JP2007230040A - Resin mold assembly and resin molding machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin mold assembly capable of effectively suppressing the occurrence of defects caused by the presence of residual air bubbles even in a case using an optically transparent resin material, and a resin molding machine. <P>SOLUTION: The resin mold assembly has a cavity and the flowable material inflow route, which is connected to the cavity, formed thereto and a thermosetting light pervious resin material can be used as a flowable material. A plurality of vent holes are opened to the cavity and include the first vent hole opened on the most downstream side of the flow of the flowable material in the cavity and the second vent hole opened to the lowermost part in the vertical direction of the cavity. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a resin mold apparatus and a resin molding apparatus, and more particularly to an arrangement design technique for a vent hole provided for gas or the like with respect to a cavity.

Molded articles using resin materials are currently used in various ways. For the production of a resin molded body, an injection device for injecting a resin material and a resin mold device for receiving the injected fluid resin material are used. As the injection device, for example, a screw type extruder is employed.
On the other hand, the resin mold apparatus is configured by combining a fixed-side mold and a movable-side mold, a movable mechanism of the movable-side mold, and a temperature control unit for adjusting the temperature of each mold. Yes. The flow path of the resin material in the mold will be described with reference to FIG. 4A to 4C, only the movable side mold 520 is shown for convenience. Actually, resin molding is performed in a state where the fixed-side mold is pressed from the front side of the sheet of FIG.

  As shown in FIG. 4A, in the movable mold 520, a sprue 521, which is a resin flow path continuing from the injection device, extends from the left side to the right side in the Y-axis direction. A cavity 523 having a shape of a resin molding to be formed is formed at the tip of the sprue 521. A gate 528 having a flow path diameter smaller than that of the sprue 521 is formed at a connection portion between the cavity 523 and the sprue 521.

The cavity 523 is provided with a vent hole 524 having an opening at a position farthest from the gate 528, that is, at the right end in the Y-axis direction of the cavity 523 in FIG.
As shown in FIG. 4B, the fluid resin material injected from the injection device is sent from the sprue 521 to the cavity 523 through the gate 528. In the cavity 523 into which the resin material has been sent, the gas remaining in the cavity 523 before the filling is discharged toward the vent hole 524.

  Incidentally, as shown in FIG. 4C, in resin molding, there may be a situation in which gas is left in the cavity 523 depending on the fluidity of the resin material, the arrangement of the vent holes 524, and the like. In such a case, due to the specific gravity between the resin material and the gas, the gas remains in the cavity 523 in a direction against gravity (upward in the Z axis), and a residual bubble portion 551 is generated. It will be. Further, since the volume of the resin material filled in the cavity 523 is determined based on the volume of the cavity 523, the bubble remaining portion 551 is generated, and the resin material corresponding to that volume becomes burrs, or the product It may become a distortion and remain.

Conventionally, various approaches have been made to the above-described problems with respect to the design of a resin forming apparatus (for example, Patent Documents 1, 2, and 3).
JP 2003-163325 A JP-A-11-87381 No. 07-9614

  However, in the conventional techniques including the above-mentioned Patent Documents 1, 2, and 3, it has become difficult to ensure the product quality for various resin materials. Specifically, when a translucent resin is used as the resin material, degassing based on stricter standards than those required during conventional molding is required. This is because, in the case of producing a translucent resin molded body using a translucent resin material, bubbles remain in the molded product, which leads to a significant deterioration of the orientation characteristics, which is a stricter standard than before. This is because it is required to degas. The conventional techniques such as the above-mentioned Patent Documents 1, 2, and 3 cannot sufficiently respond to such a request, and the above-described request is further strengthened for the future. It is anticipated that this will be necessary.

  Therefore, the present invention has been made to solve the above problems, and even when a translucent resin material is used, it is possible to effectively suppress the occurrence of defects due to residual bubbles. An object of the present invention is to provide a resin molding apparatus and a resin molding apparatus.

  In order to achieve the above object, the present invention provides a resin mold apparatus in which a cavity and an inflow path of a flowable material connected to the cavity are formed, and a thermosetting translucent resin material can be applied as the flowable material. A plurality of vent holes are opened in the cavity. The plurality of vent holes include a first vent hole opened at the most downstream side of the flow of the flowable material in the cavity and a vertical in the cavity. And a second vent hole opened at the bottom in the direction.

  In addition, a resin molding apparatus according to the present invention includes the resin molding apparatus according to the present invention as a mold part.

  As described above, in the resin mold apparatus and the resin molding apparatus including the resin mold apparatus according to the present invention, the first vent hole and the second vent hole are opened in the cavity. It is possible to effectively discharge impurities remaining in the mold inflow path and cavity before. In particular, during resin molding, a gas such as air is discharged from the first vent hole opened at the most downstream side of the flow of the flowable material (thermosetting translucent resin material) in the cavity. This is because the residual gas in the cavity is extruded and flows in accordance with the flow of the resin material to be filled. Therefore, when resin molding is performed, the most downstream of the flow of the resin material in the cavity (the resin material in the cavity is the slowest). This is because the residual gas is moved toward the turning point.

  Further, as described above, impurities having a specific gravity greater than that of the resin material are discharged from the second vent hole opened at the lowest in the vertical direction in the cavity during the resin molding. In addition, resin molding is performed repeatedly for a plurality of shots. However, cured resin remaining on the cavity or the wall surface of the inflow path in the previous shot may be introduced into the cavity during molding. However, in the resin molding apparatus and the resin molding apparatus according to the present invention in which the second vent hole is opened with respect to the cavity as described above, these cured resins can be effectively discharged. .

Therefore, in the resin mold apparatus according to the present invention and the resin molding apparatus including the resin mold apparatus, even when a translucent resin material is used, a defect caused by residual bubbles (a defect such as a decrease in light transmission efficiency) ) Can be effectively suppressed.
The following variations can be employed in the resin mold apparatus according to the present invention having the above advantages and the resin mold apparatus including the resin mold apparatus.

  In the resin mold apparatus according to the present invention and the resin molding apparatus including the same, the inflow path is connected at the vertical middle portion of the cavity, and the plurality of vent holes are opposed to the connection locations of the inflow path in the cavity. It can be set as the structure containing the 3rd vent hole opened in the location or its vicinity. Thus, in resin molding using the resin mold apparatus according to the present invention, specific gravity is close to the resin material (fluid material) having fluidity as well as the residual gas and residual impurities. Even when impurities are mixed, these can be discharged with high efficiency.

In the resin mold apparatus according to the present invention and the resin molding apparatus including the same, a configuration in which the first vent hole is opened at the uppermost portion in the vertical direction in the cavity can be employed. By opening the first vent hole in this manner, a gas such as air having a specific gravity smaller than that of the resin material is discharged from the first vent hole.
Further, the resin mold apparatus according to the present invention and the resin molding apparatus including the same have a viscosity in the range of 0.1 [Pa · s] to 1000 [Pa · s] at least when flowing into the cavity. When receiving a fluid material (thermosetting translucent resin material), it is desirable to adopt the above-described vent hole configuration. That is, when a low-viscosity resin material is introduced as described above, if a conventional resin mold apparatus is used, defects due to residual gas etc. are likely to occur, but the resin mold apparatus according to the present invention and this By adopting a vent hole configuration such as a resin molding device provided, these defects can be reduced.

  Moreover, in the said resin mold apparatus and a resin molding apparatus provided with this, although there is no limitation about the number of formation of a cavity, it is desirable to form multiple from viewpoints, such as molding efficiency.

The best mode for carrying out the present invention will be described below with reference to the drawings. The embodiment used in the following description is an example used to explain the configuration and operation / effect of the resin molding apparatus and the resin molding apparatus according to the present invention in an easy-to-understand manner. The following examples are not limited except for the outline.
1. Overall Configuration of Resin Molding Apparatus A resin molding apparatus according to the present embodiment is a thermosetting translucent resin (for example, a silicone resin) having a low viscosity (for example, 0.1 [Pa · s] to 1000 [Pa · s]). ) As a raw material, and the extruder and the resin mold apparatus 1 are the main elements. The extruder is, for example, a screw type device and is a known one. For this reason, illustration and description thereof are omitted.

2. Configuration of Resin Mold Device 1 The configuration of the resin mold device 1 having the most characteristics among the configurations of the resin molding device according to the present embodiment will be described with reference to FIG.
As shown in FIG. 1, the resin mold apparatus 1 according to the present embodiment includes a fixed mold 10 and a movable mold 20 as main elements, and the illustration thereof is omitted. However, a movable device (such as a cylinder and a guide) of the movable mold 20 is provided along with these molds 10 and 20. Among these, the fixed mold 10 is formed with a sprue 11 extending in the X-axis direction toward the fitting boundary with the movable mold 20. The sprue 11 in the fixed mold 10 is connected to the extruder at the open end (right end in the X-axis direction).

  Further, the fixed-side mold 10 is provided with a heat insulating portion 16 that interrupts the transmission of heat on the left and right sides in the middle of the X-axis direction. A cooling medium for cooling the resin material of the sprue 11 at the time of driving the right side portion in the X-axis direction of the heat insulating portion 16 in the fixed side mold 10, that is, the portion to which the extruder is connected. A pair of flow paths 12 are formed with the sprue 11 sandwiched therebetween. Each cooling medium flow path 12 is connected to a cooling medium supply unit 13.

Further, in the portion on the left side of the heat insulating portion 16 in the fixed-side mold 10, that is, the portion on the fitting side with the movable-side mold 20, portions corresponding to cavities 23a, 23b, 23c, and 23d described later are provided. A heater 14 is embedded in the interior. The heater 14 is connected to a heater power supply 15.
On the other hand, a runner 21 connected to the sprue 11 in the fixed side mold 10 is formed on the movable mold 20. The runner 21 extends in the up-down direction in the Z-axis direction (vertical direction) at the fitting boundary portion of the movable-side mold 20 with the fixed-side mold 10. A sprue lock 22 is formed in the vicinity of the intersection of the sprue 11 and the runner 21.

  A plurality of cavities 23 a, 23 b, 23 c, 23 d,... Are formed in the movable side mold 20 along the fitting boundary with the fixed side mold 10, and each is connected to the runner 21. Yes. Further, similarly to the fixed-side mold 10, the movable-side mold 20 is embedded with heaters 25 at locations corresponding to the cavities 23a, 23b, 23c, 23d,. The heater power supply 26 is connected.

  Further, vent holes 24a1, 24a2, 24b1, 24c2, 24d1, 24d2,... Are opened in the cavities 23a, 23b, 23c, 23d,. Yes. In FIG. 1, for convenience of illustration, the runner 21 and the cavities 23a and 23d are shown not connected, and only the vent holes 24b1 and 24c2 are provided in the cavities 23b and 23c. Only vent holes 24a1, 24a2, 24d1, 24d2 are connected to 23d, but in reality, runners 21 are connected to the cavities 23a, 23b, 23c, 23d,. A plurality of vent holes are opened in each.

3. Resin flow path in movable mold 20 The resin flow path in the movable mold 20 having the above-described schematic configuration will be described with reference to FIG. FIG. 2 is a plan view in which the movable mold 20 is separated from the fixed mold 10 and the fitting surface of the movable mold 20 is viewed from the right side in the Z-axis direction in FIG.
As shown in FIG. 2, the cavities 23a, 23b, 23c, 23d, 23e, 23f, 23g, and 23h in the movable mold 20 are provided in 4 rows and 2 columns on the YZ plane. The runner 21 is branched into a tree shape and connected to each of the cavities 23a, 23b, 23c, 23d, 23e, 23f, 23g, and 23h.

  A plurality of vent holes 24a1 to 24h3 are opened in each of the cavities 23a, 23b, 23c, 23d, 23e, 23f, 23g, and 23h in the movable mold 20. As shown in FIG. 2, in the resin mold apparatus 1 according to the present embodiment, three vent holes 24a1 to 24h3 are provided for the cavities 23a, 23b, 23c, 23d, 23e, 23f, 23g, and 23h. Although it is opened, the numerical aperture of the vent hole is not limited as long as it is plural for each cavity. Each vent hole 24a1-24h3 is connected to two discharge main trunk paths 27 provided in parallel.

  As shown in the enlarged portion of FIG. 2, in the present embodiment, three vent holes 24a1, 24a2, and 24a3 are opened in the cavity 23a. In the direction) of the cavity 23a. Further, the vent hole 24a2 is opened at the lowermost portion of the cavity 23a in the Z-axis direction (vertical direction), and the vent hole 24a3 is opened at a position where the runner 21 is joined to the cavity 23a, that is, a position facing the gate 28a. Yes. Here, the “location facing the gate 28 a” is a broad term including not only the location that strictly faces but also the vicinity thereof.

Although not shown in detail, the relationship between the openings of the vent holes 24a1, 24a2, 24a3 with respect to the cavity 23a is the same for the other cavities 23b, 23c, 23d, 23e, 23f, 23g, and 23h.
In the above, regarding the setting of the opening locations of the vent holes 24a1 to 24h3, the thermosetting penetration of a resin (low viscosity (for example, 0.1 [Pa · s] to 1000 [Pa · s]) used for the apparatus is used. It is set in relation to performance such as transparency required for a light-sensitive resin (for example, silicone resin) and a molded product.

4). Flow of Resin in Resin Molding Using Resin Mold Device 1 Next, the flow of the resin material 50 is also shown in FIG. 3 when the resin molding is performed using the resin molding device configured as described above. Will be described. In addition, in FIG. 3, the flow of the resin material 50 is typically shown, and the actual flow is not faithfully shown.
As shown in FIG. 3A, since the resin material 50 that has flowed from the runner 21 through the gate 28a into the cavity 23a has a low viscosity as described above, the cavity 23a has a lower Z-axis direction (vertical direction). It will be filled in order. At this time, as shown in the enlarged portion of FIG. 3A, the resin material 50 flows into the vent hole 24a2 opened at the lowermost portion of the cavity 23a. If bubbles 51 and impurities 52 are entrained in the resin material 50, they are discharged to the vent hole 24a2.

As shown in FIG. 3B, when the resin material 50 is still filled in the cavity 23a, gas such as air, impurities 52, and the like are also emitted from the vent hole 24a3 opened at a position facing the gate 28a. It is discharged together with a part of the resin material 50 or so as to be extruded into the resin material 50.
As shown in FIG. 3C, when the resin material 50 completely fills the cavity 23a, a gas such as air is extruded from the vent hole 24a1 opened at the top, and the resin material contains bubbles 51 and the like. 50 will be discharged (see the enlarged portion of FIG. 3C). At this time, since the vent hole 24a1 is opened at a location where the resin material 50 finally reaches the cavity 23a, a gas such as air is not left in the cavity 23a, and the resin molded body after molding is formed. There is no air trap mark or distortion.

  Further, if the resin mold apparatus 1 according to the present embodiment is used, the gas embraced when the resin material 50 is filled in the cavities 23a, 23b, 23c, 23d, 23e, 23f, 23g, and 23h, The resin material 50 is discharged together with part of the resin material 50 from the three vent holes 24a1 to 24h3 provided in the cavities 23a, 23b, 23c, 23d, 23e, 23f, 23g, and 23h.

  Therefore, in the resin mold apparatus 1 according to the present embodiment and the resin molding apparatus including the same, a thermosetting translucent resin having a low viscosity (for example, 0.1 [Pa · s] to 1000 [Pa · s]). Even when (for example, a silicone resin) is used as a raw material, it is possible to produce a resin molded body that has little or no sink marks, distortion, internal residual bubbles, or the like in the finished product. For this reason, also when it is going to obtain the resin molding which requires transparency, the resin molding die apparatus 1 which concerns on this Embodiment, and a resin molding apparatus provided with the same manufacture the product which fully satisfy | fills a request | requirement. be able to.

Although the flow of the resin material 50 in the cavity 23a has been described above, the other cavities 23b, 23c, 23d, 23e, 23f, 23g, and 23h also have a slight timing difference, but FIG. The flow form of the resin material 50 is the same as in FIGS.
(Other matters)
In the above-described embodiment, the resin mold apparatus 1 in which the eight cavities 23a, 23b, 23c, 23d, 23e, 23f, 23g, and 23h are formed is used as an example. For example, a resin mold apparatus having one cavity may be used, or a resin mold apparatus having a larger number of cavities may be employed.

  Moreover, in the resin mold apparatus 1 which concerns on the said embodiment, it was set as the structure by which three vent holes 24a1-24h3 were opened with respect to each cavity 23a, 23b, 23c, 23d, 23e, 23f, 23g, 23h. The vent holes may be opened at least at the location where the resin material 50 finally reaches the cavity and at the lowest part of the cavity in the vertical direction. In addition, appropriate opening is possible depending on characteristics such as viscosity of the resin material to be used, temperature management conditions during resin molding, and the shape of the resin molding (cavity shape).

Moreover, in the said embodiment, although the low-viscosity thermosetting translucent resin was used as an example of the resin material 50, not only this but a thermosetting translucent resin can be employ | adopted.
Further, although the cavities 23a, 23b, 23c, 23d, 23e, 23f, 23g, and 23h shown in FIGS. 2 and 3 are circular for convenience, the present invention is not limited to this. In addition, when there are a plurality of locations where the resin material finally arrives in the cavity during resin molding, it is desirable to open a vent hole for each of them.

  INDUSTRIAL APPLICABILITY The present invention is advantageous in realizing a resin molding device and a resin molding device that are effective for manufacturing a resin sealing body and a lens in a light emitting device.

It is sectional drawing which shows typically the structure of the resin mold apparatus 1 which concerns on embodiment. 3 is a plan view schematically showing a flow path of a resin material in the movable mold 20. FIG. 4 is a partial cross-sectional view schematically showing the flow of the resin material 50 injected into the resin mold apparatus 1. FIG. It is a fragmentary sectional view which shows typically the flow of the resin material 550 inject | poured into the resin mold apparatus 520 which concerns on a prior art.

Explanation of symbols

1. Resin mold apparatus 10. 10. Fixed side mold Sprue 12. Cooling medium flow path 13. Cooling medium supply unit 14, 25. Heater 15, 26. Heater power supply 16. Insulation part 20. Movable mold 21. Runner 22. Sprue lock 23a, 23b, 23c, 23d, 23e, 23f, 23g, 23h. Cavities 24a1, 24a2, 24a3, 24b1, 24b2, 24b3, 24c1, 24c2, 24c3, 24d1, 24d2, 24d3, 24e1, 24e2, 24e3, 24f1, 24f2, 24f3, 24g1, 24g2, 24g3, 24h1, 24h2, 24h3. Bent hole 27. Main discharge route 28a. Gate 50. Resin material 51. Bubble 52. impurities

Claims (6)

A resin mold apparatus in which a cavity and an inflow path of a fluid material connected to the cavity are formed, and a thermosetting translucent resin material is applicable as the fluid material,
A plurality of vent holes are opened in the cavity,
In the plurality of vent holes,
A first vent hole opened at the most downstream of the flow of the flowable material in the cavity;
And a second vent hole opened at the lowest in the vertical direction in the cavity. The inflow path is connected at the vertical middle part of the cavity,
2. The resin mold according to claim 1, wherein the plurality of vent holes include a third vent hole opened at a location facing the connection location of the inflow path in the cavity or in the vicinity thereof. apparatus. The resin mold apparatus according to claim 1 or 2, wherein the first vent hole is opened at an uppermost portion in the vertical direction in the cavity. The resin mold according to any one of claims 1 to 3, wherein a viscosity of the fluid material is in a range of 0.1 Pa · s to 1000 Pa · s at least when flowing into the cavity. apparatus. The resin mold apparatus according to claim 1, wherein a plurality of the cavities are formed. While having the resin mold apparatus according to any one of claims 1 to 5 as a mold part,
A resin molding apparatus, comprising: an extruding portion that supplies a thermosetting translucent resin material to an inflow path of the fluid material in the resin mold apparatus.

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