JP2007180267A5 - - Google Patents
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- Publication number
- JP2007180267A5 JP2007180267A5 JP2005377025A JP2005377025A JP2007180267A5 JP 2007180267 A5 JP2007180267 A5 JP 2007180267A5 JP 2005377025 A JP2005377025 A JP 2005377025A JP 2005377025 A JP2005377025 A JP 2005377025A JP 2007180267 A5 JP2007180267 A5 JP 2007180267A5
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- metal substrate
- wiring
- circuit element
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002184 metal Substances 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005377025A JP2007180267A (ja) | 2005-12-28 | 2005-12-28 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005377025A JP2007180267A (ja) | 2005-12-28 | 2005-12-28 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007180267A JP2007180267A (ja) | 2007-07-12 |
| JP2007180267A5 true JP2007180267A5 (ko) | 2009-02-19 |
Family
ID=38305159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005377025A Withdrawn JP2007180267A (ja) | 2005-12-28 | 2005-12-28 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007180267A (ko) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5445329B2 (ja) * | 2010-05-25 | 2014-03-19 | 株式会社デンソー | 電力半導体装置 |
| WO2016075985A1 (ja) * | 2014-11-13 | 2016-05-19 | 株式会社村田製作所 | パワー半導体のパッケージ素子 |
-
2005
- 2005-12-28 JP JP2005377025A patent/JP2007180267A/ja not_active Withdrawn
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