JP2007201378A - Translucent electromagnetic wave shielding film, optical filter, and plasma display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To inexpensively provide an electromagnetic wave shielding film of a translucent continuous configuration having a superior durability, a high electromagnetic wave shielding property and a little light scattering, to provide a translucent electromagnetic wave shielding film in which the electromagnetic wave shielding property is compatible with a near infrared ray cutting performance, and also to provide an optical filter and a plasma display panel having the high electromagnetic wave shielding property and the high near infrared ray cutting performance. <P>SOLUTION: The translucent electromagnetic wave shielding film comprises the steps of: carrying out exposure and development treatments to a layer including silver salt provided on a transparent support to form a metallic silver portion and a light transmissive portion; and forming the metallic silver portion at a conductive metallic portion on which there is a conductive metal by carrying out a physical phenomenon and/or a deposition treatment of the metallic silver portion. An organic nitrogen heterocycle compound is included in the shielding film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a front surface of a display such as a CRT (cathode ray tube), PDP (plasma display panel), liquid crystal, ELP (electroluminescence panel, EL), FED (field emission display), microwave oven, electronic device, printed wiring. The present invention relates to a translucent electromagnetic shielding film that shields electromagnetic waves generated from a plate and the like and has translucency, an optical filter including the translucent electromagnetic shielding film, and a plasma display panel.

  In recent years, electromagnetic interference (Electro-Magnetic Interference: EMI) has been rapidly increasing with the increase in the use of various electric facilities and electronic application facilities. EMI has been pointed out to be a cause of malfunction and failure of electronic and electrical equipment, as well as a health hazard to operators of these devices. For this reason, in electronic and electrical equipment, it is required to suppress the intensity of electromagnetic wave emission within the standard or regulation.

  Although it is necessary to shield the electromagnetic wave as a countermeasure against the EMI, it is obvious that a property that does not allow the metal electromagnetic wave to penetrate may be used. For example, a method of making the casing a metal body or a high conductor, a method of inserting a metal plate between the circuit board and the circuit board, a method of covering the cable with a metal foil, and the like are employed. However, in CRT, PDP, etc., since the operator needs to recognize characters displayed on the screen, transparency in the display is required. For this reason, in any of the above methods, the front surface of the display often becomes opaque, which is inappropriate as an electromagnetic wave shielding method.

Particularly, since PDP generates a large amount of electromagnetic waves as compared with CRT or the like, stronger electromagnetic shielding ability is required. The electromagnetic wave shielding ability can be simply expressed by a surface resistance value. In the case of a translucent electromagnetic wave shielding material for CRT, the surface resistance value is required to be about 300Ω / sq or less, but for PDP. The translucent electromagnetic wave shielding material is required to have a resistance of 2.5Ω / sq or less, and in a plasma plasma for consumer use using a PDP, there is a high need for 1.5Ω / sq or less, and more preferably 0.1Ω / sq. An extremely high conductivity of sq or less is required.
Further, the required level of transparency is about 70% or more for CRT and 80% or more for PDP, and further higher transparency is desired.

  In order to solve the above-described problems, various materials and methods have been proposed so far that achieve both electromagnetic shielding properties and transparency using a metal mesh having openings as will be described below.

(1) Conductive fiber For example, Patent Document 1 discloses an electromagnetic shielding material made of conductive fiber. However, this shielding material has a drawback that when the display screen is shielded with a thick mesh line width, the screen becomes dark and the characters displayed on the display are difficult to see.

(2) Electroless Plating Processed Mesh A method of printing an electroless plating catalyst as a grid pattern by a printing method and then performing electroless plating has been proposed (for example, Patent Document 2, Patent Document 3 and the like). However, the line width of the catalyst to be printed is as thick as about 60 μm, which is inappropriate as a display application that requires a relatively small line width and a dense pattern.
Further, a method of electroless plating after forming a pattern of an electroless plating catalyst by applying a photoresist containing an electroless plating catalyst and performing exposure and development is proposed (for example, Patent Document 4). . However, the visible light transmittance of the conductive film was 72%, and the transparency was insufficient. Furthermore, since it is necessary to use extremely expensive palladium as an electroless plating catalyst that removes most after exposure, there is also a problem in terms of manufacturing cost.

(3) Etching Process Mesh Using Photolithographic Method A method of forming a metal thin film mesh on a transparent substrate by etching process using a photolithography method has been proposed (for example, Patent Documents 5 to 8). In this method, since fine processing is possible, a mesh having a high aperture ratio (high transmittance) can be created, and there is an advantage that shielding is possible even when strong electromagnetic waves are emitted. However, the manufacturing process is complicated and complicated, and the production cost is high. Further, it is known from the etching method that there is a problem that the intersection of the lattice pattern is thicker than the line width of the straight line portion. In addition, the problem of moire was pointed out and improvement was desired.

(4) Conductive metallic silver using silver halide and mesh using copper plating on developed silver Method of forming conductive mesh with conductive metallic silver obtained by developing silver halide, or silver halide There has been proposed a method of forming a conductive mesh by plating metallic copper on a developed silver mesh obtained by developing a metal (for example, Patent Documents 9 and 10).

JP-A-5-327274 JP 11-170420 A Japanese Patent Laid-Open No. 5-288989 JP-A-11-170421 JP 2003-46293 A Japanese Patent Laid-Open No. 2003-23290 Japanese Patent Laid-Open No. 5-16281 JP-A-10-338848 JP 2004-207001 A JP 2004-221564 A

The metal mesh obtained by using the silver salt photography method using silver halide as described above can be manufactured with a smaller number of steps and the manufacturing cost can be reduced compared to the manufacturing process of the etching mesh using photolithography. It has special features. On the other hand, it had the following problems.
That is, the durability required for the electromagnetic shielding material used for the display is not sufficient, and improvement has been desired.

In particular, in the method using silver halide, improvement in low productivity by electroless plating has been desired. In other words, the translucent conductive film made by using the photographic photosensitive material using silver salt disclosed in Patent Document 10 can form a fine line pattern more precisely than other methods, so it is highly transparent and inexpensively mass-produced. However, it is difficult to perform direct electroplating with this film because the developed silver mesh has a high electric resistance. It is necessary to use both electroless plating and electrolytic plating. When electroless plating and electrolytic plating are used in combination, productivity is lowered, and there is a problem that the plating cost is increased.
Moreover, in the said patent document 10, the electrolytic plating process is performed by a single wafer process and a batch process. When electroplating is performed on a film having a large surface resistance of 1 Ω / □ or more by single wafer processing, a large portion of the film portion in contact with the plating solution is plated at a portion near the current flowing side. In particular, this phenomenon occurred at the start of plating, that is, at the first power supply, and it was difficult to uniformly apply the plating even if the plating was continued thereafter.

  Furthermore, improvement in low productivity due to the discontinuous mesh pattern has been demanded. Conventional mesh forming methods, except for the above-described fiber method, could not create a mesh having a break in a certain area. This is because when the mesh pattern is formed, the pattern of the catalyst core in the electroless copper plating method is a printing method such as screen printing, so the mesh breaks in units of size such as screen or intaglio, and the exposure mask size in photolithography. The mesh was broken in the unit. That is, in photolithography, there is a region without a mesh pattern. The reason is that since the exposure method is a single wafer photomask, the exposure to the exposure photoresist cannot be continuously exposed over the entire roll film, and the exposure within the size range of the photomask is 1 This is because the method is repeated once.

  For this reason, for example, in the case of PDP use, a manufacturing method has been adopted in which the mesh pattern of the created shielding material is aligned with the optical filter material based on the PDP module, front plate, glass, or the like. . In this method, the shield material is lost, and in order to improve productivity, even if it is attempted to use a rolled shield material with the shield material connected, it takes time to align and the production speed is sufficiently increased. I could not.

Furthermore, in the electromagnetic wave shielding film as described above, near infrared cut performance is an important required characteristic for the purpose of preventing malfunction of the remote control. In particular, with the recent increase in the brightness of PDPs, the amount of near infrared rays generated has increased, so that even higher near infrared ray cutting performance is required.
Giving this near-infrared cut function can be obtained by pasting the functional layer with an electromagnetic wave shielding film, etc., but the electromagnetic wave shielding film is intermittent as described above, and causes a large amount of loss. As long as the optical filter is manufactured, the film having the near-infrared cut function also has the disadvantage that it is used only intermittently as described above.
In addition, in PDP applications, in addition to the electromagnetic wave shielding ability and near infrared ray cutting ability described above, an antireflection function is indispensable. The film or functional film having the antireflection function is also a roll-like film like the film having the near-infrared cut function, and therefore when the electromagnetic wave shielding film has a discontinuous mesh pattern and is bonded to the antireflection film. In addition, there is a problem that a loss portion where the antireflection film is not used is generated.

The present invention has been made in view of the circumstances that the metal mesh pattern is prone to oxidative degradation and has insufficient stability over time, in addition to the improvement in bonding failure, non-productivity, and loss of constituent materials in the above-described laminated structure. And an object of the present invention is to provide a transmissive electromagnetic shielding film having excellent durability in use environment and storage environment over time, having high electromagnetic shielding properties, small light scattering and high light transmittance, and An object of the present invention is to provide a manufacturing method for manufacturing a shielding film in large quantities at low cost with high productivity and low material loss.
Furthermore, another object of the present invention is to provide a translucent electromagnetic wave shielding film having both high electromagnetic wave shielding properties and high near infrared ray cutting performance.
A further object of the present invention is to provide an optical filter and a plasma display having high electromagnetic shielding properties and high near infrared cut performance.

The above-mentioned problems of the present invention have been solved by the following inventions 1 to 5 of the electromagnetic shielding film, optical filter and plasma display.
1. The silver salt-containing layer provided on the transparent support is exposed and developed to form a metallic silver part and a light-transmitting part, and the metallic silver part is further subjected to physical development and / or plating treatment. A translucent electromagnetic wave shielding film in which a conductive metal part carrying a conductive metal is formed on the surface of a metallic silver part, further comprising an organic nitrogen-containing heterocyclic compound in the shielding film Translucent electromagnetic shielding film.
2. 2. The translucent electromagnetic wave shielding film as described in 1 above, wherein the transparent support is a plastic film.
3. 3. The translucency as described in 1 or 2 above, wherein the conductive metal film is formed from fine mesh-like lines of 1 to 40 μm, and a pattern formed by the fine mesh-like lines is continuous for 3 m or more. Electromagnetic shielding film.
4). An optical filter for a plasma display panel, comprising the electromagnetic wave shielding film according to any one of 1 to 3 above.
5). A plasma display panel comprising the electromagnetic wave shielding film as described in any one of 1 to 3 above.

According to the present invention, a transparent electromagnetic wave shielding film having excellent durability, high electromagnetic wave shielding properties, small light scattering and high light transmittance can be produced at low cost by reducing the loss of shielding material and improving productivity. A translucent electromagnetic wave shielding film having a continuous mesh pattern formed in a large amount can be provided.
Further, although the mesh pattern is composed of fine metal wires, it is possible to maintain a stable and excellent electromagnetic shielding effect both in the use environment and in the storage environment over time.
In addition, it is possible to provide a translucent electromagnetic shielding film that has both high electromagnetic shielding properties and high near-infrared cutting performance, and to provide an optical filter and plasma display having high electromagnetic shielding properties and high near-infrared cutting performance. Can do.

Hereinafter, specific embodiments of the present invention will be described in detail.
In the present specification, since the “electromagnetic wave shielding film” is carried on a film-like support, the “electromagnetic wave shielding film” or simply “ Sometimes called “film”.
Further, in this specification, the “mesh” of the “continuous mesh pattern” refers to a mesh pattern composed of a plurality of fine lines or a mesh composed of a plurality of thin lines according to an example in the art.
Furthermore, the meaning of “continuous” refers to a long film such as a roll, and its advantages will be described later.

[Configuration of translucent electromagnetic shielding film]
(Summary of thickness of each layer)
The thickness of the support of the translucent electromagnetic wave shielding film of the present invention is preferably 5 to 200 μm, and more preferably 30 to 150 μm. If it is the range of 5-200 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.

  The thickness of the metallic silver portion provided on the support before physical development and / or plating can be appropriately determined according to the coating thickness of the silver salt-containing layer coating applied on the support. The thickness of the metallic silver part is preferably 30 μm or less, more preferably 20 μm or less, further preferably 0.01 to 9 μm, and most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is a pattern shape, and it is especially desirable that it is a mesh-shaped pattern. The metallic silver part may be a single layer or a multilayer structure of two or more layers. When the metallic silver portion has a pattern shape and has a multilayer structure of two or more layers, different color sensitivities can be imparted so that it can be exposed to different wavelengths. Thereby, when the exposure wavelength is changed and exposed, a different pattern can be formed in each layer. The translucent electromagnetic wave shielding film including the multilayered patterned metal silver portion formed as described above can be used as a high-density printed wiring board.

The thickness of the conductive metal part is preferable as the use of the electromagnetic shielding material for the display because the viewing angle of the display increases as the thickness decreases. Furthermore, as a use of the conductive wiring material, a thin film is required because of a demand for high density. From such a viewpoint, the thickness of the layer made of the conductive metal carried on the conductive metal part is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and more preferably 0.1 μm or more. More preferably, it is less than 3 μm.
Since the light-transmitting electromagnetic wave shielding film of the present invention is most advantageously produced from a silver halide photographic light-sensitive material, in the following description of the present invention, the light-transmitting property obtained from the silver halide photographic light-sensitive material is almost the same. Although described in accordance with the electromagnetic wave shielding film and its production method, as long as it is a translucent electromagnetic wave shielding film using patterned developed silver, it is not limited to an electromagnetic wave shielding film derived from a silver halide photographic material. Absent.
In the present invention, a metallic silver portion having a desired thickness is formed by adjusting the coating thickness of the silver salt-containing layer of the above-described silver salt photosensitive material, and further from the conductive metal particles by physical development or plating treatment or both. Since the thickness of the layer can be freely controlled, even a translucent electromagnetic wave shielding film having a thickness of less than 5 μm, preferably less than 3 μm, can be easily formed.

  In the conventional method using etching, it was necessary to remove and discard most of the metal thin film by etching, but in the present invention, a pattern containing only a necessary amount of conductive metal is provided on the support. Therefore, it is sufficient to use only the minimum amount of metal, which is advantageous from the viewpoints of reducing the manufacturing cost and the amount of metal waste.

  Next, the electroplating performed continuously for 3 m or more used for this invention is demonstrated.

<Electrolytic plating>
Hereinafter, preferred embodiments of the electrolytic plating method will be specifically described with reference to the drawings. The plating apparatus for suitably carrying out the above-mentioned electrolytic plating treatment is to expose the emulsion layer, and from the reel for delivery (not shown) around which the developed film is wound, the sequentially fed film is fed to an electroplating tank. The film after feeding and plating is sequentially wound on a winding reel (not shown).

  FIG. 1 shows an example of an electrolytic plating tank suitably used for the electrolytic plating treatment. The electrolytic plating tank 10 shown in FIG. 1 is capable of performing a plating process continuously on a long film 16 (which has been subjected to the above exposure and development processes). The arrow indicates the conveyance direction of the film 16. The electrolytic plating tank 10 includes a plating bath 11 that stores a plating solution 15. A pair of anode plates 13 are disposed in parallel in the plating bath 11, and a pair of guide rollers 14 are disposed inside the anode plate 13 so as to be rotatable in parallel with the anode plate 13. The guide roller 14 can move in the vertical direction, thereby adjusting the plating processing time of the film 16.

Above the plating bath 11, a pair of feed rollers (cathodes) 12 a and 12 b for guiding the film 16 to the plating bath 11 and supplying current to the film 16 are rotatably disposed. A liquid draining roller 17 is rotatably disposed above the plating bath 11 and below the outlet-side power feeding roller 12b. Between the liquid draining roller 17 and the outlet-side power feeding roller 12b. Is provided with a water spray (not shown) for removing the plating solution from the film.
The anode plate 13 is connected to a plus terminal of a power supply device (not shown) via an electric wire (not shown), and the power supply rollers 12a and 12b are connected to a minus terminal of the power supply device (not shown). .

  In the electrolytic plating tank 10 described above, for example, when the size of the electrolytic plating tank is 10 × 10 × 10 cm to 100 × 200 × 300 cm, the lowermost portion of the surface where the feeding roller 12a on the entrance side and the film 16 are in contact with each other The distance (distance La shown in FIG. 1) between the surface and the plating solution is preferably 0.5 to 15 cm, more preferably 1 to 10 cm, and even more preferably 1 to 7 cm. Moreover, it is preferable that the distance (distance Lb shown in FIG. 1) between the lowermost part of the surface where the power supply roller 12b on the outlet side and the film 16 are in contact with the plating solution surface is 0.5 to 15 cm.

Next, a method for strengthening conductivity by forming a copper plating layer on the mesh-like silver fine wire pattern of the film using the plating apparatus including the electrolytic plating tank 10 will be described.
First, the plating solution 15 is stored in the plating bath 11. As the plating solution, in the case of copper plating, a copper sulfate pentahydrate containing 30 to 300 g / L and sulfuric acid containing 30 to 300 g / L can be used. In the case of nickel plating, nickel sulfate, nickel hydrochloride or the like can be used, and in the case of iron silver plating, one containing silver cyanide or the like can be used. Moreover, you may add additives, such as surfactant, a sulfur compound, and a nitrogen compound, to a plating solution.

The film 16 is set in a state where it is wound around a supply reel (not shown), and the film 16 is transported so that the surface of the film 16 on which the plating should be formed contacts the power supply rollers 12a and 12b. Wrap it around (not shown). The surface resistance of the film immediately before electrolytic plating is preferably 1 to 1000Ω / □, more preferably 5 to 500Ω / □, and further preferably 10 to 100Ω / □.
A voltage is applied to the anode plate 13 and the power supply rollers 12a and 12b, and the film 16 is conveyed while being in contact with the power supply rollers 12a and 12b. The film 16 is introduced into the plating bath 11 and immersed in the plating solution 15 to form a copper plating. When passing between the liquid draining rollers 17, the plating solution 15 adhered to the film 16 is wiped off and collected in the plating bath 11. This is repeated in a plurality of electrolytic plating tanks, finally washed with water, and then wound up on a take-up reel (not shown).
The conveyance speed of the film 16 is set in the range of 1 to 30 m / min. The conveyance speed of the film 16 is preferably in the range of 1 to 10 m / min, and more preferably in the range of 2 to 5 m / min.

Although the number of electrolytic plating tanks is not particularly limited, 2 to 10 tanks are preferable, and 3 to 6 tanks are more preferable.
The applied voltage is preferably in the range of 1 to 100V, more preferably in the range of 2 to 60V. When a plurality of electrolytic plating tanks are installed, it is preferable to lower the applied voltage of the electrolytic plating tank stepwise. Moreover, as an electric current amount by the side of the entrance of the 1st tank, 1-30A is preferable and 2-10A is more preferable.
The power supply rollers 12a and 12b are preferably in contact with the entire surface of the film (the portion of the contact area that is substantially in electrical contact is 80% or more).

  In addition, it is preferable to perform water washing and acid washing before performing a plating process in the said electrolytic plating tank. As the treatment liquid used for the acid cleaning, one containing sulfuric acid or the like can be used.

  The thickness of the conductive metal portion plated by the electrolytic plating treatment is preferable because the viewing angle of the display is increased as the thickness of the electromagnetic shielding material for the display is reduced. Furthermore, as a use of the conductive wiring material, a thin film is required because of a demand for high density. From such a viewpoint, the thickness of the shield film made of the plated conductive metal is preferably less than 9 μm, more preferably from 0.1 μm to less than 5 μm, and from 0.1 μm to less than 3 μm. More preferably.

Moreover, in the plating process of this invention, if the surface resistance of the film just before performing said electroplating process is a film of 1-1000 ohms / square, you may perform an electroless-plating process before that.
When performing electroless plating, a known electroless plating technique can be used, for example, an electroless plating technique used in a printed wiring board or the like can be used. Preferably there is.
Chemical species contained in the electroless copper plating solution include copper sulfate, copper chloride, reducing agent, formalin, glyoxylic acid, copper ligand, EDTA, triethanolamine, etc., bath stabilization and plating Examples of the additive for improving the smoothness of the film include polyethylene glycol, yellow blood salt, and bipyridine.

  Moreover, it is preferable that the electroconductive pattern on a film is continuous (it is not interrupted electrically). It is only necessary to be partially connected, and if the conductive pattern is interrupted, there is a possibility that a portion where plating cannot be applied in the first electrolytic plating tank may be formed or uneven.

  The plating rate during the plating process can be performed under moderate conditions, but high-speed plating of 5 μm / hr or more is also possible. In the plating process, from the viewpoint of improving the stability of the plating solution, for example, various additives such as a ligand such as EDTA can be added to the plating solution and used.

  The thickness of the conductive metal part plated by the above plating treatment is preferable because the viewing angle of the display is increased as the thickness of the electromagnetic shielding material for the display is reduced. Furthermore, as a use of the conductive wiring material, a thin film is required because of a demand for high density. From such a viewpoint, the thickness of the plated conductive metal layer is preferably less than 9 μm, more preferably from 0.1 μm to less than 5 μm, and from 0.1 μm to less than 3 μm. Is more preferable.

  The film applicable to the plating treatment method of the present invention can be applied to any film as long as it has a film surface with a surface resistance of 1Ω / □ to 1000Ω / □, for example, on an insulator film. The present invention can be applied to a printed wiring board to be formed, a translucent conductive film used for an electromagnetic wave shielding film for PDP, and the like. The surface resistivity is preferably low for electroplating, and the range thereof is 1Ω / □ to 500Ω / □, and the more preferable range is 1Ω / □ to 100Ω / □.

Next, the rust preventive agent contained in the electromagnetic wave shielding film of the present invention will be described.
In the electromagnetic wave shielding film of the present invention, the rust inhibitor may be contained in the photosensitive material (for example, in the emulsion layer or in the surface protective coarse) which is the material of the shielding film, and the photosensitive material is developed after pattern exposure. May be contained in the developing solution, fixing solution or stabilizing solution at the time, and may be taken into the shield film during the processing, or the electrolytic plating solution, the electroless plating solution, the oxidizing solution after the development processing, It may be contained in an independent rust inhibitor bath and incorporated into the shield film during processing. It is particularly preferable that it be contained in an oxidizing solution or an independent rust preventive bath and be incorporated into the shield film during the treatment with the liquid bath.
It is presumed that the rust preventive agent is adsorbed on the fine mesh wire, and it is considered that the rust preventive / stabilizing effect is exhibited in this state.
As the rust preventive agent used in the present invention, a nitrogen-containing heterocyclic compound or an organic mercapto compound is preferable, and among them, a nitrogen-containing heterocyclic compound is preferably used.
Preferable examples of the nitrogen-containing organic heterocyclic compound are preferably 5- or 6-membered azoles, and more preferably 5-membered azoles.

A preferred nitrogen-containing 5-membered or 6-membered ring structure is a non-requisite for forming a 5- or 6-membered heterocycle composed of at least one of a carbon atom, a nitrogen atom, an oxygen atom, a sulfur atom and a selenium atom. Represents a metal atom group. This heterocyclic ring may be condensed with a carbon aromatic ring or a heteroaromatic ring.
Examples of the hetero ring include a tetrazole ring, a triazole ring, an imidazole ring, a thiadiazole ring, an oxadiazole ring, a selenadiazole ring, an oxazole ring, a thiazole ring, a benzoxazole ring, a benzthiazole ring, a benzimidazole ring, a pyrimidine ring, and a triazaine. Examples thereof include a den ring, a tetraazaindene ring, and a pentaazaindene ring. R _a1 is a carboxylic acid or a salt thereof (for example, sodium salt, potassium salt, ammonium salt, calcium salt), a sulfonic acid or a salt thereof (for example, sodium salt, potassium salt, ammonium salt, magnesium salt, calcium salt), phosphonic acid or a salt thereof Salt (for example, sodium salt, potassium salt, ammonium salt), substituted or unsubstituted amino group (for example, unsubstituted amino, dimethylamino, diethylamino, methylamino, bismethoxyethylamino), substituted or unsubstituted ammonium group (for example, trimethyl) Ammonium, triethylammonium, dimethylbenzylammonium).

These rings may have a substituent, and the substituent is represented by Ln-Rm.
L represents a single bond, a divalent aliphatic group, a divalent aromatic hydrocarbon group, a divalent heterocyclic group, or a linking group combining these.
L is preferably a single bond, an alkylene group having 1 to 10 carbon atoms (for example, each group of methylene, ethylene, propylene, butylene, isopropylene, 2-hydroxypropylene, hexylene, and octylene), and an alkenylene group having 2 to 10 carbon atoms. (For example, each group of vinylene, propenylene, and butenylene), an aralkylene group having 7 to 12 carbon atoms (for example, phenethylene group), an arylene group having 6 to 12 carbon atoms (for example, phenylene, 2-chlorophenylene, 3-methoxyphenylene, naphthylene) Each group), a divalent group of a heterocyclic group having 1 to 10 carbon atoms (for example, pyridyl, thienyl, furyl, triazolyl, imidazolyl groups), a single bond, and a group arbitrarily combining these groups It _{may, -CO -, - sO 2 -} , - NR 202 -, - O- or -S- and also any combination But good. Here, R ₂₀₂ is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms (for example, methyl, ethyl, butyl, or hexyl groups), an aralkyl group having 7 to 10 carbon atoms (for example, benzyl phase, phenethyl group), 6 carbon atoms. To 10 aryl groups (for example, phenyl and 4-methylphenymethylphenyl groups). A single bond is particularly preferable.

  R represents a nitro group, a halogen atom (eg, chlorine atom, bromine atom), a mercapto group, a cyano group, a substituted or unsubstituted alkyl group (eg, methyl, ethyl, propyl, t-butyl, cyanoethyl groups), aryl Groups (eg phenyl, 4-methanesulfonamidophenyl, 4-methylphenyl, 3,4-dichlorophenyl, naphthyl groups), alkenyl groups (eg allyl groups), aralkyl groups (eg benzyl, 4-methylbenzyl, Phenethyl groups), sulfonyl groups (eg methanesulfonyl, ethanesulfonyl, p-toluenesulfonyl groups), carbamoyl groups (eg unsubstituted carbamoyl, methylcarbamoyl, phenylcarbamoyl groups), sulfamoyl groups (eg unsubstituted) Sulfamoyl, methylsulfamoyl Phenylsulfamoyl groups), carbonamide groups (eg acetamido and benzamide groups), sulfonamido groups (eg methanesulfonamide, benzenesulfonamide, p-toluenesulfonamide groups), acyloxy groups (eg acetyl) Oxy, benzoyloxy groups), sulfonyloxy groups (for example, methanesulfonyloxy), ureido groups (for example, unsubstituted ureido, methylureido, ethylureido, phenylureido groups), acyl groups (for example, acetyl, benzoyl groups) ), Oxycarbonyl groups (for example, methoxycarbonyl, phenoxycarbonyl groups), oxycarbonylamino groups (for example, methoxycarbonylamino, phenoxycarbonylamino, 2-ethylhexyloxycarbonylamino groups), Etc. In Dorokishiru group may be substituted.

  n and m represent an integer of 1 to 3, but when n and m each represent 2 or 3, each R may be the same or different.

Specific examples of preferable nitrogen-containing organic heterocyclic compounds include the following.
That is, imidazole, benzimidazole, benzoindazole, benzotriazole, benzoxazole, benzothiazole, pyridine, quinoline, pyrimidine, piperidine, piperazine, quinoxaline, morpholine, etc., these include alkyl groups, carboxyl groups, sulfo groups, etc. May have the following substituents.

Preferred nitrogen-containing 6-membered ring compounds are compounds having a triazine ring, a pyrimidine ring, a pyridine ring, a pyrroline ring, a piperidine ring, a pyridazine ring or a pyrazine ring, and among them, a compound having a triazine ring or a pyrimidine ring is preferable. These nitrogen-containing 6-membered ring compounds may have a substituent, and the substituent in that case is 1 to 6 carbon atoms, more preferably 1 to 3 lower alkyl groups, 1 to 6 carbon atoms, and more. Preferably 1-3 lower alkoxy groups, hydroxyl groups, carboxyl groups, mercapto groups, 1-6 carbon atoms, more preferably 1-3 alkoxyalkyl groups, 1-6 carbon atoms, more preferably 1-3 hydroxyalkyls. Groups.
Specific examples of preferable nitrogen-containing 6-membered ring compounds include triazine, dimethyltriazine, dimethyltriazine, hydroxyethyltriazine ring, pyrimidine, 4-methylpyrimidine, pyridine and pyrroline.

Examples of organic mercapto compounds include alkyl mercapto compounds, aryl mercapto compounds, and heterocyclic mercapto compounds.
Examples of the alkyl mercapto compound include cysteine and thiomalic acid, examples of the aryl mercapto compound include thiosalicylic acid, and examples of the heterocyclic mercapto compound include 2-phenyl-1-mercaptotetrazole, 2-mercaptobenzimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2-mercaptopyrimidine, 2,4-dimercaptopyrimidine, 2-mercaptopyridine and the like, and these include substituents such as alkyl group, carboxyl group, sulfo group, etc. May be included.

These rust inhibitors can be used alone or in combination.
The rust preventive agent used in the present invention can be included in the electromagnetic wave shielding film by each method as described above, but it can be processed into an electromagnetic wave shielding film or an intermediate stage of its production process in the form of an aqueous solution. preferable. For example, after making it into aqueous solution, it is applied to the conductive metal part by immersing it in a transparent base material in which the conductive metal part is formed in the aqueous solution. The rust prevention treatment is preferably performed on the conductive metal part after the firing treatment. The rust inhibitor aqueous solution used at this time contains the rust inhibitor compound in a concentration of 10 ⁻⁶ to 10 ⁻¹ mol, preferably 10 ⁻⁵ to 10 ⁻² mol, in 1 liter. preferable. Moreover, it is preferable to adjust pH of aqueous solution to 2-12 from a viewpoint of melt | dissolving a rust preventive agent, pH adjustment is phosphoric acid as buffer as well as usual alkalis and acids, such as sodium hydroxide and a sulfuric acid. Or a salt thereof, carbonate, acetic acid or a salt thereof, boric acid or a salt thereof, or the like can be used.

[Easily adhesive layer]
A preferred easy-adhesion layer used in the present invention will be described. The easy adhesion layer may be composed of one layer, or may be composed of two or more layers.
In the present invention, the following two-layered easy-adhesion layer may be provided on the surface of the support on the side where the photosensitive emulsion layer is provided and on the surface opposite to the emulsion layer across the support. preferable. In particular, the easy adhesion layer is preferably provided on the side opposite to the emulsion layer.

(composition)
First layer: anti-static layer comprising water-dispersible or water-soluble synthetic resin, carbodiimide compound, conductive metal oxide particles as essential components Second layer: water-dispersible or water-soluble synthetic resin, and crosslinking agent as essential components Surface layer (which is not a surface layer by being laminated with other constituent layers, but is referred to as a surface layer in the sense of the uppermost layer of the easy-adhesion layer).

The easy adhesion layer is provided with an antistatic layer and a surface layer in this order on a support. In the antistatic layer of the present invention, the haze of the low chargeable support obtained by providing the antistatic layer on the support is 3% or less, and the surface electrical resistance of the surface layer of the resulting light-sensitive material is 8 ×. Conductivity is imparted so as to be in the range of 10 ^{6 to} 6 × 10 ⁸ Ω. By providing the antistatic layer, it is possible to suppress the occurrence of trouble with dust caused by static electricity and the occurrence of static discharge fogging of the photosensitive material in the manufacturing process for handling the plastic support.

  The antistatic layer is a layer containing conductive metal oxide particles, and generally further contains a binder. The conductive metal oxide particles are preferably acicular particles having a major axis to minor axis ratio (major axis / minor axis) in the range of 3 to 50. In particular, those having a major axis / minor axis in the range of 10 to 50 are preferable. The minor axis of such acicular particles is preferably in the range of 0.001 to 0.1 μm, and particularly preferably in the range of 0.01 to 0.02 μm. The major axis is preferably in the range of 0.1 to 5.0 μm, and particularly preferably in the range of 0.1 to 2.0 μm.

Examples of the material of the conductive metal oxide particles include ZnO, TiO ₂ , SnO ₂ , Al ₂ O ₃ , In ₂ O ₃ , MgO, BaO and MoO _3, and complex oxides thereof, and metal oxides thereof. Further, metal oxides containing different atoms can be given. As the metal oxide, SnO ₂ , ZnO, Al ₂ O ₃ , TiO ₂ , In ₂ O ₃ and MgO are preferable, SnO ₂ , ZnO, In ₂ O ₂ and TiO ₂ are preferable, and SnO ₂ is particularly preferable. . Examples of containing a small amount of different atoms include Zn or Al, In, TiO ₂ Nb or Ta, In ₂ O ₃ Sn, and SnO ₂ Sb, Nb or halogen elements. An element doped with 0.01 to 30 mol% (preferably 0.1 to 10 mol%) of the element can be used. When the amount of the different element added is less than 0.01 mol%, sufficient conductivity cannot be imparted to the oxide or composite oxide. When the amount exceeds 30 mol%, the degree of blackening of the particles increases, and the charge is increased. Since the prevention layer is darkened, it is not suitable for a silver salt photographic light-sensitive material. Therefore, in the present invention, the material of the conductive metal oxide particles is preferably one containing a small amount of a different element with respect to the metal oxide or the composite metal oxide. Also preferred are those containing an oxygen defect in the crystal structure. As the conductive metal oxide particles containing a small amount of the dissimilar atom, SnO ₂ particles are preferred antimony-doped, SnO ₂ particles are preferred which are particularly doped antimony 0.2-2.0 mol%. Therefore, in the present invention, it is advantageous to use a metal oxide particle such as antimony-doped SnO ₂ having the dimensions of the short axis and the long axis in order to form an antistatic layer that is transparent and has good conductivity. is there. As a result, it is possible to easily obtain a silver salt photosensitive material having a low chargeable support having a haze of 3% or less and having a surface electrical resistance of 8 × 10 ^{6 to} 6 × 10 ⁸ Ω in the surface layer. it can.

About the reason why an antistatic layer which is transparent and has good conductivity can be advantageously formed by using acicular metal oxide particles having the dimensions of the short axis and the long axis (eg, antimony-doped SnO ₂ ). Is considered as follows. In the antistatic layer, the needle-like metal oxide particles extend long in the major axis direction parallel to the surface of the antistatic layer, but the length of the minor axis in the thickness direction of the layer. It only occupies. Since such acicular metal oxide particles are long in the major axis direction as described above, they are easier to contact with each other than ordinary spherical particles, and high conductivity can be obtained even in a small amount. Accordingly, the surface electrical resistance can be reduced without impairing the transparency. Further, in the needle-like metal oxide particles, the minor axis diameter is usually smaller than or substantially the same as the thickness of the antistatic layer and rarely protrudes on the surface. Therefore, it is almost completely covered by the surface layer provided on the antistatic layer. Therefore, there is obtained an advantage that there is almost no occurrence of powder falling which is a detachment of the protruding portion from the layer during conveyance of the support for the silver salt photosensitive material, during conveyance of the light-sensitive material for exposure and development. Furthermore, the change in surface electrical resistance before and after the development processing of the silver-sensitive salt material is extremely small when the above-mentioned acicular metal oxide is used, compared to the relatively large case of spherical particles, and particularly the development processing. It can also be said that the subsequent transportability is remarkably improved. This is presumed to be due to the fact that in the case of spherical particles, due to the swelling and shrinkage of the film due to the development process, the arrangement state changes compared to the case of acicular particles, and the number of parts that contact each other decreases.

  The antistatic layer used in the present invention generally contains a binder that disperses and supports conductive metal oxide particles. As a material for the binder, various polymers such as an acrylic resin, a vinyl resin, a polyurethane resin, and a polyester resin can be used. From the viewpoint of preventing powder falling, a cured product of a polymer (preferably an acrylic resin, a vinyl resin, a polyurethane resin, or a polyester resin) and a carbodiimide compound is preferable. In the present invention, from the viewpoint of maintaining a good working environment and preventing air pollution, it is preferable to use either a water-soluble polymer or a carbodiimide compound, or an aqueous dispersion such as an emulsion. Further, the polymer has any group of a methylol group, a hydroxyl group, a carboxyl group, and an amino group so that a crosslinking reaction with the carbodiimide compound is possible. A hydroxyl group and a carboxyl group are preferred, and a carboxyl group is particularly preferred. The content of hydroxyl group or carboxyl group in the polymer is preferably 0.0001 to 1 equivalent / 1 kg, particularly preferably 0.001 to 1 equivalent / 1 kg.

  Acrylic resins include acrylic acid esters such as acrylic acid and alkyl acrylate, acrylamide, acrylonitrile, methacrylic acid esters such as methacrylic acid and alkyl methacrylate, and homopolymers of any monomer of methacrylamide and methacrylonitrile. Or the copolymer obtained by superposition | polymerization of 2 or more types of these monomers can be mentioned. Among these, homopolymers of monomers of acrylic acid esters such as alkyl acrylates and methacrylic acid esters such as alkyl methacrylates, or copolymers obtained by polymerization of two or more of these monomers preferable. For example, mention may be made of homopolymers of monomers of acrylic acid esters and methacrylic acid esters having an alkyl group having 1 to 6 carbon atoms, or copolymers obtained by polymerization of two or more of these monomers. it can. The acrylic resin has the above composition as a main component and, for example, partially uses a monomer having any group of a methylol group, a hydroxyl group, a carboxyl group, and an amino group so that a crosslinking reaction with a carbodiimide compound is possible. The resulting polymer.

  Examples of the vinyl resin include polyvinyl alcohol, acid-modified polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, polyvinyl methyl ether, polyolefin, ethylene / butadiene copolymer, polyvinyl acetate, vinyl chloride / vinyl acetate copolymer, vinyl chloride / ( A meth) acrylic acid ester copolymer and an ethylene / vinyl acetate copolymer (preferably ethylene / vinyl acetate / (meth) acrylic acid ester copolymer) can be mentioned. Among these, polyvinyl alcohol, acid-modified polyvinyl alcohol, polyvinyl polymer, polyolefin, ethylene / butadiene copolymer and ethylene / vinyl acetate copolymer (preferably ethylene / vinyl acetate / acrylic acid ester copolymer). Is preferred. The vinyl resin can be crosslinked with a carbodiimide compound so that, for example, polyvinyl alcohol, acid-modified polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, polyvinyl methyl ether, and polyvinyl acetate leave a vinyl alcohol unit in the polymer. Thus, the polymer having a hydroxyl group is used, and the other polymer is, for example, a crosslinkable polymer by partially using a monomer having any of a methylol group, a hydroxyl group, a carboxyl group, and an amino group.

  Examples of the polyurethane resin include polyhydroxy compounds (eg, ethylene glycol, propylene glycol, glycerin, trimethylolpropane), aliphatic polyester polyols obtained by reaction of polyhydroxy compounds and polybasic acids, polyether polyols (eg, Polyurethane derived from poly (oxypropylene ether) polyol, poly (oxyethylene-propylene ether) polyol), polycarbonate-based polyol, and polyethylene terephthalate polyol, or a mixture thereof and polyisocyanate can be given. In the polyurethane resin, for example, the hydroxyl group remaining unreacted after the reaction between polyol and polyisocyanate can be used as a functional group capable of crosslinking reaction with a carbodiimide compound.

  As the polyester resin, generally used is a polymer obtained by reacting a polyhydroxy compound (eg, ethylene glycol, propylene glycol, glycerin, trimethylolpropane) with a polybasic acid. In the above-mentioned polyester resin, for example, the hydroxyl group and carboxyl group remaining unreacted after the reaction between the polyol and the polybasic acid can be used as a functional group capable of crosslinking reaction with the carbodiimide compound. Of course, a third component having a functional group such as a hydroxyl group may be added.

  Among the above polymers, acrylic resins and polyurethane resins are preferable, and acrylic resins are particularly preferable.

As the carbodiimide compound used in the present invention, a compound having a plurality of carbodiimide structures in the molecule is preferably used.
Polycarbodiimide is usually synthesized by a condensation reaction of organic diisocyanate. Here, the organic group of the organic diisocyanate used for the synthesis of the compound having a plurality of carbodiimide structures in the molecule is not particularly limited, and either aromatic or aliphatic, or a mixed system thereof can be used. An aliphatic system is particularly preferred from the viewpoint of reactivity.
As the synthetic raw material, organic isocyanate, organic diisocyanate, organic triisocyanate and the like are used.
As examples of organic isocyanates, aromatic isocyanates, aliphatic isocyanates, and mixtures thereof can be used.

Specifically, 4,4′-diphenylmethane diisocyanate, 4,4-diphenyldimethylmethane diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, cyclohexane Diisocyanate, xylylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, 4,4′-dicyclohexylmethane diisocyanate, 1,3-phenylene diisocyanate, etc. are used. As organic monoisocyanates, isophorone isocyanate, phenyl isocyanate are used. Cyclohexyl isocyanate, butyl isocyanate, naphthyl isocyanate and the like are used.
Moreover, the carbodiimide type compound that can be used in the present invention is also available as a commercial product such as Carbodilite V-02-L2 (trade name: manufactured by Nisshinbo Co., Ltd.).
The carbodiimide compound used in the present invention is preferably added in an amount of 1 to 200% by mass, more preferably 5 to 100% by mass, based on the binder.

  In the present invention, in order to form the antistatic layer, first, for example, a dispersion liquid in which the conductive metal oxide particles are dispersed as they are or in a solvent such as water (including a dispersant and a binder as necessary) is used. A coating solution for forming an antistatic layer is prepared by adding and mixing (dispersing as necessary) an aqueous dispersion or aqueous solution containing the binder (eg, polymer, carbodiimide compound and appropriate additive). The antistatic layer is a coating method generally known on the surface of a plastic film such as polyester (the side where no photosensitive layer is provided), such as dip coating, air knife coating, It can be applied by a curtain coating method, a wire bar coating method, a gravure coating method, an extrusion coating method or the like. The plastic film such as polyester to be applied may be any one before sequential biaxial stretching, before simultaneous biaxial stretching, after uniaxial stretching and before re-stretching, or after biaxial stretching. It is preferable that the surface of the plastic support on which the coating solution for forming the antistatic layer is applied in advance with a surface treatment such as an ultraviolet irradiation treatment, a corona discharge treatment, or a glow discharge treatment.

  In the present invention, the thickness of the antistatic layer is preferably in the range of 0.01 to 1 μm, more preferably in the range of 0.01 to 0.2 μm. If the coating agent is less than 0.01 μm, it is difficult to uniformly apply the coating agent, and uneven coating tends to occur on the product. If it exceeds 1 μm, the antistatic performance and scratch resistance may be inferior. The conductive metal oxide particles are preferably contained in the antistatic layer in the range of 10 to 1000% by weight with respect to the binder (eg, the total of the polymer and the carbodiimide compound), and more preferably 100 to 500%. A range of% by weight is preferred. If it is less than 10% by weight, sufficient antistatic properties cannot be obtained, and if it exceeds 1000% by weight, the haze becomes too high.

  In the present invention, additives such as a matting agent, a surfactant and a slipping agent can be used in combination with the antistatic layer and the following surface layer, if necessary. Examples of the matting agent include particles of oxides such as silicon oxide, aluminum oxide, and magnesium oxide having a particle diameter of 0.001 to 10 μm, and particles of a polymer or a copolymer such as polymethyl methacrylate and polystyrene. Can do. Examples of the surfactant include known anionic surfactants, cationic surfactants, amphoteric surfactants and nonionic surfactants. Examples of slip agents include natural waxes such as carnauba wax, phosphate esters of higher alcohols having 8 to 22 carbon atoms or amino salts thereof; palmitic acid, stearic acid, behenic acid and esters thereof; and silicone compounds. Can do.

  In the present invention, a surface layer is provided on the antistatic layer. The surface layer is provided mainly to assist the adhesion imparting with the adhesive layer and the anti-detachment function of the conductive metal oxide particles of the antistatic layer. As the material for the surface layer, various polymers such as acrylic resin, vinyl resin, polyurethane resin, and polyester resin can be generally used, and polymers described as the binder in the antistatic layer are preferable.

The crosslinking agent used for the surface layer is preferably an epoxy compound that does not affect the photosensitive properties of the photosensitive material layer that is contacted when the roll is wound in the manufacturing process.
Examples of the epoxy compound include 1,4-bis (2 ′, 3′-epoxypropyloxy) butane, 1,3,5-triglycidyl isocyanurate, 1,3-diglycidyl-5- (γ-acetoxy-β-oxy Propyl) isosinurate, sorbitol polyglycidyl ethers, polyglycerol polyglycidyl ethers, pentaerythritol polyglycidyl ethers, diglycerol polyglycidyl ether, 1,3,5-triglycidyl (2-hydroxyethyl) isocyanurate, glycerol poly Epoxy compounds such as glycerol ethers and trimethylolpropane polyglycidyl ethers are preferable, and specific examples of commercially available products include Denacol EX-521 and EX-614B (manufactured by Nagase Chemical Industries). Although it is not intended to be limited thereto.

  In addition, it can be used in combination with other crosslinkable compounds within the range of addition amount that does not affect the photosensitivity, for example, “The Theory of the Photographic Process” 3rd edition (1966) by CEKMeers and THJames. , U.S. Pat. Nos. 2,725,295, 3,100,704, 3,091,537, 3,321,313, 3,543,292 and 3,125,449, and British Patents 994869, 1,167,207, and the like. .

  As a typical example, a melamine compound containing at least one of two or more (preferably three or more) methylol groups and an alkoxymethyl group or a condensation polymer thereof, a melamine resin or a melamine urea resin, Is mucochloric acid, mucobromic acid, mucofenoxycyclolic acid, mucophenoxypromic acid, formaldehyde, glyoxal, monomethylglioxal, 2,3-dihydroxy-1,4-dioxane, 2,3-dihydroxy-5-methyl-1, Aldehyde compounds such as 4-dioxanesuccinaldehyde, 2,5-dimethoxytetrahydrofuran and glutaraldehyde and derivatives thereof; divinylsulfone-N, N′-ethylenebis (vinylsulfonylacetamide), 1,3-bis (vinylsulfonyl)- 2-Pro Nord, methylene bismaleimide, 5-acetyl-1,3-diacryloyl-hexahydro-s-triazine, 1,3,5-triacryloyl-hesahydro-s-triazine and 1,3,5-trivinylsulfonyl-hexahydro- active vinyl compounds such as s-triazine; 2,4-dichloro-6-hydroxy-s-triazine sodium salt, 2,4-dichloro-6- (4-sulfoanilino) -s-triazine sodium salt, 2,4- Active halogen compounds such as dichloro-6- (2-sulfoethylamino) -s-triazine and N, N′-bis (2-chloroethylcarbamyl) piperazine; bis (2,3-epoxypropyl) methylpropylammonium P-toluenesulfonate, 2,4,6-triethylene-s-triazine, 1, -Ethyleneimine compounds such as hexamethylene-N, N'-bisethyleneurea and bis-β-ethyleneiminoethylthioether; 1,2-di (methanesulfoneoxy) ethane, 1,4-di (methanesulfoneoxy) Methanesulfonic acid ester compounds such as butane and 1,5-di (methanesulfonoxy) pentane; carbodiimide compounds such as dicyclohexylcarbodiimide and 1-dicyclohexyl-3- (3-trimethylaminopropyl) carbodiimide hydrochloride; 2,5- Isoxazole compounds such as dimethylisoxazole; inorganic compounds such as chromium alum and chromium acetate; N-carboethoxy-2-isopropoxy-1,2-dihydroquinoline and N- (1-morpholinocarboxy) -4- Removal of methylpyridium chloride, etc. Condensation type peptide reagents; active ester compounds such as N, N′-adipoyldioxydisuccinimide and N, N′-terephthaloyldioxydisuccinimide: toluene-2,4-diisocyanate and 1,6-hexa Examples thereof include, but are not limited to, isocyanates such as methylene diisocyanate; and epichlorohydrin compounds such as polyamide-polyamine-epichlorohydrin reactant.

  For the formation of the surface layer, first, the polymer, epoxy compound, and appropriate additive are added to a solvent such as water (including a dispersant and a binder as necessary) and mixed (dispersed if necessary). To prepare a surface layer coating solution.

  The surface layer is a coating method generally well known on the antistatic layer used in the present invention, such as a dip coating method, an air knife coating method, a curtain coating method, a wire bar coating method, a gravure coating method, an extrusion coating method, etc. Can be formed by applying the surface layer coating solution. The layer thickness of the surface layer is preferably in the range of 0.01 to 1 μm, and more preferably in the range of 0.01 to 0.2 μm. If it is less than 0.01 μm, the anti-detachment function of the conductive metal oxide particles of the antistatic layer is insufficient, and if it exceeds 1 μm, it is difficult to uniformly apply the coating agent, and uneven coating tends to occur on the product.

[Adhesive layer]
The adhesive layer preferably used in the present invention will be described.
The translucent electromagnetic wave shielding film of the present invention is bonded via an adhesive layer when incorporated in an optical filter, a liquid crystal display panel, a plasma display panel, other image display panels, or the like.

  The refractive index of the adhesive used in the present invention is preferably 1.40 to 1.70. This is because the difference between the transparent base material such as a plastic film used in the present invention and the refractive index of the adhesive is reduced to prevent the visible light transmittance from being lowered. When it is .40 to 1.70, the decrease in visible light transmittance is small and good.

The adhesive used in the present invention is also preferably an adhesive that flows by heating or pressurization, and in particular, heating at 200 ° C. or less or pressurization at 1 kgf / cm ² (9.8 N / cm ² ) or more. It is preferable that the adhesive exhibits fluidity. Since it can flow, the electromagnetic wave shielding adhesive film can be easily adhered to an adherend having a curved surface or a complicated shape by lamination or pressure molding, particularly pressure molding. For this purpose, the softening temperature of the adhesive is preferably 200 ° C. or lower. Since the environment in which the electromagnetic wave shielding adhesive film is used is usually less than 80 ° C., the softening temperature of the adhesive layer is preferably 80 ° C. or higher, and most preferably 80 to 120 ° C. in view of workability. The softening temperature is a temperature at which the viscosity becomes 10 ¹² poises or less, and normally, the flow is recognized within a time of about 1 to 10 seconds at that temperature.

  Typical examples of the adhesive that flows by heating or pressurization as described above include the following thermoplastic resins. For example, natural rubber (refractive index n = 1.52), polyisoprene (n = 1.521), poly-1,2-butadiene (n = 1.50), polyisobutene (n = 1.505 to 1.51), polybutene (n = 1.513), poly- Such as 2-heptyl-1,3-butadiene (n = 1.50), poly-2-tert-butyl-1,3-butadiene (n = 1.506), poly-1,3-butadiene (n = 1.515) ) Polyenes such as ene, polyoxyethylene (n = 1.456), polyoxypropylene (n = 1.450), polyvinyl ethyl ether (n = 1.454), polyvinyl hexyl ether (n = 1.459), polyvinyl butyl ether (n = 1.456) Ethers, polyesters such as polyvinyl acetate (n = 1.467), polyvinyl propionate (n = 1.467), polyurethane (n = 1.5 to 1.6), ethyl cellulose (n = 1.479), polyvinyl chloride (n = 1.54 to 1.55) ), Polyacrylonitrile (n = 1.52), polymethacrylonitrile (n = 1.52), polysulfone (n = 1.633), polysulfide (n = 1.6), phenoxy resin (n = 1.5 to 1.6), polyethyl acrylate (n = 1.469), polybutyl acrylate (n = 1.466), poly-2-ethylhexyl acrylate (n = 1.463) , Poly-t-butyl acrylate (n = 1.464), poly-3-ethoxypropyl acrylate (n = 1.465), polyoxycarbonyltetramethylene (n = 1.465), polymethyl acrylate (n = 1.472-1.480), polyisopropyl Methacrylate (n = 1.473), polydodecyl methacrylate (n = 1.474), polytetradecyl methacrylate (n = 1.475), poly-n-propyl methacrylate (n = 1.484), poly-3,3,5-trimethylcyclohexyl methacrylate ( n = 1.484), polyethyl methacrylate (n = 1.485), poly-2-nitro-2-methylpropyl methacrylate (n = 1.487), poly-1,1-diethylpropyl methacrylate (n = 1.485). 489) and poly (meth) acrylic acid esters such as polymethyl methacrylate (n = 1.489) can be used. Two or more kinds of these acrylic polymers may be copolymerized as needed, or two or more kinds may be blended and used.

  Further, copolymer resins other than acrylic resin and other than acrylic include epoxy acrylate (n = 1.48 to 1.60), urethane acrylate (n = 1.5 to 1.6), polyether acrylate (n = 1.48 to 1.49), polyester acrylate (n = 1.48 ~ 1.54) can also be used. In particular, urethane acrylate, epoxy acrylate, and polyether acrylate are excellent from the viewpoint of adhesiveness. Examples of epoxy acrylate include 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, and resorcinol. (Meth) acrylic such as diglycidyl ether, diglycidyl adipate, diglycidyl phthalate, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether An acid adduct is mentioned. A polymer having a hydroxyl group in the molecule such as epoxy acrylate is effective for improving the adhesion. These copolymer resins can be used in combination of two or more as required. The softening temperature of the polymer used as these adhesives is preferably 200 ° C. or less, and more preferably 150 ° C. or less from the viewpoint of handleability. Since the environment in which the electromagnetic wave shielding adhesive film is used is usually 80 ° C. or lower, the softening temperature of the adhesive layer is most preferably 80 to 120 ° C. in view of processability. On the other hand, it is preferable to use a polymer having a weight average molecular weight (measured using a standard polystyrene calibration curve by gel permeation chromatography, the same applies hereinafter) of 500 or more. When the molecular weight is 500 or less, the cohesive force of the adhesive composition is too low, and the adhesion to the adherend may be reduced. You may mix | blend additives, such as a diluent, a plasticizer, antioxidant, a filler, a coloring agent, a ultraviolet absorber, and a tackifier, with the adhesive agent used by this invention as needed. The thickness of the adhesive layer is preferably 10 to 80 μm, and more preferably 20 to 50 μm, more than the thickness of the conductive layer.

  Moreover, the adhesive which coat | covers the pattern of a mesh-like thin wire | line and other geometric figures is 0.14 or less of the refractive index difference with a transparent plastic base material. In the case where the transparent plastic substrate is laminated with the conductive material through the adhesive layer, the difference in refractive index between the adhesive layer and the adhesive covering the mesh-like fine line or other geometric pattern is zero. .14 or less. This is because if the refractive index of the transparent plastic substrate and the adhesive, or the refractive index of the adhesive and the adhesive layer are different, the visible light transmittance is lowered. If the difference in refractive index is 0.14 or less, the visible light transmittance is reduced. The decrease in light transmittance is small and good. Adhesive materials that satisfy these requirements include bisphenol A type epoxy resin, bisphenol F type epoxy resin, and tetrahydroxyphenylmethane type epoxy resin when the transparent plastic substrate is polyethylene terephthalate (n = 1.575; refractive index). , Novolac epoxy resin, resorcinol type epoxy resin, polyalcohol / polyglycol type epoxy resin, polyolefin type epoxy resin, epoxy resin such as alicyclic and halogenated bisphenol (all have a refractive index of 1.55 to 1.60) it can. Other than epoxy resin, natural rubber (n = 1.52), polyisoprene (n = 1.521), poly1,2-butadiene (n = 1.50), polyisobutene (n = 1.505 to 1.51), polybutene (n = 1.5125), poly- Such as 2-heptyl-1,3-butadiene (n = 1.50), poly-2-tert-butyl-1,3-butadiene (n = 1.506), poly-1,3-butadiene (n = 1.515) ) Polyenes such as ene, polyoxyethylene (n = 1.4563), polyoxypropylene (n = 1.4495), polyvinyl ethyl ether (n = 1.454), polyvinyl hexyl ether (n = 1.4591), polyvinyl butyl ether (n = 1.4563) Ethers, polyesters such as polyvinyl acetate (n = 1.4665), polyvinyl propionate (n = 1.4665), polyurethane (n = 1.5 to 1.6), ethyl cellulose (n = 1.479), polyvinyl chloride (n = 1.5 4-1.55), polyacrylonitrile (n = 1.52), polymethacrylonitrile (n = 1.52), polysulfone (n = 1.633), polysulfide (n = 1.6), phenoxy resin (n = 1.5-1.6), etc. Can do. These express suitable visible light transmittance.

In addition, acrylic resins are well known as those that hardly change color over time, and are preferably used in the present invention. Examples include polyethyl acrylate (n = 1.4685), polybutyl acrylate (n = 1.466), poly-2-ethylhexyl acrylate (n = 1.463), poly-t-butyl acrylate (n = 1.4638), poly-3- Ethoxypropyl acrylate (n = 1.465), polyoxycarbonyltetramethacrylate (n = 1.465), polymethyl acrylate (n = 1.472 to 1.480), polyisopropyl methacrylate (n = 1.4728), polydodecyl methacrylate (n = 1.474), poly Tetradecyl methacrylate (n = 1.4746), poly-n-propyl methacrylate (n = 1.484), poly-3,3,5-trimethylcyclohexyl methacrylate (n = 1.484), polyethyl methacrylate (n = 1.485), poly-2 -Nitro-2-methylpropyl methacrylate (n = 1.4868), polytetracarbanyl Poly (meth) acrylic acid esters such as acrylate (n = 1.4889), poly-1,1-diethylpropyl methacrylate (n = 1.4889), polymethyl methacrylate (n = 1.4893), acrylic acid and methacrylic acid can be used. It is. Two or more kinds of these acrylic polymers may be copolymerized as necessary, or two or more kinds may be blended and used.
By blending a plurality of types of acrylic polymers having different molecular weights, it is possible to adjust the viscoelasticity of the adhesive to a desired property.

  Furthermore, epoxy acrylate, urethane acrylate, polyether acrylate, polyester acrylate, or the like can also be used as a copolymer resin other than an acrylic resin and an acrylic compound. In particular, epoxy acrylate and polyether acrylate are excellent from the viewpoint of adhesiveness. As the epoxy acrylate, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, allyl alcohol diglycidyl ether, resorcinol diglycidyl ether (Meth) acrylic acid adducts such as adipic acid diglycidyl ester, phthalic acid diglycidyl ester, polyethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, pentaerythritol tetraglycidyl ether, sorbitol tetraglycidyl ether Is mentioned. Epoxy acrylate has a hydroxyl group in the molecule and is effective in improving adhesiveness, and these copolymer resins can be used in combination of two or more as required. The polymer used as the main component of the adhesive has a weight average molecular weight of 1,000 or more. When the molecular weight is 1,000 or less, the cohesive force of the composition is too low, so that the adhesion to the adherend is lowered.

  Adhesive curing agents include amines such as triethylenetetramine, xylenediamine, and diaminodiphenylmethane, acid anhydrides such as phthalic anhydride, maleic anhydride, dodecyl succinic anhydride, pyromellitic anhydride, and benzophenone tetracarboxylic anhydride, Diaminodiphenyl sulfone, tris (dimethylaminomethyl) phenol, polyamide resin, dicyandiamide, ethylmethylimidazole and the like can be used. These may be used alone or in combination of two or more. The addition amount of these crosslinking agents is selected in the range of 0.1 to 50 parts by mass, preferably 1 to 30 parts by mass with respect to 100 parts by mass of the polymer. If the added amount is less than 0.1 parts by mass, curing may be insufficient, and if it exceeds 50 parts by mass, excessive crosslinking may occur, which may adversely affect adhesiveness. You may mix | blend additives, such as a diluent, a plasticizer, antioxidant, a filler, and a tackifier, with the resin composition of the adhesive agent used by this invention as needed. Then, the resin composition of this adhesive is applied to cover a part or the whole surface of the base material of the constituent material provided with a geometric figure drawn with a conductive material on the surface of the transparent plastic base material, After the solvent drying and heat curing steps, the adhesive film according to the present invention is obtained. The adhesive film having electromagnetic shielding properties and transparency obtained above can be used by directly attaching to an adhesive film adhesive such as a CRT, PDP, liquid crystal, EL display, an acrylic plate, a glass plate, etc. Affixed to a plate or sheet of a sheet and used as a display. Further, the adhesive film is used in the same manner as described above for a window or a case for looking inside a measuring apparatus, measuring apparatus or manufacturing apparatus that generates electromagnetic waves. Furthermore, it is provided in a window of a building or a window of an automobile that may be affected by an electromagnetic wave interference by a radio tower or a high voltage line. And it is preferable to provide a ground wire in the geometric figure drawn with the electroconductive material.

  Even when the transparent substrate has irregularities and has haze to scatter light, a resin with a refractive index close to that of the transparent plastic substrate is smoothly applied to the uneven surface, or a resin sheet is laminated. Diffuse reflection is minimized, and transparency is developed. In addition, the geometric figure drawn with the conductive material of the present invention is not visually recognized by the naked eye because the line width is very small. Moreover, since the pitch is sufficiently large, it is considered that apparent transparency is expressed. On the other hand, since the pitch of the geometric figure is sufficiently smaller than the wavelength of the electromagnetic wave to be shielded, it is considered that excellent shielding properties are exhibited.

  As shown in Japanese Patent Application Laid-Open No. 2003-188576, the lamination of a transparent base film and a metal foil is performed by using heat such as an ethylene-vinyl acetate copolymer resin or an ionomer resin having high heat-fusibility as the transparent base film. When a fusible resin film is used alone or laminated with another resin film, it can be performed without providing an adhesive layer, but usually a dry laminating method using an adhesive layer. Lamination is performed by such means. Examples of the adhesive constituting the adhesive layer include adhesives such as acrylic resin, polyester resin, polyurethane resin, polyvinyl alcohol resin, vinyl chloride / vinyl acetate copolymer resin, or ethylene-vinyl acetate copolymer resin. In addition to these, thermosetting resins and ionizing radiation curable resins (such as ultraviolet curable resins and electron beam curable resins) can also be used.

  In general, since the surface of the display is made of glass, bonding with a pressure-sensitive adhesive is a bonding between a transparent plastic film and a glass plate. Distorted or the display color looks different from the original display. In any case, the problem of bubbles and peeling occurs when the pressure-sensitive adhesive peels from the plastic film or glass plate. This phenomenon may occur on both the plastic film side and the glass plate side, and peeling occurs on the side with weaker adhesion. Therefore, it is necessary that the adhesive force between the pressure-sensitive adhesive, the plastic film and the glass plate is high. Specifically, the adhesive strength between the transparent plastic film and glass plate and the pressure-sensitive adhesive layer is preferably 10 g / cm (10 N / m) or more in a test method in conformity with ISO 8225 at 80 ° C., and 20 g / cm (20 N / m). m) or more, more preferably 30 g / cm (30 N / m) or more. However, a pressure-sensitive adhesive exceeding 2000 g / cm (2 kN / m) may not be preferable because the bonding operation becomes difficult. However, if this problem does not occur, it can be used without problems. Furthermore, it is also possible to provide an interleaving paper (separator) so that the portion of the pressure-sensitive adhesive not facing the transparent plastic film does not unnecessarily come into contact with other portions.

  The adhesive is preferably transparent. Specifically, the total light transmittance is preferably 70% or more, more preferably 80% or more, and most preferably 85 to 92%. Furthermore, it is preferable that the degree of purity is low. Specifically, 0 to 3% is preferable, and 0 to 1.5% is more preferable. The pressure-sensitive adhesive used in the present invention is preferably colorless so as not to change the original display color of the display. However, even if the resin itself is colored, if the thickness of the pressure-sensitive adhesive is thin, it can be regarded as substantially colorless. Similarly, when intentionally coloring as described later, it is not within this range.

  Examples of the pressure-sensitive adhesive having the above properties include acrylic resins, α-olefin resins, vinyl acetate resins, acrylic copolymer resins, urethane resins, epoxy resins, vinylidene chloride resins, vinyl chloride resins, Examples thereof include ethylene-vinyl acetate resin, polyamide resin, and polyester resin. Of these, acrylic resins are preferred. Even when the same resin is used, when the pressure-sensitive adhesive is synthesized by a polymerization method, the amount of the cross-linking agent is reduced, a tackifier is added, or the molecular end group is changed. It is also possible to improve the performance. Even if the same pressure-sensitive adhesive is used, it is possible to improve the adhesion by modifying the surface to which the pressure-sensitive adhesive is bonded, that is, the surface of the transparent plastic film or glass plate. Examples of such surface modification methods include physical methods such as corona discharge treatment and plasma glow treatment, and methods such as forming an underlayer for improving adhesion.

  From the viewpoints of transparency, colorlessness, and handling properties, the thickness of the pressure-sensitive adhesive layer is preferably about 5 to 50 μm. In the case where the pressure-sensitive adhesive layer is formed of an adhesive, the thickness is preferably reduced within the above range. Specifically, it is about 1 to 20 μm. However, when the display color of the display itself is not changed as described above and the transparency is within the above range, the thickness may exceed the above range.

(Peel strength)
In the present invention, the adhesion strength of the film provided with an adhesive layer on the easy-adhesive layer of the easy-adhesive film, when the sample film is attached to glass and the 180 ° C. peel strength is measured at 100 mm / min Furthermore, it is preferable that the peel strength is 20 N / m or more. Furthermore, the peel strength after aging for 72 hours at 60 ° C. and 90% relative humidity is preferably a peel strength of 20 N / m or more.

[Method for producing translucent electromagnetic wave shielding film]
In the present invention, the translucent electromagnetic wave shielding film is a photosensitive material having an emulsion layer containing a photosensitive silver halide salt on a support, or a photosensitive material coated with a photopolymer for photolithography (as described above. (But not limited to the former), a metallic silver part and a light-transmitting part are formed in the exposed part and the unexposed part, respectively, by exposing and developing, and if necessary, the metallic silver It can be manufactured by supporting a conductive metal on the metallic silver part by subjecting the part to physical development and / or plating treatment.
The method for forming a translucent electromagnetic wave shielding film of the present invention includes the following three forms depending on the photosensitive material and the form of development processing.
(I) A method in which a photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei is chemically developed or thermally developed to form a metallic silver portion on the photosensitive material. (II) Physical development nuclei are contained in a silver halide emulsion layer. (III) Photosensitive silver halide black-and-white photosensitive material not containing physical development nuclei and physical development nuclei A method of superimposing an image receiving sheet having a non-photosensitive layer containing, and performing diffusion transfer development to form a metallic silver portion on the non-photosensitive image receiving sheet The aspect (I) is an integrated black-and-white development type, Metallic silver is formed on the material. The resulting developed silver is chemically developed silver or heat developed silver, and is highly active in the subsequent plating or physical development process in that it is a filament with a high specific surface.
In the embodiment (II), silver halide grains close to the physical development nucleus are dissolved and deposited on the development nucleus in the exposed portion, whereby metallic silver is formed on the photosensitive material. This is also an integrated black-and-white development type. Although the developing action is precipitation on physical development nuclei, it is highly active, but developed silver has a spherical shape with a small specific surface.
In the embodiment (III), the silver halide grains are dissolved and diffused in the unexposed area and deposited on the development nuclei on the image receiving sheet, whereby metallic silver is formed on the image receiving sheet. This is a so-called separate type in which the image receiving sheet is peeled off from the photosensitive material.
In any embodiment, either negative development processing or reversal development processing can be selected (in the case of the diffusion transfer system, negative development processing is possible by using an auto-positive type photosensitive material as the photosensitive material). .
The chemical development, thermal development, and dissolution physical development referred to here have the same meanings as are commonly used in this field. For example, Shinichi Kikuchi “Photochemistry” (Kyoritsu Publishing Co., Ltd., 1955) Publication), C.I. E. K. It is described in “The Theory of Photographic Processes, 4th edition” edited by Mees (Mcmillan, 1977). Although this case is a liquid processing, a thermal development method is also applied as a development method for other applications. For example, Japanese Patent Application Laid-Open Nos. 2004-184893, 2004-334077, 2005-010752, Japanese Patent Application Nos. 2004-244080, and 2004-085655 can be applied.
Hereinafter, the photosensitive material and each of the above steps will be described.

(1) Photosensitive material (1-1) Support As a support for the photosensitive material used in the production method of the present invention, a plastic film, a plastic plate, a glass plate, or the like can be used.
Examples of the raw material for the plastic film and plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate; polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, EVA; polyvinyl chloride, Vinyl resins such as polyvinylidene chloride; polyether ether ketone (PEEK), polysulfone (PSF), polyether sulfone (PES), polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC) Etc. can be used.
In the present invention, the plastic film is preferably a polyethylene terephthalate film or triacetyl cellulose (TAC) from the viewpoints of transparency, heat resistance, ease of handling, and price.

Since the electromagnetic wave shielding material for display requires transparency, it is desirable that the support has high transparency. In this case, the total visible light transmittance of the plastic film or plastic plate is preferably 70 to 100%, more preferably 85 to 100%, and particularly preferably 90 to 100%. Moreover, in this invention, what was colored to such an extent that the objective of this invention is not disturbed can also be used as the said plastic film and a plastic board.
The plastic film and plastic plate in the present invention can be used as a single layer, but can also be used as a multilayer film in which two or more layers are combined.

  When a glass plate is used as the support in the present invention, the type thereof is not particularly limited. However, when used as an application for an electromagnetic wave shielding film for a display, it is preferable to use tempered glass having a tempered layer on the surface. There is a high possibility that tempered glass can prevent damage compared to glass that has not been tempered. Furthermore, the tempered glass obtained by the air cooling method is preferable from the viewpoint of safety because even if it is broken, the crushed pieces are small and the end face is not sharp.

(1-2) Protective layer The photosensitive material used may be provided with a protective layer on the emulsion layer described below. In the present invention, the “protective layer” means a layer made of a binder such as gelatin or a polymer material, and is formed in a photosensitive emulsion layer in order to exhibit an effect of preventing scratches and improving mechanical properties. The protective layer is preferably not provided for the plating treatment, and even if it is provided, it is preferably thin. The thickness is preferably 0.2 μm or less. The coating method of the said protective layer is not specifically limited, A well-known coating method can be selected suitably.

(1-3) Emulsion Layer The photosensitive material used in the production method of the present invention preferably has an emulsion layer (silver salt-containing layer) containing a silver salt as an optical sensor on the support. The emulsion layer in the present invention may contain a dye, a binder, a solvent and the like as required in addition to the silver salt.
<Dye>
The light-sensitive material may contain a dye at least in the emulsion layer. The dye is contained in the emulsion layer as a filter dye or for various purposes such as prevention of irradiation. The dye may contain a solid disperse dye. Examples of the dye preferably used in the present invention include dyes represented by general formula (FA), general formula (FA1), general formula (FA2), and general formula (FA3) described in JP-A-9-179243. Specifically, compounds F1 to F34 described in the publication are preferable. Further, (II-2) to (II-24) described in JP-A-7-152112, (III-5) to (III-18) described in JP-A-7-152112, and JP-A-7-152112. (IV-2) to (IV-7) described in the publication are also preferably used.

In addition, examples of the dye that can be used in the invention include cyanine dyes, pyrylium dyes, and aminium dyes described in JP-A-3-138640 as dyes in the form of solid fine particles that are decolored during development or fixing. It is done. Further, as dyes that do not decolorize during processing, cyanine dyes having a carboxyl group described in JP-A-9-96891, cyanine dyes not containing an acidic group described in JP-A-8-245902, and those described in JP-A-8-333519 Lake type cyanine dyes, cyanine dyes described in JP-A-1-266536, horopora-type cyanine dyes described in JP-A-3-136638, pyrylium dyes described in JP-A-62-299959, JP-A-7-253039 Polymer type cyanine dyes described in JP-A No. 2-282244, solid fine particle dispersions of oxonol dyes described in JP-A No. 2-282244, light scattering particles described in JP-A No. 63-131135, Yb ³⁺ described in JP-A No. 9-5913 Compounds and ITO powders described in JP-A-7-113072 The

  Moreover, as said dye, a water-soluble dye can also be contained. Such water-soluble dyes include oxonol dyes, benzylidene dyes, merocyanine dyes, cyanine dyes and azo dyes. Of these, oxonol dyes, hemioxonol dyes and benzylidene dyes are particularly useful in the present invention. Specific examples of water-soluble dyes that can be used in the present invention include British Patent Nos. 584,609, 1,177,429, JP-A-48-85130, 49-99620, No. 49-114420, No. 52-20822, No. 59-154439, No. 59-208548, US Pat. No. 2,274,782, No. 2,533,472, No. 2 No. 3,956,879, No. 3,148,187, No. 3,177,078, No. 3,247,127, No. 3,540,887, No. 3 , 575,704 specification, 3,653,905 specification, and 3,718,427 specification.

  The content of the dye in the emulsion layer is preferably 0.01 to 10% by mass with respect to the total solid content, from the viewpoint of preventing irradiation and the like, and from the viewpoint of lowering sensitivity due to an increase in the amount added. More preferred is mass%.

<Silver salt>
Examples of the silver salt used in the present invention include inorganic silver salts such as silver halide. In the present invention, it is preferable to use silver halide having excellent characteristics as an optical sensor.

The silver halide preferably used in the present invention will be described.
In the present invention, it is preferable to use silver halide in order to function as an optical sensor, and silver halide photographic film and photographic paper relating to silver halide, printing plate-making film, emulsion mask for photomask, etc. It can also be used in the present invention.

  The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. For example, silver halide mainly composed of AgCl, AgBr, and AgI is preferably used, and silver halide mainly composed of AgBr or AgCl is preferably used. Silver chlorobromide, silver iodochlorobromide and silver iodobromide are also preferably used. More preferred are silver chlorobromide, silver bromide, silver iodochlorobromide and silver iodobromide, and most preferred are silver chlorobromide and silver iodochlorobromide containing 50 mol% or more of silver chloride. Used.

  Here, “silver halide mainly composed of AgBr (silver bromide)” refers to silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more. The silver halide grains mainly composed of AgBr may contain iodide ions and chloride ions in addition to bromide ions.

Silver halide is in the form of solid grains. From the viewpoint of image quality of the patterned metallic silver layer formed after exposure and development, the average grain size of silver halide is 0.1 to 1000 nm in terms of sphere equivalent diameter ( 1 μm) is preferred, 0.1 to 100 nm is more preferred, and 1 to 50 nm is even more preferred.
Incidentally, the sphere equivalent diameter of silver halide grains is the diameter of grains having the same volume and a spherical shape.

The shape of the silver halide grains is not particularly limited, and may be various shapes such as a spherical shape, a cubic shape, a flat plate shape (hexagonal flat plate shape, triangular flat plate shape, tetragonal flat plate shape, etc.), octahedron shape, and tetrahedron shape. There can be a cube and a tetrahedron.
The silver halide grains may be composed of a uniform phase or a different surface layer. Moreover, you may have the localized layer from which a halogen composition differs in a particle | grain inside or the surface.

  The silver halide emulsion which is a coating solution for the emulsion layer used in the present invention is Chimie etPhysique Photographique (Paul Montel, 1967) by P. Glafkides, Photographic Emulsion Chemistry (The Focal Press, 1966) by GF Dufin. , VLZelikman et al, Making and Coating Photographic Emulsion (published by The FocalPress, 1964) and the like.

That is, as a method for preparing the silver halide emulsion, either an acidic method, a neutral method, or the like may be used. Also, as a method of reacting a soluble silver salt and a soluble halogen salt, a one-side mixing method, a simultaneous mixing method, Any combination of them may be used.
As a method for forming silver particles, a method of forming particles in the presence of excess silver ions (so-called back mixing method) can also be used. Furthermore, as one type of the simultaneous mixing method, a method of keeping pAg in a liquid phase where silver halide is generated, that is, a so-called controlled double jet method can be used.
It is also preferable to form grains using a so-called silver halide solvent such as ammonia, thioether or tetrasubstituted thiourea. As such a method, a tetrasubstituted thiourea compound is more preferable, which is described in JP-A Nos. 53-82408 and 55-77737. Preferred thiourea compounds include tetramethylthiourea, 1,3-dimethyl-2-imidazolidinethione and the like. The addition amount of the silver halide solvent varies depending on the type of compound used, the target grain size, and the halogen composition, but is preferably 10 ⁻⁵ to 10 ⁻² mol per mol of silver halide.

In the controlled double jet method and the grain forming method using a silver halide solvent, it is easy to prepare a silver halide emulsion having a regular crystal type and a narrow grain size distribution, and is preferably used in the present invention. it can.
Further, in order to make the grain size uniform, as described in British Patent No. 1,535,016, Japanese Patent Publication No. 48-36890, No. 52-16364, silver nitrate or halogenated A method of changing the alkali addition rate according to the particle growth rate, or a method of changing the concentration of the aqueous solution as described in British Patent No. 4,242,445 and JP-A-55-158124 It is preferable to grow silver quickly in a range not exceeding the critical saturation. The silver halide emulsion used for forming the emulsion layer in the present invention is preferably a monodispersed emulsion, and the coefficient of variation represented by {(standard deviation of grain size) / (average grain size)} × 100 is 20% or less, and more. It is preferably 15% or less, and most preferably 10% or less.

  The silver halide emulsion used in the present invention may be a mixture of a plurality of types of silver halide emulsions having different grain sizes.

The silver halide emulsion used in the present invention may contain a metal element belonging to Group VIII or VIIB of the periodic table. In particular, in order to achieve high contrast and low fog, it is preferable to contain a rhodium compound, an iridium compound, a ruthenium compound, an iron compound, an osmium compound, or the like. These compounds may be compounds having various ligands, and examples of the ligand include pseudohalogen ligands such as cyanide ion, halogen ion, thiocyanate ion, nitrosyl ion, water, hydroxide ion, Examples thereof include organic molecules such as ammonia, amines (such as methylamine and ethylenediamine), heterocyclic compounds (such as imidazole, thiazole, 5-methylthiazole, mercaptoimidazole), urea, and thiourea.
For high sensitivity, doping with a metal hexacyanide complex such as K ₄ [Fe (CN) ₆ ], K ₄ [Ru (CN) ₆ ] or K ₃ [Cr (CN) ₆ ] is advantageous. Done.

A water-soluble rhodium compound can be used as the rhodium compound. Examples of the water-soluble rhodium compound include a rhodium halide (III) compound, a hexachlororhodium (III) complex salt, a pentachloroacorodium complex salt, a tetrachlorodiacolodium complex salt, a hexabromorhodium (III) complex salt, and a hexaamine rhodium (III). ) Complex salt, trizalatodium (III) complex salt, K ₃ Rh ₂ Br _{9 and the} like.
These rhodium compounds are used by dissolving in water or a suitable solvent, and are generally used in order to stabilize the rhodium compound solution, that is, an aqueous hydrogen halide solution (for example, hydrochloric acid, odorous acid, hydrofluoric acid). Or a method of adding an alkali halide (for example, KCl, NaCl, KBr, NaBr, etc.) can be used. Instead of using water-soluble rhodium, it is also possible to add another silver halide grain previously doped with rhodium and dissolve it at the time of silver halide preparation.

Examples of the iridium compound include hexachloroiridium complex salts such as K ₂ IrCl ₆ and K ₃ IrCl ₆ , hexabromoiridium complex salts, hexaammineiridium complex salts, and pentachloronitrosyliridium complex salts.
Examples of the ruthenium compound include hexachlororuthenium, pentachloronitrosylruthenium, K ₄ [Ru (CN) ₆ ] and the like.
Examples of the iron compound include potassium hexacyanoferrate (II) and ferrous thiocyanate.

The ruthenium compound and the osmium compound are added in the form of a water-soluble complex salt described in JP-A-63-2042, JP-A-1-285941, JP-A-2-20852, JP-A-2-20855, and the like. Particularly preferred is a hexacoordination complex represented by the following formula.
[ML ₆ ] ^-n
(Here, M represents Ru or Os, and n represents 0, 1, 2, 3 or 4.)
In this case, the counter ion is not important, and for example, ammonium or alkali metal ions are used. Preferred ligands include halide ligands, cyanide ligands, cyanide oxide ligands, nitrosyl ligands, thionitrosyl ligands, and the like. Although the example of the specific complex used for this invention below is shown, this invention is not limited to this.

[RuCl ₆ ] ⁻³ , [RuCl ₄ (H ₂ O) ₂ ] ⁻¹ , [RuCl ₅ (NO)] ⁻² , [RuBr ₅ (NS)] ⁻² , [Ru (CO) ₃ Cl ₃ ] ^{− 2} , [Ru (CO) Cl ₅ ] ⁻² , [Ru (CO) Br ₅ ] ⁻² , [OsCl ₆ ] ⁻³ , [OsCl ₅ (NO)] ⁻² , [Os (NO) (CN) ₅ ] ^-2, [Os (NS) Br _5] ^-2, [Os (CN) _6] ^-4, _{[Os (O) 2 (CN)} 5 ] ^-4.

The amount of these compounds added is preferably 10 ⁻¹⁰ to 10 ⁻² mol / mol Ag per mol of silver halide, more preferably 10 ⁻⁹ to 10 ⁻³ mol / mol Ag.

In addition, in the present invention, silver halides containing Pd (II) ions and / or Pd elements can also be preferably used. Pd may be uniformly distributed in the silver halide grains, but is preferably contained in the vicinity of the surface layer of the silver halide grains. Here, Pd “contains in the vicinity of the surface layer of the silver halide grains” means that the Pd content is higher than the other layers within 50 nm in the depth direction from the surface of the silver halide grains. means.
Such silver halide grains can be prepared by adding Pd in the course of forming silver halide grains. After adding silver ions and halogen ions to 50% or more of the total addition amount, Pd Is preferably added. It is also preferred that Pd (II) ions be present in the surface layer of the silver halide by a method such as addition at the time of post-ripening.
The Pd-containing silver halide grains increase the speed of physical development and electroless plating, increase the production efficiency of a desired electromagnetic shielding material, and contribute to the reduction of production costs. Pd is well known and used as an electroless plating catalyst. However, in the present invention, Pd can be unevenly distributed on the surface layer of silver halide grains, so that extremely expensive Pd can be saved. is there.

In the present invention, the content of the Pd element contained in the silver halide is preferably 10 ^{−4 to} 0.5 mol / mol Ag with respect to the number of moles of silver in the silver halide, More preferably, it is 0.3 mol / mol Ag.
Examples of the Pd compound to be used include PdCl ₄ and Na ₂ PdCl ₄ .

  In the present invention, in order to further improve the sensitivity as an optical sensor, chemical sensitization performed with a photographic emulsion can be performed. As the chemical sensitization method, sulfur sensitization, selenium sensitization, chalcogen sensitization such as tellurium sensitization, noble metal sensitization such as gold sensitization, reduction sensitization and the like can be used. These are used alone or in combination. When the above chemical sensitization methods are used in combination, for example, sulfur sensitization method and gold sensitization method, sulfur sensitization method and selenium sensitization method and gold sensitization method, sulfur sensitization method and tellurium sensitization. A combination of a method and a gold sensitization method is preferable.

The sulfur sensitization is usually performed by adding a sulfur sensitizer and stirring the emulsion at a high temperature of 40 ° C. or higher for a predetermined time. As the sulfur sensitizer, known compounds can be used. For example, in addition to sulfur compounds contained in gelatin, various sulfur compounds such as thiosulfates, thioureas, thiazoles, rhodanines, etc. Can be used. Preferred sulfur compounds are thiosulfate and thiourea compounds. The amount of sulfur sensitizer added varies under various conditions such as pH during chemical ripening, temperature, and the size of silver halide grains, and is 10 ⁻⁷ to 10 ⁻² mol per mol of silver halide. It is preferably 10 ⁻⁵ to 10 ⁻³ mol.

  A known selenium compound can be used as the selenium sensitizer used for the selenium sensitization. That is, the selenium sensitization is usually carried out by adding unstable and / or non-labile selenium compounds and stirring the emulsion at a high temperature of 40 ° C. or higher for a predetermined time. As the unstable selenium compound, compounds described in JP-B-44-15748, JP-A-43-13489, JP-A-4-109240, JP-A-4-324855 and the like can be used. In particular, it is preferable to use compounds represented by general formulas (VIII) and (IX) in JP-A-4-324855.

  The tellurium sensitizer used for the tellurium sensitizer is a compound that generates silver telluride presumed to be a sensitization nucleus on the surface or inside of a silver halide grain. The silver telluride formation rate in the silver halide emulsion can be tested by the method described in JP-A-5-313284. Specifically, U.S. Pat. Nos. 1,623,499, 3,320,069, 3,772,031, British Patent 235,211, No. 1,121,496, No. 1,295,462, No. 1,396,696, Canadian Patent No. 800,958, JP-A-4-204640 4-271341, 4-3333043, 5-303157, Journal of Chemical Society, Chemical Communication (J. Chem. Soc. Chem. Commun.), P.635 (1980) 1102 (1979), 645 (1979), Journal of Chemical Society Perkin Transaction (J. Chem. Soc. Perkin. Trans.), Vol. 1, 2191 (1980) S. Compounds described in S. Patai, The Chemistry of Organic Selenium and Tellunium Compounds, Volume 1 (1986), Volume 2 (1987) Can be used. In particular, compounds represented by the general formulas (II), (III) and (IV) in JP-A-5-313284 are preferred.

The amount of selenium sensitizer and tellurium sensitizer that can be used in the present invention varies depending on the silver halide grains used, chemical ripening conditions, and the like, but is generally 10 ⁻⁸ to 10 ⁻² per mole of silver halide. A mole, preferably about 10 ⁻⁷ to 10 ⁻³ mole is used. The conditions for chemical sensitization in the present invention are not particularly limited, but the pH is 5 to 8, the pAg is 6 to 11, preferably 7 to 10, and the temperature is 40 to 95 ° C, preferably 45 to 45 ° C. 85 ° C.

Examples of the noble metal sensitizer include gold, platinum, palladium, iridium and the like, and gold sensitization is particularly preferable. Specific examples of the gold sensitizer used for gold sensitization include chloroauric acid, potassium chloroaurate, potassium aurithiocyanate, gold sulfide, thioglucose gold (I), and thiomannose gold (I). About 10 ⁻⁷ to 10 ⁻² mol per mol of silver halide. In the silver halide emulsion used in the present invention, a cadmium salt, a sulfite salt, a lead salt, a thallium salt or the like may coexist in the process of silver halide grain formation or physical ripening.

  In the present invention, reduction sensitization can be used. As the reduction sensitizer, stannous salts, amines, formamidinesulfinic acid, silane compounds and the like can be used. A thiosulfonic acid compound may be added to the silver halide emulsion by the method described in European Patent Publication (EP) 293917. The silver halide emulsion used in the preparation of the light-sensitive material used in the present invention may be only one type, or two or more types (for example, those having different average grain sizes, those having different halogen compositions, those having different crystal habits, Combinations of different chemical sensitization conditions and different sensitivities) may be used. In particular, in order to obtain high contrast, as described in JP-A-6-324426, it is preferable to apply an emulsion with higher sensitivity as it is closer to the support.

<Binder>
In the emulsion layer, a binder can be used for the purpose of uniformly dispersing silver salt grains and assisting the adhesion between the emulsion layer and the support. In the present invention, as the binder, any of a water-insoluble polymer, a water-soluble polymer, and an emulsion type polymer dispersed in water can be used as the binder, but it is preferable to use a water-soluble polymer or an emulsion type polymer. .
Examples of the water-soluble binder include polysaccharides such as gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), starch, cellulose and derivatives thereof, polyethylene oxide, polysaccharides, polyvinylamine, chitosan, polylysine, and polyacrylic acid. , Polyalginic acid, polyhyaluronic acid, carboxycellulose and the like. These have neutral, anionic or cationic properties depending on the ionicity of the functional group.
Examples of the emulsion polymer dispersed in water include the following. That is, acrylic resins, styrene butadiene resins, vinyl acetate resins, ethylene vinyl acetate resins, acrylic styrene resins, vinylidene chloride resins, polyurethane resins, copolymer resins thereof, and blend resins thereof are preferably used.
These binders may be present at the time of silver halide grain formation. It is also preferable to form silver halide grains in the presence of gelatin and add the above water-soluble polymer or emulsion polymer.
The volume ratio of gelatin to the synthetic resin binder in the binder of the pattern layer made of developed silver is preferably 0 to 8/2, more preferably 0 to 5/5, and 0 to 3/7. Is more preferable, and it is still more preferable that it is 0-2 / 8. The higher the ratio of the synthetic resin binder is, the higher the adhesion strength when a glass or plastic is attached to the surface having the binder and an adhesive, particularly after wet heat aging, which is preferable.
In order to obtain a silver halide emulsion layer or a developed silver pattern layer having such a binder ratio, a silver halide emulsion layer having such a binder ratio may be prepared. As a method thereof, in addition to forming silver halide grains with a binder having the binder ratio, after forming silver halide grains, a binder may be added so that the binder ratio is obtained. It is also a preferred method to remove low molecular weight gelatin from the silver halide emulsion using flocculation method or ultrafiltration method using low molecular weight gelatin. A low molecular weight gelatin having a molecular weight of 5,000 to 40,000 can be used.

The content of the binder contained in the emulsion layer is not particularly limited, and can be appropriately determined as long as dispersibility and adhesion can be exhibited.
Content of the binder contained in the silver salt content layer in the manufacturing method of this invention can be suitably determined in the range which can exhibit dispersibility and adhesiveness. In order to easily contact metal particles with each other and to obtain high conductivity, the content of the binder in the silver salt-containing layer is preferably 1/2 to 1 / 0.1 in terms of Ag / binder volume ratio. More preferably, it is /1-1/0.5.

<Solvent>
The solvent used for forming the emulsion layer is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethyl sulfoxide, etc. , Esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.
The content of the solvent used in the emulsion layer of the present invention is in the range of 30 to 90% by mass and in the range of 50 to 80% by mass with respect to the total mass of silver salt, binder and the like contained in the emulsion layer. Preferably there is.

<Hardener>
The emulsion layer and other hydrophilic colloid layers of the light-sensitive material according to the present invention are preferably hardened with a hardener.
As the hardener, inorganic or organic gelatin hardeners can be used alone or in combination. For example, active vinyl compounds (1,3,5-triacryloyl-hexahydro-s-triazine, bis (vinylsulfonylmethyl) ether, N, N′-methylenebis- [β- (vinylsulfonyl) propionamide], etc.) active halogen compounds (Such as 2,4-dichloro-6-hydroxy-s-triazine), mucohalogen acids (such as mucochloric acid), N-carbamoylpyridinium salts (such as (1-morpholinocarbonyl-3-pyridyl) methanesulfonate) haloamidinium salts ( 1- (1-chloro-1-pyridinomethylene) pyrrolidinium-2-naphthalenesulfonate, etc.) can be used alone or in combination. Of these, active vinyl compounds described in JP-A-53-41220, JP-A-53-5725, JP-A-59-162546, JP-A-60-80846, and the like and U.S. Pat. No. 3,325,287. The active halogen compounds described are preferred. The following are examples of typical compounds of gelatin hardeners.

As described above, the swelling ratio of the emulsion layer can be arbitrarily adjusted by adjusting the addition amount of the hardener in the emulsion layer.
The preferred range of the amount of the hardener added to the emulsion layer varies depending on the storage temperature and humidity of the photosensitive material after the addition of the hardener, the storage period, the film pH of the photosensitive material, the amount of binder contained in the photosensitive material, etc. Is not decided. In particular, since the hardener can diffuse over all layers located on the same side of the photosensitive material before reacting with the binder, the preferred addition amount of the hardener is the total amount of binder on the same side of the photosensitive material including the emulsion layer. Depends on. The preferable content of the hardener in the light-sensitive material of the present invention is in the range of 0.2% by weight to 15% by weight with respect to the total binder amount on the same side of the light-sensitive material including the emulsion layer, and more preferably. It is in the range of 0.5% to 6% by weight.
Further, as described above, since the hardener can diffuse, the addition position of the hardener does not need to be in the emulsion layer and can be preferably added to any layer on the same side as the emulsion layer. It is also preferable to add in portions.

(2) Conductive shield film preparation step (2-1) Exposure In the present invention, for pattern formation on a photosensitive material coated with a silver salt-containing layer or a photopolymer for photolithography provided on a support, that is, an irradiated portion Exposure is performed in the form of a ga pattern or a non-irradiated part pattern (in the case of inversion processing). The exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-rays. Furthermore, a light source having a wavelength distribution may be used for exposure, or a light source having a specific wavelength may be used.

  As the light source, various light emitters that emit light in the visible spectrum region are used as necessary. For example, any one or two or more of a red light emitter, a green light emitter, and a blue light emitter are used. The spectral region is not limited to the above red, green, and blue, and phosphors that emit light in the yellow, orange, purple, or infrared region are also used. In particular, a cathode ray tube that emits white light by mixing these light emitters is often used. An ultraviolet lamp is also preferable, and g-line of a mercury lamp, i-line of a mercury lamp, etc. are also used.

In the present invention, exposure is preferably performed using various laser beams. For example, the exposure in the present invention is a monochromatic light source such as a gas laser, a light emitting diode, a semiconductor laser, a semiconductor laser, or a second harmonic light source (SHG) that combines a solid state laser using a semiconductor laser as an excitation light source and a nonlinear optical crystal. A scanning exposure method using high-density light can be preferably used, and a KrF excimer laser, ArF excimer laser, F2 laser, or the like can also be used. In order to make the system compact and inexpensive, exposure is more preferably performed using a semiconductor laser, a semiconductor laser, or a second harmonic generation light source (SHG) that combines a solid-state laser and a nonlinear optical crystal. In particular, in order to design a compact, inexpensive, long-life and high-stability apparatus, it is most preferable to perform exposure using a semiconductor laser.
The energy of the exposure, in the case of using the silver halide, the irradiation energy is preferably 1 mJ / cm ² or less, more preferably 100 .mu.J / cm ² or less, more preferably 50μJ / cm ² or less.

Specifically, as a laser light source, a blue semiconductor laser with a wavelength of 430 to 460 nm (announced by Nichia Chemical at the 48th Applied Physics Related Conference in March 2001), a semiconductor laser (oscillation wavelength of about 1060 nm) is used. About 530 nm green laser, wavelength 685 nm red semiconductor laser (Hitachi type No. HL6738MG), wavelength about 650 nm red semiconductor laser (wavelength converted by LiNbO ₃ SHG crystal having a waveguide inversion domain structure) Hitachi type No. HL6501MG) is preferably used.

  The method of exposing the silver salt-containing layer in a pattern is preferably scanning exposure using a laser beam. In particular, a capstan type laser scanning exposure apparatus described in Japanese Patent Application Laid-Open No. 2000-39677 is preferable. Further, in this capstan method, a DMD described in Japanese Patent Application Laid-Open No. 2004-1244 is used instead of beam scanning by rotating a polygon mirror. It is also preferable to use it for a beam scanning system.

(2-2) Development Processing In the present invention, after the emulsion layer is exposed, further development processing is performed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. The developer is not particularly limited, but a PQ developer, MQ developer, MAA developer and the like can also be used, and commercially available products include, for example, CN-16, CR-56, CP45X, FD prescribed by Fuji Film Co., Ltd. -3, Papitol, each developer such as C-41, E-6, RA-4, D-19, D-72 formulated by KODAK, or a developer included in a kit thereof can be used. A lith developer can also be used.
As the squirrel developer, D85 or the like prescribed by KODAK can be used. In the present invention, by performing the above exposure and development processing, a metal silver portion, preferably a patterned metal silver portion, is formed in the exposed portion, and a light-transmitting portion described later is formed in the unexposed portion.

  In the production method of the present invention, a dihydroxybenzene developing agent can be used as the developer. Examples of the dihydroxybenzene developing agent include hydroquinone, chlorohydroquinone, isopropyl hydroquinone, methyl hydroquinone, hydroquinone monosulfonate, and the like, and hydroquinone is particularly preferable. Examples of the auxiliary developing agent exhibiting superadditivity with the dihydroxybenzene developing agent include 1-phenyl-3-pyrazolidones and p-aminophenols. As the developer used in the production method of the present invention, a combination of a dihydroxybenzene developer and 1-phenyl-3-pyrazolidones; or a combination of a dihydroxybenzene developer and p-aminophenols is preferably used.

As a developing agent combined with 1-phenyl-3-pyrazolidone or a derivative thereof used as an auxiliary developing agent, specifically, 1-phenyl-3-pyrazolidone, 1-phenyl-4,4-dimethyl-3-pyrazolidone, 1-phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone and the like.
Examples of the p-aminophenol auxiliary developing agent include N-methyl-p-aminophenol, p-aminophenol, N- (β-hydroxyethyl) -p-aminophenol, N- (4-hydroxyphenyl) glycine and the like. Among them, N-methyl-p-aminophenol is preferable. The dihydroxybenzene-based developing agent is usually preferably used in an amount of 0.05 to 0.8 mol / liter, but in the present invention, it is particularly preferably used at 0.23 mol / liter or more. More preferably, it is the range of 0.23-0.6 mol / liter. When a combination of dihydroxybenzenes and 1-phenyl-3-pyrazolidones or p-aminophenols is used, the former is 0.23-0.6 mol / liter, more preferably 0.23-0. It is preferable to use 5 mol / liter and the latter in an amount of 0.06 mol / liter or less, more preferably 0.03 mol / liter to 0.003 mol / liter.

  In the present invention, both the development initiator and the development replenisher have a property that “the pH increase when 0.1 mol of sodium hydroxide is added to 1 liter of the solution is 0.5 or less”. preferable. As a method for confirming that the development starting solution or development replenisher used has this property, the pH of the development starting solution or development replenisher to be tested is adjusted to 10.5, and then sodium hydroxide is added to 1 liter of this solution. 0.1 mol was added, and the pH value of the liquid at this time was measured. In the production method of the present invention, it is particularly preferable to use a development starter and a development replenisher whose pH value rises to 0.4 or less when the above test is performed.

  As a method for imparting the above properties to the development initiator and the development replenisher, a method using a buffer is preferably used. Examples of the buffer include carbonates, boric acid described in JP-A-62-286259, saccharides (for example, saccharose), oximes (for example, acetoxime), and phenols described in JP-A-60-93433. (For example, 5-sulfosalicylic acid), tertiary phosphate (for example, sodium salt, potassium salt) and the like can be used, and carbonate and boric acid are preferably used. The amount of the buffer (particularly carbonate) used is preferably 0.25 mol / liter or more, and particularly preferably 0.25 to 1.5 mol / liter.

  In the present invention, the pH of the development initiator is preferably 9.0 to 11.0, and particularly preferably 9.5 to 10.7. The pH of the developer replenisher and the pH of the developer in the developer tank during continuous processing are also in this range. As the alkali agent used for pH setting, a normal water-soluble inorganic alkali metal salt (for example, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate) can be used.

  In the production method of the present invention, when processing 1 square meter of the photosensitive material, the content of the developer replenisher in the developer is 323 ml or less, preferably 323 to 30 ml, particularly 225 to 50 ml. The development replenisher may have the same composition as the development starter, or it may have a higher concentration than the starter with respect to the components consumed in the development.

  In the developing solution for developing the light-sensitive material in the present invention (hereinafter sometimes referred to as “developing solution” in a wide range including both the development starting solution and the developing replenisher), commonly used additives (for example, retaining agents) are used. (Constant, chelating agent). Examples of the preservative include sulfites such as sodium sulfite, potassium sulfite, lithium sulfite, ammonium sulfite, sodium bisulfite, potassium metabisulfite, and sodium formaldehyde bisulfite. The sulfite is preferably used in an amount of 0.20 mol / liter or more, more preferably 0.3 mol / liter or more. However, if added too much, it causes silver stains in the developer, so the upper limit is It is desirable to be 1.2 mol / liter. Particularly preferred is 0.35 to 0.7 mol / liter. Further, ascorbic acid derivatives may be used in a small amount in combination with sulfite as a preservative for dihydroxybe · BR> tower developing agents. Here, the ascorbic acid derivative includes ascorbic acid and its stereoisomer erythorbic acid and its alkali metal salts (sodium and potassium salts). As the ascorbic acid derivative, sodium erythorbate is preferably used in terms of material cost. The addition amount of the ascorbic acid derivative is preferably in the range of 0.03 to 0.12, and particularly preferably in the range of 0.05 to 0.10, with respect to the dihydroxybenzene-based developing agent. When an ascorbic acid derivative is used as the preservative, it is preferable that the developer does not contain a boron compound.

  In addition to the above, additives that can be used in the developer include development inhibitors such as sodium bromide and potassium bromide; organic solvents such as ethylene glycol, diethylene glycol, triethylene glycol, and dimethylformamide; diethanolamine, triethanolamine, etc. A development accelerator such as alkanolamine, imidazole or a derivative thereof, a mercapto compound, an indazole compound, a benzotriazole compound, or a benzimidazole compound may be included as an antifoggant or a black pepper inhibitor. Specific examples of the benzimidazole compound include 5-nitroindazole, 5-p-nitrobenzoylaminoindazole, 1-methyl-5-nitroindazole, 6-nitroindazole, 3-methyl-5-nitroindazole, 5 -Nitrobenzimidazole, 2-isopropyl-5-nitrobenzimidazole, 5-nitrobenztriazole, sodium 4-[(2-mercapto-1,3,4-thiadiazol-2-yl) thio] butanesulfonate, 5- Examples include amino-1,3,4-thiadiazole-2-thiol, methylbenzotriazole, 5-methylbenzotriazole, and 2-mercaptobenzotriazole. The content of these benzimidazole compounds is usually from 0.01 to 10 mmol, more preferably from 0.1 to 2 mmol, per liter of developer.

Further, various organic and inorganic chelating agents can be used in combination in the developer. As said inorganic chelating agent, sodium tetrapolyphosphate, sodium hexametaphosphate, etc. can be used. On the other hand, as the organic chelating agent, organic carboxylic acid, aminopolycarboxylic acid, organic phosphonic acid, aminophosphonic acid and organic phosphonocarboxylic acid can be mainly used.
Examples of the above organic carboxylic acids include acrylic acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, succinic acid, acileic acid, sebacic acid, nonanedicarboxylic acid, decanedicarboxylic acid, undecanedicarboxylic acid, maleic acid. Examples thereof include, but are not limited to, acid, itaconic acid, malic acid, citric acid, and tartaric acid.

  Examples of the aminopolycarboxylic acid include iminodiacetic acid, nitrilotriacetic acid, nitrilotripropionic acid, ethylenediaminemonohydroxyethyltriacetic acid, ethylenediaminetetraacetic acid, glycol ether tetraacetic acid, 1,2-diaminopropanetetraacetic acid, diethylenetriaminepentaacetic acid, Triethylenetetramine hexaacetic acid, 1,3-diamino-2-propanol tetraacetic acid, glycol ether diamine tetraacetic acid, other publications of JP-A Nos. 52-25632, 55-67747, 57-102624, and others Examples thereof include compounds described in JP-A-53-40900.

Examples of the organic phosphonic acid include hydroxyalkylidene-diphosphonic acid and Research Disclosure Vol. 181 described in the specifications of U.S. Pat. 18170 (May 1979) and the like.
Examples of the aminophosphonic acid include aminotris (methylenephosphonic acid), ethylenediaminetetramethylenephosphonic acid, aminotrimethylenephosphonic acid and the like. In addition, Research Disclosure No. 18170, JP-A-57-208554, No.54. -61125, 55-29883 gazette and 56-97347 gazette etc. can be mentioned.

  Examples of the organic phosphonocarboxylic acid include JP-A Nos. 52-102726, 53-42730, 54-121127, 55-4024, 55-4025, 55-126241, and 55-65955. Nos. 55-65956, and the above-mentioned compounds disclosed in Research Disclosure No. 18170. These chelating agents may be used in the form of alkali metal salts or ammonium salts.

The addition amount of these chelating agents is preferably 1 × 10 ⁻⁴ to 1 × 10 ⁻¹ mol, more preferably 1 × 10 ⁻³ to 1 × 10 ⁻² mol per liter of the developer.

  Further, the compounds described in JP-A-56-24347, JP-B-56-46585, JP-B-62-2849, and JP-A-4-362294 can be used as a silver stain preventing agent in the developer. it can. Moreover, the compound of Unexamined-Japanese-Patent No. 61-267759 can be used as a solubilizing agent. Further, the developer may contain a color toning agent, a surfactant, an antifoaming agent, a hardening agent, and the like as necessary. The development processing temperature and time are related to each other and are determined in relation to the total processing time. In general, the development temperature is preferably from about 20 ° C. to about 50 ° C., more preferably from 25 to 45 ° C. The development time is preferably 5 seconds to 2 minutes, more preferably 7 seconds to 1 minute 30 seconds.

  From the viewpoint of developer transport cost, packaging material cost, space saving, and the like, it is also preferred that the developer be concentrated and diluted before use. In order to concentrate the developer, it is effective to potassium salt the salt component contained in the developer.

  The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the silver salt in the unexposed portion. For the fixing process in the present invention, a fixing process technique used for a silver salt photographic film, photographic paper, a printing plate-making film, a photomask emulsion mask, or the like can be used.

Preferred components of the fixing solution used in the fixing step include the following.
That is, sodium thiosulfate, ammonium thiosulfate, if necessary, tartaric acid, citric acid, gluconic acid, boric acid, iminodiacetic acid, 5-sulfosalicylic acid, glucoheptanoic acid, tyrone, ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic acid, nitrilotriacetic acid Etc. are preferably included. From the viewpoint of environmental protection in recent years, it is preferable that boric acid is not included. Examples of the fixing agent for the fixing solution used in the present invention include sodium thiosulfate and ammonium thiosulfate. Ammonium thiosulfate is preferable from the viewpoint of fixing speed, but sodium thiosulfate may be used from the viewpoint of environmental protection in recent years. Good. The amount of these known fixing agents used can be appropriately changed, and is generally about 0.1 to about 2 mol / liter. Most preferably, it is 0.2-1.5 mol / liter. If desired, the fixer may contain a hardener (eg, a water-soluble aluminum compound), a preservative (eg, sulfite, bisulfite), a pH buffer (eg, acetic acid), a pH adjuster (eg, ammonia, sulfuric acid). ), Chelating agents, surfactants, wetting agents, fixing accelerators.

Examples of the surfactant include anionic surfactants such as sulfates and sulfonates, polyethylene surfactants, and amphoteric surfactants described in JP-A-57-6740. A known antifoaming agent may be added to the fixing solution.
Examples of the wetting agent include alkanolamine and alkylene glycol. Examples of the fixing accelerator include thiourea derivatives described in JP-B Nos. 45-35754, 58-122535, and 58-122536; alcohols having a triple bond in the molecule; Examples include thioether compounds described in US Pat. No. 4,126,459; mesoionic compounds described in JP-A-4-229860, and compounds described in JP-A-2-44355 may be used. Examples of the pH buffer include organic acids such as acetic acid, malic acid, succinic acid, tartaric acid, citric acid, oxalic acid, maleic acid, glycolic acid, and adipic acid, boric acid, phosphate, sulfite, and the like. Inorganic buffers can be used. As the pH buffer, acetic acid, tartaric acid, and sulfite are preferably used. Here, the pH buffering agent is used for the purpose of preventing an increase in pH of the fixing agent due to bringing in the developer, and is preferably 0.01 to 1.0 mol / liter, more preferably 0.02 to 0.6 mol / liter. Use degree. The pH of the fixing solution is preferably from 4.0 to 6.5, particularly preferably from 4.5 to 6.0. Further, as the dye elution accelerator, compounds described in JP-A No. 64-4739 can also be used.

  Examples of the hardener in the fixing solution of the present invention include water-soluble aluminum salts and chromium salts. A preferred compound as the hardener is a water-soluble aluminum salt, and examples thereof include aluminum chloride, aluminum sulfate, potash and vane. A preferable addition amount of the hardener is 0.01 mol to 0.2 mol / liter, and more preferably 0.03 to 0.08 mol / liter.

The fixing temperature in the fixing step is preferably about 20 ° C. to about 50 ° C., more preferably 25 to 45 ° C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds. The replenishing amount of the fixing solution is preferably 600 ml / m ² or less with respect to the processing of the photosensitive material, more preferably 500 ml / m ² or less, 300 ml / m ² or less is particularly preferred.

The light-sensitive material that has been subjected to development and fixing processing is preferably subjected to water washing treatment or stabilization treatment. In the water washing treatment or stabilization treatment, the washing water amount is usually 20 liters or less per 1 m ^{2 of the} light-sensitive material, and can be replenished in 3 liters or less (including 0, ie, rinsing with water). For this reason, not only water-saving treatment is possible, but piping for self-installing machines can be eliminated. As a method for reducing the replenishment amount of flush water, a multi-stage countercurrent system (for example, two stages, three stages, etc.) has been known for a long time. When this multi-stage countercurrent system is applied to the production method of the present invention, the photosensitive material after fixing is gradually processed in contact with the normal direction, that is, in the direction of the processing solution not contaminated with the fixing solution. Furthermore, efficient washing with water is performed. Moreover, when performing water washing with a small amount of water, it is more preferable to provide the washing tank of a squeeze roller and a crossover roller as described in Unexamined-Japanese-Patent No. 63-18350, 62-287252, etc. In addition, various oxidizer additions and filter filtration may be combined to reduce the pollution load that becomes a problem when washing with a small amount of water. Furthermore, in the above method, a part or all of the overflow liquid from the washing bath or stabilization bath produced by replenishing the washing bath or stabilization bath with water subjected to the fouling means according to the treatment, As described in JP-A-60-235133, it can also be used for a processing solution having fixing ability, which is a previous processing step. In addition, water-soluble surfactants and antifoaming agents are added to prevent unevenness of water bubbles that are likely to occur during washing with a small amount of water and / or to prevent the processing agent component adhering to the squeeze roller from being transferred to the processed film. Also good.

  In the washing treatment or stabilization treatment, a dye adsorbent described in JP-A-63-163456 may be installed in a washing tank in order to prevent contamination with a dye eluted from the photosensitive material. In the stabilization treatment following the water washing treatment, baths containing the compounds described in JP-A-2-2013357, JP-A-2-132435, JP-A-1-102553, and JP-A-46-44446 are disclosed. May be used as the final bath of the light-sensitive material. At this time, ammonium compounds, metal compounds such as Bi, Al, fluorescent brighteners, various chelating agents, film pH regulators, hardeners, bactericides, fungicides, alkanolamines and surfactants are added as necessary. It can also be added. Water used in the water washing process or stabilization process includes tap water, water deionized, halogen, UV germicidal lamps, and water sterilized by various oxidizing agents (such as ozone, hydrogen peroxide, and chlorates). It is preferable to use it. Further, washing water containing the compounds described in JP-A-4-39652 and JP-A-5-241309 may be used. The bath temperature and time at the water washing treatment or the stabilization temperature are preferably 0 to 50 ° C. and 5 seconds to 2 minutes.

For storage of processing agents (processing chemicals) used in processing solutions such as developers and fixing solutions used in the present invention, store them in a packaging material with low oxygen permeability described in JP-A-61-73147. Is preferred. Moreover, when reducing the replenishment amount, it is preferable to prevent evaporation of the liquid and air oxidation by reducing the contact area of the treatment tank with the air.
Since the electromagnetic wave shielding film of the present invention is preferably obtained in a form supporting a continuous pattern such as a roll, it is advantageous to use a developing machine for rolls, in particular from the viewpoint of productivity and ease of production of an optical filter. It is preferable to use a conveyance type automatic developing machine. The roller conveyance type automatic developing machine is described in US Pat. Nos. 3,025,795 and 3,545,971, etc., and is simply referred to as a roller conveyance type automatic developing machine in this specification. In addition, the roller-conveying type automatic developing machine preferably has four steps of development, fixing, washing and drying, and in the present invention, other steps (for example, a stop step) are not excluded, but these four steps are followed. Is most preferred. Further, four steps by a stabilization step may be used instead of the water washing step.

  In each of the above steps, a component obtained by removing water from the composition of the developer or fixing solution is supplied in the form of a solidified processing agent, and dissolved in a predetermined amount of water and used as a developer or fixing solution. May be. Such a form of treating agent is called a solid treating agent. As the solid processing agent, powder, tablet, granule, powder, lump or paste is used. A preferred form of the treatment agent is a form described in JP-A-61-259921 or a tablet. For example, JP-A-51-61837, JP-A-54-155038, JP-A-52-88025, British Patent No. 1,213,808, etc. Can be manufactured. Furthermore, the granule treating agent can be produced by a general method described in, for example, JP-A-2-109042, JP-A-2-109043, JP-A-3-39735 and JP-A-3-393939. Further, powder processing agents are generally described in, for example, JP-A-54-133332, British Patents 725,892 and 729,862, and German Patent 3,733,861. Can be manufactured in a conventional manner.

The bulk density of the solid processing agent is preferably 0.5 to 6.0 g / cm ³ and particularly preferably 1.0 to 5.0 g / cm ^{3 in} view of its solubility.

  In preparing the solid processing agent, at least two kinds of mutually reactive particulate materials among the materials constituting the processing agent are replaced with at least one intervening separation layer made of a material inert to the reactive material. Alternatively, a method may be employed in which reactive substances are placed in layers so as to be separated into layers, a bag that can be vacuum-packed is used as a packaging material, and the bag is evacuated and sealed. Here, “inert” means that the substances do not react under normal conditions in the package when they are in physical contact with each other or that there is no significant reaction. The inert material may be inactive in the intended use of the two reactive materials, apart from being inert to the two mutually reactive materials. Furthermore, an inert substance is a substance that is used simultaneously with two reactive substances. For example, since hydroquinone and sodium hydroxide react in direct contact with each other in the developer, they can be stored in the package for a long time by using sodium sulfite or the like as a separation layer between hydroquinone and sodium hydroxide in vacuum packaging. In addition, hydroquinone or the like is briquetted to reduce the contact area with sodium hydroxide, so that the storage stability is improved and the mixture can be used. Bags made from an inert plastic film, a laminate of plastic material and metal foil are used as packaging materials for these vacuum packaging materials.

  The mass of the metallic silver contained in the exposed portion after the development treatment is preferably a content of 50% by mass or more, and 80% by mass or more with respect to the mass of silver contained in the exposed portion before exposure. More preferably. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

  The gradation after development processing in the present invention is not particularly limited, but is preferably more than 4.0. When the gradation after the development processing exceeds 4.0, the conductivity of the conductive metal portion can be increased while keeping the transparency of the light transmissive portion high. Examples of means for setting the gradation to 4.0 or higher include doping the above-mentioned rhodium ions and iridium ions into the photosensitive silver halide grains.

<Electroless plating>
In the present invention, the metal silver portion after the exposure and development treatment can be further treated with an electroless plating solution. For electroless plating, a method of treating with an aqueous palladium compound solution, a method of treating with a reducing agent and / or a silver ion ligand are preferred.
The former is performed by treating the metal silver portion after the exposure and development treatment with a solution containing Pd. Pd may be a divalent palladium ion or metallic palladium. This treatment can accelerate electroless plating or physical development speed. The electroless plating with palladium is described in detail in the chapter “Electroless plating” in the edition of the Japan Society for Science and Chemical Chemistry Handbook.

The treatment with a reducing agent and silver ion ligand preferably used in the present invention will be described.
In the present invention, it is preferable to perform treatment with a reducing agent or a silver ion ligand.
As the reducing agent, it is sufficient that silver ions can be reduced to metallic silver. For example, thiourea dioxide, Rongalite, tin (II) chloride, sodium borohydride, sodium triacetoxyborohydride, trimethylamine borane, triethylamine borane, Examples thereof include pyridine borane and borane.
Silver ion ligands include halogen ions such as chlorine ion, bromine ion and iodine ion, pseudohalogen ions such as thiocyanate ion, nitrogen-containing heterocyclic compounds such as pyridine and bipyridine, sulfite ion, and 1, 2, 4 -Mesoionic compounds such as triazolium-3-thiolates (for example, 1,2,4-trimethyl-1,2,4-triazolium-3-thiolate), thioether compounds such as 3,6-dithiaoctane-1,8-diol Etc.
The treatment temperature is preferably the same as the temperature of the series of bath treatment steps, and the treatment time is 10 to 1000 seconds, preferably 20 to 200 seconds.

After electroless plating and / or reducing agent treatment, or after development treatment or after development treatment and fixing treatment, electrolytic plating is performed to enhance conductivity. The electrolytic plating has been described above.

(2-4) Oxidation treatment In the present invention, it is preferable to subject the metallic silver portion after the development treatment and the conductive metal portion formed by physical development and / or plating treatment to an oxidation treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.
Examples of the oxidation treatment include known methods using various oxidizing agents such as Fe (III) ion treatment. As described above, the oxidation treatment can be performed after the emulsion layer exposure and development processing, or after the physical development or plating treatment, and may be performed after the development processing and after the physical development or plating treatment.

(3) Conductive metal portion In the present invention, when the conductive metal portion is used as a translucent electromagnetic wave shielding material, a triangle such as a regular triangle, an isosceles triangle, a right triangle, a square, a rectangle, a rhombus, and a parallelogram It is preferably a geometric figure combining squares such as shapes, trapezoids, (positive) hexagons, (positive) n-gons such as (positive) octagons, circles, ellipses, stars, etc., and these geometric figures More preferably, it is in the form of a mesh. From the viewpoint of EMI shielding properties, the triangular shape is the most effective, but from the viewpoint of visible light transmittance, if the same line width is used, the larger the (positive) n-gonal n number, the higher the aperture ratio and the visible light transmittance. This is advantageous because it becomes larger. From the viewpoint of making moiré less likely to occur, it is also preferable to arrange these geometric patterns at random or change the line width without periodicity.
In addition, when it is a use of an electroconductive wiring material, the shape of the said electroconductive metal part is not specifically limited, Arbitrary shapes can be determined suitably according to the objective.

  In the use of the translucent electromagnetic wave shielding material, the line width of the conductive metal part is preferably 1 μm or more and 40 μm or less, preferably 5 μm or more and 30 μm or less, and most preferably 10 μm or more and 25 μm or less. The line spacing is preferably 50 μm or more and 500 μm or less, more preferably 200 μm or more and 400 μm or less, and most preferably 250 μm or more and 350 μm or less. The conductive metal portion may have a portion whose line width is wider than 20 μm for the purpose of ground connection or the like.

  The conductive metal portion in the present invention has an aperture ratio of preferably 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is a ratio of a portion having no fine line forming the mesh to the whole. For example, the aperture ratio of a square lattice mesh having a line width of 15 μm and a pitch of 300 μm is 90%.

(4) Light transmissive part The "light transmissive part" in the present invention means a part having transparency other than the conductive metal part in the light transmissive electromagnetic wave shielding film. As described above, the transmittance of the light-transmitting portion is 90% or more, preferably 95, as shown by the minimum transmittance in the wavelength range of 380 to 780 nm excluding the contribution of light absorption and reflection of the support. % Or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.

The mesh pattern in the present invention is preferably continuous for 3 m or more, and it can be said that the more the mesh pattern is continuous, the more preferable it is because the loss in producing the optical filter material can be reduced. On the other hand, if the number of continuous rolls is large, the roll diameter will increase when the roll is formed, the roll will become heavy, the pressure at the center of the roll will become strong, causing problems such as adhesion and deformation, and cheapness. The following is preferable. Preferably they are 100 m or more and 1000 m or less, More preferably, they are 200 m or more and 800 m or less, Most preferably, they are 300 m or more and 500 m or less.
For the same reason, the thickness of the support is preferably 200 μm or less, more preferably 20 μm to 180 μm, and most preferably 50 μm to 120 μm.

  In the present invention, the pattern of intersecting linear thin lines in which meshes are substantially parallel means a so-called lattice pattern, and refers to a case where adjacent straight lines constituting the lattice are parallel or parallel within ± 2 °.

  As a scanning method of the light beam, a method of exposing with a linear light source or a rotating polygon mirror arranged in a direction substantially perpendicular to the transport direction is preferable. In this case, the light beam needs to be intensity-modulated by two or more values, and the straight line is patterned as a series of dots. Since the dots are continuous, the edge of the fine line of one dot is stepped, but the thickness of the fine line means the narrowest length of the constricted part.

As another method of scanning the light beam, it is also preferable to scan a beam whose scanning direction is inclined with respect to the conveyance direction in accordance with the inclination of the grating pattern. In this case, it is preferable to arrange the two scanning light beams so as to be orthogonal to each other. The light beam is substantially 1 on the exposed surface.
Take the intensity of the value.

  In the present invention, the mesh pattern is preferably inclined by 30 ° to 60 ° with respect to the conveying direction. More preferably, it is 40 ° to 50 °, and most preferably 43 ° to 47 °. This is because it is generally difficult to create a mask whose mesh pattern has an inclination of about 45 ° with respect to the frame, and this method tends to cause problems such as unevenness and high price. Since unevenness does not easily occur in the vicinity, the effect of the present invention is more remarkable for patterning by photolithography or screen printing using a mask contact exposure method.

(5) Protective film which can be peeled off The protective film does not necessarily have to be provided on both surfaces of the electromagnetic wave shielding sheet (translucent electromagnetic wave shielding film). FIG. As shown in FIG. 5, the protective film is only provided on the mesh-like metal foil provided on the laminate, and may not be provided on the transparent base film side. Moreover, as shown in FIG.2 (b) of the said gazette, it has only a protective film on the transparent base film side of a laminated body, and does not need to have a protective film on metal foil.

  Layer structure of a laminate comprising at least a transparent base film in a sheet for electromagnetic wave shielding and an electromagnetic wave shielding layer having transparency made of a mesh-like metal foil in which apertures are closely arranged, and the laminate The manufacturing process is not described here, but is shown in FIGS. 3A to 3F of the above publication.

  First, a laminate in which a transparent substrate film and a metal foil are laminated via an adhesive layer is prepared. As the transparent substrate film, films such as acrylic resin, polycarbonate resin, polypropylene resin, polyethylene resin, polystyrene resin, polyester resin, cellulose resin, polysulfone resin, or polyvinyl chloride resin can be used. Usually, a film of polyester resin such as polyethylene terephthalate resin having excellent mechanical strength and high transparency is preferably used. The thickness of the transparent substrate film is not particularly limited, but is preferably about 50 μm to 200 μm from the viewpoint of mechanical strength and increasing resistance to bending, and the thickness may be further increased, but electromagnetic wave shielding When the sheet for use is laminated on another transparent substrate, the thickness does not necessarily have to be greater than this range. As needed, it is good to give a corona discharge process to one side or both surfaces of a transparent base film, or to provide an easily bonding layer.

  The electromagnetic shielding sheet has the effects of enhancing the outermost surface, imparting antireflection properties, imparting antifouling properties to the front and back surfaces of the laminate laminated on the substrate through an infrared cut filter layer, etc. The above protective film must be peeled off during such further lamination, and therefore, the lamination of the protective film on the metal foil side is the so-called peeling. It is desirable to do so.

  The peel strength when the protective film is laminated on the metal foil is preferably 5 mN / 25 mm width to 5 N / 25 mm width, more preferably 10 mN / 25 mm width to 100 mN / 25 mm width. If it is less than the lower limit, peeling is too easy and the protective film may peel off during handling or inadvertent contact, which is not preferable, and if it exceeds the upper limit, a large force is required for peeling, and at the time of peeling, The mesh-shaped metal foil may peel off from the transparent base film (or from the adhesive layer), which is also not preferable.

  In the electromagnetic wave shielding sheet, the lower surface side of a laminate (which may be accompanied by a blackening layer) in which a mesh-like metal foil is laminated on a transparent substrate film via an adhesive layer, that is, a transparent substrate. The protective film to be laminated on the film side is designed to prevent the lower surface of the transparent substrate film from being damaged during handling or inadvertent contact, and in each step of etching by providing a resist layer on a metal foil, especially during etching. In order to protect the exposed surface of the transparent substrate film from contamination or erosion.

  As in the case of the protective film described above, this protective film also needs to be peeled off when the laminated body is further laminated. Therefore, it is desirable that the protective film be laminated on the transparent substrate film side so as to be peelable. The peel strength is preferably 5 mN / 25 mm width to 5 N / 25 mm width, more preferably 10 mN / 25 mm width to 100 mN / 25 mm width, similarly to the protective film in the test method. If it is less than the lower limit, peeling is too easy and the protective film may be peeled off during handling or inadvertent contact. This is not preferable, and if it exceeds the upper limit, a large force is required for peeling.

  The protective film to be laminated on the transparent substrate film side is preferably resistant to etching conditions, for example, is not eroded during etching for several minutes by an etching solution of about 50 ° C., particularly its alkaline component, or dry etching. In this case, it is desirable to withstand a temperature condition of about 100 ° C. In addition, when laminating the photosensitive resin layer, when the laminate is dip coated (dip coating), the coating liquid adheres to the opposite surface of the laminate, so the photosensitive resin is used during the etching process. It is preferable that the adhesive strength of the photosensitive resin is obtained so that it does not peel off and drift in the etching solution, and when using the etching solution, it depends on the etching solution containing iron chloride, copper chloride, etc. It is preferable to have durability that resists contamination, or durability that resists erosion or contamination by a resist removing solution such as an alkaline solution.

  In order to satisfy each of the above points, as a film constituting the protective film, a polyolefin resin such as polyethylene resin, polypropylene resin, polyester resin such as polyethylene terephthalate resin, polycarbonate resin, or resin film such as acrylic resin is used. In addition, from the above viewpoint, at least the surface of the protective film, when applied to the laminate, is subjected to a corona discharge treatment or is laminated with an easy adhesion layer. Is preferred.

  Moreover, as an adhesive which comprises a protective film, an acrylate ester type | system | group, a rubber type, or a silicone type thing can be used.

  The protective film film material and the pressure sensitive adhesive material described above can also be applied as they are to the protective film applied to the metal foil side, so different protective films may be used as the two protective films. Things can be both protective films.

(6) Blackening layer The roll-like light-transmitting electromagnetic wave shielding film of the present invention and the optical film incorporating the same may be subjected to blackening treatment.
The blackening process is disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-188576. The blackened layer formed even by the blackening treatment can impart antireflection properties in addition to the antirust effect. The blackening layer can be formed by, for example, Co—Cu alloy plating, and can prevent reflection of the surface of the metal foil. Further, a chromate treatment may be performed thereon as a rust prevention treatment. The chromate treatment is performed by dipping in a solution containing chromic acid or dichromate as a main component and drying to form a rust-preventive coating, which can be performed on one or both sides of the metal foil as required. A commercially available chromate-treated copper foil or the like may be used. Although a metal foil that has been blackened in advance can be used, it may be blackened in an appropriate later step. The blackening layer can also be formed by forming a photosensitive resin layer that can be a resist layer using a black colored composition, and leaving the resist layer without removal after the etching is completed. Alternatively, a plating method that gives a black film may be used.

  Further, as another example of the configuration including the blackening layer, the configuration described in JP-A-11-266095 may be used. That is, the first blackening layer is provided on the conductive metal portion, the electrolytic plating is performed on the first blackening layer, and then the second blackening layer is further provided on the plating. is there. In order to perform electroplating on the first blackened layer, at least the first blackened layer needs to be conductive. In general, the conductive blackening layer can be formed using a conductive metal compound, for example, a compound such as nickel (Ni), zinc (Zn), copper (Cu), or the like. It can be formed using an ionic polymer material such as an electrodeposition coating material.

In the present invention, the electrolytic solution bath (black plating bath) containing the blackening material may be a black plating bath mainly composed of nickel sulfate, and a commercially available black plating bath is also the same. Specifically, for example, Shimizu Co., Ltd. black plating bath (trade name, Novroi SNC, Sn-Ni alloy system), Nihon Kagaku Sangyo Co., Ltd. black plating bath (product) Name, Nikka Black, Sn—Ni alloy system), black plating bath (trade name, Ebony-Chromium 85 series-85 series, Cr series) manufactured by Metal Chemical Co., Ltd., and the like can be used. Moreover, in this invention, various black plating baths, such as Zn type | system | group, Cu type | system | group, others, can be used as said black plating bath. Next, after conducting the conductive plating to form a conductive mesh pattern, a second blackening layer is formed thereon. For example, when the electroplating metal is Cu, a hydrogen sulfide (H ₂ S) solution treatment is performed to blacken the Cu surface as copper sulfide (CuS), thereby forming a second blackened layer. As a material constituting the mesh-like conductive pattern, the above-mentioned metal as a highly conductive substance can be used as the most advantageous material. Therefore, when forming the above-mentioned metal electrodeposition layer, a general-purpose metal electrolyte can be used, so there are many kinds of inexpensive metal electrolytes, and the choice suitable for the purpose is free. There is an advantage that can be done. In general, Cu is frequently used as an inexpensive good conductive metal, and in the present invention, it is useful to use Cu in accordance with the purpose. Of course, other metals are also the same. It can be used for. Next, in the present invention, the mesh-like conductive pattern 4 need not be composed of only a single metal layer. For example, although not shown, the mesh-like conductive pattern 4 made of Cu in the above example is used. Since the metal is relatively soft and easily damaged, the protective layer can be a two-layer metal electrodeposition layer using a general-purpose hard metal such as Ni or Cr. In addition, as the blackening treatment agent for the second blackening layer, it can be easily produced using a sulfide-based compound, and there are many types of commercial treatment agents. -Black CuO, CuS, selenium-based Copa Black No. 65 (made by Isolate Chemical Laboratories, Inc.), trade name, Ebonol C Special (made by Meltex Co., Ltd.), etc. can be used.

  When the electromagnetic wave shielding film according to the present invention is produced by an etching resist pattern, the resist pattern after the blackening treatment may be removed or may be left. Furthermore, the etching resist pattern In the case of removing the pattern, the surface of the remaining conductive metal layer can be blackened after the etching resist pattern is removed. Thus, the blackening treatment is performed using a known blackening treatment method such as a plating method such as black copper (Cu) or black nickel (Ni) or a chemical blackening treatment method. be able to.

[Functional layers other than electromagnetic shielding of translucent electromagnetic shielding film]
(7) Other functional layers In the present invention, a functional layer having functionality may be separately provided as necessary. This functional layer can have various specifications for each application. For example, as an electromagnetic shielding material for displays, an antireflection layer provided with an antireflection function with an adjusted refractive index and film thickness, a non-glare layer or an antiglare layer (both have a glare prevention function), and absorbs near infrared rays. Near-infrared absorbing layer made of compound or metal, layer with a color tone adjustment function that absorbs visible light in a specific wavelength range, antifouling layer with a function that easily removes dirt such as fingerprints, and hard scratch-resistant hard coat A layer, a layer having an impact absorbing function, a layer having a function of preventing glass scattering when glass is broken, and the like can be provided. These functional layers may be provided on the opposite side of the silver salt-containing layer and the support, or may be provided on the same side.
These functional films may be directly bonded to the PDP, or may be bonded to a transparent substrate such as a glass plate or an acrylic resin plate separately from the plasma display panel main body. These functional films are called optical filters (or simply filters).

<Functional film>
When using a translucent electromagnetic wave shielding film for a display (especially a plasma display), it is preferable to give each functionality by sticking the functional film which has the functionality demonstrated below. The functional film can be directly or indirectly attached to the translucent electromagnetic wave shielding film via an adhesive or the like.
(Anti-reflection and anti-glare properties)
The translucent electromagnetic wave shielding film has anti-reflection (AR: anti-reflection) properties to suppress external light reflection, or anti-glare (AG: anti-glare) properties to prevent the reflection of mirror images, or both characteristics. It is preferable to provide any of the antireflection antiglare (ARAG) properties provided.
With these performances, it is possible to prevent the display screen from becoming difficult to see due to the reflection of a lighting fixture or the like. Further, by reducing the visible light reflectance of the film surface, not only the reflection can be prevented but also the contrast and the like can be improved. When the functional film having antireflection properties and antiglare properties is attached to the translucent electromagnetic wave shielding film, the visible light reflectance is preferably 2% or less, more preferably 1.3% or less, and still more preferably Is 0.8% or less.

The functional film as described above can be formed by providing a functional layer having antireflection properties and antiglare properties on a suitable transparent substrate.
As the antireflection layer, for example, a fluorine-based transparent polymer resin, magnesium fluoride, a silicon-based resin, a thin film of silicon oxide, or the like formed as a single layer with an optical film thickness of, for example, a quarter wavelength, a different refractive index, It may be formed of a multi-layered laminate of thin films of inorganic compounds such as metal oxides, fluorides, silicides, nitrides, sulfides, or organic compounds such as silicon resins, acrylic resins, and fluorine resins. it can.

The antiglare layer can be formed from a layer having a minute uneven surface state of about 0.1 μm to 10 μm. Specifically, acrylic, silicon-based resin, melamine-based resin, urethane-based resin, alkyd-based resin, fluorine-based resin and other thermosetting or photo-curable resins, silica, organosilicon compounds, melamine, acrylic, etc. It is possible to form by coating and curing an ink in which particles of the inorganic compound or organic compound are dispersed.
The average particle size of the particles is preferably about 1 to 40 μm.
The antiglare layer can also be formed by applying the thermosetting or photocurable resin and pressing and curing a mold having a desired gloss value or surface state.
When the antiglare layer is provided, the haze of the translucent electromagnetic wave shielding film is preferably 0.5% or more and 20% or less, more preferably 1% or more and 10% or less. If the haze is too small, the antiglare property is insufficient, and if the haze is too large, the transmitted image sharpness tends to be low.

(Hard coat property)
In order to add scratch resistance to the translucent electromagnetic wave shielding film, it is also preferable that the functional film has a hard coat property. Examples of the hard coat layer include acrylic resins, silicon resins, melamine resins, urethane resins, alkyd resins, thermosetting resins such as fluorinated resins, and photocurable resins. There is no particular limitation. The thickness of the hard coat layer is preferably about 1 to 50 μm. When the antireflection layer and / or the antiglare layer is formed on the hard coat layer, a functional film having scratch resistance, antireflection property and / or antiglare property is preferably obtained.
The surface hardness of the translucent electromagnetic wave shielding film to which hard coat properties are imparted is preferably a pencil hardness according to JIS (K-5400) of at least H, more preferably 2H, and even more preferably 3H or more. .

(Antistatic property)
In order to prevent dust adhesion due to electrostatic charging and electrostatic discharge due to contact with the human body, it is preferable that the transmissive electromagnetic wave shielding film has antistatic properties.
As the functional film having antistatic properties, a film having high electrical conductivity can be used. For example, the electrical conductivity may be about 10 ¹¹ Ω / □ or less in terms of surface resistance.
A highly conductive film can be formed by providing an antistatic layer on a transparent substrate. Specific examples of the antistatic agent used in the antistatic layer include a trade name Pelestat (manufactured by Sanyo Kasei Co., Ltd.), a trade name of electro slipper (manufactured by Kao Corporation), and the like. In addition, the antistatic layer may be formed of a known transparent conductive film such as ITO, or a conductive film in which conductive ultrafine particles such as ITO ultrafine particles and tin oxide ultrafine particles are dispersed. Antistatic properties may be imparted to the hard coat layer, antireflection layer, antiglare layer and the like by adding conductive fine particles.

(Anti-fouling property)
It is preferable that the light-transmitting electromagnetic wave shielding film has antifouling property because it can be easily removed when the fingerprint is prevented from being smudged or smudged.
The functional film having antifouling properties can be obtained, for example, by applying a compound having antifouling properties on a transparent substrate. The compound having antifouling property may be a compound having non-wetting properties with respect to water and / or fats and oils, and examples thereof include fluorine compounds and silicon compounds. Specific examples of the fluorine compound include trade name OPTOOL (manufactured by Daikin), and examples of the silicon compound include trade name Takata Quantum (manufactured by Nippon Oil & Fats Co., Ltd.).

(UV-cutting property)
The translucent electromagnetic wave shielding film is preferably imparted with UV-cutting properties for the purpose of preventing deterioration of a dye and a transparent substrate described later. The functional film having ultraviolet cut-off property can be formed by a method in which the transparent substrate itself contains an ultraviolet absorber or by providing an ultraviolet absorbing layer on the transparent substrate.
As the ultraviolet ray cutting ability necessary for protecting the dye, the transmittance in the ultraviolet region shorter than the wavelength of 380 nm is 20% or less, preferably 10% or less, more preferably 5% or less. A functional film having ultraviolet cut-off properties can be obtained by forming a layer containing an ultraviolet absorber or an inorganic compound that reflects or absorbs ultraviolet rays on a transparent substrate. Conventionally known UV absorbers such as benzotriazoles and benzophenones can be used, and their types and concentrations are dispersibility / solubility in the medium to be dispersed or dissolved, absorption wavelength / absorption coefficient, thickness of the medium. It is determined from the above and is not particularly limited.

In addition, it is preferable that the functional film which has ultraviolet cut-off property has little absorption of visible light region, and does not show visible light transmittance | permeability remarkably or exhibit colors, such as yellow.
Moreover, when the layer containing the pigment | dye mentioned later is formed in the functional film, it is desirable for the layer which has ultraviolet-ray cutting property to exist outside the layer.

(Gas barrier properties)
If a translucent electromagnetic shielding film is used in a temperature / humidity environment higher than room temperature and humidity, the pigments described later deteriorate due to moisture, or moisture aggregates in the adhesive used for bonding and the bonding interface and becomes cloudy. In other cases, the translucent electromagnetic wave shielding film preferably has a gas barrier property because the adhesive may be phase-separated due to the influence of moisture and may precipitate and become cloudy.
In order to prevent such pigment deterioration and fogging, it is important to prevent moisture from entering the pigment-containing layer and the adhesive layer, and the water vapor permeability of the functional film is 10 g / m ² · day or less, Preferably it is 5 g / m ² · day or less.

(Other optical properties)
Since a plasma display generates intense near-infrared rays, it is preferable to provide near-infrared cutability when a light-transmitting electromagnetic wave shielding film is used particularly for a plasma display.
As a functional film which has near-infrared cut property, what has the transmittance | permeability in a wavelength range 800-1000 nm is 25% or less, More preferably, it is 15% or less, More preferably, it is 10% or less.

  Moreover, when using a translucent electromagnetic wave shielding film for a plasma display, it is preferable that the transmitted color is neutral gray or blue gray. This is because the light emission characteristics and contrast of the plasma display are maintained or improved, and white having a slightly higher color temperature than standard white may be preferred.

  Furthermore, the color plasma display is said to have insufficient color reproducibility. In particular, the emission spectrum of red display shows several emission peaks ranging from about 580 nm to about 700 nm, and has a relatively strong short wavelength. There is a problem in that red emission is not good in color purity close to orange due to the emission peak on the side. Therefore, the functional film preferably has a function of selectively reducing unnecessary light emission from the phosphor or the discharge gas which is the cause of the functional film.

  These optical properties can be controlled by using a dye. In other words, a near-infrared absorber is used for near-infrared cut, and a dye that selectively absorbs unnecessary luminescence can be used to reduce unnecessary luminescence. The color tone can also be made suitable by using a dye having appropriate absorption in the visible region.

  As the coloring matter, a general dye or pigment having a desired absorption wavelength in the visible region and a compound known as a near infrared absorbing agent can be used, and the type thereof is not particularly limited. , Phthalocyanine, methine, azomethine, oxazine, imonium, azo, styryl, coumarin, porphyrin, dibenzofuranone, diketopyrrolopyrrole, rhodamine, xanthene, pyromethene, dithiol Examples thereof include organic dyes that are generally commercially available, such as compounds and diiminium compounds.

Since the temperature of the panel surface of the plasma display is high and the temperature of the translucent electromagnetic wave shielding film rises when the temperature of the environment is high, it is preferable that the dye has heat resistance that does not deteriorate at, for example, about 80 ° C. is there.
In addition, some dyes have poor light resistance, but if such dyes are used to cause problems with light emission of plasma displays and deterioration of external light by ultraviolet rays or visible rays, a functional film as described above. It is preferable to prevent the dye from being deteriorated by ultraviolet rays or visible rays by adding an ultraviolet absorber or providing a layer that does not transmit ultraviolet rays.
The same applies to humidity and a combined environment in addition to heat and light. When it deteriorates, the transmission characteristics of the optical filter change, and the color tone may change or the near-infrared cutting ability may decrease.
Further, in order to dissolve or disperse in a resin composition for forming a transparent substrate or a coating composition for forming a coating layer, the dye preferably has high solubility and dispersibility in a solvent.

The concentration of the dye can be appropriately set from the absorption wavelength / absorption coefficient of the dye, the transmission characteristics / transmittance required for the translucent electromagnetic wave shielding film, and the type / thickness of the medium or coating film to be dispersed. .
When making a functional film contain a pigment | dye, you may contain in the inside of a transparent base material, and you may coat the layer containing a pigment | dye on the base-material surface. Further, two or more kinds of dyes having different absorption wavelengths may be mixed and contained in one layer, or two or more layers containing dyes may be included.

  In addition, since the dye may be deteriorated by contact with a metal, when such a dye is used, the functional film containing the dye has a layer containing the dye having metallic silver on the translucent electromagnetic shielding film. More preferably, it is arranged so as not to contact the part or the conductive metal part.

When the translucent electromagnetic wave shielding film having the functional film attached thereto is attached to the display, it is usually attached so that the functional film is on the outer side and the adhesive layer is on the display side.
Here, in order not to deteriorate the electromagnetic wave shielding ability of the translucent electromagnetic wave shielding film, it is desirable to ground the metallic silver part or the conductive metallic part. For this reason, it is desirable to form a conductive part for grounding on the translucent electromagnetic wave shielding film, and to make the conductive part electrically contact the ground part of the display body. The conducting portion is preferably provided around the metallic silver portion or the conductive metallic portion along the peripheral edge portion of the translucent electromagnetic shielding film.
The conductive part may be formed by a mesh pattern, or may not be patterned, for example, may be formed by a solid metal foil, but in order to make good electrical contact with the ground part of the display body, It is preferable that it is not patterned like a metal foil solid.

  The conductive portion may be a mesh pattern layer or an unpatterned layer of metal foil, for example, but the metal foil solid layer may be used for good electrical contact with the ground portion of the display body. It is preferable that the conductive portion is not patterned like a layer.

  For example, when the conductive part is not patterned like a solid metal foil and / or when the conductive part has a sufficiently strong mechanical strength, the conductive part itself can be used as an electrode.

In order to protect the conductive part and / or to make good electrical contact with the ground part when the conductive part is a mesh pattern layer, it may be preferable to form an electrode on the conductive part. The electrode shape is not particularly limited, but is preferably formed so as to cover all the conductive portions.
The material used for the electrode is a single element or an alloy of two or more of silver, copper, nickel, aluminum, chromium, iron, zinc, carbon, etc. Alternatively, a paste made of a synthetic resin and a mixture of these simple substances or alloys, or a paste made of borosilicate glass and a mixture of these simple substances or alloys can be used. Conventionally known methods can be employed for printing and coating the paste. Moreover, a commercially available conductive tape can also be used conveniently. The conductive tape has conductivity on both sides, and a single-sided adhesive type and a double-sided adhesive type using a carbon-dispersed conductive adhesive can be suitably used. The thickness of the electrode is not particularly limited, but is about several μm to several mm.

  ADVANTAGE OF THE INVENTION According to this invention, the optical filter excellent in the optical characteristic which can maintain or improve the image quality can be obtained, without impairing the brightness | luminance of a plasma display remarkably. In addition, it has excellent electromagnetic shielding ability to block electromagnetic waves that have been pointed out to be harmful to the health generated from plasma displays, and it also efficiently uses near-infrared rays near 800 to 1000 nm emitted from plasma displays. Since it is cut well, an optical filter that does not adversely affect the wavelengths used by the remote control of peripheral electronic devices, transmission optical communication, etc., and can prevent malfunctions thereof can be obtained. Furthermore, an optical filter having excellent weather resistance can be provided at a low cost.

The features of the present invention will be described more specifically with reference to examples and comparative examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention should not be construed as being limited by the specific examples shown below.
[Example 1]
(Emulsion A adjustment)
・ Part 1: Water 750ml
20g gelatin
Sodium chloride 1.6g
1,3-Dimethylimidazolidine-2-thione 20mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
・ Two liquids 300ml
150 g silver nitrate
・ 3 liquid water 300ml
Sodium chloride 38g
Potassium bromide 32g
Hexachloroiridium (III) potassium (0.005% KCl 20% aqueous solution) 5ml
Ammonium hexachlororhodate (0.001% NaCl 20% aqueous solution) 7ml
Potassium hexachloroiridium (III) (0.005% KCl 20% aqueous solution) and ammonium hexachlororhodate (0.001% NaCl 20% aqueous solution) used in the three solutions were dissolved in KCl 20% aqueous solution and NaCl 20% aqueous solution, respectively. And heated for 120 minutes.

To 1 liquid maintained at 38 ° C. and pH 4.5, 90% of the 2 and 3 liquids were simultaneously added over 20 minutes with stirring to form 0.15 μm core particles. Subsequently, the following 4th and 5th liquids were added over 8 minutes, and the remaining 10% of the 2nd and 3rd liquids were further added over 2 minutes to grow particles to 0.18 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete grain formation.
・ 4 liquid water 100ml
Silver nitrate 50g
・ 5 liquid 100ml
Sodium chloride 13g
Potassium bromide 11g
Yellow blood salt 5mg

Then, it washed with water by the flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C., 3 g of anionic precipitant-1 shown below was added, and the pH was lowered using sulfuric acid until the silver halide was precipitated (in the range of pH 3.2 ± 0.2). Met). Next, about 3 liters of the supernatant was removed (first water washing). Further, 3 liters of distilled water was added, and sulfuric acid was added until the silver halide settled. Again, 3 liters of the supernatant was removed (second water wash). The same operation as the second water washing was further repeated once (third water washing) to complete the water washing / desalting process. 8 g of gelatin was added to the emulsion after washing and desalting, adjusted to pH 5.6 and pAg 7.5, 10 mg of sodium benzenethiosulfonate, 3 mg of sodium benzenethiosulfinate, 15 mg of sodium thiosulfate and 10 mg of chloroauric acid were added. Chemical sensitization to obtain optimum sensitivity at 0 ° C., 100 mg of 1,3,3a, 7-tetraazaindene as stabilizer and 100 mg of proxel (trade name, manufactured by ICI Co., Ltd.) as preservative It was. Finally, a silver iodochlorobromide cubic grain emulsion containing 70 mol% of silver chloride and 0.08 mol% of silver iodide and having an average grain diameter of 0.18 μm and a coefficient of variation of 9% was obtained. (Finally, the emulsion was pH = 5.7, pAg = 7.5, conductivity = 60 μS / m, density = 1.28 × 10 ³ kg / m ³ , viscosity = 60 mPa · s).

(Preparation of Sample 1-1)
A sample 1-1 was prepared by coating on a polyethylene terephthalate film support having a moisture-proof layer undercoat containing vinylidene chloride on both sides as shown below so as to have a UL layer / emulsion layer configuration. The preparation method, coating amount and coating method of each layer are shown below.
<Emulsion layer>
The emulsion A was subjected to spectral sensitization by adding sensitizing dye (sd-1) 5.7 × 10 ⁻⁴ mol / mol Ag. Further, KBr 3.4 × 10 ⁻⁴ mol / mol Ag and compound (Cpd-3) 8.0 × 10 ⁻⁴ mol / mol Ag were added and mixed well.
Then, 1,3,3a, 7-tetraazaindene 1.2 × 10 ⁻⁴ mol / mol Ag, hydroquinone 1.2 × 10 ⁻² mol / mol Ag, citric acid 3.0 × 10 ⁻⁴ mol / mol Ag, surfactant (Sa -1), (Sa-2) and (Sa-3) were added so that the coating amounts were 60 mg / m ² , 40 mg / m ² and 2 mg / m ² , respectively, and the pH of the coating solution was adjusted using citric acid. Adjusted to 5.6. Thus Ag7.6g / m ² The emulsion layer coating solution was prepared on the following support was coated to a gelatin 1.1 g / m ^2.

<UL layer>
Gelatin 0.23 g / m ²
Compound (Cpd-7) 40mg / m ²
Compound (Cpd-14) 10mg / m ²
Preservative (Proxel) 1.5mg / m ²

  In addition, the coating liquid of each layer added the thickener represented by the following structure (Z), and adjusted the viscosity.

<Support>
A polyethylene terephthalate resin having an intrinsic viscosity of 0.66 obtained by polycondensation using antimony trioxide as a main catalyst was dried to a moisture content of 50 ppm or less and melted in an extruder set at a heater temperature of 280 to 300 ° C.
The molten PET resin is discharged from a die part onto a chill roll electrostatically applied to obtain an amorphous base. The obtained amorphous base was stretched 3.1 times in the base traveling direction and then stretched 3.9 times in the width direction to obtain a support having a thickness of 96 μm.

<Back layer (adhesive layer located on the opposite side between the silver salt emulsion layer and the support)>
The sample used in the present invention was coated and dried successively under the following coating conditions with a coating solution having the following composition to form the following back layer (easy adhesion layer).
In the state where the polyethylene terephthalate support that has been biaxially stretched is transported at a transport speed of 105 m / min, the surface of the general support is subjected to corona discharge treatment under an applied energy intensity of 727 J / m ² , and an antistatic layer comprising the following composition: The coating solution for coating was applied by the bar coating method.
The coating amount was 7.1 ml / m ^2, and an antistatic layer was obtained by drying at a temperature of 180 ° C. for 1 minute in an air flotation drying zone.

(First layer coating solution (for antistatic layer))
Distilled water 781.7 parts by weight Polyacrylic resin (Julimer ET-410: Nippon Pure Chemical Co., Ltd., 30% solid content) 30.9 parts by mass Acicular structure tin oxide particles (FS-10D: Ishihara Sangyo Co., Ltd., solid content 20%) 131.1 parts by mass Carbodiimide compound (Carbodilite V-02-L2: Nisshinbo, solid content 40%) 6.4 parts by weight Surfactant (Sandet BL: Sanyo Chemical Industries, solid content 44.6%) 1.4 parts by weight Surfactant (Naroacty HN-100: Sanyo Chemical Industries solid content 100%) 0.7 parts by weight Silica fine particle dispersion (Seahoster KE-W30: Nippon Shokubai 0.3μm solid content 20%) 5.0 parts by weight

While maintaining the conveyance speed of 105 m / min, a surface layer coating solution having the following composition was subsequently applied by bar coating on the above-described antistatic property.
The coating amount was 5.05 ml / m ^2, and a two-layer back layer was obtained by drying for 1 minute at 160 ° C. in an air flotation drying zone.

(Second layer coating solution (for back side surface layer))
Distilled water 941.0 parts by mass Polyacrylic resin (Julimer ET-410: Nippon Pure Chemicals, solid content 30%) 57.3 parts by mass Epoxy compound (Denacol EX-521: Nagase Chemical Industries, solid content 100%) 1.2 parts by mass Surface activity Agent (Sandet BL: Sanyo Chemical Industries, solids 44.6%) 0.5 parts by mass

<Undercoat layer (adhesive layer) for photosensitive layer>
The undercoat layer for the photosensitive layer (easy adhesion) is formed by simultaneously applying the undercoat coating solution to the surface of the polyethylene terephthalate support opposite to the surface on which the back layer is formed so as to have the following composition. Layer).
That is, in a state where the substrate was conveyed at a conveyance speed of 105 m / min, the surface of the opposite surface of the support was subjected to corona discharge treatment under an applied energy intensity of 467 J / m ² and applied by a bar coating method so as to have the following composition. The first undercoat layer was obtained by drying for 1 minute at a temperature of 180 ° C. in an air floating drying zone.

<First undercoat layer>
Distilled water 823.0 parts by mass Styrene-butadiene copolymer latex (Nipol Latex LX407C5: ZEON Corporation solid content 40%) 151.5 parts by mass
2,4-Dichloro-6-hydroxy-s-triazine sodium salt (H-232: Sankyo Chemical Co., Ltd., solid content 8%) 25.0 parts by mass Polystyrene fine particles (average particle size 2 μm)
(Nipol UFN1008: Nippon Zeon solid content 10%) 0.5 parts by mass

While maintaining the conveyance speed of 105 m / min, a surface layer coating solution having the following composition was subsequently applied onto the first undercoat layer by the bar coating method.
The coating amount was 8.7 cc / m ^2, and a two-layer back layer was obtained by drying at 160 ° C. for 1 minute in an air flotation drying zone.

<2nd undercoat layer>
Distilled water 980.5 parts by weight Gelatin (alkali treatment) 14.8 parts by weight Methylcellulose (TC-5: Shin-Etsu Chemical Co., Ltd.) 0.46 parts by weight Compound (Cpd-21) 0.33 parts by weight Proxel (Cpd-22 solid content 3.5%) 2.0 parts by weight

<Application method>
First, two layers of the UL layer and the emulsion layer from the side closer to the support as the emulsion surface side were coated on the support with the above-mentioned subbing layer in the order of a simultaneous multi-layer by a slide bead coater method while maintaining at 35 ° C. It was passed through a set zone (5 ° C.). Here, Cpd-7, which is a hardener, was added to the UL layer immediately before coating, and was added to the emulsion layer by diffusing from the UL layer. Then, on the side opposite to the emulsion surface, from the side closer to the support, the conductive layer and the back layer were coated in the order of the conductive layer and the back layer simultaneously with the addition of the hardener solution by the curtain coater method, and the cold air set zone (5 ° C) was formed. I let it pass. When passing through each set zone, the coating solution showed a sufficient setting property. Subsequently, both sides were simultaneously dried in the drying zone.

Sample 1-1 thus obtained has a coating silver amount of 7.6 g / m ² , an Ag / gelatin weight ratio of the emulsion layer of 6.9, a swelling ratio of 209%, and a product of Ag / gelatin weight ratio and swelling ratio of 13.2. It was a photosensitive material having an emulsion layer as the uppermost layer. Here, the swelling ratio of the emulsion layer was determined as follows. That is, the thickness (a) of the emulsion layer at the time of drying is obtained by observing a section of the sample at the time of drying with a scanning electron microscope, immersed in distilled water at 25 ° C. for 1 minute, and then freeze-dried with liquid nitrogen. Was observed with a scanning electron microscope to determine the film thickness (b) of the emulsion layer during swelling, and the swelling ratio was calculated by the following equation.
Swell rate (%) = 100 × ((b) − (a)) / (a)

(Exposure and development processing)
A grid-like pattern capable of giving a developed silver image of line / space = 15 μm / 285 μm (pitch 300 μm) on the emulsion layer of each dried sample was used using an image setter FT-R5055 manufactured by Dainippon Screen Co., Ltd. And exposed. At this time, the exposure amount was adjusted to be optimal for each sample.
Two types of conductive films (conductive film a and conductive film b) were prepared by performing the following treatment on each sample after exposure.
Conductive film a: A conductive film having a conductive metal portion made of developed silver was prepared by performing the following development treatment.
Conductive film b: A conductive film in which the conductive metal portion is composed of developed silver and copper was prepared by performing the following development treatment and subsequent plating treatment.

・ Development Processing Process Temperature Time Black and white development 20 ° C 60 seconds Fixing 35 ° C 40 seconds Rinse 1 * 35 ° C 60 seconds Rinse 2 * 35 ° C 60 seconds Drying 50 ° C 60 seconds

・ Plating treatment Acid cleaning 35 ℃ 30 seconds Electrolytic plating 1 35 ℃ 30 seconds Voltage 70V
Electrolytic plating 2 35 ℃ 30 seconds Voltage 20V
Electrolytic plating 3 35 ℃ 30 seconds Voltage 10V
Electrolytic plating 4 35 ℃ 30 seconds Voltage 5V
Rinse 3 * 35 ° C 10 seconds Rinse 4 * 35 ° C 10 seconds Rust prevention solution 35 ° C 30 seconds Rinse 5 * 25 ° C 60 seconds Rinse 6 * 25 ° C 60 seconds Drying 50 ° C 60 seconds
* The water-washing process was a two-tank counter-flow system from rinse 2 to 1, rinse 4 to 3, and rinse 6 to 5.

The composition of each treatment liquid is as follows.
[Black and white developer 1L prescription]
Hydroquinone 20 g
Sodium sulfite 50 g
Potassium carbonate 40 g
Ethylenediamine tetraacetic acid 2 g
Potassium bromide 3 g
Polyethylene glycol 2000 1 g
Potassium hydroxide 4 g
Adjust to pH 10.3

[Fixing solution 1L prescription]
ATS 1.2 mol Ammonium iodide 5 g
Ammonium sulfite monohydrate 25 g
Acetic acid 5 g
Ammonia water (27%) 1 g
Adjust to pH 6.2

[Acid cleaning solution 1L formulation]
190 g of sulfuric acid
Hydrochloric acid (35%) 0.06 mL
Capper Gream PCM 5 mL
(Rohm and Haas Electronic Materials Co., Ltd.)
Add pure water and add 1 L

[Electrolytic plating solution 1L prescription]
・ Electrolytic copper plating solution composition (same replenisher composition)
Copper sulfate pentahydrate 75 g
190 g of sulfuric acid
Hydrochloric acid (35%) 0.06 mL
Capper Gream PCM 5 mL
(Rohm and Haas Electronic Materials Co., Ltd.)
Add pure water and add 1 L

[Anti-rust solution 1L prescription]
Sodium nitrate 0.2 mol / L aqueous solution

[Rinse solution 1L prescription (Rinse 1-6 are common)]
Deionized water (conductivity 5μS / cm or less) 1000 mL
Adjusted to pH 6.5

  The oxidation-reduction potential of the black and white developer was −340 mV vs SCE when expressed as a bath potential obtained by immersing the rotating platinum electrode in the developer.

Each sample was subjected to the above exposure and treatment, and further subjected to a rust prevention treatment with an aqueous solution containing the compound of the present invention described in Table 1 (0.01 mol / L). In addition, this process was performed by immersing in said aqueous solution for 3 minutes.
After the rust prevention treatment, the sample was washed with water and dried to obtain a sample of the present invention. A conductive metal film comprising a metal silver part or a conductive metal part and a light transmitting part substantially free of metal was formed. Here, the metal silver part or the conductive metal part exhibited a mesh pattern corresponding to the exposure pattern, and the line / space width was 15 μm / 285 μm in any sample. In all samples, the aperture ratio of the light transmission part was about 90%. In addition, when the surface resistivity was measured according to JIS7194 using a Mitsubishi Chemical Corporation low resistivity meter Lorester GP / ASP probe, the surface resistivity was 0.5Ω / □ or less, and the PDP electromagnetic shielding film As a result, it had sufficient conductivity.

(Comparison sample preparation)
As shown in Table 1, a comparative sample was prepared in the same manner as in Example 1 except that the rust prevention treatment was not performed or the rust inhibitor was changed.

<Evaluation method>
(Surface resistance)
The surface resistivity was measured with a Mitsubishi Chemical resistivity meter Loresta.
The sample described in Table 1 below was 0.3Ω / □.
(Moisture and heat resistance / discoloration of conductive metal parts)
A two-day wet heat resistance test was performed under the conditions of 80 ° C. and 90% RH, and the discoloration of the conductive metal part after the test was visually evaluated. The discoloration was determined by observing the phenomenon that the color of metallic copper changes from green to brown, thereby determining the resistance to moist heat.
Those in which discoloration was observed were rated as x, and those in which discoloration was not recognized were marked as ◯.
(Coloring of heat-resistant / light-transmitting parts)
A heat resistance test was conducted at 100 ° C. for one week, and a test piece with a decrease in transmittance of 410 nm after the test of 3% or more was evaluated as x.

    As can be seen from Table 1, it was found that the sample of the present invention shown in Example 1 hardly causes discoloration of the metal wire portion. Furthermore, surprisingly, it has been found that the treatment in the present invention has an unexpected effect of preventing coloration on a light-transmitting part that is not considered to rust because it does not form a conductive metal part. did.

[Example 2]
(Production of optical filter)
Using the film having the translucent electromagnetic wave shielding ability obtained in Example 1 above, on the translucent electromagnetic wave shielding film on the inner side excluding the outer edge portion 20 mm, the acrylic translucent adhesive material having a thickness of 25 μm is interposed. The glass plate was bonded together. The acrylic light-transmitting pressure-sensitive adhesive layer contained a toning dye (PS-Red-G, PS-Violet-RC manufactured by Mitsui Chemicals) that adjusts the transmission characteristics of the optical filter. Furthermore, an antireflection film having a near-infrared cutting ability (trade name Realic 772UV, manufactured by NOF Corporation) was bonded to the opposite main surface of the glass plate via an adhesive material to produce an optical filter.

  The obtained optical filter also has a black metal mesh so that the display image does not have a metallic color, and has an electromagnetic wave shielding ability and a near infrared ray cutting ability that are not problematic in practice, and is visible by an antireflection layer. It was excellent. Further, by adding a dye, a color-adjusting function can be imparted, and it can be suitably used as an optical filter such as a plasma display.

It is a schematic diagram which shows an example of the electroplating tank suitably used for the electroplating process of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electroplating tank 11 Plating bath 12a, 12b Feed roller 13 Anode plate 14 Guide roller 16 Film 17 Liquid cutting roller

Claims (5)

  The silver salt-containing layer provided on the transparent support is exposed and developed to form a metallic silver part and a light-transmitting part, and the metallic silver part is further subjected to physical development and / or plating treatment, thereby A translucent electromagnetic wave shielding film in which a conductive metal part carrying a conductive metal is formed on the surface of a metallic silver part, further comprising an organic nitrogen-containing heterocyclic compound in the shielding film Translucent electromagnetic shielding film.   The translucent electromagnetic wave shielding film according to claim 1, wherein the transparent support is a plastic film.   3. The light transmitting device according to claim 1, wherein the conductive metal film is formed of a fine mesh line of 1 μm to 40 μm, and a pattern formed by the fine mesh line is continuous for 3 m or more. Electromagnetic shielding film.   An optical filter for a plasma display panel, comprising the electromagnetic wave shielding film according to claim 1.   A plasma display panel comprising the electromagnetic wave shielding film according to claim 1.

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