JP2007149810A5 - - Google Patents

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Publication number
JP2007149810A5
JP2007149810A5 JP2005339877A JP2005339877A JP2007149810A5 JP 2007149810 A5 JP2007149810 A5 JP 2007149810A5 JP 2005339877 A JP2005339877 A JP 2005339877A JP 2005339877 A JP2005339877 A JP 2005339877A JP 2007149810 A5 JP2007149810 A5 JP 2007149810A5
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
insulating
wiring board
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005339877A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007149810A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005339877A priority Critical patent/JP2007149810A/ja
Priority claimed from JP2005339877A external-priority patent/JP2007149810A/ja
Publication of JP2007149810A publication Critical patent/JP2007149810A/ja
Publication of JP2007149810A5 publication Critical patent/JP2007149810A5/ja
Pending legal-status Critical Current

Links

JP2005339877A 2005-11-25 2005-11-25 発光素子用配線基板および発光装置 Pending JP2007149810A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005339877A JP2007149810A (ja) 2005-11-25 2005-11-25 発光素子用配線基板および発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005339877A JP2007149810A (ja) 2005-11-25 2005-11-25 発光素子用配線基板および発光装置

Publications (2)

Publication Number Publication Date
JP2007149810A JP2007149810A (ja) 2007-06-14
JP2007149810A5 true JP2007149810A5 (cg-RX-API-DMAC10.html) 2008-05-22

Family

ID=38210882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005339877A Pending JP2007149810A (ja) 2005-11-25 2005-11-25 発光素子用配線基板および発光装置

Country Status (1)

Country Link
JP (1) JP2007149810A (cg-RX-API-DMAC10.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021426A (ja) * 2007-07-12 2009-01-29 Sharp Corp チップ部品型ｌｅｄ及びその製造方法
EP2017897A1 (en) * 2007-07-16 2009-01-21 ILED Photoelectronics Inc. Package structure for a high-luminance light source
DE112010002822T5 (de) 2009-07-03 2012-06-14 Seoul Semiconductor Co., Ltd. Gehäuse für licht emittierende dioden
JP2011060960A (ja) * 2009-09-09 2011-03-24 Toshiba Lighting & Technology Corp 発光モジュール
CN103078040B (zh) * 2011-08-22 2016-12-21 Lg伊诺特有限公司 发光器件封装件和光装置
US8773006B2 (en) * 2011-08-22 2014-07-08 Lg Innotek Co., Ltd. Light emitting device package, light source module, and lighting system including the same
JP7048228B2 (ja) * 2017-08-23 2022-04-05 スタンレー電気株式会社 半導体発光装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295519B2 (ja) * 2003-01-28 2009-07-15 京セラ株式会社 発光素子収納用パッケージおよび発光装置

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