JP2007134582A - Method and system for inspecting soldered condition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and a system for inspecting a soldered condition. <P>SOLUTION: In the method for inspecting the soldered condition of an electronic component 20 of a terminal insertion mounting type; the site of a solder fillet 30 formed on a rear surface 11b of a substrate and a periphery thereof are imaged by a camera 120 under a condition of the site and periphery illuminated by an illuminating device 110, so that the formation site of the solder fillet 30, a terminal 20 of the electronic component exposed from the solder fillet 30, and the substrate rear surface 11b, are included in an imaging area. Under the condition of the solder fillet 30 already formed, a mutual positional relation between the illuminating device 110 and the camera 120 is set, so that the amount of first light 111 reflected by the solder fillet 30 and received at the camera 120 is smaller than the amount of second light 112 reflected by the terminal 20 and the mount of third light 113 reflected by the substrate rear surface 11b, and it is determined whether the soldered condition of the component and the terminal is good or bad on the basis of differences in amounts between the reflected light 111 to 113. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a soldering state inspection method and a soldering state inspection apparatus for inspecting a soldering state of a terminal insertion mounting type electronic component mounted on a printed circuit board.

  Conventionally, for example, Patent Literature 1 is disclosed as a soldering state inspection method for inspecting a soldering state of a terminal insertion mounting type electronic component mounted on a printed circuit board.

In Patent Document 1, the solder around the lead in the through hole is illuminated by omnidirectional irradiation, and the solder surface is imaged from directly above. Then, the image data is binarized, the dark area is calculated from the number of dark pixels, and the solder of the blow hole (the space formed in the soldering portion) is compared from the size of the dark area and the judgment area. The defect is detected.
JP-A-6-117828

  However, according to the method shown in Patent Document 1, even if the soldering portion (so-called solder fillet) is insufficiently soldered, it is difficult to detect the insufficient state unless blow holes are involved. is there.

  An object of this invention is to provide the soldering state inspection method and soldering state inspection apparatus which can test | inspect the solder rising state of a soldering part in view of the said problem.

  In order to achieve the above object, the invention described in claim 1 is a soldering state inspection method for inspecting a soldering state of a terminal insertion mounting type electronic component mounted on a printed circuit board, wherein a solder fillet is formed. In the state where the portion to be processed and its periphery are illuminated by a light source, the image pickup means picks up an image so that the solder fillet forming portion, the terminal of the electronic component exposed from the solder fillet, and the surface of the printed circuit board are included in the image pickup area. In the state where the solder fillet is formed, the light source and the imaging means receive the light from the imaging means, and the amount of the first reflected light from the solder fillet of the light emitted from the light source is the second reflection by the terminal. The positional relationship between each other is set so as to be smaller or larger than the amount of light and the third reflected light from the surface of the printed circuit board. Based on the light amount difference of Shako, and judging the quality of the soldering state.

  As described above, according to the present invention, the amount of reflected light from the light source differs between the solder fillet, the terminal and the substrate surface sandwiching the solder fillet, and therefore the solder fillet (solder It is possible to inspect the soldered state of the attached part).

  In addition, as an element for determining the solder rise state of the solder fillet, a solder fillet that generates the first reflected light, a terminal that generates the second reflected light, and a substrate surface that generates the third reflected light are arranged at both ends thereof. Is included. That is, the position of the solder fillet is easily defined as compared with the case where the solder fillet is inspected based on the reflected light from the solder fillet or the reflected light from the solder fillet and the terminal. Accordingly, it is possible to reduce misjudgment caused by positional deviation of, for example, a printed circuit board and an imaging unit.

  The inspection method can be applied to solder fillets formed on any surface of the printed circuit board.

  Here, at the time of soldering, the molten solder comes into contact with one side of the board (the side that directly contacts the molten solder), wets the through hole, and forms a so-called upward solder fillet on the back side of the one side. However, it is important to ensure an electrical and mechanical connection between the through hole wall surface of the substrate and the land provided around the through hole on the substrate surface and the terminals of the electronic component. Therefore, as described in claim 2, the solder fillet is formed on the back side of the surface of the printed circuit board that directly contacts the molten solder during soldering, and the solder fillet is inspected for the solder fillet. It ’s fine.

  Specifically, as described in claim 3, the light source and the imaging unit are configured so that the amount of the first reflected light is smaller than the amount of the second reflected light and the third reflected light. When the mutual positional relationship is set, the third reflected light is reflected by the surface of the printed circuit board, which is reflected by the terminal of the light emitted from the light source, and is received by the imaging means. A reflection image in which the terminal is reflected on the extension of the terminal along the longitudinal direction of the terminal is formed on the surface of the printed circuit board included in the area.

  In this case, since the reflected image formed on the substrate surface is formed on the extension of the terminal along the longitudinal direction of the terminal, for example, when there is no solder fillet, the reflected image of the terminal that is a bright part is almost the same. It becomes a straight line. That is, the presence or absence of a solder fillet can be determined based on whether the line is substantially a straight line or the straight line is divided by the dark portion of the solder fillet. Therefore, when determining the quality of the soldered state based on the presence or absence of a solder fillet, the determination can be made particularly easy.

  In addition, as a determination process, a well-known technique is employable. For example, as described in claim 4, a binarization process can be adopted. In this case, when the terminal and the substrate surface are bright parts (dark parts), the solder fillet becomes the opposite dark part (bright part), and therefore, the solder fillet state of the solder fillet is determined by, for example, the number of dark pixels (number of bright pixels). be able to. In addition to the binarization process using light and dark (black and white), a gray process or a color process using RGB data of each pixel can be applied. In addition to the number of pixels, position (coordinates), average luminance (density), and the like can be used as determination elements.

  Next, the invention according to claim 5 is a soldering state inspection device for inspecting a soldering state of an electronic component of a terminal insertion mounting type mounted on a printed board, wherein a solder fillet is formed and A light source that illuminates the surroundings, a solder fillet forming part, a terminal of an electronic component exposed from the solder fillet, and an imaging means for imaging so as to include the surface of the printed circuit board in the imaging area, and an image obtained by imaging are subjected to predetermined processing And a light source and an image pickup means are formed by a solder fillet of light emitted from the light source and received by the image pickup means in a state where a solder fillet is formed. The amount of the first reflected light is smaller or larger than the second reflected light from the terminal and the third reflected light from the surface of the printed circuit board. Mutual positional relationship is set to so that the control means on the basis of the light amount difference of each reflected light, and judging the quality of the soldering state. Since the operational effects of the present invention are the same as the operational effects of the invention described in claim 1, the description thereof is omitted.

  According to a sixth aspect of the present invention, it is preferable that the light source and the imaging means are disposed on the back side of the surface of the printed circuit board that directly contacts the molten solder during soldering. Since the operational effects of the present invention are the same as the operational effects of the invention described in claim 2, the description thereof is omitted.

  Since the operation and effect of the inventions according to claims 7 and 8 are the same as the operation and effect of the inventions according to claims 3 and 4, the description is omitted.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a soldering state inspection apparatus according to an embodiment of the present invention. As shown in FIG. 1, a soldering state inspection apparatus 100 according to this embodiment inspects a soldering state of a terminal insertion type electronic component 20 (hereinafter referred to as an electronic component) mounted on a printed circuit board 10. is there. That is, whether or not a good solder fillet 30 is formed on the land 13a on the substrate surface in a state where the terminal 20 of the electronic component is inserted into the through hole 12 formed in the substrate 11 constituting the printed circuit board 10. Is to inspect. The constituent material of the substrate 11 is not particularly limited as long as the surface has gloss. In this embodiment, it is comprised from the synthetic resin.

  In FIG. 1, only the terminal of the terminal insertion type electronic component is illustrated, and a reference numeral 20 is given to the terminal. Reference numeral 11a denotes a surface that directly contacts the molten solder during soldering (hereinafter referred to as substrate surface 11a), reference numeral 11b refers to the back surface of the substrate surface 11a (hereinafter referred to as substrate back surface 11b), and reference numeral 13b denotes the land 13 The through hole wall land is shown.

  The soldering state inspection apparatus 100 includes an illumination device 110 as a light source, a camera 120 as an imaging unit, an image processing unit 130 as a control unit, and a notification unit 140 as a notification unit.

  The illumination device 110 illuminates a portion where the solder fillet 30 is formed (in other words, a portion to be formed) and its surroundings. The type and shape of the light source are not particularly limited. In the present embodiment, an LED light source is employed and arranged so as to illuminate a portion on the substrate back surface 11b side and the periphery thereof among the portions where solder fillets 30 are formed (hereinafter referred to as solder fillet forming portions).

  The camera 120 captures an image so as to include the solder fillet forming portion, the terminal 20 of the electronic component exposed from the solder fillet 30, and the surface of the printed board 10 (substrate back surface 11 b in the present embodiment) in the imaging area. . In the present embodiment, a CCD camera provided with a CCD is used as an image sensor.

  In addition, the illumination device 110 and the camera 120 have a solder fillet 30 of light irradiated from the illumination device 110 that is received by the camera 120 in a state where the solder fillet 30 is formed (in other words, a state where the solder fillet 30 is formed). The amount of first reflected light 111 (solid arrow in FIG. 1) by the second reflected light 112 by the terminal 20 of the electronic component (broken arrow in FIG. 1) and the third reflected light 113 by the substrate back surface 11b. The mutual positional relationship is set so as to be smaller than the amount of light (two-dot chain line arrow in FIG. 1).

  In other words, the light irradiated from the illumination device 110 is set so that the reflected light from the terminal 20 is reflected by the substrate back surface 11b and received by the camera 120 as the third reflected light. That is, as shown in FIG. 2A, the imaging area includes a portion where the reflection image 21 is formed on the extension of the terminal 20 along the longitudinal direction of the terminal 20 on the substrate back surface 11b. Is set to For example, when the solder finish in the through hole 12 is insufficient and the solder fillet 30 is not formed as shown in FIG. 2B, a reflection image 21 of the terminal 20 is formed from around the through hole on the back surface 11b of the substrate. Is done. In other words, the terminal 20 exposed on the back surface 11b of the substrate and the reflected image 21 are connected as if they were connected. 2A and 2B are diagrams for explaining the reflected image 21 formed on the back surface 11b of the substrate. FIG. 2A shows a state in which the solder fillet 30 is present, and FIG.

  The image processing unit 130 performs predetermined processing on the image data from the camera 120 and determines whether the soldering state is good or bad. In the present embodiment, the quality of the soldered state is determined based on the light amount difference between the first to third reflected lights 111 to 113 described above. Specifically, it is configured as a normal computer, and includes a well-known CPU, ROM, RAM, I / O, and a bus line for connecting these configurations. In the ROM, a program to be executed by the image processing unit 130 is written, and a CPU or the like executes predetermined arithmetic processing according to this program. The image processing unit 130 according to the present embodiment includes a binarization processing unit 131, an area calculation unit 132, a determination unit 133, and a notification output control unit 134 as functional units.

  The binarization processing unit 131 reads an image signal from the camera 120 and, for example, a portion that is higher (brighter) than the threshold is white and lower (darker) based on a predetermined threshold stored in advance in a storage unit (not shown). ) Part is a part for binarizing the image signal so as to take any value of black. As a result, the image signal is converted from an analog signal to a digital signal.

  The area calculation unit 132 is a part that counts the number of pixels of at least one of white and black in a preset inspection region and calculates the area. In the present embodiment, the number of black pixels in the inspection region is counted and the area is calculated. The inspection area may be the entire imaging area, or may be in a predetermined area defined by a so-called inspection window in the imaging area. The soldering state inspection apparatus 100 according to the present embodiment can set an arbitrary inspection window at a portion to be inspected on the monitor screen as the notification unit 140. When the inspection window is set, the area is The calculation unit 132 counts the number of pixels of at least one of white and black in the region where the inspection window is set, and calculates the area.

  The determination unit 133 is a part that compares and determines whether or not the area calculated by the area calculation unit 132 is equal to or greater than a threshold value, for example, based on a predetermined threshold value stored in advance in the storage unit. Based on the determination result, the notification output control unit 134 controls the output of the notification unit 140.

  The notification unit 140 outputs a determination result to the outside based on a determination signal from the determination unit 133. For example, a display device such as a monitor, an audio output device that outputs an alarm sound or the like (for example, an electronic buzzer, a horn, etc.) ), And patrolite. In the present embodiment, a monitor that displays a captured image, a binarized image, and a determination result, and a sound output device that outputs an alarm sound in the case of poor soldering are employed.

  Next, a soldering state inspection method by the soldering state inspection apparatus 100 having the above configuration will be described with reference to FIGS. FIG. 3 is a flowchart showing a main part of the control content by the image processing unit 130. 4A and 4B are diagrams showing binarized image data. FIG. 4A shows a state in which the solder fillet 30 is present, and FIG. 4B shows a state in which the solder fillet 30 is not present. In FIG. 4, a frame portion denoted by reference numeral 135 indicates an inspection window. 5A and 5B are cross-sectional views for explaining the soldering state. FIG. 5A shows a state in which the solder fillet 30 is present on the substrate back surface 11b, and FIG.

  First, as described above, the light quantity of the first reflected light 111 by the solder fillet 30 of the light irradiated from the illumination device 110 received by the camera 120 in a state where the good solder fillet 30 is formed. The positional relationship between the illumination device 110 and the camera 120 with respect to the printed circuit board 10 is set so as to be smaller than the amount of light of the second reflected light 112 by the terminal 20 of the electronic component and the third reflected light 113 by the substrate back surface 11b. (See FIGS. 1 and 2). With this positional relationship maintained, the solder fillet formation site and its surroundings on the substrate back surface 11b illuminated by the illumination device 110 are imaged by the camera 120.

  When an image signal obtained by this imaging is input to the image processing unit 130, the binarization processing unit 131 uses a predetermined threshold stored in advance in the storage unit as the reference for the image signal (brighter). The binarization processing is performed so that the value of the portion) is white and the portion of the lower (dark) portion is black (S100). As a result, the image signal is converted from an analog signal to a digital signal. The threshold value is set to a value that is larger than the light amount of the first reflected light 111 and smaller than the light amounts of the second and third reflected lights 112 and 113, for example.

  Next, the area calculation unit 132 counts the number of pixels in the black portion in a preset inspection region (inspection window) in the binarized image signal, and calculates the area (S200). In the present embodiment, the inspection window is set so as to include a solder fillet forming portion, a terminal 20 exposed on the substrate back surface 11b, and a reflected image 21 of the terminal 20 reflected on the substrate back surface 11b. When the solder fillet 30 is formed, as shown in FIG. 4A, the reflection image 21 formation site of the terminal 20 and the substrate back surface 11b is a white portion, and the solder fillet 30 is a black portion. Further, when the solder fillet 30 is not formed, as shown in FIG. 4B, there is no black portion due to the solder fillet 30 between the terminal 20 and the portion where the reflection image 21 is formed on the back surface 11b of the substrate. 20 and the white part of the formation part of the reflected image 21 form a substantially straight line. As described above, in the present embodiment, the state of the solder fillet 30 in the black portion that is disposed between the terminal 20 that is the white portion and the portion where the reflected image 21 is formed is inspected. Therefore, it is easy to define the position of the solder fillet 30. For example, even if a positional deviation of the printed circuit board 10 or an optical axis deviation of the illumination device 110 or the camera 120 occurs, the total number of pixels in the white portion hardly changes, so that erroneous determination can be reduced.

  The determination unit 133 compares the calculated black area with a threshold value stored in advance in the storage unit. If the black area is larger than the threshold value, the determination unit 133 determines that the soldering state is good, and the black area is the threshold value. In the following cases, it is determined that the soldering state is not good (that is, defective) (S300). This determination result is output from the determination unit 133 to the notification output control unit 134. If the black portion is arranged between the white portion of the terminal 20 and the reflected image 21, the above threshold value is not limited to the solder fillet 30 formed on the back surface 11b of the substrate as shown in FIG. The soldering state is determined to be good. Note that the state without the solder fillet 30 (that is, the soldering state is not good) means that the through hole 12 has a shoulder portion and a terminal 20 corresponding to the shoulder portion on the substrate back surface 11b as shown in FIG. 5B. The state where the solder is not raised to at least one of the parts is shown.

  The notification output control unit 134 controls the output of the notification unit 140. The notification unit 140 notifies the non-defective product (S400) when the soldering state is good, and notifies the defective product when the soldering state is defective. (S500) is performed. The above steps are repeated each time an image signal is input to the image processing unit 130 with the image processing unit 130 powered on.

  As described above, according to the soldering state inspection apparatus 100 and the soldering state inspection method according to the present embodiment, it is possible to inspect the formation state of the solder fillet 30, that is, the solder rising state.

  In the present embodiment, an example in which the soldering state is determined based on the number of pixels (area) of the black portion is shown. However, as shown in the above embodiment, the reflected image 21 formed on the substrate back surface 11 b is formed on the extension of the terminal 20 along the longitudinal direction of the terminal 20. That is, for example, when the solder fillet 30 is not present, the terminal 20 which is a white portion and the reflected image 21 are substantially one straight line. Accordingly, in the binarized image data, the white portion is almost a straight line or is divided by the black portion of the solder fillet 30 (there is a black portion between the white portions). However, the presence or absence of the solder fillet 30 (in other words, the soldered state) can be determined. In this case, the determination process can be simplified.

  Although the preferred embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and can be implemented with various modifications.

  In the present embodiment, an example is shown in which the image processing unit 130 performs binarization processing of image data on white or black, calculates the number of pixels of a black portion of a predetermined inspection area, and compares the data with a threshold value. . However, the soldering state may be determined by calculating the number of pixels in the white portion and comparing it with a threshold value. In addition to the number of pixels (area), dimensions, positions (coordinates), average luminance (density), and the like can also be adopted as determination elements. In addition to the black and white binarization processing, gray processing and color processing using RGB data of each pixel can be employed. What is necessary is just to judge the quality of a soldering state based on the light quantity difference of each reflected light 1111-113.

  In the present embodiment, an example in which the solder rising state is inspected for the so-called rising solder fillet 30 formed on the back surface 11b of the surface of the printed circuit board 10 that directly contacts the molten solder during soldering has been shown. However, the present invention can be applied to the solder fillet 30 formed on any surface of the printed circuit board 10.

  In the present embodiment, the illumination device 110 and the camera 120 are the first reflected light by the solder fillet 30 of the light irradiated from the illumination device 110 that is received by the camera 120 in a state where the solder fillet 30 is formed. The example in which the mutual positional relationship is set so that the light quantity of 111 becomes smaller than the light quantity of the second reflected light 112 by the terminal 20 and the third reflected light 113 by the substrate back surface 11b is shown. However, the mutual positional relationship may be set so that the light quantity 111 of the first reflected light is larger than the light quantities of the second reflected light 112 and the third reflected light 113. Also in this case, the soldering state can be determined based on the light amount difference.

  In this embodiment, the example which determines whether a soldering state is favorable or bad by the presence or absence of the solder fillet 30 was shown. However, even if the solder fillet 30 is formed by appropriately setting a threshold value applied to the determination by the determination unit 133, soldering is performed depending on the formation state (for example, a range formed on the land 13a). It may be determined whether the state is good or bad.

It is a figure showing the schematic structure of the soldering state inspection device concerning one embodiment of the present invention. It is a figure for demonstrating the reflected image formed in a board | substrate back surface, (a) has a solder fillet, (b) has shown the state without a solder fillet. It is a flowchart which shows the principal part of the control content by an image processing unit. It is a figure which shows binarized image data, (a) has a solder fillet, (b) shows the state without a solder fillet. It is sectional drawing for demonstrating a soldering state, (a) has a solder fillet in a substrate back surface, (b) has shown the state without a solder fillet in a substrate back surface.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Printed circuit board 11 ... Board | substrate 11b ... Board | substrate back surface 12 ... Through-hole 13 ... Land 20 ... Terminal (electronic component)
21 ... Reflected image 30 ... Solder fillet 100 ... Soldering state inspection device 110 ... Illumination device (light source)
111: First reflected light 112: Second reflected light 113: Third reflected light 120: Camera (imaging means)
130: Image processing unit (control means)

Claims (8)

A soldering state inspection method for inspecting a soldering state of a terminal insertion mounting type electronic component mounted on a printed circuit board,
The image pickup area includes the solder fillet forming portion, the terminal of the electronic component exposed from the solder fillet, and the surface of the printed circuit board in a state where a portion where the solder fillet is formed and the periphery thereof are illuminated by a light source. Which is imaged by an imaging means,
In the state where the solder fillet is formed, the light source and the imaging unit are configured such that the amount of the first reflected light by the solder fillet received by the imaging unit is received by the imaging unit. The positional relationship between the second reflected light by the terminal and the third reflected light by the surface of the printed circuit board is set so as to be small or large,
A soldering state inspection method, wherein the quality of a soldering state is determined based on a difference in light amount between the reflected lights.   The soldering state inspection method according to claim 1, wherein the solder fillet is formed on the back side of the surface of the printed board that directly contacts the molten solder during soldering. The positional relationship between the light source and the imaging unit is set so that the amount of the first reflected light is smaller than the amount of the second reflected light and the third reflected light,
The third reflected light is light reflected from the terminal of the light emitted from the light source, reflected by the surface of the printed circuit board, and received by the imaging means, and is included in the imaging area. 3. The soldering according to claim 1, wherein a reflection image in which the terminal is reflected on an extension of the terminal along a longitudinal direction of the terminal is formed on a surface of the printed circuit board. Condition inspection method.   The soldering state inspection method according to claim 1, wherein binarization processing is performed based on a light amount difference between the reflected lights. A soldering state inspection device for inspecting a soldering state of a terminal insertion mounting type electronic component mounted on a printed circuit board,
A light source that illuminates the site where the solder fillet is formed and its surroundings;
Imaging means for imaging so as to include the solder fillet forming portion, the terminal of the electronic component exposed from the solder fillet, and the surface of the printed board in an imaging area;
A control unit that performs predetermined processing on the image obtained by the imaging and determines whether the soldering state is good or bad;
In the state where the solder fillet is formed, the light source and the imaging unit are configured such that the amount of first reflected light by the solder fillet received by the imaging unit is received by the imaging unit, The positional relationship between the second reflected light by the terminal and the third reflected light by the surface of the printed circuit board is set so as to be small or large,
The said control means determines the quality of a soldering state based on the light quantity difference of each reflected light, The soldering state inspection apparatus characterized by the above-mentioned.   The soldering state inspection apparatus according to claim 5, wherein the light source and the imaging unit are arranged on a back side of a surface of the printed circuit board that directly contacts molten solder during soldering. The positional relationship between the light source and the imaging unit is set so that the amount of the first reflected light is smaller than the amount of the second reflected light and the third reflected light,
The third reflected light is light reflected from the terminal of the light emitted from the light source, reflected by the surface of the printed circuit board, and received by the imaging means, and is included in the imaging area. 7. The soldering according to claim 5, wherein a reflection image in which the terminal is reflected on an extension of the terminal along a longitudinal direction of the terminal is formed on a surface of the printed circuit board. Condition inspection device.   The soldering state inspection device according to claim 5, wherein the control unit performs binarization processing based on a light amount difference between the reflected lights.

Images