JP2007137055A - Liquid discharge head and production method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid discharge head that is an ink jet recording head capable of simultaneously achieving both higher precision for a flow path formation and/or a discharge port formation and securement in joint reliability between a flow path wall and a substrate, and a production method of the liquid discharge head. <P>SOLUTION: The ink jet recording head is provided in which an orifice member for forming an ink discharge port 11 and an ink flow path 15 communicating from an ink supply port 14 to the ink discharge port 11 is jointed on a substrate 1 by photosensitive resins 16, 21, wherein the photosensitive resin 16 is a material excellent in adhesion to the substrate 1 and forms a portion to be a side wall of the ink flow path 15 jointed to the substrate 1, and the photosensitive resin 21 is a material suitable for highly precisely forming the ink discharge port 11 and forms a forming portion of the ink discharge port 11, and the photosensitive resin 16 contains a silane material larger than that of the photosensitive resin 21. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a liquid discharge head, and more particularly to an ink jet recording head that performs recording by discharging ink and a method for manufacturing the same.

  As an ink jet recording head, one having a configuration as shown in FIG. 8F is known. This ink jet recording head has a substrate 51 on which an ink discharge energy generating element 53 that can be constituted by a heating resistor or the like that generates energy for discharging ink is formed. In the substrate 51, an ink supply port 64 for supplying ink from the outside is formed as a through-hole. On the substrate 51, members that form an ink discharge port 61 arranged corresponding to the ink discharge energy generating element 53 and an ink flow path 65 communicating from the ink supply port 64 to the ink discharge port 61 are joined. Yes.

  As a manufacturing method of such an ink jet recording head, a manufacturing method having a step of forming an ink flow path pattern with a soluble resin and a step of covering the soluble resin with a coating resin layer is known ( Patent Document 1). The coating resin contains an epoxy resin that is solid at room temperature. The dissolvable resin layer can be dissolved and removed after the coating resin layer is formed, thereby forming a desired ink flow path. According to such a manufacturing method, the minute distance between the ink discharge energy generating element and the ink discharge port can be set with high accuracy and good reproducibility, thereby enabling ink jet recording capable of high-quality recording. A head can be provided.

  In such an ink jet recording head, an insulating layer film as a protective film such as an ink discharge energy generating element is generally formed on a substrate. Further, when a heating resistor is used for the ink ejection energy generating element, a cavitation resistant layer such as a Ta film is provided. In joining a resin forming an ink flow path on such a substrate, it is known to interpose an adhesion improving layer made of a polyetheramide resin in order to improve the adhesion to the substrate. (See Patent Document 2).

  FIG. 8 is a schematic cross-sectional view showing the basic manufacturing process of an example recording head incorporating such a conventional technique in time series.

At a stage shown in FIG. 8A, a plurality of ink ejection energy generating elements 53 are formed on the surface of the substrate 51, and a protective film 55 is covered thereon. On the surface of the substrate 51, a sacrificial layer 54 to be used in a subsequent step of forming the ink supply port 64 is formed, and the back surface of the substrate 51 is entirely covered with the SiO ₂ film 52.

  After that, as shown in FIG. 8B, a polyetheramide resin that becomes the adhesion improving layer 56 and the back surface patterning layer 57 is applied to the front surface and the back surface of the substrate 1, respectively, and cured by baking. Then, these polyetheramide resin layers are patterned. The patterning can be performed by applying a positive resist by spin coating or the like, then exposing and developing the positive resist, and removing the polyetheramide resin layer by dry etching or the like using the positive resist as a mask. it can.

  Then, as shown in FIG. 8C, a positive resist is applied to the surface and patterned to form a nozzle flow path mold 58. Next, as shown in FIG. 8D, a coated photosensitive resin (CR) 59 is applied on the mold material 8 by spin coating or the like. The ink discharge ports 61 are formed by exposing the coated photosensitive resin 59 with ultraviolet rays, deep UV light, or the like, performing development, and performing patterning. A water repellent material 60 is formed on the coated photosensitive resin 59 by dry film lamination or the like.

Next, as shown in FIG. 8E, a protective material 62 is applied by spin coating or the like, and the surface and side surfaces of the substrate 51 on which the mold material 58, the coated photosensitive resin 59, and the like are formed are covered with the protective material 62. Further, the SiO ₂ film 52 on the back surface of the substrate 51 is etched using the polyetheramide resin 57 as a mask. As a result, the Si surface is exposed, and this becomes an etching start surface 63 for forming the ink supply port 64.

Next, as shown in FIG. 8F, an ink supply port 64 is formed in the substrate 51. The ink supply port 64 is formed by performing chemical etching on the substrate 51, for example, anisotropic etching with a strong alkaline solution such as TMAH. When anisotropic etching is performed from the back surface, the etching region reaches the sacrificial layer 54 on the front surface, whereby the formation of the ink supply port 64 is completed. Next, the back surface patterning layer 57 and the protective material 62 are removed. Further, the mold member 58 is eluted from the ink discharge port 61 and the ink supply port 64, whereby the ink flow path 65 is formed.
JP-A-6-286149 JP 11-348290 A Japanese Patent Laid-Open No. 60-161973 Japanese Unexamined Patent Publication No. 63-221121 JP-A 64-92216 JP-A-2-140219 US Pat. No. 6,390,606

  In recent years, an ink jet recording head is required to have a higher density, and further miniaturization of an ink flow path pattern has been required. On the other hand, in the above prior art, the ink flow path pattern is formed by forming the pattern of the mold material 58, and when the coated photosensitive resin 59 is joined on the substrate 51, the adhesion is improved. The property improving layer 56 is interposed. In such a manufacturing method, when setting the ink flow path pattern, it is necessary to take into account the finished dimension tolerance of both the mold material 58 and the adhesion improving layer 56. Cause restrictions. Further, the finishing tolerance between the adhesion improving layer 56 and the mold member 58 may affect the adhesion force and the discharge performance between the coated photosensitive resin 59 and the substrate 51 in a complex manner.

  Furthermore, in the conventional manufacturing method, the material of the flow path wall forming member and the discharge port forming member are the same. For this reason, in selecting this material, if a material that enhances the adhesion to the substrate is used, it is disadvantageous for forming the discharge port, and selecting a material that is advantageous for forming the discharge port will improve the adhesion to the substrate. There is a trade-off relationship that it becomes inferior.

  Accordingly, an object of the present invention is to provide a liquid discharge head capable of simultaneously achieving both high accuracy of flow path formation and / or discharge port formation and securing of the bonding reliability between the flow path wall and the substrate, and its It is to provide a manufacturing method.

  In order to achieve the above-described object, the liquid discharge head of the present invention is bonded to a substrate on which a discharge energy generating element that generates energy necessary for discharging the liquid is formed, In a liquid discharge head including a plurality of discharge ports for discharging and an orifice member that forms a plurality of flow paths respectively communicating with the plurality of discharge ports, the orifice member forms at least a portion to be bonded onto the substrate The first resin and the second resin joined to the first resin to form a plurality of discharge ports. The first resin is silane compared to the second resin. It is characterized by containing a lot of materials.

  The method of manufacturing a liquid discharge head according to the present invention includes a step of forming at least a portion of the orifice member to be bonded to the substrate with a first resin on the surface of the substrate on which the discharge energy generating element is formed. A step of coating and forming a mold material on the surface of the substrate, and a step of polishing the mold material until a surface on the surface side of the substrate of a portion formed by the first resin is exposed; Applying and forming a second resin having a lower silane content than the first resin on the polished surface of the first resin and mold, and forming a discharge port in the second resin; And a step of removing the mold material.

  According to the present invention, it is possible to use materials suitable for the part that forms the flow path wall and the part that forms the discharge port in the orifice member. Can be formed easily. Accordingly, a liquid discharge head with high reliability, high accuracy, and high recording quality can be provided at a low price.

  Embodiments of the present invention will be described below with reference to the drawings.

  In general, the present invention is directed to a liquid ejection head that performs a process of ejecting liquid to form flying droplets and applying the droplets to a desired position on a substrate. As such a liquid discharge head, an ink jet recording head that performs desired recording by depositing ink droplets on a recording medium is well known.

  Such an ink jet recording head can be applied to an apparatus such as a printer, a copying machine, a facsimile having a communication system, a word processor having a printer unit, and an industrial recording apparatus combined with various processing apparatuses. These apparatuses can be configured to record on a recording medium using paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, or the like.

  In the present invention, “recording” means not only giving an image having a meaning such as a character or a figure to a recording medium but also giving an image having no meaning such as a pattern. .

(First embodiment)
1 and 2 schematically show an ink jet recording head as a liquid discharge head according to the first embodiment. FIG. 2 is a perspective view with a part broken away, and FIG. 1 is a cross-sectional view taken along the line AA of FIG.

  This ink jet recording head has a Si substrate 1 on which ink discharge energy generating elements (discharge energy generating elements) 3 are formed in two rows at a predetermined pitch. In the Si substrate 1, an ink supply port 14 is formed as a through-hole, and is opened between two rows of the ink ejection energy generating elements 3. Bonding pads 20 for electrical connection with the outside are formed on the Si substrate 1, and although not shown in detail, a circuit for connecting each bonding pad 20 and each ink ejection energy generating element 3 is also formed. Yes. Further, a protective film 5 for protecting the ink discharge energy generating element 3 and the like from ink is formed on these. Further, on the Si substrate 1, an ink discharge port 11 opened to a position facing each ink discharge energy generating element 3 by an orifice member 9, and an ink flow path communicating from the ink supply port 14 to each ink discharge port 11. A (liquid channel) 15 is formed. In this embodiment, the orifice member 9 is composed of two types of photosensitive resins 16 and 21 as can be seen from the description of the manufacturing process described later.

  This ink jet recording head is usually used by being incorporated in a recording apparatus. The ink jet recording head is arranged so that the surface on which the ink supply port 14 is formed faces the recording surface of the recording medium during the recording operation by the recording medium conveyance mechanism of the recording apparatus or the scanning mechanism of the recording head. Is done. Then, the ink ejection energy generating element 3 is selectively driven according to a desired recorded image. Accordingly, pressure is applied to the ink (liquid) filled in the ink flow path 15 via the ink supply port 14, and ink droplets are discharged from the ink discharge port 11. The ejected ink droplets adhere to a predetermined position of the recording medium, and by repeating such an ink attaching process, recording according to a desired recorded image is performed.

  In particular, the ink jet recording head of this embodiment may have a configuration in which thermal energy is applied to ink to obtain a driving force for ink droplet discharge. That is, in this case, bubbles are generated in the ink by overheating the ink subjected to the action of thermal energy, and the ink is pushed out from the ink discharge port 11 by the action force based on the generation of the bubbles, and the ink droplets are formed. It is formed. The ink discharge energy generating element 3 can be constituted by a heat generating resistance layer as an electrothermal converter that is a means for generating heat energy, and a lower layer for heat storage can be provided under the heat generating resistance layer. .

  Next, a method for manufacturing the ink jet recording head of this embodiment will be described with reference to FIGS. 3 and 4 correspond to a cross-sectional view taken along the line AA in FIG. 2, and show representative manufacturing steps in time series.

In the stage shown in FIG. 3A, the ink ejection energy generating element 3 is formed on the surface of the Si substrate 1. A sacrificial layer 4 used for forming an ink supply port 14 to be described later is formed between the two rows of the ink ejection energy generating elements 3. Although not shown, a circuit including a semiconductor element used for driving the wiring and the ink ejection energy generating element 3 is also formed on the Si substrate 1. A protective layer 5 is formed on these. Further, the entire back surface of the Si substrate 1 is covered with the SiO ₂ film 2.

  From this state, first, as shown in FIG. 3B, a back surface patterning layer 7 made of a polyetheramide resin, which is used for forming an ink supply port 14 described later, is formed on the back surface of the Si substrate 1. The back surface patterning layer 7 is patterned so as to have an opening corresponding to an etching start surface 13 (FIG. 4B) when forming an ink supply port 14 described later. Patterning of the back surface patterning layer 7 can be performed by applying a positive resist by spin coating or the like, exposing and developing the positive resist, and dry etching or the like using the positive resist as a mask. After the patterning, the positive resist is peeled off. It goes without saying that the patterning on the back surface may be performed in a state where the front surface side of the Si substrate 1 is protected.

  Next, as shown in FIG. 3C, a photosensitive resin (first resin) 16 having good adhesion to the protective film 5 is applied by spin coating or the like, and exposure and development with ultraviolet rays or the like are performed for patterning. . The photosensitive resin 16 is formed at least in a portion that becomes a side wall of the ink flow path 15 to be bonded to the Si substrate 1, and a hole portion 17 that is open on the upper surface side is formed. In order to improve the adhesiveness with the Si substrate 1, the photosensitive resin 16 is prepared by increasing the silane material in addition to the photocationic polymerization initiator to an amount greater than the normal addition amount. Thereby, the photosensitive resin 16 has sufficient adhesion with the Si substrate 1 (protective film 5) without interposing an adhesion improving layer as in the prior art. Here, considering the adhesion with the photosensitive resin 16 containing a large amount of silane material, the protective layer 5 is preferably an inorganic protective film such as plasma SiN or plasma SiO.

  Next, as shown in FIG. 3D, a mold material (ODUR: manufactured by Tokyo Ohka Kogyo Co., Ltd.) 8 is applied by spin coating and baked. This mold material 8 is a material that functions to prevent the side wall of the channel from collapsing during chemical mechanical polishing (CMP) in a later process, and a positive mold material can be used. Then, as shown in FIG. 3E, the mold material 8 in the hole portion 17 formed in FIG. 3C is removed by exposure and development to form a mold material patterning portion 19.

  Next, as shown in FIG. 3 (F), chemical mechanical polishing is performed from the upper surface of the mold member 8 until the upper surface of the channel side wall portion formed by the photosensitive resin 16 is exposed and cleaned. At this time, the chemical mechanical polishing is performed in order to prevent or suppress the formation of scratches (fine scratches) and dishing (irregularities) on the polishing surface, that is, the pressure, rotation speed, polishing liquid (alumina, silica It goes without saying that tuning is performed under optimum conditions.

  Next, as shown in FIG. 4A, a photosensitive resin (second resin) 21 made of the same material as the photosensitive resin 16 used to form the channel side wall is applied by spin coating or the like. At this time, the photosensitive resin 21 enters the hole portion 17 formed in the previous step. This photosensitive resin 21 is a material that is incompatible with the ODUR of the mold material 8, and is prepared with the same cationic photopolymerization initiator as that of the photosensitive resin 16. However, unlike the photosensitive resin 16, the amount of the silane agent added is reduced so that the ink discharge port 11 can be accurately formed into a predetermined shape. Here, as the photosensitive resins 16 and 21, it is preferable to use the same photosensitive resin except for the blending amount of the silane agent, and a resin composition containing at least a cationically polymerizable epoxy resin and an aromatic onium salt is used. Specifically, as a cationically polymerizable epoxy resin, there are a reaction product of bisphenol A and epochorohydrin, a reaction product of phenol novolac or o-cresol novolak and epichlorohydrin. Moreover, as a suitable other epoxy resin, the polyfunctional epoxy resin etc. which have the oxycyclohexane skeleton of patent documents 3-6 can be mentioned. On the other hand, examples of aromatic onium salts include aromatic iodonium salts, aromatic sulfonium salts, and SP-170 and SP-150 provided by Asahi Denka Kogyo Co., Ltd. In these resin compositions, the aromatic onium salt is decomposed by light irradiation to initiate cationic polymerization of the epoxy resin, thereby forming a cured film. As other epoxy resins, Epon SU-8 (trade name: manufactured by Shell Chemical Co., Ltd.) may be used.

  The ink discharge port 11 is formed by exposing and developing the photosensitive resin 21 with ultraviolet rays or the like. Further, the water repellent material 10 is formed on the photosensitive resin 21 by dry film lamination or the like.

  Next, as shown in FIG. 4B, a protective material 12 is applied by spin coating or the like to protect the surface and side surfaces of the Si substrate 1 on which the mold material 12 and the photosensitive resins 16 and 21 are patterned. Covered with material 12. The protective material 12 functions to prevent scratches during transportation of the apparatus, and at the same time, protects the photosensitive resins 16, 21 and the like from the strong alkaline solution used during anisotropic etching in a subsequent process, and is also water repellent. It works to prevent deterioration of the material 10 and the like. Therefore, a material having sufficient resistance against the strong alkaline solution is used as the protective material 12.

Next, the SiO ₂ film 2 on the back surface of the Si substrate 1 is patterned by wet etching using the back surface patterning layer 7 as a mask. As a result, the Si surface that becomes the etching start surface 13 of the anisotropic etching is exposed.

Next, as shown in FIG. 4C, the ink supply port 14 is formed. In this embodiment, the ink supply port 14 is formed by anisotropic etching using the crystal orientation <100> of the Si substrate 1 and the SiO ₂ film 2 as a mask. For this anisotropic etching, for example, a strong alkali solution such as TMAH is used. Etching is started from the etching start surface 13 until the sacrificial layer 4 formed on the surface side of the Si substrate 1 is reached. The sacrificial layer 4 is made of a material having a high etching rate with an alkaline solution, such as polysilicon, aluminum, aluminum silicon, aluminum copper, and aluminum silicon copper. In this embodiment, etching using the crystal orientation <100> of the Si substrate 1 is employed, but the crystal orientation <110> may be used.

  Next, the back surface patterning layer 7 is removed. Further, the mold material 8 is eluted from the ink supply port 14. The elution of the mold material 8 can be performed by performing development and drying after performing exposure with DeepUV light from the front surface. If necessary, the mold material 8 can be sufficiently removed by ultrasonic immersion during development. By removing the mold material 8, the ink flow path 15 is formed. The ink flow path 15 in the present specification may include a foaming chamber formed so that the pressure generated by the ink discharge energy generating element 3 effectively acts on the ink discharge port 11 side.

  Through the above steps, the main configuration of the ink jet recording head of this embodiment is completed. The ink jet recording head is not shown, but further, a chip tank member for supplying ink is connected to the ink supply port 14, and a member for electrical connection with the recording apparatus side is electrically joined to the bonding pad 20. It is good also as a structure. In addition, a plurality of inkjet recording heads can be simultaneously formed on a single Si substrate 1 by the above-described process. In this case, the Si substrate 1 is cut and separated by a dicing saw or the like to be chipped. The

  In the ink jet recording head of the present embodiment described above, separate photosensitive resins 16 and 21 are provided on the portion of the orifice member 9 serving as the side wall of the ink flow path 15 and the portion where the ink discharge port 11 is formed. Each is used. As the photosensitive resin 16 on the side wall portion of the ink flow path 15, a material having excellent adhesion to the Si substrate 1 by using a larger amount of a silane material than the photosensitive resin 21 is used. On the other hand, a material suitable for forming the ink discharge port 11 with high accuracy is used as the photosensitive resin 21 in the portion where the ink discharge port 11 is formed. As a result, both the adhesion between the orifice member 9 and the substrate 1 and the highly accurate formation of the ink discharge ports 11 can be achieved simultaneously. At this time, the photosensitive resin 21 enters the hole portion 17 of the photosensitive resin 16 to form a structure in which the photosensitive resin 16 is fitted. For this reason, even when the photosensitive resin 21 alone does not provide sufficient adhesion to the Si substrate 1, the orifice member 9 is bonded to the Si substrate 1 sufficiently firmly as a whole. Here, it is important that the photosensitive resin 21 has a lower silane material content than the photosensitive resin 16, and the present invention can be applied even if the photosensitive resin 21 does not contain any silane material.

  Further, the configuration of the present embodiment does not require an adhesion improving layer as in the prior art. For this reason, since there is no influence of the dimensional tolerance of the adhesion improving layer, the restriction on the setting of the ink flow path pattern can be reduced, and the formation pattern can be miniaturized. Therefore, it is possible to provide an ink jet recording head with high recording quality. Further, it is possible to improve the bonding reliability of the orifice member 9 and the accuracy of the formation pattern, and it is possible to manufacture an ink jet recording head having high reliability and good discharge performance. Further, the measure of the present embodiment does not require an expensive material, and can be manufactured at a low price.

(Second Embodiment)
Next, a second embodiment will be described with reference to FIGS. 6 and 7 show the manufacturing process of the ink jet recording head according to the present embodiment shown in FIG. 5 in time series in the form of a cross-sectional view similar to FIGS. Since the main configuration of the ink jet recording head is the same as that of the first embodiment, the description thereof is omitted. In FIGS. 6 and 7, the same reference numerals are given to the same portions as those of the first embodiment. .

  The configuration at the stage of FIG. 6 (A) is the same as the configuration at the stage of the first embodiment shown in FIG. 3 (A). From this state, as shown in FIG. 6B, the back surface patterning layer 7 used for forming the ink supply port 14 is formed on the back surface of the Si substrate 1 as in the first embodiment.

  Next, a thermoplastic polyetheramide resin 6 is applied to the entire surface of the Si substrate 1 and cured. This polyetheramide resin 6 has a high adhesive force with the photosensitive resin 22 (FIG. 6C) that forms the side wall of the ink flow path 15 used in the next step, and functions as an adhesive improvement layer.

  Next, as shown in FIG. 6C, a photosensitive resin (first resin) 22 is applied onto the polyetheramide resin 6 by spin coating or the like, and is patterned by performing exposure and development with ultraviolet rays or the like. . Thereby, the photosensitive resin 22 is configured to have at least a portion that becomes the side wall of the ink flow path 15, and the hole portion 17 opened on the upper surface side is formed as in the first embodiment. At this time, the photosensitive resin 22 to be used is prepared by mixing a photocationic polymerization initiator in order to improve the adhesion with the polyetheramide resin 6 as the adhesion improving layer. Thereafter, the polyetheramide resin 6 is patterned by etching using the photosensitive resin 22 as a mask.

  The subsequent steps are the same as those in the first embodiment. That is, the mold material 8 is applied (FIG. 6 (D), the mold material 8 in the hole portion 17 is removed (FIG. 6 (E)), and the mold material 8 is polished (FIG. 6 (F)). The resin 21 is applied and formed, and the ink discharge port 11 is formed in a portion formed by the second resin 21 (FIG. 7A), and the water repellent material 10 is optionally formed. Then, the surface and side surfaces of the substrate 1 are protected by the protective material 12 (FIG. 7B), the ink supply port 14 is formed, and the mold material 8 is eluted (FIG. 7C).

  Through the above steps, the main configuration of the ink jet recording head of this embodiment is completed. If necessary, dicing saws are formed into chips and chip tank members and electrical connection members are connected.

  Also in the ink jet recording head of the present embodiment described above, the orifice member 9 is composed of the photosensitive resin 22 mainly constituting the flow path wall and the photosensitive resin 21 constituting the ink discharge port 11 forming portion. As a result, both the adhesion between the orifice member 9 and the Si substrate 1 and the highly accurate formation of the ink discharge ports 11 can be achieved simultaneously. In this embodiment, the polyetheramide resin 6 as an adhesion improving layer is interposed between the orifice member 9 and the Si substrate 1 to further improve the bonding reliability between the orifice member 9 and the Si substrate 1. be able to.

  In the above-described embodiment, the configuration example in which the photosensitive resins 16, 22 and 21 are fitted is described. However, the present invention is not limited to this. For example, a manufacturing method described in Patent Document 7 may be used. That is, the present invention can also be realized by forming the ink flow path pattern made of the positive resist ODUR on the substrate and then applying the photosensitive resin 16 and further applying the photosensitive resin 21 thereon to form the discharge port. It is. Thus, in this invention, photosensitive resin does not necessarily need to fit.

1 is a schematic cross-sectional view of an ink jet recording head according to a first embodiment of the present invention. FIG. 2 is a perspective view of the inkjet recording head of FIG. FIG. 2 is a schematic cross-sectional view showing a basic manufacturing process of the ink jet recording head of FIG. 1. FIG. 2 is a schematic cross-sectional view showing a basic manufacturing process of the ink jet recording head of FIG. 1. FIG. 6 is a schematic cross-sectional view of an ink jet recording head according to a second embodiment of the present invention. FIG. 6 is a schematic cross-sectional view showing a basic manufacturing process of the ink jet recording head of FIG. 5. FIG. 6 is a schematic cross-sectional view showing a basic manufacturing process of the ink jet recording head of FIG. 5. FIG. 10 is a schematic cross-sectional view showing a basic manufacturing process of a conventional inkjet recording head.

Explanation of symbols

1 Si substrate (substrate)
3 Ink discharge energy generating element (Discharge energy generating element)
9 Orifice member 16, 22 Photosensitive resin (first resin)
21 Photosensitive resin (second resin)
11 Ink ejection port (ejection port)
15 Ink channel (channel)

Claims (5)

A substrate on which an ejection energy generating element that generates energy necessary for ejecting a liquid is formed, a plurality of ejection ports disposed on the substrate and ejecting the liquid, and the plurality of ejection ports, respectively. In a liquid ejection head comprising an orifice member that forms a plurality of communicating flow paths,
The orifice member includes at least a first resin that forms a portion to be bonded onto the substrate, and a second resin that is bonded to the first resin and forms the plurality of discharge ports. The liquid discharge head is characterized in that the first resin contains more silane agent than the second resin.   2. The liquid ejection head according to claim 1, wherein the first resin and the second resin are made of the same photosensitive resin except for a difference in blending amount of the silane agent.   The liquid discharge head according to claim 1, wherein the second resin does not contain a silane material. A substrate on which an ejection energy generating element that generates energy necessary for ejecting liquid is formed, a plurality of ejection ports bonded to the substrate and ejecting liquid, and communicating with the plurality of ejection ports, respectively In a manufacturing method of a liquid discharge head comprising an orifice member that forms a plurality of flow paths
Forming at least a portion of the orifice member to be bonded to the substrate with a first resin on the surface of the substrate on which the ejection energy generating element is formed;
Coating and forming a mold material on the surface of the substrate so as to cover the first resin;
Polishing the mold material until the surface on the surface side of the substrate of the portion formed of the first resin is exposed;
Applying and forming a second resin having a lower silane material content than the first resin on the polished surface of the first resin and the mold material;
Forming the discharge port in the second resin;
Removing the mold material;
A method of manufacturing a liquid discharge head, comprising: Before applying and forming the mold material, the step of forming a hole portion that opens to the surface side of the substrate in the portion formed by the first resin;
Removing the mold material that has entered the hole before applying and forming the second resin;
The method of manufacturing a liquid discharge head according to claim 4, further comprising:

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