JP2007235115A - Method of manufacturing conductive film, light-transmissive electromagnetic wave shield film, optical filter, and plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-transmissive electromagnetic wave shield film that is high in productivity, low in cost, hard in fog formation and high in electromagnetic wave shield performance, and to provide an optical filter and a plasma display panel using the film. <P>SOLUTION: A method of manufacturing a conductive film includes: a development step of forming a metal silver portion by exposing and developing a photosensitive film having a silver salt emulsion layer on a support; a reduction treatment step of contacting a reducing agent to a surface of the metal silver portion; and a smoothing treatment step of smoothing the photosensitive film that has been subjected to the reduction treatment. A light-transmissive electromagnetic shield film, an optical filter, and a plasma display panel are manufactured using the conductive film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a display such as a CRT (cathode ray tube), PDP (plasma display panel), liquid crystal, ELP (electroluminescence panel (EL)), FED (field emission display), a microwave oven, an electronic device, The present invention relates to an electromagnetic wave shield that shields electromagnetic waves generated from a printed wiring board or the like, and more particularly to a translucent electromagnetic wave shielding film having translucency, an optical filter provided with the translucent electromagnetic wave shielding film, and a plasma display panel.

  In recent years, electromagnetic interference (Electro-Magnetic Interference: EMI) has been rapidly increasing with the increase in the use of various electric facilities and electronic application facilities. EMI has been pointed out to be a cause of malfunction and failure of electronic and electrical equipment, as well as a health hazard to operators of these devices. For this reason, in electronic and electrical equipment, it is required to suppress the intensity of electromagnetic wave emission within the standard or regulation.

  Although it is necessary to shield the electromagnetic wave as a countermeasure against the EMI, it is obvious that a property that does not allow the metal electromagnetic wave to penetrate may be used. For example, a method of making the casing a metal body or a high conductor, a method of inserting a metal plate between the circuit board and the circuit board, a method of covering the cable with a metal foil, and the like are employed. However, in CRT, PDP, etc., since the operator needs to recognize characters displayed on the screen, transparency in the display is required. For this reason, in any of the above methods, the front surface of the display often becomes opaque, which is inappropriate as an electromagnetic wave shielding method.

Particularly, since PDP generates a large amount of electromagnetic waves as compared with CRT or the like, stronger electromagnetic shielding ability is required. The electromagnetic wave shielding ability can be simply expressed by a surface resistance value. In the case of a translucent electromagnetic wave shielding material for CRT, the surface resistance value is required to be about 300Ω / sq or less, but for PDP. The translucent electromagnetic wave shielding material is required to have a resistance of 2.5Ω / sq or less, and in a plasma plasma for consumer use using a PDP, there is a high need for 1.5Ω / sq or less, and more preferably 0.1Ω / sq. An extremely high conductivity of sq or less is required.
Further, the required level of transparency is about 70% or more for CRT and 80% or more for PDP, and further higher transparency is desired.

  In order to solve the above problems, various materials and methods have been proposed so far that achieve both electromagnetic shielding properties and transparency by using a metal mesh having openings as shown below. .

(1) Conductive fiber For example, Patent Document 1 discloses an electromagnetic shielding material made of conductive fiber. However, this shielding material has a drawback that when the display screen is shielded with a thick mesh line width, the screen becomes dark and the characters displayed on the display are difficult to see.

(2) Mesh formed by electroless plating A method has been proposed in which an electroless plating catalyst is printed as a grid pattern by a printing method, and then electroless plating is performed (for example, Patent Document 2 and Patent Document 3). . However, the line width of the catalyst to be printed is as thick as about 60 μm, which is inappropriate as a display application that requires a relatively small line width and a dense pattern.
Further, a method of electroless plating after forming a pattern of an electroless plating catalyst by applying a photoresist containing an electroless plating catalyst and performing exposure and development is proposed (for example, Patent Document 4). . However, the visible light transmittance of the conductive film was 72%, and the transparency was insufficient. Furthermore, since it is necessary to use extremely expensive palladium as an electroless plating catalyst that removes most after exposure, there is also a problem in terms of manufacturing cost.

(3) Mesh formed by photolithography method A method of forming a mesh of a metal thin film on a transparent substrate by etching using the photolithography method has been proposed (for example, Patent Documents 5 to 8). In this method, since fine processing is possible, a mesh having a high aperture ratio (high transmittance) can be created, and there is an advantage that shielding is possible even when strong electromagnetic waves are emitted. However, the manufacturing process is complicated and complicated, and the production cost is high. Further, it is known that there is a problem that the intersection part of the lattice pattern is thicker than the line width of the straight line part because of the etching method. In addition, the problem of moire was pointed out and improvement was desired.

(4) Mesh formed by a method of developing silver halide A method of forming a conductive mesh with conductive metal silver obtained by developing silver halide, or further plating metal copper on the conductive mesh A method of forming a mesh has been proposed (for example, Patent Documents 9 and 10).
JP-A-5-327274 JP 11-170420 A Japanese Patent Laid-Open No. 5-288989 JP-A-11-170421 JP 2003-46293 A Japanese Patent Laid-Open No. 2003-23290 Japanese Patent Laid-Open No. 5-16281 JP-A-10-338848 JP 2004-207001 A JP 2004-221564 A

  The patent documents described above in the background art section are disclosures of techniques that have been improved for each purpose, but the following problems remain.

(Low productivity by electroless plating)
For example, the technique disclosed in Patent Document 10 has advantages such as being able to precisely control the shape of the mesh, imparting high transparency, and enabling mass production at low cost compared to other methods. Since the resistance of the developed silver conductive mesh is high, it is difficult to perform direct electroplating, and it is necessary to use electroless plating and electrolytic plating in combination when performing plating on a large area film. Therefore, there has been a problem that productivity has deteriorated and plating costs are high, and improvement has been desired.

(The problem of fogging of photosensitive materials)
Therefore, in order to easily perform electroplating, it is desirable that the developed silver mesh has a low resistance. However, when obtaining a low-resistance developed silver mesh, it has been found that there is a problem that development occurs even in an unexposed area. did. The occurrence of developed silver in the unexposed area is called fog.
Moreover, in patent document 1, the electrolytic plating process is performed by a single wafer process and a batch process. When electroplating is performed on a film having a large surface resistance of 1 Ω / sq or more by single wafer processing, a large portion of the film portion in contact with the plating solution is plated at a portion close to the current flowing side. In particular, this phenomenon occurred at the start of plating, that is, at the first power supply, and it was difficult to uniformly apply the plating even if the plating was continued thereafter.

(Low productivity due to discontinuous mesh pattern)
In addition, some of the conventional mesh forming methods have been unable to create a mesh having a break in a certain area. For example, when the above electroless plating catalyst is printed as a grid pattern by a printing method and then electroless plating is performed, for example, when screen printing is used, the patterning of the plating catalyst core is interrupted in units of size such as a screen or intaglio. As a result, the mesh is disconnected. Further, when the photolithography method is used, the mesh is interrupted in units of exposure mask size. The reason is that since the exposure method is a single-wafer photomask, the exposure to the exposure photoresist cannot be continuously exposed over the entire roll film, and the exposure within the size range of the photomask is 1 This is because it must be repeated once.
For this reason, for example, in the case of PDP applications, a manufacturing method has been adopted in which an electromagnetic wave shielding film is aligned with an optical filter material based on a mesh pattern of the created shielding film and a PDP module or a front plate or glass. It was. However, even if a roll-like electromagnetic shielding film is continuously laminated to improve productivity, it takes time for alignment and the production speed cannot be sufficiently increased. There is also a problem that loss occurs in the electromagnetic wave shielding film.

Further, in the electromagnetic wave shielding film as described above, near infrared ray cutting performance is an important required characteristic for the purpose of preventing malfunction of the remote controller. Particularly recently, the amount of generated near-infrared light has increased with the improvement of the brightness of the PDP, so that a further advanced near-infrared cut performance is required.
In order to provide this near-infrared cut function, a method such as pasting a film having the function with an electromagnetic wave shielding film can be considered, but as long as the electromagnetic wave shielding film is intermittent as described above, Films with an outer cut function also have the disadvantage of being used only intermittently. In addition, since a film having a near-infrared cut function is generally supplied in a roll shape, there is a problem that material loss occurs during production.
In addition, in PDP applications, an antireflection function is indispensable in addition to the electromagnetic wave shielding ability and the near infrared ray cutting ability. Since the film or functional film having the antireflection function is supplied as a roll-like film as well as the film having the near-infrared cut function, the material is lost when the conductive mesh of the electromagnetic wave shielding film is interrupted. There was a problem of doing.

(Problem of adhesion strength)
As described above, the means for imparting an electromagnetic wave shielding function to the PDP is an optical filter for PDP having a base material such as glass, plastic sheet, or plastic film, in which an electromagnetic wave shielding film is bonded to an image display panel using an adhesive. A method such as attaching an electromagnetic shielding film to the substrate is employed. When an electromagnetic wave shielding film is bonded to glass or plastic, an adhesive is used. Conventionally, photographic films have very few uses for bonding to glass or plastic with such an adhesive. Furthermore, it has been found that when a support surface conventionally used in a photographic film is bonded to glass, there is a problem that the peeling strength of the bonded surface is insufficient and peeling occurs with time.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a translucent electromagnetic wave shielding film in which a continuous mesh pattern is formed in a large amount at a low cost by improving the productivity with little loss of shielding material. It is to provide.
A second object is to provide an electromagnetic wave shielding film excellent in adhesiveness (peeling strength) of an electromagnetic wave shielding film obtained from a photosensitive material to a glass substrate.
A further object of the present invention is to provide a photosensitive material having an easy-adhesion layer in which developed silver is not substantially formed on an unexposed portion on a conductive film obtained by developing the photosensitive material, that is, fog does not occur, and It is to provide an electromagnetic shielding film.
Furthermore, another object of the present invention is to provide a translucent electromagnetic wave shielding film having both high electromagnetic wave shielding properties and high near infrared ray cutting performance.
A further object of the present invention is to provide an optical filter and a plasma display having high electromagnetic shielding properties and high near infrared cut performance.

The above problems have been solved by the following invention.
That is, the first method for producing a conductive film of the present invention is a method for producing a conductive film including a developing step of exposing and developing a photosensitive film having a silver salt emulsion layer containing a silver salt on a support. Because
Furthermore, a reduction treatment step for bringing a reducing agent into contact with the surface of the photosensitive film;
A smoothing process for smoothing the photosensitive film. Here, regarding the order of the reduction process and the smoothing process, the smoothing process may be performed after the reduction process, or the reduction process may be performed after the smoothing process.
Further, the second method for producing a conductive film of the present invention is a development step of forming a metallic silver portion by exposing and developing a photosensitive film having a silver salt emulsion layer containing a silver salt on a support. When,
A reduction treatment step of bringing a reducing agent into contact with the surface of the metallic silver part;
And a smoothing treatment step of smoothing the photosensitive film subjected to the reduction treatment.
According to the first and second conductive film manufacturing methods of the present invention, the electrical resistance of the obtained conductive film can be reduced. In addition, although the reason which can reduce the electrical resistance of a conductive film is not certain, in the manufacturing method of this invention, the conductive metal formed on a conductive film (metal silver or copper formed by electrolytic plating process etc.) It is presumed that the oxides and sulfides produced during the manufacturing process could be reduced on the surface of the metal, and as a result, the electrical resistance could be reduced. In the manufacturing method of the present invention, only the reduction treatment may be performed without performing the smoothing treatment, but the electrical resistance of the conductive film is sufficiently increased by using the smoothing treatment and the reduction treatment together. Can be reduced.
In the first and second conductive film production methods of the present invention, the smoothing treatment is preferably a calendar treatment, and the calendar treatment is preferably performed at a linear pressure of 1960 N / cm (200 kgf / cm) or more. .
In the first and second conductive film production methods of the present invention, the reducing agent is an alkaline aqueous solution, and the reducing agent is sodium triacetoxyborohydride, dimethylamine borane or sodium borohydride. preferable.
In the manufacturing method of the 2nd electroconductive film of this invention, it is preferable that the said metal silver part contains 50-100 mass% of Ag. In such a form, the metal silver portion may not be substantially subjected to physical development and / or plating treatment. In addition, when physical development and / or plating treatment is not performed on the metallic silver part, it is difficult to reduce the electrical resistance, but in the present invention, since reduction treatment and / or smoothing treatment is performed, Even in such a case, the electrical resistance can be sufficiently reduced. In addition, from the viewpoint of sufficiently reducing the electric resistance, the metal silver portion may further have an electrolytic plating treatment step in which the electroplating treatment is performed, and the electrolytic plating treatment is performed using a plating bath of 10 stages or less. Preferably, it is done.
In the manufacturing method of the 2nd electroconductive film of this invention, it replaces with a reduction process or in addition to the reduction process, it is preferable that the metal silver part is processed with the silver ion ligand. By performing this treatment, the electrical resistance can be further sufficiently reduced.
Further, the present invention is a light-transmitting electromagnetic wave shielding film formed by forming a mesh-like metallic silver part on a support, wherein the mesh-like metallic silver part contains 50 to 100% by mass of Ag. Is a metallic silver portion in which metallic silver fine wires of 18 μm or less are combined in a mesh shape having an aperture ratio of 85% or more, and the shield film has a surface resistance value of 5 Ω / sq or less and the mesh shape in the longitudinal direction. There is also a translucent electromagnetic wave shielding film characterized in that the metallic silver part is a shielding film having a continuous length of 3 m or more, and the mesh-shaped metallic silver part has a disconnection of 10 places / m ² or less. The translucent electromagnetic wave shielding film preferably has a haze generated by light transmission of 10% or less. Such a translucent electromagnetic wave shielding film can be manufactured using the conductive film manufactured by the manufacturing method of the first and second conductive films of the present invention.
Moreover, this invention exists also in the translucent electromagnetic wave shielding film for plasma display panels manufactured using the said translucent electromagnetic wave shielding film, an optical filter, or a plasma display panel.
Moreover, the present invention may be in the following forms.
1) A translucent electromagnetic wave shielding film formed by forming a mesh-shaped metallic silver portion on a support, wherein the mesh-shaped metallic silver portion contains 50 to 100% by mass of Ag and has a line width of 18 μm or less. A metallic silver portion in which metallic silver fine wires are combined in a mesh shape having an aperture ratio of 85% or more, and the shield film has a surface resistance value of 5 Ω / sq or less, and the mesh-shaped metallic silver portion in the longitudinal direction. A translucent electromagnetic wave shielding film characterized in that it is a shielding film that is continuous for 3 m or more and that has a breaking of the mesh-shaped metallic silver portion at 10 sites / m ² or less.
2) The translucent electromagnetic wave shielding film as described in 1) above, wherein the haze is 10% or less.
3) The translucent electromagnetic wave shielding film as described in 1) or 2) above, wherein the mesh-like metallic silver portion is substantially not subjected to physical development and / or plating treatment.
4) The translucent electromagnetic wave shielding film as described in 1) or 2) above, wherein the mesh-shaped metallic silver portion is electroplated.
5) The translucent electromagnetic wave shielding film as described in 4) above, wherein the electroplating treatment is a treatment in a plating bath of 10 steps or less.
6) The translucent electromagnetic wave shielding film as described in any one of 1) to 5) above, wherein a calendar treatment is applied.
7) The translucent electromagnetic wave shielding film as described in 6) above, wherein the calendar treatment is performed at a linear pressure of 1960 N / cm (200 kgf / cm) or more.
8) The translucent electromagnetic wave shielding film as described in any one of 1) to 7) above, wherein the mesh-shaped metallic silver portion is treated with a reducing agent.
9) The translucent electromagnetic wave shielding film as described in any one of 1) to 8) above, wherein the mesh-shaped metallic silver portion is treated with a silver ion ligand.
10) A translucent electromagnetic wave shielding film for plasma display panel, comprising the translucent electromagnetic wave shielding film according to any one of 1) to 9) above.
11) An optical filter comprising the translucent electromagnetic wave shielding film according to any one of 1) to 9) above.
12) A plasma display panel having the translucent electromagnetic wave shielding film according to any one of 1) to 9) above.

ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the electroconductive film which can fully reduce the electrical resistance of an electroconductive film can be provided. In addition, according to the present invention, it is possible to provide a translucent electromagnetic wave shielding film in which a continuous mesh pattern is formed in a large amount at a low cost by improving the productivity with little loss of the shielding material.
Moreover, the electromagnetic wave shielding film excellent in the adhesiveness (peeling strength) to the glass substrate etc. of the electromagnetic wave shielding film obtained from a photosensitive material can be provided.
Furthermore, a photosensitive material having an easy-adhesion layer in which developed silver is not substantially formed in an unexposed portion on a conductive film obtained by developing the photosensitive material, that is, fog does not occur, and an electromagnetic wave shielding film Can be provided.
In addition, it is possible to provide a translucent electromagnetic shielding film that has both high electromagnetic shielding properties and high near-infrared cutting performance, and to provide an optical filter and plasma display having high electromagnetic shielding properties and high near-infrared cutting performance. Can do.
Therefore, according to the present invention, a translucent electromagnetic wave shielding film having excellent productivity, low cost, no fogging, and high electromagnetic wave shielding properties, an optical filter and a plasma display panel using the same are provided. can do.

In this specification, “mesh” in “continuous mesh pattern” or the like refers to a mesh pattern composed of a plurality of fine lines or a mesh composed of a plurality of fine lines according to an example in the art.
A continuous mesh pattern is a pattern in which fine lines are not substantially cut (less than 10 locations / m ² ) and is continuous over a long distance, and is in an arbitrary position according to the size of the object to be bonded. High productivity of translucent electromagnetic shielding film.
In addition, the “conductive film (referred to as an electromagnetic wave shielding film when used for electromagnetic wave shielding)” is supported on a film-like support, so it is confused with other components (component film) to be laminated. Unless otherwise noted, it may be referred to as “electromagnetic wave shielding film” or simply “film”.

[Configuration of translucent electromagnetic shielding film]
(Summary of thickness of each layer)
The thickness of the support in the translucent electromagnetic wave shielding film of the present invention is 200 μm or less, preferably 20 to 180 μm, and more preferably 50 to 120 μm. If it is the range of 10-200 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.

  The method for forming the metallic silver portion is not particularly limited, but it is most advantageous to form it by a method of developing a photosensitive material containing silver salt (photosensitive film if processed into a film). Will be described in the case of adopting a method of developing a light-sensitive material containing a silver salt. The thickness of the metallic silver portion can be appropriately determined according to the coating thickness of the silver salt-containing layer coating material (silver salt emulsion) coated on the support. The thickness of the metallic silver part is preferably 30 μm or less, more preferably 20 μm or less, further preferably 0.01 to 9 μm, and most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is pattern shape. The metallic silver part may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion has a pattern shape and has a multilayer structure of two or more layers, different color sensitivities can be imparted so that it can be exposed to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer. The translucent electromagnetic wave shielding film including the multilayered patterned metal silver portion formed as described above can be used as a high-density printed wiring board.

The thickness of the metallic silver portion is preferable for use as an electromagnetic wave shielding film for a display because the viewing angle of the display is increased as the thickness is reduced. Furthermore, as a use of the conductive wiring material, a thin film is required because of a demand for high density. From such a viewpoint, the thickness of the metallic silver portion is preferably less than 9 μm, more preferably from 0.1 μm to less than 5 μm, and further preferably from 0.1 μm to less than 3 μm.
In the present invention, a metallic silver portion having a desired thickness is formed by controlling the coating thickness of the silver salt-containing layer, and the thickness of the layer made of conductive metal particles can be freely controlled by physical development and / or plating treatment. Therefore, even a translucent electromagnetic wave shielding film having a thickness of less than 5 μm, preferably less than 3 μm, can be easily formed.

  In the conventional method using etching, it was necessary to remove and discard most of the metal thin film by etching, but in the present invention, a pattern containing only a necessary amount of conductive metal is provided on the support. Therefore, it is sufficient to use only the minimum amount of metal, which is advantageous from the viewpoints of reducing the manufacturing cost and the amount of metal waste.

  FIG. 2 shows an example of the conductive film of the present invention. The conductive film 21 shown in FIG. 2 has a conductive functional layer 22 on a support 23. The conductive functional layer 22 contains a silver halide emulsion layer 28. For example, by performing exposure / development processing or the like on the exposed portion 24, a metallic silver portion can be formed, and in order to further increase the conductivity, the conductive metal portion can be formed by performing electrolytic plating. As an example, there is an aspect in which Cu is electroplated on the electroplating treatment portion 26 and Ni is electroplating on the electroplating treatment portion 27. The unexposed portion 25 becomes a light transmissive portion (for example, one made of gelatin).

[Easily adhesive layer]
The preferable easily bonding layer of this invention is demonstrated. The easy adhesion layer may be composed of one layer, or may be composed of two or more layers.
In the present invention, it is preferable that an easy-adhesion layer having the following two-layer structure is provided on the surface of the support on which the metallic silver portion is not provided.
(composition)
First layer: Antistatic layer with water-dispersible or water-soluble synthetic resin, carbodiimide compound and conductive metal oxide particles as essential components Second layer: Water-dispersible or water-soluble synthetic resin, and cross-linking agent as essential components Surface layer (It is not the surface layer when laminated with other constituent layers, but it means the top layer of the easy-adhesion layer)
The easy adhesion layer is provided with an antistatic layer and a surface layer in this order on a support. In the antistatic layer in the present invention, the haze of the low chargeable support obtained by providing the antistatic layer on the support is 3% or less, and the surface electrical resistance of the surface layer of the resulting light-sensitive material is 8 ×. Conductivity is imparted so as to be in the range of 10 ^{6 to} 6 × 10 ⁸ Ω. By providing the antistatic layer, it is possible to suppress the occurrence of trouble with dust caused by static electricity and the occurrence of static discharge fogging of the photosensitive material in the manufacturing process for handling the plastic support.
In addition, the haze as used herein is a value measured according to JIS K-7105 using a haze meter (NDH2000, manufactured by Nippon Denshoku Co., Ltd.) under measurement conditions of 25 ° C. and 60% RH.

  The antistatic layer is a layer containing conductive metal oxide particles, and generally further contains a binder. The conductive metal oxide particles are preferably acicular particles having a major axis to minor axis ratio (major axis / minor axis) in the range of 3 to 50. In particular, those having a major axis / minor axis in the range of 10 to 50 are preferable. The minor axis of such acicular particles is preferably in the range of 0.001 to 0.1 μm, and particularly preferably in the range of 0.01 to 0.02 μm. The major axis is preferably in the range of 0.1 to 5.0 μm, and particularly preferably in the range of 0.1 to 2.0 μm.

Examples of the material of the conductive metal oxide particles include ZnO, TiO ₂ , SnO ₂ , Al ₂ O ₃ , In ₂ O ₃ , MgO, BaO and MoO _3, and complex oxides thereof, and metal oxides thereof. Further, metal oxides containing different atoms can be given. As the metal oxide, SnO ₂ , ZnO, Al ₂ O ₃ , TiO ₂ , In ₂ O ₃ and MgO are preferable, SnO ₂ , ZnO, In ₂ O ₂ and TiO ₂ are preferable, and SnO ₂ is particularly preferable. . Examples of containing a small amount of different atoms include Zn or Al, In, TiO ₂ Nb or Ta, In ₂ O ₃ Sn, and SnO ₂ Sb, Nb or halogen elements. An element doped with 0.01 to 30 mol% (preferably 0.1 to 10 mol%) of the element can be used. When the amount of the different element added is less than 0.01 mol%, sufficient conductivity cannot be imparted to the oxide or composite oxide. When the amount exceeds 30 mol%, the degree of blackening of the particles increases, and the charge is increased. Since the prevention layer is darkened, it is not suitable for photosensitive materials (hereinafter also referred to as photosensitive materials). Therefore, in the present invention, the material of the conductive metal oxide particles is preferably one containing a small amount of a different element with respect to the metal oxide or the composite metal oxide. Also preferred are those containing an oxygen defect in the crystal structure. As the conductive metal oxide particles containing a small amount of the dissimilar atom, SnO ₂ particles are preferred antimony-doped, SnO ₂ particles are preferred which are particularly doped antimony 0.2-2.0 mol%. Therefore, in the present invention, it is advantageous to use a metal oxide particle such as antimony-doped SnO ₂ having the dimensions of the short axis and the long axis in order to form an antistatic layer that is transparent and has good conductivity. is there. As a result, it is possible to easily obtain a light-sensitive material having a low chargeable support having a haze of 3% or less and having a surface electrical resistance of 8 × 10 ^{6 to} 6 × 10 ⁸ Ω in the surface layer.

About the reason why an antistatic layer which is transparent and has good conductivity can be advantageously formed by using acicular metal oxide particles having the dimensions of the short axis and the long axis (eg, antimony-doped SnO ₂ ). Is considered as follows. In the antistatic layer, the needle-like metal oxide particles extend long in the major axis direction parallel to the surface of the antistatic layer, but the length of the minor axis in the thickness direction of the layer. It only occupies. Since such acicular metal oxide particles are long in the major axis direction as described above, they are easier to contact with each other than ordinary spherical particles, and high conductivity can be obtained even in a small amount. Accordingly, the surface electrical resistance can be reduced without impairing the transparency. Further, in the needle-like metal oxide particles, the minor axis diameter is usually smaller than or substantially the same as the thickness of the antistatic layer and rarely protrudes on the surface. Therefore, it is almost completely covered by the surface layer provided on the antistatic layer. Therefore, there is an advantage that there is almost no occurrence of powder falling, which is the detachment of the protruding portion from the layer, during the transport of the support for preparing the light-sensitive material and during the transport of the light-sensitive material for exposure and development. Furthermore, the change in surface electrical resistance before and after the development of the photosensitive material is extremely small when the above-mentioned acicular metal oxide is used, compared to the relatively large case of spherical particles. It can also be said that the sex is remarkably improved. This is presumed to be because, in the case of spherical particles, the arrangement state changes due to swelling and shrinkage of the film due to the development process, and the number of parts in contact with each other decreases compared to the case of needle-like particles.

  The antistatic layer in the present invention generally contains a binder for dispersing and supporting the conductive metal oxide particles. As a material for the binder, various polymers such as an acrylic resin, a vinyl resin, a polyurethane resin, and a polyester resin can be used. From the viewpoint of preventing powder falling, a cured product of a polymer (preferably an acrylic resin, a vinyl resin, a polyurethane resin, or a polyester resin) and a carbodiimide compound is preferable. In the present invention, from the viewpoint of maintaining a good working environment and preventing air pollution, it is preferable to use either a water-soluble polymer or a carbodiimide compound, or an aqueous dispersion such as an emulsion. Further, the polymer has any group of a methylol group, a hydroxyl group, a carboxyl group, and an amino group so that a crosslinking reaction with the carbodiimide compound is possible. A hydroxyl group and a carboxyl group are preferred, and a carboxyl group is particularly preferred. The content of hydroxyl group or carboxyl group in the polymer is preferably 0.0001 to 1 equivalent / 1 kg, particularly preferably 0.001 to 1 equivalent / 1 kg.

  Acrylic resins include acrylic acid esters such as acrylic acid and alkyl acrylate, acrylamide, acrylonitrile, methacrylic acid esters such as methacrylic acid and alkyl methacrylate, and homopolymers of any monomer of methacrylamide and methacrylonitrile. Or the copolymer obtained by superposition | polymerization of 2 or more types of these monomers can be mentioned. Among these, homopolymers of monomers of acrylic acid esters such as alkyl acrylates and methacrylic acid esters such as alkyl methacrylates, or copolymers obtained by polymerization of two or more of these monomers preferable. For example, mention may be made of homopolymers of monomers of acrylic acid esters and methacrylic acid esters having an alkyl group having 1 to 6 carbon atoms, or copolymers obtained by polymerization of two or more of these monomers. it can. The acrylic resin has the above composition as a main component and, for example, partially uses a monomer having any group of a methylol group, a hydroxyl group, a carboxyl group, and an amino group so that a crosslinking reaction with a carbodiimide compound is possible. The resulting polymer.

  Examples of the vinyl resin include polyvinyl alcohol, acid-modified polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, polyvinyl methyl ether, polyolefin, ethylene / butadiene copolymer, polyvinyl acetate, vinyl chloride / vinyl acetate copolymer, vinyl chloride / ( A meth) acrylic acid ester copolymer and an ethylene / vinyl acetate copolymer (preferably ethylene / vinyl acetate / (meth) acrylic acid ester copolymer) can be mentioned. Among these, polyvinyl alcohol, acid-modified polyvinyl alcohol, polyvinyl polymer, polyolefin, ethylene / butadiene copolymer and ethylene / vinyl acetate copolymer (preferably ethylene / vinyl acetate / acrylic acid ester copolymer). Is preferred. The vinyl resin can be crosslinked with a carbodiimide compound so that, for example, polyvinyl alcohol, acid-modified polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, polyvinyl methyl ether, and polyvinyl acetate leave a vinyl alcohol unit in the polymer. Thus, the polymer having a hydroxyl group is used, and the other polymer is, for example, a crosslinkable polymer by partially using a monomer having any of a methylol group, a hydroxyl group, a carboxyl group, and an amino group.

  Examples of the polyurethane resin include polyhydroxy compounds (eg, ethylene glycol, propylene glycol, glycerin, trimethylolpropane), aliphatic polyester polyols obtained by reaction of polyhydroxy compounds and polybasic acids, polyether polyols (eg, Polyurethane derived from poly (oxypropylene ether) polyol, poly (oxyethylene-propylene ether) polyol), polycarbonate-based polyol, and polyethylene terephthalate polyol, or a mixture thereof and polyisocyanate can be given. In the polyurethane resin, for example, the hydroxyl group remaining unreacted after the reaction between polyol and polyisocyanate can be used as a functional group capable of crosslinking reaction with a carbodiimide compound.

  As the polyester resin, generally used is a polymer obtained by reacting a polyhydroxy compound (eg, ethylene glycol, propylene glycol, glycerin, trimethylolpropane) with a polybasic acid. In the above-mentioned polyester resin, for example, the hydroxyl group and carboxyl group remaining unreacted after the reaction between the polyol and the polybasic acid can be used as a functional group capable of crosslinking reaction with the carbodiimide compound. Of course, a third component having a functional group such as a hydroxyl group may be added.

  Among the above polymers, acrylic resins and polyurethane resins are preferable, and acrylic resins are particularly preferable.

As the carbodiimide compound used in the present invention, a compound having a plurality of carbodiimide structures in the molecule is preferably used.
Polycarbodiimide is usually synthesized by a condensation reaction of organic diisocyanate. Here, the organic group of the organic diisocyanate used for the synthesis of the compound having a plurality of carbodiimide structures in the molecule is not particularly limited, and either aromatic or aliphatic, or a mixed system thereof can be used. An aliphatic system is particularly preferred from the viewpoint of reactivity.
As the synthetic raw material, organic isocyanate, organic diisocyanate, organic triisocyanate and the like are used.
As examples of organic isocyanates, aromatic isocyanates, aliphatic isocyanates, and mixtures thereof can be used.
Specifically, 4,4′-diphenylmethane diisocyanate, 4,4-diphenyldimethylmethane diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, cyclohexane Diisocyanate, xylylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 4,4′-dicyclohexylmethane diisocyanate, 1,3-phenylene diisocyanate, etc. are used. As organic monoisocyanates, isophorone isocyanate, phenyl isocyanate are used. Cyclohexyl isocyanate, butyl isocyanate, naphthyl isocyanate and the like are used.
Moreover, the carbodiimide type compound that can be used in the present invention is also available as a commercial product such as Carbodilite V-02-L2 (trade name: manufactured by Nisshinbo Co., Ltd.).
The carbodiimide compound is preferably added in an amount of 1 to 200% by weight, more preferably 5 to 100% by weight, based on the binder.

  To form the antistatic layer in the present invention, first, for example, a dispersion in which the conductive metal oxide particles are dispersed as they are or in a solvent such as water (including a dispersant and a binder as necessary) An antistatic layer-forming coating solution is prepared by adding and mixing (dispersing as necessary) an aqueous dispersion or aqueous solution containing the binder (eg, polymer, carbodiimide compound and appropriate additive). The antistatic layer is a coating method generally known on the surface of a plastic film such as polyester (the side where no photosensitive layer is provided), such as dip coating, air knife coating, It can be applied by a curtain coating method, a wire bar coating method, a gravure coating method, an extrusion coating method or the like. The plastic film such as polyester to be applied may be any of before sequential biaxial stretching, before simultaneous biaxial stretching, after uniaxial stretching and before re-stretching, or after biaxial stretching. It is preferable that the surface of the plastic support on which the coating solution for forming the antistatic layer is applied in advance with a surface treatment such as an ultraviolet irradiation treatment, a corona discharge treatment, or a glow discharge treatment.

  The layer thickness of the antistatic layer in the present invention is preferably in the range of 0.01 to 1 μm, and more preferably in the range of 0.01 to 0.2 μm. If the coating agent is less than 0.01 μm, it is difficult to uniformly apply the coating agent, and uneven coating tends to occur on the product. If it exceeds 1 μm, the antistatic performance and scratch resistance may be inferior. The conductive metal oxide particles are preferably contained in the antistatic layer in the range of 10 to 1000% by mass with respect to the binder (eg, the total of the polymer and the carbodiimide compound), and more preferably 100 to 500%. A range of mass% is preferred. If it is less than 10% by mass, sufficient antistatic properties cannot be obtained, and if it exceeds 1000% by mass, the haze becomes too high.

  In the present invention, the antistatic layer and the following surface layer can be used in combination with additives such as a matting agent, a surfactant and a slipping agent, if necessary. Examples of the matting agent include particles of oxides such as silicon oxide, aluminum oxide, and magnesium oxide having a particle diameter of 0.001 to 10 μm, and particles of a polymer or a copolymer such as polymethyl methacrylate and polystyrene. Can do. Examples of the surfactant include known anionic surfactants, cationic surfactants, amphoteric surfactants and nonionic surfactants. Examples of the slip agent include natural waxes such as carnauba wax, phosphate esters of higher alcohols having 8 to 22 carbon atoms or amino salts thereof; palmitic acid, stearic acid, behenic acid and esters thereof; and silicone compounds. Can do.

  In the present invention, a surface layer may be provided on the antistatic layer. The surface layer is provided mainly to assist the adhesion imparting with the adhesive layer and the anti-detachment function of the conductive metal oxide particles of the antistatic layer. As the material for the surface layer, various polymers such as acrylic resin, vinyl resin, polyurethane resin, and polyester resin can be generally used, and polymers described as the binder in the antistatic layer are preferable.

The crosslinking agent used for the surface layer is preferably an epoxy compound that does not affect the photosensitive properties of the photosensitive material layer that is contacted when the roll is wound in the manufacturing process.
Examples of the epoxy compound include 1,4-bis (2 ′, 3′-epoxypropyloxy) butane, 1,3,5-triglycidyl isocyanurate, 1,3-diglycidyl-5- (γ-acetoxy-β-oxy Propyl) isosinurate, sorbitol polyglycidyl ethers, polyglycerol polyglycidyl ethers, pentaerythritol polyglycidyl ethers, diglycerol polyglycidyl ether, 1,3,5-triglycidyl (2-hydroxyethyl) isocyanurate, glycerol poly Epoxy compounds such as glycerol ethers and trimethylolpropane polyglycidyl ethers are preferable, and specific examples of commercially available products include Denacol EX-521 and EX-614B (manufactured by Nagase Chemical Industries). Although it is not intended to be limited thereto. In addition, it can be used in combination with other crosslinkable compounds within the range of addition amount that does not affect the photosensitivity, for example, “The Theory of the Photographic Process” 3rd edition (1966) by CEKMeers and THJames, USA Patent Nos. 3316095, 3232264, 3288775, 2732303, 2732303, 3635718, 3323276, 2732316, 2586168, 3103437, 3017280, 2983611, 2725294, Examples thereof include curing agents and the like described in the specifications of Nos. 2,725,295, 3,100,704, 3,091,537, 3,213,313, 3,543,292 and 3,125,449 and British Patents 994869, 1,167,207.
As a typical example, a melamine compound containing at least one of two or more (preferably three or more) methylol groups and an alkoxymethyl group or a condensation polymer thereof, a melamine resin or a melamine urea resin, Mucochloric acid, mucobromic acid, mucofenoxycyclolic acid, mucophenoxypromic acid, formaldehyde, glyoxal, monomethylglioxal, 2,3-dihydroxy-1,4-dioxane, 2,3-dihydroxy-5-methyl-1,4 Aldehyde compounds such as dioxane succinaldehyde, 2,5-dimethoxytetrahydrofuran and glutaraldehyde and derivatives thereof; divinylsulfone-N, N′-ethylenebis (vinylsulfonylacetamide), 1,3-bis (vinylsulfonyl) -2 - Lopanol, methylene bismaleimide, 5-acetyl-1,3-diaacryloyl-hexahydro-s-triazine, 1,3,5-triacryloyl-hesahydro-s-triazine and 1,3,5-trivinylsulfonyl-hexahydro- active vinyl compounds such as s-triazine; 2,4-dichloro-6-hydroxy-s-triazine sodium salt, 2,4-dichloro-6- (4-sulfoanilino) -s-triazine sodium salt, 2,4- Active halogen compounds such as dichloro-6- (2-sulfoethylamino) -s-triazine and N, N′-bis (2-chloroethylcarbamyl) piperazine; bis (2,3-epoxypropyl) methylpropylammonium P-toluenesulfonate, 2,4,6-triethylene-s-triazine, 1, Ethyleneimine compounds such as 6-hexamethylene-N, N′-bisethyleneurea and bis-β-ethyleneiminoethylthioether; 1,2-di (methanesulfoneoxy) ethane, 1,4-di (methanesulfoneoxy) ) Methanesulfonic acid ester compounds such as butane and 1,5-di (methanesulfonoxy) pentane; carbodiimide compounds such as dicyclohexylcarbodiimide and 1-dicyclohexyl-3- (3-trimethylaminopropyl) carbodiimide hydrochloride; 2,5 -Isoxazole compounds such as dimethylisoxazole; inorganic compounds such as chromium alum and chromium acetate; N-carboethoxy-2-isopropoxy-1,2-dihydroquinoline and N- (1-morpholinocarboxy) -4 -Removal of methylpyridium chloride, etc. Condensation type peptide reagents; active ester compounds such as N, N′-adipoyldioxydisuccinimide and N, N′-terephthaloyldioxydisuccinimide: toluene-2,4-diisocyanate and 1,6-hexa Examples thereof include, but are not limited to, isocyanates such as methylene diisocyanate; and epichlorohydrin compounds such as polyamide-polyamine-epichlorohydrin reactant.

  For the formation of the surface layer, first, the polymer, epoxy compound, and appropriate additive are added to a solvent such as water (including a dispersant and a binder as necessary) and mixed (dispersed if necessary). To prepare a surface layer coating solution.

  The surface layer is formed on the antistatic layer in the present invention by a generally well-known coating method such as dip coating, air knife coating, curtain coating, wire bar coating, gravure coating, and extrusion coating. It can form by apply | coating the said surface layer coating liquid. The layer thickness of the surface layer is preferably in the range of 0.01 to 1 μm, and more preferably in the range of 0.01 to 0.2 μm. If it is less than 0.01 μm, the anti-detachment function of the conductive metal oxide particles of the antistatic layer is insufficient, and if it exceeds 1 μm, it is difficult to uniformly apply the coating agent, and uneven coating tends to occur on the product.

[Adhesive layer]
The adhesive layer preferably used in the present invention will be described.
The translucent electromagnetic shielding film of the present invention is bonded via an adhesive layer when incorporated in an optical filter, a liquid crystal display panel, a plasma display panel, other image display panels, or the like.

  The refractive index of the adhesive used in the present invention is preferably 1.40 to 1.70. This is because the difference between the support of the plastic film or the like used in the present invention and the refractive index of the adhesive is reduced to prevent the visible light transmittance from being lowered. When it is 40 to 1.70, the decrease in visible light transmittance is small and good.

The adhesive used in the present invention is preferably an adhesive that flows by heating or pressurization, and in particular, fluidity by heating at 200 ° C. or less or pressurization at 1 kgf / cm ² (0.098 MPa) or more. It is preferable that it is an adhesive which shows. Since it can flow, a translucent electromagnetic wave shielding film (electromagnetic wave shielding adhesive film) provided with an adhesive layer can be bonded to an adherend by lamination or pressure molding, particularly pressure molding. Further, it can be easily bonded to an adherend having a curved surface or a complicated shape. For this purpose, the softening temperature of the adhesive is preferably 200 ° C. or lower. Since the environment in which the electromagnetic wave shielding adhesive film is used is usually less than 80 ° C., the softening temperature of the adhesive layer is preferably 80 ° C. or higher, and most preferably 80 to 120 ° C. in view of workability. The softening temperature is a temperature at which the viscosity becomes 10 ¹² poises or less, and normally, the flow is recognized within a time of about 1 to 10 seconds at that temperature.

  Typical examples of the adhesive that flows by heating or pressurization as described above include the following thermoplastic resins. For example, natural rubber (refractive index n = 1.52), polyisoprene (n = 1.521), poly-1,2-butadiene (n = 1.50), polyisobutene (n = 1.505 to 1.51), polybutene (n = 1.513), poly- Such as 2-heptyl-1,3-butadiene (n = 1.50), poly-2-tert-butyl-1,3-butadiene (n = 1.506), poly-1,3-butadiene (n = 1.515) ) Polyenes such as ene, polyoxyethylene (n = 1.456), polyoxypropylene (n = 1.450), polyvinyl ethyl ether (n = 1.454), polyvinyl hexyl ether (n = 1.459), polyvinyl butyl ether (n = 1.456) Ethers, polyesters such as polyvinyl acetate (n = 1.467), polyvinyl propionate (n = 1.467), polyurethane (n = 1.5 to 1.6), ethyl cellulose (n = 1.479), polyvinyl chloride (n = 1.54 to 1.55) ), Polyacrylonitrile (n = 1.52), polymethacrylonitrile (n = 1.52), polysulfone (n = 1.633), polysulfide (n = 1.6), phenoxy resin (n = 1.5 to 1.6), polyethyl acrylate (n = 1.469), polybutyl acrylate (n = 1.466), poly-2-ethylhexyl acrylate (n = 1.463) , Poly-t-butyl acrylate (n = 1.464), poly-3-ethoxypropyl acrylate (n = 1.465), polyoxycarbonyltetramethylene (n = 1.465), polymethyl acrylate (n = 1.472-1.480), polyisopropyl Methacrylate (n = 1.473), polydodecyl methacrylate (n = 1.474), polytetradecyl methacrylate (n = 1.475), poly-n-propyl methacrylate (n = 1.484), poly-3,3,5-trimethylcyclohexyl methacrylate ( n = 1.484), polyethyl methacrylate (n = 1.485), poly-2-nitro-2-methylpropyl methacrylate (n = 1.487), poly-1,1-diethylpropyl methacrylate (n = 1.485). 489) and poly (meth) acrylic acid esters such as polymethyl methacrylate (n = 1.489) can be used. Two or more kinds of these acrylic polymers may be copolymerized as needed, or two or more kinds may be blended and used.

  Further, copolymer resins other than acrylic resin and other than acrylic include epoxy acrylate (n = 1.48 to 1.60), urethane acrylate (n = 1.5 to 1.6), polyether acrylate (n = 1.48 to 1.49), polyester acrylate (n = 1.48 ~ 1.54) can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of adhesiveness. As the epoxy acrylate, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, resorcinol (Meth) acrylic such as diglycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether An acid adduct is mentioned. A polymer having a hydroxyl group in the molecule such as epoxy acrylate is effective for improving the adhesion. These copolymer resins can be used in combination of two or more as required. The softening temperature of the polymer used as these adhesives is preferably 200 ° C. or less, and more preferably 150 ° C. or less from the viewpoint of handleability. Since the environment in which the electromagnetic wave shielding adhesive film is used is usually 80 ° C. or lower, the softening temperature of the adhesive layer is most preferably 80 to 120 ° C. in view of processability. On the other hand, it is preferable to use a polymer having a mass average molecular weight (measured using a standard polystyrene calibration curve by gel permeation chromatography, the same applies hereinafter) of 500 or more. When the molecular weight is 500 or less, the cohesive force of the adhesive composition is too low, and the adhesion to the adherend may be reduced. You may mix | blend additives, such as a diluent, a plasticizer, antioxidant, a filler, a coloring agent, a ultraviolet absorber, and a tackifier, with the adhesive agent used by this invention as needed. The thickness of the adhesive layer is preferably 10 to 80 μm, and more preferably 20 to 50 μm, more than the thickness of the conductive layer.

Further, the adhesive used preferably in the present invention has a refractive index difference of 0.14 or less between the support and the easy-adhesion layer. By satisfying this difference in refractive index, the visible light transmittance is hardly lowered and becomes favorable. Adhesive materials satisfying such requirements include bisphenol A type epoxy resin, bisphenol F type epoxy resin, tetrahydroxyphenylmethane type epoxy resin, and novolac when the support is polyethylene terephthalate (n = 1.575; refractive index). Type epoxy resin, resorcinol type epoxy resin, polyalcohol / polyglycol type epoxy resin, polyolefin type epoxy resin, epoxy resin such as alicyclic or halogenated bisphenol (all having a refractive index of 1.55 to 1.60) can be used. Other than epoxy resins, natural rubber (n = 1.52), polyisoprene (n = 1.521), poly 1,2-butadiene (n = 1.50), polyisobutene (n = 1.505 to 1.51), polybutene (n = 1.5125), poly- Such as 2-heptyl-1,3-butadiene (n = 1.50), poly-2-tert-butyl-1,3-butadiene (n = 1.506), poly-1,3-butadiene (n = 1.515) ) Polyenes such as ene, polyoxyethylene (n = 1.4563), polyoxypropylene (n = 1.4495), polyvinyl ethyl ether (n = 1.454), polyvinyl hexyl ether (n = 1.4591), polyvinyl butyl ether (n = 1.4563) Ethers, polyesters such as polyvinyl acetate (n = 1.4665), polyvinyl propionate (n = 1.4665), polyurethane (n = 1.5 to 1.6), ethyl cellulose (n = 1.479), polyvinyl chloride (n = 1.5 4-1.55), polyacrylonitrile (n = 1.52), polymethacrylonitrile (n = 1.52), polysulfone (n = 1.633), polysulfide (n = 1.6), phenoxy resin (n = 1.5-1.6), etc. Can do.
These express suitable visible light transmittance.

  In addition, acrylic resins are well known as those that hardly change color over time, and are preferably used in the present invention. Examples include polyethyl acrylate (n = 1.4685), polybutyl acrylate (n = 1.466), poly-2-ethylhexyl acrylate (n = 1.463), poly-t-butyl acrylate (n = 1.4638), poly-3- Ethoxypropyl acrylate (n = 1.465), polyoxycarbonyltetramethacrylate (n = 1.465), polymethyl acrylate (n = 1.472 to 1.480), polyisopropyl methacrylate (n = 1.4728), polydodecyl methacrylate (n = 1.474), poly Tetradecyl methacrylate (n = 1.4746), poly-n-propyl methacrylate (n = 1.484), poly-3,3,5-trimethylcyclohexyl methacrylate (n = 1.484), polyethyl methacrylate (n = 1.485), poly-2 -Nitro-2-methylpropyl methacrylate (n = 1.4868), polytetracarbanyl Poly (meth) acrylic acid esters such as acrylate (n = 1.4889), poly-1,1-diethylpropyl methacrylate (n = 1.4889), polymethyl methacrylate (n = 1.4893), acrylic acid and methacrylic acid can be used. It is. Two or more kinds of these acrylic polymers may be copolymerized as necessary, or two or more kinds may be blended and used. By blending a plurality of types of acrylic polymers having different molecular weights, it is possible to adjust the viscoelasticity of the adhesive to a desired property.

  Furthermore, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate, or the like can also be used as a copolymer resin other than an acrylic resin and an acrylic compound. In particular, epoxy acrylate and polyether acrylate are excellent from the viewpoint of adhesiveness. As the epoxy acrylate, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, resorcinol diglycidyl ether (Meth) acrylic acid adducts such as adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether Is mentioned. Epoxy acrylate has a hydroxyl group in the molecule and is effective in improving adhesiveness, and these copolymer resins can be used in combination of two or more as required. The polymer used as the main component of the adhesive has a mass average molecular weight of 1,000 or more. When the molecular weight is 1,000 or less, the cohesive force of the composition is too low, so that the adhesion to the adherend is lowered.

  Adhesive curing agents include amines such as triethylenetetramine, xylenediamine, and diaminodiphenylmethane, acid anhydrides such as phthalic anhydride, maleic anhydride, dodecyl succinic anhydride, pyromellitic anhydride, and benzophenone tetracarboxylic anhydride, Diaminodiphenyl sulfone, tris (dimethylaminomethyl) phenol, polyamide resin, dicyandiamide, ethylmethylimidazole and the like can be used. These may be used alone or in combination of two or more. The addition amount of these crosslinking agents is selected in the range of 0.1 to 50 parts by mass, preferably 1 to 30 parts by mass with respect to 100 parts by mass of the polymer. If the added amount is less than 0.1 parts by mass, curing may be insufficient, and if it exceeds 50 parts by mass, excessive crosslinking may occur, which may adversely affect adhesiveness. You may mix | blend additives, such as a diluent, a plasticizer, antioxidant, a filler, and a tackifier, with the resin composition of the adhesive agent used by this invention as needed. The adhesive resin composition is applied to cover a part or the whole of the metallic silver portion on the surface of the support, followed by solvent drying and heat-curing steps, and then applied to the electromagnetic shielding adhesive film. To do. The electromagnetic wave shielding adhesive film having the electromagnetic shielding properties and transparency obtained above can be directly attached to a display such as a CRT, PDP, liquid crystal, EL, or a plate or sheet such as an acrylic plate or a glass plate. Paste to and use for display. Moreover, this electromagnetic wave shielding adhesive film is used in the same manner as described above for a window or a case for looking inside a measuring device, measuring device or manufacturing device that generates electromagnetic waves. Furthermore, it is provided in a window of a building or a window of an automobile that may be affected by an electromagnetic wave interference by a radio tower or a high voltage line. And it is preferable to provide a ground wire in a metal silver part.

  Even when the support has irregularities and has haze to scatter light, the diffuse reflection is minimal when a resin with a refractive index close to that of the support is applied to the uneven surface or when the resin sheet is laminated. It is suppressed to the limit, and transparency is developed. Moreover, since the metal silver part of this invention has a very small line width, it is not visually recognized with the naked eye. Moreover, since the pitch is sufficiently large, it is considered that apparent transparency is expressed. On the other hand, since the pitch is sufficiently smaller than the wavelength of the electromagnetic wave to be shielded, it is considered that excellent shielding properties are exhibited.

  In general, since the surface of the display is made of glass, bonding with an adhesive is a bonding between a support and a glass plate. If bubbles are generated or peeling occurs on the bonding surface, an image is displayed. Distorted or the display color looks different from the original display. Further, the problem of bubbles and peeling occurs in any case when the adhesive peels off from the support or the glass plate. This phenomenon may occur on both the support side and the glass plate side, and peeling occurs on the side with a weaker adhesion. Accordingly, it is necessary that the adhesive force between the adhesive at high temperature, the support, and the glass plate is high. Specifically, the adhesion between the support and the glass plate and the adhesive layer is preferably 10 g / cm (10 N / m) or more at 80 ° C. in a test method in conformity with ISO 8225. It is more preferably 20 g / cm (20 N / m) or more, and particularly preferably 30 g / cm (30 N / m) or more. However, an adhesive exceeding 2000 g / cm (2 kN / m) may not be preferable because the bonding operation becomes difficult. However, if this problem does not occur, it can be used without problems. Furthermore, it is also possible to provide an interleaving paper (separator) on the portion of the adhesive not facing the support so that it does not unnecessarily touch other portions.

  The adhesive is preferably transparent. Specifically, the total light transmittance is preferably 70% or more, more preferably 80% or more, and most preferably 85 to 92%. Furthermore, it is preferable that the degree of purity is low. Specifically, 0 to 3% is preferable, and 0 to 1.5% is more preferable. The adhesive used in the present invention is preferably colorless so as not to change the original display color of the display. However, even if the resin itself is colored, it can be considered substantially colorless if the adhesive is thin. Similarly, when intentionally coloring as described later, it is not within this range.

  Examples of the adhesive having the above characteristics include acrylic resins, α-olefin resins, vinyl acetate resins, acrylic copolymer resins, urethane resins, epoxy resins, vinylidene chloride resins, vinyl chloride resins, Examples thereof include ethylene-vinyl acetate resin, polyamide resin, and polyester resin. Of these, acrylic resins are preferred. Even when the same resin is used, the adhesiveness can be reduced by reducing the addition amount of the crosslinking agent, adding a tackifier, or changing the end group of the molecule when synthesizing the adhesive by the polymerization method. It is also possible to improve. Even when the same adhesive is used, it is possible to improve adhesion by modifying the surface to which the adhesive is bonded, that is, the surface of the support or the glass plate. Examples of such surface modification methods include physical methods such as corona discharge treatment and plasma glow treatment, and methods such as forming an underlayer for improving adhesion.

  From the viewpoint of transparency, colorlessness, and handling properties, the thickness of the adhesive layer is preferably about 5 to 50 μm. In the case where the adhesive layer is formed of an adhesive, the thickness may be reduced within the above range. Specifically, it is about 1 to 20 μm. However, when the display color of the display itself is not changed as described above and the transparency is within the above range, the thickness may exceed the above range.

(Peel strength)
The adhesion strength between the translucent electromagnetic wave shielding film of the present invention and the glass substrate is preferably as follows.
When a peel strength is measured by sticking a film sample on glass and pulling it in a direction of 180 ° with respect to the joint surface at a pulling speed of 100 mm / min, the peel strength is preferably 20 N / m or more. Furthermore, it is preferable that the peel strength after aging for 72 hours at a temperature of 60 ° C. and a relative humidity of 90% is a peel strength of 20 N / m or more.

[Method for producing translucent electromagnetic wave shielding film]
The translucent electromagnetic wave shielding film of the present invention preferably exposes a photosensitive material having an emulsion layer containing a photosensitive silver halide salt on a support, and develops the exposed portion and unexposed portion, Each is obtained by forming a metallic silver portion and a light transmitting portion. Furthermore, a conductive metal may be supported on the metallic silver portion by subjecting the metallic silver portion to physical development and / or plating treatment as necessary. In the following description of the present invention, it is mainly explained that a photosensitive material having an emulsion layer containing a photosensitive silver halide salt is exposed on a support and subjected to development processing. However, a photopolymer for photolithography is applied. A shield film can also be produced for the processed photosensitive material.
The method for forming a translucent electromagnetic wave shielding film of the present invention includes the following three forms depending on the photosensitive material and the form of development processing.
(I) A method in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material. (II) Physical development nuclei are contained in a silver halide emulsion layer. (III) Photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei and physical development nuclei A method of superimposing an image receiving sheet having a non-photosensitive layer containing, and performing diffusion transfer development to form a metallic silver portion on the non-photosensitive image receiving sheet The aspect (I) is an integrated black-and-white development type, Metallic silver is formed on the material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the embodiment (II), silver halide grains close to the physical development nucleus are dissolved and deposited on the development nucleus in the exposed portion, whereby metallic silver is formed on the photosensitive material. This is also an integrated black-and-white development type. Although the developing action is precipitation on physical development nuclei, it is highly active, but developed silver has a spherical shape with a small specific surface.
In the embodiment (III), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby metallic silver is formed on the image receiving sheet. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.
In any embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer system, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .
The chemical development, thermal development, and dissolution physical development referred to here have the same meanings as are commonly used in this field. For example, Shinichi Kikuchi “Photochemistry” (Kyoritsu Publishing Co., Ltd., 1955) Publication), C.I. E. K. It is described in “The Theory of Photographic Processes, 4th edition” edited by Mees (Mcmillan, 1977). Although this case is a liquid processing, a thermal development method is also applied as a development method for other applications. For example, Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, 2005-010752, Japanese Patent Application Nos. 2004-244080, and 2004-085655 can be applied.
Hereinafter, the photosensitive material and each of the above steps will be described.

(1) Photosensitive material (1-1) Support As the support of the photosensitive material used in the production method of the present invention, a plastic film, a plastic plate, a glass plate, or the like can be used.
Examples of the raw material for the plastic film and plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, EVA; polyvinyl chloride, Vinyl resins such as polyvinylidene chloride; polyether ether ketone (PEEK), polysulfone (PSF), polyether sulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC) Etc. can be used.
In the present invention, the plastic film is preferably a polyethylene terephthalate film or triacetyl cellulose (TAC) from the viewpoints of transparency, heat resistance, ease of handling, and price.

Since the electromagnetic wave shielding material for display requires transparency, it is desirable that the support has high transparency. In this case, the total visible light transmittance of the plastic film or plastic plate is preferably 70 to 100%, more preferably 85 to 100%, and particularly preferably 90 to 100%. Moreover, in this invention, what was colored to such an extent that the objective of this invention is not disturbed can also be used as the said plastic film and a plastic board.
The plastic film and plastic plate in the present invention can be used as a single layer, but can also be used as a multilayer film in which two or more layers are combined.

  When a glass plate is used as the support in the present invention, the type thereof is not particularly limited. However, when used as an application for an electromagnetic wave shielding film for a display, it is preferable to use tempered glass having a tempered layer on the surface. There is a high possibility that tempered glass can prevent damage compared to glass that has not been tempered. Furthermore, the tempered glass obtained by the air cooling method is preferable from the viewpoint of safety because even if it is broken, the crushed pieces are small and the end face is not sharp.

(1-2) Protective layer The photosensitive material used may be provided with a protective layer on the emulsion layer described below. In the present invention, the “protective layer” means a layer made of a binder such as gelatin or a polymer material, and is formed in a photosensitive emulsion layer in order to exhibit an effect of preventing scratches and improving mechanical properties. The protective layer is preferably not provided for the plating treatment, and even if it is provided, it is preferably thin. The thickness is preferably 0.2 μm or less. The formation method of the said protective layer is not specifically limited, A well-known coating method can be selected suitably.

(1-3) Emulsion Layer The photosensitive material used in the production method of the present invention preferably has an emulsion layer (silver salt-containing layer) containing a silver salt as an optical sensor on the support. The emulsion layer in the present invention may contain a dye, a binder, a solvent and the like as required in addition to the silver salt.
<Dye>
The light-sensitive material may contain a dye at least in the emulsion layer. The dye is contained in the emulsion layer as a filter dye or for various purposes such as prevention of irradiation. The dye may contain a solid disperse dye. Examples of the dye preferably used in the present invention include dyes represented by general formula (FA), general formula (FA1), general formula (FA2), and general formula (FA3) described in JP-A-9-179243. Specifically, compounds F1 to F34 described in the publication are preferable. Further, (II-2) to (II-24) described in JP-A-7-152112, (III-5) to (III-18) described in JP-A-7-152112, and JP-A-7-152112. (IV-2) to (IV-7) described in the publication are also preferably used.

  In addition, examples of the dye that can be used in the present invention include cyanine dyes, pyrylium dyes, and aminium dyes described in JP-A-3-138640 as dyes in the form of solid fine particles that are decolored during development or fixing. It is done. Further, as dyes that do not decolorize during processing, cyanine dyes having a carboxyl group described in JP-A-9-96891, cyanine dyes not containing an acidic group described in JP-A-8-245902, and those described in JP-A-8-333519 Lake type cyanine dyes, cyanine dyes described in JP-A-1-266536, horopora-type cyanine dyes described in JP-A-3-136638, pyrylium dyes described in JP-A-62-299959, JP-A-7-253039 Polymer type cyanine dyes described in JP-A No. 2-282244, solid fine particle dispersions described in JP-A No. 2-282244, light scattering particles described in JP-A No. 63-131135, Yb3 + compounds described in JP-A No. 9-5913 And ITO powder described in JP-A-7-113072. .

  Moreover, as said dye, a water-soluble dye can also be contained. Such water-soluble dyes include oxonol dyes, benzylidene dyes, merocyanine dyes, cyanine dyes and azo dyes. Of these, oxonol dyes, hemioxonol dyes and benzylidene dyes are particularly useful in the present invention. Specific examples of water-soluble dyes that can be used in the present invention include British Patent Nos. 584,609, 1,177,429, JP-A-48-85130, 49-99620, No. 49-114420, No. 52-20822, No. 59-154439, No. 59-208548, US Pat. No. 2,274,782, No. 2,533,472, No. 2 No. 3,956,879, No. 3,148,187, No. 3,177,078, No. 3,247,127, No. 3,540,887, No. 3 , 575,704 specification, 3,653,905 specification, and 3,718,427 specification.

  The content of the dye in the emulsion layer is preferably 0.01 to 10% by mass with respect to the total solid content, from the viewpoint of preventing irradiation and the like, and from the viewpoint of lowering sensitivity due to an increase in the amount added. More preferred is mass%.

<Silver salt>
Examples of the silver salt used in the present invention include inorganic silver salts such as silver halide. In the present invention, it is preferable to use silver halide having excellent characteristics as an optical sensor.

The silver halide preferably used in the present invention will be described.
In the present invention, it is preferable to use silver halide in order to function as an optical sensor, and silver halide photographic film and photographic paper relating to silver halide, printing plate-making film, emulsion mask for photomask, etc. It can also be used in the present invention.

  The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. For example, silver halide mainly composed of AgCl, AgBr, and AgI is preferably used, and silver halide mainly composed of AgBr or AgCl is preferably used. Silver chlorobromide, silver iodochlorobromide and silver iodobromide are also preferably used. More preferred are silver chlorobromide, silver bromide, silver iodochlorobromide and silver iodobromide, and most preferred are silver chlorobromide and silver iodochlorobromide containing 50 mol% or more of silver chloride. Used.

  Here, “silver halide mainly composed of AgBr (silver bromide)” refers to silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more. The silver halide grains mainly composed of AgBr may contain iodide ions and chloride ions in addition to bromide ions.

Silver halide is in the form of solid grains. From the viewpoint of image quality of the patterned metallic silver layer formed after exposure and development, the average grain size of silver halide is 0.1 to 1000 nm in terms of sphere equivalent diameter ( 1 μm) is preferred, 0.1 to 100 nm is more preferred, and 1 to 50 nm is even more preferred.
Incidentally, the sphere equivalent diameter of silver halide grains is the diameter of grains having the same volume and a spherical shape.

The shape of the silver halide grains is not particularly limited, and may be various shapes such as a spherical shape, a cubic shape, a flat plate shape (hexagonal flat plate shape, triangular flat plate shape, tetragonal flat plate shape, etc.), octahedron shape, and tetrahedron shape. There can be a cube and a tetrahedron.
The silver halide grains may be composed of a uniform phase or a different surface layer. Moreover, you may have the localized layer from which a halogen composition differs in a particle | grain inside or the surface.

  The silver halide emulsion, which is a coating solution for the emulsion layer used in the present invention, is Chimie et Physique Photographique (Paul Montel, 1967) by P. Glafkides, Photographic Emulsion Chemistry (The Forcal Press, 1966) by GF Dufin. , VLZelikman et al., Making and Coating Photographic Emulsion (published by The ForcalPress, 1964) and the like.

That is, as a method for preparing the silver halide emulsion, either an acidic method, a neutral method, or the like may be used. Also, as a method of reacting a soluble silver salt and a soluble halogen salt, a one-side mixing method, a simultaneous mixing method, Any combination of them may be used.
As a method for forming silver particles, a method of forming particles in the presence of excess silver ions (so-called back mixing method) can also be used. Furthermore, as one type of the simultaneous mixing method, a method of keeping pAg in a liquid phase where silver halide is generated, that is, a so-called controlled double jet method can be used.
It is also preferable to form grains using a so-called silver halide solvent such as ammonia, thioether or tetrasubstituted thiourea. As such a method, a tetrasubstituted thiourea compound is more preferable, which is described in JP-A Nos. 53-82408 and 55-77737. Preferred thiourea compounds include tetramethylthiourea, 1,3-dimethyl-2-imidazolidinethione and the like. The addition amount of the silver halide solvent varies depending on the type of compound used, the target grain size, and the halogen composition, but is preferably 10 ⁻⁵ to 10 ⁻² mol per mol of silver halide.

In the controlled double jet method and the grain forming method using a silver halide solvent, it is easy to prepare a silver halide emulsion having a regular crystal type and a narrow grain size distribution, and is preferably used in the present invention. it can.
Further, in order to make the grain size uniform, as described in British Patent No. 1,535,016, Japanese Patent Publication No. 48-36890, No. 52-16364, silver nitrate or halogenated A method of changing the alkali addition rate according to the particle growth rate, or a method of changing the concentration of the aqueous solution as described in British Patent No. 4,242,445 and JP-A-55-158124 It is preferable to grow silver quickly in a range not exceeding the critical saturation. The silver halide emulsion used for forming the emulsion layer in the present invention is preferably a monodispersed emulsion, and the coefficient of variation represented by {(standard deviation of grain size) / (average grain size)} × 100 is 20% or less, and more. It is preferably 15% or less, and most preferably 10% or less.

  The silver halide emulsion used in the present invention may be a mixture of a plurality of types of silver halide emulsions having different grain sizes.

The silver halide emulsion used in the present invention may contain a metal element belonging to Group VIII or VIIB of the periodic table. In particular, in order to achieve high contrast and low fog, it is preferable to contain a rhodium compound, an iridium compound, a ruthenium compound, an iron compound, an osmium compound, or the like. These compounds may be compounds having various ligands. Examples of ligands include pseudohalogen ligands such as cyanide ions, halogen ions, thiocyanate ions, nitrosyl ions, water, hydroxide ions, In addition to ammonia, organic molecules such as amines (methylamine, ethylenediamine, etc.), heterocyclic compounds (imidazole, thiazole, 5-methylthiazole, mercaptoimidazole, etc.), urea, and thiourea can be mentioned.
For high sensitivity, doping with a metal hexacyanide complex such as K ₄ [Fe (CN) ₆ ], K ₄ [Ru (CN) ₆ ] or K ₃ [Cr (CN) ₆ ] is advantageous. Done.

A water-soluble rhodium compound can be used as the rhodium compound. Examples of the water-soluble rhodium compound include a rhodium halide (III) compound, a hexachlororhodium (III) complex salt, a pentachloroacorodium complex salt, a tetrachlorodiacolodium complex salt, a hexabromorhodium (III) complex salt, and a hexaamine rhodium (III). ) Complex salt, trizalatodium (III) complex salt, K ₃ Rh ₂ Br _{9 and the} like.
These rhodium compounds are used by dissolving in water or a suitable solvent, and are generally used in order to stabilize the rhodium compound solution, that is, an aqueous hydrogen halide solution (for example, hydrochloric acid, odorous acid, hydrofluoric acid). Or a method of adding an alkali halide (for example, KCl, NaCl, KBr, NaBr, etc.) can be used. Instead of using water-soluble rhodium, it is also possible to add another silver halide grain previously doped with rhodium and dissolve it at the time of silver halide preparation.

Examples of the iridium compound include hexachloroiridium complex salts such as K ₂ IrCl ₆ and K ₃ IrCl ₆ , hexabromoiridium complex salts, hexaammineiridium complex salts, and pentachloronitrosyliridium complex salts.
Examples of the ruthenium compound include hexachlororuthenium, pentachloronitrosylruthenium, K ₄ [Ru (CN) ₆ ] and the like.
Examples of the iron compound include potassium hexacyanoferrate (II) and ferrous thiocyanate.

The ruthenium compound and the osmium compound are added in the form of a water-soluble complex salt described in JP-A-63-2042, JP-A-1-285941, JP-A-2-20852, JP-A-2-20855, and the like. Particularly preferred is a hexacoordination complex represented by the following formula.
[ML ₆ ] ^-n
(Here, M represents Ru or Os, and n represents 0, 1, 2, 3 or 4.)
In this case, the counter ion is not important, and for example, ammonium or alkali metal ions are used. Preferred ligands include halide ligands, cyanide ligands, cyanide oxide ligands, nitrosyl ligands, thionitrosyl ligands, and the like. Although the example of the specific complex used for this invention below is shown, this invention is not limited to this.

[RuCl ₆ ] ⁻³ , [RuCl ₄ (H ₂ O) ₂ ] ⁻¹ , [RuCl ₅ (NO)] ⁻² , [RuBr ₅ (NS)] ⁻² , [Ru (CO) ₃ Cl ₃ ] ^{− 2} , [Ru (CO) Cl ₅ ] ⁻² , [Ru (CO) Br ₅ ] ⁻² , [OsCl ₆ ] ⁻³ , [OsCl ₅ (NO)] ⁻² , [Os (NO) (CN) ₅ ] ^-2, [Os (NS) Br _5] ^-2, [Os (CN) _6] ^-4, _{[Os (O) 2 (CN)} 5 ] ^-4.

The amount of these compounds added is preferably 10 ⁻¹⁰ to 10 ⁻² mol / mol Ag per mol of silver halide, more preferably 10 ⁻⁹ to 10 ⁻³ mol / mol Ag.

In addition, in the present invention, silver halides containing Pd (II) ions and / or Pd elements can also be preferably used. Pd may be uniformly distributed in the silver halide grains, but is preferably contained in the vicinity of the surface layer of the silver halide grains. Here, Pd “contains in the vicinity of the surface layer of the silver halide grains” means that the Pd content is higher than the other layers within 50 nm in the depth direction from the surface of the silver halide grains. means. Such silver halide grains can be prepared by adding Pd in the course of forming silver halide grains. After adding silver ions and halogen ions to 50% or more of the total addition amount, Pd Is preferably added. It is also preferred that Pd (II) ions be present in the surface layer of the silver halide by a method such as addition at the time of post-ripening.
The Pd-containing silver halide grains increase the speed of physical development and electroless plating, increase the production efficiency of a desired electromagnetic shielding material, and contribute to the reduction of production costs. Pd is well known and used as an electroless plating catalyst. However, in the present invention, Pd can be unevenly distributed on the surface layer of silver halide grains, so that extremely expensive Pd can be saved. is there.

In the present invention, the content of Pd ions and / or Pd metal elements contained in silver halide is 10 ^{−4 to} 0.5 mol / mol Ag with respect to the number of moles of silver in the silver halide. Preferably, it is 0.01-0.3 mol / mol Ag.
Examples of the Pd compound to be used include PdCl ₄ and Na ₂ PdCl ₄ .

  In the present invention, in order to further improve the sensitivity as an optical sensor, chemical sensitization performed with a photographic emulsion can be performed. As the chemical sensitization method, sulfur sensitization, selenium sensitization, chalcogen sensitization such as tellurium sensitization, noble metal sensitization such as gold sensitization, reduction sensitization and the like can be used. These are used alone or in combination. When the above chemical sensitization methods are used in combination, for example, sulfur sensitization method and gold sensitization method, sulfur sensitization method and selenium sensitization method and gold sensitization method, sulfur sensitization method and tellurium sensitization. A combination of a method and a gold sensitization method is preferable.

The sulfur sensitization is usually performed by adding a sulfur sensitizer and stirring the emulsion at a high temperature of 40 ° C. or higher for a predetermined time. As the sulfur sensitizer, known compounds can be used. For example, in addition to sulfur compounds contained in gelatin, various sulfur compounds such as thiosulfates, thioureas, thiazoles, rhodanines, etc. Can be used. Preferred sulfur compounds are thiosulfate and thiourea compounds. The amount of sulfur sensitizer added varies under various conditions such as pH during chemical ripening, temperature, and the size of silver halide grains, and is 10 ⁻⁷ to 10 ⁻² mol per mol of silver halide. It is preferably 10 ⁻⁵ to 10 ⁻³ mol.

  A known selenium compound can be used as the selenium sensitizer used for the selenium sensitization. That is, the selenium sensitization is usually carried out by adding unstable and / or non-labile selenium compounds and stirring the emulsion at a high temperature of 40 ° C. or higher for a predetermined time. As the unstable selenium compound, compounds described in JP-B-44-15748, JP-A-43-13489, JP-A-4-109240, JP-A-4-324855 and the like can be used. In particular, it is preferable to use compounds represented by general formulas (VIII) and (IX) in JP-A-4-324855.

  The tellurium sensitizer used for the tellurium sensitizer is a compound that generates silver telluride presumed to be a sensitization nucleus on the surface or inside of a silver halide grain. The silver telluride formation rate in the silver halide emulsion can be tested by the method described in JP-A-5-313284. Specifically, U.S. Pat. Nos. 1,623,499, 3,320,069, 3,772,031, British Patent 235,211, No. 1,121,496, No. 1,295,462, No. 1,396,696, Canadian Patent No. 800,958, JP-A-4-204640 4-271341, 4-3333043, 5-303157, Journal of Chemical Society, Chemical Communication (J. Chem. Soc. Chem. Commun.), P.635 (1980) 1102 (1979), 645 (1979), Journal of Chemical Society Perkin Transaction (J. Chem. Soc. Perkin. Trans.), 2191 (1980), S. Compounds described in S. Patai, The Chemistry of Organic Selenium and Tellunium Compounds, Volume 1 (1986), Volume 2 (1987) Can be used. Particularly preferred are compounds represented by the general formulas (II), (III) and (IV) in JP-A-5-313284.

The amount of selenium sensitizer and tellurium sensitizer that can be used in the present invention varies depending on the silver halide grains used, chemical ripening conditions, and the like, but is generally 10 ⁻⁸ to 10 ⁻² per mole of silver halide. A mole, preferably about 10 ⁻⁷ to 10 ⁻³ mole is used. The conditions for chemical sensitization in the present invention are not particularly limited, but the pH is 5 to 8, the pAg is 6 to 11, preferably 7 to 10, and the temperature is 40 to 95 ° C, preferably 45 to 45 ° C. 85 ° C.

Examples of the noble metal sensitizer include gold, platinum, palladium, iridium and the like, and gold sensitization is particularly preferable. Specific examples of the gold sensitizer used for gold sensitization include chloroauric acid, potassium chloroaurate, potassium aurithiocyanate, gold sulfide, thioglucose gold (I), and thiomannose gold (I). About 10 ⁻⁷ to 10 ⁻² mol per mol of silver halide. In the silver halide emulsion used in the present invention, a cadmium salt, a sulfite salt, a lead salt, a thallium salt or the like may coexist in the process of silver halide grain formation or physical ripening.

  In the present invention, reduction sensitization can be used. As the reduction sensitizer, stannous salts, amines, formamidinesulfinic acid, silane compounds and the like can be used. A thiosulfonic acid compound may be added to the silver halide emulsion by the method described in European Patent Publication (EP) 293917. The silver halide emulsion used in the preparation of the light-sensitive material used in the present invention may be only one type, or two or more types (for example, those having different average grain sizes, those having different halogen compositions, those having different crystal habits, Combinations of different chemical sensitization conditions and different sensitivities) may be used. In particular, in order to obtain high contrast, as described in JP-A-6-324426, it is preferable to apply an emulsion with higher sensitivity as it is closer to the support.

<Binder>
In the emulsion layer, a binder can be used for the purpose of uniformly dispersing silver salt grains and assisting the adhesion between the emulsion layer and the support. In the present invention, as the binder, both water-insoluble polymers and water-soluble polymers can be used as binders, but it is preferable to use water-soluble polymers.
Examples of the binder include polysaccharides such as gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch, cellulose and derivatives thereof, polyethylene oxide, polysaccharides, polyvinylamine, chitosan, polylysine, polyacrylic acid, polyacrylic acid, and the like. Examples include alginic acid, polyhyaluronic acid, and carboxycellulose. These have neutral, anionic, and cationic properties depending on the ionicity of the functional group.

The content of the binder contained in the emulsion layer is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited.
Content of the binder contained in the silver salt content layer in the manufacturing method of this invention can be suitably determined in the range which can exhibit dispersibility and adhesiveness. In order to easily contact metal particles with each other and to obtain high conductivity, the content of the binder in the silver salt-containing layer is preferably 1/2 to 1 / 0.1 in terms of Ag / binder volume ratio. More preferably, it is /1-1/0.5.

<Solvent>
The solvent used for forming the emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, etc. , Esters such as ethyl acetate, ethers, etc.), and mixed solvents thereof.
The content of the solvent used in the emulsion layer of the present invention is in the range of 30 to 90% by mass and in the range of 50 to 80% by mass with respect to the total mass of silver salt, binder and the like contained in the emulsion layer. Preferably there is.

<Hardener>
The emulsion layer and other hydrophilic colloid layers of the light-sensitive material according to the present invention are preferably hardened with a hardener.
As the hardener, inorganic or organic gelatin hardeners can be used alone or in combination. For example, active vinyl compounds (1,3,5-triacryloyl-hexahydro-s-triazine, bis (vinylsulfonylmethyl) ether, N, N′-methylenebis- [β- (vinylsulfonyl) propionamide], etc.) active halogen compounds (Such as 2,4-dichloro-6-hydroxy-s-triazine), mucohalogen acids (such as mucochloric acid), N-carbamoylpyridinium salts (such as (1-morpholinocarbonyl-3-pyridinyl) methanesulfonate), haloamidinium salts (1- (1-chloro-1-pyridinomethylene) pyrrolidinium-2-naphthalenesulfonate, etc.) can be used alone or in combination.
Of these, active vinyl compounds described in JP-A-53-41220, JP-A-53-57257, JP-A-59-162546, JP-A-60-80846, and the like, and U.S. Pat. No. 3,325,287. The active halogen compounds described are preferred. The following are examples of typical compounds of gelatin hardeners.

As described above, the swelling ratio of the emulsion layer can be arbitrarily controlled by adjusting the addition amount of the hardener in the emulsion layer.
The preferred range of the amount of the hardener added to the emulsion layer varies depending on the storage temperature and humidity of the photosensitive material after the addition of the hardener, the storage period, the film pH of the photosensitive material, the amount of binder contained in the photosensitive material, etc. Is not decided. In particular, since the hardener can diffuse over all layers located on the same side of the photosensitive material before reacting with the binder, the preferred addition amount of the hardener is the total amount of binder on the same side of the photosensitive material including the emulsion layer. Depends on. The preferable content of the hardener in the light-sensitive material of the present invention is in the range of 0.2% by weight to 15% by weight with respect to the total binder amount on the same side of the light-sensitive material including the emulsion layer, and more preferably. It is in the range of 0.5 mass% to 6 mass%.
Further, as described above, since the hardener can diffuse, the addition position of the hardener does not need to be in the emulsion layer and can be preferably added to any layer on the same side as the emulsion layer. It is also preferable to add in portions.

(2) Conductive shield film production step (2-1) Exposure In the present invention, for pattern formation on a photosensitive material coated with a silver salt-containing layer or a photopolymer for photolithography provided on a support, that is, irradiation. The part is exposed on the pattern or the non-irradiated part is patterned (reversed). The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

  As the light source, various light emitters that emit light in the visible spectrum region are used as necessary. For example, any one or two or more of a red light emitter, a green light emitter, and a blue light emitter are used. The spectral region is not limited to the above red, green, and blue, and phosphors that emit light in the yellow, orange, purple, or infrared region are also used. In particular, a cathode ray tube that emits white light by mixing these light emitters is often used. An ultraviolet lamp is also preferable, and g-line of a mercury lamp, i-line of a mercury lamp, etc. are also used.

In the present invention, exposure is preferably performed using various laser beams. For example, the exposure in the present invention is a monochromatic light source such as a gas laser, a light emitting diode, a semiconductor laser, a semiconductor laser, or a second harmonic light source (SHG) that combines a solid state laser using a semiconductor laser as an excitation light source and a nonlinear optical crystal. A scanning exposure method using high-density light can be preferably used, and a KrF excimer laser, ArF excimer laser, F2 laser, or the like can also be used. In order to make the system compact and inexpensive, exposure is more preferably performed using a semiconductor laser, a semiconductor laser, or a second harmonic generation light source (SHG) that combines a solid-state laser and a nonlinear optical crystal. In order to design an apparatus that is particularly compact, inexpensive, long-life, and highly stable, exposure is most preferably performed using a semiconductor laser.
The energy of the exposure, in the case of using the silver halide, the amount of irradiation energy is preferably at 1 mJ / cm ² or less, more preferably 100 .mu.J / cm ² or less, more preferably 50μJ / cm ² or less.

Specifically, as a laser light source, a blue semiconductor laser with a wavelength of 430 to 460 nm (announced by Nichia Chemical at the 48th Applied Physics Related Conference in March 2001), a semiconductor laser (oscillation wavelength of about 1060 nm) is used. About 530 nm green laser, wavelength 685 nm red semiconductor laser (Hitachi type No. HL6738MG), wavelength about 650 nm red semiconductor laser (wavelength converted by LiNbO ₃ SHG crystal having a waveguide inversion domain structure) Hitachi type No. HL6501MG) is preferably used.

  The method of exposing the silver salt-containing layer in a pattern is preferably scanning exposure using a laser beam. In particular, a capstan type laser scanning exposure apparatus described in Japanese Patent Application Laid-Open No. 2000-39677 is preferable. Further, in this capstan method, a DMD described in Japanese Patent Application Laid-Open No. 2004-1244 is used instead of beam scanning by rotating a polygon mirror. It is also preferable to use it for a beam scanning system.

(2-2) Development Processing In the present invention, after the emulsion layer is exposed, further development processing is performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. The developer is not particularly limited, but a PQ developer, MQ developer, MAA developer and the like can also be used, and commercially available products include, for example, CN-16, CR-56, CP45X, FD prescribed by Fuji Film Co., Ltd. -3, Papitol, each developer such as C-41, E-6, RA-4, D-19, D-72 formulated by KODAK, or a developer included in a kit thereof can be used. A lith developer can also be used.
As the squirrel developer, D85 or the like prescribed by KODAK can be used. In the present invention, by performing the above exposure and development processing, a metal silver portion, preferably a patterned metal silver portion, is formed in the exposed portion, and a light-transmitting portion described later is formed in the unexposed portion.

  In the production method of the present invention, a dihydroxybenzene developing agent can be used as the developer. Examples of the dihydroxybenzene developing agent include hydroquinone, chlorohydroquinone, isopropyl hydroquinone, methyl hydroquinone, hydroquinone monosulfonate, and the like, and hydroquinone is particularly preferable. Examples of the auxiliary developing agent exhibiting superadditivity with the dihydroxybenzene developing agent include 1-phenyl-3-pyrazolidones and p-aminophenols. As the developer used in the production method of the present invention, a combination of a dihydroxybenzene developer and 1-phenyl-3-pyrazolidones; or a combination of a dihydroxybenzene developer and p-aminophenols is preferably used.

As a developing agent combined with 1-phenyl-3-pyrazolidone or a derivative thereof used as an auxiliary developing agent, specifically, 1-phenyl-3-pyrazolidone, 1-phenyl-4,4-dimethyl-3-pyrazolidone, 1-phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone and the like.
Examples of the p-aminophenol auxiliary developing agent include N-methyl-p-aminophenol, p-aminophenol, N- (β-hydroxyethyl) -p-aminophenol, N- (4-hydroxyphenyl) glycine and the like. Among them, N-methyl-p-aminophenol is preferable. The dihydroxybenzene-based developing agent is usually preferably used in an amount of 0.05 to 0.8 mol / liter, but in the present invention, it is particularly preferably used at 0.23 mol / liter or more. More preferably, it is the range of 0.23-0.6 mol / liter. When a combination of dihydroxybenzenes and 1-phenyl-3-pyrazolidones or p-aminophenols is used, the former is 0.23-0.6 mol / liter, more preferably 0.23-0. It is preferable to use 5 mol / liter and the latter in an amount of 0.06 mol / liter or less, more preferably 0.03 mol / liter to 0.003 mol / liter.

  In the present invention, both the development initiator and the development replenisher have a property that “the pH increase when 0.1 mol of sodium hydroxide is added to 1 liter of the solution is 0.5 or less”. preferable. As a method for confirming that the development starting solution or development replenisher used has this property, the pH of the development starting solution or development replenisher to be tested is adjusted to 10.5, and then sodium hydroxide is added to 1 liter of this solution. 0.1 mol was added, and the pH value of the liquid at this time was measured. In the production method of the present invention, it is particularly preferable to use a development starter and a development replenisher whose pH value rises to 0.4 or less when the above test is performed.

  As a method for imparting the above properties to the development initiator and the development replenisher, a method using a buffer is preferably used. Examples of the buffer include carbonates, boric acid described in JP-A-62-286259, saccharides (for example, saccharose), oximes (for example, acetoxime), and phenols described in JP-A-60-93433. (For example, 5-sulfosalicylic acid), tertiary phosphate (for example, sodium salt, potassium salt) and the like can be used, and carbonate and boric acid are preferably used. The amount of the buffer (particularly carbonate) used is preferably 0.25 mol / liter or more, and particularly preferably 0.25 to 1.5 mol / liter.

  In the present invention, the pH of the development initiator is preferably 9.0 to 11.0, and particularly preferably 9.5 to 10.7. The pH of the developer replenisher and the pH of the developer in the developer tank during continuous processing are also in this range. As the alkali agent used for pH setting, a normal water-soluble inorganic alkali metal salt (for example, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate) can be used.

  In the production method of the present invention, when processing 1 square meter of the photosensitive material, the content of the developer replenisher in the developer is 323 ml or less, preferably 323 to 30 ml, particularly 225 to 50 ml. The development replenisher may have the same composition as the development starter, or it may have a higher concentration than the starter with respect to the components consumed in the development.

  In the developing solution for developing the light-sensitive material in the present invention (hereinafter, both the development starting solution and the developing replenisher may be simply referred to as “developing solution”), commonly used additives (for example, retaining agents) are used. (Constant, chelating agent). Examples of the preservative include sulfites such as sodium sulfite, potassium sulfite, lithium sulfite, ammonium sulfite, sodium bisulfite, potassium metabisulfite, and sodium formaldehyde bisulfite. The sulfite is preferably used in an amount of 0.20 mol / liter or more, more preferably 0.3 mol / liter or more. However, if added too much, it causes silver stains in the developer, so the upper limit is It is desirable to be 1.2 mol / liter. Particularly preferred is 0.35 to 0.7 mol / liter. Further, ascorbic acid derivatives may be used in a small amount in combination with sulfite as a preservative for dihydroxybe · BR> tower developing agents. Here, the ascorbic acid derivative includes ascorbic acid and its stereoisomer erythorbic acid and its alkali metal salts (sodium and potassium salts). As the ascorbic acid derivative, sodium erythorbate is preferably used in terms of material cost. The addition amount of the ascorbic acid derivative is preferably in the range of 0.03 to 0.12, and particularly preferably in the range of 0.05 to 0.10, with respect to the dihydroxybenzene-based developing agent. When an ascorbic acid derivative is used as the preservative, it is preferable that the developer does not contain a boron compound.

  Additives that can be used in the developer other than the above include development inhibitors such as sodium bromide and potassium bromide; organic solvents such as ethylene glycol, diethylene glycol, triethylene glycol, and dimethylformamide; diethanolamine, triethanolamine, and the like A development accelerator such as alkanolamine, imidazole or a derivative thereof, or a mercapto compound, an indazole compound, a benzotriazole compound, or a benzimidazole compound may be included as an antifoggant or a black pepper inhibitor. Specific examples of the benzimidazole compound include 5-nitroindazole, 5-p-nitrobenzoylaminoindazole, 1-methyl-5-nitroindazole, 6-nitroindazole, 3-methyl-5-nitroindazole, 5 -Nitrobenzimidazole, 2-isopropyl-5-nitrobenzimidazole, 5-nitrobenztriazole, sodium 4-[(2-mercapto-1,3,4-thiadiazol-2-yl) thio] butanesulfonate, 5- Examples include amino-1,3,4-thiadiazole-2-thiol, methylbenzotriazole, 5-methylbenzotriazole, and 2-mercaptobenzotriazole. The content of these benzimidazole compounds is usually from 0.01 to 10 mmol, more preferably from 0.1 to 2 mmol, per liter of developer.

Further, various organic and inorganic chelating agents can be used in combination in the developer. As said inorganic chelating agent, sodium tetrapolyphosphate, sodium hexametaphosphate, etc. can be used. On the other hand, as the organic chelating agent, organic carboxylic acid, aminopolycarboxylic acid, organic phosphonic acid, aminophosphonic acid and organic phosphonocarboxylic acid can be mainly used.
Examples of the above organic carboxylic acids include acrylic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, succinic acid, acileic acid, sebacic acid, nonanedicarboxylic acid, decanedicarboxylic acid, undecanedicarboxylic acid, maleic acid. Examples thereof include, but are not limited to, acid, itaconic acid, malic acid, citric acid, and tartaric acid.

  Examples of the aminopolycarboxylic acid include iminodiacetic acid, nitrilotriacetic acid, nitrilotripropionic acid, ethylenediaminemonohydroxyethyltriacetic acid, ethylenediaminetetraacetic acid, glycol ether tetraacetic acid, 1,2-diaminopropanetetraacetic acid, diethylenetriaminepentaacetic acid, Triethylenetetramine hexaacetic acid, 1,3-diamino-2-propanol tetraacetic acid, glycol ether diamine tetraacetic acid, other publications of JP-A Nos. 52-25632, 55-67747, 57-102624, and others Examples thereof include compounds described in JP-A-53-40900.

Examples of the organic phosphonic acid include hydroxyalkylidene-diphosphonic acid and Research Disclosure Vol. 181 described in the specifications of U.S. Pat. 18170 (May 1979) and the like.
Examples of the aminophosphonic acid include aminotris (methylenephosphonic acid), ethylenediaminetetramethylenephosphonic acid, aminotrimethylenephosphonic acid and the like. In addition, Research Disclosure No. 18170, JP-A-57-208554, No.54. -61125, 55-29883 gazette and 56-97347 gazette etc. can be mentioned.

  Examples of the organic phosphonocarboxylic acid include JP-A Nos. 52-102726, 53-42730, 54-121127, 55-4024, 55-4025, 55-126241, and 55-65955. Nos. 55-65956, and the above-mentioned compounds disclosed in Research Disclosure No. 18170. These chelating agents may be used in the form of alkali metal salts or ammonium salts.

The addition amount of these chelating agents is preferably 1 × 10 ⁻⁴ to 1 × 10 ⁻¹ mol, more preferably 1 × 10 ⁻³ to 1 × 10 ⁻² mol per liter of the developer.

  Further, the compounds described in JP-A-56-24347, JP-B-56-46585, JP-B-62-2849, and JP-A-4-362294 can be used as a silver stain preventing agent in the developer. it can. Moreover, the compound of Unexamined-Japanese-Patent No. 61-267759 can be used as a solubilizing agent. Further, the developer may contain a color toning agent, a surfactant, an antifoaming agent, a hardening agent, and the like as necessary. The development processing temperature and time are related to each other and are determined in relation to the total processing time. In general, the development temperature is preferably from about 20 ° C. to about 50 ° C., more preferably from 25 to 45 ° C. The development time is preferably 5 seconds to 2 minutes, more preferably 7 seconds to 1 minute 30 seconds.

  From the viewpoint of developer transport cost, packaging material cost, space saving, and the like, it is also preferred that the developer be concentrated and diluted before use. In order to concentrate the developer, it is effective to potassium salt the salt component contained in the developer.

  The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for a silver salt photographic film, photographic paper, a printing plate-making film, a photomask emulsion mask, or the like can be used.

Preferred components of the fixing solution used in the fixing step include the following.
That is, sodium thiosulfate, ammonium thiosulfate, if necessary, tartaric acid, citric acid, gluconic acid, boric acid, iminodiacetic acid, 5-sulfosalicylic acid, glucoheptanoic acid, tyrone, ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic acid, nitrilotriacetic acid Etc. are preferably included. From the viewpoint of environmental protection in recent years, it is preferable that boric acid is not included. Examples of the fixing agent for the fixing solution used in the present invention include sodium thiosulfate and ammonium thiosulfate. Ammonium thiosulfate is preferable from the viewpoint of fixing speed, but sodium thiosulfate may be used from the viewpoint of environmental protection in recent years. Good. The amount of these known fixing agents used can be appropriately changed, and is generally about 0.1 to about 2 mol / liter. Most preferably, it is 0.2-1.5 mol / liter. If desired, the fixer may contain a hardener (eg, a water-soluble aluminum compound), a preservative (eg, sulfite, bisulfite), a pH buffer (eg, acetic acid), a pH adjuster (eg, ammonia, sulfuric acid). ), Chelating agents, surfactants, wetting agents, fixing accelerators.

Examples of the surfactant include anionic surfactants such as sulfates and sulfonates, polyethylene surfactants, and amphoteric surfactants described in JP-A-57-6740. A known antifoaming agent may be added to the fixing solution.
Examples of the wetting agent include alkanolamine and alkylene glycol. Examples of the fixing accelerator include thiourea derivatives described in JP-B Nos. 45-35754, 58-122535, and 58-122536; alcohols having a triple bond in the molecule; Examples include thioether compounds described in US Pat. No. 4,126,459; mesoionic compounds described in JP-A-4-229860, and compounds described in JP-A-2-44355 may be used. Examples of the pH buffer include organic acids such as acetic acid, malic acid, succinic acid, tartaric acid, citric acid, oxalic acid, maleic acid, glycolic acid, and adipic acid, boric acid, phosphate, sulfite, and the like. Inorganic buffers can be used. As the pH buffer, acetic acid, tartaric acid, and sulfite are preferably used. Here, the pH buffering agent is used for the purpose of preventing an increase in pH of the fixing agent due to bringing in the developer, and is preferably 0.01 to 1.0 mol / liter, more preferably 0.02 to 0.6 mol / liter. Use degree. The pH of the fixing solution is preferably from 4.0 to 6.5, particularly preferably from 4.5 to 6.0. Further, as the dye elution accelerator, compounds described in JP-A No. 64-4739 can also be used.

  Examples of the hardener in the fixing solution of the present invention include water-soluble aluminum salts and chromium salts. A preferred compound as the hardener is a water-soluble aluminum salt, and examples thereof include aluminum chloride, aluminum sulfate, potash and vane. A preferable addition amount of the hardener is 0.01 mol to 0.2 mol / liter, and more preferably 0.03 to 0.08 mol / liter.

The fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds. The replenishing amount of the fixing solution is preferably 600 ml / m ² or less with respect to the processing of the photosensitive material, more preferably 500 ml / m ² or less, 300 ml / m ² or less is particularly preferred.

The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment. In the water washing treatment or stabilization treatment, the washing water amount is usually 20 liters or less per 1 m ^{2 of the} light-sensitive material, and can be replenished in 3 liters or less (including 0, ie, rinsing with water). For this reason, not only water-saving treatment is possible, but piping for self-installing machines can be eliminated. As a method for reducing the replenishment amount of flush water, a multi-stage countercurrent system (for example, two stages, three stages, etc.) has been known for a long time. When this multi-stage countercurrent system is applied to the production method of the present invention, the photosensitive material after fixing is gradually processed in contact with the normal direction, that is, in the direction of the processing solution not contaminated with the fixing solution. Furthermore, efficient washing with water is performed. Moreover, when performing water washing with a small amount of water, it is more preferable to provide the washing tank of a squeeze roller and a crossover roller as described in Unexamined-Japanese-Patent No. 63-18350, 62-287252, etc. In addition, various oxidizer additions and filter filtration may be combined to reduce the pollution load that becomes a problem when washing with a small amount of water. Furthermore, in the above method, a part or all of the overflow liquid from the washing bath or stabilization bath produced by replenishing the washing bath or stabilization bath with water subjected to the fouling means according to the treatment, As described in JP-A-60-235133, it can also be used for a processing solution having fixing ability, which is a previous processing step. In addition, water-soluble surfactants and antifoaming agents are added to prevent unevenness of water bubbles that are likely to occur during washing with a small amount of water and / or to prevent the processing agent component adhering to the squeeze roller from being transferred to the processed film. Also good.

  In the washing treatment or stabilization treatment, a dye adsorbent described in JP-A-63-163456 may be installed in a washing tank in order to prevent contamination with a dye eluted from the photosensitive material. In the stabilization treatment following the water washing treatment, baths containing the compounds described in JP-A-2-2013357, JP-A-2-132435, JP-A-1-102553, and JP-A-46-44446 are disclosed. May be used as the final bath of the light-sensitive material. At this time, ammonium compounds, metal compounds such as Bi, Al, fluorescent brighteners, various chelating agents, film pH regulators, hardeners, bactericides, fungicides, alkanolamines and surfactants are added as necessary. It can also be added. Water used in the water washing process or stabilization process includes tap water, water deionized, halogen, UV germicidal lamps, and water sterilized by various oxidizing agents (such as ozone, hydrogen peroxide, and chlorates). It is preferable to use it. Further, washing water containing the compounds described in JP-A-4-39652 and JP-A-5-241309 may be used. The bath temperature and time at the water washing treatment or the stabilization temperature are preferably 0 to 50 ° C. and 5 seconds to 2 minutes.

In order to preserve the processing solution such as a developing solution and a fixing solution used in the present invention, it is preferable to store the packaging solution having a low oxygen permeability described in JP-A-61-73147. Moreover, when reducing the replenishment amount, it is preferable to prevent evaporation of the liquid and air oxidation by reducing the contact area of the treatment tank with the air.
Since the electromagnetic wave shielding film of the present invention is preferably obtained in a shape carrying a contact pattern such as a roll shape in terms of productivity and ease of optical filter production, it is advantageous to use a developing machine for rolls. It is preferable to use a roller conveyance type automatic developing machine.
The roller conveyance type automatic developing machine is described in US Pat. Nos. 3,025,795 and 3,545,971, etc., and is simply referred to as a roller conveyance type automatic developing machine in this specification. In addition, the roller-conveying type automatic developing machine preferably has four steps of development, fixing, washing and drying, and in the present invention, other steps (for example, a stop step) are not excluded, but these four steps are followed. Is most preferred. Moreover, four steps by a stable process may be used instead of the water washing process.

  In each of the above steps, a component obtained by removing water from the composition of the developing solution or the fixing solution may be supplied as a solid, dissolved in a predetermined amount of water and used as a developing solution or a fixing solution. Such a form of treating agent is called a solid treating agent. As the solid processing agent, powder, tablet, granule, powder, lump or paste is used. A preferred form of the treatment agent is a form described in JP-A-61-259921 or a tablet. For example, JP-A-51-61837, JP-A-54-155038, JP-A-52-88025, British Patent No. 1,213,808, etc. Can be manufactured. Furthermore, the granule treating agent can be produced by a general method described in, for example, JP-A-2-109042, JP-A-2-109043, JP-A-3-39735 and JP-A-3-393939. Further, powder processing agents are generally described in, for example, JP-A-54-133332, British Patents 725,892 and 729,862, and German Patent 3,733,861. Can be manufactured in a conventional manner.

The bulk density of the solid processing agent is preferably 0.5 to 6.0 g / cm ³ and particularly preferably 1.0 to 5.0 g / cm ^{3 in} view of its solubility.

  In preparing the solid processing agent, at least two kinds of mutually reactive particulate materials among the materials constituting the processing agent are replaced with at least one intervening separation layer made of a material inert to the reactive material. Alternatively, a method may be employed in which reactive substances are placed in layers so as to be separated into layers, a bag that can be vacuum-packed is used as a packaging material, and the bag is evacuated and sealed. Here, “inert” means that the substances do not react under normal conditions in the package when they are in physical contact with each other or that there is no significant reaction. The inert material may be inactive in the intended use of the two reactive materials, apart from being inert to the two mutually reactive materials. Furthermore, an inert substance is a substance that is used simultaneously with two reactive substances. For example, since hydroquinone and sodium hydroxide react in direct contact with each other in the developer, they can be stored in the package for a long time by using sodium sulfite or the like as a separation layer between hydroquinone and sodium hydroxide in vacuum packaging. In addition, hydroquinone or the like is briquetted to reduce the contact area with sodium hydroxide, so that the storage stability is improved and the mixture can be used. Bags made from an inert plastic film, a laminate of plastic material and metal foil are used as packaging materials for these vacuum packaging materials.

  The mass of the metallic silver contained in the exposed portion after the development treatment is preferably a content of 50% by mass or more, and 80% by mass or more with respect to the mass of silver contained in the exposed portion before exposure. More preferably. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

  The gradation after development processing in the present invention is not particularly limited, but is preferably more than 4.0. When the gradation after the development processing exceeds 4.0, the conductivity of the conductive metal portion can be increased while keeping the transparency of the light transmissive portion high. Examples of means for setting the gradation to 4.0 or higher include doping the above-mentioned rhodium ions and iridium ions into the photosensitive silver halide grains.

  The developed silver thus obtained is preferably subjected to a treatment with a reducing agent or a silver ion ligand, or a treatment with heating or a calender roll. By these treatments, the conductivity of developed silver can be increased. These processes may be performed after the development process before the fixing process, may be performed after the development process and the fixing process, or may be performed at both times.

The treatment with a reducing agent or silver ion ligand preferably used in the present invention will be described.
In the present invention, treatment with a reducing agent or a silver ion ligand is preferably performed.
As the reducing agent, it is sufficient that silver ions can be reduced to metallic silver. For example, thiourea dioxide, Rongalite, tin (II) chloride, sodium borohydride, sodium triacetoxyborohydride, trimethylamine borane, triethylamine borane, Examples thereof include pyridine borane and borane. Among these, alkali is preferable, and sodium triacetoxyborohydride, dimethylamine borane, or sodium borohydride is particularly preferable.
Silver ion ligands include halogen ions such as chlorine ion, bromine ion and iodine ion, pseudohalogen ions such as thiocyanate ion, nitrogen-containing heterocyclic compounds such as pyridine and bipyridine, sulfite ion, and 1, 2, 4 -Mesoionic compounds such as triazolium-3-thiolates (for example, 1,2,4-trimethyl-1,2,4-triazolium-3-thiolate), thioether compounds such as 3,6-dithiaoctane-1,8-diol Etc.

A calendar process preferably used in the present invention, that is, a process using a calendar roll will be described.
In the present invention, the mesh-shaped metallic silver part is preferably treated with a calender roll. Thereby, it is possible to improve the electroconductivity of a mesh-shaped metallic silver part, and it is possible to improve electromagnetic wave shielding performance.
A calendar roll usually consists of one or more pairs of rolls. As a roll used for the calendar process, a plastic roll or a metal roll such as epoxy, polyimide, polyamide, polyimide amide or the like is used. It is particularly preferable to treat with metal rolls. The linear pressure is preferably 1960 N / cm (200 kgf / cm) or more, more preferably 2940 N / cm (300 kgf / cm) or more.
The temperature of the calender roll treatment is preferably 10 ° C to 100 ° C, more preferably 10 ° C to 50 ° C.
This calendar process can continuously process a roll-like long film.

  The heat treatment preferably used in the present invention is preferably performed at 40 ° C to 250 ° C, more preferably 60 ° C to 200 ° C, still more preferably 70 ° C to 150 ° C, and the time is 10 seconds to 1 hour. However, it is preferable to heat-treat for 30 seconds to 30 minutes, more preferably for 1 minute to 10 minutes. It is good to carry out after development and before electrolytic plating.

(2-3) Physical development and plating treatment In the present invention, for the purpose of imparting conductivity to the metal silver portion formed by the exposure and development treatment, the physical for supporting the conductive metal particles on the metal silver portion. Development and / or plating can also be performed. In the present invention, the conductive metal particles can be supported on the metal silver portion by only one of physical development and plating treatment. However, the combination of physical development and plating treatment allows the conductive metal particles to be attached to the metal silver portion. It can also be carried on. A metal silver part that has been subjected to physical development and / or plating is referred to as a “conductive metal part”.
“Physical development” in the present invention means that metal particles such as silver ions are reduced with a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention.
Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.

  In the present invention, the plating treatment can use electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating.

<Electroless plating>
In the present invention, the metal silver portion after the exposure and development treatment can be further treated with an electroless plating solution. For electroless plating, a method of treating with an aqueous palladium compound solution, a method of treating with a reducing agent and / or a silver ion ligand are preferred.
The former is performed by treating the metal silver portion after the exposure and development treatment with a solution containing Pd. Pd may be a divalent palladium ion or metallic palladium. This treatment can accelerate electroless plating or physical development speed. The electroless plating with palladium is described in detail in the chapter “Electroless plating” in the edition of the Japan Society for Science and Chemical Chemistry Handbook.

<Electrolytic plating>
Hereinafter, preferred embodiments of the electrolytic plating method will be specifically described with reference to the drawings. The plating apparatus for suitably carrying out the above-mentioned electrolytic plating treatment is to expose the emulsion layer, and from the reel for delivery (not shown) around which the developed film is wound, the sequentially fed film is fed to an electroplating tank. The film after feeding and plating is sequentially wound on a winding reel (not shown).

  FIG. 1 shows an example of an electrolytic plating tank suitably used for the electrolytic plating treatment. The electrolytic plating tank 10 shown in FIG. 1 is capable of performing a plating process continuously on a long film 16 (which has been subjected to the above exposure and development processes). The arrow indicates the conveyance direction of the film 16. The electrolytic plating tank 10 includes a plating bath 11 that stores a plating solution 15. A pair of anode plates 13 are disposed in parallel in the plating bath 11, and a pair of guide rollers 14 are disposed inside the anode plate 13 so as to be rotatable in parallel with the anode plate 13. The guide roller 14 can move in the vertical direction, thereby adjusting the plating processing time of the film 16.

Above the plating bath 11, a pair of feed rollers (cathodes) 12 a and 12 b for guiding the film 16 to the plating bath 11 and supplying current to the film 16 are rotatably disposed. A liquid draining roller 17 is rotatably disposed above the plating bath 11 and below the outlet-side power feeding roller 12b. Between the liquid draining roller 17 and the outlet-side power feeding roller 12b. Is provided with a water spray (not shown) for removing the plating solution from the film.
The anode plate 13 is connected to a plus terminal of a power supply device (not shown) via an electric wire (not shown), and the power supply rollers 12a and 12b are connected to a minus terminal of the power supply device (not shown). .

  In the electrolytic plating tank 10 described above, for example, when the size of the electrolytic plating tank is 10 × 10 × 10 cm to 100 × 200 × 300 cm, the lowermost portion of the surface where the feeding roller 12a on the entrance side and the film 16 are in contact with each other The distance (distance La shown in FIG. 1) between the surface and the plating solution is preferably 0.5 to 15 cm, more preferably 1 to 10 cm, and even more preferably 1 to 7 cm. Moreover, it is preferable that the distance (distance Lb shown in FIG. 1) between the lowermost part of the surface where the power supply roller 12b on the outlet side and the film 16 are in contact with the plating solution surface is 0.5 to 15 cm.

Next, a method for reinforcing the conductivity by forming a copper plating layer on the mesh-like silver fine wire pattern of the film using the plating apparatus provided with the electrolytic plating tank 10 will be described.
First, the plating solution 15 is stored in the plating bath 11. As the plating solution, in the case of copper plating, a copper sulfate pentahydrate containing 30 g / L to 300 g / L and sulfuric acid containing 30 g / L to 300 g / L can be used. In the case of nickel plating, nickel sulfate, nickel hydrochloride or the like can be used, and in the case of iron silver plating, one containing silver cyanide or the like can be used. Moreover, you may add additives, such as surfactant, a sulfur compound, and a nitrogen compound, to a plating solution.

The film 16 is set in a state where it is wound around a supply reel (not shown), and the film 16 is transported so that the surface of the film 16 on which the plating should be formed contacts the power supply rollers 12a and 12b. Wrap it around (not shown). In addition, it is preferable that the surface resistance of the film just before electrolytic plating is 1-1000 ohm / sq, It is more preferable that it is 5-500 ohm / sq, Furthermore, a more preferable range is 10-100 ohm / sq.
A voltage is applied to the anode plate 13 and the power supply rollers 12a and 12b, and the film 16 is conveyed while being in contact with the power supply rollers 12a and 12b. The film 16 is introduced into the plating bath 11 and immersed in the plating solution 15 to form a copper plating. When passing between the liquid draining rollers 17, the plating solution 15 adhered to the film 16 is wiped off and collected in the plating bath 11. This is repeated in a plurality of electrolytic plating tanks, finally washed with water, and then wound up on a take-up reel (not shown).
The conveyance speed of the film 16 is set in the range of 1 to 30 m / min. The conveyance speed of the film 16 is preferably in the range of 1 to 10 m / min, and more preferably in the range of 2 to 5 m / min.

The number of electrolytic plating tanks is not particularly limited, but is preferably 10 stages or less, that is, 10 tanks or less, preferably 2 to 10 tanks, and more preferably 3 to 6 tanks. The applied voltage is preferably in the range of 1 to 100V, more preferably in the range of 2 to 60V. When a plurality of electrolytic plating tanks are installed, it is preferable to lower the applied voltage of the electrolytic plating tank stepwise. Moreover, as an electric current amount by the side of the entrance of the 1st tank, 1-30A is preferable and 2-10A is more preferable.
The power supply rollers 12a and 12b are preferably in contact with the entire surface of the film (the portion of the contact area that is substantially in electrical contact is 80% or more).

  In addition, it is preferable to perform water washing and acid washing before performing a plating process in the said electrolytic plating tank. As the treatment liquid used for the acid cleaning, one containing sulfuric acid or the like can be used.

  The thickness of the conductive metal portion plated by the electrolytic plating treatment is preferable because the viewing angle of the display is increased as the thickness of the electromagnetic shielding material for the display is reduced. Furthermore, as a use of the conductive wiring material, a thin film is required because of a demand for high density. From such a viewpoint, the thickness of the conductive metal part is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and further preferably 0.1 μm or more and less than 3 μm.

Moreover, in the plating process of this invention, if the surface resistance of the film just before performing said electroplating process is a film of 1-1000 ohm / sq, you may perform an electroless-plating process before that.
When performing electroless plating, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Preferably there is.
Chemical species contained in the electroless copper plating solution include copper sulfate, copper chloride, reducing agent, formalin, glyoxylic acid, copper ligand, EDTA, triethanolamine, etc., bath stabilization and plating Examples of the additive for improving the smoothness of the film include polyethylene glycol, yellow blood salt, and bipyridine.

  Moreover, it is preferable that the electroconductive pattern on a film is continuous (it is not interrupted electrically). It is only necessary to be partially connected, and if the conductive pattern is interrupted, there is a possibility that a portion where plating cannot be applied in the first electrolytic plating tank may be formed or uneven.

  The plating rate during the plating process can be performed under moderate conditions, but high-speed plating of 5 μm / hr or more is also possible. In the plating process, from the viewpoint of improving the stability of the plating solution, for example, various additives such as a ligand such as EDTA can be added to the plating solution and used.

(2-4) Oxidation treatment In the present invention, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to an oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.
Examples of the oxidation treatment include known methods using various oxidizing agents such as Fe (III) ion treatment. As described above, the oxidation treatment can be performed after the emulsion layer exposure and development processing, or after the physical development or plating treatment, and may be performed after the development processing and after the physical development or plating treatment.

(3) Conductive metal portion In the present invention, when the conductive metal portion is used as a light-transmitting electromagnetic wave shielding material, a triangle such as an equilateral triangle, an isosceles triangle, a right triangle, a square, a rectangle, a rhombus, and a parallel shape. It is preferably a geometric figure combining quadrangles, trapezoids, etc., (positive) hexagons, (positive) octagons, (positive) n-gons, circles, ellipses, stars, etc. More preferably, it is in the form of a mesh consisting of figures. From the viewpoint of EMI shielding properties, the triangular shape is the most effective, but from the viewpoint of visible light transmittance, if the same line width is used, the larger the (positive) n-gonal n number, the higher the aperture ratio and the visible light transmittance. This is advantageous because it becomes larger. From the viewpoint of making moiré less likely to occur, it is also preferable to arrange these geometric patterns at random or change the line width without periodicity.
In addition, when it is a use of an electroconductive wiring material, the shape of the said electroconductive metal part is not specifically limited, Arbitrary shapes can be determined suitably according to the objective.

  In the application of the light-transmitting electromagnetic wave shielding material, the line width of the thin metal wire of the conductive metal portion needs to be 18 μm or less in order to ensure conductivity. If the line width exceeds 18 μm, it is not preferable because both the aperture ratio and the mesh size are restricted to a satisfactory level. The line width is preferably 5 to 18 μm, and more preferably 8 to 16 μm. The line spacing is preferably 50 μm or more and 500 μm or less, more preferably 200 μm or more and 400 μm or less, and most preferably 250 μm or more and 350 μm or less.

  The conductive metal portion in the present invention has an aperture ratio of preferably 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is a ratio of a portion having no fine line forming the mesh to the whole. For example, the aperture ratio of a square lattice mesh having a line width of 15 μm and a pitch of 300 μm is 90%.

(4) Light transmissive part The "light transmissive part" in the present invention means a part having transparency other than the conductive metal part in the light transmissive electromagnetic wave shielding film. As described above, the transmittance of the light-transmitting portion is 90% or more, preferably 95, as shown by the minimum transmittance in the wavelength range of 380 to 780 nm excluding the contribution of light absorption and reflection of the support. % Or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.

In the present invention, the mesh pattern of the conductive metal part is preferably continuous for 3 m or more in the longitudinal direction of the translucent electromagnetic wave shielding film. When the continuous length of the mesh pattern is longer, the optical filter material is produced. It can be said that this is a more preferable embodiment because the loss of the above can be reduced. On the other hand, if the continuous length is long, the roll diameter becomes large when the roll is formed, the mass of the roll becomes heavy, the pressure at the center of the roll becomes strong, and problems such as adhesion and deformation are reduced and the price is reduced to 2000 m The following is preferable. Preferably they are 100 m or more and 1000 m or less, More preferably, they are 200 m or more and 800 m or less, Most preferably, they are 300 m or more and 500 m or less.
For the same reason, the thickness of the support is preferably 200 μm or less, more preferably 20 μm or more and 180 μm or less, and most preferably 50 μm or more and 120 μm or less.

  As a scanning method of the light beam, a method of exposing with a linear light source or a rotating polygon mirror arranged in a direction substantially perpendicular to the transport direction is preferable. In this case, the light beam needs to be intensity-modulated by two or more values, and the straight line is patterned as a series of dots. Since the dots are continuous, the edge of the fine line of one dot is stepped, but the thickness of the fine line means the narrowest length of the constricted part.

As another method of scanning the light beam, it is also preferable to scan a beam whose scanning direction is inclined with respect to the conveyance direction in accordance with the inclination of the grating pattern. In this case, it is preferable to arrange the two scanning light beams so as to be orthogonal to each other. The light beam is substantially 1 on the exposed surface.
Take the intensity of the value.

  In the present invention, the mesh pattern is preferably inclined by 30 ° to 60 ° with respect to the longitudinal direction of the translucent electromagnetic shielding film. More preferably, it is 40 ° to 50 °, and most preferably 43 ° to 47 °. This is because it is generally difficult to create a mask whose mesh pattern has an inclination of about 45 ° with respect to the frame, and this method tends to cause problems such as unevenness and high price. Since unevenness does not easily occur in the vicinity, the effect of the present invention is more significant for patterning by photolithography using a mask contact exposure method or screen printing.

The surface resistance value of the translucent electromagnetic wave shielding film of the present invention is required to be 5Ω / sq or less. A preferable surface resistance value is 1 Ω / sq or less, and more preferably 0.7 to 0.03 Ω / sq.
Moreover, the disconnection of the metallic silver part of the translucent electromagnetic wave shielding film of the present invention needs to be 10 locations / m ² or less. Thereby, electroconductivity is ensured and the electromagnetic wave shielding function is exhibited. Preferably, it is 4 locations / m ² or less, more preferably 1 location / m ² or less.

(5) Peelable protective film The translucent electromagnetic wave shielding film of the present invention can be provided with a peelable protective film. The protective film does not need to be provided on both surfaces of the translucent electromagnetic wave shielding film, and can be provided only on the conductive metal portion or only on the opposite side. When the protective film is provided on the conductive metal part, it is desirable that the protective film can be peeled off.

  The peel strength of the protective film is preferably 5 mN / 25 mm width to 5 N / 25 mm width, more preferably 10 mN / 25 mm width to 100 mN / 25 mm width under the above test conditions. If it is less than the lower limit, peeling is too easy and the protective film may be peeled off during handling or inadvertent contact.It is not preferable, and if it exceeds the upper limit, a large force is required for peeling. There is a possibility that the conductive metal portion may be peeled off from the support, which is not preferable.

  As the film constituting the protective film, it is preferable to use a polyolefin resin such as polyethylene resin, polypropylene resin, polyester resin such as polyethylene terephthalate resin, resin film such as polycarbonate resin or acrylic resin, and adhesion of the protective film. The surface to be treated is preferably subjected to corona discharge treatment.

  Moreover, as an adhesive which comprises a protective film, an acrylate ester type | system | group, a rubber type, or a silicone type thing can be used.

(6) Blackening layer
The roll-shaped translucent electromagnetic wave shielding film of the present invention and the optical film incorporating the same may be subjected to blackening treatment.
The blackening process is disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-188576. The blackened layer formed even by the blackening treatment can impart antireflection properties in addition to the antirust effect. The blackening layer can be formed by, for example, Co—Cu alloy plating, and can prevent reflection of the surface of the metal foil. Further, a chromate treatment may be performed thereon as a rust prevention treatment. The chromate treatment is performed by dipping in a solution containing chromic acid or dichromate as a main component and drying to form a rust-preventive coating, which can be performed on one or both sides of the metal foil as required. A commercially available chromate-treated copper foil or the like may be used. Although a metal foil that has been blackened in advance can be used, it may be blackened in an appropriate later step. The blackening layer can also be formed by forming a photosensitive resin layer that can be a resist layer using a black colored composition, and leaving the resist layer without removal after the etching is completed. Alternatively, a plating method that gives a black film may be used.

  Further, as another example of the configuration including the blackening layer, the configuration described in JP-A-11-266095 may be used. That is, the first blackening layer is provided on the conductive metal portion, the electrolytic plating is performed on the first blackening layer, and then the second blackening layer is further provided on the plating. is there. In order to perform electroplating on the first blackened layer, at least the first blackened layer needs to be conductive. In general, the conductive blackening layer can be formed using a conductive metal compound, for example, a compound such as nickel (Ni), zinc (Zn), copper (Cu), or the like. It can be formed using an ionic polymer material such as an electrodeposition coating material.

In the present invention, the electrolytic solution bath (black plating bath) containing the blackening material may be a black plating bath mainly composed of nickel sulfate, and a commercially available black plating bath is also the same. Specifically, for example, Shimizu Co., Ltd. black plating bath (trade name, Novroi SNC, Sn-Ni alloy system), Nihon Kagaku Sangyo Co., Ltd. black plating bath (product) Name, Nikka Black, Sn—Ni alloy system), black plating bath (trade name, Ebony-Chromium 85 series-85 series, Cr series) manufactured by Metal Chemical Co., Ltd., and the like can be used. Moreover, in this invention, various black plating baths, such as Zn type | system | group, Cu type | system | group, others, can be used as said black plating bath. Next, after conducting the conductive plating to form a conductive mesh pattern, a second blackening layer is formed thereon. For example, when the electroplating metal is Cu, a hydrogen sulfide (H ₂ S) solution treatment is performed to blacken the Cu surface as copper sulfide (CuS), thereby forming a second blackened layer. As a material constituting the mesh-like conductive pattern, the above-mentioned metal as a highly conductive substance can be used as the most advantageous material. Therefore, when forming the above-mentioned metal electrodeposition layer, a general-purpose metal electrolyte can be used, so there are many kinds of inexpensive metal electrolytes, and the choice suitable for the purpose is free. There is an advantage that can be done. In general, Cu is frequently used as an inexpensive good conductive metal, and in the present invention, it is useful to use Cu in accordance with the purpose. Of course, other metals are also the same. It can be used for. Next, in the present invention, the mesh-like conductive pattern 4 need not be composed of only a single metal layer. For example, although not shown, the mesh-like conductive pattern 4 made of Cu in the above example is used. Since the metal is relatively soft and easily damaged, the protective layer can be a two-layer metal electrodeposition layer using a general-purpose hard metal such as Ni or Cr. In addition, as the blackening treatment agent for the second blackening layer, it can be easily produced using a sulfide-based compound, and there are many types of commercial treatment agents. -Black CuO, CuS, selenium-based Copa Black No. 65 (made by Isolate Chemical Laboratories, Inc.), trade name, Ebonol C Special (made by Meltex Co., Ltd.), etc. can be used.

[Functional layers other than electromagnetic shielding of translucent electromagnetic shielding film]
(7) Other functional layers In the present invention, a functional layer having functionality may be separately provided as necessary. This functional layer can have various specifications for each application. For example, as an electromagnetic shielding material for displays, an antireflection layer provided with an antireflection function with an adjusted refractive index and film thickness, a non-glare layer or an antiglare layer (both have a glare prevention function), and absorbs near infrared rays. Near-infrared absorbing layer made of compound or metal, layer with a color tone adjustment function that absorbs visible light in a specific wavelength range, antifouling layer with a function that easily removes dirt such as fingerprints, and hard scratch-resistant hard coat A layer, a layer having an impact absorbing function, a layer having a function of preventing glass scattering when glass is broken, and the like can be provided. These functional layers may be provided on the opposite surface across the conductive metal portion and the support, or may be provided on the same surface side.
A material provided with these functional layers is called an optical filter (or simply a filter).

<Functional film>
When using a translucent electromagnetic wave shielding film for a display (especially a plasma display), it is preferable to give each functionality by sticking the functional layer (functional film) demonstrated below. The functional film can be directly or indirectly attached to the translucent electromagnetic wave shielding film via an adhesive or the like. The functional film can be formed by providing a functional layer having antireflection properties and antiglare properties on a suitable transparent substrate.
(Anti-reflection and anti-glare properties)
The translucent electromagnetic wave shielding film has anti-reflection (AR: anti-reflection) properties to suppress external light reflection, or anti-glare (AG: anti-glare) properties to prevent the reflection of mirror images, or both characteristics. It is preferable to provide any of the antireflection antiglare (ARAG) properties provided.
With these performances, it is possible to prevent the display screen from becoming difficult to see due to the reflection of a lighting fixture or the like. Further, by reducing the visible light reflectance of the film surface, not only the reflection can be prevented but also the contrast and the like can be improved. When the functional film having antireflection properties and antiglare properties is attached to the translucent electromagnetic wave shielding film, the visible light reflectance is preferably 2% or less, more preferably 1.3% or less, and still more preferably Is 0.8% or less.

  As the antireflection layer, for example, a fluorine-based transparent polymer resin, magnesium fluoride, a silicon-based resin, a thin film of silicon oxide, or the like formed as a single layer with an optical film thickness of, for example, a quarter wavelength, a different refractive index, It may be formed of a multi-layered laminate of thin films of inorganic compounds such as metal oxides, fluorides, silicides, nitrides, sulfides, or organic compounds such as silicon resins, acrylic resins, and fluorine resins. it can.

The antiglare layer can be formed from a layer having a minute uneven surface state of about 0.1 μm to 10 μm. Specifically, acrylic, silicon-based resin, melamine-based resin, urethane-based resin, alkyd-based resin, fluorine-based resin and other thermosetting or photo-curable resins, silica, organosilicon compounds, melamine, acrylic, etc. It is possible to form by coating and curing an ink in which particles of the inorganic compound or organic compound are dispersed.
The average particle size of the particles is preferably about 1 to 40 μm.
The antiglare layer can also be formed by applying the thermosetting or photocurable resin and pressing and curing a mold having a desired gloss value or surface state.
When the antiglare layer is provided, the haze generated during light transmission of the translucent electromagnetic wave shielding film is preferably 0.5% or more and 20% or less, more preferably 10% or less, for example, 1% It is 10% or less. If the haze is too small, the antiglare property is insufficient, and if the haze is too large, the transmitted image sharpness tends to be low.

(Hard coat property)
In order to add scratch resistance to the translucent electromagnetic wave shielding film, it is also preferable that the functional film has a hard coat property. Examples of the hard coat layer include acrylic resins, silicon resins, melamine resins, urethane resins, alkyd resins, thermosetting resins such as fluorinated resins, and photocurable resins. There is no particular limitation. The thickness of the hard coat layer is preferably about 1 to 50 μm. When the antireflection layer and / or the antiglare layer is formed on the hard coat layer, a functional film having scratch resistance, antireflection property and / or antiglare property is preferably obtained.
The surface hardness of the translucent electromagnetic wave shielding film to which hard coat properties are imparted is preferably a pencil hardness according to JIS (K-5400) of at least H, more preferably 2H, and even more preferably 3H or more. .

(Antistatic property)
In order to prevent dust adhesion due to electrostatic charging and electrostatic discharge due to contact with the human body, it is preferable that the transmissive electromagnetic wave shielding film has antistatic properties.
As the functional film having antistatic properties, a film having high electrical conductivity can be used. For example, the electrical conductivity may be about 10 ¹¹ Ω / sq or less in terms of surface resistance.
A highly conductive film can be formed by providing an antistatic layer on a transparent substrate. Specific examples of the antistatic agent used in the antistatic layer include a trade name Pelestat (manufactured by Sanyo Kasei Co., Ltd.), a trade name of electro slipper (manufactured by Kao Corporation), and the like. In addition, the antistatic layer may be formed of a known transparent conductive film such as ITO, or a conductive film in which conductive ultrafine particles such as ITO ultrafine particles and tin oxide ultrafine particles are dispersed. Antistatic properties may be imparted to the hard coat layer, antireflection layer, antiglare layer and the like by adding conductive fine particles.

(Anti-fouling property)
It is preferable that the light-transmitting electromagnetic wave shielding film has antifouling property because it can be easily removed when the fingerprint is prevented from being smudged or smudged.
The functional film having antifouling properties can be obtained, for example, by applying a compound having antifouling properties on a transparent substrate. The compound having antifouling property may be a compound having non-wetting properties with respect to water and / or fats and oils, and examples thereof include fluorine compounds and silicon compounds. Specific examples of the fluorine compound include trade name OPTOOL (manufactured by Daikin), and examples of the silicon compound include trade name Takata Quantum (manufactured by Nippon Oil & Fats Co., Ltd.).

(UV-cutting property)
The translucent electromagnetic wave shielding film is preferably imparted with UV-cutting properties for the purpose of preventing deterioration of a dye and a transparent substrate described later. The functional film having ultraviolet cut-off property can be formed by a method in which the transparent substrate itself contains an ultraviolet absorber or by providing an ultraviolet absorbing layer on the transparent substrate.
As the ultraviolet ray cutting ability necessary for protecting the dye, the transmittance in the ultraviolet region shorter than the wavelength of 380 nm is 20% or less, preferably 10% or less, more preferably 5% or less. A functional film having ultraviolet cut-off properties can be obtained by forming a layer containing an ultraviolet absorber or an inorganic compound that reflects or absorbs ultraviolet rays on a transparent substrate. Conventionally known UV absorbers such as benzotriazoles and benzophenones can be used, and their types and concentrations are dispersibility / solubility in the medium to be dispersed or dissolved, absorption wavelength / absorption coefficient, thickness of the medium. It is determined from the above and is not particularly limited.

In addition, it is preferable that the functional film which has ultraviolet cut-off property has little absorption of visible light region, and does not show visible light transmittance | permeability remarkably or exhibit colors, such as yellow.
Moreover, when the layer containing the pigment | dye mentioned later is formed in the functional film, it is desirable for the layer which has ultraviolet-ray cutting property to exist outside the layer.

(Gas barrier properties)
If a translucent electromagnetic shielding film is used in a temperature / humidity environment higher than room temperature and humidity, the pigments described later deteriorate due to moisture, or moisture aggregates in the adhesive used for bonding and the bonding interface and becomes cloudy. In other cases, the translucent electromagnetic wave shielding film preferably has a gas barrier property because the adhesive may be phase-separated due to the influence of moisture and may precipitate and become cloudy.
In order to prevent such pigment deterioration and fogging, it is important to prevent moisture from entering the pigment-containing layer and the adhesive layer, and the water vapor permeability of the functional film is 10 g / m ² · day or less, Preferably it is 5 g / m ² · day or less.

(Other optical properties)
Since a plasma display generates intense near-infrared rays, it is preferable to provide near-infrared cutability when a light-transmitting electromagnetic wave shielding film is used particularly for a plasma display.
As a functional film which has near-infrared cut property, what has the transmittance | permeability in a wavelength range 800-1000 nm is 25% or less, More preferably, it is 15% or less, More preferably, it is 10% or less.

  Moreover, when using a translucent electromagnetic wave shielding film for a plasma display, it is preferable that the transmitted color is neutral gray or blue gray. This is because the light emission characteristics and contrast of the plasma display are maintained or improved, and white having a slightly higher color temperature than standard white may be preferred.

  Furthermore, the color plasma display is said to have insufficient color reproducibility. In particular, the emission spectrum of red display shows several emission peaks ranging from about 580 nm to about 700 nm, and has a relatively strong short wavelength. There is a problem in that red emission is not good in color purity close to orange due to the emission peak on the side. Therefore, the functional film preferably has a function of selectively reducing unnecessary light emission from the phosphor or the discharge gas which is the cause of the functional film.

  These optical properties can be controlled by using a dye. In other words, a near-infrared absorber is used for near-infrared cut, and a dye that selectively absorbs unnecessary luminescence can be used to reduce unnecessary luminescence. The color tone can also be made suitable by using a dye having appropriate absorption in the visible region.

  As the coloring matter, a general dye or pigment having a desired absorption wavelength in the visible region and a compound known as a near infrared absorbing agent can be used, and the type thereof is not particularly limited. , Phthalocyanine, methine, azomethine, oxazine, imonium, azo, styryl, coumarin, porphyrin, dibenzofuranone, diketopyrrolopyrrole, rhodamine, xanthene, pyromethene, dithiol Examples thereof include organic dyes that are generally commercially available, such as compounds and diiminium compounds.

Since the temperature of the panel surface of the plasma display is high and the temperature of the translucent electromagnetic wave shielding film rises when the temperature of the environment is high, it is preferable that the dye has heat resistance that does not deteriorate at, for example, about 80 ° C. is there.
In addition, some dyes have poor light resistance, but if such dyes are used to cause problems with light emission of plasma displays and deterioration of external light by ultraviolet rays or visible rays, a functional film as described above. It is preferable to prevent the dye from being deteriorated by ultraviolet rays or visible rays by adding an ultraviolet absorber or providing a layer that does not transmit ultraviolet rays.
The same applies to humidity and a combined environment in addition to heat and light. When it deteriorates, the transmission characteristics of the optical filter change, and the color tone may change or the near-infrared cutting ability may decrease.
Further, in order to dissolve or disperse in a resin composition for forming a transparent substrate or a coating composition for forming a coating layer, the dye preferably has high solubility and dispersibility in a solvent.

The concentration of the dye can be appropriately set from the absorption wavelength / absorption coefficient of the dye, the transmission characteristics / transmittance required for the translucent electromagnetic wave shielding film, and the type / thickness of the medium or coating film to be dispersed. .
When making a functional film contain a pigment | dye, you may contain in the inside of a transparent base material, and you may coat the layer containing a pigment | dye on the base-material surface. Moreover, two or more types of pigments having different absorption wavelengths may be mixed and contained in one layer, or two or more layers containing pigments may be included.

  In addition, since the dye may be deteriorated by contact with metal, when such a dye is used, the functional film containing the dye has a conductive layer on the translucent electromagnetic shielding film. More preferably, it is arranged so as not to contact the metal part.

When the translucent electromagnetic wave shielding film having the functional film attached thereto is attached to the display, it is usually attached so that the functional film is on the outside and the adhesive layer is on the display side.
Here, it is desirable to ground the conductive metal part so that the electromagnetic wave shielding ability of the translucent electromagnetic wave shielding film is not lowered. For this reason, it is desirable to form a conductive part for grounding on the translucent electromagnetic wave shielding film, and to make the conductive part electrically contact the ground part of the display body. The conducting part is preferably provided around the conductive metal part along the peripheral edge of the translucent electromagnetic shielding film.
The conductive part may be formed by a mesh pattern, or may not be patterned, for example, may be formed by a solid metal foil, but in order to make good electrical contact with the ground part of the display body, It is preferable that it is not patterned like a metal foil solid.

  The conductive portion may be a mesh pattern layer or an unpatterned layer of metal foil, for example, but a metal foil solid layer may be used for good electrical contact with the ground portion of the display body. It is preferable that the conductive portion is not patterned like a layer.

  For example, when the conductive part is not patterned like a solid metal foil and / or when the conductive part has a sufficiently strong mechanical strength, the conductive part itself can be used as an electrode.

In order to protect the conductive part and / or to make good electrical contact with the ground part when the conductive part is a mesh pattern layer, it may be preferable to form an electrode on the conductive part. The electrode shape is not particularly limited, but is preferably formed so as to cover all the conductive portions.
The material used for the electrode is a single element or an alloy of two or more of silver, copper, nickel, aluminum, chromium, iron, zinc, carbon, etc. Alternatively, a paste made of a synthetic resin and a mixture of these simple substances or alloys, or a paste made of borosilicate glass and a mixture of these simple substances or alloys can be used. Conventionally known methods can be employed for printing and coating the paste. Moreover, a commercially available conductive tape can also be used conveniently. The conductive tape has conductivity on both sides, and a single-sided adhesive type and a double-sided adhesive type using a carbon-dispersed conductive adhesive can be suitably used. The thickness of the electrode is not particularly limited, but is about several μm to several mm.

  ADVANTAGE OF THE INVENTION According to this invention, the optical filter excellent in the optical characteristic which can maintain or improve the image quality can be obtained, without impairing the brightness | luminance of a plasma display remarkably. In addition, it has excellent electromagnetic shielding ability to block electromagnetic waves that have been pointed out to be harmful to the health generated from plasma displays, and it also efficiently uses near-infrared rays near 800 to 1000 nm emitted from plasma displays. Since it is cut well, an optical filter that does not adversely affect the wavelengths used by the remote control of peripheral electronic devices, transmission optical communication, etc., and can prevent malfunctions thereof can be obtained. Furthermore, an optical filter having excellent weather resistance can be provided at a low cost.

  The features of the present invention will be described more specifically with reference to examples and comparative examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the specific examples shown below.

[Example 1]
(Emulsion A adjustment)
・ 1 liquid water 750ml
20g gelatin
Sodium chloride 1.6g
1,3-Dimethylimidazolidine-2-thione 20mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
・ Two liquids 300ml
150 g silver nitrate
・ 3 liquid water 300ml
Sodium chloride 38g
Potassium bromide 32g
Hexachloroiridium (III) potassium (0.005% KCl 20% aqueous solution) 5ml
Ammonium hexachlororhodate (0.001% NaCl 20% aqueous solution) 7ml
Potassium hexachloroiridium (III) (0.005% KCl 20% aqueous solution) and ammonium hexachlororhodate (0.001% NaCl 20% aqueous solution) used in the three solutions were dissolved in KCl 20% aqueous solution and NaCl 20% aqueous solution, respectively. And heated for 120 minutes.

  To 1 liquid maintained at 38 ° C. and pH 4.5, 90% of the 2 and 3 liquids were simultaneously added over 20 minutes with stirring to form 0.15 μm core particles. Subsequently, the following 4th and 5th liquids were added over 8 minutes, and the remaining 10% of the 2nd and 3rd liquids were further added over 2 minutes to grow particles to 0.18 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete the grain formation.

・ 4 liquid water 100ml
Silver nitrate 50g
・ 5 liquid 100ml
Sodium chloride 13g
Potassium bromide 11g
Yellow blood salt 5mg

Then, it washed with water by the flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C., 3 g of anionic precipitant-1 shown below was added, and the pH was lowered using sulfuric acid until the silver halide was precipitated (in the range of pH 3.2 ± 0.2). Met). Next, about 3 liters of the supernatant was removed (first water washing). Further, 3 liters of distilled water was added, and sulfuric acid was added until the silver halide settled. Again, 3 liters of the supernatant was removed (second water wash). The same operation as the second water washing was further repeated once (third water washing) to complete the water washing / desalting process. 8 g of gelatin was added to the emulsion after washing and desalting, adjusted to pH 5.6 and pAg 7.5, 10 mg of sodium benzenethiosulfonate, 3 mg of sodium benzenethiosulfinate, 15 mg of sodium thiosulfate and 10 mg of chloroauric acid were added. Chemical sensitization to obtain optimum sensitivity at 0 ° C., 100 mg of 1,3,3a, 7-tetraazaindene as stabilizer and 100 mg of proxel (trade name, manufactured by ICI Co., Ltd.) as preservative It was. Finally, a silver iodochlorobromide cubic grain emulsion containing 70 mol% of silver chloride and 0.08 mol% of silver iodide and having an average grain size of 0.18 μm and a coefficient of variation of 9% was obtained (final emulsion having pH = 5.7, pAg = 7.5, conductivity = 60 μS / m, density = 1.28 × 10 ³ kg / m ³ , viscosity = 60 mPa · s).

(Preparation of Sample 1-1)
A sample 1-1 was prepared by coating on a polyethylene terephthalate film support having a moisture-proof layer undercoat containing vinylidene chloride on both sides as shown below so as to have a UL layer / emulsion layer configuration. The preparation method, coating amount and coating method of each layer are shown below.
<Emulsion layer>
The emulsion A was subjected to spectral sensitization by adding sensitizing dye (sd-1) 5.7 × 10 ⁻⁴ mol / mol Ag. Furthermore, KBr 3.4 × 10 ⁻⁴ mol / mol Ag and compound (Cpd-3) 8.0 × 10 ⁻⁴ mol / mol Ag were added,
Mix well.
Then, 1,3,3a, 7-tetraazaindene 1.2 × 10 ⁻⁴ mol / mol Ag, hydroquinone 1.2 × 10 ⁻² mol / mol Ag, citric acid 3.0 × 10 ⁻⁴ mol / mol Ag, surfactant (Sa -1), (Sa-2) and (Sa-3) were added so that the coating amounts were 60 mg / m ² , 40 mg / m ² and 2 mg / m ² , respectively, and the pH of the coating solution was adjusted using citric acid. Adjusted to 5.6. Thus Ag7.6g / m ² The emulsion layer coating solution was prepared on the following support was coated to a gelatin 1.1 g / m ^2.

<UL layer>
Gelatin 0.23 g / m ²
Compound (Cpd-7) 40mg / m ²
Compound (Cpd-14) 10mg / m ²
Preservative (Proxel) 1.5mg / m ²

  In addition, the coating liquid of each layer added the thickener represented by the following structure (Z), and adjusted the viscosity.

<Support>
A polyethylene terephthalate resin having an intrinsic viscosity of 0.66 obtained by polycondensation using antimony trioxide as a main catalyst was dried to a moisture content of 50 ppm or less and melted in an extruder set at a heater temperature of 280 to 300 ° C.
The molten PET resin is discharged from a die part onto a chill roll electrostatically applied to obtain an amorphous base. The obtained amorphous base was stretched 3.1 times in the direction of base travel and then stretched 3.9 times in the width direction to produce a support having a thickness of 96 μm in the form of a roll.

<Back layer (adhesive layer located on the opposite side of the emulsion layer and support)>
The sample used in the present invention was coated and dried successively under the following coating conditions with a coating solution having the following composition to form the following back layer (easy adhesion layer).
After the biaxially stretched polyethylene terephthalate support is transported at a transport speed of 105 m / min, the surface of the support is subjected to corona discharge treatment under an applied energy of 727 J / m ² , and then antistatic comprising the following composition: The layer coating solution was applied by a bar coating method at a coating amount of 7.1 cc / m ² . Subsequently, an antistatic layer was obtained by drying at 180 ° C. for 1 minute in an air floating drying zone.

(First layer coating solution (for antistatic layer))
Distilled water 781.7 parts by mass Polyacrylic resin (Julimer ET-410: Nippon Pure Chemical Co., Ltd., solid content 30%) 30.9 parts by mass Acicular structure tin oxide particles (FS-10D: Ishihara Sangyo Co., Ltd., solid content 20%) 131.1 parts by mass Carbodiimide compound (Carbodilite V-02-L2: Nisshinbo, solid content 40%) 6.4 parts by mass surfactant (Sandet BL: Sanyo Chemical Industries solid content 44.6%) 1.4 parts by mass surfactant (Naroacty HN-100: Sanyo Kasei Kogyo Co., Ltd., solid content 100%) 0.7 parts by mass Silica fine particle dispersion (Seahoster KE-W30: Nippon Shokubai 0.3 μm solid content 20%) 5.0 parts by mass

While maintaining the conveyance speed of 105 m / min, a surface layer coating solution having the following composition was subsequently applied on the antistatic layer by a bar coating method at a coating amount of 5.05 cc / m ² . Subsequently, a back layer having a two-layer structure was obtained by drying at 160 ° C. for 1 minute in an air floating drying zone.

(Second-layer coating solution (for surface layer))
Distilled water 941.0 parts by mass Polyacrylic resin (Julimer ET-410: manufactured by Nippon Pure Chemicals, solid content 30%) 57.3 parts by mass epoxy compound (Denacol EX-521: manufactured by Nagase Chemical Industries, solid content 100%) 1.2 parts by mass Agent (Sandet BL: Sanyo Chemical Industries, solids 44.6%) 0.5 parts by mass

<Undercoat layer>
An undercoat coating solution having the following composition was simultaneously applied to the surface of the polyethylene terephthalate support opposite to the surface on which the back layer was formed, thereby forming an undercoat layer for an emulsion layer.
That is, in a state of being transported by the transport speed of 105m / min condition, performs a corona discharge treatment opposite facing surface of the support at 467J / m ² condition, bar coating a subbing layer 1-layer coating solution having the following composition It was applied by the method. The coating amount was 5.05 cc / m ^2, and the first undercoat layer was obtained by drying at 180 ° C. for 1 minute in the same air floating drying zone as the back layer antistatic layer drying zone.

<First undercoat layer>
Distilled water 823.0 parts by mass Styrene-butadiene copolymer latex (Nipol Latex LX407C5: ZEON Corporation solid content 40%) 151.5 parts by mass
2,4-Dichloro-6-hydroxy-s-triazine sodium salt (H-232: Sankyo Chemical, solid content 8%) 25.0 parts by weight Polystyrene fine particles (average particle size 2 μm)
(Nipol UFN1008: Nippon Zeon solid content 10%) 0.5 parts by mass

While maintaining the conveying speed of 105 m / min, a coating solution having the following composition was subsequently applied onto the first undercoat layer by the bar coating method. The coating amount was 8.7 cc / m ^2, and the second undercoat layer was obtained by drying at 160 ° C. for 1 minute in an air floating drying zone.

<2nd undercoat layer>
Distilled water 980.5 parts by weight Gelatin (alkali treatment) 14.8 parts by weight Methylcellulose (TC-5: Shin-Etsu Chemical Co., Ltd.) 0.46 parts by weight Compound (Cpd-21) 0.33 parts by weight Proxel (Cpd-22 solid content 3.5%) 2.0 parts by weight

<Application method>
First, two layers of the UL layer and the emulsion layer from the side closer to the support as the emulsion surface side were coated on the support with the above-mentioned subbing layer in the order of a simultaneous multi-layer by a slide bead coater method while maintaining at 35 ° C. It was passed through a set zone (5 ° C.). Here, Cpd-7, which is a hardener, was added to the UL layer immediately before coating, and was added to the emulsion layer by diffusing from the UL layer. The back layer was formed on the side opposite to the emulsion surface as described above, and finally passed through a cold air set zone (5 ° C.). When passing through each set zone, the coating solution showed a sufficient setting property. Subsequently, both sides were simultaneously dried in the drying zone.

Sample 1-1 thus obtained has a coating silver amount of 7.6 g / m ² , an Ag / gelatin mass ratio of the emulsion layer of 6.9, a swelling ratio of 209%, and a product of Ag / gelatin mass ratio and swelling ratio of 13.2. The photosensitive material had an emulsion layer as the uppermost layer. Here, the swelling ratio of the emulsion layer was determined as follows. That is, the thickness (a) of the emulsion layer at the time of drying is obtained by observing a section of the sample at the time of drying with a scanning electron microscope, immersed in distilled water at 25 ° C. for 1 minute, and then freeze-dried with liquid nitrogen. Was observed with a scanning electron microscope to determine the film thickness (b) of the emulsion layer during swelling, and the swelling ratio was calculated by the following equation.
Swell rate (%) = 100 × ((b) − (a)) / (a)

(Exposure and development processing)
A grid-like pattern capable of giving a developed silver image of line / space = 15 μm / 285 μm (pitch 300 μm) on the emulsion layer of the dried sample was obtained using an image setter FT-R5055 manufactured by Dainippon Screen Co., Ltd. Exposed. At this time, the exposure amount was adjusted to be optimal for each sample.
The exposed sample was subsequently subjected to development processing to create a metallic silver part.

・ Development processing process Temperature Time Black / white development 20 ° C 60 seconds Fixing 35 ° C 40 seconds Rinse 1 * 35 ° C 60 seconds Rinse 2 * 35 ° C 60 seconds Drying 50 ° C 60 seconds

One of the samples was subjected to electrolytic plating treatment.
・ Plating treatment Acid cleaning 35 ℃ 30 seconds Electrolytic plating 1 35 ℃ 30 seconds
Electrolytic plating 2 35 ℃ 30 seconds
Electrolytic plating 3 35 ℃ 30 seconds
Electrolytic plating 4 35 ° C 30 seconds
Rinse 3 * 35 ° C 10 seconds Rinse 4 * 35 ° C 10 seconds Rust prevention solution 35 ° C 30 seconds Rinse 5 * 25 ° C 60 seconds Rinse 6 * 25 ° C 60 seconds Drying 50 ° C 60 seconds
* The water-washing process was a two-tank counter-flow system from rinse 2 to 1, rinse 4 to 3, and rinse 6 to 5.

The composition of each treatment liquid is as follows.
[Black and white developer 1L prescription]
Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjust to pH 10.3

[Fixing solution 1L prescription]
ATS 1.2 mol Ammonium iodide 5 g
Ammonium sulfite monohydrate 25 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjust to pH 6.2

[Acid cleaning solution 1L formulation]
190 g of sulfuric acid
Hydrochloric acid (35%) 0.06 mL
Capper Gream PCM 5 mL
(Rohm and Haas Electronic Materials Co., Ltd.)
Add pure water and add 1 L

[Electrolytic plating solution 1L prescription]
・ Electrolytic copper plating solution composition (same replenisher composition)
Copper sulfate pentahydrate 75 g
190 g of sulfuric acid
Hydrochloric acid (35%) 0.06 mL
Capper Gream PCM 5 mL
(Rohm and Haas Electronic Materials Co., Ltd.)
Add pure water and add 1 L

[Anti-rust solution
A 0.01 mol / L aqueous solution of benzotriazole was used.

[Rinse solution 1L prescription (Rinse 1-6 are common)]
Deionized water (conductivity 5μS / cm or less) 1000 mL
Adjusted to pH 6.5

  The oxidation-reduction potential of the black and white developer was −340 mV vs SCE when expressed as a bath potential obtained by immersing the rotating platinum electrode in the developer.

(Creation of other samples)
As shown in Table 1, samples shown in Table 1 were prepared by changing the amount of gelatin (Gel) used for the binder of the emulsion. In addition, a sample not subjected to plating treatment, a sample subjected to reduction treatment after development processing, and a sample subjected to calendar treatment were prepared.
The reduction treatment was performed by treating with a 0.01 mol / L aqueous solution of sodium triacetoxyborohydride for 5 minutes. The calendering was performed by applying a linear pressure of 2940 N / cm (300 kg / cm) with a calender roll and passing the sample between calender rollers composed of two pairs of metal rolls.

  Each sample was subjected to the above-described exposure and development processes, and a light-transmitting electromagnetic wave shielding film composed of a conductive metal portion and a light transmission portion substantially free of metal was formed. Here, the conductive metal portion had a mesh pattern corresponding to the exposure pattern, and the line / space width was 15 μm / 285 μm in all samples. In all the samples, the aperture ratio of the light transmission portion was about 90%.

(Evaluation)
(Surface resistance)
The surface resistivity was measured using a Mitsubishi Chemical Corporation low resistivity meter, Lorester GP / ASP probe.
(Evaluation of fogging)
Each sample was developed without being exposed, and each sample was visually observed to evaluate whether a black spot-like or linear developed silver was formed. The evaluation criteria were as follows.
<Evaluation criteria for occurrence frequency of fog (observation of sample 1 m ² after development)>
Level A: Number of black spots or linear developed silver 0-3.
Level B: Number of black spots or linear developed silver 4 to 10.
Level C: Number of black spots or linear developed silver is 10 or more.

(Evaluation of disconnection level)
Each sample was developed and visually observed on each sample to evaluate the disconnection of the mesh. The evaluation criteria were as follows.
<Evaluation criteria of fog occurrence frequency (observation of sample 1m ² after development)>
Level A: Number of breaks 0-10.
Level B: Number of breaks 11 or more.
Level C: Number of disconnections 20 or more.
The obtained evaluation results are shown in Table 1.

Instead of sodium triacetoxyborohydride (NaHB (OCOCH ₃ ) ₃ ) of Example 1-4, dimethylamine borane ((CH ₃ ) ₂ NH BH ₃ ) or sodium borohydride (NaBH ₄ ) was used for permeation. A photoelectromagnetic wave shielding film was manufactured. The obtained examples are shown in Table 2.

  From the results shown in Tables 1 and 2, in the comparative examples (Samples 1-1 and 1-3) corresponding to the prior art, a mesh having a low surface resistivity, that is, a high electromagnetic wave shielding property can be obtained, but the disconnection is severe and fog is scattered. It was insufficient. In Sample 1-2, the disconnection and fogging were good, but the surface resistance value was high and the electromagnetic shielding ability was insufficient. On the other hand, the translucent electromagnetic wave shielding film of the present invention has a low surface resistivity, and also has few disconnections and fog.

(Production of optical filter)
Using the film having translucent electromagnetic wave shielding ability obtained in Example 1 (Sample 1-7),
A glass plate was bonded to the inner light-transmitting electromagnetic wave shielding film excluding the outer edge portion 20 mm through an acrylic light-transmitting adhesive material having a thickness of 25 μm. The acrylic light-transmitting pressure-sensitive adhesive layer contained a toning dye (PS-Red-G, PS-Violet-RC manufactured by Mitsui Chemicals) that adjusts the transmission characteristics of the optical filter. Furthermore, an antireflection film having a near-infrared cutting ability (trade name: Realak 772UV, manufactured by NOF Corporation) was bonded to the opposite main surface of the glass plate via an adhesive material to produce an optical filter.

  When the obtained optical filter is used for a plasma display panel, the display image does not have a metallic color, and has an electromagnetic wave shielding ability and a near infrared ray cutting ability that are not problematic in practical use. It was excellent. In addition, it was found that by adding a pigment, a toning function can be imparted, and it can be suitably used as an optical filter such as a plasma display.

It is a schematic diagram which shows an example of the electroplating tank suitably used for an electroplating process. It is a schematic diagram which shows an example of the electroconductive film obtained by the manufacturing method of the electroconductive film of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electroplating tank 11 Plating bath 12a, 12b Feed roller 13 Anode plate 14 Guide roller 16 Film 17 Liquid drain roller 21 Conductive film 22 Conductive functional layer 23 Support body 24 Exposure part (metal silver part)
25 Unexposed portion 26 Electrolytic plating processing portion 27 Electrolytic plating processing portion 28 Silver halide emulsion layer

Claims (14)

A method for producing a conductive film comprising a development step of exposing and developing a photosensitive film having a silver salt emulsion layer containing a silver salt on a support,
Furthermore, a reduction treatment step for bringing a reducing agent into contact with the surface of the photosensitive film;
A smoothing process for smoothing the photosensitive film;
A method for producing a conductive film, comprising: A development step of forming a metallic silver portion by exposing and developing a photosensitive film having a silver salt emulsion layer containing a silver salt on a support;
A reduction treatment step of bringing a reducing agent into contact with the surface of the metallic silver part;
A smoothing treatment step of smoothing the photosensitive film subjected to the reduction treatment;
A method for producing a conductive film, comprising:   The method for producing a conductive film according to claim 1, wherein the smoothing process is a calendar process.   The method for producing a conductive film according to claim 3, wherein the calendering is performed at a linear pressure of 1960 N / cm (200 kgf / cm) or more.   The method for producing a conductive film according to claim 1, wherein the reducing agent is an alkali.   The method for producing a conductive film according to claim 1 or 2, wherein the reducing agent is sodium triacetoxyborohydride, dimethylamine borane, or sodium borohydride.   The method for producing a conductive film according to claim 2, wherein the metallic silver part contains 50 to 100 mass% of Ag.   3. The method for producing a conductive film according to claim 2, wherein the metallic silver portion is not substantially subjected to physical development and / or plating treatment.   The method for producing a conductive film according to claim 2, further comprising an electrolytic plating process in which an electroplating process is performed on the metal silver part.   The method for producing a conductive film according to claim 9, wherein the electrolytic plating treatment is a treatment in a plating bath of 10 steps or less.   The method for producing a conductive film according to claim 2, wherein the metallic silver portion is treated with a silver ion ligand. A translucent electromagnetic wave shielding film formed by forming a mesh-like metallic silver portion on a support, wherein the mesh-like metallic silver portion contains 50 to 100% by mass of Ag and has a line width of 18 μm or less A thin silver wire is a metallic silver portion combined in a mesh shape with an aperture ratio of 85% or more, the shield film has a surface resistance of 5 Ω / sq or less, and the mesh-shaped metallic silver portion is 3 m or more in the longitudinal direction. A light-transmitting electromagnetic wave shielding film which is a shielding film which is continuous and has a disconnection of 10 mesh points / m ² or less in the mesh-shaped metallic silver portion.   The translucent electromagnetic wave shielding film according to claim 12, wherein a haze generated by light transmission is 10% or less.   A light-transmitting electromagnetic wave shielding film for a plasma display panel, an optical filter, or a plasma display panel produced using the light-transmitting electromagnetic wave shielding film according to claim 12 or 13.

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