JP2007157623A - Manufacturing device of display device, manufacturing method of display device and substrate of display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing device of a display device capable of positioning with high precision between a substrate with a pattern formed to form a display part and the positioning member, and also, provide a manufacturing method capable of highly precisely positioning between the substrate and the positioning member used for the display device without having complicated processes. <P>SOLUTION: The manufacturing device 100 of a display device is to be faced a substrate 2 formed a pattern 24 to form a display part to a positioning member (mask 3), and carries out positioning between the pattern 24 and the mask 3. The substrate 2 has a light acceptance element part 21 having an output function at a predetermined position of a position relation with the pattern 24. A mask 3 includes a translucent part 32 for positioning. The manufacturing device 100 includes a light source 4 with position relation fixed with a light acceptance element part 21 or a translucent part 32, and capable of emitting light to the light acceptance element part 21 through the translucent part 32. The manufacturing device 100 includes a positioning control means (a relative position driving part 5 or a control part 8) carrying out position control between the substrate 2 and the mask 3 based on an output of the light acceptance element part 21. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a display device manufacturing apparatus, a display device manufacturing method, and a display device substrate.

A position control method for a substrate and a deposition mask in a manufacturing process of a conventional display device, for example, an organic EL panel will be described.
In a general organic EL panel manufacturing process, a process of forming a lower electrode on a support substrate (substrate), a process of cleaning the support substrate (substrate), a process of forming an insulating film or a partition, pre-deposition treatment, organic A layer forming step (pattern forming step), a step of forming an upper electrode, a sealing step (bonding step), and the like are sequentially performed.
In the organic layer formation step (pattern formation step) described above, the support substrate (substrate) that has been pre-deposited is transported into a deposition apparatus (position control apparatus), and a deposition mask is placed between the deposition source and the support substrate. After arranging and positioning the evaporation mask and the substrate, an organic layer (pattern) is formed by evaporation. Since the opening formed in the vapor deposition mask corresponds to the organic EL element formation region formed on the substrate, it is necessary to adjust the position with high accuracy between the substrate and the mask.

  For example, Patent Document 1 discloses a vapor deposition apparatus having a positioning function. For example, as shown in FIG. 1, this apparatus captures an alignment mark 102 formed on a transparent substrate (substrate) 101 and an alignment opening 104 formed on a deposition mask (mask) 103 with a camera 105. Then, the position adjustment between the substrate 101 and the mask 103 is performed based on the photographing result. After the position adjustment, the vapor deposition material 109 evaporated from the vapor deposition source 107 in the vacuum chamber 106 is vapor deposited on the substrate 101 through the pattern forming opening 108 of the mask 103.

JP 2004-183044 A

  However, in the above-described apparatus, position adjustment is performed based on an image obtained by camera shooting. For example, when the alignment mark 102 on the support substrate side is soiled with a resist or the like, misalignment occurs and misalignment occurs. Accuracy may be reduced. If the accuracy of this position adjustment is low, a film formation failure may occur during film formation, and a display failure or the like may occur on the final display panel. Further, there is a problem that the position adjustment by the camera photographing is limited to the transparent substrate. In order to increase the detection accuracy of the alignment mark 102, a method of forming the alignment mark 102 with a highly reflective metal material is known. For example, when an insulating film or a partition wall is formed on a substrate by a photolithography process. However, since the alignment mark 102 is contaminated with a resist or the like, there is a problem that an extra step for removing the dirt is required. Even when the substrate 101 is made of a material having translucency or reflectivity, the accuracy of image recognition of the alignment mark 102 may be lowered, and the accuracy of position adjustment may be lowered. In addition, if the alignment mark 102 is formed to be relatively small in order to adjust the position with high accuracy, the alignment mark 102 is easily affected by dirt.

  This invention makes it an example of a subject to cope with such a problem. That is, it is possible to provide a display device manufacturing apparatus capable of highly accurately aligning a substrate used in a display device and a member to be aligned, and a substrate used in the display device and a position without performing a complicated process. The present invention provides a method for manufacturing a display device capable of aligning with an alignment member with high accuracy, alignment with an alignment target member with high accuracy even for an opaque substrate, and the like. Is the purpose.

In order to achieve such an object, the present invention comprises at least the configurations according to the following independent claims.
According to the first aspect of the present invention, there is provided a display device for aligning the pattern and the member to be aligned by causing the member to be aligned to face a substrate on which a pattern for forming a display unit is formed. The substrate is provided with a light receiving element portion having an output function at a position where a positional relationship with the pattern is defined in advance, and the member to be aligned has a light transmitting portion for alignment. Then, a positional relationship with the light receiving element part or the light transmitting part is fixed, a light source capable of irradiating light to the light receiving element part through the light transmitting part is provided, and based on the output of the light receiving element part, It has a position control means for controlling the position of the substrate and the member to be aligned.

  According to a tenth aspect of the present invention, there is provided a display device for aligning the pattern and the member to be aligned by causing the member to be aligned to face a substrate on which a pattern for forming a display unit is formed. In the method, the substrate has a light receiving element portion having an output function formed at a position where a positional relationship with the pattern is defined in advance, and is formed on the light receiving element portion or the aligned member. A step of irradiating light to the light receiving element portion through the light transmitting portion from a light source whose positional relationship with the light transmitting portion for alignment is fixed, and based on the output of the light receiving element portion, the substrate and the And a step of performing position control with the member to be aligned.

  According to a fifteenth aspect of the present invention, there is provided a display device substrate in which a pattern for forming a display portion is formed, and the pattern and the alignment target member are aligned. A light receiving element portion having an output function is formed at a position where the positional relationship is defined in advance.

An apparatus for manufacturing a display device according to an embodiment of the present invention performs alignment between a pattern and a member to be aligned by causing the member to be aligned to face a substrate on which a pattern for forming a display unit is formed. . On this substrate, a light receiving element portion having an output function is formed at a position where the positional relationship with the pattern is defined in advance. Further, the member to be aligned has a translucent part for alignment. Further, a positional relationship with the optical element portion or the light transmitting portion is fixed, and a light source capable of irradiating light to the light receiving element portion through the light transmitting portion is provided. The manufacturing apparatus has position control means for performing position control of the substrate and the member to be aligned based on the output of the light receiving element unit.
In the display device manufacturing apparatus having the above-described configuration, the position control unit controls the position of the substrate and the member to be aligned based on the output of the light receiving element unit. Can be aligned.

In the manufacturing method of the display device according to the embodiment of the present invention, the alignment member is faced to the substrate on which the pattern for forming the display portion is formed, and the pattern and the alignment member are aligned. It is a manufacturing method of a display device. In the substrate, a light receiving element portion having an output function is formed at a position where a positional relationship with the pattern is defined in advance. The manufacturing method includes irradiating light to the light receiving element portion through the light transmitting portion from a light source having a fixed positional relationship with the light transmitting element portion or the light transmitting portion for alignment formed on the member to be aligned. And a step of controlling the position of the substrate and the alignment member based on the output of the light receiving element portion.
As described above, since the position control between the substrate and the member to be aligned is performed based on the output of the light receiving element portion, the position control can be performed with high accuracy.

A substrate of a display device according to an embodiment of the present invention is a substrate of a display device in which a pattern for forming a display portion is formed and the pattern and a member to be aligned are aligned. In this substrate, a light receiving element portion having an output function is formed at a position where the positional relationship with the pattern is defined in advance.
The substrate having the above configuration can be aligned with the member to be aligned with high accuracy by the manufacturing apparatus and the manufacturing method.
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 2 is a view for explaining the manufacturing apparatus 100 for manufacturing the display device according to the first embodiment of the present invention. The vapor deposition apparatus that employs the production apparatus according to the present embodiment is an apparatus for vapor-depositing various vapor deposition materials on a substrate, and can be used, for example, for production of a display device for an organic EL panel. The manufacturing apparatus according to the present invention is not limited to the above-described embodiment. The manufacturing apparatus according to the present invention can be employed in an assembly apparatus that performs alignment between a plurality of members.
A display device manufacturing apparatus 100 according to the present embodiment includes, as shown in FIG. 2, for example, a substrate 2, a mask 3, a light source 4, a relative position driving unit 5, a device-side terminal unit (terminal unit) 6, a vapor deposition source 7, And a control unit 8.

  The substrate 2 corresponds to an embodiment of the substrate according to the present invention. The mask 3 corresponds to an embodiment of an alignment member and a film formation mask according to the present invention. The light source 4 corresponds to an embodiment of the light source according to the present invention. The relative position driving unit 5 corresponds to an embodiment of relative position driving means according to the present invention. The terminal portion 6 corresponds to an embodiment of the device side terminal portion according to the present invention. The vapor deposition source 7 corresponds to an embodiment of the vapor deposition source according to the present invention. The relative position drive unit 5 and the control unit 8 correspond to an embodiment of the position control means according to the present invention. The control unit 8 corresponds to an embodiment of a control circuit according to the present invention. The relative position driving unit 5 corresponds to an embodiment of relative position driving means according to the present invention.

The board | substrate 2 which concerns on this embodiment is a member used for the display apparatus aligned with a to-be-aligned member, for example. The substrate 2 according to this embodiment is a substrate on which display elements such as a substrate on which an organic EL element is formed, a substrate on which a liquid crystal is formed, a substrate on which a PDP is formed (position adjustment with a mask is performed during film formation). And the like can be used for a substrate constituting a display device (display panel).
In addition, the substrate 2 is a substrate on which a pigment is transferred or patterned to form a color filter, or a substrate used when patterning a metal wiring by photolithography (position with a photomask at the time of transfer or exposure). Adjustment). The substrate 2 may be employed as a substrate or a resin film that requires alignment, such as a substrate used when a flexible substrate such as COG (Chip on Glass) is bonded. In addition, the substrate 2 can be used for various substrates such as a substrate when a substrate on which a display element is formed and a member that protects the display element are bonded together.

For example, as shown in FIG. 2, the substrate 2 includes a light receiving element portion 21, a substrate-side terminal portion (terminal portion) 22, a pattern formation region 23, and a pattern 24.
The light receiving element portion 21 corresponds to an embodiment of the light receiving element portion according to the present invention. The board | substrate side terminal part (terminal part) 22 is corresponded to one Embodiment of the board | substrate side terminal part of this invention. The pattern formation region 23 corresponds to an embodiment of the display unit according to the present invention. The pattern 24 corresponds to an embodiment of the pattern according to the present invention. In the pattern formation region 23, a pattern 24 according to the present invention is formed in advance. This pattern 24 is a pattern for forming a display portion of the display device, and is formed on the substrate 2 in advance before alignment. The pattern 24 and the member to be aligned are aligned.

The light receiving element portion 21 is formed at a predetermined position on the substrate 2. Specifically, in the light receiving element portion 21, a light receiving element portion having an output function is formed at a position where the positional relationship with the pattern is defined in advance. Specifically, the light receiving element portion 21 is formed in a region other than the pattern formation region 23, for example, in the vicinity of the pattern formation region 23. In the present embodiment, as shown in FIG. 2, the plurality of light receiving element portions 21 are formed in the vicinity of the end portion of the substrate 2, preferably in the corner portions of the substrate 2, separated by a specified distance. At this time, the positioning accuracy in the in-plane direction of the substrate 2 is higher as the light receiving element portions 21 are separated from each other.
As will be described later, the light receiving element unit 21 receives light from the light source 4 through the mask 3 and outputs a signal corresponding to the light reception result. The light receiving element portion 21 is formed on the substrate 2 at a position corresponding to an alignment mark (translucent portion) 32 formed on the mask 3 as will be described later. That is, the light receiving element portion 21 has a function of detecting the alignment mark (translucent portion) 32 formed at the specified position of the mask 3.
As the light receiving element portion 21, various light receiving elements (photoelectric elements) such as a semiconductor light receiving element, for example, an image sensor such as a photodiode, a phototransistor, a charge coupled device (CCD), and a complementary metal-oxide semiconductor (CMOS) sensor. Conversion element) can be employed.
The light receiving element portion 21 may have one light receiving element portion 21 formed in a predetermined region on the substrate 2 or a plurality of light receiving elements in a predetermined region on the substrate 2. The portion 21 may be formed in various shapes such as an array shape and a matrix shape. By providing the plurality of light receiving element portions 21 having the above-described configuration, position detection can be performed with high accuracy based on the result of light received from the light source 4 through the mask 3, and as a result, alignment is performed with high accuracy. be able to.
The light receiving element portion 21 is formed on the substrate 2 by various manufacturing processes such as a film forming process such as a photolithography process, an etching process, a sputtering method, a vacuum deposition method, and a CVD method. At this time, the light receiving element portion 21 is formed on the substrate 2 by a photolithography process, an etching process, or the like corresponding to the pattern formation process. The light receiving element portion 21 is not limited to this form. For example, the light receiving element portion 21 such as a photodiode or a phototransistor previously formed separately from the substrate 2 may be formed by adhering to a predetermined position on the substrate 2 with an adhesive or the like.

The terminal portion 22 is a conductive portion electrically connected to the light receiving element portion 21 as an output function of the light receiving element portion 21, and is formed on the substrate 2. The terminal portion 22 is a terminal formed so that one end is electrically connected to the light receiving element portion 21 and the other end is connectable to an external device. The terminal portion 22 made of the conductive material is formed by various manufacturing processes such as a photolithography process, an etching process, a film forming process such as a sputtering method, a vacuum deposition method, and a CVD method. For example, as shown in FIG. 2, the terminal portion 22 is formed in the vicinity of the light receiving element portion 21, and is formed along the side in the vicinity of the end portion of the substrate 2.
The pattern formation region 23 is a region where the pattern 24 for forming the display unit of the display device is formed as described above. For example, in the pattern formation region 23, various patterns such as a lower electrode of the display unit are formed in advance. Further, for example, the pattern forming region 23 is made of various materials such as an organic EL layer, a conductive layer, an insulating layer, and a semiconductor layer by a film forming method such as sputtering, vacuum deposition, CVD, or ion plating in the pattern region. A layer is deposited.

A method of manufacturing the substrate 2 having the above configuration will be briefly described. First, as shown in FIG. 2, a pattern 24 is formed in a predetermined position on the substrate 2, specifically, in a pattern formation region 23. The pattern 24 is formed by various manufacturing processes such as a photolithography process etching process, a film forming process such as a sputtering method, a vacuum deposition method, and a CVD method.
Next, the light receiving element portion 21 and the terminal portion 22 are formed corresponding to the pattern 24 forming step. The light receiving element portion 21 and the terminal portion 22 are formed by various manufacturing processes such as a photolithography process or an etching process, a film forming process such as a sputtering method, a vacuum deposition method, and a CVD method. For example, when a photodiode is employed as the light receiving element portion 21, a lower electrode, an n-type semiconductor, a p-type semiconductor, an upper electrode, a protective film, and the like are stacked on the substrate 2 by various manufacturing methods to form the light receiving element portion 21. Form. The light receiving element portion 21 and the terminal portion 22 may be formed at the same time, or may be formed in separate steps. The light receiving element portion 21 and the terminal portion 22 may be formed simultaneously with the pattern formation or may be formed in separate steps. The substrate 2 can be easily obtained by the above manufacturing method.

The mask 3 according to this embodiment is a member to be aligned with the substrate 2. The mask 3 according to the present embodiment is a film formation mask, for example, a so-called deposition mask (shadow mask). The mask 3 is disposed between the light source 4 and the substrate 2. The mask 3 includes a shielding part 31, a translucent part (alignment mark) 32, and a pattern forming opening 33.
The mask 3 is made of various materials such as a metal material and a resin material. When the mask 3 according to the present embodiment is employed as, for example, a vapor deposition mask, the shielding unit 31 shields the vapor deposition material from the vapor deposition source from the mask 3. The shielding unit 31 has a function of shielding the light emitted from the light source 4 from the substrate 2. The translucent part 32 serves as an index for positioning with other members in the manufacturing process. Specifically, the light transmitting part 32 is formed at a predetermined position of the mask 3, for example, a position corresponding to the light receiving element part 21 of the substrate 2, and transmits at least light emitted from the light source 4. Specifically, the light transmitting portion 32 may be formed of a material that transmits light emitted from the light source 4 or may be a through hole portion (light transmitting hole portion). The pattern forming opening 33 is a through hole formed corresponding to the shape of the vapor deposition pattern formed on the substrate 2 when the mask 3 is employed as a vapor deposition mask, for example.

  The light source 4 is a light source that emits light (alignment light) for alignment between the first member (substrate 2) and the second member (mask 3). Specifically, the light source 4 has a fixed positional relationship with the light receiving element portion 21 or the light transmitting portion 32, and can irradiate light to the light receiving element portion 21 through the light transmitting portion 32. As the light source 4, for example, a light output device that outputs various kinds of light such as laser light having a specific wavelength (specific frequency), incandescent light, or light obtained by collecting sunlight can be adopted. For example, when the light source 4 employs a photodiode composed of an n-type semiconductor and a p-type semiconductor as the light receiving element portion 21, the alignment output from the light source 4 is larger than the semiconductor band gap of the light receiving element portion 21. It is set so that the energy of light is not large. The light source 4 preferably emits light that can be distinguished from external light such as light having a predetermined wavelength (or frequency) or pulse light having a predetermined pulse length. By doing so, the light receiving element portion 21 can distinguish between the light from the light source 4 and the outside light, and the alignment accuracy can be improved.

  The relative position driving unit 5 adjusts the relative position between the substrate 2 and the mask 3 under the control of the control unit 8, for example. Specifically, the relative position driving unit 5 supports the substrate 2 and the mask 3 and adjusts the position of the relative position between the substrate 2 and the mask 3 based on a control signal from the control unit 8. For example, the relative position driving unit 5 can relatively move the substrate 2 and the mask 3 along the in-plane direction, specifically along the x-axis direction and the y-axis direction. Further, the relative position driving unit 5 can further rotate, for example, the substrate 2 and the mask 3 relative to each other. Moreover, the relative position drive part 5 may be comprised, for example so that the board | substrate 2 and the mask 3 can be relatively moved along a z-axis direction.

The terminal portion 6 is formed such that one end thereof can be electrically connected to the terminal portion 22 formed on the substrate 2, and the other end portion is connected to the control unit 8.
The vapor deposition source 7 includes a storage container that stores the vapor deposition material and a heating unit that heats the vapor deposition material. For example, the heating unit is controlled by the control unit 8.

The control unit 8 controls the entire apparatus as a whole to realize the functions according to the present invention. The control unit 8 drives the relative position driving unit 5 so that the substrate 2 and the mask 3 are in a predetermined relative position based on the light reception result by the light receiving element unit 21, for example. Adjust the relative position of.
When determining the relative position between the substrate 2 and the mask 3, the control unit 8 fixes the substrate 2 and the mask 3 while maintaining the relative positional relationship.

As the relative position control by the control unit 8, it is preferable to perform optimal control as appropriate according to various conditions.
FIG. 3 is a diagram for explaining the operation of the control unit 8 of the manufacturing apparatus 100 shown in FIG. The horizontal axis indicates the relative position r between the substrate 2 and the mask 3, and the vertical axis indicates the light reception intensity of the light reception result by the light receiving element unit 21. 3A and 3B are diagrams showing the received light intensity distribution Ip1 with respect to the relative position between the substrate 2 and the mask 3. FIG.
For example, as shown in FIG. 3A, when the control unit 8 obtains the light reception intensity Ip2 at the relative position ra as a result of light reception by the light receiving element unit 21, the light reception intensity Ip3 specified in advance is obtained. The relative position drive unit 5 is controlled. In the received light intensity distribution Ip3, the received light intensity has a maximum peak at the relative position rb as shown in FIG.

  Further, as shown in FIG. 3B, the control unit 8 drives the relative position driving unit 5 based on the result of light reception by the light receiving element unit 21 so that the light reception intensity I becomes the maximum peak value Id, for example. For example, when the received light intensity Ic is obtained at the relative position rc, the control unit 8 controls the relative position driving unit 5 to adjust the relative position r between the substrate 2 and the mask 3 so that the received light intensity I is increased. When the maximum light receiving intensity Id is obtained at the relative position rd, the relative positional relationship between the substrate 2 and the mask 3 is fixed at the relative position rd.

  Further, the control unit 8 may perform position control between the substrate 2 and the mask 3 so that the relative position corresponding to the middle of the half-value width of the maximum reception intensity is based on the result of light reception by the light receiving element unit 21. . Specifically, for example, as shown in FIG. 3B, the control unit 8 specifies the relative positions re and rf corresponding to the half value Idh of the maximum light receiving intensity Id, and sets the intermediate position rg between the specified positions re and rf. The substrate 2 and the mask 3 may be relatively fixed.

  In addition, the control unit 8 slightly moves the substrate 2 for alignment so that the maximum intensity peak can be obtained based on the light reception intensity distribution of the light detected by the light receiving element unit 21 through the light transmitting unit 32 of the mask 3. May be performed.

The operation of the manufacturing apparatus 100 having the above configuration will be described with reference to the drawings.
First, the substrate 2 and the mask 3 are transferred into the manufacturing apparatus 100. A mask 3 is disposed between the substrate 2 and the light source 4. Next, the terminal portion 6 is connected to the terminal portion 22 electrically connected to the light receiving element portion 21 of the substrate 2. Next, the control unit 8 controls the light source 4 to output laser light from the light source 4. The light receiving element portion 21 of the substrate 2 outputs a signal corresponding to the result of light reception. The control unit 8 controls the relative position driving unit 5 based on signals output from the light receiving element unit 21 via the terminal unit 22 and the terminal unit 6. At this time, the control unit 8 outputs a control signal to the relative position driving unit 5 so that the light reception intensity is increased based on the light reception result. The relative position driving unit 5 adjusts the relative position between the substrate 2 and the mask 3 based on a control signal from the control unit 8.

  At this time, as described above, the control unit 8 may control the relative position driving unit 5 based on the signal from the light receiving element unit 21 so as to obtain a predetermined light reception intensity distribution. Further, for example, the control unit 8 may control the relative position driving unit 5 so that the received light intensity received by the light receiving element unit 21 becomes the maximum level. Further, the control unit 8 may specify the half value width of the received light intensity level, and may control the relative position driving unit 5 so as to be an intermediate position of the specified half value width.

  When the substrate 2 and the mask 3 are positioned at predetermined positions as a result of the above control, the control unit 8 controls the relative position driving unit 5 so as to fix the positional relationship between the substrate 2 and the mask 3. . Then, the control unit 8 controls the vapor deposition source 7 to evaporate the vapor deposition material from the vapor deposition source 7. A deposition material from the deposition source 7 is deposited on the pattern formation region 23 on the substrate 2 through the mask 3.

  As described above, the manufacturing apparatus 100 according to the present embodiment allows the alignment target member (mask 3) to face the substrate 2 on which the pattern 24 for forming the display unit of the display device is formed. After aligning 24 and the alignment member, the vapor deposition material from the vapor deposition source 7 is vapor-deposited on the substrate 2 to be vapor-deposited through the mask 3. At this time, the light receiving element portion 21 that receives light from the light source 4 and has an output function (terminal portion 22) is provided on the substrate 2 in a predetermined position on the substrate 2, specifically, a positional relationship with the pattern 24. It is formed at the position. The mask 3 is disposed between the light source 4 and the substrate 2, and the mask 3 includes a light transmitting part 32 as an alignment mark that is formed at a position corresponding to the light receiving element part 21 and transmits light from the light source 4. The manufacturing apparatus 100 includes a light source 4 that is fixed in positional relationship with the light receiving element unit 21 or the light transmitting unit 32 and can irradiate light to the light receiving element unit 21 through the light transmitting unit 32. Since the manufacturing apparatus 100 includes position control means (relative position driving unit 5 and control unit 8) that controls the position of the substrate 2 and the mask 3 based on the output of the light receiving element unit 21, without performing complicated processes. The position of the substrate 2 and the member to be aligned (mask 3) can be controlled with high accuracy.

  Further, by performing film formation in a state where the substrate 2 and the mask 3 are aligned with high accuracy, a film formation pattern can be formed with high accuracy in the pattern formation region 23 of the substrate 2. Further, for example, a film-forming material such as an organic EL layer can be formed with high precision on the pattern 24 such as the lower electrode formed in advance on the substrate 2, so that a high-performance display device can be obtained.

  Further, when forming a film formation pattern on the substrate 2, for example, when forming a film formation layer constituting an organic EL element, the light receiving element portion 21 is formed on the substrate 2 and the light detected by the light receiving element portion 21. Since the alignment between the substrate 2 and the mask 3 is performed based on the intensity distribution, the alignment can be performed with high accuracy even when dirt is attached on the substrate 2. Even if the substrate 2 is a non-transparent substrate, the light receiving element portion 21 is formed on the surface facing the light source 4 (mask 3) to receive light through the light transmitting portion 32 of the mask 3. It is possible to easily perform alignment based on the received light intensity.

Further, the position control means according to the present invention detects the intensity distribution, specifies the intensity peak position, and controls the relative position between the substrate 2 and the mask 3 so as to be the position of the intensity peak. In addition, alignment can be performed with higher accuracy than in a conventional apparatus that performs alignment based on the result of taking an alignment mark with a camera.
In addition, since the light receiving element portion 21 having the output function is provided on the substrate 2, alignment with the member to be aligned (mask 3) can be performed with high accuracy even if the substrate is opaque.

[Second Embodiment]
FIG. 4 is a view for explaining a manufacturing apparatus 100a according to the second embodiment of the present invention. FIG. 5 is a view for explaining the substrate 2a shown in FIG. FIG. 6 is a view for explaining the substrate 2a and the substrate support portion shown in FIG. FIG. 7 is a view for explaining the mask 3a shown in FIG. FIG. 8 is a view for explaining the substrate 2a and the substrate support portion shown in FIG. FIG. 8A is a perspective view for explaining the substrate support portion, and FIG. 8B is a perspective view for explaining the substrate and the substrate support portion. Description of components having the same functions as those of the first embodiment is omitted.

As shown in FIG. 4, the manufacturing apparatus 100a according to this embodiment includes a substrate 2a, a mask 3a, a light source 4, a relative position driving unit 5a, a terminal unit 6a, a vapor deposition source 7, a control unit 8a, a vacuum chamber 10, and a rotation. A drive unit 11 is included. In the present embodiment, the substrate 2 a, the mask 3 a, the light source 4, the relative position driving unit 5 a, the terminal unit 6 a, the vapor deposition source 7, and the rotation driving unit 11 are arranged in the vacuum chamber 10, and the control unit is outside the vacuum chamber 10. 8a is arranged.
The vacuum chamber 10 has an evacuation system including a vacuum pump (not shown), for example, so that the inside can be maintained at a predetermined pressure. A substrate 2a and a mask 3a are disposed in the upper part of the vacuum chamber 10, and a vapor deposition source 7 is disposed below the substrate 2a so as to face the mask 3a.

For example, as shown in FIG. 5, the substrate 2a according to the present embodiment includes a light receiving element portion 21a, a terminal portion 22a, a pattern formation region 23a, and a pattern 24a.
As shown in FIG. 5, the light receiving element portion 21a according to the present embodiment is formed in the vicinity of the end of the substrate 2a, preferably in the vicinity of the corner. For example, four light receiving element portions 21 are formed in the vicinity of the corner portions. In the present embodiment, a photodiode is employed as the light receiving element portion 21a. As shown in FIG. 4, the terminal portion 22a is made of a conductive material and is formed in a substantially L shape on the substrate 2a. One end portion of the terminal portion 22a is electrically connected to, for example, an anode of a photodiode, and the other end portion is formed on the substrate. A first terminal portion 221 formed so as to be disposed at the end portion of 2 and formed in a substantially L shape made of a conductive material on the substrate 2, and one end portion is electrically connected to the cathode of the photodiode; The second terminal portion 222 is formed so that the other end portion is disposed at the end portion of the substrate 2. The pattern formation region 23a is formed with two pattern formation regions 231 and 232 arranged side by side at substantially the center of the substrate 2a. For example, as shown in FIG. 5, the light receiving element portion 21 is formed so that each component, specifically, the light receiving element portion 21a and the terminal portion 22a coincide with each other when rotated 180 degrees in the xy plane. Yes. The pattern 24a is formed in the pattern formation region 23a. The pattern 24a is a pattern for forming a display unit of the display device. In this embodiment, patterns 241 and 242 are formed in the pattern formation regions 231 and 232. The light receiving element portion 21a is formed at a position where the positional relationship with the pattern 24a is defined in advance. With this configuration, the pattern 24a and the member to be aligned (mask 3a) can be aligned with high accuracy.

  As shown in FIG. 7, the mask 3a has a shielding part 31a, a light transmitting part (alignment mark) 32a, and a pattern forming opening 33a. The shielding part 31a and the pattern forming opening 33a according to the present embodiment are formed in a shape corresponding to the pattern forming region 23 of the substrate 2a. The translucent part (alignment mark) 32a is formed corresponding to the light receiving element part 21a of the substrate 2a. As shown in FIG. 7, the light transmitting portion 32a according to the present embodiment has two light transmitting hole portions formed at corners of the mask 3a.

As shown in FIGS. 4 and 8, the relative position drive unit 5 a according to the present embodiment includes a substrate support unit 51, a mask support unit 52, a mask position drive unit 53, and a substrate position drive unit 54.
The board | substrate support part 51 hold | maintains the board | substrate 2a. For example, as shown in FIG. 4 and FIG. 8A, the substrate support portion 51 is formed with an arm portion bent in a substantially L shape, and supports the substrate 2a at its end portion. Further, the substrate support portion 51 has a device side terminal portion (terminal portion) 6a that can be electrically connected to the terminal portion 22a on the surface side that contacts the terminal portion 22a formed on the substrate 2a. Specifically, the terminal portion 6a is formed at the end of the substrate support portion 51 at a position corresponding to the terminal portion 22a formed on the substrate 2a in a state where the substrate support portion 51 supports the substrate 2a. This terminal part 6a is electrically connected to the control part 8a. As shown in FIGS. 6 and 8B, the substrate 2a is supported by the substrate support portion 51, whereby the terminal portion 22a and the terminal portion 6a are electrically connected. That is, the light receiving element unit 21a and the control unit 8 are electrically connected.
By providing the terminal portion 6a on the substrate support portion 51 having the above configuration, the light receiving element portion 21a and the control portion 8 can be easily electrically connected. Further, the effective film formation area of the pattern formation region 23a of the substrate 2a can be expanded.

The mask support 52 holds the mask 3a. The mask support 52 is formed in a frame shape, for example, and supports the vicinity of the end of the mask 3a as shown in FIG.
The mask position driving unit 53 adjusts the relative position of the mask 3a with respect to the substrate 2a, for example, according to control by the control unit 8a. Specifically, the mask position driving unit 53 can move relative to the substrate 2a along the x-axis direction and the y-axis direction. For example, the mask position driving unit 53 can relatively rotate the substrate 2a and the mask 3a. The mask position driving unit 53 may be configured to relatively move the substrate 2a and the mask 3a along the z-axis direction, for example.
The substrate position driving unit 54 can relatively move the position of the substrate 2a along the x-axis direction and the y-axis direction, for example, under the control of the control unit 8a.
The rotation driving unit 11 holds the relative position driving unit 5a, that is, holds the substrate 2a and the mask 3a, and rotates the relative position driving unit 5a during film formation under the control of the control unit 8a.

  The control unit 8a according to the present embodiment includes an interface 81, an operation input unit 82, a display unit 83, a memory 84, a storage device 85, and a CPU (control circuit) 86, for example, as shown in FIG. Each component is electrically connected by a bus (conductive wire) 87. The interface 81 is electrically connected to the light receiving element portion 21a and the like via specified components of the manufacturing apparatus, for example, the light source 4, the relative position driving portion 5a, the vapor deposition source 7, and the terminal portion 6a. Under the control, a control signal is output to the component or a signal from the component is output to the control circuit 86. The operation input unit 82 includes, for example, an operation input device operated by an operator, such as a keyboard, operation buttons, and a mouse, and outputs a signal corresponding to the operation to the control circuit 86. The control circuit 86 performs processing according to the signal. The display unit 83 performs screen display according to the present invention under the control of the control circuit 86, for example. The memory 84 is configured by, for example, a semiconductor memory such as a RAM or a ROM, and stores, for example, a program having a function according to the present invention. The control circuit 86 realizes the function according to the present invention by executing this program, for example. The storage device 85 is constituted by a storage device such as a hard disk drive (HDD) or a magneto-optical disk drive. A CPU (control circuit) 86 comprehensively controls the entire apparatus. The detailed operation of the control circuit 86 will be described later.

FIG. 9 is a flowchart for explaining the operation of the manufacturing apparatus 100a shown in FIG. Referring to FIG. 9, the operation of the manufacturing apparatus 100a will be described focusing on the operation of the control unit 8a, specifically the control circuit 86.
In step S1, the substrate 2a, the mask 3a, the light source 4, the vapor deposition source 7 and the like are set to predetermined initial positions. More specifically, first, the substrate 2a is supported by the substrate support 51 in the vacuum chamber 10 and disposed at the initial position, and the mask 3a is disposed between the light source 4 and the substrate 2a at the specified position. At this time, as described above, the terminal portion 22a electrically connected to the light receiving element portion 21a of the substrate 2a is connected to the terminal portion 6a.
In step S <b> 2, the control unit 8 a controls the light source 4 to output laser light from the light source 4.
In step S3, the light receiving element portion 21a of the substrate 2a outputs a signal corresponding to the result of light reception.
In step S4, the control unit 8a controls the relative position driving unit 5a based on a signal input from the light receiving element unit 21 via the terminal unit 22a and the terminal unit 6a. At this time, the control unit 8a outputs a control signal to the relative position driving unit 5a so that the light reception intensity is increased based on the light reception result. The relative position driving unit 5a adjusts the relative position between the substrate 2a and the mask 3a based on a control signal from the control unit 8a. Specifically, the control unit 8a outputs a control signal to the mask position driving unit 53 in detail, for example, and the relative position between the substrate 2a and the mask 3a, in detail, relative to the x-axis direction, the y-axis direction, and the z-axis direction. Adjust the position. In addition, as described above, the control unit 8a may control the relative position driving unit 5a based on a signal from the light receiving element unit 21 so that a predetermined received light intensity distribution is obtained.
In step S5, when the substrate 2a and the mask 3a are positioned at a predetermined position as a result of the control, the control unit 8a controls the relative position driving unit so as to fix the positional relationship between the substrate 2a and the mask 3a. 5a is controlled.
In step S <b> 6, the controller 8 a controls the vapor deposition source 7 to evaporate the vapor deposition material from the vapor deposition source 7. The deposition material from the deposition source 7 is deposited on the pattern formation region 23 on the substrate 2a through the mask 3a. At the time of film formation, the control unit 8a rotates the substrate 2a and the mask 3a by rotating the rotation driving unit 11.

  As described above, the manufacturing apparatus 100a according to the present embodiment has a device-side terminal portion (terminal portion) that can be electrically connected to the terminal portion 22a on the surface side in contact with the terminal portion 22a formed on the substrate 2a. ) Since the substrate support portion 51 on which 6a is formed is provided, the terminal portion 22a and the terminal portion 6a are easily electrically connected by supporting the substrate 2a with the substrate support portion 51. That is, the light receiving element portion 21a and the control portion 8a can be easily electrically connected.

Further, the manufacturing apparatus 100a holds the substrate 2a and the vapor deposition mask 3a on the vapor deposition source 7, and rotates the substrate 2a and the vapor deposition mask 3a during film formation to each of the relative position drive units 5a. Since the constituent elements are provided, the controller 8a can easily deposit the substrate 2a and the mask 3a while rotating the position of the substrate 2a and the mask 3a after rotating the position of the substrate 2a and the mask 3a. By doing so, it is possible to obtain the substrate 2a having a pattern formed with high accuracy. When the manufacturing apparatus 100a according to the above embodiment is applied to an apparatus for forming an organic EL element, a display device having a high quality display performance is obtained using the substrate 2a having a pattern formed with high accuracy. be able to.
In addition, since the light receiving element portion 21a having the output function is provided on the substrate 2a, even the opaque substrate can be aligned with the alignment member (mask 3a) with high accuracy.

[Third Embodiment]
FIG. 10 is a view for explaining a manufacturing apparatus 100b according to the third embodiment of the present invention. The manufacturing apparatus 100b according to the present embodiment adjusts the gap between the substrate 2b and the evaporation mask 3a with high accuracy. Specifically, in the manufacturing apparatus 100b according to the present embodiment, as shown in FIG. 10, light (laser light) is emitted along a direction (perpendicular direction) substantially orthogonal to the surfaces of the substrate 2b and the mask 3a. The light source 4a and the light source 4b which irradiates light (laser light) in the diagonal direction with respect to the surface of the board | substrate 2b and the mask 3a are provided. The light emitted from the light source 4b is incident on the transparent portion 32a of the mask 3a in an oblique direction, and is also incident on the substrate 2a in an oblique direction. Further, the light source 4a and the light source 4b according to the present embodiment are disposed outside the vacuum chamber 10, and light (laser light) is incident on the inside of the vacuum chamber 10 through the light transmission window portion 10a.
The substrate 2b has a light receiving element portion 21a and a light receiving element portion 21b adjacent thereto. The light receiving element portion 21a receives light (laser light) from the light source 4a. The light receiving element portion 21b is disposed so as to receive light (laser light) from the light source 4b when, for example, the substrate 2b and the mask 3a have a predetermined relative distance (gap).

  In the manufacturing apparatus 100b configured as described above, the control unit 8a first drives and controls the relative position driving unit 5a based on the light reception result by the light receiving element unit 21a, and in the x-axis direction and the y-axis direction between the substrate 2b and the mask 3. Adjust the relative position along. Next, the control unit 8a controls the relative position driving unit 5a based on the light reception result by the light receiving element unit 21b to adjust the relative distance (gap) between the substrate 2b and the mask 3a. Specifically, the light receiving element portion 21b is formed so that the light receiving intensity of the light (laser light) from the light source 4b is maximized when the substrate 2b and the mask 3a have a predetermined relative distance (gap). In addition, when the light receiving intensity reaches the maximum intensity as a result of receiving light from the light source 4b by the light receiving element portion 21b, the control unit 8a specifies the position as a specified gap, and the substrate is determined based on the positional relationship. 2b and the mask 3a are fixed.

As described above, in the manufacturing apparatus 100b, the light source 4a and the light source 4b are provided, and the light receiving element portion 21a and the light receiving element portion 21b are formed on the substrate 2b. Therefore, the control unit 8a has the light receiving element portion 21a and the light receiving element portion 21b. The gap between the substrate 2b and the mask 3a can be easily adjusted based on the light reception result by.
The gap adjustment is not limited to the above-described form. For example, an optical system such as a lens, a mirror (mirror), or a refractive member may be disposed between the light source 4 and the mask 3a, and control equivalent to the above configuration may be performed. Further, without providing the light source 4b and the light receiving element portion 21b, an optical system such as a lens, a mirror, and a refractive member is provided between the light source 4 and the mask 3a. The gap adjustment may be performed using.

The present invention is not limited to the embodiment described above.
For example, the organic EL element manufactured by the above-described manufacturing method includes at least one organic functional layer by the vapor deposition flow from the vapor deposition source 7. For example, the structure of the organic functional layer of the organic EL element generally has a structure of a hole transport layer / light emitting layer / electron transport layer when the lower electrode is an anode and the upper electrode is a cathode. The hole transport layer and the electron transport layer may be provided not only as a single layer but also as a plurality of layers, and either layer may be omitted or both layers may be omitted for the hole transport layer and the electron transport layer. Thus, only the light emitting layer may be used. Moreover, as an organic functional layer, organic layers, such as a positive hole injection layer, an electron injection layer, a positive hole barrier layer, and an electronic barrier layer, can be inserted according to a use. Alternatively, the organic light emitting functional layer may be an electron transport layer / light emitting layer / hole transport layer, the lower electrode may be a cathode, and the upper electrode may be an anode.

Moreover, although the example of the organic functional layer material which can be employ | adopted as embodiment of this invention is shown below, it is not specifically limited to these.
For example, the hole transport layer only needs to have a function of high hole mobility, and any material can be selected and used from conventionally known compounds. Specific examples include porphyrin compounds such as copper phthalocyanine, aromatic tertiary amines such as 4,4′-bis [N- (1-naphthyl) -N-phenylamino] -biphenyl (NPB), 4- (di- Organic materials such as stilbene compounds such as p-tolylamino) -4 ′-[4- (di-p-tolylamino) styryl] stilbenzene, triazole derivatives, and styrylamine compounds are used. In addition, a polymer-dispersed material in which a low-molecular organic material for hole transport is dispersed in a polymer such as polycarbonate can also be used.

  For example, a known light emitting material can be used for the light emitting layer. Specific examples thereof include aromatic dimethylidin compounds such as 4,4′-bis (2,2′-diphenylvinyl) -biphenyl (DPVBi), 1,4 -Styrylbenzene compounds such as bis (2-methylstyryl) benzene, triazole derivatives such as 3- (4-biphenyl) -4-phenyl-5-t-butylphenyl-1,2,4-triazole (TAZ), anthraquinones Derivatives, fluorescent organic materials such as fluorenone derivatives, fluorescent organometallic compounds such as (8-hydroxyquinolinato) aluminum complex (Alq3), polyparaphenylene vinylene (PPV), polyfluorene, polyvinylcarbazole (PVK) To emit phosphorescence from triplet excitons such as platinum and iridium complexes Use can be organic material (Kohyo 2001-520450) can be used. It may be composed only of the light emitting material as described above, or may contain a hole transport material, an electron transport material, an additive (donor, acceptor, etc.) or a light emitting dopant. These may be dispersed in a polymer material or an inorganic material.

  For example, the electron transport layer only needs to have a function of transmitting electrons injected from the cathode to the light-emitting layer, and as the material thereof, any one of conventionally known compounds can be selected and used. . Specific examples include organic materials such as nitro-substituted fluorenone derivatives and anthraquinodimethane derivatives, metal complexes of 8-quinolinol derivatives, metal phthalocyanines, and the like.

In the above-described embodiment, the mask 3 is disposed above the light source 4 and the substrate 2 is disposed above the mask 3. However, the present invention is not limited to this configuration. For example, the positional relationship between the substrate 2 and the mask 3 may be upside down, or may be disposed horizontally. However, the mask 3 is set between the light source 4 and the substrate 2.
The alignment light output from the light source 4 may be applied to the mask 3 and the substrate 2 through an optical system such as a lens or a mirror. The alignment accuracy can be improved by using a lens for the alignment light. Moreover, you may irradiate toward the board | substrate 2 from the mask 3 side using a mirror. The light source 4 may be installed in the vacuum chamber 10, or the light source 4 may be installed outside the vacuum chamber 10.

  In the above-described embodiment, the manufacturing apparatus that performs the alignment process between the substrate 2 and the mask 3 during the film forming process using the mask among the processes for manufacturing the display device including the substrate 2 has been described. However, the present invention is not limited to this form. For example, in the process of manufacturing the display device, in the dry etching process, the manufacturing method according to the present invention may be applied to perform the alignment process of the substrate 2 and the mask 3.

In the above-described embodiment, the manufacturing apparatus and the manufacturing method according to the present invention are applied to the alignment process between the substrate 2 and the mask 3 in the vapor deposition process (film formation process). However, the present invention is not limited to this embodiment. Absent. The manufacturing apparatus according to the present invention may be applied to, for example, an apparatus that performs alignment between a first member and a second member.
The light receiving element portions 21, 21a, and 21b may be removed from the substrate 2 by cutting the substrate after completion of the alignment.

  As described above, the display device manufacturing apparatus 100 according to an embodiment of the present invention provides the alignment member (evaporation mask 3) on the substrate 2 on which the pattern 24 for forming the display unit is formed. This is a display device manufacturing apparatus that performs alignment between the pattern 24 and the alignment target member (mask 3) while facing each other. In the substrate 2, a light receiving element portion 21 having an output function is formed at a position where a positional relationship with the pattern 24 is defined in advance. Further, the member to be aligned (mask 3) has a translucent part 32 for alignment. And the positional relationship with the light receiving element part 21 or the translucent part 32 is fixed, and it has the light source 4 which can irradiate light to the light receiving element part 21 via the translucent part 32. In addition, since the manufacturing apparatus 100 includes the relative position driving unit 5 and the control unit 8 that perform position control between the substrate 2 and the member to be aligned (mask 3) based on the output of the light receiving element unit 21, The alignment member (mask 3) can be aligned with high accuracy.

  In addition, the display device manufacturing apparatus 100 according to an embodiment of the present invention holds the substrate 2 and the evaporation mask 3 on the evaporation source 7 and rotates the substrate 2 and the evaporation mask 3 during film formation. (Rotation drive unit) 11, detection device (control unit) 8 that can output and monitor the light intensity distribution detected by the light receiving element unit 21 on the substrate 2 as the light intensity distribution, and the light receiving element unit on the substrate 2 A light source 4 for outputting a laser beam to be irradiated 21, a mechanism (relative position driving unit) 5 for moving the substrate minutely so that the light intensity distribution confirmed by the detection device (control unit) 8 has a maximum peak, Have The manufacturing apparatus 100 having the above configuration includes a mechanism for finely moving the substrate 2 so that the light intensity distribution confirmed by the detection apparatus (control unit) 8 has a maximum peak. 3 and the substrate 2 can be aligned, and a predetermined pattern can be deposited on the substrate 2 through the deposition mask 3 with high accuracy.

  In addition, the display device manufacturing apparatus 100 according to the embodiment of the present invention causes the alignment member (mask 3) to face the substrate 2 on which the pattern 24 for forming the display unit is formed, and the pattern 24 and It is a manufacturing method of a display device that performs alignment with a member to be aligned (mask 3). As described above, the light receiving element portion 21 having the output function is formed on the substrate 2 at a position where the positional relationship with the pattern 24 is defined in advance. Further, from the light source 4 having a fixed positional relationship with the light transmitting element 32 for alignment formed on the light receiving element part 21 or the alignment target member (mask 3) to the light receiving element part 21 via the light transmitting part 32. Since it has the process of irradiating light, and the process of controlling the position of the substrate 2 and the member to be aligned (mask 3) based on the output of the light receiving element section 21, it is highly accurate without performing complicated processes. The substrate 2 and the alignment member (mask 3) can be aligned.

  Moreover, after aligning with high precision, an organic EL display device capable of high-quality display can be manufactured by forming an organic EL element on the substrate 2 through the mask 3.

  The substrate 2 according to the present invention is a substrate 2 of a display device in which a pattern 24 for forming a display portion is formed, and the pattern 24 and a to-be-aligned member (mask 3) are aligned. Since the light receiving element portion 21 having an output function is formed on the substrate 2 at a position where the positional relationship with the pattern 24 is defined in advance, the light receiving element portion 21 is placed on the alignment member (mask 3). By performing alignment so as to detect the formed alignment mark (translucent portion) 32, the position can be easily adjusted with high accuracy without performing a complicated process.

Conventionally, in an alignment method for performing mark recognition by a camera, for example, when vapor deposition is performed by sequentially arranging a vapor deposition source, a mask, and a substrate at a specified position, alignment between the mask and the substrate is performed. In order to do this, an alignment mark is formed on the mask, the alignment mark is imaged by a camera via a transparent substrate, and the mask and the substrate are aligned based on the imaging result. When the mask mark overlaps, when foreign matter exists on either the substrate or the mask, or when the mask mark is small, erroneous recognition or recognition failure may occur.
On the other hand, in the manufacturing apparatus 100 according to the present invention, the position adjustment is performed based on the intensity distribution of the light transmitted from the light transmitting portion 32 of the mask 3, so that recognition failure depending on the mark shape is unlikely to occur and the position adjustment is performed with high accuracy. It can be performed.

  In addition, as compared with the conventional case where the alignment mark is recognized by a camera placed away from the mask, in the manufacturing apparatus 100 according to the present invention, the light received on the substrate 2 by the alignment mark approaching the substrate 2. Since the detection is performed by the element portion 21, the size of the alignment mark (translucent portion) 32 can be made as small as possible, and the alignment accuracy is improved.

Conventionally, a mask and a substrate are arranged between the light source and the camera, and the light emitted from the light source needs to reach the camera through the mask alignment mark and the substrate. It is necessary to provide a light transmitting hole in the substrate.
On the other hand, in the manufacturing apparatus 100 according to the present invention, by applying to an opaque substrate such as a silicon (Si) substrate, alignment can be performed with high accuracy even on a substrate having no transparency.

  In the manufacturing apparatus 100 according to the present invention, the light receiving element portion 21 for detecting the alignment mark for alignment is formed in the manufacturing stage, the terminal portion 22 connected to the light receiving element portion 21 is formed, and the substrate support portion Since the terminal portion 6a is formed at 51, the light receiving element portion 21 and the control portion 8 can be easily electrically connected, and the manufacturing process can be simplified. In addition, the manufacturing time can be shortened.

  Further, since the alignment mark is not formed on the substrate as in the prior art, it is not necessary to perform a complicated process of removing the dirt adhering to the alignment mark, so that the manufacturing time is shortened.

It is a figure for demonstrating the conventional manufacturing apparatus. It is a figure for demonstrating the manufacturing apparatus 100 which concerns on 1st Embodiment of this invention. 3 is a diagram for explaining the operation of the control unit 8 of the manufacturing apparatus 100 shown in FIG. 2, and (a) and (b) are diagrams showing the received light intensity distribution with respect to the relative positions of the substrate 2 and the mask 3. It is a figure for demonstrating the manufacturing apparatus 100a which concerns on 2nd Embodiment of this invention. It is a figure for demonstrating the board | substrate 2a shown in FIG. It is a figure for demonstrating the board | substrate 2a shown in FIG. 4, and a board | substrate support part. It is a figure for demonstrating the mask 3a shown in FIG. 5A and 5B are diagrams for explaining the substrate 2a and the substrate support portion shown in FIG. 4, FIG. 5A is a perspective view for explaining the substrate support portion, and FIG. 5B is a diagram explaining the substrate and the substrate support portion. FIG. It is a flowchart for demonstrating operation | movement of the manufacturing apparatus 100a shown in FIG. It is a figure for demonstrating the manufacturing apparatus 100b which concerns on 3rd Embodiment of this invention.

Explanation of symbols

2 Substrate 3 Evaporation mask (mask)
4 Light source 5 Relative position drive unit 6 Device side terminal unit (terminal unit)
7 Deposition source 8 Control unit 21 Light receiving element unit 22 Substrate side terminal unit (terminal unit)
DESCRIPTION OF SYMBOLS 23 Pattern formation area 24 Pattern 31 Shielding part 32 Light transmission part 33 Pattern formation opening part 51 Substrate support part 52 Mask support part 53 Mask position drive part 54 Substrate position drive part 100,100a, 100b Manufacturing apparatus

Claims (19)

An apparatus for manufacturing a display device, wherein an alignment member is made to face a substrate on which a pattern for forming a display unit is formed, and alignment between the pattern and the alignment member is performed.
The substrate is provided with a light receiving element portion having an output function at a position where a positional relationship with the pattern is defined in advance.
The member to be aligned has a translucent part for alignment,
A light source capable of irradiating light to the light receiving element part through the light transmitting part is provided, the positional relationship with the light receiving element part or the light transmitting part is fixed,
An apparatus for manufacturing a display device, comprising: position control means for performing position control between the substrate and the member to be aligned based on an output of the light receiving element portion. The alignment member is a film formation mask disposed between a film formation source and the substrate on which the film formation material from the film formation source is formed,
The display device manufacturing apparatus according to claim 1, wherein the position control unit performs position control of the substrate and the mask based on an output of the light receiving element unit. The substrate includes a substrate-side terminal portion electrically connected to the light receiving element portion as the output function of the light receiving element portion,
The manufacturing apparatus has a device-side terminal portion that can be electrically connected to the substrate-side terminal portion,
The display according to claim 1, wherein the position control unit performs the position control based on an output of the light receiving element unit via the substrate side terminal unit and the device side terminal unit. Equipment manufacturing equipment. A substrate support part for supporting the substrate;
In the substrate support portion, the device-side terminal portion that can be electrically connected to the substrate-side terminal portion is formed on a surface side in contact with the substrate-side terminal portion formed on the substrate. The display device manufacturing apparatus according to claim 3. The position control means includes a relative position driving means for adjusting a relative position between the aligned member and the substrate;
The control circuit according to claim 1, further comprising a control circuit that controls the relative position driving unit based on an output of the light receiving element unit so as to obtain a predetermined light receiving intensity. The manufacturing apparatus of the display apparatus of description.   6. The display device manufacturing apparatus according to claim 5, wherein the control circuit controls the relative position driving unit based on an output of the light receiving element unit so as to obtain a prescribed light reception intensity distribution. .   6. The control circuit according to claim 5, wherein the relative position of the member to be aligned and the substrate is minutely controlled by the relative position driving unit based on the output of the light receiving element unit. The manufacturing apparatus of the display apparatus of description.   The display device manufacturing apparatus according to claim 1, wherein the light receiving element portion includes a semiconductor light receiving element.   The display device manufacturing apparatus according to claim 1, wherein the light source outputs pulsed light or light having a wavelength in a non-visible region as alignment light. A method for manufacturing a display device, wherein a positioning member is made to face a substrate on which a pattern for forming a display unit is formed, and the positioning of the pattern and the positioning member is performed.
The substrate is provided with a light receiving element portion having an output function at a position where a positional relationship with the pattern is defined in advance.
A step of irradiating light to the light receiving element portion through the light transmitting portion from a light source having a fixed positional relationship with the light transmitting element portion or a light transmitting portion for alignment formed on the alignment target member. When,
And a step of controlling the position of the substrate and the member to be aligned based on the output of the light receiving element section. The alignment member is a film formation mask having an opening for forming a film formation material on the substrate in a predetermined pattern;
The method for manufacturing a display device according to claim 10, wherein film formation is performed after position control of the substrate and the film formation mask is performed based on an output of the light receiving element portion. On the substrate, as the output function of the light receiving element portion, a substrate side terminal portion electrically connected to the light receiving element portion is formed,
The method for manufacturing a display device according to claim 10, wherein the position control is performed based on an output of the light receiving element portion via the substrate side terminal portion.   13. The display device manufacturing method according to claim 10, wherein the positioning is performed in advance so that a prescribed light-receiving intensity distribution is obtained based on an output of the light-receiving element unit. Method.   Based on the received light intensity distribution of the light detected by the light receiving element portion through the light transmitting portion, the relative position between the member to be aligned and the substrate is controlled to be relatively moved to perform the alignment. The method for manufacturing a display device according to claim 10, wherein the display device is a display device. A substrate for a display device in which a pattern for forming a display portion is formed, and the pattern and a member to be aligned are aligned,
The substrate of a display device, wherein a light receiving element portion having an output function is formed at a position where a positional relationship with the pattern is defined in advance.   16. The display device substrate according to claim 15, wherein one end portion is electrically connected to the light receiving element portion, and the other end portion is formed with a terminal portion connectable to an external device.   The substrate of the display device according to claim 15 or 16, wherein the other end portion of the terminal portion is formed in the vicinity of the end portion of the substrate.   The substrate of a display device according to claim 15, wherein the light receiving element portion is a semiconductor light receiving element.   The substrate of the display device according to claim 15, wherein a plurality of the light receiving element portions are formed in a predetermined region on the substrate.

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