JP2007184236A - Substrate with transparent conductive film for laser patterning, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a glass substrate for a flat panel display with a transparent conductive film for laser patterning of which laser etching property becomes excellent, and to provide its manufacturing method. <P>SOLUTION: This is the substrate with the transparent conductive film which is employed in order to form transparent conductive film patterns by pattering the transparent conductive film formed on the glass substrate with a laser beam. A material forming the transparent conductive film contains indium oxide, tin oxide, or zinc oxide as main components, and an absorptivity of the transparent conductive film obtained by the formula (1) in wavelength 1,064 nm is 5% or more and 20% or less. In the formula (1), the absorptivity of transparent conductive film=ä100-(transmittance of glass substrate with transparent conductive film+reflectance of glass substrate with transparent conductive film)}-ä100-(transmittance of glass substrate+reflectance of glass substrate)}. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate with a transparent conductive film that can be used for a front plate of a plasma display panel (hereinafter abbreviated as PDP).

  As a transparent electrode of a flat panel display, a transparent electrode or the like obtained by patterning a transparent conductive film mainly composed of indium oxide formed on a glass substrate by a wet etching method using photolithography has been used. However, with the increase in the size of the substrate, wet patterning by photolithography has been problematic in that it makes it difficult to produce a large mask used for photolithography and increases the cost due to the large number of patterning steps. Therefore, as shown in Patent Documents 1 and 2, a laser patterning method in which a transparent conductive film pattern is directly formed on a substrate with laser light is being used.

JP 2001-52602 A JP 2005-108668 A

  However, the conventionally used transparent conductive film mainly composed of indium oxide film is formed due to the remaining film because the indium oxide film remains when the laser irradiation energy per unit area decreases. There is a problem in that leakage occurs without insulation between the formed conductive film patterns. Conversely, when the laser irradiation energy is increased, there is a problem that the glass substrate itself is easily scratched. In addition, there is a problem that tact-up is difficult and production efficiency is low.

  The present invention has been made in consideration of such a current situation, and an object thereof is to provide a glass substrate with a transparent conductive film for laser patterning that can be easily patterned, a method for manufacturing the same, and a method for patterning the conductive film. .

  In particular, a glass substrate with a transparent conductive film for laser patterning, which has good patternability and stable patternability with respect to laser light having a wavelength of 250 to 1500 nm, particularly 1000 to 1500 nm (and when the wavelength is 1064 nm), is provided. The purpose is to do.

In order to achieve the above object, the present application provides the following inventions.
(1) A substrate with a transparent conductive film used for forming a transparent conductive film pattern by patterning a transparent conductive film formed on a glass substrate with a laser beam,
The material forming the transparent conductive film is mainly composed of indium oxide, tin oxide or zinc oxide,
The board | substrate with a transparent conductive film whose absorptivity of the said transparent conductive film calculated | required by Formula (1) in wavelength 1064nm is 5% or more and 20% or less.
Absorbance of transparent conductive film = {100- (transmittance of glass substrate with transparent conductive film + reflectance of glass substrate with transparent conductive film)}-{100- (transmittance of glass substrate + reflectance of glass substrate)}
(1) Formula (2) The substrate with a transparent conductive film according to (1), wherein the wavelength of the laser beam is 1000 to 1500 nm.

(3) The substrate with a transparent conductive film according to (1) or (2), wherein the specific resistance value of the transparent conductive film is 4 × 10 ⁻³ Ω · cm or less.
(4) The substrate with a transparent conductive film according to (1), (2) or (3), which can be used for a front plate of a plasma display panel.

(5) The substrate temperature during film formation is 220 ° C. to 400 ° C., and the O ₂ concentration in the sputtering gas is 0.5 to 1.5%, according to any one of (1) to (4) The manufacturing method of a board | substrate with a transparent conductive film which forms a transparent conductive film.
(6) A substrate with a transparent conductive film pattern obtained by laser patterning the transparent conductive film according to any one of (1) to (4).
(7) A substrate with a transparent conductive film pattern obtained by laser patterning a transparent conductive film obtained by the method for manufacturing a substrate with a transparent conductive film according to (5).

(8) A front panel of a plasma display panel using the substrate with a transparent conductive film pattern according to (6) or (7).
(9) A plasma display panel using the front plate according to (8).

  According to the present invention, it is possible to obtain a glass substrate with a transparent conductive film for laser patterning, particularly a glass substrate with a transparent conductive film for PDP, which is easy to etch and has a stable laser etching property.

  Moreover, according to the glass substrate with a transparent conductive film for PDP of the present invention, as a result of patterning into a desired shape even if the laser output is low, it is possible to stably insulate. Therefore, a low-power laser can be used, and a wide range of etching can be performed with the same laser power. Therefore, tact-up is possible and production efficiency can be increased. As mentioned above, the said glass substrate with a transparent conductive film is optimal as a board | substrate for front plates for PPD of this invention.

  The substrate used in the present invention is not particularly limited, such as soda lime glass and non-alkali glass, and various glass substrates can be used. In this embodiment, glass for PDP (PD200 manufactured by Asahi Glass) is used.

  The size of the glass substrate is not particularly limited, and is preferably 100 to 3000 mm, particularly 500 to 2500 mm in both length and width. Moreover, it is preferable that the thickness of a glass substrate is 0.3-3 mm, especially 1.5-3 mm.

  The material for forming the transparent conductive film on the glass substrate is a material mainly composed of indium oxide, tin oxide, or zinc oxide. Specifically, indium oxide, tin oxide or zinc oxide is preferably 60% by mass or more, particularly 70% by mass or more, and more preferably 80% by mass or more in the transparent conductive film. In particular, tin oxide, indium oxide doped with tin oxide (hereinafter referred to as ITO), zinc oxide doped with aluminum oxide (AZO), and the like can be given. The transparent conductive film may be a single layer film made of one kind of conductive material, may be a composite layer made of different kinds of transparent conductive material, and is a laminated film having two or more different layers. Also good. The film thickness of the transparent conductive film is preferably 50 to 250 nm from the viewpoint of resistance value, transmittance, and the like.

Among these, the transparent conductive film is preferably a film containing the conductive material as a main component, that is, a film containing 80 to 99% by mass of the conductive material and 1 to 20% by mass of a dopant material. Further, the transparent conductive film is preferably a film containing indium oxide as a main component, and a film made of ITO (hereinafter referred to as ITO film) or a tin oxide film is particularly preferable. The specific resistance value of the transparent conductive film is preferably 4 × 10 ⁻⁴ Ω · cm or less, particularly 3 × 10 ⁻⁴ Ω · cm or less, and more preferably 2.5 × 10 ⁻⁴ Ω · cm or less. In addition, the visible light transmittance of the transparent conductive film is preferably 80% or more in terms of transparency.

It is preferable that the ITO film contains 1 to 20% by mass of tin oxide in a total of 100% by mass of indium oxide and tin oxide because the conductivity can be improved. The thickness of the ITO film is preferably 50 to 250 nm from the viewpoint of resistance value, transmittance, and the like. The specific resistance value of the ITO film is preferably 4 × 10 ⁻⁴ Ω · cm or less.

A tin oxide film containing 85% by mass or more of tin oxide is preferable in that the conductivity can be improved. The thickness of the tin oxide film is preferably 100 to 250 nm from the viewpoint of resistance value, transmittance, and the like. Further, the specific resistance value of the tin oxide film is preferably 5 × 10 ⁻⁴ Ω · cm or less.

  Methods for forming ITO films and tin oxide films include thermal decomposition (method of forming a film by applying a raw material solution followed by heating), chemical vapor deposition (CVD), sputtering, vapor deposition, and ion plating. Among them, the method of forming by an RF (high frequency) or DC (direct current) sputtering method using an ITO target is preferable.

  It is preferable to use an argon-oxygen mixed gas as an atmosphere gas during film formation by sputtering, and to determine the gas ratio between argon and oxygen so that the specific resistance value of the ITO film is minimized. The content of oxygen gas in the atmospheric gas is preferably 0.1 to 5% by volume in terms of specific resistance. Moreover, the glass substrate temperature at the time of film-forming by sputtering method has preferable 100-500 degreeC. This is because when the glass substrate temperature is set to 100 ° C. or higher, the ITO film is less likely to be amorphous, the chemical resistance of the ITO film is improved, and the film forming temperature is set to 500 ° C. or lower to achieve crystallinity. This is because the unevenness of the film surface is difficult to increase.

Examples of the laser that forms a transparent conductive film pattern by irradiating the transparent conductive film with laser light include a CO ₂ laser, a YVO laser, and a Ne-YAG laser. In particular, it is preferable to use a fundamental wave (1064 nm) of a Ne-YAG laser because a high-power and stable laser can be obtained at low cost.

  In the visible light (wavelength 400 to 750 nm) region, the crystallinity of the ITO film, the tin oxide film, and the AZO film improves as the glass substrate temperature during film formation by the sputtering method increases, and as a result, the absorptance is low. Tend to be. That is, conventionally, taking into consideration the absorptance in the visible light region, it has been usual to lower the glass substrate temperature during film formation.

  On the other hand, it was found that the absorptance of the ITO film at a wavelength of 1064 nm tends to increase when the glass substrate temperature during film formation by sputtering is increased and decrease when the glass substrate temperature is decreased. Therefore, it is preferable that the substrate temperature during film formation is high. In particular, in order to set the absorption rate of the ITO film at a wavelength of 1064 nm to 5% or more, it is preferable to set the substrate temperature during film formation to 220 ° C. or more and 400 ° C. or less.

  Here, the absorptance is a value obtained by the following formula (1). The reflectance means the reflectance at 5 ° incidence.

Absorbance of transparent conductive film = {100- (transmittance of glass substrate with transparent conductive film + reflectance of glass substrate with transparent conductive film)}-{100- (transmittance of glass substrate + reflectance of glass substrate)} (1) Formula Each transmittance and reflectance in the formula is measured according to JIS R3106 (1998).

  In the present invention, the absorptivity of the transparent conductive film is 5% or more. It is considered that the laser patterning is facilitated as a result of improving the absorption of the laser by increasing the absorption rate at a certain wavelength of the laser.

However, especially when patterning is performed using the fundamental wave (1064 nm) of a Ne-YAG laser as the laser, the method for increasing the absorptivity of the transparent conductive film described in the present invention is easily understood by those skilled in the art. Absent.
In a transparent conductive film typified by an ITO film, in the visible light (wavelength 400 to 750 nm) region, the higher the glass substrate temperature during film formation by sputtering, the better the crystallinity and the lower the absorptance. In other words, it has been generally considered that the film formation temperature should be lowered in order to increase the absorption rate for the purpose of improving the laser etching property.

  However, as shown in the following examples, it has been found that the absorption rate of the ITO film at a wavelength of 1064 nm tends to increase when the glass substrate temperature at the time of film formation by the sputtering method is increased and decrease when the glass substrate temperature is decreased.

  As described above, the reason why the film forming temperature and the absorptance are completely opposite in visible light (wavelength 400 to 700 nm) and wavelength 1064 nm can be considered as follows.

  In the transparent conductive film, it is conceivable that by raising the film formation temperature, (1) the crystallinity is improved and the absorptance due to defects is lowered, and (2) the carrier density is increased and the absorption by carriers is increased.

  In the transparent conductive film of visible light (wavelength 400 to 700 nm), the absorption by carriers is smaller than the absorption by defects. Therefore, when the film formation temperature is increased, (1) the crystallinity is improved and the effect of reducing or reducing the absorption rate due to defects is greatly affected. To do. It is believed that the absorption rate is reduced.

  On the other hand, since the absorption due to carriers is larger than the absorption due to defects at a wavelength of 1064 nm, the effect of increasing the carrier density and increasing the absorption due to carriers is greater when the film forming temperature is increased. It is considered to be.

  Considering the specific resistance and absorptance conditions, the substrate temperature during film formation is preferably 220 ° C. or more and 500 ° C. or less. However, 400 ° C. or less is more preferable because of difficulty in manufacturing an apparatus that can be used in a high temperature range. More preferably, it is 250-350 degreeC.

Further, when the O ₂ concentration in the atmospheric gas during film formation by sputtering is increased, the absorptance at a wavelength of 1064 nm of the ITO film decreases, and when the O ₂ concentration is decreased, the absorptance at a wavelength of 1064 nm tends to increase. Therefore, a lower O ₂ concentration is preferable. In particular, in order to set the absorption rate of the ITO film at a wavelength of 1064 nm to 5% or more, the O ₂ concentration in the atmosphere is preferably 2.5% by volume or less. On the other hand, if the O ₂ concentration is less than 0.3% by volume, the ITO film becomes deficient in oxygen, and the transparency may deteriorate and the resistance value may deteriorate. Therefore, the O ₂ concentration is preferably 0.3 to 2.5% by volume, particularly 0.5 to 1.5% by volume, and more preferably 0.6 to 1.2% by volume.

Note that the conventional ITO film is usually formed with a high O ₂ concentration in consideration of its transparency and the like. In the present invention, the O ₂ concentration in the atmospheric gas is limited to a lower range in consideration of the absorbability of the ITO film at a wavelength of 1064 nm.

The conditions for both the substrate temperature at the time of film formation and the O ₂ concentration in the atmosphere are greatly affected by the absorption rate of the ITO film. In particular, in order to stably obtain an ITO film having an absorption rate of 5% or more at a wavelength of 1064 nm, the substrate temperature during film formation is 220 ° C. to 400 ° C., and the O ₂ concentration in the sputtering gas is 0.6 to 1. 2% is preferable.

  When an alkali-containing glass substrate is used, alkali ions contained in the glass substrate may diffuse into the ITO film and affect the resistance value of the ITO film. Therefore, it is preferable to form a silicon dioxide film or the like as an alkali barrier layer between the glass substrate and the ITO film. Examples of the method for forming the alkali barrier layer include a thermal decomposition method, a CVD method, a sputtering method, a vapor deposition method, and an ion plating method. The thickness of the alkali barrier film is preferably 10 nm or more from the viewpoint of alkali barrier performance, and preferably 500 nm or less from the viewpoint of cost.

  As described above, a glass substrate with a transparent conductive film for laser patterning having a transparent conductive film that is easy to etch and has stable laser etching properties can be obtained.

Examples of the present invention and comparative examples are shown below.
(Example 1)
First, a 50 mm × 50 mm high strain point glass for PDP (PD200 manufactured by Asahi Glass) is used as a sample substrate. An ITO film was formed on this sample substrate by DC magnetron sputtering so that the film thickness became 130 nm, and a sample substrate with an ITO film was obtained. As the target, an indium oxide target doped with 10% by mass of tin oxide was used. The sample substrate temperature during film formation was 250 ° C., and sputtering was performed in an Ar—O ₂ mixed gas atmosphere. The content of O ₂ was 0.6% by volume.

<Measurement of absorption rate E of ITO film>
According to JIS R3106 (1998), the reflectance and absorptivity of the sample substrate with the ITO film at wavelengths of 532 nm and 1064 nm were measured. In this measurement, Hitachi spectrophotometer U-4000 was used. From the film-forming surface of the substrate on which ITO was formed, transmittance A in equation (1), 5 ° reflectance B when the incident angle was 5 ° Was measured.

  Next, a sample substrate with an ITO film whose transmittance A and 5 ° reflectance B were measured was mixed with an etching solution heated to 47 ° C. (mixture of water 1000 ml, 40 mass% ferric chloride aqueous solution 500 ml, 35 mass% hydrochloric acid 1000 ml). All the ITO films were removed from the glass surface by immersing in the liquid for 3 minutes. Thereafter, the transmittance C of the glass substrate alone from which the films at wavelengths of 532 nm and 1064 nm were removed, and the 5 ° reflectance D when the incident angle was 5 ° were measured.

From these measured values A, B, C, and D, an absorptance E at a wavelength of 1064 nm of the ITO film was calculated using the following equation. The results are shown in Table 1.
Absorbance E = {100− (transmittance A of glass substrate with ITO film + 5 ° reflectivity B of glass substrate with ITO film)} − {100− (transmittance C of glass substrate + 5 ° reflectivity of glass substrate) D)} (1) Formula.

  FIG. 1 is a cross-sectional view illustrating the traveling direction of laser light when measuring transmittance A, 5 ° reflectance B, transmittance C, and 5 ° reflectance D. FIG. In FIG. 1, 1 is a transparent conductive film (ITO film), and 2 is a glass substrate.

<Measurement of resistance value after laser etching and line width of laser etched part>
Patterning was performed by irradiating the surface of the sample substrate with the ITO film with laser light under the same conditions as the ITO film for which the absorption rate E was calculated. Specifically, as shown in FIG. 2, the substrate was transported and patterned so that a linear shape passing through the center of the substrate and parallel to the side could be patterned. The patterning width was targeted at 48 μm. Etching conditions at this time were as follows: laser light was irradiated with a laser light wavelength of 1064 nm, a laser output of 5 W, a laser diameter of 60 μm, and a frequency of 30 kHz, and the substrate conveyance speed was 500 mm / second.

  FIG. 2 is a diagram illustrating a method for measuring the resistance value of a glass substrate with an ITO film after laser etching. As shown in FIG. 2, a tester (PC510: manufactured by Sanwa Denki Keiki Co., Ltd.) is applied to the resistance measurement points 5 at intervals of 10 mm across the laser-etched portion 4 of the glass substrate 3 with ITO film, and after laser etching The resistance value (hereinafter referred to as resistance value after laser etching) and the line width of the laser-etched portion 4 were measured. The results are shown in Table 1.

  The resistance value after laser etching is O.D. L. This means that the resistance value after laser etching is 50 MΩ or more, which is practically at a level where there is no problem as a patterned substrate with a transparent conductive film for PDP.

<Measurement of the line width of the laser-etched part when the line width target is changed>
The discharge electrode width of ITO for PDP is usually about 100 μm in many cases. Then, next, the laser diameter was changed, and the absorptivity of the 1064 nm ITO film and the patterning property when laser patterning was performed with a width of 100 μm were evaluated. Specifically, patterning was performed in the same manner as described above except that the line width target was changed from 48 μm to 100 μm, and the line width of the laser-etched portion 4 was measured. The results are shown in Table 1.

<Measurement of minimum laser density>
The laser output having the lowest power (minimum laser density) was measured such that the resistance after laser etching was changed to 50 MΩ or more by changing the laser output.

  A sample substrate with an ITO film was formed under the same conditions as the ITO film for which the absorption rate E was calculated. Patterning was performed by irradiating the formed ITO film surface with laser light. Specifically, as shown in FIG. 2, the substrate was transported and patterned so that a linear shape passing through the center of the substrate and parallel to the side could be patterned. The patterning width was targeted at 48 μm. Etching conditions at this time were as follows: laser light was irradiated with a laser light wavelength of 1064 nm, a laser output of 5 W, a laser diameter of 60 μm, and a frequency of 30 kHz, and the substrate conveyance speed was 500 mm / second.

  In the patterning, the laser density is changed in five steps of 1.8, 2.4, 2.9, 3.5, and 4.1 J / cm 2 for each laser irradiation. Laser etching was performed at a laser density to prepare a sample. Thereafter, the resistance value after laser etching of each sample was measured, the minimum laser density at which the resistance value after laser etching was 50 MΩ or more was determined, and this was set as the minimum laser density. The results are shown in Table 1. As this value is smaller, a pattern having sufficient insulation can be formed with a laser beam having a smaller energy density.

(Examples 2-4, Comparative Examples 1-5)
Since the absorption rate is affected by the substrate temperature during film formation and the O ₂ concentration in the sputtering atmosphere, by changing these two variables, an 8-pattern sample substrate is prepared, and the resistivity, absorption rate, and laser etching of the ITO film are produced. The post resistance value, laser etched pattern line width and minimum laser density were measured. The results are shown in Table 1 (OL in the table: overload).

From Table 1, when the deposition substrate temperature is the same, the lower the O ₂ concentration in the sputtering gas, the higher the absorption rate at a wavelength of 1064 nm, and the higher the deposition substrate temperature when the O ₂ concentration in the sputtering gas is the same. It can be confirmed that the absorptance at a wavelength of 1064 nm increases.

  In addition, in the sample substrate having an absorptance of 5% or more at a wavelength of 1064 nm, the resistance value after laser etching is overloaded, and it can be confirmed that there is no ITO film residue. On the other hand, in the sample substrate having an absorptance of less than 5% at a wavelength of 1064 nm, an ITO film residue was generated, and the resistance value did not become overloaded after laser etching. Further, as the absorptance at a wavelength of 1064 nm decreases, the remaining ITO film increases and the resistance value after laser etching decreases.

  Further, it can be confirmed that the ITO film having a higher absorption rate at a wavelength of 1064 nm has a larger pattern line width etched by laser.

  As described above, it was confirmed that the ITO film having a higher absorption rate at a wavelength of 1064 nm has a more stable laser etching at a laser beam wavelength of 1064 nm and a low laser output. In particular, it was confirmed that if the absorptance at a wavelength of 1064 nm is 5% or more, it is suitable as a glass substrate with a transparent conductive film for laser patterning.

In Examples 1 to 4, the absorptance at a wavelength of 1064 nm is high and is 5% or more. Therefore, it was confirmed that the ITO film formed under the conditions of Examples 1 to 4 with the substrate temperature during sputtering and the O ₂ concentration in the atmosphere being suitable as a glass substrate with a transparent conductive film for laser patterning.

  Further, Comparative Example 1 and Examples 2 and 4 in which the oxygen partial pressure concentration in the atmosphere is the same 1.2% and the film formation substrate temperature is different are compared. The absorption rate at 532 nm is 0.7% when the film formation substrate temperature is 200 ° C., 0.5% when the film formation substrate temperature is 250 ° C., and 0.3% when the film formation substrate temperature is 320 ° C. The rate is low.

  On the other hand, the absorptivity of the ITO film at 1064 nm is 4.4% at 200 ° C., 5.5% at 250 ° C., and 6.8% at 320 ° C. In contrast to the absorptance at 532 nm, it can be seen that the absorptance at 1064 nm decreases as the deposition substrate temperature increases.

  It is known that a transparent conductive film typified by an ITO film has higher crystallinity and lower absorptance in the visible light (wavelength 400 to 700 nm) region as the glass substrate temperature during film formation by sputtering is increased. It has been. However, it has been found that the absorptance at 1064 nm increases as the glass substrate temperature increases. This is presumed to be due to the effect of carrier density.

In addition, when etching is performed at a laser density of 2.9 J / cm ² , it can be confirmed that the resistance value after laser etching is overloaded and there is no ITO film residue in the sample substrate having an absorptivity at a wavelength of 1064 nm of 5% or more. On the other hand, in the sample substrate having an absorptance of less than 5% at a wavelength of 1064 nm, the ITO film remains, so that the resistance value after laser etching did not become overloaded. Further, as the absorptance at a wavelength of 1064 nm decreases, the remaining ITO film increases and the resistance value after laser etching decreases.

  In addition, it can be confirmed that the ITO film having a higher absorptance at a wavelength of 1064 nm has a larger pattern line width by laser etching. In addition, the minimum laser density shows a smaller value as the absorption rate at a wavelength of 1064 nm is larger. From this, it can be seen that the larger the absorptivity at the wavelength of 1064 nm, the easier the laser patterning is.

As the minimum laser density of the transparent conductive film is smaller, the laser density irradiated by laser patterning can be reduced, and tact-up and cost reduction are possible. In the patterning of the transparent electrode of the front plate for PDP, it is considered desirable that the minimum laser density is 3 J / cm ² or less from the viewpoint of scratching the glass substrate and productivity. From the results shown in Table 1, it can be seen that the absorptance at a wavelength of 1064 nm is preferably 5% or more.

  The glass substrate of the present invention is useful as a glass substrate for FPD such as PDP, LCD, ELD, FED and the like because laser patterning is easy.

The conceptual diagram of the type | formula which calculates | requires the absorptivity E of an ITO film | membrane using the transmittance | permeability A, the 5 degree reflectance B, the transmittance C, and the 5 degree reflectance D. The figure explaining the measurement content after laser etching the sample board | substrate.

Explanation of symbols

1: Transparent conductive film 2: Glass substrate (glass substrate for flat panel display)
3: Glass substrate with ITO film 4: Laser etched part 5: Resistance measurement point A: Transmittance of glass substrate with transparent conductive film B: Reflectance of glass substrate with transparent conductive film C: Transmittance D of glass substrate : Reflectance of glass substrate

Claims (9)

A substrate with a transparent conductive film used for forming a transparent conductive film pattern by patterning a transparent conductive film formed on a glass substrate with laser light,
The material forming the transparent conductive film is mainly composed of indium oxide, tin oxide or zinc oxide,
The board | substrate with a transparent conductive film whose absorptivity of the said transparent conductive film calculated | required by Formula (1) in wavelength 1064nm is 5% or more and 20% or less.
Absorbance of transparent conductive film = {100- (transmittance of glass substrate with transparent conductive film + reflectance of glass substrate with transparent conductive film)}-{100- (transmittance of glass substrate + reflectance of glass substrate)}
(1) Formula   The substrate with a transparent conductive film according to claim 1, wherein the wavelength of the laser light is 1000 to 1500 nm. The substrate with a transparent conductive film according to claim 1, wherein the transparent conductive film has a specific resistance value of 4 × 10 ⁻³ Ω · cm or less.   The substrate with a transparent conductive film according to claim 1, 2 or 3, which can be used for a front plate of a plasma display panel. The transparent conductive film according to any one of claims 1 to 4 is formed by setting the substrate temperature during film formation to 220 ° C to 400 ° C and the O ₂ concentration in the sputtering gas to 0.5 to 1.5%. A method for manufacturing a substrate with a transparent conductive film.   The board | substrate with a transparent conductive film pattern obtained by carrying out laser patterning of the transparent conductive film of any one of Claims 1-4.   The board | substrate with a transparent conductive film pattern obtained by carrying out laser patterning of the transparent conductive film obtained by the manufacturing method of the board | substrate with a transparent conductive film of Claim 5.   The front plate of the plasma display panel using the board | substrate with a transparent conductive film pattern of Claim 6 or 7.   A plasma display panel using the front plate according to claim 8.

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