JP2007168786A - In-vehicle electronic device and thermal flowmeter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an in-vehicle electronic device with an airtight structure which suppresses permeation of a corrosive gas from a silicon adhesive agent and blocks off the corrosive gas entering a case. <P>SOLUTION: An adsorbent adsorbing the corrosive gas is compounded into the silicon adhesive agent. Permeation of the corrosive gas into the case can be suppressed, and a highly reliable in-vehicle electronic device is obtained. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to an in-vehicle electric device. In particular, a sensing element for detecting various physical quantities installed in an engine room and an electronic circuit for controlling the sensing elements, and a sealing structure for various sensors for outputting various physical quantities as electrical signals, and for the various sensors. The present invention relates to a sealing structure of a control unit having a microprocessor arithmetic unit that receives various electrical signals and controls various states of a vehicle.

Conventionally, this type of sealing structure has been adopted as a basic structure of many physical quantity detection devices and control devices in an engine room, such as a thermal air flow meter disclosed in JP-A-6-11373. . Taking the thermal air flow meter shown in JP-A-6-11373 as an example, these physical quantity detection sensors are assumed to be used under severe environmental conditions such as high temperature, low temperature, and humidity. A base member formed by insert molding a resin with a terminal that holds a temperature-sensitive resistor and a base made of aluminum having good thermal conductivity, receives and controls the electrical signals of the heating resistor and the temperature-sensitive resistor, and outputs them to the outside. The drive circuit is bonded to the base, further covered with a case member made of resin or the like that covers the drive circuit, and the upper surface is further bonded with a cover. Here, as the adhesive, a silicone adhesive is mainly used for bonding the drive circuit and the base, and a silicone adhesive is often used for bonding the base and the case. Further, an epoxy adhesive or a silicone adhesive is often used for bonding the case and the cover.

Further, as a silicone composition having antibacterial and antifungal properties for a silicone adhesive, JP-A-7
No. 62242 discloses a silicone composition in which a silicone rubber composition is blended with zeolite containing 0.1 to 15 wt% of silver ions.

The above prior art has a structure in which the drive circuit is hermetically sealed by bonding the metal base covering the drive circuit and the case made of resin with a silicone adhesive. Therefore, when the drive circuit is adhesively sealed between the base and the case with a silicone adhesive, if there is a corrosive gas atmosphere, the corrosive gas is transmitted through the silicone adhesive sealing portion. Intrusions into the case.

Many on-vehicle electronic devices that are assumed to be used in harsh environments have a structure in which the structure of the electronic drive circuit is a resistor that forms a conductor and resistance on an inorganic surface such as alumina or glass ceramic. A hybrid IC substrate having a capacitor, a diode, a semiconductor integrated circuit, etc. mounted on the surface is used in many cases, but the corrosive gas penetrates the silicone adhesive and reaches the case. When forming the conductor member, silver or silver alloy to cause a chemical reaction to form silver sulfide, and eventually lead to a disconnection,
I was worried about reliability.

The present invention has the advantages of the silicone adhesive, such as excellent viscoelastic properties, balance of mechanical strength and elongation, excellent reliability, etc. of the silicone adhesive as an adhesive for a case made of a metal base and a resin. With regard to gas permeability, which is a drawback as a sealant, especially for driving circuits of in-vehicle electronic devices, corrosive acid such as sulfur gas that promotes corrosion, sulfur compound gas such as sulfurous acid gas and hydrogen sulfide gas, etc. A drive circuit that prevents the penetration of corrosive acid gas into the case by using a silicone adhesive that prevents gas permeation or promotes delay in permeation as an adhesive sealant. An object of the present invention is to provide a highly reliable in-vehicle electronic device due to the effect of preventing corrosion of the conductor material.

  The above object is solved by the invention described in the appended claims.

For example, in order to give the silicone adhesive a silicone polymer based on dimethylpolysiloxane or methylphenylpolysiloxane as a filler in order to give the silicone adhesive a function that does not permeate corrosive gases without impairing the viscoelastic properties of the silicone adhesive, This is achieved by adding activated carbon that adsorbs corrosive acid gases in addition to the trade name, Aerosil, and Fumed Silica. In particular, activated carbon is presumably effective to be white charcoal or coconut shell activated carbon that is porous and has undergone a firing temperature of 1000 ° C. or higher.

According to the present invention, the hybrid IC substrate stored in the case is protected from corrosion by corrosive acidic gas such as corrosive sulfur compound gas, sulfur gas, nitrogen oxide gas, or alkali gas, and corrosion resistance. In-vehicle electronic devices with high performance can be provided.

Embodiments of the present invention will be described below in order to clarify the present invention more specifically. However, the present invention is not limited by the description of such embodiments. Needless to say.

First, referring to FIG. 2 showing a typical cross-sectional structure of the in-vehicle electronic device shown in FIG. 1 and a corrosive environment to which the in-vehicle electronic device is exposed, the structure, use environment and problems of the in-vehicle electronic device will be described.
In-vehicle electronic devices are roughly divided into a fuel control device for sensors and a control unit, and an ignition control device for igniters and coils. The sensor detects physical quantities such as intake air flow rate, air temperature, atmospheric pressure, boost pressure, etc., and the control unit receives the sensor signal and controls the combustion state in the cylinder. The igniter and coil are inside the cylinder. It has a function to control the ignition timing. What is common in the structure of these in-vehicle electronic devices is that each has an electronic drive circuit 1 or an electronic control circuit, and is bonded and fixed to a metal base 2 on which the electronic drive circuit 1 or the electronic control circuit is installed. In many cases, the electronic drive circuit 1 or the case 3 for storing the electronic control circuit is bonded and fixed 4 to the base 2, and the upper surface is covered with a cover 5 and bonded and fixed. The electronic drive circuit 1 or the electronic control circuit described above is formed by printing and firing a conductor 8 wiring and a resistor to be a conductor 8 of the circuit on the surface of the flat substrate 7 formed of an inorganic material such as ceramic. A hybrid IC substrate 9 in which a capacitor, a diode, and a semiconductor integrated circuit are mounted is often used. In order to promote heat dissipation from the hybrid IC substrate 9, the hybrid IC substrate 9 is bonded and fixed to the metal base 2 with a silicone adhesive. Is done. Since the metal base 2 serves as a heat sink for heat dissipation, a metal having a high thermal conductivity, particularly aluminum, is often used. The case 3 for storing the hybrid IC substrate 9 and the cover 5 covering the upper surface have a shape integrated with a connector serving as an input / output signal interface of the electronic drive circuit 1, and transmit electrical signals inside the resin forming the case 3. A structure in which the terminal 11 made of a conductive member for controlling the sensor 11 is formed in a sensate manner is employed. Here, the sensor for detecting physical quantities such as intake air temperature, intake air flow rate, boost pressure, etc. has a structure in which the sensing element 10 is installed outside or in the case opening, and is electrically connected via the electronic drive circuit 1 and the terminal 11. It is connected to the. The case 3 is adhesively fixed 4 to the base 2, and the cover 5 is also adhesively fixed 6 to the case 3. Examples of resin members forming the case 3 and the cover 5 include polybutylene terephthalate (PBT), polyphenylene sulfide (PPS),
Resins with excellent injection moldability, such as nylon 6, nylon 66, nylon 11, and nylon 12, are used in many in-vehicle electronic devices.

Here, the case 3 and the base 2 described above are often bonded and sealed 4 with an elastic adhesive having viscoelasticity such as the silicone adhesive 12 because the linear expansion coefficients of both are greatly different. Case 3 and cover 5 are epoxy adhesive if they are the same member, and silicone adhesive 12 if they are different members.
There are many examples of sealing with.

Many of the on-vehicle electronic devices described above are characterized in that bonding is employed at many structural locations for bonding the structural components, and the silicone adhesive 12 is often used.

However, the silicone adhesive 12 has an inconvenient aspect due to the properties unique to the silicone resin. The inside of the engine room of a vehicle on which the in-vehicle electronic device is mounted is blown back from the combustion gas from the engine, is returned from the unburned gas, and is exposed to the atmosphere 13 where the hydrocarbon stays. In addition, the interior of the engine room is in a state where products such as rubber ducts containing sulfur, hoses 26, and the like, which are often arranged in engine components, are gathered, and the internal temperature of the engine exceeds 100 ° C for some in-vehicle electronic devices. Reach. In this state, sulfur-containing gas or sulfur compound gas 14 springs out from the product group vulcanized with sulfur such as rubber ducts and hoses 26, and changes to a corrosive environment. There is a possibility that it will be a low-reliability product if it does not produce in-vehicle electronic devices that are resistant to these corrosive gases. There is. This is because the ceramic substrate 7 of many electronic drive circuits 1 in these in-vehicle electronic devices.
In many cases, the conductor wiring 8 formed above is formed of silver or a silver alloy. When corrosive gas, particularly sulfur gas or sulfur compound gas 14 enters the inside of the case 3, the conductor wiring 8 and This is because the silver and silver alloy wiring portion to be formed is subject to sulfide corrosion, and the wiring 8 of the electronic driving circuit 1 may be disconnected, and the electronic driving circuit 1 may not operate.

Silicone adhesive 12 used in many in-vehicle electronic devices has physical properties unique to silicone resin, and has a high gas permeability. In general, an industrial polymer material having many poly bonds has a low gas permeability and can be said to be a gas shield. Polyamide (such as nylon) and saturated polyester resin group (such as PBT and PET) have low gas permeability and are not at a level that causes common sense. However, in the silicone resin, a polymer is formed by a siloxane bond in which Si (silicon) and O (oxygen) are linearly connected, and this siloxane bond (-Si
-O-Si-) is flexible because of its large intermolecular distance, has a physical property that gas permeability is high because of its small molecular rotational steric hindrance and low intermolecular force. Therefore, as described above, it should be the sealing part of the in-vehicle electronic device exposed to the environment of corrosive gas, and the corrosive gas 14 permeates from the adhesive sealing part 4 made of the silicone adhesive 12 and the inside of the case 3 In the end, there is a problem that the conductor wiring 8 formed of silver or a silver alloy formed on the surface of the electronic drive circuit 1 is subjected to sulfide corrosion.

The sealing structure of the in-vehicle electronic device according to the present invention traps or adsorbs corrosive gas inside the silicone resin with respect to the silicone adhesive 12 having high gas permeability.
Internally trapped in the silicone adhesive as a sealing structure that can block the corrosive gas with a silicone adhesive that does not allow the passage of corrosive gas, or by chemically reacting the corrosive gas in the silicone adhesive The present invention proposes a sealing structure for an in-vehicle electronic device with an improved function of protecting the electronic drive circuit 1 from corrosive gas.

  Hereinafter, the structure of the silicone adhesive according to the present invention will be described.

Since there are a large number of in-vehicle electronic devices and it is difficult to describe them all here, the structure of the thermal flow meter for measuring the intake air flow rate shown in FIG. Embodiments of the invention will be described. First, the air flow meter will be briefly described. 3 and 4 are sectional structural views showing the structure of the thermal flow meter.

The thermal flow meter is a sensor that measures intake air that has been rapidly spread in the market in recent years. The heat generating resistor 15 of the thermal air flow meter 17 using the heat generating resistor 15 and the temperature sensitive resistor 16 has a constant temperature so as to be always kept at a constant temperature difference from the temperature sensitive resistor 16 for measuring the air temperature. The controller 18 is controlled at a constant temperature and is constantly heated. Since the heat generating resistor 15 is installed in the air flow, the surface portion of the heat generating resistor 15 that radiates heat to the air flow becomes a heat radiating surface, that is, a heat transfer surface. The amount of heat lost to the air flow by this heat transfer is converted into an electrical signal to measure the air flow rate.
The overall configuration of the body 19 that holds the thermal flow meter 17 while introducing the intake air is the heating resistor 15, the temperature sensitive resistor 16, and the suction in the sub-passage 20 through which a part of the total flow rate flows. An air temperature measurement sensor 21 is arranged. These resistor elements and the constant temperature control circuit 18 have a structure for transmitting an electrical signal through the terminal 11 by a conductive member embedded in the case 3. A specific structure will be described. In the thermal flow meter 17 described above, the base 2 for dissipating self-heating of a power device such as a power transistor serves as a structural base. The base 2 is often made of a metal material having high thermal conductivity, and aluminum is often used for this. A conductor wiring 8 and a resistor are formed on the surface of the base 2 by printing on the surface of the ceramic substrate 7, and a hybrid IC substrate 9 on which a semiconductor integrated circuit, a capacitor, a diode, and the like are mounted is bonded with a silicone adhesive. Further, a case 3 in which a connector, which is an interface part for transmitting a sensor signal to the outside or supplying circuit drive power from the outside, is formed simultaneously with a silicone adhesive 12 on the base 2 as a base for storing the hybrid IC substrate 9. Adhesive sealing 4 is performed. In this state, after adjusting the output characteristics and the like of the sensor, silicone gel 22 is injected into the case 3 as a protective film of the hybrid IC substrate 9 and covered with the cover 5 on the upper surface of the case 3. It has a structure sealed with 6 or the like.

Here, as described above, the silicone adhesive 12 used for bonding many members to each other has high gas permeability, and when it is in a corrosive environment, it penetrates into the case 3 from the adhesive sealing portion 4. Therefore, in order to prevent the mounting components of the hybrid IC substrate 9 and the conductor wiring 8 from being corroded, the silicone adhesive is devised so that the corrosive gas does not permeate the silicone adhesive, or the silicone adhesive. By providing a function of trapping or adsorbing corrosive gas, it is possible to manufacture an in-vehicle electronic device including the thermal flow meter 17 having high corrosion resistance reliability.

Specifically, by adsorbing the adsorbent 24 as the filler 23 in the silicone composition such as the silicone adhesive 12. As shown in FIG. 5, the normal silicone adhesive 12 is blended with 10 to 60 wt% of filler 23 as a reinforcing agent in a dimethylposiloxane polymer or methylphenyl polysiloxane polymer 27 as a base polymer. It is a composition in which an agent or the like is blended. This filler 23 is silicon dioxide (silica).
In general, it is blended as an industrial polymer filler 23 under the trade name Aerosil or fumed silica. Each company is improving the characteristics of the resin by changing the shape, size, and state of the fine powdered silica. In the present invention, as shown in FIG. 6, an adsorbent 24 is blended as an alternative to the silica filler 23 blended in the silicone resin. Alternatively, the main point is to use the silica filler 23 and the adsorbent 24 together. Further, even if the silica filler 23, the adsorbent 24, and the neutralizing agent are used together and blended with the silicone resin, the effect of preventing the permeation of corrosive gas to the external corrosive environment is the same.

Here, the adsorbent 24 to be used generally determines the cost, the adsorption effect of the corrosive gas, and the like, and the activated carbon 25 is most effective. Activated carbon 25 is a high-purity activated carbon with a small amount of impurities fired at a high temperature of 1000 ° C. or higher, activated carbon containing a certain amount of impurities formed at a baking temperature of 1000 ° C. or lower, and the activated carbon material also includes coconut husk, charcoal, The activated carbon 25 described in the present invention covers all of these, although there are a wide variety of fiber plant groups. In addition to the activated carbon 25, the adsorbent 24 includes various measures such as photocatalysts such as titanium oxide, self-cleaning metals such as zinc oxide, zeolites, ion exchange resins, and the like. ing.

In particular, the activated carbon 25 is advantageous in that it has a specific adsorption effect for the target gas. For example, if the target gas is clear, such as activated carbon having a high adsorption effect with respect to sulfurous acid gas (SO ₂ ) shown in FIG. 7 and activated carbon having a high adsorption effect with respect to hydrogen sulfide (H ₂ S), the target is used. By adding the activated carbon 25 having a high adsorption effect to the gas to the silicone adhesive 12, the gas body other than the target, for example, a gas having no corrosive properties such as water vapor and air, the activated carbon 25 does not adsorb these gas molecules. However, if activated carbon that has the function of adsorbing only sulfur dioxide gas, which is a sulfur-based corrosive gas 14, or hydrogen sulfide having a similar molecular structure is mixed, only corrosive gas is trapped. As a result, a highly corrosion-resistant and reliable sealing structure with a high adsorption effect can be realized. The activated carbon 25 has a porous surface 28. For example, the activated carbon 25 formed on the surface has many pores having a shape approximate to the molecular shape of sulfurous acid gas. It is adsorbed by the negative ions 29 present and adsorbed in the pores on the surface of the activated carbon 25 that approximates the shape of sulfurous acid gas. Depending on the type of the activated carbon 25, after the gas adsorbed in the pores on the surface of the activated carbon 25 is adsorbed in the pores of the activated carbon 25,
An activated carbon 25 that generates a chemical reaction and changes or neutralizes it to another substance has also been developed.

Considering the inside of the engine room or the inside of the intake system of the automobile, the generated gas is a sulfur-based gas 14 such as H ₂ S, SO ₂ , SOx, CS ₂ , S 8, NO, NO ₂ , N ₂ O. NOx gas 13 such as HC, hydrocarbon such as HC, chlorine gas such as Cl _2, etc.
These corrosive gases are complex mixed gas, and based on these corrosive gas components, by adding activated carbon 25 that adsorbs gas components in accordance with the corrosive gas components, the corrosive gas is further mixed. It becomes possible to improve adsorption efficiency. In addition, by sealing with at least two types of activated carbon 25 having different adsorption effects or silicone adhesive 12 containing a neutralizing agent as filler 23, it is possible to provide a thermal air flow meter with improved corrosion resistance reliability. It has a positive effect.

Of course, the silica used as the filler 23 originally blended in the silicone adhesive is also porous and is an adsorbent in a sense. However, silica is a sulfur-based corrosive gas 14
It is said that it is not very effective in adsorbing. Silica has been confirmed to be effective as an adsorbent for gases such as aliphatic hydrocarbons, and zeolite has been confirmed to be effective for adsorption of aromatic hydrocarbons. Silica as filler 23 is effective for gas adsorption of alcohol, solvent, etc., and is desirably used in combination with activated carbon 25, and is incorporated into silicone adhesive 12 by maintaining the function as a silicone adhesive sealant. The activated carbon 25 as the filler 23 is preferably blended in an amount of 5 wt% or more.

The advantage of blending the activated carbon 25 as the filler 23 is that it can be regenerated. Naturally, when the adsorption capacity of the activated carbon 25 is saturated, the adsorption capacity is lost and the filler 23 has no function. However, in the saturated state, it has the effect of discharging the adsorbed gas molecules when it reaches a certain temperature or beyond, and after it is discharged, it refreshes again and the adsorption capacity is restored. It is possible to continue to act as an adsorbent, and is effective in maintaining reliability for products used for a long period of time such as automobiles. In particular, in the case of the thermal air flow meter 17, since the gas molecules discharged from the activated carbon 25 are sucked into the cylinder and burned, the influence on the atmosphere is small.

  FIG. 8 shows another embodiment of the present invention shown in FIG.

In this embodiment, as the filler 23 to be blended with the silicone resin, silver fine powder 30 is blended as a filler in addition to silica. This method is particularly effective when a sulfur-based corrosive acidic gas 14 is targeted. The sulfur-based corrosive gas 14 adsorbed and permeated on the surface of the silicone adhesive directly reacts with the silver fine powder 30 mixed in the silicone adhesive to form silver sulfide, which is trapped as sulfide in the silicone. Thus, the adhesive sealing structure improves the corrosion resistance reliability by a mechanism in which the sulfur-based corrosive gas 14 does not enter the case 3 in which the hybrid IC substrate 9 is stored.

In general, a composition in which silver is mixed with a silicone resin already exists on the market. However, it is often an antibacterial resin that makes use of the bactericidal properties of silver, a biological resin, or an antifungal resin for construction. In the present invention, the present invention has been devised by paying attention to the high reactivity of silver with sulfur-based corrosive gas.

Since the silver fine powder 30 blended in the silicone adhesive has a large size, the electrical properties, such as electrical insulation and conductivity, which are inherent properties of the silicone adhesive, may change. Silver is desirably at least 10 μm or less. The shape may be spherical, but there is no problem, but an amorphous bulk shape, flake, needle shape or the like that can secure a larger surface area is effective. The concentration of silver is also important. The higher the purity of the silver, the more active the fine powder surface and the more active the chemical reaction with the corrosive gas. However, when an alloy of silver and other metals, particularly platinum group elements such as platinum, palladium, and iridium is used, the sensitivity to corrosive acid gas is impaired, and the chemical reaction that forms sulfides is impaired. The same applies to alloys with other transition metal groups such as copper and gold. Therefore, it is desirable that the purity of silver be at least 80 wt%.

In recent years, fine powder in which a resin is coordinated on the surface of silver, hydrosilylapatite silver, and fine silver powder in which an active group is formed on the surface are also effective.

As described above, the adsorbent 24 and fine silver powder 30 are blended in the silicone adhesive, and the structure prevents the corrosive gas from being adsorbed or trapped in the silicone adhesive to prevent penetration into the case. On the other hand, as another embodiment, the protective film for protecting the hybrid IC substrate 9 housed in the case 3 is blended with the adsorbent 24 which is the gist of the present invention and the fine silver powder 30. Silicone gel 22 is used as a protective film covering the hybrid IC substrate 9 of many in-vehicle electronic devices, but both the silicone gel 22 and the silicone adhesive 12 basically have the above-described polymer main chain by the siloxane bond. The structures to be formed are the same, and the difference is often only the number of crosslinking points. Therefore, even if the adsorbent 24 and the fine silver powder 30 are blended with the silicone gel 22, it can be used without any problem. Adsorbent 24 and fine silver powder 30
As described above, the description is omitted here, but by combining the adsorbent 24 blended in the silicone adhesive 12, the fine silver powder 30 filler, and the adsorbent 24 filler blended in the silicone gel 22, There exists an effect which can provide the adhesion sealing structure with higher corrosion resistance reliability.

Furthermore, even if the adsorbent 24 filler is blended with the resin forming the case member and the cover member, the same effect can be expected, and there is an effect that an in-vehicle electronic device with high corrosion resistance reliability can be provided.

The cross-section figure of the vehicle-mounted electronic device which shows the characteristic of this invention. An example of an environment where in-vehicle electronic devices are taken. The structural diagram of a thermal flow meter. The cross-section figure of a thermal type flow meter. Structure diagram of a general silicone adhesive. 1 is a schematic diagram of the structure of a silicone adhesive according to the present invention. The schematic diagram of corrosive gas adsorption of activated carbon. 1 is a schematic diagram of the structure of a silicone adhesive according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic drive circuit, 2 ... Base, 3 ... Case, 4 ... Bonding sealing part of base and case, 5 ...
Cover, 6 ... Adhesive seal part of cover and case, 7 ... Ceramic substrate, 8 ... Conductor wiring, 9 ... Hybrid IC substrate, 10 ... Sensing element, 11 ... Terminal, 12 ... Silicone adhesive, 13 ... Combustion gas, not NOx such as combustion gas, hydrocarbon such as hydrocarbon, HC corrosive gas, 14 ... corrosive gas such as sulfur gas, sulfur compounds, 15 ... exothermic resistor, 16 ... temperature sensitive resistor, 17 ... thermal flow meter, 18 ... constant temperature control circuit, 19 ... body, 20 ... sub-passage, 21 ... intake air temperature sensor, 22 ... silicone gel, 23 ... filler, 24 ... adsorbent, 25 ... activated carbon,
26 ... rubber duct, hose, 27 ... main polymer of silicone composition, 28 ... porous,
29 ... negative ions, 30 ... fine silver powder.

Claims (36)

An electronic component that functions by applying electricity, such as a circuit board on which an electronic circuit is formed, a case that houses the electronic component, a cover that covers the open surface of the case, the electronic component being disposed in the case In an electronic device having
A structure in which the case and the cover are joined using an adhesive or a sealant that has a function of adsorbing corrosive gas as an adhesive or sealant for joining the gap or filling the gap. In-vehicle electronic equipment characterized by An electronic component that functions by applying electricity, such as a circuit board on which an electronic circuit is formed, a base to which the electronic component is fixed, a case that surrounds the electronic component, and a cover that covers an open surface of the case In an electronic device having
Adhesive having a function of adsorbing corrosive gas, or sealing as an adhesive or sealant for bonding or filling any gap of either the case and the base or the cover An in-vehicle electronic device characterized by having a structure bonded with an agent. An electronic component that functions by applying electricity, such as a circuit board on which an electronic circuit is formed, a base to which the electronic component is fixed, a case that surrounds the electronic component, and a cover that covers an open surface of the case In an electronic device having
An adhesive having a function of adsorbing corrosive gas, or a structure sealed with an encapsulant, as an adhesive or a sealant for joining the electronic component and the case or filling a gap In-vehicle electronic device characterized by In claim 1, claim 2 or claim 3,
A terminal for obtaining an electrical connection between the electronic component covered by them and the outside is fixed to any of the case, the cover, and the base. The terminal, the case, the cover, and the base An in-vehicle electronic device characterized by having a structure sealed with an adhesive having a function of adsorbing corrosive gas or an adhesive as a sealant or an adhesive for filling any gaps machine. Claim 1, claim 2, claim 3 and claim 4,
In particular, the case and the base for storing the electronic parts, or the case and the cover are adsorbed to corrosive gases such as sulfur gas, sulfur-based compound gas, nitrogen oxide gas, COx gas, and chlorine gas. An in-vehicle electronic device characterized by a structure bonded with an adhesive or a sealant containing a functional filler. In claim 1, claim 2, claim 3 and claim 4,
In particular, the case and the base for storing the electronic components, or the case and the cover have an adsorption function for corrosive gases such as sulfur gas, sulfur-based compound gas, nitrogen oxide gas, COx gas, and chlorine gas. An in-vehicle electronic device characterized by a structure in which a base polymer blended with a filler is joined with a silicone adhesive or sealant made of dimethylpolysiloxane or methylphenylpolysiloxane. In claim 1, claim 2, claim 3 and claim 4,
In particular, the case and the base for storing the electronic components, or the case and the cover have an adsorption function for corrosive gases such as sulfur gas, sulfur-based compound gas, nitrogen oxide gas, COx gas, and chlorine gas. An in-vehicle electronic device characterized by a structure sealed with an epoxy-based adhesive using bisphenol A or bisphenol F containing a filler as a base polymer. In claim 1, claim 2, claim 3 and claim 4,
In particular, the case and the base for storing the electronic components, or the case and the cover have an adsorption function for corrosive gases such as sulfur gas, sulfur-based compound gas, nitrogen oxide gas, COx gas, and chlorine gas. An in-vehicle electronic device characterized by a structure sealed with a polyurethane adhesive with a urethane group containing a filler having a base polymer. In claim 1, claim 2, claim 3 and claim 4,
Particularly, the case and the base for storing the electronic circuit components, or the case and the cover are adsorbed to corrosive gases such as sulfur gas, sulfur-based compound gas, nitrogen oxide gas, COx gas, and chlorine gas. An in-vehicle electronic device characterized by a structure in which a trifluoropropyl group containing a filler having a fluorine content is sealed with a fluorine-based adhesive made of a polymer having a fluorine group in its side chain or main chain. In claims 1 to 9,
A composition comprising a polymer as a base polymer, wherein the adsorbent blended in the adhesive or sealant is activated carbon. In claims 1 to 9,
A composition comprising a polymer as a base polymer, wherein the activated carbon blended in the adhesive or sealant is activated carbon having specificity with high adsorption efficiency to sulfurous acid gas (SO ₂ ). In claims 1 to 9,
A composition comprising a polymer as a base polymer, wherein the activated carbon blended in the adhesive or sealant is activated carbon having specificity with high adsorption efficiency for hydrogen sulfide gas (H ₂ S). In claims 1 to 9,
Activated carbon blended in the adhesive or sealant is a simple sulfur gas (S2, S3, S4,
A composition comprising a polymer as a base polymer, which is activated carbon having specificity with high adsorption efficiency for (S6, S8, Sx ring state). In claims 1 to 9,
A composition comprising a polymer as a base polymer, wherein the activated carbon blended in the adhesive or sealant is activated carbon having specificity with high adsorption efficiency for carbon disulfide gas (CS ₂ ). In claims 1 to 9,
A composition comprising a polymer as a base polymer, wherein titanium oxide is added as a filler to be blended in an adhesive or a sealant. In claims 1 to 9,
A composition comprising a polymer as a base polymer, wherein an ion exchange resin is added to a filler blended in the adhesive or sealant. In claims 1 to 9,
A composition comprising a polymer as a base polymer, wherein zeolite is added to a filler blended in the adhesive or sealant. In claims 1 to 9,
At least 5 adsorbents that adsorb corrosive gas mixed in the adhesive or sealant.
A composition comprising a polymer as a base polymer, characterized in that the composition is not less than wt%. In claims 1 to 9,
The filler blended in the adhesive or sealant is based on silicon dioxide (silica), and is at least 2 such as an adsorbent that adsorbs silicon dioxide and corrosive gas, or a member that neutralizes corrosive gas. A composition comprising a polymer as a base polymer, characterized by dispersing and blending more than one type of filler. In claims 1 to 9,
As a filler blended in the adhesive or sealant, a base polymer is a polymer characterized in that the total amount of filler of adsorbent that adsorbs silicon dioxide (silica) and corrosive gas is at least 15 wt% or more. Composition. An electronic component that functions by applying electricity, such as a circuit board on which an electronic circuit is formed, a case that houses the electronic component, a cover that covers the open surface of the case, the electronic component being disposed in the case In an electronic device having
An in-vehicle electronic device characterized by a structure in which an adhesive mixed with silver as a filler, or a structure bonded with a sealant as an adhesive or sealant for bonding the case and the cover or filling a gap. An electronic component that functions by applying electricity, such as a circuit board on which an electronic circuit is formed, a base to which the electronic component is fixed, a case that surrounds the electronic component, and a cover that covers an open surface of the case In an electronic device having
Bonding using either an adhesive containing silver or a sealing agent as an adhesive or sealant for joining the gap between the case and the base, or the cover, or for all or a gap In-vehicle electronic device characterized by having a structure as described above. An electronic component that functions by applying electricity, such as a circuit board on which an electronic circuit is formed, a base to which the electronic component is fixed, a case that surrounds the electronic component, and a cover that covers an open surface of the case In an electronic device having
As an adhesive for joining the electronic component and the case or filling a gap, or as a sealant, an adhesive containing silver or a structure sealed with a sealant is used. In-vehicle electronic equipment. In claim 21, claim 22 or claim 23,
A terminal for obtaining an electrical connection between the electronic component covered by them and the outside is fixed to any of the case, the cover, and the base. The terminal, the case, the cover, and the base An in-vehicle electronic device characterized by having a structure sealed with an adhesive containing silver as an encapsulant or an adhesive for filling any of the gaps, or an encapsulant. In Claim 21, Claim 22, Claim 23, and Claim 24,
An on-vehicle electronic device characterized in that the filler to be blended in the adhesive or sealant is a silicone-based, polyurethane-based, fluorine-based elastic adhesive blended with silver as a filler, or a sealant. In Claim 21, Claim 22, Claim 23, and Claim 24,
An in-vehicle electronic device characterized by being an epoxy adhesive compounded with silver as a filler as a filler to be blended with the adhesive or sealant. In claims 21 to 26,
Silver as a filler to be blended in the adhesive or sealant is silver having a purity of 80 wt% or more, or an alloy with another metal element. In claims 21 to 26,
As a filler to be blended in the adhesive or sealant, the element alloyed with silver is a platinum group element, in particular, platinum, palladium, rhodium, transition elements such as gold, copper, nickel, iron, and chromium. In-vehicle electronic device characterized by being. In claims 21 to 26,
The in-vehicle electronic device characterized in that the size of silver to be blended as a filler in the adhesive or sealant is at least 50 μm or less. In claims 21 to 26,
The vehicle-mounted electronic device characterized by the filler made from silver mix | blended with the said adhesive agent or sealing agent being spherical shape, needle shape, flake shape, or the amorphous bulk which can enlarge a specific surface area. In claims 21 to 26,
Surface treatment with active groups on the surface, such as hydrosilylapatite silver with active hydroxyl group added to the surface of silver that is blended as a filler in the adhesive and sealant, or silver surface-treated with resin In-vehicle electronic devices characterized by In particular, in a thermal flow meter for measuring an intake air flow rate comprising an exothermic resistor and a thermosensitive resistor, and an electronic circuit for controlling the exothermic resistor and the thermosensitive resistor,
A base for installing the base and the drive circuit; a case for storing the drive circuit for controlling an electrical signal of the heating resistor and the temperature sensitive resistor; an adhesive for a cover covering an open surface of the case; the base; As an adhesive for the drive circuit and an adhesive for the base and the case,
A thermal flow meter characterized in that the structure according to the invention presented in No. 31 to No. 31 is applied. Claimed on a coating material that forms a filling material or a protective film to be injected into the case for the purpose of protecting mounting parts of electronic circuits of various in-vehicle electronic devices and fine wire wires that are electrically connected at both ends for electrical connection. An in-vehicle electronic device characterized in that it is a coated member containing the filler according to the invention presented in claims 1 to 31. In claim 33,
In particular, the on-vehicle electronic device is characterized in that a member filled on the surface of the electronic circuit is silicone gel for protecting the electronic circuit. An electronic component that functions by applying electricity, such as a circuit board on which an electronic circuit is formed, a base to which the electronic component is fixed, a case that surrounds the electronic component, and a cover that covers an open surface of the case In the electronic device which has, resin components, such as the said case and the said cover, shape | molded with resin which mix | blended the filler shown to Claims 1-34, The vehicle-mounted electronic device characterized by the above-mentioned. 36. The vehicle-mounted electronic device according to claim 35, wherein the member for forming the case and the cover is blended with polybutylene terephthalate or polyphenylene sulfide as a base polymer and an adsorbent that adsorbs corrosive gas as a filler.

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