JP2007177012A - Thermosetting organopolysiloxane composition - Google Patents

Thermosetting organopolysiloxane composition Download PDF

Info

Publication number
JP2007177012A
JP2007177012A JP2005374724A JP2005374724A JP2007177012A JP 2007177012 A JP2007177012 A JP 2007177012A JP 2005374724 A JP2005374724 A JP 2005374724A JP 2005374724 A JP2005374724 A JP 2005374724A JP 2007177012 A JP2007177012 A JP 2007177012A
Authority
JP
Japan
Prior art keywords
group
component
composition
thermosetting
organopolysiloxane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005374724A
Other languages
Japanese (ja)
Other versions
JP4743511B2 (en
Inventor
Nobuyoshi Kameda
宜良 亀田
Tsuneo Kimura
恒雄 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP2005374724A priority Critical patent/JP4743511B2/en
Publication of JP2007177012A publication Critical patent/JP2007177012A/en
Application granted granted Critical
Publication of JP4743511B2 publication Critical patent/JP4743511B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermosetting organopolysiloxane composition excellent in deep-part curability. <P>SOLUTION: The thermosetting organopolysiloxane composition comprises (A) 100 pts.mass of an organopolysiloxane represented by general formula (1) (wherein R<SP>1</SP>denotes a 1-10C substituted or unsubstituted monovalent hydrocarbon group), (B) 0.1-30 pts.mass of a hydrolyzable silane represented by general formula (2) (wherein R<SP>2</SP>denotes a substituted or unsubstituted monovalent hydrocarbon group; R<SP>3</SP>denotes a hydrogen atom or a monovalent hydrocarbon group; and m is an integer of 2-4) or a partial hydrolyzate thereof, and (C) an organic compound having at least one NH<SB>2</SB>group in a molecule and containing the NH<SB>2</SB>group in an amount of 0.001-1 mol per 100 g of the organopolysiloxane, wherein a ketone compound formed by hydrolysis of the hydrolyzable silane or the partial hydrolyzate thereof and the NH<SB>2</SB>group undergo dehydration condensation. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は熱硬化性オルガノポリシロキサン組成物に関する。   The present invention relates to a thermosetting organopolysiloxane composition.

湿気により架橋する縮合硬化型のシリコーンゴムはその取り扱いが容易なことに加え、耐熱性、接着性、電気特性に優れるため、建材用のシーリング材や電気電子分野の接着剤など様々な分野で利用されている。このオルガノポリシロキサン組成物は湿気により架橋するために深部硬化性が悪いという問題があり、この問題を改良するため、架橋剤を極限まで減量して加水分解による架橋速度を向上させた1液タイプの材料や、架橋剤と硬化剤とを別梱包とした2液タイプの材料が知られている。
しかしながら、上記した1液タイプのオルガノポリシロキサン組成物は、単に表面からの硬化速度が早いだけであり、深部硬化には一定の時間が必要である。2液タイプの組成物は、深部硬化性に比較的優れるものの、付加硬化型のオルガノポリシロキサン組成物と比べ、完全硬化に要する時間が長いという欠点がある。更に、2液タイプの組成物の場合、深部まで完全に硬化させるためには、架橋剤と硬化剤の添加量を厳密に規定するか、又は深部硬化剤として水を加えることが必要である。
Condensation-curing silicone rubber that crosslinks with moisture is easy to handle and has excellent heat resistance, adhesion, and electrical properties, so it can be used in various fields such as sealing materials for building materials and adhesives in the electrical and electronic fields. Has been. This organopolysiloxane composition has a problem of poor deep-curability because it is crosslinked by moisture, and in order to improve this problem, the one-pack type in which the crosslinking agent is reduced to the utmost to improve the crosslinking rate by hydrolysis. A two-pack type material in which a cross-linking agent and a curing agent are separately packaged is known.
However, the above-described one-pack type organopolysiloxane composition merely has a high curing rate from the surface, and a certain time is required for deep curing. Although the two-component type composition is relatively excellent in deep part curability, it has a drawback that it takes a long time to complete curing as compared with the addition-curing type organopolysiloxane composition. Furthermore, in the case of a two-component type composition, in order to completely cure to a deep part, it is necessary to strictly define the addition amount of a crosslinking agent and a curing agent, or to add water as a deep part curing agent.

そこで、上記した問題点を解決すべく、本発明者らは、ジオルガノポリシロキサンに対し、C=O基を有する有機化合物とNH2基を有する有機化合物とを含有する室温速硬化性オルガノポリシロキサン組成物を提案した(例えば、特許文献1参照)。この技術は、組成物中のC=O基とNH2基とによるケチミン生成反応から副生する水を利用し、深部硬化性を改良するものである。
又、オルガノポリシロキサン組成物に熱を加えて架橋反応を活性化させ、深部硬化性を改良する熱硬化型組成物が知られている。
Accordingly, in order to solve the above-mentioned problems, the present inventors have developed a room temperature rapid-curing organopolysiloxane containing an organic compound having a C═O group and an organic compound having an NH 2 group with respect to diorganopolysiloxane. A siloxane composition was proposed (see, for example, Patent Document 1). This technique uses water produced as a by-product from a ketimine formation reaction by C═O groups and NH 2 groups in the composition, and improves the deep curability.
In addition, thermosetting compositions are known in which heat is applied to an organopolysiloxane composition to activate a cross-linking reaction, thereby improving deep part curability.

特開平5−279570号公報JP-A-5-279570

しかしながら、上記した特許文献1記載の組成物は室温硬化型であるため、深部硬化性が充分ではない。
一方、1液タイプの熱硬化型組成物の場合、架橋反応に必要となる水が深部で生成しないため、深部硬化性を改良することは困難である。又、2液タイプの熱硬化型組成物は脱アルコールによって硬化するものであるが、加熱するとリバージョンが生じて硬化不良となる問題がある。さらに、2液タイプの熱硬化型組成物において、深部硬化剤として水を加えると、反応前の水が気化して硬化物中に泡が入る問題がある。
なお、付加硬化型のオルガノポリシロキサン組成物の場合、深部硬化性に優れるが、組成物中の硬化触媒が触媒毒を受けるため、周囲の作業環境が限定されるという欠点がある。
従って、本発明の目的は、深部硬化性に優れた熱硬化性オルガノポリシロキサン組成物を提供することにある。
However, since the above-described composition described in Patent Document 1 is a room temperature curable type, the deep curability is not sufficient.
On the other hand, in the case of a one-component thermosetting composition, it is difficult to improve the deep curability because water necessary for the crosslinking reaction does not form in the deep portion. In addition, the two-component type thermosetting composition is cured by dealcoholization, but when heated, there is a problem that reversion occurs to cause curing failure. Furthermore, in a two-component thermosetting composition, when water is added as a deep-part curing agent, there is a problem that water before the reaction is vaporized and bubbles are contained in the cured product.
In addition, in the case of an addition-curing type organopolysiloxane composition, the deep part curability is excellent. However, since the curing catalyst in the composition is subjected to the catalyst poison, there is a disadvantage that the surrounding working environment is limited.
Accordingly, an object of the present invention is to provide a thermosetting organopolysiloxane composition excellent in deep part curability.

本発明は、縮合硬化時に必要となる水を添加するのでなく、以下の(B)成分から生成するケトン化合物と(C)成分との反応により組成物内に水を発生させることにより、表面のみならず内部からも硬化し、深部硬化性を大幅に向上させることができる。又、本発明は、加熱により架橋反応を活性化させる熱硬化型の組成物であるため、付加硬化型の組成物のような触媒の被毒がなく、速硬化性及び深部硬化性を大幅に向上させることができる。   The present invention does not add water required at the time of condensation curing, but generates water in the composition by the reaction of the ketone compound produced from the following component (B) and the component (C), so that only the surface is generated. Not only can it harden from the inside, but the deep curability can be greatly improved. In addition, since the present invention is a thermosetting composition that activates the crosslinking reaction by heating, there is no poisoning of the catalyst as in the addition-curable composition, and rapid curing and deep curing are greatly improved. Can be improved.

すなわち、上記の目的を達成するために、本発明の熱硬化性オルガノポリシロキサン組成物は、(A)下記一般式(1):

Figure 2007177012
(式中、Rは炭素原子数1〜10の置換又は非置換の一価の炭化水素基であり、nは10以上の整数である)で示されるオルガノポリシロキサン100質量部、
(B)下記一般式(2):
Figure 2007177012
(式中、Rは置換又は非置換の一価の炭化水素基であり、Rは水素原子又は一価の炭化水素基であり、mは2〜4の整数である)で示される加水分解性シラン又はその部分加水分解物0.1〜30質量部、
(C)一分子中に少なくとも1個のNH基を有し、前記オルガノポリシロキサン100g当り、該NH基を0.001〜1mol含有する有機化合物、
を含み、前記加水分解性シラン又はその部分加水分解物の加水分解により生成するケトン化合物と前記NH基とが脱水縮合反応することを特徴とする。 That is, in order to achieve the above object, the thermosetting organopolysiloxane composition of the present invention comprises (A) the following general formula (1):
Figure 2007177012
(Wherein R 1 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 10 or more), 100 parts by mass of an organopolysiloxane,
(B) The following general formula (2):
Figure 2007177012
(Wherein R 2 is a substituted or unsubstituted monovalent hydrocarbon group, R 3 is a hydrogen atom or a monovalent hydrocarbon group, and m is an integer of 2 to 4). 0.1-30 parts by mass of degradable silane or a partial hydrolyzate thereof,
(C) an organic compound having at least one NH 2 group in one molecule and containing 0.001 to 1 mol of the NH 2 group per 100 g of the organopolysiloxane;
And a ketone compound produced by hydrolysis of the hydrolyzable silane or a partial hydrolyzate thereof and the NH 2 group undergo a dehydration condensation reaction.

本発明において、さらに、(D)有機錫系触媒0.001〜20質量部を含むことが好ましく、(E)一分子中に少なくとも1個のC=O基を有し、前記オルガノポリシロキサン100g当り、該C=O基を0.001〜1mol含有する有機化合物を含むことが好ましい。
本発明において、熱硬化温度が50〜150℃であることが好ましく、前記(A)〜(C)成分の沸点が150℃以上であることが好ましい。
In the present invention, (D) preferably contains 0.001 to 20 parts by mass of an organotin catalyst, (E) has at least one C═O group in one molecule, and 100 g of the organopolysiloxane. It is preferable to contain an organic compound containing 0.001 to 1 mol of the C═O group.
In this invention, it is preferable that thermosetting temperature is 50-150 degreeC, and it is preferable that the boiling points of the said (A)-(C) component are 150 degreeC or more.

本発明によれば、深部硬化性に優れた熱硬化性オルガノポリシロキサン組成物が得られる。   According to the present invention, a thermosetting organopolysiloxane composition excellent in deep part curability can be obtained.

以下、本発明の実施形態に係る熱硬化性オルガノポリシロキサン組成物について説明する。熱硬化性オルガノポリシロキサン組成物は、以下の(A)〜(C)成分を必須として含む。
このうち、(A)成分は縮合硬化型のオルガノポリシロキサン組成物に用いる基油である。(B)成分は加水分解によりケトンを発生し、(C)成分とケチミン反応する。そのため、上記特許文献1記載の組成物のようにC=O化合物を添加する必要がなく、又、加熱によりケチミン反応が効果的に進行するので、加熱下での深部硬化性に優れる。(C)成分は組成物内に水を生成させる。
Hereinafter, the thermosetting organopolysiloxane composition according to the embodiment of the present invention will be described. The thermosetting organopolysiloxane composition contains the following components (A) to (C) as essential components.
Among these, (A) component is a base oil used for a condensation-curable organopolysiloxane composition. Component (B) generates a ketone by hydrolysis and reacts with component (C) as a ketimine. Therefore, it is not necessary to add a C═O compound as in the composition described in Patent Document 1, and since the ketimine reaction effectively proceeds by heating, the deep curability under heating is excellent. Component (C) generates water in the composition.

[(A)成分]
(A)成分は、下記一般式(1)

Figure 2007177012
で示されるオルガノポリシロキサン100質量部からなる。
式1中、Rは炭素原子数1〜10の置換又は非置換の一価の炭化水素基であり、nは10以上の整数である。Rとしては、例えばメチル基、エチル基、プロピル基などのアルキル基;シクロヘキシル基などのシクロアルキル基;ビニル基、アリル基などのアルケニル基;フェニル基、トリル基などのアリール基;およびこれらの基の水素結合が部分的にハロゲン原子などで置換された基(例えば3,3,3-トリフルオロプロピル基)等であげられる。これらのうち、特にメチル基が好ましい。
式1中の複数個のRはそれぞれ同一の基であっても異種の基であってもよい。
上記オルガノポリシロキサンの25℃における粘度が25〜1,00,000mPa・s、好ましくは100〜200,000mPa・sであることが好ましい。上記粘度が25mPa・s未満であると、諸特性を満たすゴム硬化物を形成することが困難な場合がある。又、上記粘度が1,00,000mPa・sを超えると、作業性が低下する場合がある。なお、上記粘度は、JIS−K−6249(液状未硬化シリコーンゴムの項目)に従って測定することができる。 [(A) component]
The component (A) is represented by the following general formula (1)
Figure 2007177012
It consists of 100 mass parts of organopolysiloxane shown by these.
In Formula 1, R 1 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 10 or more. R 1 includes, for example, an alkyl group such as a methyl group, an ethyl group, and a propyl group; a cycloalkyl group such as a cyclohexyl group; an alkenyl group such as a vinyl group and an allyl group; an aryl group such as a phenyl group and a tolyl group; Examples thereof include a group in which the hydrogen bond of the group is partially substituted with a halogen atom (for example, 3,3,3-trifluoropropyl group). Of these, a methyl group is particularly preferable.
May be a plurality of R 1 are heterogeneous group each be the same group in Formula 1.
The organopolysiloxane has a viscosity at 25 ° C. of 25 to 1,000,000 mPa · s, preferably 100 to 200,000 mPa · s. If the viscosity is less than 25 mPa · s, it may be difficult to form a cured rubber satisfying various properties. On the other hand, when the viscosity exceeds 1,000,000 mPa · s, workability may be deteriorated. The viscosity can be measured according to JIS-K-6249 (item of liquid uncured silicone rubber).

[(B)成分]
(B)成分は、下記一般式(2)

Figure 2007177012
で示される加水分解性シラン又はその部分加水分解物0.1〜30質量部からなる。(B)成分は、(A)成分の架橋剤として作用する。又、(B)成分は、例えば大気中の水分により加水分解してケトン化合物を生成し、後述する(C)成分と反応して組成物中に水を発生させる。発生した水は、(B)成分による架橋反応を加熱下で促進させ、深部硬化性や速硬化性を向上させる。この場合、(B)成分によって架橋し、組成物中には(B)成分からケトンを放出した化合物が残る。
式2中、Rは置換又は非置換の一価の炭化水素基であり、Rは水素原子又は一価の炭化水素基である。 [(B) component]
The component (B) is represented by the following general formula (2)
Figure 2007177012
It consists of 0.1-30 mass parts of hydrolyzable silane or its partial hydrolyzate shown by these. The component (B) acts as a crosslinking agent for the component (A). Moreover, (B) component hydrolyzes with the water | moisture content in air | atmosphere, for example, produces | generates a ketone compound, reacts with the (C) component mentioned later, and generates water in a composition. The generated water promotes the crosslinking reaction by the component (B) under heating, and improves the deep curability and fast curability. In this case, the compound which cross-linked by the (B) component and released the ketone from the (B) component remains in the composition.
In Formula 2, R 2 is a substituted or unsubstituted monovalent hydrocarbon group, and R 3 is a hydrogen atom or a monovalent hydrocarbon group.

は、例えばメチル基、エチル基、プロピル基、ブチル基、ペンチル基等のアルキル基;シクロペンチル基、シクロヘキシル基等のシクロアルキル基;ビニル基、アリル基、5−ヘキセニル基、9−デセニル基等のアルケニル基;フェニル基、トリル基等のアリール基;ベンジル基(フェニルメチル基)、フェニルエチル基等のアラルキル基;これらの基の炭素原子に結合した水素原子の一部又は全部がハロゲン原子で置換された基が挙げられる。このハロゲン置換基としては、3,3,3−トリフルオロプロピル基、ヘプタデカフルオロプロピル基、クロロフェニル基等、ハロゲン化炭化水素基を置換した一価炭化水素基が例示される。Rは、特に好ましくはメチル基、エチル基、プロピル基、ビニル基、フェニル基、3,3,3−トリフルオロプロピル基である。 R 2 is, for example, an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, or a pentyl group; a cycloalkyl group such as a cyclopentyl group or a cyclohexyl group; a vinyl group, an allyl group, a 5-hexenyl group, or a 9-decenyl group. Alkenyl groups such as phenyl groups, tolyl groups, etc .; Aralkyl groups such as benzyl groups (phenylmethyl groups) and phenylethyl groups; some or all of the hydrogen atoms bonded to carbon atoms of these groups are halogen atoms And a group substituted with. Examples of the halogen substituent include monovalent hydrocarbon groups substituted with halogenated hydrocarbon groups such as 3,3,3-trifluoropropyl group, heptadecafluoropropyl group, and chlorophenyl group. R 2 is particularly preferably a methyl group, an ethyl group, a propyl group, a vinyl group, a phenyl group, or a 3,3,3-trifluoropropyl group.

は、例えば例えばメチル基、エチル基、プロピル基などのアルキル基;シクロヘキシル基などのシクロアルキル基;ビニル基、アリル基などのアルケニル基;フェニル基、トリル基などのアリール基;およびこれらの基の水素結合が部分的にハロゲン原子などで置換された基が挙げられる。このハロゲン置換基としては、3,3,3-トリフルオロプロピル基が例示される。Rは、特に好ましくは水素原子、メチル基である。
式2中の複数個のRはそれぞれ同一の基であっても異種の基であってもよい。
R 3 represents, for example, an alkyl group such as a methyl group, an ethyl group or a propyl group; a cycloalkyl group such as a cyclohexyl group; an alkenyl group such as a vinyl group or an allyl group; an aryl group such as a phenyl group or a tolyl group; And a group in which the hydrogen bond of the group is partially substituted with a halogen atom or the like. Examples of the halogen substituent include a 3,3,3-trifluoropropyl group. R 3 is particularly preferably a hydrogen atom or a methyl group.
A plurality of R 3 in Formula 2 may be the same group or different groups.

式2中のmは2〜4の整数であり、好ましくは3〜4の整数である。   M in Formula 2 is an integer of 2 to 4, preferably an integer of 3 to 4.

上記加水分解性シラン又はその部分加水分解物の具体例としては、メチルトリイソプロペノキシシラン、エチルトリイソプロペノキシシラン、ビニルトリイソプロペノキシシラン、フェニルトリイソプロペノキシシラン、テトライソプロペノキシシラン等が例示されるが、これらに限定されるものではない。(B)成分として、これらの化合物を1種単独で用いてもよく、2種以上を併用してもよい。
(B)成分の配合量は、(A)成分100質量部当たり0.1〜30質量部、好ましくは0.5〜20質量部である。(B)成分の配合量が0.1質量部未満であると組成物の調製が困難であり、30質量部を超えると得られた硬化物が目的とする物性(弾性)を示さなくなる(硬くなりすぎる)。
Specific examples of the hydrolyzable silane or a partial hydrolyzate thereof include methyltriisopropenoxysilane, ethyltriisopropenoxysilane, vinyltriisopropenoxysilane, phenyltriisopropenoxysilane, and tetraisopropenoxysilane. However, the present invention is not limited to these. (B) As a component, these compounds may be used individually by 1 type, and may use 2 or more types together.
(B) The compounding quantity of a component is 0.1-30 mass parts per 100 mass parts of (A) component, Preferably it is 0.5-20 mass parts. When the blending amount of the component (B) is less than 0.1 parts by mass, it is difficult to prepare the composition, and when it exceeds 30 parts by mass, the obtained cured product does not exhibit the desired physical properties (elasticity) (hard) Too much).

[(C)成分]
(C)成分は、一分子中に少なくとも1個のアミノ基(NH2基)を有し、前記オルガノポリシロキサン100g当り、該NH基を0.001〜1mol含有する有機化合物からなる。
(C)成分は、(B)成分の加水分解によるケトン化合物と、下記式(3)
(RC=O + HNR’ → RC=NR’ + HO (3)
(式中、Rは式(2)と同一の基、R’は所定の有機基である)の脱水縮合反応を行う。
この反応により、架橋反応に必要となる水が組成物中に発生する。
[Component (C)]
The component (C) comprises an organic compound having at least one amino group (NH 2 group) in one molecule and containing 0.001 to 1 mol of the NH 2 group per 100 g of the organopolysiloxane.
The component (C) includes a ketone compound obtained by hydrolysis of the component (B) and the following formula (3):
(R 3 ) 2 C═O + H 2 NR ′ → R 2 C═NR ′ + H 2 O (3)
(Wherein R 3 is the same group as in formula (2), and R ′ is a predetermined organic group).
By this reaction, water necessary for the crosslinking reaction is generated in the composition.

(C)成分として用いられるアミノ基含有有機化合物は、1分子中に少なくとも1個の反応性のアミノ基を有するものであれば、任意のものを使用することができる。具体的な有機化合物としては、メチルアミン、エチルアミン、ブチルアミン、エチレンジアミン、アニリン等のアミン類;γ−アミノプロピルトリエトキシシラン等のNH2基を有するシランカップリング剤;NH2基を有するポリマー、オリゴマーなどが例示され、これらの1種を単独で又は2種以上を組み合わせて使用することができる。特に1級アミン化合物、及びNH2基を有するシランカップリング剤が好ましい。
又、上記ケトン化合物との反応時における立体障害が少ないという点から、上記有機化合物として、アミノ基のα位の炭素原子が1級、2級、又は芳香族環の一部であるものを使用することが好ましい。このα位の炭素原子が、通常の3級の炭素原子である場合には、カルボニル基との反応性に劣り、所望の効果が得られない場合がある。
上記(C)成分の配合量は、そのNH基量が(A)成分100g当たり0.001〜1molとする必要があり、好ましくは0.01〜0.1molである。(C)成分の配合量が0.01mol未満であると深部硬化性が充分でなく、1molを超えると、得られた弾性体硬化物が目的とする物性を示さなくなる(硬くなりすぎる)。
As the (C) component, any amino group-containing organic compound may be used as long as it has at least one reactive amino group in one molecule. Specific organic compounds include amines such as methylamine, ethylamine, butylamine, ethylenediamine, and aniline; silane coupling agents having NH 2 groups such as γ-aminopropyltriethoxysilane; polymers and oligomers having NH 2 groups Etc., and one of these can be used alone or in combination of two or more. In particular, a primary amine compound and a silane coupling agent having an NH 2 group are preferable.
In addition, from the viewpoint that there is little steric hindrance during the reaction with the ketone compound, the organic compound in which the α-position carbon atom of the amino group is primary, secondary, or part of an aromatic ring is used. It is preferable to do. When the α-position carbon atom is a normal tertiary carbon atom, the reactivity with the carbonyl group is poor and the desired effect may not be obtained.
The blend quantity of the component (C), it is necessary that NH 2 groups amount to (A) per component 100 g 0.001 to 1 mol, preferably 0.01 to 0.1 mol. When the blending amount of the component (C) is less than 0.01 mol, the deep part curability is not sufficient, and when it exceeds 1 mol, the obtained elastic cured product does not exhibit the desired physical properties (is too hard).

[その他の成分]
本発明の熱硬化性オルガノポリシロキサン組成物は、上記(A)〜(C)成分に加え、加熱下での速硬化性及び深部硬化性が阻害されない限り、種々の配合剤を添加することが可能である。ここで、上記式(3)の反応を阻害しない範囲で、任意成分である各種配合剤を選択して使用することが必要である。
このような配合剤としては、例えばオクタノンやシクロヘキサノン等のC=O基を有する有機化合物(以下、(E)成分とする)、有機錫エステル、有機錫キレート錯体等の有機錫系触媒(以下、(D)成分とする)、有機チタン酸エステル、有機チタンキレート錯体等の有機チタン系触媒、テトラメチルグアニジルプロピルトリメトキシシラン、テトラメチルグアニジルプロピルトリストリメチルシロキシシラン等の縮合触媒;煙霧質シリカ、沈降性シリカ、石英粉末、炭素粉末、タルク、ベントナイト、炭酸マグネシウム等の充填剤;ガラス繊維、炭素繊維及び有機繊維等の繊維質充填剤;顔料、染料等の着色剤;ベンガラ及び酸化セリウム等の耐熱性向上剤;耐寒性向上剤;防錆剤;γ−グリシドキシプロピルトリメトキシシラン等の接着性向上剤;トリオルガノシロキシ単位及びSiO2単位よりなる網状ポリシロキサン等の液状補強剤などが挙げられ、これらを必要に応じて常用量添加することが可能である。
[Other ingredients]
In addition to the components (A) to (C), the thermosetting organopolysiloxane composition of the present invention may be added with various compounding agents as long as the rapid curability and deep curability under heating are not inhibited. Is possible. Here, it is necessary to select and use various compounding agents that are optional components as long as the reaction of the above formula (3) is not inhibited.
As such a compounding agent, for example, an organic compound having a C═O group such as octanone or cyclohexanone (hereinafter referred to as component (E)), an organic tin ester, an organic tin chelate complex or the like (hereinafter referred to as “organic tin catalyst”) (D) component), organic titanium catalysts such as organic titanate esters and organic titanium chelate complexes, condensation catalysts such as tetramethylguanidylpropyltrimethoxysilane, tetramethylguanidylpropyltristrimethylsiloxysilane; Silica, precipitated silica, quartz powder, carbon powder, talc, bentonite, magnesium carbonate and other fillers; glass fiber, carbon fiber and organic fiber and other fillers; pigments, dyes and other colorants; bengara and oxidation Heat resistance improvers such as cerium; cold resistance improvers; rust preventives; γ-glycidoxypropyltrimethoxysilane, etc. Wear improvers; and liquid reinforcing agents reticulated polysiloxane consisting triorganosiloxy units and SiO 2 units and the like, it is possible to add conventional amounts in accordance with these demands.

[組成物の形態]
本発明の熱硬化性オルガノポリシロキサン組成物は、使用時に(A)〜(C)成分が反応することによって硬化する。従って、上記組成物は使用前、(A)〜(C)成分が未反応の状態でそれぞれ存在するような形態とする必要がある。
例えば、本発明の組成物として、(A)成分と(B)成分をX剤とし、(A)成分と(C)成分をY剤とした2液梱包の形態とすることができ、使用時にX剤:Y剤=1:1の割合で混合することで取り扱い性が容易となる。又、(A)成分と(C)成分をX剤とし、(A)成分と(B)成分をY剤とした2液梱包の形態としてもよい。
又、1液タイプの形態として、上記(A)〜(C)成分、及び必要に応じて上記配合剤をさらに混合したものを、乾燥(無水)雰囲気中で均一に混合し、水分が混入しないように梱包することもできる。この場合、梱包物の保存性を確保するため、C成分をカプセル化して使用前の硬化を防止することができる。又、熱硬化時の熱によって破壊されるマイクロカプセルに(C)成分を収容してもよい。
[Form of composition]
The thermosetting organopolysiloxane composition of the present invention is cured by the reaction of the components (A) to (C) during use. Therefore, before use, the composition must be in such a form that the components (A) to (C) are present in an unreacted state.
For example, the composition of the present invention can be in the form of a two-pack package in which the component (A) and the component (B) are the X agent and the component (A) and the component (C) are the Y agent. X agent: Y agent = 1: The handling property becomes easy by mixing in the ratio of 1: 1. Moreover, it is good also as a form of 2 liquid packaging which made (A) component and (C) component X agent, and made (A) component and (B) component Y agent.
In addition, as a one-pack type form, the above components (A) to (C) and, if necessary, further mixed with the above compounding ingredients are mixed uniformly in a dry (anhydrous) atmosphere, and moisture does not enter It can also be packed. In this case, in order to ensure the preservability of the package, the C component can be encapsulated to prevent curing before use. Moreover, you may accommodate (C) component in the microcapsule destroyed by the heat | fever at the time of thermosetting.

本発明の熱硬化性オルガノポリシロキサン組成物の熱硬化温度が50〜150℃であることが好ましく、70〜120℃であることがより好ましい。熱硬化温度を50℃未満とすると、上記(B)成分による架橋反応が充分でなく、150℃を超えると、各成分が揮発する恐れがある。加熱時間は、工程により調整が可能である。
又、(A)〜(C)成分の沸点がそれぞれ150℃以上であることが好ましい。このようにすると、各成分が揮発し難いので、硬化温度を高くして硬化をさらに促進することができる。
It is preferable that the thermosetting temperature of the thermosetting organopolysiloxane composition of this invention is 50-150 degreeC, and it is more preferable that it is 70-120 degreeC. If the thermosetting temperature is less than 50 ° C, the crosslinking reaction by the component (B) is not sufficient, and if it exceeds 150 ° C, each component may volatilize. The heating time can be adjusted depending on the process.
Moreover, it is preferable that the boiling points of the components (A) to (C) are each 150 ° C. or higher. If it does in this way, since each component does not volatilize easily, hardening temperature can be raised and hardening can be accelerated | stimulated further.

以上述べた本発明の熱硬化性オルガノポリシロキサン組成物は、深部硬化性を有し、工程の合理化要求の高い電気電子用シーリング剤、自動車用オイルシール、接着剤、ポッティング材などに好適に使用できる。   The thermosetting organopolysiloxane composition of the present invention described above is suitable for use in electrical and electronic sealants, automobile oil seals, adhesives, potting materials, etc., which have deep-part curability and high process rationalization requirements. it can.

<実施例>
以下に本発明を実施例を挙げて説明するが、本発明はこれらの例に限定されるものではない。又、実施例において示す「部」及び「%」は特に明示しない限り、質量部及び質量%を示す。
<Example>
EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Further, “parts” and “%” shown in the examples represent parts by mass and mass% unless otherwise specified.

(A)成分として25℃における粘度が5,000mPa・sのポリジメチルシロキサン(式1のR1=メチル基、n=400であるもの)100gと、(B)成分としてビニルトリイソプロペノキシシシラン6.0gと、(C)成分としてγ−アミノプロピルトリエトキシシラン2.21g(0.01モル)と、配合剤(縮合触媒)としてテトラメチルグアニジルプロピルトリメトキシシラン0.5gと、煙霧質シリカ(フィラー)10gを無水の状態で混合して硬化性シリコーンゴム組成物を調製した。
(1)得られた組成物を用いて厚さ2mmのシートを作成し、硬化条件として120℃で1時間放置してゴム弾性体とし、JIS−K−6249(硬化シリコーンゴムの対象項目)に従ってゴム物性(硬さ、(切断時)伸び、引張り強さ)を測定した。
(2)また、上記組成物を直径20mm、深さ15mmのガラス円筒管に注入し、(1)と同一の硬化条件(120℃で1時間)で硬化を行った。硬化後にガラス管を破壊して硬化物を取り出し、以下の基準で深部硬化性を評価した。
○:硬化物の深部が充分硬化している
△:硬化物の表面のみ硬化している
×:組成物が未硬化である
100 g of polydimethylsiloxane (R1 = methyl group, n = 400 in formula 1) having a viscosity of 5,000 mPa · s at 25 ° C. as component (A) and vinyltriisopropenoxy silane 6 as component (B) 0.0 g, 2.21 g (0.01 mol) of γ-aminopropyltriethoxysilane as component (C), 0.5 g of tetramethylguanidylpropyltrimethoxysilane as a compounding agent (condensation catalyst), and fumes A curable silicone rubber composition was prepared by mixing 10 g of silica (filler) in an anhydrous state.
(1) A sheet having a thickness of 2 mm is prepared using the obtained composition, and left as a curing condition at 120 ° C. for 1 hour to form a rubber elastic body, according to JIS-K-6249 (target item of cured silicone rubber). Rubber physical properties (hardness, (when cut), elongation, tensile strength) were measured.
(2) Moreover, the said composition was inject | poured into the glass cylindrical tube of diameter 20mm and depth 15mm, and it hardened | cured on the same hardening conditions (120 degreeC for 1 hour) as (1). After curing, the glass tube was broken to take out the cured product, and the deep curability was evaluated according to the following criteria.
○: The deep part of the cured product is sufficiently cured Δ: Only the surface of the cured product is cured ×: The composition is uncured

(A)成分として25℃における粘度が5,000mPa・sのポリジメチルシロキサン(式1のR1=メチル基、n=400であるもの)100gと、(B)成分としてビニルトリイソプロペノキシシシラン6.0gと、(C)成分としてγ−アミノプロピルトリエトキシシラン2.21g(0.01モル)と、配合剤(縮合触媒)としてテトラメチルグアニジルプロピルトリメトキシシラン0.5gと、配合剤(有機錫系触媒、(D)成分)としてジオクチル錫ジラウレート0.05gと、煙霧質シリカ(フィラー)10gを無水の状態で混合して硬化性シリコーンゴム組成物を調製した。得られた組成物について、硬化条件をそれぞれ50℃で1時間としたこと以外は実施例1とまったく同様にしてゴム物性、深部硬化性を調べた。   100 g of polydimethylsiloxane (R1 = methyl group, n = 400 in formula 1) having a viscosity of 5,000 mPa · s at 25 ° C. as component (A) and vinyltriisopropenoxy silane 6 as component (B) 0.0 g, 2.21 g (0.01 mol) of γ-aminopropyltriethoxysilane as component (C), 0.5 g of tetramethylguanidylpropyltrimethoxysilane as compounding agent (condensation catalyst), and compounding agent A curable silicone rubber composition was prepared by mixing 0.05 g of dioctyltin dilaurate as an (organic tin-based catalyst, component (D)) and 10 g of fumed silica (filler) in an anhydrous state. About the obtained composition, rubber | gum physical property and deep part sclerosis | hardenability were investigated like Example 1 except having made hardening conditions into 1 hour at 50 degreeC, respectively.

(A)成分として25℃における粘度が5,000mPa・sのポリジメチルシロキサン(式1のR1=メチル基、n=400であるもの)100gと、(B)成分としてフェニルトリイソプロペノキシシシラン7.0gと、配合剤(カルボニル基を有する有機化合物、(E)成分)シクロヘキサノン0.98g(0.01モル)と、(C)成分としてγ−アミノプロピルトリエトキシシラン2.21g(0.01モル)と、配合剤(縮合触媒)としてテトラメチルグアニジルプロピルトリメトキシシラン0.5gと、煙霧質シリカ(フィラー)10gを無水の状態で混合して硬化性シリコーンゴム組成物を調製した。得られた組成物について、実施例1とまったく同様にして(硬化条件もそれぞれ実施例1と同一)ゴム物性、深部硬化性を調べた。   100 g of polydimethylsiloxane (R1 = methyl group, n = 400 in Formula 1) having a viscosity of 5000 mPa · s at 25 ° C. as component (A), and phenyltriisopropenoxy silane 7 as component (B) 0.0 g, compounding agent (organic compound having a carbonyl group, component (E)) 0.98 g (0.01 mol) of cyclohexanone, and 2.21 g of γ-aminopropyltriethoxysilane (0.01) as component (C) Mol) and 0.5 g of tetramethylguanidylpropyltrimethoxysilane as a compounding agent (condensation catalyst) and 10 g of fumed silica (filler) were mixed in an anhydrous state to prepare a curable silicone rubber composition. The obtained composition was examined in the same manner as in Example 1 (the curing conditions were the same as in Example 1), and the rubber physical properties and the deep curability were examined.

実施例1と同一の組成物を用いてゴム弾性体を作成する際、硬化条件をそれぞれ70℃で1時間としたこと以外は実施例1と全く同様にしてゴム物性と深部硬化性を調べた。   When a rubber elastic body was prepared using the same composition as in Example 1, the rubber physical properties and the deep curability were examined in exactly the same manner as in Example 1 except that the curing conditions were each set at 70 ° C. for 1 hour. .

実施例1と同一の組成物を用いてゴム弾性体を作成する際、硬化条件をそれぞれ150℃で1時間としたこと以外は実施例1と全く同様にしてゴム物性と深部硬化性を調べた。   When a rubber elastic body was produced using the same composition as in Example 1, the rubber physical properties and deep part curability were examined in exactly the same manner as in Example 1 except that the curing conditions were set at 150 ° C. for 1 hour. .

実施例1と同一の組成物を用いてゴム弾性体を作成する際、硬化条件をそれぞれ50℃で1時間としたこと以外は実施例1と全く同様にしてゴム物性と深部硬化性を調べた。   When a rubber elastic body was prepared using the same composition as in Example 1, the rubber physical properties and the deep curability were examined in exactly the same manner as in Example 1 except that the curing conditions were set at 50 ° C. for 1 hour. .

<比較例1>
(A)成分として25℃における粘度が5,000mPa・sのポリジメチルシロキサン(式1のR1=メチル基、n=400であるもの)100gと、ビニルトリメチルエチルケトオキシムシラン6gと、(C)成分としてγ−アミノプロピルトリエトキシシラン2.21g(0.01モル)と、配合剤(有機錫系触媒、(D)成分)としてジオクチル錫ジラウレート0.1gと、煙霧質シリカ(フィラー)煙霧質シリカ10gとを無水の状態で混合して硬化性シリコーンゴム組成物を調製した。得られた組成物について、実施例1とまったく同様にしてゴム物性、深部硬化性を調べた。
<Comparative Example 1>
(A) 100 g of polydimethylsiloxane having a viscosity at 25 ° C. of 5,000 mPa · s (R1 = methyl group of formula 1, n = 400), 6 g of vinyltrimethylethylketoxime silane, (C) component Γ-aminopropyltriethoxysilane (2.21 g, 0.01 mol), dioctyltin dilaurate (0.1 g) as a compounding agent (organotin-based catalyst, component (D)), and fumed silica (filler) fumed silica A curable silicone rubber composition was prepared by mixing 10 g in an anhydrous state. About the obtained composition, the rubber physical property and the deep part curability were examined in the same manner as in Example 1.

<比較例2>
(A)成分として25℃における粘度が5,000mPa・sのポリジメチルシロキサン(式1のR1=メチル基、n=400であるもの)100gと、(B)成分としてビニルトリイソプロペノキシシシラン6.0gと、配合剤(縮合触媒)としてテトラメチルグアニジルプロピルトリメトキシシラン0.5gと、煙霧質シリカ(フィラー)10gを無水の状態で混合して硬化性シリコーンゴム組成物を調製した。得られた組成物について、実施例1とまったく同様にしてゴム物性、深部硬化性を調べた。
<Comparative Example 2>
100 g of polydimethylsiloxane (R1 = methyl group, n = 400 in formula 1) having a viscosity of 5,000 mPa · s at 25 ° C. as component (A) and vinyltriisopropenoxy silane 6 as component (B) 0.0 g, 0.5 g of tetramethylguanidylpropyltrimethoxysilane as a compounding agent (condensation catalyst), and 10 g of fumed silica (filler) were mixed in an anhydrous state to prepare a curable silicone rubber composition. About the obtained composition, the rubber physical property and the deep part curability were examined in the same manner as in Example 1.

<比較例3>
(A)成分として25℃における粘度が5,000mPa・sのポリジメチルシロキサン(式1のR1=メチル基、n=400であるもの)100gと、ビニルトリメトキシシラン3gと、(C)成分としてγ−アミノプロピルトリエトキシシラン2.21g(0.01モル)と、配合剤(有機錫系触媒、(D)成分)としてジオクチル錫ジラウレート0.1gと、煙霧質シリカ(フィラー)10gを無水の状態で混合して硬化性シリコーンゴム組成物を調製した。得られた組成物について、実施例1とまったく同様にしてゴム物性、深部硬化性を調べた。
<Comparative Example 3>
(A) 100 g of polydimethylsiloxane having a viscosity of 5,000 mPa · s at 25 ° C. (R1 = methyl group, n = 400 in formula 1), 3 g of vinyltrimethoxysilane, and (C) Anhydrous 2.21 g (0.01 mol) of γ-aminopropyltriethoxysilane, 0.1 g of dioctyltin dilaurate as a compounding agent (organotin-based catalyst, component (D)), and 10 g of fumed silica (filler) A curable silicone rubber composition was prepared by mixing in the state. About the obtained composition, the rubber physical property and the deep part curability were examined in the same manner as in Example 1.

<比較例4>
比較例1で得られた組成物を用いてゴム弾性体を作成する際、硬化条件をそれぞれ150℃で1時間としたこと以外は比較例1と全く同様にしてゴム物性と深部硬化性を調べた。
<Comparative Example 4>
When producing a rubber elastic body using the composition obtained in Comparative Example 1, the rubber physical properties and the deep curability were examined in exactly the same manner as in Comparative Example 1 except that the curing conditions were set to 1 hour at 150 ° C., respectively. It was.

得られた結果を表1に示す。   The obtained results are shown in Table 1.

Figure 2007177012
Figure 2007177012

表1から明らかなように、各実施例の場合、深部硬化性が顕著に向上すると共に、所特性を満たすゴム硬化物が得られた。
なお、(D)成分をさらに加えた実施例2の場合、実施例1より低温(50℃)で硬化させても充分な硬さが得られ、(D)成分により短時間で硬化することがわかった。一方、(D)成分を加えずに低温(50℃)で硬化させた実施例6の場合、深部硬化は充分であったが、硬さが不充分となった。
(E)成分をさらに加えた実施例3の場合、得られたゴムの硬さは実施例1に比べて若干低下したが、伸びが優れたものとなった。
As can be seen from Table 1, in each of the examples, the deep-curability was remarkably improved, and a rubber cured product satisfying the desired characteristics was obtained.
In the case of Example 2 in which component (D) is further added, sufficient hardness can be obtained even when cured at a lower temperature (50 ° C.) than Example 1, and the component (D) can be cured in a short time. all right. On the other hand, in the case of Example 6 cured at a low temperature (50 ° C.) without adding the component (D), the deep curing was sufficient, but the hardness was insufficient.
In the case of Example 3 in which the component (E) was further added, the hardness of the obtained rubber was slightly reduced as compared with Example 1, but the elongation was excellent.

一方、(B)成分を配合しなかった比較例1、3、4の場合、組成物が硬化しなかった。同様に、(C)成分を配合しなかった比較例2の場合も組成物が硬化しなかった。なお、比較例1の組成物中のケトオキシムシランが加水分解するとカルボニル化合物でなくオキシムを生成するため、ケチミン反応が生じず、深部硬化性に劣る。
以上から、組成物を硬化させるために(B)成分と(C)成分による水の生成反応が必要であることがわかる。
On the other hand, in the case of Comparative Examples 1, 3, and 4 where the component (B) was not blended, the composition was not cured. Similarly, in the case of Comparative Example 2 in which the component (C) was not blended, the composition was not cured. In addition, when the ketoxime silane in the composition of Comparative Example 1 is hydrolyzed, an oxime is generated instead of a carbonyl compound. Therefore, a ketimine reaction does not occur and the deep curability is poor.
From the above, it can be seen that water generation reaction by the component (B) and the component (C) is necessary to cure the composition.

Claims (5)

(A)下記一般式(1):
Figure 2007177012
(式中、Rは炭素原子数1〜10の置換又は非置換の一価の炭化水素基であり、nは10以上の整数である)で示されるオルガノポリシロキサン100質量部、
(B)下記一般式(2):
Figure 2007177012
(式中、Rは置換又は非置換の一価の炭化水素基であり、Rは水素原子又は一価の炭化水素基であり、mは2〜4の整数である)で示される加水分解性シラン又はその部分加水分解物0.1〜30質量部、
(C)一分子中に少なくとも1個のNH基を有し、前記オルガノポリシロキサン100g当り、該NH基を0.001〜1mol含有する有機化合物、
を含み、前記加水分解性シラン又はその部分加水分解物の加水分解により生成するケトン化合物と前記NH基とが脱水縮合反応することを特徴とする熱硬化性オルガノポリシロキサン組成物。
(A) The following general formula (1):
Figure 2007177012
(Wherein R 1 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is an integer of 10 or more), 100 parts by mass of an organopolysiloxane,
(B) The following general formula (2):
Figure 2007177012
(Wherein R 2 is a substituted or unsubstituted monovalent hydrocarbon group, R 3 is a hydrogen atom or a monovalent hydrocarbon group, and m is an integer of 2 to 4). 0.1-30 parts by mass of degradable silane or a partial hydrolyzate thereof,
(C) an organic compound having at least one NH 2 group in one molecule and containing 0.001 to 1 mol of the NH 2 group per 100 g of the organopolysiloxane;
And a ketone compound produced by hydrolysis of the hydrolyzable silane or a partial hydrolyzate thereof and the NH 2 group undergoes a dehydration condensation reaction, a thermosetting organopolysiloxane composition.
さらに、(D)有機錫系触媒0.001〜20質量部を含むことを特徴とする請求項1記載の熱硬化性オルガノポリシロキサン組成物。 The thermosetting organopolysiloxane composition according to claim 1, further comprising (D) 0.001 to 20 parts by mass of an organotin catalyst. さらに、(E)一分子中に少なくとも1個のC=O基を有し、前記オルガノポリシロキサン100g当り、該C=O基を0.001〜1mol含有する有機化合物を含むことを特徴とする請求項1または2記載の熱硬化性オルガノポリシロキサン組成物 And (E) an organic compound having at least one C═O group in one molecule and containing 0.001 to 1 mol of the C═O group per 100 g of the organopolysiloxane. The thermosetting organopolysiloxane composition according to claim 1 or 2. 熱硬化温度が50〜150℃であることを特徴とする請求項1ないし3のいずれかに記載の熱硬化性オルガノポリシロキサン組成物。 The thermosetting organopolysiloxane composition according to any one of claims 1 to 3, wherein the thermosetting temperature is 50 to 150 ° C. 前記(A)〜(C)成分の沸点が150℃以上であることを特徴とする請求項1ないし4のいずれかに記載の熱硬化性オルガノポリシロキサン組成物。
The thermosetting organopolysiloxane composition according to any one of claims 1 to 4, wherein the components (A) to (C) have boiling points of 150 ° C or higher.
JP2005374724A 2005-12-27 2005-12-27 Method for curing thermosetting organopolysiloxane composition Expired - Fee Related JP4743511B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005374724A JP4743511B2 (en) 2005-12-27 2005-12-27 Method for curing thermosetting organopolysiloxane composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005374724A JP4743511B2 (en) 2005-12-27 2005-12-27 Method for curing thermosetting organopolysiloxane composition

Publications (2)

Publication Number Publication Date
JP2007177012A true JP2007177012A (en) 2007-07-12
JP4743511B2 JP4743511B2 (en) 2011-08-10

Family

ID=38302512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005374724A Expired - Fee Related JP4743511B2 (en) 2005-12-27 2005-12-27 Method for curing thermosetting organopolysiloxane composition

Country Status (1)

Country Link
JP (1) JP4743511B2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05279570A (en) * 1992-03-30 1993-10-26 Shin Etsu Chem Co Ltd Organopolysiloxane composition rapidly curable at room temperature
JPH06220326A (en) * 1993-01-25 1994-08-09 Matsushita Electric Works Ltd Coating composition
JPH0782486A (en) * 1993-09-13 1995-03-28 Shin Etsu Chem Co Ltd Room temperature curing organopolysiloxane composition
JP2000234057A (en) * 1998-12-14 2000-08-29 Shin Etsu Chem Co Ltd Room-temperature quick-curing composition
JP2002121385A (en) * 2000-10-12 2002-04-23 Shin Etsu Chem Co Ltd Room temperature-curable organopolysiloxane composition
JP2003183505A (en) * 2001-10-12 2003-07-03 Shin Etsu Chem Co Ltd Room temperature curable organopolysiloxane composition

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05279570A (en) * 1992-03-30 1993-10-26 Shin Etsu Chem Co Ltd Organopolysiloxane composition rapidly curable at room temperature
JPH06220326A (en) * 1993-01-25 1994-08-09 Matsushita Electric Works Ltd Coating composition
JPH0782486A (en) * 1993-09-13 1995-03-28 Shin Etsu Chem Co Ltd Room temperature curing organopolysiloxane composition
JP2000234057A (en) * 1998-12-14 2000-08-29 Shin Etsu Chem Co Ltd Room-temperature quick-curing composition
JP2002121385A (en) * 2000-10-12 2002-04-23 Shin Etsu Chem Co Ltd Room temperature-curable organopolysiloxane composition
JP2003183505A (en) * 2001-10-12 2003-07-03 Shin Etsu Chem Co Ltd Room temperature curable organopolysiloxane composition

Also Published As

Publication number Publication date
JP4743511B2 (en) 2011-08-10

Similar Documents

Publication Publication Date Title
JP5404988B2 (en) Method for producing room temperature curable polyorganosiloxane composition
JP2738235B2 (en) Ultraviolet and moisture curable organopolysiloxane composition, cured product thereof and method for producing the same
US6306998B1 (en) Room temperature fast curable composition
JP4811562B2 (en) Room temperature curable organopolysiloxane composition
JPH08269337A (en) Curable organopolysiloxane composition
JP2007321122A (en) Room temperature-curable organopolysiloxane composition
JP2009007553A (en) Room temperature-curable organopolysiloxane composition
JP4912754B2 (en) Room temperature curable organopolysiloxane composition
JPH05262989A (en) Room temperature curing organopolysiloxane composition
JPH0627267B2 (en) Room temperature curable polyorganosiloxane composition
US6166121A (en) Curable organopolysiloxane composition
EP0575863B1 (en) Modulus controllable room-temperature-curable silicone elastomer composition
JPH08269335A (en) Production of one-part type cold curing silicone elastomer composition
JPH0834922A (en) Silicone elastomer composition curing at room temperature
JPH01165663A (en) Room-temperature-curable composition
JP4553110B2 (en) Organopolysiloxane composition for adhesion of magnesium alloy
JP6018031B2 (en) Room temperature curable organopolysiloxane composition, architectural sealant using the cured product of the composition, electrical and electronic component, and automotive oil seal
JP2008019363A (en) Room temperature-curable polyorganosiloxane composition
JP4743511B2 (en) Method for curing thermosetting organopolysiloxane composition
JP2004269818A (en) Room temperature-curable polyorganosiloxane composition
JP3521787B2 (en) Room temperature fast curable composition
JP4055552B2 (en) Primer composition and method for bonding thermosetting elastomer
JP4530136B2 (en) Room temperature curable organopolysiloxane composition and method for producing the same
JP4553119B2 (en) Organopolysiloxane composition for adhering magnesium alloy and composite article
JP3022091B2 (en) Heat-curable silicone elastomer composition

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071221

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100608

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100616

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100726

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110427

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110427

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140520

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4743511

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees