JP2007149888A - Printed wiring board, connection structure thereof, and sealing method for connection part therebetween - Google Patents

Printed wiring board, connection structure thereof, and sealing method for connection part therebetween Download PDF

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JP2007149888A
JP2007149888A JP2005341034A JP2005341034A JP2007149888A JP 2007149888 A JP2007149888 A JP 2007149888A JP 2005341034 A JP2005341034 A JP 2005341034A JP 2005341034 A JP2005341034 A JP 2005341034A JP 2007149888 A JP2007149888 A JP 2007149888A
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connection
printed wiring
wiring board
connection terminals
gap
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Yutaka Amamiya
豊 雨宮
Hiroki Maruo
弘樹 圓尾
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Fujikura Ltd
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Fujikura Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board connection structure for preventing occurrence of a short circuit, exfoliation, and breakage or the like of the connection. <P>SOLUTION: Each interval S1-S8 between connection terminals 12A adjacent to each other is set so as to be gradually narrower in a fixed direction in a first printed wiring board 10. Connection terminals 32A of a second printed wiring board 30 are also composed so as to have the arrangement similar to that of the connection terminals 12A of the first printed wiring board 10. Thus, it is possible to adjust an intrusion speed into gaps 20 due to the capillary phenomenon by feeding an underfill 40 from the wider gap 20 in turn. It prevents air from being confined in the other openings of the gaps 20 due to intrusion of the underfill 40 into the other openings. Consequently, it is possible to prevent the connection terminals 12A(32A) from being exfoliated or broken due to expansion of air when subjected to heat treatment. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明はプリント配線板同士の接続技術に関し、さらに詳しくは、プリント配線板、一対のプリント配線板同士の接続構造、及び一対のプリント配線板同士の接続部を封止する方法に関するものである。   The present invention relates to a connection technique between printed wiring boards, and more particularly to a printed wiring board, a connection structure between a pair of printed wiring boards, and a method for sealing a connection portion between a pair of printed wiring boards.

近年、携帯用情報機器や、携帯用電話あるいは携帯用情報端末等の電子機器では、プリント配線板同士、例えばリジッドプリント配線板とフレキシブルプリント配線板との接続部同士を接合させて電気的に接続する必要がある。このような接続部同士を接合させる方法としては、互いの接続部に備えられた複数の接続端子同士を半田付けして接合する方法や、接続端子同士を異方導電性のペーストやフィルムを用いて接合する方法などがある。   In recent years, electronic devices such as portable information devices and portable telephones or portable information terminals are electrically connected by joining printed wiring boards, for example, connecting portions of a rigid printed wiring board and a flexible printed wiring board. There is a need to. As a method for joining such connection parts, a method of soldering and joining a plurality of connection terminals provided in each connection part, or using an anisotropic conductive paste or film between the connection terminals. And joining methods.

上述のような半田を用いた接合構造では、接合を容易かつ安価に行うことができるものの、接合後のリフロー工程において接合部分（接続端子）が酸化したり、剥離したりする恐れがあった。   In the joining structure using solder as described above, joining can be performed easily and inexpensively, but there is a risk that the joined portion (connection terminal) may be oxidized or peeled off in the reflow process after joining.

異方導電性のペーストやフィルムを用いたプリント配線板同士の接合では、ペーストの印刷やフィルムの貼り付けなどの工程が必要であるため、接合工程が複雑であり製造コストが高くなる上、電気的導通は樹脂中に含まれる導電粒子の接触状態に依存するため、電気的導通の信頼性に問題があった。   Joining printed wiring boards using anisotropic conductive pastes and films requires processes such as paste printing and film pasting, which complicates the joining process and increases manufacturing costs. Since the electrical conduction depends on the contact state of the conductive particles contained in the resin, there is a problem in the reliability of electrical conduction.

最近は、電子機器の小型化に伴って、プリント配線板の導体パターンの狭ピッチ化の要求は厳しくなっている。今後、狭ピッチ化に伴う端子同士の接触面積の低減が接合強度の低下を招き、上述のような半田を用いた接合構造や異方導電性のペーストやフィルム用いた接続構造では、外部応力などによって接合したプリント配線板の接合界面が剥離していまう恐れがある。   In recent years, with the miniaturization of electronic devices, the demand for narrowing the pitch of conductor patterns on printed wiring boards has become strict. In the future, the reduction in contact area between terminals due to the narrowing of the pitch will lead to a decrease in bonding strength. In the bonding structure using solder as described above and the connection structure using anisotropic conductive paste or film, external stress, etc. There is a risk that the bonded interface of the printed wiring board bonded by the peeling off.

このような接合界面の剥離を抑制する方法として、端子接続部同士の間の間隙に毛細管現象を利用して樹脂を充填することが提案されている（例えば、特許文献１参照）。以下、図２１（ａ）、及び（ｂ）を用いて、接続端子同士の間の間隙に樹脂を充填する方法について説明する。   As a method for suppressing such peeling at the bonding interface, it has been proposed to fill the gap between the terminal connection portions with a resin using a capillary phenomenon (see, for example, Patent Document 1). Hereinafter, a method of filling a resin in the gap between the connection terminals will be described with reference to FIGS. 21 (a) and 21 (b).

図２１（ａ）に示すように、まず、一方のプリント配線板１０１の接続部（接合領域）１０２と、他方のプリント配線板１０３の接続部（接合領域）１０４と、を接合する。プリント配線板１０１の接続部１０２には、所定ピッチで配置された複数の導体パターン１０５が露出している。プリント配線板１０３の接続部１０４にも、所定ピッチで配置された複数の導体パターン１０６が露出している。接合部では、互いに対応する位置に配置された導体パターン１０５と導体パターン１０６とが、半田付けされている。このように導体パターン１０５と導体パターン１０６とが半田付けされた接続部同士の間には、間隙１０７が形成されている。   As shown in FIG. 21A, first, the connecting portion (joining region) 102 of one printed wiring board 101 and the connecting portion (joining region) 104 of the other printed wiring board 103 are joined. A plurality of conductor patterns 105 arranged at a predetermined pitch are exposed at the connection portion 102 of the printed wiring board 101. A plurality of conductor patterns 106 arranged at a predetermined pitch are also exposed at the connection portion 104 of the printed wiring board 103. In the joint portion, the conductor pattern 105 and the conductor pattern 106 arranged at positions corresponding to each other are soldered. Thus, a gap 107 is formed between the connection portions to which the conductor pattern 105 and the conductor pattern 106 are soldered.

次に、図２１（ａ）に示すように、接続部１０２と接続部１０４とを接合した状態で、接続部１０４の先端縁近傍で複数の導体パターン１０５が露出する場所（カバーレイ層を除去した部分）の幅方向の一方側より他方側（図中矢印で示す方向）へ向けてディスペンサ１０８を移動させつつアンダーフィル（斜線で示す）１０９を供給する。この結果、ディスペンサ１０８からのアンダーフィル１０９の供給により、図２１（ｂ）に示すように間隙１０７の一方の開口部から毛細管現象により樹脂１０９が所定の速度で浸入する。なお、ディスペンサ１０８が移動し終わった直後は、幅方向の一方側に位置する間隙１０７がアンダーフィル１０９の浸入が最も進み、幅方向の他方側に位置する間隙１０７がアンダーフィル１０９の浸入が最も少ない状態である。その後、時間の経過に伴って全ての間隙１０７内へのアンダーフィル１０９の浸入が毛細管現象により進み、間隙１０７の他方の開口部まで到達する。次に、アンダーフィル１０９を例えば１５０〜１６０℃にてオーブンなどで熱硬化させるか、紫外線により硬化させることによりプリント配線板の接合体を完成する。その後、部品実装が必要である場合はリフロー炉にてはんだ付けを行う。
特開２００５−１８３５８９号公報 Next, as shown in FIG. 21A, in a state where the connection portion 102 and the connection portion 104 are joined, a place where a plurality of conductor patterns 105 are exposed near the leading edge of the connection portion 104 (the cover lay layer is removed). The underfill (indicated by hatching) 109 is supplied while moving the dispenser 108 from the one side in the width direction of the portion toward the other side (indicated by the arrow in the figure). As a result, the supply of the underfill 109 from the dispenser 108 causes the resin 109 to enter at a predetermined speed from one opening of the gap 107 by capillary action as shown in FIG. Immediately after the dispenser 108 has finished moving, the gap 107 located on one side in the width direction has the most penetration of the underfill 109, and the gap 107 located on the other side in the width direction has the most penetration of the underfill 109. There are few states. Thereafter, as time elapses, the penetration of the underfill 109 into all the gaps 107 proceeds by capillary action and reaches the other opening of the gap 107. Next, the underfill 109 is thermally cured, for example, in an oven at 150 to 160 ° C., or is cured by ultraviolet rays, thereby completing a printed wiring board joined body. Thereafter, when component mounting is necessary, soldering is performed in a reflow furnace.
JP 2005-183589 A

しかしながら、上述したように、端子接続部同士の間の間隙１０７内に毛細管現象を利用してアンダーフィル１０９を充填する技術では、複数の間隙１０７のうち、ディスペンサ１０８で先にアンダーフィル１０９を供給（塗布）した位置の間隙１０７から先にアンダーフィル１０９が浸入していくため、ディスペンサ１０８の移動する速度や、間隙１０７内をアンダーフィル１０９が毛細管現象により浸入する速度によっては、図２１（ｃ）に示すように、先にアンダーフィル１０９の充填が完了した間隙１０７の他方の開口部から未だ他方の開口部にアンダーフィル１０９が到達していない間隙１０７の他方の開口部にアンダーフィル１０９が回り込み、気泡（空気）１１０が閉じこめられた構造となる。このように間隙１０７内に気泡１１０を閉じ込めた状態で、リフロー炉にて加熱を行うと、加熱により気泡１１０を構成する空気が膨脹することで、接続部の剥離又は破損などが発生するという問題があった。   However, as described above, in the technique in which the underfill 109 is filled in the gap 107 between the terminal connection portions by utilizing capillary action, the underfill 109 is first supplied by the dispenser 108 among the plurality of gaps 107. Since the underfill 109 penetrates first from the gap 107 at the (applied) position, depending on the moving speed of the dispenser 108 and the speed at which the underfill 109 penetrates into the gap 107 by capillary action, FIG. ), The underfill 109 does not reach the other opening from the other opening of the gap 107 that has been previously filled with the underfill 109, and the underfill 109 does not reach the other opening of the gap 107. It becomes a structure in which the air bubbles (air) 110 are confined. When heating is performed in a reflow furnace with the bubbles 110 confined in the gap 107 as described above, the air constituting the bubbles 110 expands due to the heating, which causes peeling or breakage of the connection portion. was there.

そこで、本発明の目的は、封止用樹脂の回り込みによる気泡の閉じ込めを原因とする、接続部のショートや、接続部の剥離や、接続部の破損などの発生を防止できる、プリント配線板、プリント配線板の接続構造、及びプリント配線板間接続部の封止方法を提供することにある。   Therefore, the purpose of the present invention is to prevent the occurrence of short-circuiting of the connection part, peeling of the connection part, breakage of the connection part, and the like due to the confinement of bubbles due to the wraparound of the sealing resin, It is providing the connection structure of a printed wiring board, and the sealing method of the connection part between printed wiring boards.

本発明の第１の特徴は、少なくとも３つ以上の接続端子が互いに平行をなし且つ表面に露出して配置された接続部を有し、接続部の接続端子が、相手側プリント配線板の接続部に備えられた対応する相手側接続端子と接合され接続端子と相手側接続端子とでなる接続体同士の間の間隙内に、封止用樹脂が毛細管現象により供給されるプリント配線板であって、接続端子同士の間隔が、接続端子と直交する特定方向に沿って漸次狭くなるようにパターン設定されたことを要旨とする。なお、封止用樹脂は、特定方向に沿って供給されるように設定することが有効である。   A first feature of the present invention is that a connection portion in which at least three or more connection terminals are arranged parallel to each other and exposed on the surface is provided, and the connection terminal of the connection portion is connected to a mating printed wiring board. This is a printed wiring board in which sealing resin is supplied by capillarity in the gap between the connecting bodies that are joined to the corresponding mating connection terminals provided in the section and are composed of the connection terminals and the mating connection terminals. Thus, the gist is that the pattern is set so that the interval between the connection terminals becomes gradually narrower along a specific direction orthogonal to the connection terminals. It is effective to set the sealing resin so as to be supplied along a specific direction.

本発明の第２の特徴は、プリント配線板の接続構造であって、少なくとも３つ以上の第１接続端子が互いに平行をなし且つ表面に露出して配置されると共に、第１接続端子と直交する特定方向に沿って、第１接続端子同士の間隔が、漸次狭くなるように設定された第１接続部を有する第１プリント配線板と、第１接続端子のそれぞれに対応するように形成された第２接続端子が表面に露出して配置された第２接続部を有し、第２接続端子がそれぞれ対応する第１接続端子と接続されている第２プリント配線板と、第１接続端子と第２接続端子とが接合されてなる端子接続体同士の間隙に充填された封止用樹脂と、を備えることを要旨とする。なお、封止用樹脂は、特定方向に沿って移動しながら供給され、間隙内に毛細管現象により充填されることが有効である。   A second feature of the present invention is a printed wiring board connection structure, wherein at least three or more first connection terminals are arranged parallel to each other and exposed on the surface, and orthogonal to the first connection terminals. A first printed wiring board having a first connection portion that is set so that the interval between the first connection terminals is gradually narrowed along a specific direction is formed to correspond to each of the first connection terminals. A second printed wiring board having a second connection portion disposed so that the second connection terminal is exposed on the surface, and the second connection terminal is connected to the corresponding first connection terminal, and the first connection terminal And a sealing resin filled in a gap between terminal connection bodies formed by joining the second connection terminal and the second connection terminal. It is effective that the sealing resin is supplied while moving along a specific direction, and is filled in the gap by capillary action.

本発明の第３の特徴は、プリント配線板間接続部の封止方法であって、少なくとも３つ以上の第１接続端子が互いに平行をなし且つ表面に露出して配置されると共に、第１接続端子と直交する特定方向に沿って、第１接続端子同士の間隔が、漸次狭くなるように設定された第１接続部を有する第１プリント配線板を用意する工程と、第１接続端子のそれぞれに対応するように形成された第２接続端子が表面に露出して配置された第２接続部を有する第２プリント配線板を用意する工程と、第１プリント配線板の第１接続部と、第２プリント配線板の第２接続部とを接合して、第１接続端子と第２接続端子とを接続させる工程と、特定方向に沿って封止用樹脂を移動しながら供給して、第１接続端子と第２接続端子とが接続してなる端子接続体同士の間隙内に、封止用樹脂を毛細管現象により充填させる工程と、封止用樹脂を硬化させる工程と、を備えることを要旨とする。   A third feature of the present invention is a method for sealing a connection portion between printed wiring boards, wherein at least three or more first connection terminals are arranged parallel to each other and exposed on the surface, and the first A step of preparing a first printed wiring board having a first connection portion in which a distance between the first connection terminals is set to be gradually narrowed along a specific direction orthogonal to the connection terminals; A step of preparing a second printed wiring board having a second connecting portion in which second connecting terminals formed so as to correspond to each other are exposed on the surface; and a first connecting portion of the first printed wiring board; , Joining the second connection part of the second printed wiring board, connecting the first connection terminal and the second connection terminal, supplying the sealing resin while moving along the specific direction, Terminal connection body formed by connecting the first connection terminal and the second connection terminal In Judges gap, the sealing resin and the step of filling by capillary action, and curing the sealing resin, and summarized in that it comprises a.

なお、封止用樹脂は、第１プリント配線板と第２プリント配線板とのいずれか一方の接続部の先端縁部分に位置する他方の接続部の基部に、特定方向に沿って移動するディスペンサにより塗布されることが好ましい。また、ディスペンサの移動速度は、端子接続体同士の間の間隙の断面積、間隙の内側表面の特性、封止用樹脂の特性に基づいて決定されることが好ましい。   The sealing resin is a dispenser that moves along a specific direction to the base of the other connecting portion located at the tip edge portion of either one of the first printed wiring board and the second printed wiring board. It is preferable to apply by. The movement speed of the dispenser is preferably determined based on the cross-sectional area of the gap between the terminal connectors, the characteristics of the inner surface of the gap, and the characteristics of the sealing resin.

本発明によれば、接続端子同士の間隔が、特定方向に沿って漸次狭くなるようにパターン設定されているため、相手側プリント配線板と接合したときに、接続端子同士の間に形成される間隙の幅が広いものから順に狭い間隙へ向けて封止用樹脂が供給されることにより、先に封止用樹脂が供給された間隙が封止用樹脂で満たされて、後に封止用樹脂が供給された間隙の開口部を封止用樹脂で塞ぐことを防止できる。このため、間隙内に空気が閉じ込められることがなく、封止用樹脂を熱処理した際に、空気が膨脹して接続端子が剥離したり破損することを防止できる。このため、プリント配線板間接続部の接続信頼性を向上できる。   According to the present invention, since the interval between the connection terminals is set so as to gradually narrow along the specific direction, it is formed between the connection terminals when joined to the mating printed wiring board. By supplying the sealing resin from the wide gap to the narrow gap in order, the gap to which the sealing resin has been supplied is filled with the sealing resin. It is possible to prevent the opening portion of the gap to which is supplied from being blocked with a sealing resin. For this reason, air is not trapped in the gap, and when the sealing resin is heat-treated, it is possible to prevent the air from expanding and peeling off or damaging the connection terminal. For this reason, the connection reliability of the connection part between printed wiring boards can be improved.

また、本発明によれば、接続部同士の接合強度を高める接続構造及び封止構造を実現できる。   Moreover, according to this invention, the connection structure and sealing structure which raise the joint strength of connection parts are realizable.

以下、本発明の実施の形態に係るプリント配線板、プリント配線板の接続構造、及びプリント配線板間接続部の封止方法の詳細を図面に基づいて説明する。   Hereinafter, details of a printed wiring board, a printed wiring board connection structure, and a printed wiring board connecting method according to an embodiment of the present invention will be described with reference to the drawings.

（第１の実施の形態）
図１〜図９は、本発明の第１の実施の形態に係るプリント配線板、プリント配線板の接続構造、及びプリント配線板間接続部の封止方法を示している。 (First embodiment)
1 to 9 show a printed wiring board, a printed wiring board connection structure, and a printed wiring board connecting portion sealing method according to the first embodiment of the present invention.

まず、本実施の形態に係る第１プリント配線板１０及び第２プリント配線板３０の構成について、図１〜図３を用いて説明する。なお、図１は第１プリント配線板１０と第２プリント配線板３０とを接合した状態を示す平面図、図２は第１プリント配線板１０と第２プリント配線板３０との接続構造を示した図であり、図１のＡ−Ａ断面に相当する断面図、図３は封止用樹脂としてのアンダーフィルを塗布する状態を示す斜視図である。   First, the structure of the 1st printed wiring board 10 and the 2nd printed wiring board 30 which concern on this Embodiment is demonstrated using FIGS. 1-3. 1 is a plan view showing a state in which the first printed wiring board 10 and the second printed wiring board 30 are joined, and FIG. 2 shows a connection structure between the first printed wiring board 10 and the second printed wiring board 30. FIG. 3 is a cross-sectional view corresponding to the AA cross section of FIG. 1, and FIG. 3 is a perspective view showing a state in which an underfill as a sealing resin is applied.

〈第１プリント配線板及び第２プリント配線板〉
第１プリント配線板１０は、絶縁性基板（基材）１１と、この絶縁性基板１１の一方の表面にパターン形成された複数の配線１２と、これらの配線１２が形成された絶縁性基板１１の上に形成された接着層（図示省略する）と、接着層の上に形成されたレジスト層（カバー層）１３と、を備えて大略構成されている。 <First printed wiring board and second printed wiring board>
The first printed wiring board 10 includes an insulating substrate (base material) 11, a plurality of wires 12 patterned on one surface of the insulating substrate 11, and an insulating substrate 11 on which these wires 12 are formed. And an adhesive layer (not shown) formed on the substrate and a resist layer (cover layer) 13 formed on the adhesive layer.

第１プリント配線板１０がリジッド基板である場合は、絶縁性基板１１として、例えばガラスエポキシ、ＳＥＭ３、紙エポキシなどを用い、フレキシブル基板である場合は、例えばポリイミド樹脂、ＰＥＮ（ポリエチレンナフタレート）、ＰＥＴ（ポリエチレンテレフタレート）、液晶ポリマーなどを用いることができる。   When the first printed wiring board 10 is a rigid substrate, for example, glass epoxy, SEM3, paper epoxy, or the like is used as the insulating substrate 11, and when it is a flexible substrate, for example, polyimide resin, PEN (polyethylene naphthalate), PET (polyethylene terephthalate), liquid crystal polymer, and the like can be used.

配線１２は、絶縁性基板１１の上に貼り付けた銅箔を例えばサブトラクティブ法によりパターン加工して形成されている。なお、銅箔としては、圧延銅箔、電解銅箔などを用いることができる。なお、本実施の形態では、配線１２として、スパッタ法やキャスト法で銅箔と絶縁性基板１１とを直接接合したものであってもよい。レジスト層１３としては、絶縁性基板１１と同様の樹脂などを用いることができる。   The wiring 12 is formed by patterning a copper foil attached on the insulating substrate 11 by, for example, a subtractive method. In addition, as copper foil, rolled copper foil, electrolytic copper foil, etc. can be used. In the present embodiment, as the wiring 12, the copper foil and the insulating substrate 11 may be directly joined by a sputtering method or a casting method. As the resist layer 13, the same resin as the insulating substrate 11 can be used.

この第１プリント配線板１０は、絶縁性基板１１の所定の端部に、複数の配線１２の接続端子１２Ａが露出する接続部（接続領域）１４を備えている。これら接続端子１２Ａは、図１及び図２に示すように、互いに同一の幅寸法であり、互いに平行をなすように形成されている。また、これら接続端子１２Ａは、図２に示すように、矢印ｘ方向の一方から他方に向けて（本実施の形態では図面左から右に向けて）隣接する接続端子１２Ａとの間隔Ｓ１〜Ｓ８が漸次狭くなるように配置されている。すなわち、接続端子１２Ａは、矢印ｘ方向の一方から他方へ向けてピッチが漸次小さくなるように設定されている。   The first printed wiring board 10 includes a connection portion (connection region) 14 at which a connection terminal 12 </ b> A of the plurality of wires 12 is exposed at a predetermined end portion of the insulating substrate 11. As shown in FIGS. 1 and 2, these connection terminals 12 </ b> A have the same width dimension and are formed to be parallel to each other. Further, as shown in FIG. 2, these connection terminals 12A are spaced from S1 to S8 between adjacent connection terminals 12A from one to the other in the direction of the arrow x (in the present embodiment, from the left to the right in the drawing). Are arranged so as to become gradually narrower. That is, the connection terminal 12A is set so that the pitch gradually decreases from one to the other in the arrow x direction.

一方、第２プリント配線板３０は、第１プリント配線板１０と接合する相手の配線板であり、第１プリント配線板１０と同様の構成を有している。すなわち、第２プリント配線板３０は、絶縁性基板３１と、この絶縁性基板３１の一方の表面にパターン形成された複数の配線３２と、これらの配線３２が形成された絶縁性基板３１の上に形成された接着層（図示省略する）と、接着層の上に形成されたレジスト層（カバー層）３３と、を備えて大略構成されている。   On the other hand, the second printed wiring board 30 is a counterpart wiring board to be joined to the first printed wiring board 10, and has the same configuration as the first printed wiring board 10. That is, the second printed wiring board 30 includes an insulating substrate 31, a plurality of wirings 32 patterned on one surface of the insulating substrate 31, and the insulating substrate 31 on which these wirings 32 are formed. And a resist layer (cover layer) 33 formed on the adhesive layer.

この第２プリント配線板３０は、絶縁性基板３１の所定の端部に、複数の配線３２の接続端子３２Ａが露出する接続部（接続領域）３４を備えている。これら接続端子３２Ａは、図１及び図２に示すように、互いに平行をなすように形成されている。また、これら接続端子３２Ａは、図２に示すように、第１プリント配線板１０の接続端子１２Ａと接合するときに、接続端子１２Ａと合致するように、第１プリント配線板１０と同様に、矢印ｘ方向の一方から他方に向けて（本実施の形態では図面左から右に向けて）隣接する接続端子３２Ａとの間隔Ｓ１〜Ｓ８が漸次狭くなるように配置されている。   The second printed wiring board 30 includes a connection portion (connection region) 34 where a connection terminal 32 </ b> A of the plurality of wires 32 is exposed at a predetermined end portion of the insulating substrate 31. These connection terminals 32A are formed so as to be parallel to each other, as shown in FIGS. Further, as shown in FIG. 2, these connection terminals 32 </ b> A are connected to the connection terminals 12 </ b> A of the first printed wiring board 10 so as to coincide with the connection terminals 12 </ b> A, as in the first printed wiring board 10. Arranged so that the distances S1 to S8 between the adjacent connection terminals 32A gradually decrease from one to the other in the direction of the arrow x (from the left to the right in the present embodiment).

このような構成の第１プリント配線板１０と第２プリント配線板３０とを半田付けするには、少なくともどちらか一方のプリント配線板１０、３０の接続端子１２Ａ、３２Ａの表面に、半田めっき層を形成すればよい。また、半田付け以外の手法で第１プリント配線板１０と第２プリント配線板３０と接続してもよい。   In order to solder the first printed wiring board 10 and the second printed wiring board 30 having such a configuration, a solder plating layer is formed on the surface of the connection terminals 12A and 32A of at least one of the printed wiring boards 10 and 30. May be formed. Further, the first printed wiring board 10 and the second printed wiring board 30 may be connected by a method other than soldering.

第１プリント配線板１０及び第２プリント配線板３０において、接続端子１２Ａ（３２Ａ）同士の間隔が、接続端子の延在方向と直交するｘ方向の一方から他方へ向けて漸次狭くなるようにパターン設定されているため、これらプリント配線板１０、３０を互いに接合したときに、接続端子１２Ａ（３２Ａ）同士の間に形成される間隙の幅が広いものから順に狭い間隙へ向けて封止用樹脂が一方の開口部側より供給されることにより、先に封止用樹脂が供給された間隙が封止用樹脂で満たされて、後に封止用樹脂が供給された間隙の他方の開口部を封止用樹脂で塞ぐことを防止できる。 このため、間隙内に空気が閉じ込められることがなく、封止用樹脂を熱処理した際に、空気が膨脹して接続端子が剥離したり破損することを防止できる。このため、第１、第２プリント配線板間接続部の接続信頼性を向上できる。   In the first printed wiring board 10 and the second printed wiring board 30, a pattern is formed so that the interval between the connection terminals 12A (32A) is gradually narrowed from one side to the other side in the x direction perpendicular to the extending direction of the connection terminals. Therefore, when these printed wiring boards 10 and 30 are joined to each other, a sealing resin is formed in order from the wide gap formed between the connection terminals 12A (32A) to the narrow gap. Is supplied from one opening side, so that the gap to which the sealing resin has been supplied is filled with the sealing resin, and the other opening of the gap to which the sealing resin is supplied later is filled. It is possible to prevent clogging with the sealing resin. For this reason, air is not trapped in the gap, and when the sealing resin is heat-treated, it is possible to prevent the air from expanding and peeling off or damaging the connection terminal. For this reason, the connection reliability of the connection part between the 1st and 2nd printed wiring boards can be improved.

〈プリント配線板の接続構造〉
次に、本実施の形態に係るプリント配線板の接続構造について、図２を用いて説明する。本実施の形態では、第１プリント配線板１０と、第２プリント配線板３０とを半田付けしている。そして、互いに上下に接合して半田付けされた接続端子１２Ａ、３２Ａとが接続してなる接続体同士の間隙２０に封止用樹脂としてのアンダーフィル４０が充填されている。このアンダーフィル４０は、矢印ｘ方向の両方の最外側に位置する接続体（接続端子１２Ａ、３２Ａ）の外側側壁にも設けられている。なお、アンダーフィル４０は、矢印ｘ方向の一方から他方の向きに（接続体同士の間隔が広い方から狭い方に向けて）移動しながら供給され、間隙２０内に毛細管現象により充填されたものである。そして、このアンダーフィル４０は、例えば１５０〜１６０℃にてオーブンなどで熱硬化させるか、紫外線照射により硬化させることによりプリント配線板の接合体を完成する。次いで、部品実装が必要である場合はリフロー炉にてはんだ付けが行われている。 <Connection structure of printed wiring board>
Next, a printed wiring board connection structure according to the present embodiment will be described with reference to FIG. In the present embodiment, the first printed wiring board 10 and the second printed wiring board 30 are soldered. Then, an underfill 40 serving as a sealing resin is filled in a gap 20 between the connection bodies formed by connecting the connection terminals 12A and 32A that are joined to each other and soldered to each other. The underfill 40 is also provided on the outer side wall of the connection body (connection terminal 12A, 32A) located on the outermost side in both directions of the arrow x. The underfill 40 is supplied while moving from one direction in the direction of the arrow x to the other direction (from the wide connection to the narrow one), and is filled in the gap 20 by capillary action. It is. And this underfill 40 completes the joined body of a printed wiring board by making it harden | cure in oven etc. at 150-160 degreeC, for example, or hardening by ultraviolet irradiation. Next, when component mounting is necessary, soldering is performed in a reflow furnace.

このような構成のプリント配線板の接続構造では、接続体同士の間の間隙２０の幅が、ｘ方向の一方から他方に向けて漸次狭くなるようにパターン設定されているため、間隙２０の幅が広いものから順に狭い間隙２０へ向けてアンダーフィル４０が供給されることにより、先にアンダーフィル４０が供給された間隙２０がアンダーフィル４０で満たされて、後にアンダーフィル４０が供給された間隙２０の開口部をアンダーフィル４０で塞ぐことを防止できる。   In the printed wiring board connection structure having such a configuration, the width of the gap 20 is set so that the width of the gap 20 between the connecting bodies gradually decreases from one side to the other side in the x direction. By supplying the underfill 40 from the widest one to the narrow gap 20 in order, the gap 20 to which the underfill 40 has been supplied first is filled with the underfill 40, and the gap to which the underfill 40 has been supplied later is filled. It is possible to prevent the 20 openings from being blocked by the underfill 40.

その理由は、幅の広い間隙２０は幅の狭い間隙２０より毛細管現象による浸入速度が遅くなるため、全ての間隙２０で同時に充填が終了するように調整することが可能となるためである。   The reason is that the wide gap 20 has a slower penetration rate due to capillary action than the narrow gap 20, and therefore, it is possible to adjust so that filling is completed in all the gaps 20 at the same time.

このため、間隙２０内に空気が閉じ込められることがなく、アンダーフィル４０を熱処理した際に、空気が膨脹して接続端子１２Ａ、３２Ａが剥離したり破損することを防止できる。したがって、プリント配線板間接続部の接続信頼性を向上できる。また、接続部１４、３４同士の接合強度を高める接続構造及び封止構造を実現できる。   For this reason, air is not confined in the gap 20, and when the underfill 40 is heat-treated, it is possible to prevent the air from expanding and causing the connection terminals 12A and 32A to peel off or break. Therefore, the connection reliability of the connection part between printed wiring boards can be improved. In addition, a connection structure and a sealing structure that increase the bonding strength between the connection portions 14 and 34 can be realized.

〈プリント配線板間接続部の封止方法〉
次に、図３〜図１３を用いてプリント配線板間接続部の封止方法を説明する。先ず、上記構成の第１プリント配線板１０と第２プリント配線板３０とを用意し、第１プリント配線板１０の接続部１４と、第２プリント配線板３０の接続部３４とを接合して、接続端子１２Ａと接続端子３２Ａとを半田付けして接続する。 <Method of sealing the connection between printed wiring boards>
Next, the sealing method of the connection part between printed wiring boards is demonstrated using FIGS. First, the first printed wiring board 10 and the second printed wiring board 30 configured as described above are prepared, and the connecting portion 14 of the first printed wiring board 10 and the connecting portion 34 of the second printed wiring board 30 are joined. The connection terminal 12A and the connection terminal 32A are soldered and connected.

次に、図３に示すように、第２プリント配線板３０の先端縁と第２プリント配線板３０のレジスト層（カバー層）１３の先端縁との間のｘ方向に沿って形成された隙間部分（間隙２０の一方の開口部が位置する部分）における、接続端子１２Ａ（３２Ａ）同士の間隔の最も広い間隙２０の入口近傍にアンダーフィル４０を供給するディスペンサ５０を配置させる。ディスペンサ５０が移動する位置はこの隙間部分である。なお、図４においては、斜線部がアンダーフィル４０を示し、太線の円はディスペンサ５０を示している。   Next, as shown in FIG. 3, a gap formed along the x direction between the leading edge of the second printed wiring board 30 and the leading edge of the resist layer (cover layer) 13 of the second printed wiring board 30. A dispenser 50 for supplying the underfill 40 is disposed in the vicinity of the entrance of the gap 20 having the widest gap between the connection terminals 12A (32A) in the portion (the portion where one opening of the gap 20 is located). The position where the dispenser 50 moves is this gap portion. In FIG. 4, the hatched portion indicates the underfill 40, and the bold circle indicates the dispenser 50.

そして、ディスペンサ５０から所定流量のアンダーフィル４０を吐出させながら、接続端子１２Ａ（３２Ａ）同士の間隔の最も狭い間隙２０の方へ向けて所定の速度で移動させる。   Then, while discharging the underfill 40 at a predetermined flow rate from the dispenser 50, the dispenser 50 is moved at a predetermined speed toward the gap 20 having the narrowest interval between the connection terminals 12A (32A).

図５は、ディスペンサ５０が第１プリント配線板１０及び第２プリント配線板３０の接合部のｘ方向の中央部を通過した位置に配置されている場合を示している。この時点では、最初にアンダーフィル４０が供給された間隙２０に毛細管現象により浸入したアンダーフィル４０は間隙２０のｘ方向の幅（Ｓ１）が広い（断面積が大きい）ため、遅い浸入速度で間隙２０内を他方の開口部へ向けて進んでいる。そして、２番目に広い幅（Ｓ２）の間隙２０では、先の間隙２０よりも浸入した長さは短いが、先の間隙２０よりは断面積が狭いため浸入速度は速い。同様に、３番目に広い幅（Ｓ３）の間隙２０では、２番目に広い幅（Ｓ２）の間隙２０よりも浸入した長さは短いが、２番目に広い幅（Ｓ２）の間隙２０よりは断面積が狭いため浸入速度は速い。以後の間隙２０においても浸入速度と浸入長さの関係は上記した関係と同様である。   FIG. 5 shows a case where the dispenser 50 is disposed at a position passing through the central portion in the x direction of the joint portion of the first printed wiring board 10 and the second printed wiring board 30. At this time, since the underfill 40 that has entered the gap 20 to which the underfill 40 is first supplied by capillarity has a wide width (S1) in the x direction of the gap 20 (large cross-sectional area), the gap has a low penetration speed. 20 is proceeding toward the other opening. In the gap 20 having the second widest width (S2), the penetration depth is shorter than that of the previous gap 20, but the penetration speed is faster because the cross-sectional area is narrower than that of the previous gap 20. Similarly, in the gap 20 having the third widest width (S3), the intrusion length is shorter than that in the gap 20 having the second widest width (S2), but compared to the gap 20 having the second widest width (S2). Since the cross-sectional area is narrow, the penetration speed is fast. In the subsequent gap 20 as well, the relationship between the penetration speed and the penetration length is the same as that described above.

その後、図６に示すように、第１プリント配線板１０の接続部１４におけるｘ方向の端部（最も狭い間隙２０の入口近傍）まで、ディスペンサ５０が移動した状態を示している。この時点では、図２に示す間隔Ｓ１〜Ｓ８のそれぞれの間隙２０では、アンダーフィル４０が毛細管現象により浸入している。ここで、相対的に広い間隙２０では狭い間隙２０に比べてアンダーフィル４０の浸入時間が長いため浸入長さは長くなっており、相対的に幅が狭い間隙２０では浸入速度が速くなっている。   Thereafter, as shown in FIG. 6, the dispenser 50 is moved to the end in the x direction (near the entrance of the narrowest gap 20) in the connection portion 14 of the first printed wiring board 10. At this time, the underfill 40 has infiltrated in the gaps 20 of the intervals S1 to S8 shown in FIG. 2 due to capillary action. Here, since the penetration time of the underfill 40 is longer in the relatively wide gap 20 than in the narrow gap 20, the penetration length is longer, and the penetration speed is faster in the relatively narrow gap 20. .

図７は、図６に示す状態から所定の時間が経過した状態を示している。図７に示すように、所定の時間が経過したことにより、各間隙２０では、アンダーフィル４０が他方の開口部へ向けて浸入している。このとき、相対的に幅が狭い間隙２０では、幅が広い間隙２０よりもアンダーフィル４０の浸入速度が速いため、図７に示すように、相対的に幅が広い間隙２０に対して浸入長さが追い付き始める。   FIG. 7 shows a state where a predetermined time has elapsed from the state shown in FIG. As shown in FIG. 7, under a predetermined time, the underfill 40 enters the other opening in each gap 20. At this time, in the gap 20 having a relatively narrow width, the penetration speed of the underfill 40 is faster than that in the gap 20 having a wide width. Therefore, as shown in FIG. Begins to catch up.

さらに、所定の時間が経過すると、図８に示すように、全部の間隙２０でアンダーフィル４０が他方の開口部に到達した状態となり、その後、図９に示すように、第１プリント配線板１０の先端縁と第２プリント配線板３０のレジスト層３３の先端縁との間の隙間をアンダーフィル４０が覆った状態となる。   Further, when a predetermined time elapses, as shown in FIG. 8, the underfill 40 reaches the other opening in all the gaps 20, and thereafter, as shown in FIG. The underfill 40 covers the gap between the leading edge of the second printed wiring board 30 and the leading edge of the resist layer 33 of the second printed wiring board 30.

このようにしてアンダーフィル４０の封止工程が終了する。その後、アンダーフィル４０を例えば１５０〜１６０℃にてオーブンなどで熱硬化させるか、紫外線照射により硬化させることによりプリント配線板の接合体を完成させる。次いで、部品実装が必要である場合はリフロー炉にてはんだ付けを行う。   In this way, the sealing process of the underfill 40 is completed. Thereafter, the underfill 40 is thermally cured, for example, in an oven at 150 to 160 ° C., or is cured by ultraviolet irradiation, thereby completing a printed wiring board assembly. Next, when component mounting is necessary, soldering is performed in a reflow furnace.

ここで、図１０〜図１３を用いて、順次、間隙２０内にアンダーフィル４０を浸入させるときの設定条件について説明する。なお、図１０〜図１３は、説明の便宜上、間隙２０の数を３つ、すなわち導体（上下一対の接続端子）の数を４つとした場合である。なお、上記第１プリント配線板１０と第２プリント配線板３０と対応する部分に同一の符号を付して説明する。図１０は最も広い間隙２０にアンダーフィル４０を充填し始めた時点の状態を示す平面図、図１１は図１０のＢ−Ｂ断面図、図１２は２番目に広い間隙２０にアンダーフィル４０を充填し始めた時点の状態を示す平面図、図１３は最も狭い間隙２０にアンダーフィル４０を充填し始めた時点の状態を示す平面図である。   Here, using FIG. 10 to FIG. 13, setting conditions when the underfill 40 enters the gap 20 sequentially will be described. 10 to 13 show a case where the number of the gaps 20 is three, that is, the number of conductors (a pair of upper and lower connection terminals) is four for convenience of explanation. In addition, the same code | symbol is attached | subjected and demonstrated to the part corresponding to the said 1st printed wiring board 10 and the 2nd printed wiring board 30. 10 is a plan view showing a state when the underfill 40 is started to fill the widest gap 20, FIG. 11 is a sectional view taken along line BB of FIG. 10, and FIG. 12 shows the underfill 40 in the second widest gap 20. FIG. 13 is a plan view showing a state at the time when the underfill 40 is started to fill the narrowest gap 20.

この例では、半田付けにより接続された接続端子１２Ａ、３２Ａでなる導体（接続体）Ｍの幅が全て同一であり、ピッチがＰ１からＰ３まで漸次狭くなるように設定されている。従って、間隙２０もＳ１からＳ３まで漸次狭くなるようになっている。この例は、図１０、図１２及び図１３に示すように、広い間隔Ｓ１の間隙２０から狭い間隔Ｓ３の間隙２０の順にディスペンサ５０によりアンダーフィル４０を充填する場合を示している。本来、ディスペンサ５０は、３つの間隙２０の部分だけでなく、導体の部分も封止するように移動して充填するべきであるが、ここでは説明の便宜のため、間隔Ｓ１の間隙２０にｔ１時間充填、その後、間隔Ｓ２の間隙２０に移動してｔ２時間の充填、最後に間隔Ｓ３の間隙２０に移動してｔ３時間の充填を行うものとして説明する。   In this example, the widths of the conductors (connection bodies) M made up of the connection terminals 12A and 32A connected by soldering are all the same, and the pitch is set so as to gradually narrow from P1 to P3. Accordingly, the gap 20 is gradually narrowed from S1 to S3. In this example, as shown in FIGS. 10, 12, and 13, the underfill 40 is filled by the dispenser 50 in the order of the gap 20 with the wide gap S <b> 1 to the gap 20 with the narrow gap S <b> 3. Originally, the dispenser 50 should move and fill not only the three gaps 20 but also the conductors, but here, for convenience of explanation, the dispenser 50 has t1 in the gap 20 of the gap S1. In the following description, it is assumed that the filling is performed for the time t2, and then the gap 20 at the interval S2 is moved to t2 hours, and finally, the gap 20 is moved to the gap 20 at the interval S3.

各間隙２０におけるアンダーフィル４０の充填の平均速度をそれぞれ、ｖ１、ｖ２、ｖ３とすると、それぞれアンダーフィル４０び浸入（透過）距離Ｙ１、Ｙ２、Ｙ３は、下記の式で表すことができる。   If the average filling speed of the underfill 40 in each gap 20 is v1, v2, and v3, respectively, the underfill 40 penetration (permeation) distances Y1, Y2, and Y3 can be expressed by the following equations.

Ｙ１＝ｖ１・（ｔ１＋ｔ２＋ｔ３）
Ｙ２＝ｖ２・（ｔ２＋ｔ３）
Ｙ３＝ｖ３・ｔ３
これらの浸入距離Ｙ１、Ｙ２、Ｙ３の全てが、導体Ｍの長さＬに等しくなるようにスペース幅（間隙２０の幅）を設計してｖ１、ｖ２、ｖ３を調整すれば、全ての間隙２０に同時にアンダーフィル４０の充填が終わることになる。 Y1 = v1 · (t1 + t2 + t3)
Y2 = v2 · (t2 + t3)
Y3 = v3 · t3
If the space width (width of the gap 20) is designed and v1, v2, and v3 are adjusted so that all of the penetration distances Y1, Y2, and Y3 are equal to the length L of the conductor M, all the gaps 20 are obtained. At the same time, the filling of the underfill 40 ends.

一例として、ｔ１＝ｔ２＝ｔ３＝Ｔとして３箇所とも同じ充填作業する場合を考えると、上式から、
ｖ１・３・Ｔ＝ｖ２・２・Ｔ＝ｖ３・Ｔ
となり、
ｖ１：ｖ２：ｖ３＝１：２：３
の関係であればよいことになる。 As an example, consider the case where t1 = t2 = t3 = T and the same filling operation is performed at all three locations.
v1 ・ 3 ・ T = v2 ・ 2 ・ T = v3 ・ T
And
v1: v2: v3 = 1: 2: 3
If it is a relationship, it will be good.

上述したように、アンダーフィル４０の充填は毛細管現象によるため、充填速度は間隙２０の断面積が小さいほど速くなる。通常、間隙２０の断面積は、接続する２つのプリント配線板の接続端子の厚さの和に、間隙２０の幅寸法を乗じたものであり、間隙２０によって接続端子の厚さを変えることは困難であるから、間隙２０の幅を変えて浸入（浸透）速度を調整することが現実的である。   As described above, the filling of the underfill 40 is due to the capillary phenomenon, so that the filling speed increases as the cross-sectional area of the gap 20 decreases. In general, the cross-sectional area of the gap 20 is obtained by multiplying the sum of the thicknesses of the connection terminals of the two printed wiring boards to be connected by the width dimension of the gap 20. Since it is difficult, it is realistic to adjust the penetration (penetration) speed by changing the width of the gap 20.

但し、実際には、どのような間隙２０の幅にすると、どのような浸入速度になるかについては、アンダーフィル４０に接触する周囲の接続端子や絶縁性基板などの表面の界面状態やアンダーフィルの特性など勘案して設定する必要がある。   However, in actuality, what kind of gap 20 width and what kind of penetration speed is obtained depends on the interface state of the surface of the surrounding connection terminals and the insulating substrate contacting the underfill 40 and the underfill. It is necessary to set in consideration of the characteristics of the.

（第２の実施の形態）
次に、図１４〜図２０を用いて、本発明の第２の実施の形態について説明する。なお、本実施の形態のプリント配線板の接続構造において、上記第１の実施の形態と同様の部分には同様の符号を付して説明を省略する。 (Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. In the printed wiring board connection structure of the present embodiment, the same reference numerals are given to the same parts as those of the first embodiment, and the description thereof is omitted.

本実施の形態では、第１プリント配線板１０Ａは、複数（７つ）の配線１２の接続端子１２Ａのピッチが一定で、接続端子１２Ａの幅が異なるように設定されている。そして、接続端子１２Ａ同士の間の６つの間隙２０の間隔Ｓ１〜Ｓ６は、図１５に示すように、Ｓ４＞Ｓ５＞Ｓ６＞Ｓ３＞Ｓ２＞Ｓ１の関係に設定されている。このような関係を満足するために接続端子１２Ａの幅寸法を変えたことにより、配線１２の端部の接続端子１２Ａの平面形状は、図１４に示す通りである。   In the present embodiment, the first printed wiring board 10A is set so that the pitch of the connection terminals 12A of the plurality (seven) of the wirings 12 is constant and the width of the connection terminals 12A is different. Then, the intervals S1 to S6 of the six gaps 20 between the connection terminals 12A are set to a relationship of S4> S5> S6> S3> S2> S1, as shown in FIG. By changing the width dimension of the connection terminal 12A in order to satisfy such a relationship, the planar shape of the connection terminal 12A at the end of the wiring 12 is as shown in FIG.

本実施の形態の第２プリント配線板３０Ａは、上記第１プリント配線板１０Ａの接続部１４の接続端子１２Ａと対応する接続端子３２Ａを備えること以外は、上記した第１の実施の形態と同様である。   The second printed wiring board 30A of the present embodiment is the same as the first embodiment described above except that it includes a connection terminal 32A corresponding to the connection terminal 12A of the connection portion 14 of the first printed wiring board 10A. It is.

第１プリント配線板１０Ａと第２プリント配線板３０Ａとを接続するには、半田めっき層を形成する半田付けや、異方導電性のペーストやフィルムなどを用いた接続方法を用いることができる。   In order to connect the first printed wiring board 10A and the second printed wiring board 30A, a soldering method for forming a solder plating layer or a connection method using an anisotropic conductive paste or film can be used.

このような接続端子１２Ａ、３２Ａの配置構造を有する第１及び第２プリント配線板１０Ａ、３０Ａの接続構造では、アンダーフィル４０を供給する順序が、上記した間隔の広い間隙２０の順となる。   In the connection structure of the first and second printed wiring boards 10A and 30A having such an arrangement structure of the connection terminals 12A and 32A, the order in which the underfill 40 is supplied is the order of the gaps 20 having the wide intervals described above.

第１プリント配線板１０Ａ及び第２プリント配線板３０Ａにおいて、接続端子１２Ａ（３２Ａ）同士の間隔が、広い順にディスペンサ５０を移動させるため、最初にディスペンサ５０を配置する位置は、図１４に示すようにほぼ中央に位置する間隙２０の端部（一方の開口部）近傍となる。   In the first printed wiring board 10A and the second printed wiring board 30A, since the dispenser 50 is moved in the order in which the interval between the connection terminals 12A (32A) is wide, the position where the dispenser 50 is first arranged is as shown in FIG. In the vicinity of the end (one opening) of the gap 20 located substantially at the center.

次に、図１６に示すように、ディスペンサ５０を、接続端子１２Ａ（３２Ａ）の延在方向と直交する矢印ｘ方向に沿って、中央位置から図面右側方向へ向けて移動させる。すると、接続端子１２Ａ（３２Ａ）同士の間に形成される間隙２０の幅が広いものから順に狭い間隙へ向けてアンダーフィル４０が供給される。   Next, as shown in FIG. 16, the dispenser 50 is moved from the center position toward the right side of the drawing along the arrow x direction orthogonal to the extending direction of the connection terminal 12A (32A). Then, the underfill 40 is supplied from the widest gap 20 formed between the connection terminals 12A (32A) toward the narrower gap in order.

次に、図１７に示すように、最初にアンダーフィル４０を供給した間隙２０の矢印ｘ方向の反対側の間隙２０の入口部分にディスペンサ５０を移動させてアンダーフィル４０の供給を行う。続いてい、図１８に示すように、矢印ｘ方向の反対向きの端部までディスペンサ５０を移動させる。   Next, as shown in FIG. 17, the underfill 40 is supplied by moving the dispenser 50 to the inlet portion of the gap 20 on the opposite side of the gap 20 to which the underfill 40 is first supplied in the arrow x direction. Subsequently, as shown in FIG. 18, the dispenser 50 is moved to the end opposite to the arrow x direction.

そして、所定時間が経過すると、アンダーフィル４０は間隙２０内に浸入して図１９に示すように間隙２０の他方の開口部に至る。さらに、所定時間が経過すると、図２０に示すように、第１プリント配線板１０Ａの先端縁と第２プリント配線板３０のレジスト層との間の隙間を覆うように形成する。   When a predetermined time has elapsed, the underfill 40 enters the gap 20 and reaches the other opening of the gap 20 as shown in FIG. Furthermore, when a predetermined time has elapsed, as shown in FIG. 20, the gap is formed so as to cover the gap between the leading edge of the first printed wiring board 10 </ b> A and the resist layer of the second printed wiring board 30.

このように間隙２０の間隔を漸次変えたことにより、先にアンダーフィル４０が供給された間隙２０はアンダーフィル４０で満たされて、後にアンダーフィル４０が供給された間隙２０の開口部へ流れてアンダーフィル４０でこの開口部を塞ぐことを防止できる。 このため、間隙２０内に空気が閉じ込められることがなく、アンダーフィル４０を熱処理した際に、空気が膨脹して接続端子１２Ａ、３２Ａが剥離したり破損することを防止できる。このため、第１、第２プリント配線板１０Ａ、３０Ａ間接続部の接続信頼性を向上できる。   As the gap 20 is gradually changed in this way, the gap 20 to which the underfill 40 has been supplied first is filled with the underfill 40 and then flows to the opening of the gap 20 to which the underfill 40 has been supplied. The underfill 40 can prevent the opening from being blocked. For this reason, air is not confined in the gap 20, and when the underfill 40 is heat-treated, it is possible to prevent the air from expanding and causing the connection terminals 12A and 32A to peel off or break. For this reason, the connection reliability of the connection part between the 1st and 2nd printed wiring boards 10A and 30A can be improved.

本実施の形態では、複数の間隙２０のうち中央に位置する間隙２０の幅を広く設定し、この間隙２０よりｘ方向の一方側に位置する間隙２０の幅を順次狭くしている。また、この中央に位置する間隙２０のｘ方向の他方側に隣接する間隙２０の幅を、ｘ方向の一方側の端部に位置する間隙２０の幅よりやや狭く設定し、中央に位置する間隙２０のｘ方向の他方側に隣接する間隙２０からｘ方向の他方側へ向けて間隙２０の幅を順次狭くしている。このため、接続端子１２Ａ（３２Ａ）間の幅の調整の自由度が高く、端子群の幅を小さくできるという利点がある。   In the present embodiment, the width of the gap 20 located at the center among the plurality of gaps 20 is set wider, and the width of the gap 20 located on one side in the x direction is sequentially narrowed from the gap 20. Further, the width of the gap 20 adjacent to the other side in the x direction of the gap 20 located at the center is set slightly narrower than the width of the gap 20 located at one end in the x direction, and the gap located at the center. The width of the gap 20 is gradually reduced from the gap 20 adjacent to the other side in the x direction toward the other side in the x direction. For this reason, there is an advantage that the degree of freedom in adjusting the width between the connection terminals 12A (32A) is high, and the width of the terminal group can be reduced.

（その他の実施の形態）
上述した実施の形態の開示の一部をなす論述および図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施の形態、実施例および運用技術が明らかとなろう。 (Other embodiments)
It should not be understood that the descriptions and drawings which form part of the disclosure of the above-described embodiments limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

例えば、上述した第１及び第２の実施の形態では、接続部における接続端子の数が９つや７つの場合について説明したが、少なくとも３つ以上の接続端子を備える接続部であればよい。   For example, in the first and second embodiments described above, the case where the number of connection terminals in the connection unit is nine or seven has been described, but any connection unit including at least three or more connection terminals may be used.

上述した第１の実施の形態及び第２の実施の形態では、複数の接続端子で幅寸法が一定でピッチが漸次小さくなる場合と、ピッチが一定で接続端子の幅寸法が異なる場合と、を説明したが、複数の接続端子で、ピッチと接続端子の幅寸法の両方が異なる場合も本発明の適用範囲である。   In the first embodiment and the second embodiment described above, a case where the width dimension is constant and the pitch gradually decreases among a plurality of connection terminals, and a case where the pitch is constant and the width dimensions of the connection terminals are different. As described above, the present invention is also applicable to the case where both the pitch and the width dimension of the connection terminal are different in a plurality of connection terminals.

本発明の第１の実施の形態に係るプリント配線板の接続構造を示す平面図である。It is a top view which shows the connection structure of the printed wiring board which concerns on the 1st Embodiment of this invention. 図１のＡ−Ａ断面図である。It is AA sectional drawing of FIG. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を示す斜視図である。It is a perspective view which shows the sealing method of the connection part between printed wiring boards which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 1st Embodiment of this invention. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を模式的に示す平面説明図である。It is a plane explanatory view showing typically the sealing method of the connecting part between printed wiring boards concerning a 1st embodiment of the present invention. 図１０のＢ−Ｂ断面説明図である。It is BB sectional explanatory drawing of FIG. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を模式的に示す平面説明図である。It is a plane explanatory view showing typically the sealing method of the connecting part between printed wiring boards concerning a 1st embodiment of the present invention. 本発明の第１の実施の形態に係るプリント配線板間接続部の封止方法を模式的に示す平面説明図である。It is a plane explanatory view showing typically the sealing method of the connecting part between printed wiring boards concerning a 1st embodiment of the present invention. 本発明の第２の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 2nd Embodiment of this invention. 図１４のＣ−Ｃ断面図である。It is CC sectional drawing of FIG. 本発明の第２の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 2nd Embodiment of this invention. 本発明の第２の実施の形態に係るプリント配線板間接続部の封止方法を示す平面図である。It is a top view which shows the sealing method of the connection part between printed wiring boards which concerns on the 2nd Embodiment of this invention. （ａ）〜（ｃ）は、従来のプリント配線板間接続部の封止方法を示す平面図である。(A)-(c) is a top view which shows the sealing method of the conventional connection part between printed wiring boards.

符号の説明Explanation of symbols

Ｐ１〜Ｐ３ ピッチ
１０，１０Ａ 第１プリント配線板
１１ 絶縁性基板
１２ 配線
１２Ａ 接続端子
１３ レジスト層
１４ 端子部
２０ 間隙
３０，３０Ａ 第２プリント配線板
３１ 絶縁性基板
３２ 配線
３２Ａ 接続端子
３３ レジスト層
３４ 接続部
４０ アンダーフィル
５０ ディスペンサ P1 to P3 Pitch 10, 10A First printed wiring board 11 Insulating substrate 12 Wiring 12A Connection terminal 13 Resist layer 14 Terminal portion 20 Gap 30, 30A Second printed wiring board 31 Insulating substrate 32 Wiring 32A Connection terminal 33 Resist layer 34 Connection 40 Underfill 50 Dispenser

Claims (10)

少なくとも３つ以上の接続端子が互いに平行をなし且つ表面に露出して配置された接続部を有し、前記接続部の前記接続端子が、相手側プリント配線板の接続部に備えられた対応する相手側接続端子と接合されるプリント配線板であって、
前記接続端子同士の間隔が、前記接続端子と直交する特定方向に沿って漸次狭くなるようにパターン設定されたことを特徴とするプリント配線板。 At least three or more connection terminals have a connection part arranged parallel to each other and exposed on the surface, and the connection terminal of the connection part is provided in the connection part of the counterpart printed wiring board. A printed wiring board to be joined to a mating connection terminal,
The printed wiring board is characterized in that a pattern is set so that an interval between the connection terminals is gradually narrowed along a specific direction orthogonal to the connection terminals. 前記間隙の一方の開口部側は、前記封止用樹脂が前記特定方向に沿って一定の速度で塗布されるように設定されていることを特徴とする請求項１に記載されたプリント配線板。   2. The printed wiring board according to claim 1, wherein one opening side of the gap is set so that the sealing resin is applied at a constant speed along the specific direction. . 前記接続部は、前記特定方向に沿って前記接続端子のピッチが漸次短くなることを特徴とする請求項１又は請求項２に記載されたプリント配線板。   The printed wiring board according to claim 1, wherein the connection portion has a pitch of the connection terminals that gradually decreases along the specific direction. 前記接続部は、前記特定方向に沿って、前記接続端子が一定のピッチで配置され且つ前記接続端子の幅寸法が漸次大きくなることを特徴とする請求項１又は請求項２に記載されたプリント配線板。   3. The print according to claim 1, wherein the connection portion has the connection terminals arranged at a constant pitch along the specific direction, and the width dimension of the connection terminals gradually increases. 4. Wiring board. 前記接続部は、前記特定方向の中央位置の前記接続端子同士の間隔が最も広く、中央位置から両外側位置へ向けて前記接続端子同士の間隔が漸次狭くなるように設定されていることを特徴とする請求項１又は請求項２に記載されたプリント配線板。   The connection portion is set such that the distance between the connection terminals at the center position in the specific direction is the widest, and the distance between the connection terminals gradually decreases from the center position toward both outer positions. The printed wiring board according to claim 1 or 2. 少なくとも３つ以上の第１接続端子が互いに平行をなし且つ表面に露出して配置されると共に、前記第１接続端子と直交する特定方向に沿って、前記第１接続端子同士の間隔が、漸次狭くなるように設定された第１接続部を有する第１プリント配線板と、
前記第１接続端子のそれぞれに対応するように形成された第２接続端子が表面に露出して配置された第２接続部を有し、前記第２接続端子がそれぞれ対応する前記第１接続端子と接続されている第２プリント配線板と、
前記第１接続端子と前記第２接続端子とが接合されてなる端子接続体同士の間隙に充填された封止用樹脂と、
を備えることを特徴とするプリント配線板の接続構造。 At least three or more first connection terminals are arranged parallel to each other and exposed on the surface, and the interval between the first connection terminals gradually increases along a specific direction orthogonal to the first connection terminals. A first printed wiring board having a first connection portion set to be narrow;
The second connection terminal formed so as to correspond to each of the first connection terminals has a second connection portion disposed so as to be exposed on the surface, and the first connection terminals corresponding to the second connection terminals, respectively. A second printed wiring board connected to
A sealing resin filled in a gap between terminal connection bodies formed by bonding the first connection terminal and the second connection terminal;
A printed wiring board connection structure comprising: 前記封止用樹脂は、前記特定方向に沿って移動しながら供給され、前記間隙内に毛細管現象により充填されたものであることを特徴とする請求項６に記載されたプリント配線板の接続構造。   The printed wiring board connection structure according to claim 6, wherein the sealing resin is supplied while moving along the specific direction, and is filled in the gap by capillary action. . 前記第１接続部は、前記特定方向の中央に位置する前記第１接続端子同士の間隔が最も広く、中央位置から両外側位置へ向けて前記第１接続端子同士の間隔が漸次狭くなるように設定され、
前記第２接続部の第２接続端子は、前記第１接続端子の配置と対応して同様の配置に設定されていることを特徴とする請求項６又は請求項７に記載されたプリント配線板の接続構造。 In the first connection portion, the interval between the first connection terminals located at the center in the specific direction is the widest, and the interval between the first connection terminals gradually decreases from the center position toward both outer positions. Set,
8. The printed wiring board according to claim 6, wherein the second connection terminal of the second connection portion is set in the same arrangement corresponding to the arrangement of the first connection terminal. 9. Connection structure. 複数の前記端子接続体のうち、前記特定方向の両方の最外側に位置する前記端子接続体の外側壁にも、前記封止用樹脂が設けられていることを特徴とする請求項６乃至請求項８のいずれか一項に記載されたプリント配線板の接続構造。   The sealing resin is provided on an outer wall of the terminal connection body located on the outermost side in both of the specific directions among the plurality of terminal connection bodies. Item 9. A printed wiring board connection structure according to any one of Items 8 to 9. 少なくとも３つ以上の第１接続端子が互いに平行をなし且つ表面に露出して配置されると共に、前記第１接続端子と直交する特定方向に沿って、前記第１接続端子同士の間隔が、漸次狭くなるように設定された第１接続部を有する第１プリント配線板を用意する工程と、
前記第１接続端子のそれぞれに対応するように形成された第２接続端子が表面に露出して配置された第２接続部を有する第２プリント配線板を用意する工程と、
前記第１プリント配線板の前記第１接続部と、前記第２プリント配線板の第２接続部とを接合して、前記第１接続端子と前記第２接続端子とを接続させる工程と、
前記特定方向に沿って封止用樹脂を移動しながら供給して、前記第１接続端子と前記第２接続端子とが接続してなる端子接続体同士の間隙内に、前記封止用樹脂を毛細管現象により充填させる工程と、
前記封止用樹脂を硬化させる工程と、
を備えることを特徴とするプリント配線板間接続部の封止方法。 At least three or more first connection terminals are arranged parallel to each other and exposed on the surface, and the interval between the first connection terminals gradually increases along a specific direction orthogonal to the first connection terminals. Preparing a first printed wiring board having a first connection portion set to be narrow;
A step of preparing a second printed wiring board having a second connection portion disposed so that the second connection terminals formed to correspond to the first connection terminals are exposed on the surface;
Joining the first connection part of the first printed wiring board and the second connection part of the second printed wiring board to connect the first connection terminal and the second connection terminal;
The sealing resin is supplied while moving the sealing resin along the specific direction, and the sealing resin is inserted into a gap between the terminal connection bodies formed by connecting the first connection terminal and the second connection terminal. Filling with capillarity,
Curing the sealing resin;
A method for sealing a connecting portion between printed wiring boards, comprising:
JP2005341034A 2005-11-25 2005-11-25 Printed wiring board, connection structure thereof, and sealing method for connection part therebetween Pending JP2007149888A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002232133A (en) * 2001-01-31 2002-08-16 Denso Corp Connecting method for board, connection structure, and multilayer board
JP2005183589A (en) * 2003-12-18 2005-07-07 Fujikura Ltd Junction and its production process

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002232133A (en) * 2001-01-31 2002-08-16 Denso Corp Connecting method for board, connection structure, and multilayer board
JP2005183589A (en) * 2003-12-18 2005-07-07 Fujikura Ltd Junction and its production process

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