JP2007184643A5 - - Google Patents

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Publication number
JP2007184643A5
JP2007184643A5 JP2007085025A JP2007085025A JP2007184643A5 JP 2007184643 A5 JP2007184643 A5 JP 2007184643A5 JP 2007085025 A JP2007085025 A JP 2007085025A JP 2007085025 A JP2007085025 A JP 2007085025A JP 2007184643 A5 JP2007184643 A5 JP 2007184643A5
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JP
Japan
Prior art keywords
optical semiconductor
semiconductor element
light
shielding resin
hemisphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007085025A
Other languages
Japanese (ja)
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JP2007184643A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007085025A priority Critical patent/JP2007184643A/en
Priority claimed from JP2007085025A external-priority patent/JP2007184643A/en
Publication of JP2007184643A publication Critical patent/JP2007184643A/en
Publication of JP2007184643A5 publication Critical patent/JP2007184643A5/ja
Pending legal-status Critical Current

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Claims (4)

光半導体素子と、
前記光半導体素子を覆うように予め成型されて配設された透光性の半球体と、
前記光半導体素子を実装するリードフレームと、
前記リードフレームおよび前記半球体を支持する遮光性樹脂成型体と、
を備え、
前記リードフレームは、前記光半導体素子を主面に実装する第１の部分と、前記遮光性樹脂成型体の内部から前記遮光性樹脂成型体の外側へ延設されるように形成された複数の第２の部分と、を有し、
前記リードフレームの前記第１の部分は、その裏面が前記遮光性樹脂成型体の底部を貫通して下側へ突出するように形成されて第１の放熱領域をなし、前記第２の部分の前記遮光性樹脂成型体から外側の領域は第２の放熱領域をなし、前記第１の部分の前記裏面と、前記第２の部分の外側端部の裏面とはほぼ同じ面に位置する、
光半導体パッケージ。 An optical semiconductor element;
A translucent hemisphere previously molded and disposed to cover the optical semiconductor element;
A lead frame for mounting the optical semiconductor element;
A light-shielding resin molding that supports the lead frame and the hemisphere;
With
The lead frame includes a first portion that mounts the optical semiconductor element on a main surface, and a plurality of lead frames that extend from the inside of the light-shielding resin molding to the outside of the light-shielding resin molding. A second part,
The first portion of the lead frame is formed so that the back surface thereof penetrates the bottom of the light-shielding resin molded body and protrudes downward to form a first heat dissipation region, and the first portion of the second portion The outer region from the light-shielding resin molded body forms a second heat dissipation region, and the back surface of the first portion and the back surface of the outer end portion of the second portion are located on substantially the same surface.
Optical semiconductor package. 前記遮光性樹脂成型体は、前記リードフレームを支持する底部と、前記半導体素子の周囲を囲むように配設された側部とを有し、前記側部における前記光半導体素子を囲む側の上面には前記半球体を支持する段部が設けられていることを特徴とする請求項１に記載の光半導体パッケージ。   The light-shielding resin molded body has a bottom portion for supporting the lead frame and a side portion disposed so as to surround the periphery of the semiconductor element, and an upper surface on the side portion surrounding the optical semiconductor element The optical semiconductor package according to claim 1, further comprising a step portion for supporting the hemisphere. 前記半球体は、前記光半導体素子を上方から覆うように前記段部に固着されていることを特徴とする請求項２に記載の光半導体パッケージ。   The optical semiconductor package according to claim 2, wherein the hemisphere is fixed to the stepped portion so as to cover the optical semiconductor element from above. 前記半球体と前記光半導体素子との間には乾燥窒素（Ｎ２）が充填されていることを特徴とする請求項３に記載の光半導体パッケージ。 The optical semiconductor package according to claim 3, wherein dry nitrogen (N 2 ) is filled between the hemisphere and the optical semiconductor element.
JP2007085025A 2007-03-28 2007-03-28 Optical semiconductor package Pending JP2007184643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007085025A JP2007184643A (en) 2007-03-28 2007-03-28 Optical semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007085025A JP2007184643A (en) 2007-03-28 2007-03-28 Optical semiconductor package

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP36937499A Division JP3964590B2 (en) 1999-12-27 1999-12-27 Optical semiconductor package

Publications (2)

Publication Number Publication Date
JP2007184643A JP2007184643A (en) 2007-07-19
JP2007184643A5 true JP2007184643A5 (en) 2008-01-10

Family

ID=38340374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007085025A Pending JP2007184643A (en) 2007-03-28 2007-03-28 Optical semiconductor package

Country Status (1)

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JP (1) JP2007184643A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5667820B2 (en) * 2010-09-14 2015-02-12 東芝電子エンジニアリング株式会社 Optical semiconductor device
KR101693642B1 (en) 2010-12-21 2017-01-17 삼성전자 주식회사 Manufacturing method of Light emitting device package

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49112163U (en) * 1973-01-23 1974-09-25
JPS58101445A (en) * 1981-12-11 1983-06-16 Mitsubishi Electric Corp Resin-sealed semiconductor device
JPH0773122B2 (en) * 1983-12-27 1995-08-02 株式会社東芝 Sealed semiconductor device
JPH05166979A (en) * 1991-12-16 1993-07-02 Mitsubishi Electric Corp Semiconductor device and manufacture thereof
JPH06290476A (en) * 1993-04-01 1994-10-18 Seiko Epson Corp Optical semiconductor device, semiconductor laser unit and optical head for optical memory
JP2945246B2 (en) * 1993-06-23 1999-09-06 株式会社日立製作所 Optical element module
JP2902919B2 (en) * 1993-11-25 1999-06-07 三洋電機株式会社 Surface mount type semiconductor device
DE19549818B4 (en) * 1995-09-29 2010-03-18 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor device
WO1998020718A1 (en) * 1996-11-06 1998-05-14 Siliconix Incorporated Heat sink-lead frame structure
JPH10233532A (en) * 1997-02-21 1998-09-02 Houshin Kagaku Sangiyoushiyo:Kk Light emitting diode
JP2001518692A (en) * 1997-07-29 2001-10-16 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト Photoelectric element
JP3472450B2 (en) * 1997-09-04 2003-12-02 シャープ株式会社 Light emitting device
JPH11145364A (en) * 1997-11-12 1999-05-28 Denso Corp Resin encapsulating type of semiconductor device, and its manufacture
JP3808627B2 (en) * 1998-05-29 2006-08-16 ローム株式会社 Surface mount semiconductor device
US6335548B1 (en) * 1999-03-15 2002-01-01 Gentex Corporation Semiconductor radiation emitter package

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