JP2007142294A - Heat sink device, separating jig, and electronic device equipped with the heat sink device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem, wherein it is difficult to separate a semiconductor element to which a heat sink has been bonded, by pressing a separation jig into a cement applied part in between the semiconductor element and the heat sink in the transverse direction of a printed circuit board for separating the semiconductor element from a heat dissipation fin, or by inserting a pin into a through hole formed in the heat dissipation fin and raising an end of the heat sink by fingers, while pressing the semiconductor element by the pin, since there is no empty space for inserting the separation jig or fingers, because other circuit components are mounted densely on the circuit board. <P>SOLUTION: The heat sink device having a heating element and the heat sink which are bonded via the cement. In this case, a threaded through-hole for separation is formed in the upper part of the heat sink for separating the heat sink from the heating element, and a separation jig is provided which screws into the threaded hole for separation. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heat radiating device having a heat radiating body provided with a separation jig and a heat generating body, and an electronic device in which the heat radiating device is mounted on a printed circuit board.

  In recent years, electronic devices mounted on information equipment have many electronic components mounted on a printed circuit board at high density. Some of the electronic components to be mounted are heating elements, such as semiconductor elements, that generate a lot of heat during operation due to high performance. On the upper part of the semiconductor element, a heat radiating body having heat radiating fins is joined by a heat conductive joining material. In recent years, electronic devices tend to have electronic components mounted on a printed circuit board at a higher density.

FIG. 5 is a cross-sectional view of an electronic device according to the prior art.
In order to make the explanation easy to understand, the drawing shows one semiconductor element and other parts adjacent to each other, but in reality, many parts are mounted.

  1 is an electronic device, 2 is a printed circuit board, 3 is a socket, 31 is a socket lock pin, 4 is a heating element (semiconductor element) that generates heat during operation, 41 is another electronic component adjacent to the heating element (semiconductor element) 5 is a bonding agent, 6 is a heat radiating body, and 61 is a heat radiating fin formed on the heat radiating body.

The manufacturing method of this electronic device is performed as follows.
First, for example, the printed circuit board 2 is prepared. The printed circuit board 2 is electrically connected to a socket 3. Generally, conductive connection is made by soldering. This socket 3 has a number of terminals and a lock pin 31. Next, the terminal of the semiconductor element 4 is inserted into the terminal of the socket 3. Then, the terminal of the socket 3 and the terminal of the semiconductor element 4 are fixed by the lock pin 31. Subsequently, the semiconductor element 4 and the heat dissipating body 6 having the heat dissipating fins 61 are bonded and fixed via the bonding agent 5 having good thermal conductivity. Therefore, the socket 3 is hidden under the radiator 6.

On the other hand, the semiconductor element 4 may be detached from or attached to the socket 3. For example, when the electronic device 1 fails or when the printed circuit board 2 is tested. Specifically, when a failure occurs, the semiconductor element 4 is removed from the socket 3, and the printed circuit board 2 or the semiconductor element 4 is checked for normality or failure. Thereafter, the defective semiconductor element 4 is replaced with a non-defective semiconductor element 4 and reattached to the socket 3. However, the lock pin 31 cannot be released because the socket 3 is hidden under the heat radiating body 6 at the time of attachment / detachment. Accordingly, the semiconductor element 4 and the radiator 6 are separated. There is the following patent document 1 as a technique similar to this.
JP, 2005-136197, A The semiconductor element of the above-mentioned patent documents 1 is joined with a heat sink, and a separating jig is pushed into this bonding agent application part from the side of a printed circuit board, and a semiconductor element and a heat sink are separated. is doing. Alternatively, a pin is inserted into a through-hole provided in the heat radiating member to press the semiconductor element, and the end of the heat radiating member is separated with a finger.

  However, a method of separating the semiconductor element and the heat radiating fin by inserting a separation jig into the bonding agent application portion from the lateral direction of the printed circuit board, or inserting a pin into a through hole provided in the heat radiating body, and inserting The method of causing the end of the radiator to be pressed with a finger while pressing the semiconductor element with a pin is because a large number of components are mounted on the printed circuit board at high density. There is no free space to insert. For this reason, other electronic components adjacent to the heating element must be removed as a pre-process for separating the semiconductor element and the heat radiating body. Therefore, such a separation method requires a lot of man-hours. Further, since the other electronic components adjacent to the heating element are removed and attached, the reliability of the conductive connection with the printed circuit board is lowered.

    The present invention provides a heat radiating device in which a heating element and a heat radiating body are bonded via a bonding agent, and has a through screw hole for separation that separates the heat radiating body and the heat radiating body above the heat radiating body. A heat dissipating device having a separating jig screwed into the separating screw hole is provided.

  Such a configuration, specifically, a separation screw hole penetrating from above is provided in the radiator. Therefore, the separation jig can be screwed into the separation screw hole and rotated. Further, the separation screw hole is a through-hole penetrating from above to separate the heat dissipating body and the heat generating body in at least one place in a region in contact with the heat dissipating body and the heat generating body. Provide equipment. Thus, the position of the separation screw hole is a region where the heat radiating body and the heat generating body abut. Accordingly, the leading end of the separating jig that enters is in contact with the heating element. Therefore, the separation jig can be rotated and the heat radiating body and the heat generating body can be peeled off. That is, the heating element and the heat dissipation element can be separated. For this purpose, after removing the separated heat sink, the lock pin is rotated to unlock the socket terminal and the semiconductor element terminal. As a result, the semiconductor element can be easily removed from the socket.

  A separating screw hole that can be rotated and entered by screwing a separation jig from above the heat radiator is provided in the heat radiator, and the separation jig that rotates and enters is in contact with the semiconductor element. For this reason, it is not necessary to insert a jig and a finger from the side of the printed circuit board. That is, it is not necessary to secure a space for inserting a separation jig and a finger on the printed circuit board. For this reason, the space for inserting a jig and a finger can be effectively used as a mounting space for electronic components. Accordingly, semiconductor elements and electronic components can be mounted on the printed circuit board with high density. As a result, the information device can be reduced in size. Further, there is no need for a previous step of separating the semiconductor element and the heat dissipating member, that is, a step of removing other electronic components adjacent to the heat generating member. For this reason, the separation method like this technique does not require many man-hours. Furthermore, since it is not necessary to remove and attach other electronic components adjacent to the heating element, the reliability of the conductive connection with the printed circuit board is not lowered.

  Next, the present invention will be specifically described based on examples.

<Example>
FIG. 1 is a cross-sectional view of an electronic device according to the present embodiment.
It should be noted that the same components as those described in the prior art are denoted by conventional reference numerals, and the description thereof is omitted.
1 is an electronic device, 10 is a heat radiating device having a heat radiating body, a fin, and a separation jig screwed into the separation screw hole, 101 is a heat radiating body having a separation screw hole, and 102 is formed in the heat radiating body. The heat dissipating fin, 11 is a separating screw hole penetrating the heat dissipating member from above, and 12 is a separating jig that can be screwed into the separating screw hole to enter and retreat.

  As described above, the printed circuit board 2 and the socket 3 are conductively connected. The terminal of the semiconductor element 4 is inserted into the terminal of the socket 3, and the terminal of the socket 3 and the terminal of the semiconductor element 4 are fixed by the lock pin 31. A heat dissipating body 101 having heat dissipating fins 102 is bonded and fixed to the upper surface of the semiconductor element 4 with a bonding agent 5 having good thermal conductivity.

  FIG. 2 is a plan view of the heat dissipation device according to this embodiment.

  In the drawing, a heat dissipating body 101 having heat dissipating fins 102 extending in the vertical direction and the semiconductor element 4 are described so that the explanation can be easily understood. The semiconductor element 4 is located below the heat radiating body 101. Specifically, the semiconductor element 4 is indicated by a broken line. A plurality of separation screw holes 11 are formed in a plurality of places, for example, four places of the heat dissipating body 101 through the heat dissipating body 101. The positions of the separation screw holes 11 correspond to the four corners of the semiconductor element 4. The end portion of the semiconductor element 4 is not limited to these four corners and may be anywhere. The heat radiating device 10 is exposed to wind in order to be efficiently cooled. For this purpose, air is blown from the direction of the arrow along the heat dissipating fins 102. The heat dissipating fins 102 of the heat dissipating body 6 that has been heated are deprived of heat by the wind and cooled.

  FIG. 3 is an explanatory view of the separation jig according to the present embodiment.

FIG. 3A is a view of the other end portion of the separation jig according to the present embodiment as seen from above.
The shape of the vortex generator 122 at the other end of the separation jig 12 is a substantially opposing triangle through the slit 121. Accordingly, two projections are provided on the other end of the separation jig 12. This protrusion may be on the side surface of the separation jig 12 as well as the other end, and the number of protrusions is not limited to two. The shape is not limited to this embodiment.

FIG. 3B is a cross section of the separation jig according to the present embodiment.
One end of the separation jig 12 is formed with a screw portion that is screwed into the separation screw hole 11. A slit 121 into which the tip of a screwdriver is inserted is formed at the substantially central portion of the other end, and a vortex generator 122 facing left and right is formed.

  The separation jig and the wind direction will be described with reference to FIG.

The wind flows along the row direction of the radiating fins 102 provided on the radiator 101. The separation jig 12 also serves as a heat radiation fin 102. The vortex generator 122 of the separation jig 12 generates vortices in the flow of wind that flows through the gaps between the radiating fins 102 in a row on the radiating body 101. The vortex generator 122 is arranged so that the wind flows from the bottom face side of the triangle of the vortex generator 122 to the tip of the triangle. The wind flowing through the gaps between the heat dissipating fins 102 becomes turbulent air current, improving the heat dissipating effect.
FIG. 4 is an explanatory view for separating the heat radiating body and the heat generating member according to this embodiment.

  For example, the separation jig 12 is applied to the separation screw hole 11 formed at the four corners of the radiator 101, for example, at the right end, and the screwdriver is engaged with the slit 121 of the separation jig 12 and rotated. The separation screw hole 11 through which the separation jig 12 passes is rotated and entered. The leading end of the separation jig 12 comes into contact with the semiconductor element 4. Further, the semiconductor element 4 and the heat radiating body 101 are peeled off by causing the rotation to enter. Therefore, a gap is formed between the right end portions of the semiconductor element 4 and the radiator 101. Further, the right end portion of the semiconductor element 4 and the heat dissipating body 101 is separated by rotating and entering. As a result, the right end portion of the heat dissipating body 101 is inclined upward. Next, the separation jig 12 is caused to rotate into the separation screw hole 11 at the left end facing the rotation. When the separation jig 12 is rotated into the separation screw hole 11 at the right end portion described above, the left end portion is moved in a different manner. For example, the left end portion of the radiator 101 is raised. And the semiconductor element 4 and the heat radiator 101 become parallel. Then, the semiconductor element 4 and the radiator 101 are separated. Subsequently, the lock pin 31 is rotated to release the fixation between the terminal of the socket 3 and the terminal of the semiconductor element 4. Subsequently, the semiconductor element 4 is easily removed from the socket 3.

It is sectional drawing of the electronic device which concerns on a present Example. It is a top view of the heat radiator which concerns on a present Example. It is explanatory drawing of the jig | tool for isolation | separation which concerns on a present Example. It is explanatory drawing which isolate | separates the heat radiator and heat generating member which concern on a present Example. It is sectional drawing of the electronic device which concerns on a prior art.

Explanation of symbols

1; electronic device,
2; printed circuit board,
3; socket,
31; Lock pin attached to the socket,
4; a semiconductor element that generates heat during operation;
41; other electronic components adjacent to the heating element (semiconductor element),
5; bonding agent,
6;
61; radiating fins formed on the radiator;
10; heat dissipation device,
101; radiator
102; radiating fins,
11; screw hole for separation,
12: Jig for separation,
121; slit,
122: A vortex generator.

Claims (5)

In a heat dissipation device in which a heating element and a heat dissipation body are bonded via a bonding agent,
A heat dissipating device comprising: a separating screw hole that penetrates the dissipating screw hole; and a separation jig hole that is threaded into the separating screw hole. The screw hole for separation according to claim 1 is a through-hole penetrating from above for separating the heat dissipating body and the heat generating body at least at one place in a region where the heat dissipating body and the heat generating body are in contact with each other. Features a heat dissipation device. 3. The separation jig according to claim 1, wherein the separation jig screwed into the separation screw hole is a vortex generator for generating a vortex in the wind passing through the heat radiating device. 3. A separation jig, wherein the separation jig screwed into the separation screw hole according to claim 1 is a part of a heat radiation fin. An electronic apparatus comprising the heat dissipating device according to claim 1 mounted on a printed circuit board.