JP2007232840A - Method for manufacturing photosensitive resist film and liquid crystal device manufactured by using the method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a photosensitive resist film with a forward-tapered rim by using a photosensitive resin composition with a reverse-tapered rim, and to provide a liquid crystal device having a topcoat layer comprising the photosensitive resist film with a forward tapered rim manufactured by using the above method. <P>SOLUTION: The method for manufacturing a photosensitive resist film (topcoat layer) 23A with the forward-tapered rim portions 25A<SB>1</SB>, 25B<SB>1</SB>includes steps of: forming a photosensitive resist composition layer of a predetermined thickness on a substrate; exposing the photosensitive resist composition layer through a mask 1A having a predetermined pattern 2 and long patterns 3A<SB>1</SB>, 3A<SB>2</SB>along the edges of the predetermined pattern; and developing the resist to form the photosensitive resist film 23A in the predetermined pattern having a forward tapered rim. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to a method for producing a lift-off photosensitive resist film having a forward-tapered peripheral edge and a liquid crystal device manufactured by the manufacturing method, and more particularly to a lift-off negative photosensitive resin composition having a reverse-tapered peripheral edge. A manufacturing method of a lift-off negative photosensitive resist film having a forward-tapered peripheral edge and a topcoat layer comprising a negative photosensitive resist film for lift-off having a forward-tapered peripheral edge manufactured by the manufacturing method. The present invention relates to a transflective liquid crystal display device provided with an insulating film.

  First, as an example of a conventional transflective display device, an active matrix transflective liquid crystal display device is taken as an example, and FIG. 7 which is a plan view of several pixel portions thereof and FIG. A brief description will be given with reference.

  The conventional transflective liquid crystal display device 10 is surrounded by scanning lines Xn, Xn + 1,... And signal lines Ym, Ym + 1,. A pixel electrode 12 is provided for each region, and a reflector 24 made of a metal such as aluminum or silver is formed below the reflective portion of the pixel electrode 12. The pixel electrode 12 is connected to a switching element 14 formed of a driving thin film transistor TFT. In FIG. 8, reference numeral 13 indicates an auxiliary capacitance electrode, reference numeral 18 indicates a gate insulating film, and reference numeral 21 indicates a semiconductor layer made of amorphous silicon or the like constituting the TFT.

  The TFT is composed of an insulated gate field effect transistor, and its source electrode S is connected to the signal lines Ym, Ym + 1... To receive an image signal, and the drain electrode D is connected to the pixel through the contact hole 17. It is connected to the electrode 12. Further, the gate electrode G of the TFT is connected to the scanning lines Xn, Xn + 1... So that a gate pulse having a predetermined voltage is applied.

  In the transflective liquid crystal display device 10 shown here, as shown in FIG. 8, each TFT, the scanning lines Xn, Xn + 1... And the signal lines Ym, Ym + 1. As described above, the interlayer film 19 is provided over the entire display region of the first light-transmitting substrate 11 so as to have a predetermined height via a protective insulating film 22 made of a silicon nitride layer (hereinafter referred to as SiN layer). The pixel electrode 12 is provided on the interlayer film 19 of the reflective portion for each pixel via the reflector 24, and the pixel electrode 12 is provided directly on the surface of the interlayer film 19 in the transmissive region. Yes. Note that the surface of the interlayer film 19 in the reflecting portion is slightly uneven so that the reflected light is diffused, but this uneven state is not shown.

  Further, a common electrode 16 is provided on the second translucent substrate 15 through the color filter layer CF, and the cell gap (layer thickness of the liquid crystal layer) of the reflection part is half of the cell gap of the transmission part region. A top coat layer (insulating film) 23 is provided for achieving the above. Then, the pair of substrates is assembled by pasting the periphery together with a sealing material and enclosing the liquid crystal 20 therein, whereby the transflective liquid crystal display device 10 is obtained.

  By the way, in the transflective liquid crystal display device having such a configuration, it is necessary to arrange (orient) the molecules of the liquid crystal 20 sealed therein in a certain arrangement. Therefore, an alignment film (not shown) for aligning liquid crystal molecules is formed on the pair of substrates on which the respective constituent members as described above are formed. This alignment film is made of a predetermined material (for example, polyimide), and aligns the liquid crystal in a direction perpendicular to the substrate or in a direction slightly inclined from the vertical direction, and the liquid crystal in a horizontal direction or a horizontal direction with respect to the substrate. There are horizontal alignment films that align in a direction slightly inclined from the direction, and various display methods (for example, TN mode, STN mode, ECB (Electrically Controlled Birefringence) mode, VA (Vertical Alignment) mode, etc.) It is used properly according to the. For example, a horizontal alignment film is used in the TN mode, STN, and ECB mode (for example, see Patent Document 1 below), and a vertical alignment film is used in the VA mode (see Patent Document 2 below).

  The step of forming this alignment film is generally performed by applying a solution obtained by dissolving an alignment film forming material in a solvent onto a substrate by a predetermined method, and heating the substrate to volatilize only the solvent (temporary baking) Subsequently, the alignment film forming material from which the solvent has volatilized is further heated at a high temperature to cure the alignment film forming material (main firing) to form the alignment film, and then the alignment film is subjected to a rubbing treatment (described below) (See Patent Documents 2 and 3).

  Here, the rubbing treatment refers to a rubbing roller on which a rubbing cloth such as a cloth material is wound, and an alignment film formed on the substrate surface is brought into contact, and the roller is rotated to rub the surface of the alignment film in one direction. By rubbing the surface of the alignment film, the alignment direction of the liquid crystal molecules is regulated to the rubbing direction by giving a certain energy directivity by fluffing or forming grooves.

  FIG. 9 is a plan view showing a positional relationship between a substrate to be processed and a rubbing roller in a conventional rubbing process. In FIG. 9, a substrate 40 to be processed arranged on a stage has a configuration in which a transparent electrode is formed on one main surface of a rectangular flat glass substrate 41 and an alignment film 42 is formed so as to cover it. Yes. The rubbing roller 43 has a configuration in which a rubbing cloth 45 is wound around the surface of the rotating roller 44.

  In the rubbing process, the rubbing roller 43 is brought into contact with the surface of the alignment film 42 with a constant pressure, and the rubbing roller 43 is rotated at a predetermined speed around a rotation shaft 46 in a predetermined direction 48, for example, on the substrate 40 to be processed. In this process, the surface of the alignment film 42 is rubbed in a certain direction by moving in the longitudinal direction X. At this time, the rotation axis direction 47 and the relative movement direction 49 of the rubbing roller 43 are normally 90 ° on a plane parallel to the stage mounting surface, but the relative direction between the longitudinal direction X of the substrate to be processed 40 and the rubbing roller 43 is relatively long. The angle formed by the moving direction is selected according to various display modes (FIG. 9 shows a case where this angle is 0 °).

As described above, since the alignment film needs to be rubbed, the peripheral portion 25 of the topcoat layer (insulating film) 23 of the transflective liquid crystal display device 10 has a forward taper shape as shown in FIG. It is necessary to be. This is because if the peripheral edge portion 25 of the top coat layer 23 is reversely tapered, the alignment of liquid crystal molecules is disturbed at the edge portion 26 of the top coat layer 23, leading to a decrease in contrast of the display image.
JP 6-301036 A (paragraph [0003]) JP-A-5-203953 (paragraphs [0002] to [0007]) Japanese Patent Laid-Open No. 10-161078 (paragraph [0003], FIG. 2) JP 2003-207904 A (claims, paragraphs [0003] to [0009], [0055] to [0062])

  By the way, in the formation of conductor patterns such as TFTs, scanning lines Xn, Xn + 1,. The lift-off method has been adopted because it is advantageous for reducing the size and the conductor shape. In this lift method, a conductor such as metal is formed on the surface on which a resist film patterned using a photosensitive resist material is formed by vapor deposition, sputtering, etc., and then the resist layer is removed, The conductive film is removed (lifted off) together with the resist film to leave the conductive film only on the portion where the resist film is not formed on the substrate, thereby forming a desired conductive pattern.

  In this lift-off method, since the resist film surface is covered with a conductor film, the resist removal solution is difficult to permeate. Therefore, the resist film has a reverse taper shape as schematically shown in FIG. It has been made easy to remove (see Patent Document 4). Therefore, when manufacturing the transflective liquid crystal display device, as described above, a resist material (positive type) in which the peripheral portion 25 has a forward taper shape is required for forming the topcoat layer (insulating film) 23. In order to form various conductor patterns, a resist material (negative type) having a reverse taper shape is required. However, it is uneconomical to use a plurality of types of such photosensitive materials that are in conflict with each other, which requires a storage space for a plurality of types of materials.

  The inventors of the present application have conducted various studies on a method capable of realizing the other characteristic by using one of the photosensitive materials having the opposite characteristics such as the forward taper or the reverse taper as described above. The inventors have found a method capable of forming a forward taper using a lift-off photosensitive resist composition having a reverse taper shape, and have completed the present invention.

  That is, the first object of the present invention is to provide a method for producing a lift-off photosensitive resist film having a forward-tapered peripheral edge manufactured using a lift-off photosensitive resin composition having a reverse-tapered peripheral edge. There is to do. In addition, the second object of the present invention is to form a lift-off photosensitive resist film having a forward-tapered peripheral edge manufactured using a lift-off photosensitive resin composition having a reverse-tapered peripheral edge with a topcoat layer ( An object is to provide a transflective liquid crystal display device provided as an insulating film.

  In order to achieve the first object, a method for producing a photosensitive resist film of the present invention includes a step of forming a photosensitive resist composition layer having a predetermined thickness on a substrate, a predetermined pattern, and the predetermined pattern. A step of exposing the photosensitive resist composition layer using a mask provided with a pattern having a longitudinal shape along the edge portion of the photosensitive layer, and development of the predetermined pattern in which the peripheral portion is forward-tapered by development. And a step of forming a conductive resist film.

  Further, in the method for producing a photosensitive resist film of the present invention, the photosensitive resist composition layer is a negative photosensitive resist composition layer, and the mask has the predetermined pattern as a translucent portion with respect to a light shielding portion and the predetermined pattern. A slit having a longitudinal shape along an edge portion of a predetermined pattern, a step of exposing the negative photosensitive resist composition layer, and developing to develop a negative photosensitive resist film of the predetermined pattern Forming a negative photosensitive resist film having a pattern shape corresponding to the predetermined pattern and a forward tapered shape of the peripheral edge corresponding to the slit.

  Further, the method for producing a photosensitive resist film of the present invention is the above-described method for producing a photosensitive resist film having a forward-tapered peripheral portion, wherein the pattern having the longitudinal shape is along an edge portion of the predetermined pattern. A plurality of lines are formed.

  Moreover, the manufacturing method of the photosensitive resist film of this invention WHEREIN: In said manufacturing method of the photosensitive resist film whose peripheral part is a forward taper shape, the pattern which has the said some longitudinal shape contains what has a different width | variety. Features.

  The method for producing a photosensitive resist film according to the present invention is the above method for producing a photosensitive resist film having a forward taper in the peripheral edge portion, wherein the pattern having the longitudinal shape is the same along the edge portion of the predetermined pattern. It is characterized by being provided in parallel on the side.

  Further, the method for producing a photosensitive resist film of the present invention is the above method for producing a photosensitive resist film having a forward tapered shape at the peripheral edge, wherein the pattern having the plurality of longitudinal shapes is formed on an edge portion of the predetermined pattern. The width of the pattern arranged on the near side is formed wider than the width of the pattern arranged on the side far from the edge portion of the predetermined pattern.

  In order to achieve the second object, in the liquid crystal device of the present invention, the substrate is at least one of a pair of substrates constituting the liquid crystal device, and the forward tapered photosensitive resist film is It is an insulating film formed on the substrate, and is manufactured by any one of the above manufacturing methods.

  By providing the above-described configuration, the present invention has the following excellent effects. That is, according to the above-described invention, the periphery of the edge portion of the predetermined pattern is also exposed by the pattern (slit portion) having a longitudinal shape provided along the mask of the predetermined pattern. In this case, even when a lift-off negative photosensitive resist composition is used in which only a film having an inversely tapered edge is obtained, a film having a forward tapered edge can be formed. In addition, it is well known that the negative photosensitive resist composition for lift-off has a reverse edge in a normal usage method. For example, a composition as disclosed in Patent Document 4 is used. obtain.

  Moreover, according to the said invention, by providing the pattern (slit) which has several longitudinal shape around a predetermined pattern, the peripheral part of a plurality of directions can form a forward taper-like film | membrane. .

  In addition, according to the invention, the angle of the taper portion can be changed by changing the width of the pattern (slit) having the longitudinal shape, so that the forward taper portion having a desired taper inclination angle around the predetermined pattern. Can be formed.

  Moreover, according to the said invention, it can be made the same state as having substantially increased the width | variety of the pattern (slit) which has a longitudinal shape by making the number of the pattern (slit) which has a longitudinal shape into multiple pieces. In addition, when a pattern (slit) having only one longitudinal shape is made thick in order to smooth the inclination angle of the taper at the peripheral edge, the pattern (slit) portion having this longitudinal shape is uniformly exposed. As a result, a step may occur in the taper portion, but by dividing the longitudinal pattern (slit) into a plurality of pieces, a forward taper portion having a small taper inclination angle is formed while eliminating the step. Will be able to.

  In addition, according to the above-described invention, a portion closer to the edge portion of the predetermined pattern is exposed more, so that a tapered portion smoothly connected to the predetermined pattern can be obtained even if the taper inclination angle is small.

  Furthermore, according to the above invention, a lift-off photosensitive resist composition commonly used for forming a conductor pattern such as a TFT, a scanning line, a signal line, a pixel electrode, and a reflective layer of a liquid crystal device is used. In a transflective liquid crystal device, a cell gap adjusting topcoat layer (insulating film) can be formed in a forward-tapered reflecting portion (reflection display region). Since it is not necessary to prepare a plurality, it becomes economical. In addition, compared with the case where the taper portion of the topcoat layer is in the reverse taper state, the disorder of the alignment of the liquid crystal molecules generated at the edge portion can be suppressed, so that a liquid crystal device with good contrast can be obtained. It is done.

  Hereinafter, a specific example of a method for producing a topcoat layer made of a negative photosensitive resist film for lift-off having a forward taper in the peripheral edge according to the present invention will be described in detail with reference to the drawings. However, the following embodiments will be described by taking as an example a method of manufacturing a topcoat layer of a transflective liquid crystal display device for embodying the technical idea of the present invention, and the present invention is specified thereto. However, the present invention can be equally applied to various modifications without departing from the technical idea shown in the claims. A specific configuration of a transflective liquid crystal display device having a top coat layer made of a negative photosensitive resist film for lift-off having a forward tapered shape and a peripheral edge manufactured according to the following embodiments is shown in FIGS. Since it is the same as the transflective liquid crystal display device 10 of the conventional example shown, the reference numerals shown in FIGS. 7 and 8 will be referred to when necessary, and the detailed description thereof will be omitted.

FIG. 1A is a plan view of a mask 1A for manufacturing a forward-tapered topcoat layer (insulating film) 23 of Example 1, and FIG. 1B is a plan view of a topcoat layer 23A manufactured using this mask 1A. Each is shown. A schematic cross-sectional view of an exposure process using this mask 1A is shown in FIG. The mask 1A used in Example 1 includes a rectangular opening 2 that transmits exposure light corresponding to the pattern shape of the topcoat layer 23A with the light shielding mask portion (light shielding portion) as a background (ground). Narrow bar-like (line-like) slits 3A ₁ and 3A ₂ (patterns having a longitudinal shape) are provided in parallel along the edge portions on both sides. The width of the slit 3A ₁ and 3A ₂ are the same, it is smaller than the width of the peripheral portion 25A of the top coat layer (an insulating film) 23A. Note that the mask used here is for one pixel, and in actuality, a topcoat layer is formed using a mask in which a large number of such masks are formed (hereinafter the same).

When exposing a predetermined thickness for lift-off negative photosensitive resist composition formed of layers using the mask 1A, the peripheral edge of the edge portion of the opening portion 2, the light transmitted through the slit 3A ₁ and 3A ₂ parts In addition to being directly exposed, the exposure is performed by the scattered light of the light transmitted through the opening 2 and the scattered light of the light transmitted through the slits 3A ₁ and 3A ₂ portions, so that the width is larger than the width of the slits 3A ₁ and 3A _2. A tapered peripheral portion 25A is formed.

  In the transflective liquid crystal display device including the topcoat layer 23A manufactured by the manufacturing method of Example 1, the edge of the topcoat layer is compared with the case where the peripheral portion 25A of the topcoat layer 23A is in a reverse tapered state. Since the disorder of the alignment of the liquid crystal molecules generated in the portion 26A can be suppressed, a transflective liquid crystal display device with good contrast is obtained.

The width of the peripheral portion 25A of the top coat layer 23A of the first embodiment, can be widely in proportion to the increase the width of the slit 3A ₁ and 3A ₂ mask 1A, the slit 3A ₁ and 3A ₂ too widened Since the portions are uniformly exposed, a step is formed. In Example 2, in order to obtain a wide forward taper portion while avoiding such a step, a plurality of slits are provided in parallel along the edge portion of the opening portion 2 and the slit width is substantially wide. It became equivalent to. FIG. 3A shows a plan view of the mask 1B for manufacturing the forward-tapered topcoat layer 23B of Example 2, and FIG. 3B shows a plan view of the topcoat layer 23B manufactured using this mask 1B. Moreover, the schematic cross section of the exposure process using this mask 1B is shown in FIG.

The mask 1B used in Example 2 is provided with a rectangular opening 2 corresponding to the topcoat layer 23B at the center, and two slits are provided in parallel at the edge portions on both sides thereof. Among these, the slits 3B ₁ and 3B ₃ on the edge part side of the opening 2 are provided with the same thickness and at equal distances, and further, slits 3B ₂ and 3B ₄ are provided at equal distances on both sides thereof. However, the width of the slit 3B ₃ is are thicker than slightly slit 3B _4.

When the mask 1B with exposing a predetermined a thickness lift-off negative photosensitive resist composition layer, the peripheral portion of the edge of the opening 2 on one side is transmitted through the slits 3B ₁ and 3B ₂ parts the light was, and by the other side is light transmitted through the slits 3B ₃ and 3B ₄ parts, because each are exposed, broad forward tapered portion is formed than in example 1. In addition, because you have more right slits 3B ₂ is wider than slightly slit 3B _4, as shown in FIGS. 3B and 4, the loose and wide inclination angle of the taper of the drawing on the right side of the forward peripheral edge 25B It has become. In this way, the inclination angle and width of the taper can be controlled in the method of the present invention.

As described above, an alignment film is provided on the surface of the topcoat layer of the transflective liquid crystal display device, and this alignment film is subjected to rubbing treatment. And this because the rubbing direction is definite for each of the semi-transmissive liquid crystal display device, the inclination angle of the rubbing direction of the taper of the periphery 25C ₂ of the top coat layer 23C of the front side of the rubbing direction Example 3 It was formed to be smaller than the inclination angle of the distal end side of the taper of the periphery 25C _1. FIG. 5 is a plan view of the mask 1C used in Example 3, FIG. 6A is a plan view of the topcoat layer 23C obtained in Example 3, and FIG. 6B is a cross-sectional view thereof.

The mask 1C used in Example 3 has a rectangular opening 2 corresponding to the topcoat layer 23C at the center, and the leading edge side in the rubbing direction (on the right side in FIGS. 6A and 6B) at the left and right edges. ) is a slit 3C ₁ thin one provided, the front side of the rubbing direction (in FIGS. 6A and 6B the left) is provided with a narrow slit 3C ₃ provided in parallel to it with a thick slit 3C _2, further parallel to the rubbing direction In one direction (upper and lower sides in FIG. 6A), those provided with thin slits 3C ₄ and 3C ₅ were used.

When exposing a predetermined a thickness lift-off negative photosensitive resist composition layer using the mask 1C, the inclination angle of the tapered portion formed on the peripheral portion 25C ₁ rubbing direction of the distal end side is large, small inclination angle of the tapered portion formed on the peripheral portion 25C ₂ of the rubbing direction of the near side, and the inclination angle is greater topcoat layer 23C is obtained of the tapered portion of the peripheral portion 25C3 and 25C ₄ parallel side rubbing direction It is done.

  As described above, when the mask 1C having slits on the four sides of the opening 2 as used in Example 3 is used, the width and the number of these slits are appropriately polarized, so that the four sides around the topcoat layer 23C. It is possible to make the inclination angles of all the tapers different from each other, to make them partially the same, or to make them all the same.

In any of the above embodiments, the manufacturing method using the negative photosensitive resist has been described. However, in the mask used in the above embodiments, the light shielding mask portion (light shielding portion) and the exposure light transmission portion (photosensitive portion). The positive photosensitive resist is exposed and exposed using a mask in which the relationship between the pattern 2 corresponding to the pattern shape of the photosensitive resist film and the pattern 3A ₁ ) having the longitudinal shape corresponding to the forward tapered portion of the pattern is reversed. A positive photosensitive resist film in which a predetermined pattern shape and a peripheral edge portion of the pattern shape are forward tapered may be formed by development.

1A is a plan view of a mask used in Example 1, and FIG. 1B is a plan view of a topcoat layer manufactured using the mask of FIG. 1A. It is a schematic cross section of the exposure process using the mask of FIG. 1A. 3A is a plan view of the mask used in Example 2, and FIG. 3B is a plan view of a topcoat layer manufactured using the mask of FIG. 3A. It is a schematic cross section of the exposure process using the mask of FIG. 3A. 6 is a plan view of a mask 1C used in Example 3. FIG. 6A is a plan view of the topcoat layer obtained in Example 3, and FIG. 6B is a cross-sectional view of the topcoat layer obtained in Example 3. FIG. It is a top view of the several pixel part of the transflective liquid crystal display device of a prior art example. It is AA sectional drawing of FIG. It is a top view which shows the positional relationship of the to-be-processed substrate and the rubbing roller in the conventional rubbing process. It is a figure which shows typically the shape of the resist film in the conventional lift-off method.

Explanation of symbols

1A to 1C Mask 2 Openings 3A _{1 to} 3A ₂ , 3B _{1 to} 3B ₄ , 3C _{1 to} 3C ₅ slits (longitudinal pattern)
DESCRIPTION OF SYMBOLS 10 Semi-transmissive liquid crystal display device 11 1st translucent board | substrate 12 Pixel electrode 14 Switching element 15 2nd translucent board | substrate 16 Common electrode 17 Contact hole 19 Interlayer film 20 Liquid crystal 22 Protective insulating film 23, 23A-23C Top Coat layer (insulating film)
24 Reflector 25, 25A _{1 to} 25A ₂ , 25B _{1 to} 25B ₂ , 25C _{1 to} 25C ₄ Peripheral edge portion (forward taper portion)
26, 26A to 26C Edge portion CF of top coat layer Color filter layer Xn, Xn + 1... Scanning line Ym, Ym + 1... Signal line

Claims (7)

Forming a photosensitive resist composition layer having a predetermined thickness on a substrate;
Exposing the photosensitive resist composition layer using a mask provided with a predetermined pattern and a pattern having a longitudinal shape along an edge of the predetermined pattern;
A step of developing and forming a photosensitive resist film having the predetermined pattern in which the peripheral portion has a forward tapered shape;
A method for producing a photosensitive resist film, comprising: The photosensitive resist composition layer is a negative photosensitive resist composition layer,
The mask is provided with the predetermined pattern and a slit having a longitudinal shape along an edge portion of the predetermined pattern as a translucent portion with respect to the light shielding portion,
A pattern shape corresponding to the predetermined pattern and the slit are formed by exposing the negative photosensitive resist composition layer and developing to form a negative photosensitive resist film having the predetermined pattern. The method for producing a photosensitive resist film according to claim 1, wherein a negative photosensitive resist film having a corresponding forward tapered shape of a peripheral edge is formed.   The method for producing a photosensitive resist film according to claim 1, wherein a plurality of patterns having the longitudinal shape are formed along an edge portion of the predetermined pattern.   The method for producing a photosensitive resist film according to claim 3, wherein the plurality of patterns having the longitudinal shape include patterns having different widths.   4. The method for producing a photosensitive resist film according to claim 3, wherein a plurality of the patterns having the longitudinal shape are provided in parallel on the same side along an edge portion of the predetermined pattern.   In the pattern having the plurality of longitudinal shapes, the width of the pattern arranged on the side closer to the edge portion of the predetermined pattern is larger than the width of the pattern arranged on the side farther from the edge portion of the predetermined pattern. The method for producing a photosensitive resist film according to claim 5, wherein the photosensitive resist film is also formed wide.   The substrate is at least one of a pair of substrates constituting a liquid crystal device, and the forward tapered photosensitive resist film is an insulating film formed on the substrate. A liquid crystal device manufactured by any one of manufacturing methods 1 to 6.

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