JP2007134893A

JP2007134893A - Circuit module

Info

Publication number: JP2007134893A
Application number: JP2005324925A
Authority: JP
Inventors: Yoshinobu Hayakawa; 宜延早川
Original assignee: Alps Electric Co Ltd
Current assignee: Alps Alpine Co Ltd
Priority date: 2005-11-09
Filing date: 2005-11-09
Publication date: 2007-05-31

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit module which can be carried by a suction device and also can prevent foreign matter from entering inside a cover. <P>SOLUTION: The circuit module of the present invention has a hole 3b bored in the top surface plate 3a of the cover 3 covering the upper part of a circuit component 2 and the hole 3b is covered with a closing member 4 stuck on the top surface plate 3a, so the top surface plate 3a of the cover 3 can be sucked by the suction device 5 to automate assembling operation by the suction device 5 and also can prevent foreign matter from entering inside the cover 3 by the closing member 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、携帯電話機の送受信ユニット等に使用して好適な回路モジュールに関するものである。 The present invention relates to a circuit module suitable for use in a transmission / reception unit of a cellular phone.

従来の回路モジュールの構成を図２に基づいて説明すると、回路基板５１には、種々の回路部品５２が搭載されて、所望の電気回路が形成されており、この回路基板５１は、回路部品５２を上方にして、箱形の枠体５３内に取り付けられると共に、この枠体５３には、上方の開放部を塞ぐようにカバー５４が取り付けられ、カバー５４の上面板５４ａには、回路部品５２を調整するための複数の孔５４ｂが設けられて、従来の回路モジュールが形成されている（例えば、特許文献１参照）。 The configuration of a conventional circuit module will be described with reference to FIG. 2. Various circuit components 52 are mounted on the circuit board 51 to form a desired electric circuit. And a cover 54 is attached to the frame 53 so as to close the upper open portion. A circuit component 52 is attached to the upper surface plate 54a of the cover 54. A conventional circuit module is formed by providing a plurality of holes 54b for adjusting the angle (see, for example, Patent Document 1).

このような構成を有する従来の回路モジュールは、メーカ（顧客）側で、電子機器のマザー基板５５への組み込み作業が行われるが、組立作業を自動化するために、回路モジュールの供給位置で、吸着装置によってカバー５４の上面板５４ａを吸着し、そして、吸着装置によって回路モジュールをマザー基板５５上に搬送するようになっている。
特開平８−２７９６８７号公報 The conventional circuit module having such a configuration is assembled on the mother board 55 of the electronic device on the manufacturer (customer) side. In order to automate the assembling work, the suction is performed at the supply position of the circuit module. The upper surface plate 54a of the cover 54 is sucked by the device, and the circuit module is conveyed onto the mother substrate 55 by the sucking device.
JP-A-8-279687

しかし、従来の回路モジュールは、カバー５４の上面板５４ａに孔５４ｂがあるため、吸着装置による搬送ができないばかりか、孔５４ｂの存在によって、カバー５４内に埃等の異物が侵入するという問題がある。 However, since the conventional circuit module has the hole 54b in the upper surface plate 54a of the cover 54, it cannot be transported by the suction device, and the presence of the hole 54b causes a problem that foreign matters such as dust enter the cover 54. is there.

本発明は、このような従来技術の実情に鑑みてなされたもので、その目的は、吸着装置による搬送が可能であると共に、カバー内への異物の侵入を防止できる回路モジュールを提供することにある。 The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide a circuit module that can be transported by a suction device and can prevent foreign matter from entering the cover. is there.

上記の目的を達成するために、本発明の第１の解決手段として、回路部品が搭載されて所望の電気回路を形成した回路基板と、この回路基板に取り付けられたカバーとを備え、前記カバーは、前記回路部品の上部を覆う上面板を有し、この上面板には、孔が設けられて、前記孔が前記上面板に貼り付けられた塞ぎ部材によって塞がれた構成とした。 In order to achieve the above object, as a first solving means of the present invention, a circuit board on which circuit components are mounted to form a desired electric circuit, and a cover attached to the circuit board, the cover is provided. Has an upper surface plate that covers the upper part of the circuit component. The upper surface plate is provided with a hole, and the hole is closed by a closing member attached to the upper surface plate.

また、第２の解決手段として、前記塞ぎ部材が前記上面板のほぼ全面にわたって設けられた構成とした。 As a second solution, the closing member is provided over substantially the entire upper surface plate.

また、第３の解決手段として、前記塞ぎ部材が粘着剤を設けた絶縁材からなるテープによって形成された構成とした。 As a third solution, the closing member is formed of a tape made of an insulating material provided with an adhesive.

また、第４の解決手段として、前記回路部品の少なくも一つの上部が前記孔内に位置した構成とした。 As a fourth solution, at least one upper part of the circuit component is configured to be located in the hole.

本発明の回路モジュールにおいて、回路部品の上部を覆うカバーの上面板には、孔が設けられて、この孔が上面板に貼り付けられた塞ぎ部材によって塞がれたため、カバーの上面板は、吸着装置によって吸着可能となって、吸着装置による組立作業の自動化が可能となると共に、塞ぎ部材の存在によって、カバー内への異物の侵入を防止できる。 In the circuit module of the present invention, a hole is provided in the upper surface plate of the cover that covers the upper part of the circuit component, and this hole is blocked by the closing member attached to the upper surface plate. Adsorption can be performed by the adsorption device, so that assembly work by the adsorption device can be automated, and the presence of the blocking member can prevent foreign matter from entering the cover.

また、塞ぎ部材が前記上面板のほぼ全面にわたって設けられたため、塞ぎ部材と上面板との間の段差が無くなって、吸着装置による吸着が一層確実にできる。 Further, since the closing member is provided over substantially the entire upper surface plate, there is no step between the closing member and the upper surface plate, and the suction by the suction device can be more reliably performed.

また、塞ぎ部材が粘着剤を設けたテープによって形成されたため、テープの取付が簡単となると共に、テープが絶縁材で形成されることによって、回路部品との絶縁を図ることができる。 In addition, since the closing member is formed of a tape provided with an adhesive, it is easy to attach the tape, and the tape is formed of an insulating material, so that the circuit component can be insulated.

また、回路部品の少なくも一つの上部が孔内に位置したため、カバーの高さを低くできて、小型化を図ることができる。 Further, since at least one upper part of the circuit component is located in the hole, the height of the cover can be reduced, and the size can be reduced.

発明の実施の形態について図面を参照して説明すると、図１は本発明の回路モジュールの要部断面図であり、本発明の回路モジュールの構成を図１に基づいて説明すると、回路基板１には、コンデンサや抵抗器等の種類が異なり、且つ、大きさや形状の異なる種々の回路部品２が搭載されて、所望の電気回路が形成されている。 An embodiment of the invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of an essential part of the circuit module of the present invention. The configuration of the circuit module of the present invention will be described with reference to FIG. In this case, various types of circuit components 2 having different types of capacitors, resistors, etc., and different sizes and shapes are mounted to form a desired electric circuit.

金属製の箱形のカバー３は、四角形の上面板３ａと、この上面板３ａに設けられた孔３ｂと、上面板３ａの辺から下方に折り曲げられた側面板３ｃを有し、このカバー３は、上面板３ａが回路部品２の上部を覆った状態で、側面板３ｂが回路基板１に取り付けられており、この時、背の高い少なくとも一つ回路部品２の上部は、孔３ｂ内に位置した状態となっている。 The metal box-shaped cover 3 includes a rectangular upper surface plate 3a, a hole 3b provided in the upper surface plate 3a, and a side surface plate 3c bent downward from the side of the upper surface plate 3a. The side plate 3b is attached to the circuit board 1 with the top plate 3a covering the top of the circuit component 2. At this time, the top of at least one tall circuit component 2 is placed in the hole 3b. It is in a position.

塞ぎ部材４は、一方の面に粘着剤が設けられた絶縁材からなるテープで形成され、この塞ぎ部材４は、上面板３ａの上面のほぼ全体に貼り付けられて、孔３ｂを塞ぐようになっているが、塞ぎ部材４は、孔３ｂを塞ぐにたりる大きさでも良く、また、この塞ぎ部材４を絶縁材にすることによって、上部が孔３ｂ内に位置した回路部品２との間の絶縁を図ることができるようになって、本発明の回路モジュールが形成されている。 The closing member 4 is formed of a tape made of an insulating material provided with an adhesive on one surface, and the closing member 4 is attached to almost the entire upper surface of the upper surface plate 3a so as to close the hole 3b. However, the closing member 4 may be of a size that closes the hole 3b, and by using the closing member 4 as an insulating material, the closing member 4 can be connected to the circuit component 2 whose upper part is located in the hole 3b. The circuit module of the present invention is formed.

このような構成を有する本発明の回路モジュールは、メーカ（顧客）側で、電子機器のマザー基板（図示せず）への組み込み作業が行われるが、組立作業を自動化するために、図１に示すように、回路モジュールの供給位置で、吸着装置５によってカバー３の上面板３ａを吸着し、そして、吸着装置５によって回路モジュールをマザー基板上に搬送するようになっているが、上面板３ａの孔３ｂを塞ぐ塞ぎ部材４の存在によって、吸着装置５による回路モジュールの搬送が可能となっている。 The circuit module of the present invention having such a configuration is assembled on the mother board (not shown) of the electronic device on the manufacturer (customer) side. In order to automate the assembly work, FIG. As shown, the upper surface plate 3a of the cover 3 is adsorbed by the adsorbing device 5 at the supply position of the circuit module, and the circuit module is conveyed onto the mother substrate by the adsorbing device 5. The presence of the closing member 4 that closes the hole 3b makes it possible to transport the circuit module by the suction device 5.

本発明の回路モジュールの要部断面図である。It is principal part sectional drawing of the circuit module of this invention. 従来の回路モジュールの分解斜視図である。It is a disassembled perspective view of the conventional circuit module.

Explanation of symbols

１回路基板
２回路部品
３カバー
３ａ上面板
３ｂ孔
３ｃ側面板
４塞ぎ部材
５吸着装置 DESCRIPTION OF SYMBOLS 1 Circuit board 2 Circuit component 3 Cover 3a Top plate 3b Hole 3c Side plate 4 Closing member 5 Suction device

Claims

A circuit board on which circuit components are mounted to form a desired electric circuit, and a cover attached to the circuit board, the cover having an upper surface plate that covers an upper portion of the circuit component, Is a circuit module characterized in that a hole is provided and the hole is closed by a closing member attached to the upper surface plate.

The circuit module according to claim 1, wherein the blocking member is provided over substantially the entire surface of the upper surface plate.

3. The circuit module according to claim 1, wherein the closing member is formed of a tape made of an insulating material provided with an adhesive.

The circuit module according to claim 1, wherein at least one upper portion of the circuit component is located in the hole.