JP2007142112A - Method for manufacturing stem for optical semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a stem for an optical semiconductor element which can monitor beams emitted from a light-emitting element with accuracy by the light-emitting element disposed at the lower side, even when the position of the light-emitting element that is to be mounted on the mounting side face is displaced. <P>SOLUTION: By press machining a metal member, an eyelet 10, an element-mounting part 12 comprising a mounting side face S erected thereon, and a recess 10a for mounting on a portion of the eyelet 10 ahead of the element-mounting part 12. Thereafter, by press machining the element-mounting part 12, the mounting side face S of the element-mounting part 12 is shifted to the side of the recess 10a, and the position of the mounting side face S is adjusted. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a stem for an optical semiconductor element, and more particularly to a method for manufacturing a stem for an optical semiconductor element on which a semiconductor laser element or the like applied to an optical communication apparatus, an optical disk apparatus or the like is mounted.

  Conventionally, there is an optical semiconductor element stem on which a semiconductor laser element and a light receiving element are mounted. As shown in FIG. 1, the conventional stem for an optical semiconductor element includes a disk-shaped eyelet 100, an element mounting part 110 standing on the disk-shaped eyelet 100, and first to third leads 120a and 120b provided on the eyelet 100. 120c.

  The eyelet 100 is provided with a through hole 100x penetrating in the thickness direction, and the first and second leads 120a and 120b are inserted and fixed in the through hole 100x while being sealed by the glass 130. ing. The third lead 120c is fixed to the lower surface of the eyelet 100 by resistance welding. Thus, the first and second leads 120a and 120b are provided to be electrically insulated from the eyelet 100, and the third lead 120c is provided in a state of being electrically connected to the eyelet 100.

  The element mounting unit 110 includes a mounting side surface S on which a semiconductor laser element (not shown) is mounted. In addition, a recessed portion 100a having a sloped bottom surface is formed in the eyelet portion in front of the mounting side surface S, and a light receiving element (not shown) is mounted on the bottom surface of the recessed portion 100a. The semiconductor laser element and the light receiving element are electrically connected to predetermined leads 120a to 120c via wires or the like.

Patent Documents 1 to 3 describe what is similar to such a stem for an optical semiconductor element.
JP 2004-72072 A JP 2005-150684 A Japanese Utility Model Publication No. 2-9461

  In the above-described conventional stem for an optical semiconductor element, the semiconductor laser element is mounted on the mounting side S of the element mounting portion 110 via a submount having a certain thickness, and therefore, from the mounting side S by the thickness of the submount. Mounted at a remote location. A light receiving element is mounted on the bottom surface of the dent 100a of the eyelet 100, and the laser light emitted from the semiconductor laser element is monitored by the light receiving element.

  In recent years, attempts have been made to reduce or omit the thickness of the submount because it has a poor thermal conductivity and hinders heat radiation of the semiconductor laser device and reduces costs.

  However, if the thickness of the submount is reduced or omitted, the semiconductor laser element is mounted close to the mounting side surface of the element mounting portion, so that the laser light from the semiconductor laser element is transmitted from the light receiving portion of the light receiving element. Since it hits the shifted position, there is a problem that the laser light from the semiconductor laser element cannot be accurately monitored by the light receiving element.

  The present invention was created in view of the above problems, and even when the position of the light emitting element mounted on the mounting side surface is shifted, the light receiving element disposed below the light emitting element emits light from the light emitting element. It is an object of the present invention to provide a method for manufacturing a stem for an optical semiconductor element capable of accurately monitoring light.

  In order to solve the above-described problems, the present invention relates to a method for manufacturing a stem for an optical semiconductor element, and by pressing a metal member, an eyelet, and an element mounting portion having a mounting side surface standing on the eyelet, A step of forming a mounting recess provided in the portion of the eyelet in front of the mounting side surface, and by pressing the element mounting portion, the mounting side surface of the element mounting portion is moved to the recess portion side. And a step of adjusting the position of the mounting side surface by moving.

  In the present invention, first, by pressing a metal member, a plate-shaped eyelet, an element mounting portion that is erected thereon and has a mounting side surface on which a light emitting element is mounted, and a front portion of the element mounting portion. A dent portion provided with the light receiving element is provided in the eyelet portion. In this step, the mounting side surface of the element mounting portion is disposed at a position shifted outward from the position of the regular mounting side surface.

  Further, by pressing the element mounting portion, the mounting side surface of the element mounting portion is moved to the dent portion side, and the position adjustment is performed so that the mounting side surface of the element mounting portion is disposed at the position of the regular mounting side surface. As a result, the mounting side surface of the element mounting portion on which the light emitting element is mounted is arranged at a desired position that overlaps the area of the eyelet recess where the light receiving element is mounted.

  As described above, the light emitting element is mounted on the mounting side surface of the element mounting portion via a submount having a certain thickness, but the thickness of the submount is reduced for the purpose of cost reduction and heat dissipation improvement, There is a demand to omit the submount.

  In the present invention, the mounting side surface of the element mounting portion can be shifted and adjusted to an arbitrary position in the indentation region where the light receiving element is mounted. Even when mounted closer, the light receiving part of the light receiving element can be arranged under the light emitting part of the light emitting element. As described above, since the positional relationship between the light emitting element and the light receiving element can be easily adjusted, even when the mounting position of the light emitting element is deviated, the light emitted from the light emitting element is accurately reflected by the light receiving element. It becomes possible to monitor.

  Moreover, in order to prevent chipping of the punch of the mold, even if the boundary between the element mounting part and the dent part is a curved surface, so that the light receiving element cannot be moved further to the mounting side, no problems occur. Never do.

  Furthermore, even when the submount is omitted, the light emitted from the light emitting element can be monitored with high accuracy by the light receiving element by further moving the mounting side surface of the element mounting part to the indented part side. It becomes like this.

  In Patent Document 3, the end of the monitor element is accommodated and mounted in a recess provided in the base of the radiator, so that the light received by the monitor element is directly below the semiconductor laser element mounted on the side surface of the radiator. Although it is described that the surface is configured to be disposed, no consideration is given to the manufacturing method, and the configuration of the present invention is not suggested.

  As described above, in the method for manufacturing a stem for an optical semiconductor element of the present invention, the position of the mounting side surface on which the light emitting element is mounted can be easily adjusted, so that the distance between the mounting side surface and the light emitting element changes. Can also be easily accommodated.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  Before describing the embodiment of the present invention, a problem that occurs when the submount is thinned and the semiconductor laser element is mounted on the mounting side surface of the element mounting portion will be described.

  FIG. 2 shows the eyelet 100 of the stem for the optical semiconductor element and the element mounting portion 110 standing on the stem, and the bottom surface is sloped to the portion of the eyelet 100 in front of the mounting side S of the element mounting portion 110. A recessed portion 100a is provided. The lower part of the mounting side surface S of the element mounting part 110 and one end side of the dent part 100a are connected by a boundary part A, and the boundary part A is formed into a curved surface (R surface) and rounded. The reason why the boundary A is a curved surface is that when a metal member is formed by a series of pressing processes and a stem is manufactured, if there is a corner in the punch of the mold in the pressing step for forming the recess 100a, the punch is chipped. This is because (chips) occur and it becomes difficult to perform press processing continuously and accurately.

  Then, the semiconductor laser element 200 is mounted on the mounting side surface S of the element mounting portion 110 via the submount 130. In addition, a light receiving element 300 that monitors the laser light L emitted from the lower portion of the semiconductor laser element 200 is mounted on the bottom surface of the indented portion 100a. In this way, the laser light L emitted from the semiconductor laser element 200 can be monitored by the light receiving element 300.

  As described above, in recent years, since the submount 130 has poor thermal conductivity and hinders heat radiation of the semiconductor laser element 200 and reduces costs, attempts have been made to reduce or omit the thickness. Yes.

  Therefore, as shown in FIG. 3, when the thickness of the submount 130 is reduced, the position of the semiconductor laser element 200 moves to the mounting side S side, so that the laser light L emitted from the semiconductor laser element 200 is emitted from the light receiving element 300. The light beam comes in contact with the position shifted from the light receiving portion, and the laser light L from the semiconductor laser element 200 cannot be accurately monitored by the light receiving element 300. In addition, since the boundary portion A between the mounting side surface S and the recessed portion 100a is a curved surface, it is difficult to bring the light receiving element 300 closer to the semiconductor laser element 200 side.

  The embodiment of the present invention described below can easily solve the above-described problems.

  4 to 9 are cross-sectional views illustrating a method for manufacturing a stem for an optical semiconductor element according to an embodiment of the present invention. In the manufacturing method of the stem for an optical semiconductor element according to the embodiment of the present invention, first, as shown in FIG. 4A, the metal member 5 is prepared, and the lower mold 20a and the recess 20x are formed on the lower side. A first mold 20 having an upper mold 20b is prepared. As the metal member 5, a metal material made of iron (Fe) or copper (Cu) or a clad material made of iron (Fe) / copper (Cu) / iron (Fe) is preferably used.

  And the metal member 5 is arrange | positioned between the lower mold | type 20a and the upper mold | type 20b, and the metal member 5 on the lower mold | type 20a is pressed by the upper mold | type 20b. As a result, as shown in FIG. 4B, the metal member 5 is pushed into the concave portion 20x side of the upper mold 20b to form a convex portion that protrudes upward, and the plate-shaped eyelet 10 is erected on it. The element mounting part (heat radiation part) 12 to be obtained is obtained. The element mounting portion 12 includes a mounting side surface S on which the semiconductor laser element is mounted. The mounting side surface S is a distance dmm (for example, 0.2 mm) from the position of the regular mounting side surface on which the semiconductor laser element is disposed later. (Offset) by 0.5 mm). The position of the regular mounting side surface is set so that the semiconductor laser element is arranged at the optimum position corresponding to the case where the thickness of the submount is reduced or the case where the submount is omitted, and the distance d is adjusted accordingly. Is done.

  Next, as shown in FIG. 5A, a second mold 21 including a lower mold 21a, a pressing member 21x, and a punch 21y is prepared. The punch 21y of the second mold 21 is for forming a dent portion in which the light receiving element is mounted in the portion of the eyelet 10 in front of the mounting side surface S of the element mounting portion 12, and corresponds to the dent portion in the lower part thereof. The convex part C to be formed is formed.

  Then, the eyelet 10 in which the element mounting portion 12 is erected is placed on the lower mold 21a, and the portion of the eyelet 10 in front of the mounting side S of the element mounting portion 12 is pressed by the punch 21y while being held by the pressing member 21x. To do. As a result, as shown in FIG. 5 (b), a recessed portion 10 a having a sloped bottom surface is formed in the portion of the eyelet 10 in front of the mounting side surface S of the element mounting portion 12. At this time, the portion of the punch 21y that presses the base portion of the element mounting portion 12 is a curved surface (R surface) to prevent chipping (chip), and thereby the mounting side surface S of the element mounting portion 12 and the eyelet 10 are formed. The boundary portion A (FIG. 5B) of the indented portion 10a is formed into a curved surface (R surface).

  Next, as shown in FIG. 6, a third mold 22 including a lower mold 22a, a first punch 22x, a second punch 22y, and a third punch 22z is prepared. The first punch 22x is for pressing the element mounting portion 12 in the lateral direction, the second punch 22y is for pressing the upper surface of the element mounting portion 12, and the third punch 22z is for pressing the eyelet 10. It functions as a stopper that determines the position of the mounting side surface S of the element mounting portion 12. That is, the surface of the third punch 22z that faces the mounting side S of the element mounting unit 12 is for adjusting the mounting side S of the element mounting unit 12 that has been offset in advance to the position of the regular mounting side. This is a reference plane B. Then, the eyelet 10 on which the element mounting portion 12 is erected is disposed on the lower mold 22 a of the third mold 22, and the first to third punches 22 x to 22 z are arranged around the element mounting portion 12 on the element mounting portion 12. Align and place.

  Subsequently, as shown in FIG. 7, in a state where the upper surface of the element mounting portion 12 is pressed by the second punch 22y and the eyelet 10 is pressed by the third punch 22z, the element mounting portion 12 is held by the first punch 22x. The mounting side surface S is moved in the lateral direction by pressing toward the recess 10a. Thereby, the mounting side surface S of the element mounting part 12 contacts the reference surface B of the third punch 22z and is disposed at the position of the regular mounting side surface.

  In this manner, as shown in FIG. 8, the mounting side S side of the element mounting portion 12 is pushed out toward the dent portion 10a side of the eyelet 10 and protrudes from the base so as to overlap the region of the dent portion 10a. The protrusion T is formed, and the position of the mounting side surface S is adjusted and arranged. Further, the surface opposite to the mounting side surface S of the element mounting portion 12 is pressed by the first punch 22x to be provided with the recess 12x.

  Subsequently, as shown in FIGS. 9 and 10, the first and second through holes 11a and 11b are formed in the eyelet 10 by pressing, and a pair of triangular notches for positioning are formed on the outer periphery of the eyelet. A portion 10x and a rectangular cutout portion 10y for direction indication are formed.

  Further, the first and second leads 16 a and 16 b are inserted into the first and second through holes 11 a and 11 b of the eyelet 10 and sealed and fixed by the glass 18. Further, the third lead 16c is fixed to the lower surface of the eyelet 12 by resistance welding.

  As described above, the stem 1 for optical semiconductor elements according to this embodiment as shown in FIG. 10 is manufactured. In the above-described embodiment, the element mounting portion 12 is pressed in the lateral direction in a series of pressing processes to adjust the position of the mounting side S. However, after the leads 16a to 16c are provided on the eyelet 10, the element The position of the mounting side surface S of the mounting unit 12 may be adjusted.

  As described above, in the method for manufacturing a stem for an optical semiconductor element according to the present embodiment, first, the metal member 5 is pressed to obtain a plate-shaped eyelet 10 and an element mounting portion 12 standing on the plate-shaped eyelet 10. And a dent 10a provided in the portion of the eyelet 10 in front of the element mounting portion 12. At this time, a boundary portion A between the lower portion of the mounting side surface S of the element mounting portion 12 and the bottom surface of the recessed portion 10a of the eyelet 10 is formed as a curved surface to prevent chipping of the mold. At this time, the mounting side surface S of the element mounting portion 12 is disposed immediately above one end portion of the indented portion 10a, and is formed in a state shifted (offset) outward from the position of the regular mounting side surface.

  Further, the mounting side surface S of the element mounting part 12 is moved to the side of the indented part 10a by pressing the element mounting part 12 toward the indented part 10a side of the eyelet 10 by press working, so that Adjust to position. As a result, the mounting side surface S of the element mounting portion 12 on which the semiconductor laser element is mounted is disposed at a desired position that overlaps the region of the recess 10a of the eyelet 10 on which the light receiving element is mounted.

  As shown in FIG. 10, the stem 1 for an optical semiconductor device manufactured by such a manufacturing method includes an eyelet 10, an element mounting portion 12 erected on the eyelet 10, and three leads 16 (first pins mounted on the eyelet 10). 1 to 3rd leads 16a to 16c). The element mounting portion 12 includes a mounting side S on which the semiconductor laser element is mounted. Further, the eyelet 10 in front of the mounting side surface S is provided with a recess 10a having a sloped bottom surface on which the light receiving element is mounted. The element mounting portion 12 is provided with a protruding portion T that protrudes from the base portion toward the recessed portion 10a side of the eyelet 10, and is disposed at a position where the mounting side surface S overlaps the region of the recessed portion 10a.

  Further, the eyelet 10 is provided with two through holes (first and second through holes 11a and 11b) penetrating in the thickness direction. The first and second leads 16a and 16b are inserted into the first and second through holes 11a and 11b, respectively, and are sealed and fixed to the first and second through holes 11a and 11b by the glass 18, respectively.

  Further, the third lead 16 c is resistance-welded to the lower surface of the eyelet 10, and the third lead 16 c is fixed while being electrically connected to the eyelet 10 and the element mounting portion 12.

  Further, the eyelet 10 is provided with a pair of triangular notch portions 10x for positioning and a square notch portion 10y for direction indication.

  For example, the first lead 16a becomes a light emitting element lead, the second lead 16b becomes a light receiving element lead, and the third lead 16c becomes a common ground lead. The light emitting element mounted on the mounting side S of the element mounting portion 12 is electrically connected to the first lead 16a via a wire. The light receiving element mounted on the bottom surface of the recessed portion 10a of the eyelet 10 is electrically connected to the second lead 16b for the light receiving element through a wire. Further, the light emitting element and the light receiving element are electrically connected to the third lead 16c (common ground lead) through the eyelet 10 by a wire or the like.

  FIG. 11 shows an example in which a semiconductor laser element and a light receiving element are mounted on the optical semiconductor element stem 1 according to the present embodiment. The stem in FIG. 11 corresponds to a cross section along II in FIG. As shown in FIG. 11, the semiconductor laser element 30 is mounted on the mounting side S of the element mounting portion 12 via the submount 32, and the light receiving element 40 is mounted on the bottom surface of the recessed portion 10 a of the eyelet 10.

  As described above, the mounting side surface S of the element mounting portion 12 is disposed at a desired position that overlaps the region of the recessed portion 10 a of the eyelet 10. Therefore, even if the submount 32 is thinned and the semiconductor laser element 30 is mounted close to the mounting side S of the element mounting portion 12, the light receiving portion of the light receiving element 40 is used as the light emitting portion of the semiconductor laser element 30. Therefore, the laser light L emitted from the semiconductor laser element 30 can be accurately monitored by the light receiving element 40.

  Moreover, in order to prevent chipping of the punch of the mold, even if the boundary between the element mounting portion 12 and the dent portion 10a is a curved surface, the light receiving element 40 can no longer be moved to the mounting side S side. It is possible to cope without any trouble.

  Furthermore, even when the submount 32 is omitted in order to reduce costs and improve heat dissipation, the semiconductor laser can be arranged by moving the mounting side surface S of the element mounting portion 12 further toward the dent portion 10a. The laser beam L emitted from the element 30 can be accurately monitored by the light receiving element 40.

FIG. 1 is a perspective view showing an example of a conventional stem for an optical semiconductor element. FIG. 2 is a cross-sectional view showing a state in which a semiconductor laser element and a light receiving element are mounted on a stem for an optical semiconductor element. FIG. 3 is a cross-sectional view illustrating a problem that occurs when the thickness of the submount on which the semiconductor laser element is mounted is reduced in the semiconductor element stem of FIG. 4 (a) and 4 (b) are cross-sectional views (No. 1) showing the method for manufacturing the stem for a semiconductor element according to the embodiment of the present invention. 5A and 5B are sectional views (No. 2) showing the method for manufacturing the stem for the optical semiconductor element according to the embodiment of the present invention. FIG. 6 is a sectional view (No. 3) showing the method for manufacturing the stem for the optical semiconductor element according to the embodiment of the present invention. FIG. 7: is sectional drawing (the 4) which shows the manufacturing method of the stem for optical semiconductor elements of embodiment of this invention. FIG. 8: is sectional drawing (the 5) which shows the manufacturing method of the stem for optical semiconductor elements of embodiment of this invention. FIG. 9 is a sectional view (No. 6) showing the method for manufacturing the stem for the optical semiconductor element according to the embodiment of the present invention. FIG. 10 is a perspective view showing an optical semiconductor element stem according to an embodiment of the present invention. FIG. 11 is a cross-sectional view showing a state in which a semiconductor laser element and a light receiving element are mounted on a stem for an optical semiconductor element according to an embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Stem for optical semiconductor elements, 5 ... Metal member, 10 ... Eyelet, 10a ... Recessed part, 10x, 10y ... Notch part, 11a, 11b ... Through-hole, 12 ... Element mounting part, 12x ... Recessed part, 16a ... 1st 1 lead, 16b ... 2nd lead, 16c ... 3rd lead, 18 ... glass, 20 ... 1st metal mold | die, 20a, 21a, 22a ... lower mold | type, 20b ... upper mold | type, 20x ... recessed part, 21 ... 2nd metal mold | die 21x ... Pressing member, 21y ... Punch, 22 ... Third mold, 22x ... First punch, 22y ... Second punch, 22z ... Third punch, 30 ... Semiconductor laser element, 32 ... Submount, 40 ... Light receiving element , A ... boundary part, S ... mounting side surface, T ... projecting part, C ... convex part, L ... laser beam.

Claims (7)

By pressing the metal member, an eyelet, an element mounting portion having a mounting side surface standing on the eyelet, and a mounting dent portion provided in the portion of the eyelet in front of the mounting side surface Forming, and
And a step of adjusting the position of the mounting side surface by pressing the element mounting portion to move the mounting side surface of the element mounting portion to the indented portion side. Production method.   2. The step of pressing the metal member, wherein a lower side of a mounting side surface of the element mounting portion and one end side of the indented portion of the eyelet are connected via a curved surface. Of manufacturing a stem for an optical semiconductor element. The step of pressing the metal member includes:
Forming the metal member by first press working to form the eyelet and the element mounting portion;
The method for manufacturing a stem for an optical semiconductor element according to claim 1, further comprising a step of forming the dent portion in a portion of the eyelet in front of the mounting side surface by a second press working. In the step of pressing the metal member, the mounting side surface of the element mounting portion is disposed at a position shifted from the position of the regular mounting side surface to the outside of the eyelet,
4. The optical semiconductor element according to claim 1, wherein in the step of adjusting the position of the mounting side surface, the mounting side surface of the element mounting portion is arranged at the regular mounting position. 5. Stem manufacturing method.   4. The stem for an optical semiconductor element according to claim 1, further comprising a step of attaching a lead to the eyelet after or before the step of adjusting the position of the mounting side surface. 5. Production method.   The light emitting device is mounted on the mounting side surface of the device mounting portion, and the light receiving device for monitoring the light emitted from the light emitting device is mounted on the dent portion of the eyelet. 4. The method for manufacturing a stem for an optical semiconductor element according to claim 3.   4. The method for manufacturing a stem for an optical semiconductor element according to claim 1, wherein the metal member is made of a clad material made of iron, copper, or iron / copper / iron. 5.

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