JP2007142061A - Display device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a display device that can be formed by narrowing the separation distance to other adjacent wiring layers as compared with before even if the wiring layers are formed by conductive paste. <P>SOLUTION: The display device has first and second wiring layers formed adjacently on the same layer. The first and second wiring layers are formed by applying and drying conductive ink. The first and second wiring layers are formed by coating and drying in each separate process. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a display device and a manufacturing method thereof, and more particularly to a display device having a wiring layer formed of conductive ink and a manufacturing method thereof.

  For example, in a display device such as a liquid crystal display device, pixels arranged in a matrix are formed on a substrate, and a wiring layer composed of a large number of signal lines is formed to drive these pixels. A drive circuit for supplying signals to the wiring layer is also mounted.

  Since the pixels and the like are formed with high definition, they are formed by laminating a metal layer, a semiconductor layer, an insulating layer, and the like patterned by a selective etching method using a so-called photolithography technique. Included the wiring layer.

  However, since the formation of the wiring layer using the selective etching method has the disadvantage that most of the material cannot be recovered and must be discarded, attempts have been made in recent years to use conductive ink. It is coming.

  This is a technique for forming a wiring layer by using a so-called printing method or an inkjet method, and is disclosed in the following documents.

JP-A-11-207959 Japanese Patent Laid-Open No. 5-95178

  However, when a wiring layer is formed using conductive ink, it is formed by drying after coating, but the width of the wiring layer is relatively large immediately after coating, and the width after drying is reduced. Has the property of shrinking small. This reason is presumed to be due to the surface tension acting at the time when the solvent or moisture contained in the conductive ink is scattered.

  For this reason, for example, in the case of forming wiring layer groups that run parallel to each other, it is inevitable that the distance between them is limited. This is because a phenomenon occurs in which they come into contact with each other at the application stage of the conductive ink.

  The present invention has been made based on such circumstances, and even when a wiring layer is formed with a conductive paste, the distance between adjacent wiring layers is made narrower than before. It is an object of the present invention to provide a manufacturing method of a display device that can be used.

Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.
(1)
The method for manufacturing a display device according to the present invention includes, for example, a first wiring layer and a second wiring layer that are formed in the same layer and adjacent to each other, and the first wiring layer and the second wiring layer are both conductive inks. Formed by coating and drying,
The first wiring layer and the second wiring layer are formed by coating and drying in separate steps, respectively.
(2)
The method for manufacturing a display device according to the present invention is based on, for example, the configuration (1), and the wiring layer is composed of a plurality of wiring layer groups, and every other wiring layer is a first wiring layer, The wiring layer is a second wiring layer.
(3)
The method for manufacturing a display device according to the present invention includes, for example, a first wiring layer and a second wiring layer that are formed in the same layer and adjacent to each other, and the first wiring layer and the second wiring layer are both conductive inks. Are formed by coating and drying, having a wide part and a narrow part,
The first wiring layer and the second wiring layer are divided into a portion including at least a portion of the first wiring layer and having a small separation distance from the second wiring layer and a portion other than the portion, and the signal lines at the respective portions are arranged. It is characterized by being formed by coating and drying in separate steps.
(4)
The display device according to the present invention has, for example, a first wiring layer and a second wiring layer formed in the same layer and adjacent to each other, and both the first wiring layer and the second wiring layer are formed of conductive ink. , Having a wide part and a narrow part of their separation distance,
The first wiring layer including at least a portion having a small separation distance from the second wiring layer and the other first wiring layer other than the first wiring layer are overlapped with each other and connected to each other. .
(5)
The display device according to the present invention includes, for example, a wiring layer group formed of conductive ink, and each wiring layer of the wiring layer group is converged at least on one end side thereof and led to a terminal,
In the wiring layer group, at least converged portions, and every other wiring layer and other remaining wiring layers are formed in separate steps.
(6)
The display device according to the present invention is, for example, on the premise of the configuration (5), wherein the terminals are those connected to bumps of a semiconductor chip.
(7)
The display device according to the present invention includes, for example, a wiring layer group formed of conductive ink, and each wiring layer of the wiring layer group is converged at least on one end side thereof and led to a terminal,
The wiring layer group is composed of a first wiring layer and a second wiring layer that are different layers via an insulating film,
A wiring layer arranged at every other place in a portion excluding a portion close to the terminal that is at least a converged portion of the wiring layer group is formed as the second wiring layer,
The electrical connection between the first wiring layer and the second wiring layer is made through a contact hole formed in the insulating film.
(8)
The display device according to the present invention is based on, for example, the configuration of (7), and at least one of the first wiring layer and the second wiring layer formed at least at a converged portion of the wiring layer group. The wiring layers arranged every other line and the other remaining wiring layers are formed in separate steps.
(9)
The display device according to the present invention, for example, is based on the configuration (7), and is characterized in that the terminal is connected to a bump of a semiconductor chip.

  In addition, this invention is not limited to the above structure, A various change is possible in the range which does not deviate from the technical idea of this invention.

Embodiments of a display device according to the present invention will be described below with reference to the drawings.
FIG. 2A is a plan view showing an embodiment of the display device according to the present invention. FIG. 2A shows a liquid crystal display device, for example, and shows the configuration of the surface on the liquid crystal side of one of the substrates that are opposed to each other with the liquid crystal interposed therebetween.

  In FIG. 2A, on the surface of the substrate SUB1, gate signal lines GL extending in the X direction and juxtaposed in the y direction, and drain signal green extending in the y direction and juxtaposed in the X direction. DL is formed.

  Each region surrounded by a pair of adjacent gate signal lines GL and a pair of adjacent drain signal lines DL constitutes a pixel region, and a display unit AR (within a dotted frame in the figure) is formed by an aggregate of these pixel regions. It is supposed to be formed.

  As shown in FIG. 2B, each pixel region is supplied with a thin film transistor TFT which is turned on by a signal from the gate signal line GL and a signal from the drain signal line DL on one side via the thin film transistor TFT. A pixel electrode PX is formed. This pixel electrode PX generates an electric field between, for example, a counter electrode (not shown) formed on the liquid crystal side surface of another substrate disposed opposite to the substrate SUB1, and the liquid crystal in the pixel region behaves. It is supposed to let you.

  2A again, for example, one end of each gate signal line GL extends beyond the display portion AR and is connected to the scanning signal drive circuit V. The scanning signal driving circuit V is composed of a plurality of semiconductor chips CHPv arranged in parallel in the y direction, and each gate signal line GL is connected to a corresponding electrode of the corresponding semiconductor chip CHPv.

  For example, one end of each drain signal line DL extends beyond the display portion AR and is connected to the video signal driving circuit H. The video signal driving circuit H includes a plurality of semiconductor chips CHPh arranged in parallel in the X direction, and each drain signal line DL is connected to a corresponding electrode of the corresponding semiconductor chip CHPh.

  The reason why the scanning signal driving circuit V and the video signal driving circuit H are each composed of a plurality of semiconductor chips CHP is that it is difficult to manufacture a large one from the viewpoint of manufacturing yield. For this reason, the semiconductor chips CHP are arranged with a relatively large interval.

  In this case, each of the signal lines GL and DL is configured such that the distance between the other signal lines adjacent to the signal lines GL and DL is larger than the distance between the other electrodes adjacent to each electrode of the semiconductor chip CHP. It is unavoidable that it is bent at a portion close to the CHP, and as a result, forms a pattern that converges on the semiconductor chip CHP side together with other adjacent signal lines.

  FIG. 1 is an enlarged view showing the configuration of the semiconductor chip CHP and signal lines (wiring layers) connected thereto. The semiconductor chip CHP may be that of the scanning signal driving circuit V or that of the video signal driving circuit H. In the former case, the arrangement shown in FIG. 1 is rotated 90 ° clockwise, and in the latter case, the arrangement shown in FIG. It will be signed.

  A cross section taken along line IIIa-IIIa in FIG. 1 is shown in FIG. 3A, a cross section taken along line IIIb-IIIb is shown in FIG. 3B, and a cross section taken along line IIIc-IIIc is shown in FIG.

  In FIG. 1, a plurality (for example, nine in the figure) of signal lines SL extend from the upper side to the lower side of the figure, and bend in directions where they converge at substantially the same position (the middle signal line is not required because it is not necessary). However, it is further extended and led to the terminal ST to be connected to the electrode of the semiconductor chip CHP.

  In this embodiment, each signal line SL is formed in the same layer. That is, each of the signal lines SL described above is formed on the upper surface of the insulating film formed over almost the entire main surface of the substrate SUB1, and the semiconductor chip CHP is connected to the convergence side end (terminal ST) of each of the signal lines. The electrode is faced down, and the electrode is brought into contact with and connected to the end (terminal ST) through an anisotropic conductive film, for example.

  Here, among the signal lines SL, the signal lines SLa which are every other line and are connected to the terminal ST in the vicinity of the terminal ST are shifted in time with respect to the other signal lines SLb. It shows that it forms.

  That is, it means that the signal line SLa may be formed first, and then the signal line SLb may be formed, or the signal line SLb may be formed first and then the signal line SLa may be formed. In other words, the signal line SLa and the signal line SLb are formed in different steps.

  As is apparent from FIG. 1, the signal line SLa is disposed adjacent to the signal line SLb, and is formed with a relatively small distance from the signal line SLb. That is, in the configuration in which the adjacent signal lines SL extend from the inside to the outside of the display area AR and converge via the bent portion, at least the signal line SLa in the extended portion extending to the terminal ST after the bending. And the signal line SLa is adjacent to the other signal line SLb.

  Each signal line SL formed by application of the conductive ink is formed by drying after the application, but the width of the signal line SL is relatively large immediately after application, and the signal line SL after drying is The width has the property of shrinking small. It is presumed that the solvent contained in the conductive ink is scattered and is due to the surface tension acting at that time.

  For this reason, when it is attempted to give a predetermined value to the line width of each signal line SL formed after drying, the width of the signal line SL formed immediately after application of the conductive ink and before drying is the same. The contact with other adjacent signal lines SL formed in the same process and formed in the same process is concerned.

  As in the case of the signal line SL having the configuration shown in FIG. 1, when there are a relatively large portion and a small portion that are separated from other adjacent signal lines SL, both of these in the portion where the separation distance is large. Even if there is no contact, the anxiety cannot be avoided at a small distance.

  Therefore, in FIG. 1, the production of each signal line SL is divided into two steps. First, in the first step, in FIG. 1, for example, the leftmost signal line in FIG. The signal line SLb extending to ST, the second signal line on the right side thereof, which extends halfway to the terminal ST from the liquid crystal display AR side, and the third signal line on the right side thereof, which is the liquid crystal Applying and drying signal line SLb extending from display AR to terminal ST, and the fourth signal line on the right side extending from the liquid crystal display AR side to halfway before reaching terminal ST Let it form.

  In the next step, the signal line SLa which is the second signal line from the leftmost signal line in the figure and reaches the terminal ST from the middle before reaching the terminal ST from the liquid crystal display part AR side, The fourth signal line from the right signal line and extending from the liquid crystal display AR side to the terminal ST in the middle before reaching the terminal ST, the sixth signal line from the leftmost signal line in the figure The signal lines SLa,... Extending from the liquid crystal display area AR side to the terminal ST from the middle before reaching the terminal ST are applied and dried.

  Since each signal line SL is formed through such a process, it is formed in the previous process in the even-numbered signal lines (substantially formed through two processes) from the rightmost signal line in the drawing. The electrical connection between the signal line and the signal line formed in the subsequent process will be achieved. As shown in the enlarged circle in FIG. 1, the end of each signal line is directly connected. It is designed to be superimposed. In addition, the figure shown enlarged in the round frame shows a case where the alignment of the signal lines formed in each process is slightly shifted, and thereby, when the connection location of each signal line is observed in a plane But it will be easy to recognize.

  Forming each signal line SL in two steps has the disadvantage that the number of steps is greater than before, but the length of the signal line SLa is increased by applying the conductive paste by, for example, an inkjet method. Since it is extremely short compared with the signal line SLb, the coating (scanning) time can be extremely shortened accordingly, and there is an effect that it has only a labor that is not substantially different from the case of forming in one step.

  In the above-described embodiment, the signal line SLb is formed first and then the signal line SLa is formed. However, these are reversed to form the signal line SLa first, and then the signal line SLb. It goes without saying that the same effect can be obtained even if the film is formed.

  In addition, since it is necessary to form the signal line SL in two steps, it is desired that the connection portion has a reliable connection, but the reliability depends on the pattern alignment accuracy in each step. To do. Since this accuracy is relatively improved, for example, as shown in FIGS. 5 (a), 5 (b), and 5 (c), the area of the connection portion is not particularly increased, but rather the connection of the signal lines. Even if it is formed so that the width is narrowed at the end, good connection can be achieved.

  4A to 4D are cross-sectional views taken along the line IIIc-IIIc in FIG. 1, and show process diagrams in the production of the respective signal lines SL.

  First, as shown in FIG. 4A, a trench GT is formed in a portion where the signal line SL is to be formed on the main surface of the prepared substrate SUB1. This is because when the conductive paste is applied in accordance with the location where the groove GT is formed, it is prevented from spreading due to the fluidity of the conductive paste.

  In FIGS. 4A to 4D, the trench GT is drawn as if it was formed directly on the surface of the substrate SUB1, but if an insulating film is formed on the surface on which the signal line SL is formed. The trench is formed on the surface of the insulating film.

  Further, the groove GT has a width of 5 μm, for example, and the distance from other adjacent grooves GT is also 5 μm. This means that the width of the formed signal line is 5 μm, and the distance from other adjacent signal lines is also set to 5 μm.

  First, as shown in FIG. 4A, the conductive paste CP is applied to the formation positions of the signal lines SLb arranged every other signal line among the signal lines to be formed. This coating method may be either a printing method or an ink jet method.

  The applied conductive paste CP adheres so as to have a width (about 10 μm) that exceeds the width of the groove GT at the place where the applied paste is applied, and the height also becomes a certain value due to the surface tension of the conductive paste. However, it is formed larger than the height of the signal line to be formed. This is because the coating is performed in anticipation that the solvent is scattered and the conductive paste shrinks when firing in the subsequent step.

  In this case, the conductive paste CP is sufficiently separated from the other conductive paste CP applied adjacent to the conductive paste CP because a distance of at least 10 μm or more is maintained between the conductive paste CP. It can be avoided.

  Then, as shown in FIG. 4B, drying is performed to disperse the solvent in the conductive paste CP. The conductive paste CP is shrunk, its width becomes about 5 μm and fits in the trench GT, and its height is lowered to form the signal line SLb.

  Next, as shown in FIG. 4C, a conductive paste CP is applied to the formation positions of the remaining signal lines SLa among the signal lines CP to be formed. Similarly to the case of FIG. 4A, the applied conductive paste CP adheres so as to have a width exceeding the width of the groove GT at the applied position, and also attempts to form its height. It is formed larger than the height of the signal line.

  In this case, the conductive paste CP is maintained at a distance of about 2.5 μm from the adjacently baked signal line, and the mutual contact can be reliably avoided.

  Finally, as shown in FIG. 4D, firing is performed to disperse the solvent in the conductive paste CP. As shown in FIG. 4B, the conductive paste CP is shrunk, its width becomes about 5 μm and fits in the trench GT, and its height is lowered to form the signal line SLa.

  Each signal line SL thus formed has a separation distance of about 5 μm from the other signal lines SL adjacent thereto, and can be manufactured in a predetermined manner.

  FIG. 6 is a block diagram showing another embodiment of the display device according to the present invention and corresponds to FIG. 5A is a cross section taken along line VIIa-VIIa, FIG. 7B is a cross section taken along line VIIb-VIIb, FIG. 7C is a cross section taken along line VIIc-VIIc, and FIG. This is shown in FIG.

  In FIG. 6, the signal lines SL extending from the display unit AR are converged so that the distance between the signal lines SL is reduced and led to the terminals ST to be connected to the bumps of the semiconductor chip CT. It is the same as the case of.

  However, as compared with the case of FIG. 1, each signal line SL is formed with a signal line having a different layer in a part thereof.

  That is, a region after the signal line SL extending from the display portion AR is bent and converged (region below the line VIIb-VIIb in the drawing) and a region excluding the vicinity of the terminal (VIId in the drawing). Among the signal lines SL formed in the upper region with respect to the −VIId line), every other signal line SLd is arranged in the lower layer via the insulating film IL.

  Here, the insulating film IL is formed, for example, in the display area AR, and is formed to extend to the outside of the display area AR.

  That is, in FIG. 6, a signal line SLu indicated by a solid line is formed in an upper layer of the insulating film IL, and a signal line SLd indicated by a dotted line is formed in a lower layer of the insulating film IL.

  The signal line SLd formed in the lower layer of the insulating film IL is connected to the corresponding signal line SLu formed in the upper layer of the insulating film IL through the contact holes CH1 and CH2 formed in the insulating film IL at both ends, respectively. Functions similar to those of the wiring layer group shown in FIG. 1 can be provided.

  Here, the diameters of the contact holes CH1 and CH2 are W as shown in FIG. Even if the diameter W is set to be relatively small, sufficient reliability can be provided in the connection of the signal line SLu to the signal line SLd.

  For example, when a wiring layer having a predetermined pattern is formed from a metal layer by selective etching using a photolithography technique, when the first wiring layer is to be connected to the second wiring layer through the contact hole, the contact hole A tapered slope must be formed on the side wall surface of the contact hole, resulting in a disadvantage that the diameter of the contact hole must be made considerably large. This is because the prevention of step breakage caused by the step in the contact hole of the second wiring layer is achieved by the inclined side wall surface.

  On the other hand, in the case of the present embodiment, since the second-layer signal line SLu is formed by filling the contact hole CH with the conductive paste, the connection with the first-layer signal line SLd is sufficient. This is because the side wall surface of the contact hole may be a vertical surface.

  In this embodiment, the diameter of the contact hole can be made sufficiently small in this embodiment, apart from the contact hole CH at each end of the signal line SLd below the insulating film IL on the liquid crystal display area AR side. As a result, the semiconductor chip CHP side has a great effect.

  The distance between each signal line SL converged on the semiconductor chip CHP side and other adjacent signal lines SL is very narrow, and the distance must be widened due to the presence of the contact hole CH. This is because there is no inconvenience.

  Compared with FIG. 1, the signal line SL extending from the display portion AR is a region after bending and converging (region below the line VIIb-VIIb in the drawing), and the vicinity of the terminal In the excluded region (the region on the upper side with respect to the line VIId-VIId in the drawing), the interval between the signal lines SL in the upper and lower layers of the insulating film IL can be reduced. This is because there is no concern that the respective signal lines SL in each layer are connected to each other during the manufacture. For this reason, since the width of the signal line group in the above-described region can be sufficiently narrowed, a region where the signal line SL does not need to be formed on the substrate SUB1 is increased accordingly. For example, there is an effect that the inspection wiring / circuit for inspecting the disconnection or the short circuit of the signal line SL, or another circuit can be formed with a sufficient margin.

  Note that, in the region in the vicinity of the terminal (the region below the line VIId-VIId in the figure), each of the signal lines SL including the terminal ST connected thereto is formed above the insulating film IL. It has become. This is because each terminal ST faces the semiconductor chip CHP down and is connected to the bump, so that their height (with respect to the surface of the substrate SUB1) must be aligned.

  At least in this region, each signal line SL connected to each terminal ST is desired to form signal lines SL and other remaining signal lines SL arranged every other line in separate steps. This is because the interval between the signal lines SL in the signal line group described above is the smallest in this region.

  That is, in FIG. 6, the signal line SLu formed in the vicinity of the terminal ST among the signal lines SL reaching the terminal ST from the liquid crystal display unit AR through the signal line SLd once formed under the insulating film IL is The remaining signal lines SLu may be formed in a separate process.

  Further, for the same purpose, it may be configured as shown in FIG. FIG. 9 is a diagram corresponding to FIG. 6, and a configuration different from that in FIG. 6 is that the terminal among the signal lines SLu formed on the insulating film IL from the liquid crystal display portion AR to the terminal ST. The signal line SLu formed in the vicinity of ST is formed in a separate process from the other remaining signal lines SLu. Therefore, for example, the signal line SLu is connected to each other by forming an overlapping portion with another signal line SLu to be connected to the line VIId-VIId in the drawing.

  In the embodiment described above, as one embodiment, the signal line connected to the semiconductor chip in the vicinity of the mounted semiconductor chip is shown. However, it goes without saying that even if a circuit corresponding to the semiconductor chip is formed on the substrate SUB1 at the mounting position of the semiconductor chip, it can be applied as it is to the signal lines around the circuit.

  Moreover, it is needless to say that the present invention can be applied to other locations without being limited to being applied to locations around the circuit.

Further, in this embodiment, the mode is shown by taking a liquid crystal display device as an example, but it is needless to say that the present invention can be applied to other display devices such as an organic EL display device.
This is because the arrangement of the signal lines and the like are similar to those of the present embodiment although there are differences in the configuration of the pixels.

  Each of the embodiments described above may be used alone or in combination. This is because the effects of the respective embodiments can be achieved independently or synergistically.

It is the top view which showed one Example of the signal wire | line in the vicinity of the semiconductor chip mounted in the display apparatus by this invention. It is a schematic plan view which shows one Example of a structure of the display apparatus by this invention. It is a figure which shows the cross section in the IIIa-IIIa line of FIG. 1, the IIIb 1 IIIb line, and the IIIc-IIIc line. It is process drawing which shows one Example of the manufacturing method of the display apparatus by this invention. It is the top view which showed each Example of the connection part of the signal line of the same layer formed in the display apparatus by this invention. It is the top view which showed the other Example of the signal wire | line in the vicinity of the semiconductor chip mounted in the display apparatus by this invention. It is a figure which shows the cross section in the VIIa-VIIa line of FIG. 6, the VIIb-VIIb line, the VIIc-VIIc line, and the VIId-VIId line. It is sectional drawing which shows one Example of the contact hole formed in the display apparatus by this invention. It is the top view which showed the other Example of the signal wire | line in the vicinity of the semiconductor chip mounted in the display apparatus by this invention.

Explanation of symbols

SUB1 ... Substrate, GL ... Gate signal line, DL ... Drain signal line, CHP ... Semiconductor chip, SL ... Signal line, AR ... Liquid crystal display, ST ... Electrode, IL ... Insulating film, SLu ... Signal line (on insulating film) Signal line), SLd... Signal line (signal line under the insulating film), CH... Contact hole.

Claims (9)

The first wiring layer and the second wiring layer are formed in the same layer and adjacent to each other, and each of the first wiring layer and the second wiring layer is formed by applying conductive ink and drying. ,
The method for manufacturing a display device, wherein the first wiring layer and the second wiring layer are formed by coating and drying in separate steps, respectively.   2. The display according to claim 1, wherein the wiring layer is composed of a plurality of wiring layer groups, and every other wiring layer is a first wiring layer and the other wiring layers are second wiring layers. Device manufacturing method. The first wiring layer and the second wiring layer are formed in the same layer and adjacent to each other, and each of the first wiring layer and the second wiring layer is formed by applying conductive ink and drying, and the separation distance therebetween. Is formed with a wide part and a narrow part,
The first wiring layer and the second wiring layer are divided into a portion including at least a portion of the first wiring layer and having a small separation distance from the second wiring layer and a portion other than the portion, and the signal lines at the respective portions are arranged. A method for manufacturing a display device, wherein the display device is formed by coating and drying in separate steps. The first wiring layer and the second wiring layer are formed in the same layer and adjacent to each other, and each of the first wiring layer and the second wiring layer is formed of a conductive ink, Having a narrow portion,
The first wiring layer including at least a portion having a small separation distance from the second wiring layer and the other first wiring layer other than the first wiring layer are overlapped with each other and connected to each other. Display device. A display device comprising a wiring layer group formed of conductive ink, each wiring layer of these wiring layer group is converged at least on one end side thereof and led to a terminal,
A display device, wherein at least converged portions of the wiring layer group, and wiring layers arranged every other line and other remaining wiring layers are formed in separate steps.   6. The display device according to claim 5, wherein the terminal is connected to a bump of a semiconductor chip. A display device comprising a wiring layer group formed of conductive ink, each wiring layer of these wiring layer group is converged at least on one end side thereof and led to a terminal,
The wiring layer group is composed of a first wiring layer and a second wiring layer that are different layers via an insulating film,
A wiring layer arranged at every other place in a portion excluding a portion close to the terminal that is at least a converged portion of the wiring layer group is formed as the second wiring layer,
An electrical connection between the first wiring layer and the second wiring layer is made through a contact hole formed in the insulating film.   At least one of the first wiring layer and the second wiring layer formed at least at the converged portion of the wiring layer group, and the other wiring layers arranged alternately and the other remaining wiring layers The display device according to claim 7, wherein the display device is formed in a separate process. The display device according to claim 7, wherein the terminal is connected to a bump of a semiconductor chip.

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