includes an elastic deformation portion 92 and a fixing portion 98 extending substantially parallel to the elastic deformation portion 92. The elastic deformation portion 92 and the fixing portion 98 are integrally formed so as to form a substantially U shape. The elastic deformation portion 92 has an engagement hole 94 that engages with the locking protrusion 80P of the contact presser plate 80 at the distal end portion, and a curved portion 96 that protrudes toward the card accommodation space at an intermediate portion thereof.

  The lock / unlock metal fitting 90 is fixed to the side wall 70WR of the base member 70 via a fixing portion 98. The elastic deformation portion 92 of the lock / unlock metal fitting 90 can be elastically deformed not only in the coordinate axis direction indicated by the arrow Y in FIG. 11 but also in the Z-axis direction (perpendicular to the paper surface) perpendicular to the arrow Y. Is formed. By configuring in this way, the contact pressing plate 80 is released from the locked state in the front-rear direction, and the contact pressing plate 80 can be rotated.

  Therefore, the lock / unlock metal fitting 90 is in a locked state so that the contact pressing plate 80 cannot be moved and rotated when an IC card (in this embodiment, the memory stick MC and the XD card XMC) is inserted. ing. Further, the lock / unlock metal fitting 90 is provided only when the second IC card having a medium size and width such as an SD card or an MMC card is inserted into the card housing space. Operates to release the locked state.

  In such a configuration, when the memory stick MS is inserted into the card accommodation space through the card slot 71CS, one side portion of the memory stick MS does not contact the curved portion 96 of the lock / unlock metal fitting 90, and the contact The presser plate 80 remains locked.

  The front end portion of the memory stick MS inserted rearward is in contact with the front base end portion 80F of the contact presser plate 80 while pushing down the contact portion of the contact terminal 76ai, and the contact presser plate 80 is rotated counterclockwise in FIG. Rotate to When the rear end portion 80R of the contact pressing plate 80 is pushed down, the contact terminal 74ai comes into contact with the rear end portion 80R.

  Therefore, the contact portion of the contact terminal 74ai is also pushed down while being positioned in the slit 80ai of the contact pressing plate 80. As a result, the memory stick MS passes over the contact pressing plate 80 and reaches the contact terminal 78ai, and then the contact pad of the memory stick MS contacts the contact portion of the corresponding contact 78ai.

  At that time, with the insertion of the memory stick MS, the tip of the memory stick MS abuts against the abutting portion 82E of the eject member 82, and the eject member 82 moves backward against the urging force of the first spring member 88. Let When the contact pad of the memory stick MS comes into contact with the contact portion of the contact terminal 78ai, the eject member 82 is held by the other end of the cam lever 84 engaging the cam surface of the heart cam 82CA.

  Next, when the SD card SMC or MMC card is inserted, the curved portion 96 of the lock / unlock metal fitting 90 comes into contact with the side surface of the inserted SD card SMC. As a result, the elastically deformable portion 92 of the lock / unlock metal fitting 90 is deformed, and the periphery of the engagement hole 94 formed at the tip thereof is disengaged from the locking protrusion 80P of the contact presser plate 80. That is, the locked state of the contact pressing plate 80 is released.

  The contact retainer plate 80 released from the locked state has the tip of the SD card SMC to be inserted in contact with the front base end portion 80F, thereby resisting the urging force of the second spring member 87. As it is inserted, it is moved backward and moved forward, and is rotated counterclockwise in FIG. 14 by the inserted SD card SMC and pushed down.

  As a result, the contact portion of the contact 74ai constrained by the rear end portion 80R of the contact retainer plate 80 projects upward from the slit 80ai of the contact retainer plate 80 by the elastic force of the contact 74ai itself, so that the SD card SMC is inserted. The contact portion of the contact 74ai is in electrical contact with the contact pad.

  At that time, as described above, a locking claw is formed at the rear end of the spring member support arm 81 of the contact presser plate 80, and the locking claw is locked to a step formed on the bottom wall 70B. When configured, the forward movement of the contact pressing plate 80 by the second spring member 87 is surely prevented.

  At that time, a part of the tip of the SD card SMC or MMC card to be inserted is pushed into contact with the contact surface 82b, so that the eject member 82 of the first spring member 88 is the same as in the case of the memory stick. It can be moved backward against the urging force. Further, when the contact pad of the SD card or the MMC card comes into contact with the contact portion of the contact 74ai, the eject member 82 is held with the other end of the cam lever 84 engaged with the cam surface of the heart cam 82CA.

  When the smallest IC card XD card XMC is inserted, the tip of the XD card XMC inserted through the card slot 71CS in FIG. 14 and obliquely inserted by the lower wall surface 70Sc as shown by a two-dot chain line is The contact pad of the XD card XMC contacts the contact portion of the contact 76ai arranged on the foremost side.

  At that time, as in the case of the SD card or MMC card, a part of the tip of the inserted XD card XMC abuts on the stepped portion 82a, and the eject member 82 resists the biasing force of the first spring member 88. It can be moved backward. When the contact pad of the XD card XMC comes into contact with the contact portion of the contact terminal 76ai, the eject member 82 is held with the other end of the cam lever 84 engaged with the cam surface of the heart cam 82CA.

  On the other hand, when the mounted IC card is removed, the mounted IC card is pushed slightly rearward so that the engagement between one end of the cam lever 84 and the cam surface of the heart cam 82CA is disengaged. Is done. Thereby, the eject member 82 is returned to the original position by the biasing force (returning force) of the first spring member 88. As a result, the IC card whose tip is in contact with the contact portion or step portion of the eject member 82 is discharged through the card slot 71CS. Further, as shown in FIG. 14, the contact pressing plate 80 is also returned to the initial position while being in the inclined state as the initial posture by the urging force (returning force) of the second spring member 87.

  A case where the attached IC card is forcibly removed in the state where the SD card SMC or MMC card is attached will be described.

  As shown in FIG. 16, when the SD card SMC is mounted, the second spring member 87 is compressed by the rearward movement of the contact pressing plate 80. Further, the end of the second spring member 87 on the side of the contact pressing plate 80 is moved along the inclined surface 70Ba of the bottom wall 70B of the base member 70 by the rotation of the contact pressing plate 80 as shown in FIG. Inclined. In other words, the second spring member 87 in the state of FIG. 16 falls substantially horizontally along the bottom wall 70B via the support protrusion 70S and the spring member support arm 81 in order to return to the original horizontal state. The contact pressing plate 80 is biased forward and upward.

  In this state, as shown by a two-dot chain line in FIG. 17, if the SD card SMC is forcibly pulled out manually through the card slot 71CS, the contact pressing plate 80 resists the restoring force of the second spring member 87. Then, it is released from the force that is pressed down horizontally by the SD card SMC.

  Therefore, as shown in FIG. 17, the contact pressing plate 80 biased upward and forward by the second spring member 87 is in an inclined state as the initial posture, and the contact 74ai is placed in the slit 80ai. It is returned to the original position while accommodating the contact portion. At that time, the ejection member 82 is held because the ejection mechanism is operating.

  As described above, even when the SD card SMC is forcibly removed from the card accommodation space, the contact retainer plate 80 remains in the tilted state, which is the original posture, regardless of the position of the eject member 82 and the front. To the predetermined position. Therefore, since the contact terminal 74ai does not protrude into the card receiving space, the tip of the IC card abuts against the contact 74ai, in particular, the contact portion even if any IC card is inserted again, and the contact 74ai is deformed. Or there is no risk of buckling.

  Furthermore, if the SD card SMC is inserted in the wrong direction, that is, the SD card SMC is in a state where one surface portion on which the plurality of contact pads of the SD card SMC are formed faces the inner surface of the cover member 72. Is inserted into the second part through the card slot 71CS through the first part in the above-described card accommodating part, the SD card SMC is placed on the lower wall surface 70Sc as shown by a two-dot chain line in FIG. As a result of being guided in an inclined state, the front end portion thereof abuts against the opening end of the cover member 72, and thus erroneous insertion of the SD card SMC into the reverse side is restricted.

  Further, as shown by a two-dot chain line in FIG. 14, if the memory stick MS is erroneously inserted in the reverse direction, the tip of the memory stick MS hits the above-described protruding piece 70 </ b> P. Incorrect insertion of the reverse side will be restricted.

It is a front view which shows the card slot of an example of the IC card connector which concerns on this invention. It is a top view which shows the external appearance of an example of the IC card connector which concerns on this invention. It is sectional drawing in the example shown by FIG. It is a top view shown in the state where the cover member was removed in the example shown in FIG. In FIG. 4, it is a top view shown in the state which removed the ejection mechanism. It is a top view with which it uses for description of the mounting | wearing operation | movement of SD card in the example shown by FIG. It is a top view with which it uses for description of mounting | wearing operation | movement of a XD card in the example shown by FIG. In the example shown by FIG. 2, it is a front view with which description of the mounting | wearing operation | movement of the SD card of the state turned back is provided. It is sectional drawing with which it uses for description of the mounting | wearing operation | movement of a XD card in the example shown by FIG. It is a front view which shows an example of the card slot of the other base member used for an example of the IC card connector which concerns on this invention. It is a top view which shows another example of the IC card connector which concerns on this invention. FIG. 12 is a front view showing a card slot in the example shown in FIG. 11. FIG. 12 is a perspective view schematically showing an eject member used in the example shown in FIG. 11. It is sectional drawing in the example shown by FIG. It is a fragmentary sectional view which expands and shows the principal part in the example shown by FIG. It is sectional drawing with which it uses for operation | movement description in the example shown by FIG. It is sectional drawing with which it uses for operation | movement description in the example shown by FIG.

Explanation of symbols

12 Base member 16ai, 18ai Contact terminal 20, 36 Eject member 40, 61 Card slot 44, 48 Guide block 46, 50 Lock spring 54 Guide return spring SMC SD card XMC XD card MS Memory stick

Claims (8)

Two types of IC cards having different shapes have a common card slot that can be selectively attached and detached, and a plurality of contact terminal groups that electrically connect electrode portions of the two types of IC cards. An IC card housing portion for housing the card;
A position control mechanism that controls the position of a card guiding member that guides the IC card so that the advancing end of the IC card faces a normal contact terminal group in accordance with attachment / detachment of the different types of IC cards. ,
The dimension of the first IC card in the thickness direction of the portion through which the narrow first IC card of the two types of IC cards in the card slot passes is the reverse of the first IC card. It is set to be smaller than the dimension in the thickness direction of the second IC card in the portion through which the second wide IC card of the two types of IC cards passes so as to regulate. IC card connector.   The inner peripheral surface forming a portion through which the second IC card passes in the card slot is connected to an inclined surface formed in the IC card housing portion and guiding the second IC card. Item 1. An IC card connector according to Item 1.   The position of the plurality of contact terminal groups that electrically connect the electrode portions of the second IC card is more than the position of the plurality of contact terminal groups that electrically connect the electrode portions of the first IC card. 2. The IC card connector according to claim 1, wherein the IC card connector is close to a slot. A side wall forming the IC card housing portion is provided so as to be rotatable along a direction in which the IC card is attached and detached, and one of the two types of IC cards is accommodated in the IC card through the card slot. When the IC card is mounted, the IC card is in a first position for guiding a portion of the IC card facing the side wall so that the advancing end of the IC card faces one contact terminal group. When the other IC card of the IC cards is inserted into the IC card housing portion through the card slot, the portion facing the side wall portion is guided so that the advancing end of the IC card faces the other contact terminal group A card guiding member that takes the state of the second position
A position control mechanism for causing the card guiding member to take the first position or the second position in accordance with attachment / detachment of the different types of IC cards;
The IC card connector according to claim 1, further comprising:   The position control mechanism portion selectively engages with one end of the card guiding member to lock the card guiding member in the first position, or is separated from the one end of the card guiding member. A lock spring that unlocks the card guide member, and a guide return that engages the other end of the card guide member and biases the card guide member in one direction so as to return the card guide member to the first position. The IC card connector according to claim 4, further comprising a spring. 2. The IC card connector according to claim 1, further comprising an eject mechanism unit that selectively ejects at least one of the two types of IC cards having different shapes from the IC card housing unit.   6. The IC card connector according to claim 5, wherein the guide return spring is disposed in a recess formed under a groove portion of a side wall portion that forms the IC card housing portion. A first part that detachably accommodates a first IC card of a plurality of IC cards having different shapes from each other via a common card insertion slot, and a card insertion slot that is closer to the card than the first part. A second portion that is formed in a row and partially overlaps with the separated position and accommodates the second IC card, and is further separated from the card insertion slot than the first portion and the second portion. A composite card accommodating portion formed of a third portion that overlaps and is formed in a line and accommodates a third IC card;
The first IC card, the second IC card, the third IC card, the third IC card, the third IC card, the third IC card, the third IC card, the third IC card, and the third IC card. A first contact terminal group, a second contact terminal group, and a third contact terminal group that perform electrical connection for each IC card;
The first contact terminal group and the second contact terminal group are arranged so as to be slidable and rotatable between the first contact terminal group and the second contact terminal group, and the second IC card or the third IC card is attached or detached according to an attachment / detachment operation. A contact pressing plate that presses down the contact group of the two contact terminal groups to a predetermined position, or releases the contact group from the predetermined position;
An IC card connector characterized in that a wall surface that forms the card insertion slot and guides the second IC card passing therethrough is an inclined surface so as to restrict insertion of the reverse side of the second IC card. .

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