JP2007157832A - Sheet cutting device and method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet cutting device and a sheet cutting method for preventing unneeded rubbish from being generated by cutting a sheet so that a second sheet does not adhere to a first one, when sticking the second sheet to a surface at a side opposite to a planar member to which the first sheet has been stuck for cutting. <P>SOLUTION: A protective sheet S is stuck to the side of the circuit surface of a semiconductor wafer W, and the semiconductor wafer W is placed on a table 10 so that the rear becomes an upper surface side. After a die-bonding sheet DS is stuck to the upper surface side of the wafer W, the die-bonding sheet DS is cut in a closed loop shape by a cutter blade 11 to the shape of the wafer W. The cutter blade 11 in cutting is inclined by an inclination angle α where a tip 11A is positioned outside a base 11B for maintaining so that an outer unneeded sheet DS1 does not fall and adheres to the protective sheet S. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a sheet cutting apparatus and a cutting method. More specifically, the present invention relates to a sheet cutting device and a cutting method. The present invention relates to a sheet cutting apparatus and a cutting method that do not cause cracking or the like by applying an unintended deformation force to the plate-like member when the protruding sheet portion is cut and removed.

  Conventionally, in a wafer processing step, for example, back surface grinding is performed with a protective sheet applied to protect the circuit surface, and then a heat-sensitive adhesive die bonding sheet is applied to the back surface side. It has been broken.

  4 to 7 are general process sectional views in which a protective sheet is attached to one surface (circuit surface) of a wafer and a die bonding sheet is attached to the other surface (back surface). As shown in FIG. 4, when the protective sheet S is pasted on the wafer W before the back surface grinding, the wafer W is attracted to the first table 50 for sheet pasting so that the circuit surface is on the upper surface side. The belt-shaped protective sheet S that is held and has a width that protrudes from the outer edge of the wafer W is supplied to the circuit surface, and the protective sheet S presses the adhesive layer A by pressing the protective sheet S while rotating a pressing roller (not shown). It is pasted through. Incidentally, the wafer W at this stage is generally a wafer whose outer periphery is chamfered so that the central portion in the thickness direction is the largest dimension and has a substantially arcuate curved surface in cross-sectional view.

  After affixing the protective sheet S to the wafer W, the cutter blade 53 descends in a substantially vertical posture from above, and the tip is inserted into the circumferential groove 55 formed in the first table 50 through the surface of the protective sheet S. In this state, the cutter blade 53 and the wafer W are relatively rotated in a plane, whereby a closed-loop cut is formed in the protective sheet S so as to match the shape of the wafer W. Then, the protective sheet portion that protrudes from the outer edge of the wafer W is removed as an unnecessary sheet portion S1, whereby the application of the protective sheet S is completed.

  As shown in FIG. 5, the wafer W to which the protective sheet S is attached is reversed and transferred to the second table 56 for grinding, and the plate thickness of the order of several tens μm is obtained by the grinder 57 from the back side. So that it is ground. In such a state where the grinding is finished, the outer peripheral portion of the protective sheet S protrudes from the outer edge of the wafer W because the thickness of the wafer W is processed to an extremely thin level.

  After the back-ground grinding wafer W is transferred to the third table 60 for sheet pasting with the ground side being the upper surface side, a band-shaped die bonding sheet DS having a width protruding from the outer edge of the wafer W is pasted. Then, the wafer W is cut in accordance with the shape of the wafer W. At this time, the cutter blade 62 is inserted in a substantially vertical posture so as to be positioned in the circumferential groove 61 formed in the third table 60. In this state, the cutter blade 62 and the wafer W are relatively rotated in a plane. The die bonding sheet DS and the protective sheet S are formed in a closed loop shape so as to match the shape of the wafer W, and the die bonding sheet DS portion that protrudes outside the outer edge of the wafer W is removed as an unnecessary sheet portion DS1, Thereby, sticking of the die bonding sheet DS is completed.

  However, as shown in FIG. 6, the cutter blade 62 performs the above-described cutting with the insertion amount penetrating the protective sheet S, so that the outer peripheral portion S2 of the protective sheet S is cut off and becomes dust and left in the apparatus. This causes an inconvenience that the next wafer is processed and becomes an obstacle, and the wafer is damaged. In addition, the troublesome work of taking out the cut outer peripheral portion S2 from the apparatus is inevitable.

Therefore, as shown in FIG. 7, when cutting with the cutter blade 62, it is conceivable to cut only the die bonding sheet DS by reducing the insertion amount of the cutter blade 62. In this case, 8, when cutting is completed, the unnecessary sheet portion DS1 of the die bonding sheet DS located outside the outer edge of the wafer W falls by its own weight and adheres to the adhesive layer A of the protective sheet S. It often happens.
In such a case, as shown in FIG. 9, when the unnecessary sheet portion DS1 of the die bonding sheet DS is removed, a force acts to simultaneously lift the protective sheet S adhered to the unnecessary sheet portion DS1. This causes a disadvantage that the wafer W is lifted and broken.

  By the way, Patent Literature 1 discloses a configuration in which a protective sheet is cut with a cutter blade so as to conform to the shape of the wafer after a protective sheet is attached to the circuit surface of the wafer held by suction on the table. At this time, the cutter blade is set to an insertion amount that enters a circumferential groove formed in the table, and is configured to perform cutting while maintaining an inclined posture.

Japanese Patent No. 3545758

  However, in Patent Document 1, the protective sheet is inclined so that the outer periphery of the protective sheet does not protrude from the outer periphery of the wafer. For example, the protective sheet is attached to the circuit surface side with another apparatus, as shown in FIG. If this is applied to a cut wafer with a protective sheet applied to a die bonding sheet on the back side to cut the die bonding sheet, the outer periphery of the protective sheet will also be cut. In addition, it is impossible to avoid the generation of dust due to the above, and inconvenience that the cut-off protective sheet portion must be removed from the apparatus.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to apply a second sheet on the opposite surface of the plate-like member to which the first sheet is attached, and cut it. It is an object of the present invention to provide a sheet cutting apparatus and a cutting method that cut the second sheet so that the second sheet does not adhere to the first sheet and do not cause unnecessary dust.

In order to achieve the above object, the present invention provides a plate-like member having a first sheet affixed on one surface thereof placed on a table so that the first sheet is on the lower surface side. A second sheet having a size that protrudes outside the outer edge of the plate-like member is attached to the other surface of the member, and the second sheet is matched with the shape of the plate-like member and cut with a cutter blade. In the sheet cutting device to
The cutter blade is located on the second sheet side and is opposed to the table, and the tip is cut off the second sheet in an inclined posture located outside the plate-like member with respect to the base,
The structure is adopted.

In the present invention, the plate-like member having the first sheet affixed on one surface is placed on the table so that the first sheet is on the lower surface side, and the other surface of the plate-like member is placed. A sheet cutting device for attaching a second sheet having a size that protrudes outside the outer edge of the plate-like member and cutting the second sheet with a cutter blade in accordance with the shape of the plate-like member ,
The cutter blade is located on the table side and is opposed to the second sheet, and has a configuration in which the tip is cut in an inclined posture where the tip is located inside the plate-like member with respect to the base. It can also be taken.

In the present invention, the first sheet has a size such that the outer edge of the first sheet protrudes outside the outer edge of the plate-shaped member,
The angle of inclination of the cutter blade can be set to an angle at which the outer unnecessary sheet portion produced by the cutting falls and does not adhere to the first sheet after the second sheet is cut.

  Further, the cutter blade is maintained in an insertion amount for cutting the second sheet without cutting the first sheet.

Furthermore, the present invention is such that after grinding the back side of a semiconductor wafer having a protective sheet affixed to the circuit side, it is placed on a table so that the back side of the semiconductor wafer becomes the top side. In a sheet cutting device that attaches a die bonding sheet having a size that protrudes to the outside and cuts the die bonding sheet with a cutter blade in accordance with the shape of the semiconductor wafer,
The cutter blade has a configuration in which after the die bonding sheet is cut, the outer unnecessary sheet portion generated by the cutting is kept in an inclined posture so as not to adhere to the protective sheet.

In the present invention, the plate-like member having the first sheet affixed on one surface is placed on the table so that the first sheet is on the lower surface side, and the other surface of the plate-like member is placed. A sheet cutting method in which a second sheet having a size that protrudes outward from the outer edge of the plate-like member is attached, and the second sheet is cut with a cutter blade in accordance with the shape of the plate-like member. ,
When the cutter blade is lowered from above the second sheet to cut the second sheet, the tip of the cutter blade is kept in an inclined posture located outside the plate-like member from the base,
Next, the cutter blade and the plate-like member are rotated relative to each other while maintaining the inclined posture to cut the second sheet into a closed loop shape, and the unnecessary sheet portion outside is adhered to the first sheet at the time of cutting. The method of keeping it so that there is no.

Further, according to the present invention, the plate-like member having the first sheet affixed on one surface is placed on the table so that the first sheet is on the lower surface side, and the other surface of the plate-like member is placed. A sheet cutting method in which a second sheet having a size that protrudes outward from the outer edge of the plate-like member is attached, and the second sheet is cut with a cutter blade in accordance with the shape of the plate-like member. ,
When cutting the second sheet with the cutter blade facing the second sheet from the table side, the tip of the cutter blade is kept in an inclined position positioned inside the plate-like member with respect to the base. ,
Next, the cutter blade and the plate-like member are rotated relative to each other while maintaining the inclined posture to cut the second sheet into a closed loop shape, and the unnecessary sheet portion outside is adhered to the first sheet at the time of cutting. It is also possible to adopt a method in which there is no problem.

  According to the present invention, when the second sheet is applied to the opposite side of the plate-like member to which the first sheet is applied and the cutter blade is cut with the cutter blade, the cutter blade is maintained in an inclined posture. In addition to being able to realize cutting according to the shape of the shaped member, it is possible to prevent the unnecessary sheet portion in the second sheet caused by cutting from falling due to its own weight, thereby preventing adhesion to the first sheet It becomes possible to prevent the plate-like member from being cracked when the unnecessary sheet portion is removed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 to 3 are sectional views showing a cutting process according to the present embodiment. In these drawings, a protective sheet S as a first sheet is attached to the lower surface side (circuit surface side), which is one surface of a wafer W as a plate-like member, via an adhesive layer A, and the protection is performed. In a state where the sheet S is positioned on the lower surface side of the wafer W, the sheet S is held by suction on a table 10 that can be heated by a heater (not shown). The wafer W is subjected to back grinding and processed to a thickness of the order of several tens of μm. Therefore, the protective sheet S is in a state of protruding from the outer edge of the wafer W.

  A die bonding sheet DS as a second sheet is fed out on the back side (upper side) which is the other side of the wafer W, and is stuck by a pressing force of a pressing roller (not shown). The die bonding sheet DS has a belt shape with a width that protrudes from the outer edge of the wafer W, and is drawn out and pasted along the upper surface of the wafer W via a sheet feeding device (not shown), and the wafer generated by cutting described later. The die bonding sheet DS portion on the outer peripheral side is recovered as an unnecessary sheet portion DS1.

  The die bonding sheet DS is cut by the cutter blade 11 in accordance with the shape of the wafer W from above the die bonding sheet DS side. In this embodiment, the cutter blade 11 is attached to the tip of an articulated robot arm (not shown), and cutting is performed by setting a movement locus in advance along the outer edge of the wafer W. At this time, the orientation, angle, and the like of the cutter blade 11 are kept adjustable by the robot arm. As shown in FIG. 1, when the cutter blade 11 starts cutting, the tip 11A of the cutter blade 11 is maintained at an inclination angle α located outside the wafer W with respect to the base portion 11B. The inclination angle α is such that the unnecessary sheet portion DS1 of the die bonding sheet, which is produced by cutting the die bonding sheet DS along the outer periphery of the wafer W in a closed loop shape, falls due to its own weight and adheres to the adhesive layer A of the protective sheet S. It is set so that a resistance that does not occur can be generated between the cut end faces. In the present embodiment, the inclination angle α is set to 45 ° (see FIG. 2). Further, in the present embodiment, the protective sheet S is not cut by maintaining the above-described inclination angle α. In the state of FIG. 1, when the inclination angle α is increased, the cutter blade 11 can penetrate the outer peripheral portion of the protective sheet S. In this case, the amount of insertion of the cutter blade 11 is reduced and the protective sheet is inserted. By setting so as not to reach the adhesive layer A of S, cutting of the protective sheet S can be avoided even when the inclination angle is changed.

  When the die bonding sheet DS is cut in a closed loop shape along the outer edge of the wafer W by the cutter blade 11, an unnecessary sheet portion DS1 is generated on the outer peripheral side of the wafer W, but the unnecessary sheet portion DS1 is not illustrated. It is recovered via a recovery device. When this collection is performed, as shown in FIG. 3, since the unnecessary sheet portion DS1 is not adhered to the adhesive layer A of the protective sheet S, there is no effect of lifting the wafer W upward. Only the unnecessary sheet portion DS1 is pulled upward and removed while maintaining the planar position of the wafer W.

  Therefore, according to such an embodiment, even if the die bonding sheet DS is cut, the die bonding sheet DS does not adhere to the protective sheet S, so that the cause of breaking the wafer W can be avoided. The effect of being able to be obtained.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the case where the protective sheet S is employed as the first sheet and the die bonding sheet DS is employed as the second sheet has been described. Can be changed arbitrarily. Incidentally, instead of the die bonding sheet DS, a heat-sensitive adhesive protective sheet for protecting the surface of the adherend may be used. Moreover, the case where the sheet | seat for protective film formation disclosed by Unexamined-Japanese-Patent No. 2002-280329 and the dry resist film are stuck and cut | disconnected can also be illustrated.

  Further, although the wafer W is targeted as the plate-like member, the plate-like member in the present invention is not limited to the semiconductor wafer W, and other plate-like members such as glass, steel plate, or resin plate are also targeted. The semiconductor wafer may be a silicon wafer or a compound wafer. Further, the plate-like member is not limited to a circular shape, and may be a polygonal shape.

Further, in the above-described embodiment, the cutter blade 11 is provided on the die bonding sheet DS side and at a position facing the table 10, and the cutting is performed in an inclined posture in which the tip 11A is located outside the wafer W with respect to the base 11B. For example, as shown in FIG. 10, the cutter blade 11 is positioned on the table 10 side and is opposed to the die bonding sheet DS, and the tip 11A is positioned on the inner side of the wafer W with respect to the base 11B. It may be an inclined posture. More specifically, as shown in FIG. 10, the table 10 has a two-part configuration of an inner table 10A and an outer table 10B. The inner table 10A has an upper surface as an adsorption holding surface and is configured as a heater built-in type, and is fixed by a table stand 20 that hangs down from the center on the lower surface side. On the other hand, the outer table 10 </ b> B includes a block 21 having a substantially ring shape in plan view surrounding the inner table 10 </ b> A and a plate 22 that supports the block 21. A sleeve 25 surrounding the table stand 20 is suspended from the center of the lower surface side of the plate 22, and the outer table 10 </ b> B is rotatably provided by being connected to a driving means such as a motor (not shown). A cutter blade 11 is attached to a predetermined position of the outer table 10B so as to be able to advance and retract by a cylinder 26, and the die bonding sheet DS can be cut by rotating the outer table 10B with the cutter blade 11 protruding upward. It is like that.
Therefore, the same effect as that of the above-described embodiment can be obtained by such a modification.

Sectional drawing which shows the cutting method which concerns on this embodiment. Sectional drawing which shows the state at the time of completion | finish of a cutting | disconnection. Sectional drawing which shows the state which removes the unnecessary sheet | seat part of a 2nd sheet | seat. Sectional drawing which shows the prior art example which cut | disconnects the protection sheet affixed on the semiconductor wafer. Sectional drawing which shows the prior art example which ground the back surface of the semiconductor wafer. Sectional drawing which shows the prior art example which affixes a die bonding sheet | seat on the back surface of a ground semiconductor wafer, and cut | disconnects. Sectional drawing which shows the other prior art example which affixes and cut | disconnects a die bonding sheet | seat on the back surface of the ground semiconductor wafer. Sectional drawing which shows the state which a die bonding sheet | seat falls by dead weight at the time of completion | finish of cutting | disconnection, and adhere | attaches on the adhesive layer of a protection sheet. Sectional drawing which shows the cause of a crack of a semiconductor wafer. Sectional drawing similar to FIG. 1 which shows a modification.

Explanation of symbols

10 table 11 cutter blade 11A tip 11B base W wafer (plate-like member)
S protection sheet (first sheet)
DS die bonding sheet (second sheet)
α Inclination angle

Claims (7)

A plate-like member having the first sheet attached to one surface is placed on a table so that the first sheet is on the lower surface side, and the plate-like member is placed on the other surface of the plate-like member. In a sheet cutting device for applying a second sheet having a size protruding outside the outer edge of the sheet and cutting the second sheet with a cutter blade in accordance with the shape of the plate-like member,
The cutter blade is located on the second sheet side and is opposed to the table, and cuts the second sheet in an inclined posture in which a tip is positioned outside the plate-like member with respect to a base portion. Sheet cutting device to do. A plate-like member having the first sheet attached to one surface is placed on a table so that the first sheet is on the lower surface side, and the plate-like member is placed on the other surface of the plate-like member. In a sheet cutting device for applying a second sheet having a size protruding outside the outer edge of the sheet and cutting the second sheet with a cutter blade in accordance with the shape of the plate-like member,
The cutter blade is located on the table side and is opposed to the second sheet, and cuts the second sheet in an inclined posture in which a tip is located inside the plate-like member with respect to a base. Sheet cutting device to do. The first sheet has a size such that an outer edge of the first sheet protrudes outside an outer edge of the plate-shaped member,
The inclination angle of the cutter blade is set to an angle at which an outer unnecessary sheet portion generated by the cutting falls and does not adhere to the first sheet after the second sheet is cut. The sheet cutting device according to claim 1 or 2. The sheet cutting device according to claim 1, wherein the cutter blade is maintained at an insertion amount for cutting the second sheet without cutting the first sheet. After grinding the back side of a semiconductor wafer with a protective sheet affixed to the circuit side, it is placed on the table so that the back side of the semiconductor wafer becomes the top side and protrudes outside the outer edge of the semiconductor wafer. In a sheet cutting device that attaches a die bonding sheet with a die cutting sheet and cuts it with a cutter blade in accordance with the shape of the semiconductor wafer,
The cutter blade is maintained in an inclined posture in which, after cutting the die bonding sheet, an unnecessary outer sheet portion generated by the cutting is dropped and does not adhere to the protective sheet. A plate-like member having the first sheet attached to one surface is placed on a table so that the first sheet is on the lower surface side, and the plate-like member is placed on the other surface of the plate-like member. In a sheet cutting method in which a second sheet having a size protruding outside the outer edge of the sheet is pasted and the second sheet is cut with a cutter blade in accordance with the shape of the plate member,
When the cutter blade is lowered from above the second sheet to cut the second sheet, the tip of the cutter blade is kept in an inclined posture located outside the plate-like member from the base,
Next, the cutter blade and the plate-like member are rotated relative to each other while maintaining the inclined posture to cut the second sheet into a closed loop shape, and the unnecessary sheet portion outside is adhered to the first sheet at the time of cutting. The sheet cutting method is characterized in that the sheet is kept so as not to exist. A plate-like member having the first sheet attached to one surface is placed on a table so that the first sheet is on the lower surface side, and the plate-like member is placed on the other surface of the plate-like member. In a sheet cutting method in which a second sheet having a size protruding outside the outer edge of the sheet is pasted and the second sheet is cut with a cutter blade in accordance with the shape of the plate member,
When cutting the second sheet with the cutter blade facing the second sheet from the table side, the tip of the cutter blade is kept in an inclined position positioned inside the plate-like member with respect to the base. ,
Next, the cutter blade and the plate-like member are rotated relative to each other while maintaining the inclined posture to cut the second sheet into a closed loop shape, and the unnecessary sheet portion outside is adhered to the first sheet at the time of cutting. The sheet cutting method is characterized in that the sheet is kept so as not to exist.

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