JP2007234792A - Electronic apparatus cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make passage width of blast in a lateral cooling device very small, and to reduce ventilation resistance in an electronic apparatus cooling device having the lateral cooling device radiating generated heat of an electronic apparatus outside through a water-cooled heat exchanger. <P>SOLUTION: The water-cooled heat exchanger 10 is a plate fin & tubular heat exchanger having a rectangular plate fin having a short side and a long side and a water-cooled pipe. The heat exchanger is arranged in the lateral cooling device 9, so that a long side (l) direction (B direction) of the rectangular plate fin and an in-flow direction (A direction) of cooling wind become the almost same direction with a micro inclination angle (β) through dividers for ventilation guide 17a and 17b, which are installed in doorway parts of cooling wind. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a cooling device for an electronic device, and more particularly to a cooling device for a large electronic device with a large heat generation amount such as a server system including a large scale integrated circuit and a high performance CPU.

  Regarding the cooling device for electronic devices, various configurations have been proposed according to the scale and the amount of heat generated (see, for example, Patent Documents 1 and 2).

  Large electronic devices are usually used in a dedicated air-conditioning environment by air-conditioning a room in which electronic devices are installed, for example, a computer room. The heat generated by the electronic device is dissipated to the installation environment, and this heat is removed by a dedicated air conditioner.

  FIG. 8 is a schematic perspective view for explaining the conventional electronic device cooling apparatus as described above, and FIG. 7 is a schematic top view of the electronic device cooling apparatus of FIG. 7 and 8, part number 1 is a housing in which an electronic device 5 is accommodated, 2 is a side cover, 3 is a front cover (with a vent), 4 is a back cover (with a vent), and 6 is an image. A heating element of the electronic device shown, 7 is a cooling fan, and 8 is a pedestal. In FIG. 7, the flow path of the cooling air is indicated by an arrow, and heat generated from the electronic device is radiated from the ventilation opening of the front cover 3 to the installation environment by the cooling air.

  By the way, in recent years, the amount of heat generated by electronic devices has been increasing year by year, and the capacity of cooling air conditioners has reached the limit due to the increase in capacity. ing. This is because a large amount of capital investment is required to add a new computer room or increase the air conditioning capacity.

  In order to solve the above problems, a configuration of a cooling device for an electronic device as shown in FIG. 6 can be considered. FIG. 6 is a schematic top view of an electronic device cooling device provided with a side-by-side cooling device having a water-cooled heat exchanger on the side surface of the housing in order to exhaust heat outside through the cooling water without radiating heat to the installation environment. FIG. In FIG. 6, the same members as those in FIG. 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In FIG. 6, 9 is a horizontal cooling device having a water-cooled heat exchanger 10, and 11 and 12 are air ducts provided on the front and back surfaces of the casing, respectively. In FIG. 6, the circulation of the cooling air is, as indicated by an arrow, heating element 6 → fan 7 → air duct 11 → horizontal cooling device 9 → air duct 12 → electronic device 5, and the electronic device along the circulation passage of the cooling air 5 is carried to the horizontal cooling device 9 and removed in the water-cooled heat exchanger 10.

  FIG. 4 is a schematic enlarged configuration diagram of the horizontal cooling device 9 of FIG. 6, and FIG. 5 is a perspective view of the water-cooled heat exchanger 10. In addition, the water-cooled heat exchanger 10 in FIG. 4 shows the figure seen from the arrow direction of P of FIG. These configurations will be described in detail below. In FIG. 4, the water cooling heat exchanger 10 provided in the horizontal cooling device 9 is a plate fin & tube heat exchanger having rectangular plate fins having short sides and long sides and water cooling pipes. 5, reference numeral 13 is a fin, 14 is a manifold of a water cooling coil, 15 is a U bend, 16 is an end plate, and 17a and 17b are partition plates provided near the cooling air inlet and outlet, respectively.

Further, the short side and the long side of the plate fin are indicated by m and l, respectively, and the stacking height of the fin is indicated by n. Furthermore, the flow direction of the cooling air is indicated by an arrow and a symbol F. The cooling air flows in from the lower right side of FIG. 4 as indicated by the symbol F, flows along the direction of the short side m of the fin, passes between the fins, and flows out to the upper left side of FIG. In FIG. 4, an angle α formed by A-0-B indicates an angle formed by the long side direction (0-B) of the plate fin and the inflow direction (A-0) of the cooling air. This angle α is close to approximately 90 degrees in FIG. That is, since the main surface of the plate fin is substantially perpendicular to the cooling air inflow direction (A-0), the air path is bent sharply before and after the plate fin portion. Therefore, there is a problem that the ventilation resistance in the horizontal cooling device 9 is increased, and as a result, the air volume is reduced and the cooling capacity cannot be sufficiently exhibited.
JP-A-5-235570 JP 2002-366258 A

  By the way, in the case of the electronic apparatus cooling apparatus shown in FIG. 6, the horizontal cooling apparatus 9 does not include a dedicated circulation fan from the viewpoint of cost reduction, and the blowing depends on the electronic apparatus fan 7. Therefore, it is desired to reduce the ventilation resistance in the horizontal cooling device 9 as much as possible. On the other hand, since the horizontal cooling device 9 is provided on the side surface of the housing 1 that houses the electronic device, it is required that the dimension in the flow width direction of the cooling air in the horizontal cooling device 9 be as small as possible.

  The present invention has been made in view of the above-described demand, and an object of the present invention is to provide an electronic device cooling apparatus including a side-by-side cooling apparatus that radiates heat generated by the electronic apparatus to the outside through a water-cooled heat exchanger. The purpose of the present invention is to reduce the ventilation passage width in the horizontal cooling device as much as possible and to reduce the ventilation resistance.

  The above-mentioned subject is achieved by the following. That is, a plurality of electronic devices housed in a housing, a fan for cooling the electronic devices, and a horizontal cooling device installed on the side surface of the housing and having a water-cooled heat exchanger, It was configured to circulate between the electronic device and the side-mounted cooling device through air ducts provided on the front and back surfaces of the housing, and to dissipate heat generated from the electronic device to the outside via the water-cooled heat exchanger. In the electronic apparatus cooling apparatus, the water-cooled heat exchanger is a plate fin & tube heat exchanger having a rectangular plate fin having a short side and a long side and a water-cooled pipe, and the heat exchanger is disposed in the side-by-side cooling apparatus. In addition, the long side direction of the rectangular plate fin and the inflow direction of the cooling air are in substantially the same direction with a minute inclination angle through the partition plate for the ventilation guide provided at the inlet / outlet portion of the cooling air. Set up as Characterized in that the (first aspect of the present invention). According to the above invention, since the long side direction of the plate fin and the inflow direction of the cooling air are installed so as to be substantially the same direction, the passage area of the cooling air can be enlarged and the air path can be straightened, and the side cooling Even if the blower passage width of the apparatus is equal to or less than that of the conventional one, it is possible to reduce the ventilation resistance. Details will be described later.

  Further, in the electronic device cooling apparatus according to claim 1, the rectangular plate fin in the plate fin & tube heat exchanger is divided into three along the long side direction, and The fin pitches on the cooling air inlet side and outlet side in the cooling air inflow direction are made denser than the fin pitch at the center (invention of claim 2). According to the said invention, the ventilation resistance in a plate fin can be equalize | homogenized, and a cooling capability can be improved and size reduction can be achieved. Details will be described later.

  According to the present invention, in the electronic device cooling apparatus including the horizontal cooling device that dissipates heat generated by the electronic device to the outside through the water-cooled heat exchanger, the ventilation passage width in the horizontal cooling device is minimized and the ventilation resistance Thus, it is possible to provide an electronic device cooling apparatus that achieves an increase in cooling capacity and a reduction in size.

  Next, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic enlarged configuration diagram of a horizontal cooling device 9 according to an embodiment of the present invention, and FIG. 2 is a perspective view of a water-cooled heat exchanger 10. In addition, the water cooling heat exchanger 10 in FIG. 1 shows the figure seen from the arrow direction of P of FIG. 1 and 2, the same functional members as those in FIGS. 4 and 5 are denoted by the same reference numerals, and detailed description thereof is omitted. Further, the short side and the long side of the plate fin, the stacking height of the fin, and the flow direction of the cooling air are also indicated by m, l, n, and F, respectively.

  By the way, the angle α formed by the long side direction (0-B) of the plate fin shown in FIG. 4 and the cooling air inflow direction (A-0) is indicated by β in FIG. Thus, the basic difference between FIG. 1 and FIG. 4 is that the angle α is nearly 90 degrees in FIG. 4 whereas the angle β is an acute angle in FIG. It is a point close to. That is, in the case of FIG. 1, the long side l direction (B direction) of the rectangular plate fin and the cooling air inflow direction (A direction) have a slight inclination angle β and are substantially in the same direction. is set up.

  1, the air path between the plate fins can be straightened as shown by reference numeral F in FIG. 1, and the air path bent sharply before and after the plate fin portion as shown by reference numeral F in FIG. Must not. In the case of FIG. 4, the inlet width of the cooling air in the horizontal cooling device 9 is relatively narrow as the width below the partition plate 17 a, but in the case of FIG. 1, the partition plate 17 a is the water-cooled heat exchanger 10. Therefore, the inlet width of the cooling air in the horizontal cooling device 9 is relatively wide. As described above, the ventilation resistance in the horizontal cooling device 9 can be reduced in the case of FIG. 1 by expanding the air passage area of the cooling air, linearizing the air passage F, or the like.

  By reducing the ventilation resistance as described above, the amount of circulating cooling air by the fan 7 of the electronic device is increased. As a result, the cooling capacity increases, and as a result, the capacity of the electronic device can be increased and the lateral cooling device can be downsized.

  Next, FIG. 3 will be described. FIG. 3 is a perspective view of a water-cooled heat exchanger according to an embodiment of the present invention different from that in FIG. 2, and is an embodiment in which the performance of the water-cooled heat exchanger in FIG. 2 is improved. In the case of FIG. 3, the rectangular plate fin 13 in the plate fin & tube type heat exchanger is divided into three along the long side direction, and the fin pitch of the fin 13a in the central portion is roughened, and the fins on both sides thereof are divided. The fin pitches 13b and 13c are honey. That is, when the water cooling heat exchanger 10 is installed in the horizontal cooling device 9 of FIG. 1, the fin pitches on the cooling air inlet side and the outlet side in the cooling air inflow direction of the three divided plate fins are set to the fin pitch at the center. It is dense compared to.

  According to the simulation result of the cooling air speed in the horizontal cooling device 9 in FIG. 1, it is confirmed that the cooling air is relatively difficult to flow in the central portion and easier to flow on both sides. Therefore, it is effective to make the fin pitch of the fins 13a at the center coarse in order to make the ventilation resistance in the fins of the water-cooled heat exchanger uniform and improve the heat transfer capability. The above phenomenon is considered to be because the flow path length of the cooling air at the center is larger than that at both ends.

The typical expanded block diagram of the horizontal cooling apparatus in connection with embodiment of this invention. The perspective view of the water cooling heat exchanger in the horizontal cooling apparatus of FIG. 1 in connection with this invention. The perspective view of the water-cooled heat exchanger which concerns on this invention and is different from FIG. The typical expansion block diagram of the conventional horizontal cooling device. FIG. 5 is a perspective view of a water-cooled heat exchanger in the conventional horizontal cooling device of FIG. The typical top view of the electronic device cooling device which provided the conventional horizontal cooling device. The typical top view of the conventional electronic device cooling device. The typical perspective view of the conventional electronic device cooling device.

Explanation of symbols

1: Housing, 5: Electronic equipment, 6: Heating element, 7: Fan, 9: Horizontal cooling device, 10: Water-cooled heat exchanger, 11, 12: Air duct, 13, 13a, 13b, 13c: Fin, 14: Manifold, 15: U bend, 16: End plate, 17a, 17b: Partition plate, F: Flow direction of cooling air, l: Long side of plate fin, m: Short side of plate fin, n: Stack height of plate fin Α, β: angles formed by the long side direction of the plate fin and the inflow direction of the cooling air.

Claims (2)

A plurality of electronic devices housed in a housing, a fan for cooling the electronic devices, and a side-by-side cooling device installed on a side surface of the housing and having a water-cooling heat exchanger, An electronic device having a configuration in which heat is radiated to the outside through the water-cooled heat exchanger by circulating between the electronic device and the horizontal cooling device through air ducts provided on the front and back surfaces In the cooling device,
The water-cooled heat exchanger is a plate fin & tube heat exchanger having a rectangular plate fin having a short side and a long side, and a water-cooled pipe. The long plate direction of the rectangular plate fin and the inflow direction of the cooling air are arranged so as to be in substantially the same direction with a minute inclination angle through the partition plate for the ventilation guide provided in the section. Electronic device cooling device characterized. The rectangular plate fin in the plate fin & tube heat exchanger is divided into three along the long side direction, and the cooling air inlet side and the outlet side in the cooling air inflow direction of the three divided plate fins. The electronic device cooling device according to claim 1, wherein the fin pitch of the electronic device is made denser than the fin pitch of the central portion.

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