JP2007193029A - Color filter and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To sufficiently suppress defects due to light leakage. <P>SOLUTION: The manufacturing method of a color filter comprises an exposure process, a developing process and a washing process of injecting a washing solution from each injection nozzle 8b to a transparent substrate 100 so that a spray pattern 8e on the transparent substrate 100 becomes a spindle shape. In the washing process, the washing solution is injected from each injection nozzle 8b at pressure of 5 to 35 MPa, an angle θ formed by the proceeding direction of the transparent substrate 100 and the longitudinal direction of each spray pattern 8e satisfies a relation: 45°≤θ≤85°. When A denotes length in the longitudinal direction of the spray pattern on the transparent substrate 100, overlapping width X of fellow spray patterns 8e when seen from the proceeding direction of the transparent substrate 100 in two adjoining injection nozzles 8b is set so as to satisfy a relation: (1/4)Asinθ≤X≤(3/5)Asinθ. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a color filter and a manufacturing method thereof.

Conventionally, after the formation, exposure and development of a photosensitive resin film on a glass substrate, in order to remove residues remaining on or remaining on the photosensitive resin film, a cleaning process is performed by spraying a cleaning liquid onto the glass substrate. There is known a method for manufacturing a color filter comprising: For example, in Patent Document 1, as a method of manufacturing this type of color filter, a color filter that ejects a cleaning liquid having a spraying pressure of 5 to 40 kg / cm ² (about 0.49 to 3.92 MPa) onto a substrate when cleaning the residue. The manufacturing method is known.
JP-A-7-211683

  However, in the conventional color filter manufacturing method described in Patent Document 1, light leakage may occur in the manufactured color filter.

  An object of the present invention is to provide a color filter having no light leakage and extremely good quality, and a method for manufacturing the color filter.

  By the way, when a negative photosensitive resin film containing a light-shielding agent is exposed, the amount of light absorption increases as the surface of the photosensitive resin film increases, and the photocuring reaction proceeds. Light absorption is small and photosensitivity is likely to occur, and polymerization in the deep layer does not proceed. For this reason, a ridge is generated at the edge portion on the surface side of the photosensitive resin film after development. If such a collar portion remains, when a black matrix is formed with this photosensitive resin, another photosensitive resin film formed so as to cover the black matrix is blocked without sufficiently entering the opening portion of the black matrix. Therefore, light leakage occurs when the color filter is manufactured.

  Therefore, the present inventors have conducted intensive research on a color filter having no light leakage and extremely good quality and a method for manufacturing the color filter. As a result, the present inventors have found the optimal cleaning liquid spray pressure and spray nozzle arrangement that can satisfactorily peel off the ridges generated in the photosensitive resin film containing the light-shielding agent, and have completed the present invention.

  Based on such research results, the color filter manufacturing method according to the present invention includes an exposure step of exposing a predetermined portion of a photosensitive resin film containing a light-shielding agent formed on a substrate, and an exposed portion of the photosensitive resin film. A development process for removing portions other than, and a cleaning process for cleaning the photosensitive resin film by spraying a cleaning liquid so that each spray pattern on the substrate has a spindle shape from a plurality of spray nozzles to the substrate, In the cleaning step, the cleaning liquid is sprayed from each spray nozzle onto the substrate at a pressure of 5 to 35 MPa, and the angle θ formed by the traveling direction of the substrate and the longitudinal direction of each spray pattern satisfies the relationship of 45 ° ≦ θ ≦ 85 °, When the length in the longitudinal direction of each spray pattern on the substrate is A, the overlapping width of the spray patterns when viewed from the traveling direction of the substrate in two adjacent spray nozzles There satisfy the relation of the respective (1/4) Asinθ ≦ X ≦ (3/5) Asinθ.

  In the color filter manufacturing method according to the present invention, the spray pressure of the cleaning liquid is set to be extremely higher than the spray pressure of the conventional cleaning liquid (about 0.49 to 3.92 MPa), and the spray on the substrate is further performed. In accordance with the length A in the longitudinal direction of the pattern, the width X where the adjacent spray patterns overlap each other when viewed from the traveling direction of the substrate is set to a predetermined range. Therefore, the ridges generated in the photosensitive resin film after development are scraped off evenly on almost the entire surface of the substrate and hardly remain. As a result, the photosensitive resin film to be formed later is not blocked by the collar portion, so that light leakage in the color filter is eliminated, and a color filter with extremely good quality can be manufactured.

  Here, it is preferable to spray the cleaning liquid onto the substrate at a pressure of 5 to 20 MPa from each spray nozzle, and it is more preferable to spray the cleaning liquid onto the substrate at a pressure of 5 to 15 MPa from each spray nozzle. If it does in this way, it will become possible to remove the collar part of the photosensitive resin film more easily.

  The average diameter of the cleaning liquid droplets is preferably 5 to 20 μm. If it does in this way, it will become possible to remove the collar part of the photosensitive resin film still more easily with the improvement in a cleaning effect.

  Further, the cleaning liquid is preferably pure water. If it does in this way, compared with the washing | cleaning liquid containing surfactant, a bubble will not produce easily in piping.

  Further, it is preferable to further include a step of forming a photosensitive resin using a non-spin type slit coater die. Conventionally, since the photosensitive resin film is formed on the substrate by rotating the substrate, a large amount of the photosensitive resin is discarded due to the rotation of the substrate, which is costly, and a large substrate cannot be rotated. However, since the substrate is not rotated in the non-spin type slit coater die, the photosensitive resin can be uniformly applied on the substrate regardless of the size of the substrate. As a result, the size of the color filter can be increased, and the amount of the photosensitive resin used can be minimized, so that the cost can be further reduced.

  Moreover, it is preferable that the length A in the longitudinal direction of each spray pattern on the substrate satisfies the relationship of 50 mm ≦ A ≦ 300 mm. When the length A is less than 50 mm, the installation interval between the adjacent injection nozzles is reduced from the relationship with the overlapping width X, the number of installation of the injection nozzles is increased, and the installation cost may be increased. When A exceeds 300 mm, the spraying pressure of the cleaning liquid varies particularly in the central portion of the spray pattern and both end portions in the longitudinal direction of the spray pattern, and the cleaning effect is reduced due to uneven cleaning. However, by setting the length A in this way, it is possible to reduce the cost and improve the cleaning effect.

  On the other hand, the color filter according to the present invention is manufactured by any one of the methods described above.

  ADVANTAGE OF THE INVENTION According to this invention, the color filter which can fully suppress the defect by light leakage, and its manufacturing method can be provided.

  Preferred embodiments of the present invention will be described with reference to the drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and a duplicate description is omitted.

(Color filter)
With reference to FIG. 1, the configuration of a color filter CF according to an embodiment of the present invention will be described. FIG. 1 is a longitudinal sectional view schematically showing a color filter according to this embodiment. The color filter CF includes a transparent substrate (substrate) 100, a light shielding layer 104 formed in a lattice (matrix shape) on the transparent substrate 100, and a plurality of colored resin regions 102R arranged side by side on the transparent substrate 100. 102G and 102B. The color filter CF is suitably used for a liquid crystal display device such as a TFT liquid crystal display. Examples of the transparent substrate 100 include inorganic glass (quartz glass, borosilicate glass, aluminum silicate glass, soda lime glass coated with silica on the surface), transparent rigid material such as artificial quartz glass, transparent resin film, A flexible material such as a transparent resin sheet or an optical transparent resin plate can be used.

  The light shielding layer 104 is, for example, carbon black, aniline black, a perylene compound, or a color index (published by The Society of Dyers and Colorists). I. Acid Black 51, C.I. I. Acid Black 52, C.I. I. Basic Black 2, C.I. I. It is comprised from the hardened | cured material of photosensitive resin containing light-shielding agents, such as organic pigments, such as compounds, such as Solvent Black 123, and inorganic pigments, such as titanium black and magnetite. The light shielding layer 104 is formed in a matrix so as to separate the adjacent colored resin regions 102R, 102G, and 102B, and functions as a black matrix. In the light shielding layer 104 shown in FIG. 1, the collar portion 200 a (details will be described later) of the photosensitive resin film 200 shown in FIG. 3 does not remain, so the vertical cross-sectional shape of the light shielding layer 104 has an upper bottom. It has a substantially trapezoidal shape with a short bottom (hereinafter referred to as a forward tapered shape). Therefore, the colored resin regions 102R, 102G, and 102B are securely embedded in the plurality of openings in the light shielding layer 104 arranged in a matrix. Therefore, the light transmitted through the colored resin regions 102R, 102G, and 102B is separated by the light shielding layer 104, and the occurrence of light leakage is extremely suppressed.

(Photosensitive resin)
Here, the photosensitive resin used for forming the light shielding layer 104 will be described. Here, a negative photosensitive resin is used.

  In the negative photosensitive resin, the irradiated portion of the light becomes insoluble in the developer and remains. The negative photosensitive resin is used to form an etching pattern for the light shielding layer 104. The negative photosensitive resin is preferably composed of an energy ray-polymerizable composition that is polymerized by energy rays including X-rays, ultraviolet rays, visible light, or infrared rays. The energy ray-polymerizable composition includes an energy ray polymerization initiator that absorbs energy rays to generate radicals, and a compound having at least one addition-polymerizable ethylenically unsaturated double bond that is polymerized by radicals (ethylene Compound), binders, solvents and dispersants. In addition, when forming the light shielding layer 104, the light shielding agent mentioned above is mix | blended with an energy-beam polymeric composition.

(Energy beam polymerization initiator)
Examples of the energy ray polymerization initiator include an ultraviolet-sensitive polymerization initiator that absorbs ultraviolet rays as energy rays and generates radicals, and a visible light-sensitive type initiator that absorbs visible rays as energy rays and generates radicals. A polymerization initiator etc. are mentioned. Examples of ultraviolet-sensitive polymerization initiators include dialkyl acetophenone series, benzyl dialkyl ketal series, benzoin series, benzoin alkyl ether series, thiomosantone derivatives, alsiphosphine oxide series, hexaarylbiimidazole series, and s-trihalomethyltriazine series. Of the polymerization initiator.

(Ethylene compound)
The ethylenic compound may be, for example, a monomer, a dimer, a trimer, an oligomer, or a polymer having an ethylenically unsaturated double bond in the side chain or main chain. Specific examples include unsaturated carboxylic acids and esters. Examples of the ester include an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, an ester of an aromatic polyhydroxy compound and an unsaturated carboxylic acid, an ester of a polyvalent hydroxy compound, an unsaturated carboxylic acid, and a polyvalent carboxylic acid. Is mentioned. Examples of the polyvalent hydroxy compound include an aliphatic pyrohydroxy compound and an aromatic polyhydroxy compound.

(Binder)
Examples of the binder include alkyl esters of (meth) acrylic acid such as methyl (meth) acrylic acid, vinyl acetate such as vinyl acetate, and organic substances such as acrylonitrile. From the viewpoint of adhesiveness to the transparent substrate 100, the binder may be, for example, styrene, α-methylstyrene, benzyl (meth) acrylate, hydroxyphenyl (meth) acrylic acid, methoxyphenyl (meth) acrylic acid, hydroxyphenyl (meta It is preferable to contain a copolymer of (meth) acrylic acid and a copolymerizable monomer having a phenyl group, such as acrylamide and hydroxyphenyl (meth) acrylsulfamide. The copolymerizable monomer having a phenyl group is preferably contained in a proportion of 10 to 80 mol%, more preferably 20 to 70 mol%, particularly preferably 30 to 60 mol%, based on the total amount of the binder. (Meth) acrylic acid is contained in an amount of preferably 2 to 50% by mass, more preferably 5 to 40% by mass, and particularly preferably 5 to 30% by mass with respect to the total amount of the binder. The binder is a compound in which 2 to 50 mol%, preferably 5 to 40 mol%, more preferably 10 to 30 mol% of epoxy (meth) acrylate is added to the total copolymerization monomer, ) It may contain a copolymer with acrylic acid.

(solvent)
As a solvent for dissolving the energy ray polymerizable composition, for example, methyl cellosolve, ethyl cellosolve, butyl cellosolve, diethylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, toluene, chloroform, dichloromethyl, Examples include ethyl acetate, methyl lactate, ethyl lactate, methyl alcohol, ethyl alcohol, propyl alcohol, butyl alcohol, and tetrahydrofuran. When the energy beam polymerizable composition is dissolved in this solvent, a resist solution that becomes the photosensitive resin film 200 when applied onto the transparent substrate 100 can be obtained.

  Referring again to FIG. 1, in this embodiment, colored resin regions 102 </ b> R, 102 </ b> G, and 102 </ b> B are provided on the transparent substrate 100. The colored resin regions 102R, 102G, and 102B are light transmissive and function as optical filters. The colored resin regions 102R, 102G, and 102B are made of, for example, a photosensitive resin containing a colorant such as a pigment, and a known pigment dispersion method, printing method, ink jet method, transfer method, dyeing method, or the like is used. Can be formed. The material of the photosensitive resin can be the same as the photosensitive resin constituting the light shielding layer 104 described above except that it does not contain a light shielding agent. As the pigment, for example, a yellow pigment, a red pigment, a blue pigment, a purple pigment, a green pigment and the like are preferably used. In the present embodiment, the colored resin region 102R is made of, for example, a red pigment and a resin, the colored resin region 102G is made of, for example, a green pigment and a resin, and the colored resin region 102B is made of, for example, a blue pigment and a resin. In addition, organic and inorganic pigments can be used as the pigment, and specific examples include compounds classified as Pigment in the Color Index (published by The Society of Dyers and Colorists). Such compounds include C.I. I. Pigment yellow 1, C.I. I. Pigment yellow 3, C.I. I. Pigment yellow 12, C.I. I. Pigment yellow 13, C.I. I. Pigment yellow 138, C.I. I. Pigment yellow 150, C.I. I. Pigment yellow 180, C.I. I. Yellow pigments such as C.I. Pigment Yellow 185, C.I. I. Pigment red 1, C.I. I. Pigment red 2, C.I. I. Pigment red 3, C.I. I. Pigment red 254, C.I. I. Red pigments such as C.I. Pigment Red 177, C.I. I. Pigment blue 15, C.I. I. Pigment blue 15: 3, C.I. I. Pigment blue 15: 4, C.I. I. Pigment Blue 15: 6 and other blue pigments, C.I. I. Violet pigments such as C.I. Pigment Violet 23:19, C.I. I. Examples thereof include green pigments such as pigment green 36.

  On the transparent substrate 100, a protective layer 106 and a transparent electrode layer 108 are sequentially provided so as to cover the light shielding layer 104 and the colored resin regions 102R, 102G, and 102B. The protective layer 106 prevents the light shielding layer 104 and the colored resin regions 102R, 102G, and 102B from eluting during the use of the color filter CF, and the steps (in the light shielding layer 104 and the colored resin regions 102R, 102G, and 102B ( It is provided for the purpose of making the driving speed of the liquid crystal uniform by reducing the gap. The protective layer 106 is made of, for example, a resin having an oxygen barrier property. As such a resin, for example, a resin obtained by pendating a styrylpyridium group, a stilbazole salt, or the like into polyvinyl alcohol, an acrylate copolymer, or the like can be given.

  The transparent electrode layer 108 is for driving the liquid crystal. The transparent electrode layer 108 is made of, for example, indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), tin oxide (SnO), or an alloy thereof.

  The color filter CF includes a spacer 110 provided on the transparent substrate 100. In the present embodiment, a plurality of spacers 110 are provided on the transparent electrode layer 108. The spacer 110 is preferably disposed above the light shielding layer 104. Thereby, even if the spacer 110 has a light shielding property, the light transmitted through the colored resin regions 102R, 102G, and 102B is not blocked by the spacer 110. The spacer 110 contacts the counter substrate when the color filter CF and the counter substrate (not shown) are bonded to each other, and provides a space filled with liquid crystal between the transparent electrode layer 108 and the counter substrate. The gap between the filter CF and the counter substrate is controlled. Note that the material of the spacer 110 can also be the same as the photosensitive resin that forms the light shielding layer 104 described above.

(Configuration of color filter manufacturing system)
With reference to FIG. 2, the structure of the manufacturing system 1 for enforcing the manufacturing method of the color filter which concerns on embodiment of this invention is demonstrated. FIG. 2 is a diagram showing an outline of a manufacturing system for carrying out the color filter manufacturing method according to the present embodiment.

  The manufacturing system 1 is mainly composed of a resist film forming device 2, an exposure device 4, a developing device 6 and a cleaning device 8.

(Resist deposition system)
The resist film forming apparatus 2 is an apparatus for forming a photosensitive resin film (photoresist) 200 containing a light shielding agent on the transparent substrate 100. As the resist film forming apparatus 2, it is preferable to use a non-spin type slit coater die. This is because even if the transparent substrate 100 is large, the photosensitive resin can be uniformly applied onto the transparent substrate 100.

(Exposure equipment)
The exposure device 4 is a device that projects a predetermined light pattern onto the photosensitive resin film 200 formed on the transparent substrate 100. For example, an apparatus that can perform contact exposure, proximity exposure, mirror project exposure, and the like can be used as the exposure apparatus 4. Further, the light source of the exposure apparatus 4 is not particularly limited, but is preferably g-line, h-line or i-line, and is a mixed light of g-line, h-line or i-line and light having a wavelength shorter than i-line. And more preferred.

(Developer)
The developing device 6 is a device that develops and patterns the photosensitive resin film 200. As the developing device 6, various known developing devices can be used. For example, since the photosensitive resin film 200 is a negative type, the developing device 6 removes a portion of the photosensitive resin film 200 that is not exposed by the exposure device 4 and develops (patterns) the photosensitive resin film 200. Complete. At this time, in the photosensitive resin film 200, a flange 200a is formed at the edge portion on the surface side (see FIG. 3). This is because when the photosensitive resin film 200 containing a light shielding agent is exposed by the exposure device 4, the surface of the photosensitive resin film 200 has a larger amount of light absorption and the photocuring reaction proceeds. This is because the deeper layer part farther away from the film has a smaller amount of light absorption, and photosensitivity is likely to occur, and polymerization in the deep layer part does not proceed.

(Cleaning device)
The cleaning device 8 sprays the cleaning liquid onto the patterned photosensitive resin film 200 to remove the residue remaining on the transparent substrate 100 and the photosensitive resin film 200 and the flange 200 a generated on the photosensitive resin film 200. Is for. The configuration of the cleaning device 8 will be described with reference to FIGS. 2 and 4 to 7. FIG. 4 is a schematic perspective view of the cleaning apparatus. FIG. 5 is a top view of the cleaning apparatus. FIG. 6 is a side view of the cleaning device as viewed from the transparent substrate transport direction.

  The cleaning device 8 includes a pipe 8a, a transport unit (not shown), and a plurality of injection nozzles 8b.

  The pipe 8a supplies the cleaning liquid (in this embodiment, pure water) pressurized from the tank 8c by the pump 8d to each injection nozzle 8b (see FIG. 2). The transport unit transports the transparent substrate 100 placed on the transport unit in a direction intersecting the pipe 8a (the direction of arrow a shown in FIGS. 4 and 5).

  Each spray nozzle 8b is connected to the pipe 8a so as to be arranged in a line, and sprays the cleaning liquid supplied from the pipe 8a onto the transparent substrate 100. The cleaning liquid sprayed from each spray nozzle 8b has a substantially spindle-shaped spray pattern 8e on the transparent substrate 100. Each spray nozzle 8b is installed so that the angle θ formed by the traveling direction of the transparent substrate 100 and the longitudinal direction of the spray pattern 8e on the transparent substrate 100 of the cleaning liquid is 45 ° to 85 ° (FIG. 4 and FIG. 5).

  Further, the width X (see FIGS. 5 and 6) where the spray patterns 8e overlap each other when viewed from the traveling direction of the transparent substrate 100 in the two adjacent injection nozzles 8b is (1/4) Asin θ ≦ X ≦. (3/5) It is set to satisfy the relationship of Asin θ. Here, θ is defined by the traveling direction of the transparent substrate 100 (the direction of the arrow a shown in FIGS. 3 and 4) and the longitudinal direction of the spray pattern 8e of the cleaning liquid on the transparent substrate 100 ejected from each ejection nozzle 8b. Is an angle. When the overlapping width X is less than (1/4) Asin θ, each of the adjacent injection nozzles 8b is too far away, so that a portion where the cleaning liquid is not sprayed or a portion where the pressure of the cleaning liquid becomes extremely low occurs. This is because a portion where the flange portion 200a formed on the photosensitive resin film 200 is not peeled remains, and the width of the patterned photosensitive resin film 200 tends to be non-uniform. Further, when the overlapping width X exceeds (3/5) Asin θ, the spray nozzles 8b are arranged too densely so that a portion where the cleaning liquid is too strongly hit against the photosensitive resin film 200 is generated, and the photosensitive resin is formed. This is because not only the flange 200a of the film 200 but also the photosensitive resin film 200 itself is scraped off, and the width of the patterned photosensitive resin film 200 tends to be non-uniform. The overlapping widths X are more preferably set so as to satisfy the relationship of (1/3) Asin θ ≦ X ≦ (1/2) Asin θ.

  The spray pressure of the cleaning liquid when the cleaning liquid is sprayed from each spray nozzle 8b is set to 5 to 35 MPa. When the spraying pressure of the cleaning liquid is less than 5 MPa, it is not so different from the spraying pressure of the conventional cleaning liquid (about 0.49 to 3.92 MPa), and it is difficult to remove the flange 200a of the photosensitive resin film 200. When the spraying pressure of the cleaning liquid exceeds 35 MPa, the pressure becomes too high, and not only the flange 200a of the photosensitive resin film 200 is peeled off, but also the photosensitive resin film 200 itself is scraped off. . In addition, the spraying pressure of this cleaning liquid is more preferably 5 to 20 MPa, and even more preferably 5 to 15 MPa.

  It is preferable that the average diameter of the droplets of the cleaning liquid sprayed from each spray nozzle 8b is set to 5 to 20 μm. This is because when the average diameter of the droplets is less than 5 μm, the droplets are extremely small, and thus the ridges 200a of the photosensitive resin film 200 tend not to be sufficiently removed. In addition, when the average diameter of the droplets exceeds 20 μm, the droplets are large, so that not only the collar portion 200a of the photosensitive resin film 200 but also the photosensitive resin film 200 itself tends to be scraped off. . The average diameter of the droplets is more preferably 8 to 15 μm.

  The length A (see FIG. 5) of each spray pattern 8e in the transparent substrate 100 of the cleaning liquid sprayed from each spray nozzle 8b is preferably set to satisfy the relationship of 50 mm ≦ A ≦ 300 mm. . When the length A is less than 50 mm, from the relationship with the width X (details will be described later) where the spray patterns 8e overlap each other when viewed from the traveling direction of the transparent substrate 100 in the two adjacent injection nozzles 8b. This is because the installation interval between the adjacent injection nozzles 8b is reduced, the number of installation of the injection nozzles 8b is increased, and the installation cost tends to increase. When the length A exceeds 300 mm, the spray pattern 8e becomes too large, and the spraying pressure of the cleaning liquid varies at the central portion of the spray pattern 8e on the transparent substrate 100 and both end portions in the longitudinal direction of the spray pattern 8e. This is because there is a tendency that a portion where the collar portion 200a formed on the photosensitive resin film 200 is not peeled off remains. The length A is more preferably set to satisfy the relationship of 50 mm ≦ A ≦ 250 mm.

  In the present embodiment, the angle θ formed by the traveling direction of the transparent substrate 100 (the direction of the arrow a shown in FIGS. 4 and 5) and the longitudinal direction of the spray pattern 8e of the cleaning liquid sprayed from each spray nozzle 8b (see FIG. 4) is set to 45 ° or more and 85 ° or less. Moreover, as FIG. 5 shows, the height h from the transparent substrate 100 of the injection port of each injection nozzle 8b can be about 80 mm-150 mm, for example. Further, as shown in FIG. 6, the spray angle α of the cleaning liquid sprayed from each spray nozzle 8b is a value satisfying tan (α / 2) = (A / 2) / h.

(Color filter manufacturing method)
Next, a method for manufacturing the color filter CF by the above-described color filter manufacturing system 1 will be described.

  First, the light shielding layer 104 is formed on the transparent substrate 100. Specifically, the photosensitive resin film 200 in which the above-described light shielding agent is blended is applied onto the transparent substrate 100 using a non-spin type slit coater die which is the resist film forming apparatus 2. Then, the photosensitive resin film 200 is exposed using the exposure apparatus 4, and the unexposed portion of the photosensitive resin film 200 is removed using the developing apparatus 6 to develop the photosensitive resin film 200. I do. Further, a cleaning liquid is sprayed onto the developed photosensitive resin film 200 by using the cleaning device 8, and residues remaining on the transparent substrate 100 and the photosensitive resin film 200, or a ridge portion of the photosensitive resin film 200. The light shielding layer 104 is formed by removing 200a (see FIG. 1). Then, in order to prevent deformation or the like during use of the color filter CF and to make the light shielding layer 104 have a forward tapered shape as shown in FIG.

  Subsequently, the colored resin regions 102R, 102G, and 102B are formed so as to be embedded in the plurality of openings of the light shielding layer 104 arranged in a matrix. Each of these colored resin regions 102R, 102G, and 102B is also formed in the same procedure as the light shielding layer 104 by using the resist film forming apparatus 2, the exposure apparatus 4, the developing apparatus 6, and the cleaning apparatus 8. . Here, a photosensitive resin containing the above-described colorant is used.

  Subsequently, a protective layer 106 is formed on the transparent substrate 100 so as to cover the light shielding layer 104 and the colored resin regions 102R, 102G, and 102B.

  Subsequently, a transparent electrode layer 108 is formed on the protective layer 106 as necessary. The transparent electrode layer 108 is formed by using a film forming method such as a sputtering method, a vacuum evaporation method, a CVD method, or a coating method.

  Subsequently, the color filter CF is manufactured by forming the spacer 110 on the transparent electrode layer 108. The spacer 110 is also formed in the same procedure as the light shielding layer 104 and the colored resin regions 102R, 102G, and 102B by using the resist film forming device 2, the exposure device 4, the developing device 6, and the cleaning device 8. Become.

  As described above, in the present embodiment, the jetting pressure of the cleaning liquid is set to be extremely high (5-35 MPa) as compared with the jetting pressure of the conventional cleaning liquid (about 0.49 to 3.92 MPa). The width X in which the spray patterns 8e overlap each other when viewed from the traveling direction of the transparent substrate 100 in the spray nozzle 8b is set to a predetermined range. Therefore, the flange 200a generated in the photosensitive resin film 200 that becomes the light-shielding layer 104 is scraped off evenly on substantially the entire surface of the substrate and hardly remains. As a result, since the photosensitive resin film to be formed later as the colored resin regions 102R, 102G, and 102B is not blocked by the collar portion 200a, light leakage from the color filter CF is eliminated, and the color filter having an extremely good quality. CF can be manufactured.

  In this embodiment, the average diameter of the cleaning liquid droplets is set to 5 to 20 μm. Therefore, it becomes possible to remove the flange portion 200a of the photosensitive resin film 200 more easily as the cleaning effect is improved.

  In this embodiment, pure water is used as the cleaning liquid. Therefore, bubbles are less likely to be generated in the pipe as compared with a cleaning liquid containing a surfactant, which is preferable.

  In this embodiment, a non-spin type slit coater die is used as the resist film forming apparatus 2. For this reason, conventionally, the transparent substrate 100 is rotated to form a photosensitive resin film on the transparent substrate 100, so that a large amount of photosensitive resin is discarded due to the rotation of the transparent substrate 100, and a large transparent substrate is required. However, the non-spin type slit coater die does not rotate the transparent substrate 100, so that the photosensitive resin is uniformly distributed on the transparent substrate 100 regardless of the size of the transparent substrate 100. Can be applied. As a result, the size of the color filter can be increased, and the amount of the photosensitive resin used can be minimized, so that the cost can be further reduced.

  In the present embodiment, the length A in the longitudinal direction of each spray pattern 8e in the transparent substrate 100 is set so as to satisfy the relationship of 50 mm ≦ A ≦ 300 mm. When the length A is less than 50 mm, from the relationship with the overlapping width X, the installation interval between the adjacent injection nozzles 8b may be reduced, the number of installation of the injection nozzles 8b may be increased, and the installation cost may increase. When the length A exceeds 300 mm, the spraying pressure of the cleaning liquid varies particularly in the central portion of the spray pattern 8e and both end portions in the longitudinal direction of the spray pattern 8e, and the cleaning effect is reduced due to uneven cleaning. However, by setting the length A in this way, it is possible to reduce the cost and improve the cleaning effect.

  Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments. For example, in this embodiment, a non-spin type slit coater die is used as the resist film forming apparatus 2, but depending on the size of the transparent substrate 100, known resists such as a spin coater, a roll coater, a dry film resist laminator, etc. A film forming apparatus can be used. When using a spin coater, the photosensitive resin film may be uniformly formed on the transparent substrate 100 by dropping the photosensitive resin on the center of the transparent substrate 100 and then rotating the transparent substrate 100. The photosensitive resin film may be uniformly formed on the transparent substrate 100 by applying the photosensitive resin on the transparent substrate 100 with a slit coater die and then rotating the transparent substrate 100.

  In this embodiment, pure water is used as the cleaning liquid. However, a cleaning liquid containing at least one of a nonionic surfactant and an anionic surfactant may be used.

  In this embodiment, the protective layer 106 is formed so as to cover the light shielding layer 104 and the colored resin regions 102R, 102G, and 102B. However, the protective layer 106 is not formed, and the light shielding layer 104 and the colored resin regions 102R, 102G are formed. , 102B, the transparent electrode layer 108 may be directly formed.

  In the present embodiment, the cleaning method using the above-described cleaning device 8 is applied when forming the light shielding layer 104, the respective colored resin regions 102R, 102G, and 102B, and the spacer 110, but only when forming the light shielding layer 104. A cleaning method using the cleaning device 8 may be applied.

  EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on Examples 1-1 to 1-24 and Comparative Examples 1-1 to 1-2, this invention is not limited to a following example. In addition, FIG. 7 is a table | surface which shows each implementation condition of Examples 1-1 to 1-24 and Comparative Examples 1-1 to 1-2, and its evaluation result.

(Example 1-1)
A non-spin type slit coater die (TR63240S-manufactured by Tokyo Ohka Kogyo Co., Ltd.) which is a resist film-forming apparatus 2 on a transparent substrate (1737 glass substrate manufactured by Corning) having a length and width of 1100 mm × 1250 mm and a thickness of 0.63 mm CPD-CLT) is used to uniformly apply an acrylic photosensitive resin (CFPR-BK8000 type, manufactured by Tokyo Ohka Kogyo Co., Ltd.) containing a light-shielding agent so as to have a thickness of 1.5 μm. A film 200 was formed. After the photosensitive resin film 200 is preliminarily dried at 90 ° C. for 100 seconds, the photosensitive resin is passed through a mask using a proximity exposure apparatus (Hitachi Electronics Co., Ltd. proximity exposure apparatus LE9100S type) as the exposure apparatus 4. The film 200 was irradiated with light. The exposure amount was 100 mJ / cm ² .

  Subsequently, the exposed photosensitive resin film 200 was developed by the developing device 6 using a 0.1% KOH aqueous solution at 23 ° C. for 60 seconds. Subsequently, pure water having an average droplet diameter of 10 μm was sprayed from each spray nozzle 8b to the developed photosensitive resin film 200 by the cleaning device 8 at a pressure of 10 MPa for 60 seconds. At this time, the length A in the longitudinal direction of the spray pattern 8e is 153.4 mm, and the width X in which the adjacent spray patterns 8e overlap each other when viewed from the traveling direction of the transparent substrate 100 is 68.17 mm (0.46 Asin θ), the angle. θ was 75 °, the height h of the spray nozzle 8b from the transparent substrate 100 was 100 mm, and the spray angle α was 75 °. And after drying this photosensitive resin film 200, the light shielding layer 104 which functions as a black matrix was formed on the transparent substrate 100 by post-baking for 40 minutes at 230 degreeC. Thereafter, the colored resin regions 102R, 102G, and 102B, the protective layer 106, the transparent electrode 108, and the spacer 110 were sequentially formed on the transparent substrate 100 and the light shielding layer 104 to obtain a color filter CF. In addition, when producing each colored resin area | region 102R, 102G, 102B and the spacer 110, these were wash | cleaned by the low pressure (for example, about 1.5 MPa) like the past. Further, the length A in the longitudinal direction of each spray pattern 8e in Example 1-1 and Examples and Comparative Examples described later has an error of about ± 2 mm.

(Examples 1-2 to 1-6)
When the length A is 50 mm, the widths X overlapping in the order of Examples 1-2 to 1-6 are 28.3 mm (0.59 Asin θ), 25.3 mm (0.52 Asin θ), 18.3 mm (0.38 Asin θ), respectively. Examples 1-2 to 1-6 are the same as Example 1-1 except that the photosensitive resin film 200 was cleaned at 15.3 mm (0.32 Asin θ) and 13.3 mm (0.28 Asin θ). Color filter CF was obtained.

(Examples 1-7 to 1-1-11)
With the length A being 150 mm, the width X overlapping in the order of Examples 1-7 to 1-11 was 84.9 mm (0.59 Asin θ), 74.9 mm (0.52 Asin θ), 59.9 mm (0.41 Asin θ), 44 Examples 1-7 to 1-11 are the same as Example 1-1, except that the photosensitive resin film 200 was cleaned at .9 mm (0.31 Asin θ) and 39.9 mm (0.28 Asin θ). A color filter CF was obtained.

(Examples 1-12 to 1-16)
With the length A being 250 mm, the width X overlapping in the order of Examples 1-12 to 1-16 was 141.5 mm (0.59 Asin θ), 126.5 mm (0.52 Asin θ), 106.5 mm (0.44 Asin θ), 76 Example 1-12 to Example 1-16 except that the photosensitive resin film 200 was cleaned to 0.5 mm (0.32 Asin θ) and 66.5 mm (0.28 Asin θ). A color filter CF was obtained.

(Examples 1-17 to 1-21)
When the length A is 300 mm, the width X overlapping in the order of Examples 1-17 to 1-21 is 169.8 mm (0.59 Asin θ), 154.8 mm (0.53 Asin θ), 124.8 mm (0.43 Asin θ), 89 Except that the photosensitive resin film 200 was cleaned at .8 mm (0.31 Asin θ) and 79.8 mm (0.28 Asin θ), the steps of Examples 1-17 to 1-21 were the same as in Example 1-1. A color filter CF was obtained.

(Example 1-22)
Except for cleaning the photosensitive resin film 200 with the length A set to 160 mm and the overlapping width X set to repeat 54.5 mm (0.35 Asin θ) and 74.5 mm (0.48 Asin θ). The color filter CF of Example 1-22 was obtained in the same manner as Example 1-1.

(Example 1-23)
The color filter of Example 1-23 is the same as Example 1-1 except that the photosensitive resin film 200 is cleaned with a length A of 350 mm and an overlapping width X of 163.1 mm (0.48 Asin θ). CF was obtained.

(Example 1-24)
The color filter of Example 1-24 is the same as Example 1-1 except that the photosensitive resin film 200 is cleaned with a length A of 30 mm and an overlapping width X of 14.0 mm (0.48 Asin θ). CF was obtained.

(Comparative Example 1-1)
The color filter of Comparative Example 1-1 was prepared in the same manner as in Example 1-1 except that the photosensitive resin film was washed with a length A of 150 mm and an overlapping width X of 24.9 mm (0.17 Asin θ). Obtained.

(Comparative Example 1-2)
The color filter of Comparative Example 1-2 was prepared in the same manner as in Example 1-1 except that the photosensitive resin film was washed with a length A of 150 mm and an overlapping width X of 94.9 mm (0.65 Asin θ). Obtained.

(Evaluation results)
As a result of observing the color filters CF of Examples 1-1 to 1-24 with an electron microscope, no residue or foreign matter remained in the color filters CF of Examples 1-1 to 1-24. Further, in the color filters CF of Examples 1-1 to 1-24, as shown in FIG. 7, the vertical cross-sectional shape of the light shielding layer 104 is “no ridge”, “no ridge, but some corners slightly. "Shaped off" or "Slightly left ridge", and the patterning state of the light shielding layer 104 is "uniform in width", "approximately uniform in width", or "approximately uniform in width and slightly thin" It was in a state. From the above, the evaluation results of the quality of the color filter CF in Examples 1-1 to 1-24 were either “A: extremely good” or “B: almost good”.

  On the other hand, as a result of observing the color filters of Comparative Examples 1-1 to 1-2 with an electron microscope, residues were left in a plurality of places in the color filters of Comparative Examples 1-1 to 1-2. Further, in the color filters of Comparative Examples 1-1 to 1-2, as shown in FIG. 7, the vertical cross-sectional shape of the light shielding layer is “there is a considerable ridge part” or “there is no ridge part, but the corner part. The bottom of the shading layer is severely scraped off ", and the patterning state of the light shielding layer is" uneven width ". From the above, the evaluation result of the quality of the color filter was “C: problematic”.

  Further, using the color filters CF of Examples 1-1 to 1-24 and the color filters of Comparative Examples 1-1 to 1-2, a liquid crystal panel is created and displayed by a known method, and light leakage is prevented. The state was observed visually. As a result, no light leakage was observed in any of the liquid crystal panels using the color filters CF of Examples 1-1 to 1-24. On the other hand, in the liquid crystal panel using the color filters of Comparative Examples 1-1 to 1-2, light leakage was observed particularly in a portion where the collar portion remained in the light shielding layer of the color filter.

  Then, although this invention is demonstrated more concretely based on Examples 2-1 to 2-3, this invention is not limited to a following example. In addition, FIG. 8 is a table | surface which shows each implementation condition of Examples 2-1 to 2-3, and its evaluation result.

(Example 2-1)
Under the same conditions as in Example 1-1, the light-shielding layer 104 functioning as a black matrix was formed on a transparent substrate (1737 glass substrate manufactured by Corning) having a vertical and horizontal dimensions of 1100 mm × 1300 mm and a thickness of 0.63 mm. Thereafter, a thickness of 2.1 μm is formed on the transparent substrate 100 and the light shielding layer 104 using a non-spin type slit coater die (TR63240S-CPD-CLT manufactured by Tokyo Ohka Kogyo Co., Ltd.) which is the resist film forming apparatus 2. Thus, a photosensitive resin containing a blue colorant (YB-14 manufactured by Sumitomo Chemical Co., Ltd.) was uniformly applied to form a photosensitive resin film (hereinafter referred to as a blue photosensitive resin film). After preliminary drying of the blue photosensitive resin film at 90 ° C. for 100 seconds, the blue photosensitive resin is passed through a mask using a proximity exposure apparatus (proximity exposure apparatus LE9100S manufactured by Hitachi Electronics Co., Ltd.) as the exposure apparatus 4. The film was irradiated with light. The exposure amount was 100 mJ / cm ² .

  Subsequently, the exposed blue photosensitive resin film was developed with a developing device 6 using a 0.1% KOH aqueous solution at 23 ° C. for 60 seconds. Subsequently, a photosensitive resin (manufactured by Sumitomo Chemical Co., Ltd.) containing a green colorant on the transparent substrate 100 and the blue photosensitive resin film by using the resist film forming apparatus 2 so as to have a thickness of 2.2 μm. YG-13) was uniformly applied to form a photosensitive resin film (hereinafter referred to as a green photosensitive resin film), and developed in the same manner as the blue photosensitive resin film. Further, a photosensitive resin (Sumitomo Chemical Co., Ltd.) containing a red colorant on the transparent substrate 100, the blue and green photosensitive resin films using the resist film forming apparatus 2 so as to have a thickness of 2.1 μm. YR-14) was uniformly applied to form a photosensitive resin film (hereinafter referred to as a red photosensitive resin film) and developed in the same manner as the blue photosensitive resin film. The cleaning device 8 sprayed pure water having an average droplet diameter of 10 μm from each spray nozzle 8b onto the developed blue photosensitive resin film at a pressure of 10 MPa for 60 seconds. At this time, the length A in the longitudinal direction of the spray pattern 8e is 160 mm, the overlapping width X is 74.5 mm (0.48 Asin θ), the angle θ is 75 °, and the height of the injection port of each injection nozzle 8b from the transparent substrate 100 h was 100 mm, and the injection angle α was 75 °. Then, after drying the blue, green, and red photosensitive resin films, the colored resin regions 102B, 102G, and 102R were formed on the transparent substrate 100 and the light shielding layer 104 by post-baking at 220 ° C. for 40 minutes.

(Example 2-2)
The photosensitive resin (MY-B342 manufactured by Sumitomo Chemical Co., Ltd.) to be the colored resin region 102B is applied using the resist film forming apparatus 2 so as to have a thickness of 1.7 μm, and the photosensitive resin to be the colored resin region 102G. A photosensitive resin (MY-manufactured by Sumitomo Chemical Co., Ltd.) that is applied using the resist film forming apparatus 2 so that the thickness of YX-G512 (manufactured by Sumitomo Chemical Co., Ltd.) is 1.9 μm and becomes the colored resin region 102R. A color filter CF of Example 2-2 was obtained in the same manner as in Example 2-1, except that the resist film forming apparatus 2 was used so that the thickness of R302) was 1.8 μm.

(Example 2-3)
The photosensitive resin (YF-B016 manufactured by Sumitomo Chemical Co., Ltd.) that becomes the colored resin region 102B is applied using the resist film forming apparatus 2 so that the thickness becomes 1.9 μm, and the photosensitive resin that becomes the colored resin region 102G. A photosensitive resin (YF-manufactured by Sumitomo Chemical Co., Ltd.) which is applied using the resist film forming apparatus 2 so that the thickness of YF-G022 (manufactured by Sumitomo Chemical Co., Ltd.) is 1.8 μm and becomes the colored resin region 102R. A color filter CF of Example 2-3 was obtained in the same manner as in Example 2-1, except that the resist film forming apparatus 2 was used so that the thickness of R017D) was 1.8 μm.

(Evaluation results)
As a result of observing the color filters CF of Examples 2-1 to 2-3 with an electron microscope, no residue or foreign matter remained in the color filters CF of Examples 2-1 to 2-3. In the color filters CF of Examples 2-1 to 2-3, in any of the colored resin regions 102B, 102G, and 102R, the vertical cross-sectional shape is “no ridge”, and the patterning state is “width” It was in a “uniform” state. In addition, using each of the color filters CF of Examples 2-1 to 2-3, a liquid crystal panel was prepared and turned on by a known method, and the state of light leakage was visually observed. As a result, no light leakage was observed in any of the liquid crystal panels using the color filters CF of Examples 2-1 to 2-3.

  Then, although this invention is demonstrated more concretely based on Examples 3-1 to 3-4 and Comparative Examples 3-1 to 3-3, this invention is not limited to a following example. . In addition, FIG. 9 is a table | surface which shows each implementation condition of Examples 3-1 to 3-4 and Comparative Examples 3-1 to 3-3, and its evaluation result.

(Example 3-1)
A color filter CF of Example 3-1 was obtained in the same manner as Example 1-1 except that the pressure of pure water sprayed from each spray nozzle 8b was set to 5 MPa and the photosensitive resin film 200 was washed.

(Example 3-2)
A color filter CF of Example 3-2 was obtained in the same manner as in Example 1-1 except that the pressure of pure water sprayed from each spray nozzle 8b was set to 15 MPa and the photosensitive resin film 200 was washed.

(Example 3-3)
A color filter CF of Example 3-3 was obtained in the same manner as in Example 1-1 except that the pressure of pure water sprayed from each spray nozzle 8b was set to 20 MPa and the photosensitive resin film 200 was washed.

(Example 3-4)
A color filter CF of Example 3-4 was obtained in the same manner as Example 1-1 except that the pressure of pure water sprayed from each spray nozzle 8b was set to 30 MPa and the photosensitive resin film 200 was washed.

(Comparative Example 3-1)
A color filter of Comparative Example 3-1 was obtained in the same manner as Example 1-1, except that the pressure of pure water sprayed from each spray nozzle 8b was 1.5 MPa and the photosensitive resin film 200 was washed. .

(Comparative Example 3-2)
A color filter of Comparative Example 3-2 was obtained in the same manner as Example 1-1 except that the pressure of pure water sprayed from each spray nozzle 8b was set to 3 MPa and the photosensitive resin film 200 was washed.

(Comparative Example 3-3)
A color filter of Comparative Example 3-3 was obtained in the same manner as Example 1-1 except that the pressure of pure water sprayed from each spray nozzle 8b was set to 40 MPa and the photosensitive resin film 200 was washed.

(Evaluation results)
As a result of observing the color filters CF of Examples 3-1 to 3-4 with an electron microscope, no residue or foreign matter remained in the color filters CF of Examples 3-1 to 3-4. Further, in the color filters CF of Examples 3-1 to 3-4, as shown in FIG. 9, the vertical cross-sectional shape of the light shielding layer 104 is “no ridge” or “no ridge, but some corners slightly. The patterning state of the light shielding layer 104 was “uniform width”, “substantially uniform width”, or “slightly narrow” state. From the above, the evaluation results of the quality of the color filter CF in Examples 3-1 to 3-4 were “A: extremely good” or “B: almost good”.

  On the other hand, as a result of observing the color filters of Comparative Examples 3-1 to 3-3 with an electron microscope, residues remained in the color filters of Comparative Examples 3-1 to 3-3. Further, in the color filters of Comparative Examples 3-1 to 3-3, as shown in FIG. 9, the vertical cross-sectional shape of the light shielding layer is “there is a considerable part of the collar part” or “there is no collar part, but the corner part. And the bottom is severely shaved off ", and the patterning state of the light shielding layer was" uneven width ". As a result of evaluating the quality of the color filter, it was “C: There was a problem in quality”.

  Further, using the color filters CF of Examples 3-1 to 3-4 and the color filters of Comparative Examples 3-1 to 3-3, a liquid crystal panel is created and displayed by a known method, and light leakage is prevented. The state was observed visually. As a result, no light leakage was observed in any of the liquid crystal panels using the color filters CF of Examples 3-1 to 3-4. On the other hand, light leakage was observed in the liquid crystal panels using the color filters of Comparative Examples 3-1 to 3-3.

  Then, although this invention is demonstrated more concretely based on Examples 4-1 to 4-3, this invention is not limited to a following example. In addition, FIG. 10 is a table | surface which shows each implementation condition of Examples 4-1 to 4-3, and its evaluation result.

(Example 4-1)
The color filter CF of Example 4-1 is the same as Example 1-1, except that the photosensitive resin film 200 is cleaned by setting the average diameter of pure water droplets ejected from each ejection nozzle 8b to 3 μm. Got.

(Example 4-2)
The color filter CF of Example 4-2 is the same as Example 1-1, except that the photosensitive resin film 200 is cleaned by setting the average diameter of pure water droplets ejected from each ejection nozzle 8b to 20 μm. Got.

(Example 4-3)
The color filter CF of Example 4-3 is the same as Example 1-1, except that the photosensitive resin film 200 is cleaned by setting the average diameter of pure water droplets ejected from each ejection nozzle 8b to 25 μm. Got.

(Evaluation results)
As a result of observing each of the color filters CF of Examples 4-1 to 4-3 with an electron microscope, no residue or foreign matter remained in the color filters CF of Examples 4-1 to 4-3. Further, in the color filters CF of Examples 4-1 to 4-3, as shown in FIG. 10, the vertical cross-sectional shape of the light shielding layer 104 is “no ridge”, “no ridge but no corner. The patterning state of the light shielding layer 104 was “uniform in width” or “approximately uniform in width”. From the above, the evaluation results of the quality of the color filter CF in Examples 4-1 to 4-3 were “A: extremely good” or “B: almost good”. Furthermore, using each of the color filters of Examples 4-1 to 4-3, a liquid crystal panel was created by a known method and displayed with light, and the state of light leakage was visually observed. As a result, no light leakage was observed in any of the liquid crystal panels using the color filters CF of Examples 4-1 to 4-3.

It is a longitudinal cross-sectional view which shows the color filter which concerns on this embodiment typically. It is a figure which shows the outline | summary of the manufacturing system for enforcing the manufacturing method of the color filter which concerns on this embodiment. It is a longitudinal cross-sectional view which shows an example of the developed photosensitive resin. It is a schematic perspective view of a washing | cleaning apparatus. It is a top view of a cleaning device. It is the side view of the cleaning apparatus which looked at the cleaning apparatus from the conveyance direction of the transparent substrate. It is a table | surface which shows each implementation condition of Examples 1-1 to 1-24 and Comparative Examples 1-1 to 1-2, and its evaluation result. It is a table | surface which shows each implementation condition of Examples 2-1 to 2-3. It is a table | surface which shows each implementation condition of Examples 3-1 to 3-4 and Comparative Examples 3-1 to 3-3, and its evaluation result. It is a table | surface which shows each implementation condition of Examples 4-1 to 4-3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Color filter manufacturing system, 2 ... Resist film forming apparatus, 4 ... Exposure apparatus, 6 ... Developing apparatus, 8 ... Cleaning apparatus, 8b ... Spray nozzle, 8e ... Spray pattern, 100 ... Transparent substrate, 102R, 102G, 102B DESCRIPTION OF SYMBOLS ... Colored resin area | region, 104 ... Light-shielding layer, 106 ... Protective layer, 108 ... Transparent electrode layer, 110 ... Spacer, 200 ... Photosensitive resin film, 200a ... Collar, CF ... Color filter.

Claims (8)

An exposure step of exposing a predetermined portion of the photosensitive resin film containing a light-shielding agent formed on the substrate;
A developing step of removing a portion other than the exposed portion of the photosensitive resin film;
A cleaning step of cleaning the photosensitive resin film by spraying a cleaning liquid so that each spray pattern on the substrate has a spindle shape with respect to the substrate from a plurality of spray nozzles,
In the washing step,
Spraying the cleaning liquid onto the substrate at a pressure of 5 to 35 MPa from each spray nozzle;
The angle θ formed by the traveling direction of the substrate and the longitudinal direction of each spray pattern satisfies the relationship of 45 ° ≦ θ ≦ 85 °,
When the length in the longitudinal direction of each spray pattern on the substrate is A, the overlapping widths X of the spray patterns when viewed from the traveling direction of the substrate in two adjacent spray nozzles are respectively ( 1/4) A method for producing a color filter satisfying the relationship of Asin θ ≦ X ≦ (3/5) Asin θ.   The method for manufacturing a color filter according to claim 1, wherein the cleaning liquid is sprayed from the spray nozzles onto the substrate at a pressure of 5 to 20 MPa.   The method for producing a color filter according to claim 2, wherein the cleaning liquid is sprayed from the spray nozzles onto the substrate at a pressure of 5 to 15 MPa.   The method for producing a color filter according to claim 1, wherein an average diameter of the cleaning liquid droplets is 5 to 20 μm.   The method for producing a color filter according to claim 1, wherein the cleaning liquid is pure water.   The manufacturing method of the color filter as described in any one of Claims 1-5 further provided with the process of forming the said photosensitive resin film using a non-spin type slit coater die.   The method for producing a color filter according to claim 1, wherein a length A of each spray pattern in the substrate in a longitudinal direction satisfies a relationship of 50 mm ≦ A ≦ 300 mm. The color filter manufactured by the method as described in any one of Claims 1-7.

Images