JP2007241600A - Rfid tag - Google Patents

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JP2007241600A
JP2007241600A JP2006062260A JP2006062260A JP2007241600A JP 2007241600 A JP2007241600 A JP 2007241600A JP 2006062260 A JP2006062260 A JP 2006062260A JP 2006062260 A JP2006062260 A JP 2006062260A JP 2007241600 A JP2007241600 A JP 2007241600A
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chip
component
antenna
rfid tag
state
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Masaki Oku
勝紀 奥
Yasutoshi Kojima
康稔 小島
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Honda Motor Co Ltd
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Honda Motor Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide RFID tags allowing the state of parts to be easily confirmed without disassembling an assembly regarding the RFID tags provided at a plurality of parts which constitute the assembly. <P>SOLUTION: The RFID tag comprises a storage means for storing parts information for identifying the part 3, a transmitting means capable of transmitting parts information, and a transmission preventing means for preventing transmission of parts information by the transmitting means when the part 3 is put in a predetermined state. With this constitution, parts information is transmitted from the RFID tag 1 before the part 3 is put in the predetermined state, and transmission of parts information from the RFID tag 1 is prevented by the transmission preventing means when the part 3 is put in the predetermined state. The state of the part 3 can thereby be confirmed by the presence/absence of transmission of parts information. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、自動車等の組立体を構成する複数の部品にそれぞれ設けられるRFIDタグに関する。   The present invention relates to an RFID tag provided on each of a plurality of parts constituting an assembly such as an automobile.

従来、組立体の部品にRFIDタグを取り付け、RFIDタグに書込まれた製造年月日、使用開始年月日等から交換時期を把握するものが知られている(例えば、特許文献1参照)。
特開2005−55831号公報(段落番号0119)
Conventionally, an RFID tag is attached to a component of an assembly, and the replacement date is known from the date of manufacture, the date of start of use, etc. written on the RFID tag (for example, see Patent Document 1). .
JP 2005-55831 A (paragraph number 0119)

しかしながら、例えば、自動車(組立体)の排気管の触媒等の部品のように、過剰な高温状態が続くと、その部品の機能が低下してしまうことがあるものについては、製造年月日等から予測される交換時期に至る前に交換が必要となることもある。特に、この部品が自動車等の組立体の内部に配置されている場合、その部品が正常な状態であるか否かを確認するためには、組立体を分解しなければ点検することができず、面倒であった。   However, for example, when the excessively high temperature continues, such as a part of an exhaust pipe catalyst of an automobile (assembly), the function of the part may be deteriorated. May need to be replaced before the expected replacement time. In particular, when this part is placed inside an assembly such as an automobile, in order to confirm whether or not the part is in a normal state, it cannot be inspected unless the assembly is disassembled. It was troublesome.

本発明は、以上の点に鑑み、組立体を分解することなく、容易に部品状態を確認することができるRFIDタグを提供することを目的とする。   In view of the above points, an object of the present invention is to provide an RFID tag that can easily check a component state without disassembling an assembly.

上記目的を達成するため、本発明は、組立体を構成する複数の部品に設けられたRFIDタグにおいて、部品を識別するための部品情報を記憶する記憶手段と、部品情報を送信自在な送信手段と、部品が所定状態になると該送信手段による部品情報の送信を阻止する送信阻止手段とを備えることを特徴とする。   To achieve the above object, according to the present invention, there is provided a storage means for storing part information for identifying a part and a transmission means capable of transmitting the part information in an RFID tag provided in a plurality of parts constituting the assembly. And transmission blocking means for blocking transmission of component information by the transmission means when the component is in a predetermined state.

かかる構成によれば、部品が所定状態となる前はRFIDタグから部品情報が送信され、部品が所定状態となると送信阻止手段によりRFIDタグからの部品情報の送信が阻止されるため、部品情報の送信の有無により部品の状態を確認することができる。   According to such a configuration, the component information is transmitted from the RFID tag before the component is in the predetermined state, and the transmission of the component information from the RFID tag is blocked by the transmission blocking unit when the component is in the predetermined state. The state of the component can be confirmed by the presence or absence of transmission.

例えば、前記部品は、前記所定状態としての所定温度状態になると機能が停止又は低下するものである場合、アンテナと、アンテナの一方の端部に接続され、前記記憶手段と、アンテナを介して部品情報を送信する前記送信手段とを有するICチップと、アンテナとICチップとを支持する基板とを備えたRFIDタグを該部品に設け、RFIDタグのアンテナとICチップとの接続部分に所定温度状態になると溶融してアンテナとICチップとの接続を遮断する前記送信阻止手段としての溶融部を設け、部品が前記所定温度状態になった場合に、溶融部が溶けてアンテナとICチップとの接続が遮断されることにより、部品情報の送信が阻止されるように構成すればよい。   For example, when the function of the component stops or decreases when the temperature reaches a predetermined temperature state as the predetermined state, the component is connected to the antenna and one end of the antenna, and the component via the storage unit and the antenna An RFID tag including an IC chip having the transmission means for transmitting information and a substrate that supports the antenna and the IC chip is provided in the component, and a predetermined temperature state is provided at a connection portion between the antenna of the RFID tag and the IC chip. Then, a melting part is provided as the transmission preventing means for melting and blocking the connection between the antenna and the IC chip, and when the component reaches the predetermined temperature state, the melting part melts and the antenna and the IC chip are connected. It may be configured such that transmission of component information is blocked by blocking.

又、前記ICチップを第1ICチップとし、前記溶融部を前記所定温度としての第1温度以上で溶融する第1溶融部とし、該第1ICチップと並列になるように前記アンテナの一方の端部に接続された第2ICチップと、アンテナと第2ICチップとの接続部分に位置するように前記基板に設けられ、前記部品が前記第1温度よりも低い第2温度以上になると溶融してアンテナと第2ICチップとの接続を遮断する第2溶融部を備え、前記第1ICチップの前記記憶手段に第1状態情報を記憶させ、前記第2ICチップに設けられた記憶手段に第2状態情報を記憶させることが好ましい。   In addition, the IC chip is a first IC chip, the melting part is a first melting part that melts at a first temperature or higher as the predetermined temperature, and one end of the antenna is parallel to the first IC chip. A second IC chip connected to the antenna, and the substrate is disposed so as to be positioned at a connection portion between the antenna and the second IC chip, and the antenna melts when the component becomes a second temperature lower than the first temperature. A second melting section for cutting off the connection with the second IC chip; storing the first state information in the storage means of the first IC chip; and storing the second state information in the storage means provided in the second IC chip. It is preferable to make it.

これによれば、部品の温度が第2温度以上となると第2溶融部が溶融し、第2ICチップの記憶手段に記憶された第2状態情報が送信されなくなる。すなわち、部品の温度が第2温度以上であって、第1温度未満の場合は、第1ICチップの記憶手段に記憶された第1状態情報のみが送信されることとなり、部品の温度が第1温度になる前に、まもなく部品がその機能を停止又は低下させる所定温度状態(第1温度状態)となることを案内することができる。よって、部品の交換や修理を早期に促すことができ、未然に部品の故障等を回避することができる。   According to this, when the temperature of the component becomes equal to or higher than the second temperature, the second melting portion is melted, and the second state information stored in the storage unit of the second IC chip is not transmitted. That is, when the temperature of the component is equal to or higher than the second temperature and lower than the first temperature, only the first state information stored in the storage unit of the first IC chip is transmitted, and the temperature of the component is the first temperature. Before reaching the temperature, it can be guided that the part will soon be in a predetermined temperature state (first temperature state) that stops or reduces its function. Therefore, replacement and repair of parts can be promptly promoted, and failure of parts can be avoided in advance.

本発明の実施の形態を図1から図3を参照して説明する。図1は実施形態の部品状態管理システムを示す説明図、図2は実施形態のRFIDタグを示す説明図、図3はアンテナとICチップとを接続する接続部分を示す説明図である。   An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is an explanatory diagram showing the component state management system of the embodiment, FIG. 2 is an explanatory diagram showing the RFID tag of the embodiment, and FIG. 3 is an explanatory diagram showing a connection portion for connecting the antenna and the IC chip.

本発明の実施形態のRFIDタグ1は、図1に示すように、組立体としての自動車2の排気管の触媒などの部品3に設けられるものである。部品3は所定状態としての第1温度(所定温度)tに達した状態(所定温度状態。第1温度状態)になるとその機能が停止又は低下する。   As shown in FIG. 1, an RFID tag 1 according to an embodiment of the present invention is provided in a component 3 such as an exhaust pipe catalyst of an automobile 2 as an assembly. When the component 3 reaches a first temperature (predetermined temperature) t as a predetermined state (predetermined temperature state, first temperature state), its function is stopped or lowered.

RFIDタグ1は、図2に示すように、コイルを形成するアンテナ11と、記憶手段(図示省略)を備える2つのICチップ12,13と、アンテナ11とICチップ12,13とを支持する基板14とで構成されている。又、ICチップ12,13は、アンテナ11を介して部品情報を送信する図示しない送信手段を備え、送信手段により送信された部品情報は、図1に示すリーダ4で受信する。   As shown in FIG. 2, the RFID tag 1 includes an antenna 11 that forms a coil, two IC chips 12 and 13 that include storage means (not shown), and a substrate that supports the antenna 11 and the IC chips 12 and 13. 14. Further, the IC chips 12 and 13 include transmission means (not shown) that transmits component information via the antenna 11, and the component information transmitted by the transmission means is received by the reader 4 shown in FIG.

又、ICチップ12の記憶手段には、部品3が第1温度tに達する前の注意状態等の第1状態情報が記憶され、ICチップ13の記憶手段には第1温度tよりも低い第2温度t−Δtに達する前の正常状態等の第2状態情報が記憶されている。ICチップ12,13には、コンデンサ(図示省略)が設けられている。RFIDタグ1はコイルを構成するアンテナ11とICチップ12,13内に設けられたコンデンサにより構成される共振回路の共振周波数がリーダ4の搬送波と一致するように設定されており、リーダ4はRFIDタグ1をこの周波数で共振させて内部に記憶された情報を読み取る。   The storage means of the IC chip 12 stores first state information such as a caution state before the component 3 reaches the first temperature t. The storage means of the IC chip 13 stores the first state information lower than the first temperature t. 2nd state information, such as a normal state before reaching 2 temperature t-deltat, is memorized. The IC chips 12 and 13 are provided with capacitors (not shown). The RFID tag 1 is set so that the resonance frequency of a resonance circuit composed of an antenna 11 constituting a coil and a capacitor provided in the IC chips 12 and 13 matches the carrier wave of the reader 4. The tag 1 is caused to resonate at this frequency, and the information stored therein is read.

基板14にはアンテナ11とICチップ12との接続部分に位置させて第1温度tで溶融する第1溶融部14aが設けられている。又、アンテナ11とICチップ13との接続部分に位置させて第2温度t−Δtで溶融する第2溶融部14bが設けられている。他の基板14の部分は、所定温度t以上の温度に耐え得る樹脂等で形成されている。   The substrate 14 is provided with a first melting portion 14a that is located at a connection portion between the antenna 11 and the IC chip 12 and melts at a first temperature t. Further, a second melting portion 14b is provided that is located at a connection portion between the antenna 11 and the IC chip 13 and melts at the second temperature t−Δt. The other part of the substrate 14 is formed of a resin or the like that can withstand a temperature equal to or higher than a predetermined temperature t.

リーダ4は、部品3の温度が第2温度t−Δt未満のときには、RFIDタグ1から送信される部品情報及び第1・第2状態情報を受信する。又、リーダ4は第2状態情報を受信すると、部品3が正常であると判断しその旨を図示しない表示画面に表示する。   The reader 4 receives the component information and the first and second state information transmitted from the RFID tag 1 when the temperature of the component 3 is lower than the second temperature t−Δt. When the reader 4 receives the second status information, the reader 4 determines that the component 3 is normal and displays that fact on a display screen (not shown).

部品3が第2温度t−Δt以上になると、図2(b)に示すように、第2溶融部14bが溶融し、アンテナ11とICチップ13との接続が遮断される。具体的には、図3に示すように、アンテナ11の第2溶融部14bが設けられた箇所に位置させて断線部11aを形成する。そして、第2溶融部14bに表面が露出するように金属箔11bを埋め込む。金属箔11bの両端はアンテナ11の断線部11aを電気的に接続するように接触している。第2溶融部14bの下方には隙間14cが設けられている。部品3が第2温度t−Δt以上になると第2溶融部14bが溶融して隙間14cに金属箔11aと共に落ちる。このようにしてアンテナ11とICチップ13との接続が遮断され、RFIDタグ1はICチップ43の記憶手段に記憶された部品情報及び第2状態情報を送信することができなくなる。   When the component 3 becomes equal to or higher than the second temperature t−Δt, as shown in FIG. 2B, the second melting part 14b is melted, and the connection between the antenna 11 and the IC chip 13 is cut off. Specifically, as shown in FIG. 3, the disconnection portion 11 a is formed at a location where the second melting portion 14 b of the antenna 11 is provided. Then, the metal foil 11b is embedded so that the surface is exposed in the second melting portion 14b. Both ends of the metal foil 11b are in contact with each other so as to electrically connect the disconnected portion 11a of the antenna 11. A gap 14c is provided below the second melting portion 14b. When the component 3 becomes equal to or higher than the second temperature t−Δt, the second melting part 14b melts and falls together with the metal foil 11a into the gap 14c. In this way, the connection between the antenna 11 and the IC chip 13 is cut off, and the RFID tag 1 cannot transmit the component information and the second state information stored in the storage unit of the IC chip 43.

従って、RFIDタグ1は、ICチップ42の記憶手段に記憶された部品情報及び第1状態情報のみを送信することとなる。このとき、リーダ4は、部品3が注意状態であることを図示しない表示画面に表示する。ゆえに、リーダ4により部品3がまもなく交換時期に入ることを運転手等に知らせることができ、早期に部品3の交換を促すことができる。   Therefore, the RFID tag 1 transmits only the component information and the first state information stored in the storage unit of the IC chip 42. At this time, the reader 4 displays that the component 3 is in a caution state on a display screen (not shown). Therefore, the driver 4 can notify the driver and the like that the component 3 will soon be replaced, and can promptly replace the component 3 at an early stage.

又、部品3が第1温度tになると、部品3はその機能を停止又は低下させる。このとき図2(c)に示すように、第1溶融部14aが溶融して、アンテナ11とICチップ12との接続が、第2温度t−Δtに達したときと同様に遮断される。このため、リーダ4はRFIDタグ1の部品情報及び第1・第2状態情報を受信できなくなり、部品3が交換時期に入ったことを表示する。従って、運転手等は、部品3が故障したこと又は部品3の機能が低下したことをリーダ4により確認することができ、早急に部品3を修理又は交換する必要があることを容易に確認することができる。   Further, when the component 3 reaches the first temperature t, the component 3 stops or reduces its function. At this time, as shown in FIG. 2C, the first melting portion 14a is melted, and the connection between the antenna 11 and the IC chip 12 is cut off in the same manner as when the second temperature t−Δt is reached. For this reason, the reader 4 cannot receive the component information and the first and second state information of the RFID tag 1, and displays that the component 3 has entered the replacement period. Therefore, the driver or the like can confirm by the reader 4 that the component 3 has failed or that the function of the component 3 has deteriorated, and easily confirms that the component 3 needs to be repaired or replaced immediately. be able to.

実施形態のRFIDタグ1によれば、自動車2の内部の部品3について、自動車2を分解することなく、リーダ4により容易に部品3が正常に機能しているか否かを確認することができる。このため、部品3のメンテナンスが容易となる。   According to the RFID tag 1 of the embodiment, it is possible to easily confirm whether or not the component 3 is functioning normally by the reader 4 without disassembling the vehicle 2 with respect to the component 3 inside the vehicle 2. For this reason, the maintenance of the component 3 becomes easy.

尚、実施形態においては、所定状態として部品3の第1温度(所定温度)tに達した状態(所定温度状態)を基準にしたものを説明したが、所定状態はこれに限られず、例えば、部品間の接続状態や部品の所定の膨張、所定の歪み等を基準にしてもよい。例えば、部品間の接続状態を基準にした場合、部品間の間隔がその機能が停止又は低下する所定間隔以上開くことによりアンテナ11とICチップ42との接続が遮断されるように構成すればよい。   In the embodiment, the description has been made on the basis of the state (predetermined temperature state) that has reached the first temperature (predetermined temperature) t of the component 3 as the predetermined state, but the predetermined state is not limited to this, for example, A connection state between components, a predetermined expansion of the component, a predetermined distortion, or the like may be used as a reference. For example, when the connection state between the components is used as a reference, the connection between the antenna 11 and the IC chip 42 may be cut off by opening the interval between the components more than a predetermined interval at which the function stops or decreases. .

このとき、実施形態のように交換時期に入ったときだけでなく、まもなく交換時期に入ることも知らせたい場合には、例えば、実施形態のように2つのICチップ12,13をRFIDタグ1に設けると共に、弾性係数の異なる弾性部材を基板14に設け、所定間隔以上又は所定間隔よりも一定長狭い間隔以上開いた場合に、アンテナ41とICチップ42,43との接続が解除されるように構成すればよい。   At this time, when it is desired to notify not only when the replacement time is entered as in the embodiment but also that the replacement time is about to be reached, for example, the two IC chips 12 and 13 are attached to the RFID tag 1 as in the embodiment. In addition, an elastic member having a different elastic coefficient is provided on the substrate 14, and the connection between the antenna 41 and the IC chips 42, 43 is released when the substrate 14 is opened at a predetermined interval or more or a certain length narrower than the predetermined interval. What is necessary is just to comprise.

又、弾性部材の代わりに、アンテナ11とICチップ12,13との接続部分が互いに重なるように移動自在に接触する部分を設け、所定間隔以上開くとアンテナ41とICチップ42,43との接続部分が重ならなくなり、両者の接触が解除されるように構成してもよい。   In addition, instead of the elastic member, a connecting portion is provided so that the connecting portions of the antenna 11 and the IC chips 12 and 13 overlap each other, and the antenna 41 and the IC chips 42 and 43 are connected when they are opened by a predetermined distance or more. You may comprise so that a part may not overlap and both contact may be cancelled | released.

又、実施形態においては、ICチップを2つ設けたRFIDタグ1について説明したが、ICチップは3つ以上設けてもよい。この場合、例えば3つ目のICチップに部品3の機能を最大限発揮することができる第3状態情報を記憶させるようにしてもよい。   In the embodiment, the RFID tag 1 provided with two IC chips has been described. However, three or more IC chips may be provided. In this case, for example, third state information that can maximize the function of the component 3 may be stored in the third IC chip.

実施形態の部品状態管理システムを示す説明図。Explanatory drawing which shows the component state management system of embodiment. 実施形態のRFIDタグを示す説明図。Explanatory drawing which shows the RFID tag of embodiment. アンテナとICチップとを接続する接続部分を示す説明図。Explanatory drawing which shows the connection part which connects an antenna and IC chip.

符号の説明Explanation of symbols

1…RFIDタグ、 11…アンテナ、 12,13…ICチップ、 14…基板、 14a…第1溶融部、 14b…第2溶融部、 2…自動車(組立体)、 3…部品、 4…リーダ。 DESCRIPTION OF SYMBOLS 1 ... RFID tag, 11 ... Antenna, 12, 13 ... IC chip, 14 ... Board | substrate, 14a ... 1st fusion | melting part, 14b ... 2nd fusion | melting part, 2 ... Automobile (assembly), 3 ... Components, 4 ... Reader.

Claims (3)

組立体を構成する複数の部品に設けられたRFIDタグにおいて、
部品を識別するための部品情報を記憶する記憶手段と、
部品情報を送信自在な送信手段と、
部品が所定状態になると該送信手段による部品情報の送信を阻止する送信阻止手段とを備えることを特徴とするRFIDタグ。
In the RFID tag provided in a plurality of parts constituting the assembly,
Storage means for storing component information for identifying the component;
A transmission means capable of transmitting parts information;
An RFID tag comprising: a transmission blocking unit that blocks transmission of component information by the transmission unit when the component is in a predetermined state.
前記所定状態は前記部品の機能が停止又は低下する所定温度状態であり、
アンテナと、アンテナの一方の端部に接続され、前記記憶手段と、アンテナを介して部品情報を送信する前記送信手段とを有するICチップと、アンテナとICチップとを支持する基板とを備え、
前記送信阻止手段は、アンテナとICチップとの接続部分に位置するように基板に設けられ、前記部品が前記所定温度以上になると溶融してアンテナとICチップとの接続を遮断する溶融部であることを特徴とする請求項1記載のRFIDタグ。
The predetermined state is a predetermined temperature state in which the function of the component stops or decreases,
An antenna, an IC chip connected to one end of the antenna and having the storage means and the transmission means for transmitting component information via the antenna, and a substrate for supporting the antenna and the IC chip,
The transmission blocking means is a melting portion that is provided on the substrate so as to be positioned at a connection portion between the antenna and the IC chip, and melts when the component reaches the predetermined temperature or higher and blocks the connection between the antenna and the IC chip. The RFID tag according to claim 1, wherein:
前記ICチップを第1ICチップとし、前記溶融部を前記所定温度としての第1温度以上で溶融する第1溶融部とし、
該第1ICチップと並列になるように前記アンテナの一方の端部に接続された第2ICチップと、
アンテナと第2ICチップとの接続部分に位置するように前記基板に設けられ、前記部品が前記第1温度よりも低い第2温度以上になると溶融してアンテナと第2ICチップとの接続を遮断する第2溶融部を備え、
前記第1ICチップの前記記憶手段に第1状態情報を記憶させ、前記第2ICチップに設けられた記憶手段に第2状態情報を記憶させることを特徴とする請求項2記載のRFIDタグ。
The IC chip is a first IC chip, and the melting part is a first melting part that melts at a first temperature or higher as the predetermined temperature,
A second IC chip connected to one end of the antenna so as to be in parallel with the first IC chip;
Provided on the substrate so as to be located at a connection portion between the antenna and the second IC chip, and when the component reaches a second temperature lower than the first temperature, it melts to cut off the connection between the antenna and the second IC chip. A second melting part,
3. The RFID tag according to claim 2, wherein the first state information is stored in the storage unit of the first IC chip, and the second state information is stored in a storage unit provided in the second IC chip.
JP2006062260A 2006-03-08 2006-03-08 Rfid tag Pending JP2007241600A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013051121A1 (en) * 2011-10-05 2013-04-11 富士通株式会社 Rfid tag and fuse

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013051121A1 (en) * 2011-10-05 2013-04-11 富士通株式会社 Rfid tag and fuse
US9443187B2 (en) 2011-10-05 2016-09-13 Fujitsu Limited RFID tag and fuse

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