JP2007221170A5 - - Google Patents
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- Publication number
- JP2007221170A5 JP2007221170A5 JP2007132969A JP2007132969A JP2007221170A5 JP 2007221170 A5 JP2007221170 A5 JP 2007221170A5 JP 2007132969 A JP2007132969 A JP 2007132969A JP 2007132969 A JP2007132969 A JP 2007132969A JP 2007221170 A5 JP2007221170 A5 JP 2007221170A5
- Authority
- JP
- Japan
- Prior art keywords
- metal
- polishing
- water
- preparing
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 238000005498 polishing Methods 0.000 claims 30
- 239000002184 metal Substances 0.000 claims 22
- 239000007788 liquid Substances 0.000 claims 12
- 238000000034 method Methods 0.000 claims 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 9
- 239000003795 chemical substances by application Substances 0.000 claims 7
- 239000012141 concentrate Substances 0.000 claims 6
- 230000001681 protective effect Effects 0.000 claims 6
- 229910044991 metal oxide Inorganic materials 0.000 claims 3
- 150000004706 metal oxides Chemical class 0.000 claims 3
- 239000002002 slurry Substances 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 238000013329 compounding Methods 0.000 claims 1
- 238000007865 diluting Methods 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
Claims (11)
- 酸化金属溶解剤、保護膜形成剤及び水を含有してなる金属研磨濃縮液を調製し、
金属研磨濃縮液を研磨前に希釈する際に、金属の酸化剤を配合して金属研磨液を得ることを特徴とする金属用研磨液の調製方法。 - 金属研磨濃縮液が水によって希釈される請求項1に記載の金属用研磨液の調製方法。
- 金属研磨濃縮液が水によって5倍以上に希釈する請求項1又は請求項2に記載の金属用研磨液の調製方法。
- 金属研磨濃縮液が水によって10倍以上に希釈する請求項1又は請求項2に記載の金属用研磨液の調製方法。
- 上記の保護膜形成剤が、親水性を有する保護膜形成剤を含有する請求項1〜4のいずれか1項に記載の金属用研磨液の調製方法。
- 親水性基がカルボキシル基又はチオール基である請求項5に記載の金属用研磨液の調製方法。
- 上記金属研磨濃縮液を調製する際に、上記保護膜形成剤を40℃以上の温度で水に溶解させ、これと酸化金属溶解剤及び水とを混合することによって上記金属研磨濃縮液を得る、請求項1に記載の金属研磨液の調製方法。
- 酸化金属溶解剤、保護膜形成剤及び水を含有してなる金属研磨濃縮液を用意し、
金属研磨濃縮液を研磨前に希釈する際に、金属の酸化剤を配合して金属研磨液を得て、
該金属用研磨液を使用して金属膜を研磨することを特徴とする金属研磨方法。 - 研磨前に水によって希釈される請求項8に記載の金属研磨方法。
- 研磨前に水によって10倍以上に希釈される請求項8に記載の金属研磨方法。
- 親水性基を有する保護膜形成剤を含有する請求項8〜10のいずれか1項に記載の金属研磨方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007132969A JP2007221170A (ja) | 2007-05-18 | 2007-05-18 | 金属用研磨液の調製方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007132969A JP2007221170A (ja) | 2007-05-18 | 2007-05-18 | 金属用研磨液の調製方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP37260798A Division JP4078473B2 (ja) | 1998-12-28 | 1998-12-28 | 金属研磨方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007221170A JP2007221170A (ja) | 2007-08-30 |
JP2007221170A5 true JP2007221170A5 (ja) | 2008-03-13 |
Family
ID=38498029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007132969A Withdrawn JP2007221170A (ja) | 2007-05-18 | 2007-05-18 | 金属用研磨液の調製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2007221170A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200945429A (en) * | 2008-04-24 | 2009-11-01 | Uwiz Technology Co Ltd | Composition of chemical mechanical polishing |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3397501B2 (ja) * | 1994-07-12 | 2003-04-14 | 株式会社東芝 | 研磨剤および研磨方法 |
JP3841873B2 (ja) * | 1996-04-30 | 2006-11-08 | 株式会社フジミインコーポレーテッド | 研磨用砥粒及び研磨用組成物 |
KR19980032145A (ko) * | 1996-10-04 | 1998-07-25 | 포만제프리엘 | 알루미늄 구리 합금의 화학기계적 연마시 구리 도금을 방지하는 방법 |
US6068787A (en) * | 1996-11-26 | 2000-05-30 | Cabot Corporation | Composition and slurry useful for metal CMP |
US6309560B1 (en) * | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
JP4078473B2 (ja) * | 1998-12-28 | 2008-04-23 | 日立化成工業株式会社 | 金属研磨方法 |
-
2007
- 2007-05-18 JP JP2007132969A patent/JP2007221170A/ja not_active Withdrawn
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