JP2007134446A - Optical element module, photoelectric wiring board, and photoelectronic compound assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optoelectric module wherein an optical element and an optical waveguide can be automatically positioned respectively only by mounting them, and to provide an photoelectric wiring board and an photoelectronic compound assembly. <P>SOLUTION: The optical element module is provided with an insertion part which is inserted into an insertion hole made in an photoelectric wiring board so that it may cross an optical waveguide, and which includes an optical element as well as a board from which the insertion is projected. The board includes a connection pad on the board side formed on the surface of the photoelectric wiring board, and a connection pad on the module side that is electrically connected by heating and melting a solder. In addition, the connection pad on the module side is provided in a manner that its center is displaced in the opposite direction to a direction where the respective optical elements are pressed to the end face of the optical waveguide corresponding to the optical element. Thus, the optical element module, the photoelectric wiring board, and the photoelectronic compound assembly, are formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical element module, an optoelectric wiring board, and an optoelectronic composite assembly.

  In recent years, in an electronic device such as a microcomputer, it has been studied to improve an operation speed and a degree of integration by performing optical wiring instead of electric wiring between boards or in a chip. Further, instead of the conventional telecommunication system, an optoelectronic composite system capable of performing communication at high speed and large capacity has been used.

  As such an optoelectronic composite system, there is one in which an optical element module on which an optical element is mounted is mounted on an optoelectric board having an optical waveguide formed on the surface or inside thereof.

  As an optoelectronic composite system in which an optical element module is mounted on a photoelectric substrate, for example, a step of sequentially laminating a clad layer and a core layer on a substrate, patterning the core layer into a core portion of a desired shape, and then upper clad A step of providing an optical waveguide portion by stacking layers; a step of removing a desired portion of the optical waveguide portion into a concave cross-sectional shape to form an optical element mounting portion; and a step of providing an electric wiring portion at the bottom of the concave shape And when the core layer is patterned into a desired core portion, a portion corresponding to a region including at least a part of the electrical wiring portion is included in the patterned core portion. And forming a dielectric layer comprising a part of an optical waveguide on a substrate corresponding to a region including a part of the electrical wiring part after forming the optical element mounting part. Optoelectronic integrated for mounting the substrate has been proposed (Patent Document 1).

  As the optoelectronic composite system, an electronic integrated element bare chip and an optical element chip for performing at least part of signal input / output to / from the element by an optical signal are integrated in the same package. There has been proposed an optoelectronic integrated device in which a drive circuit for controlling the optical circuit is integrated in the same package together with wiring means between the optical device (Patent Document 2).

Furthermore, in an optical semiconductor module in which an optical semiconductor element and a sub-board are fixed via solder bumps and the sub-board is accommodated in a package, an optical semiconductor module having two or more types of solder bumps having different melting points has been proposed. (Patent Document 3).
JP 10-048449 A JP 2001-048449 A Japanese Patent Laid-Open No. 10-34040

  In these optoelectronic composite systems, when the optical element module is mounted on the photoelectric circuit board, the optical signal is not attenuated between the optical element of the optical element module and the optical waveguide of the photoelectric circuit board. When mounting the optical element module on the optoelectric wiring board, the optical element and the optical waveguide need to be positioned accurately.

  However, Patent Documents 1 and 2 do not show anything about an optical element module or an optoelectric wiring board in which an optical element and an optical waveguide are automatically positioned at the time of mounting.

  Patent Document 3 describes that an optical semiconductor element is automatically self-aligned at a predetermined position on a sub-board by the surface tension of a melted solder bump. It is not shown to press against the end face of the optical fiber.

  The present invention has been made to solve the above problems, and an optical element module and an optoelectric wiring board in which an optical element and an optical waveguide are automatically and accurately positioned only by mounting, and the optical element module. It is an object of the present invention to provide an optoelectronic composite assembly in which is mounted on the optoelectric wiring board.

  The invention according to claim 1 is an optical element module mounted on an optoelectric wiring board on which an optical waveguide is formed, and is drilled in the optoelectric wiring board so as to intersect the optical waveguide at the time of mounting. An insertion portion provided with an optical element that is inserted into the insertion hole and has at least one of a function of emitting light to the optical waveguide and a function of receiving light transmitted through the optical waveguide; A module-side connection pad that is electrically connected to the board-side connection pad provided on the surface of the opto-electric wiring board by heating and melting solder. The module-side connection pad has a center in the direction in which each optical element is pressed against the end face of the optical waveguide corresponding to the optical element with respect to the center of the board-side connection pad. Relates to an optical element module characterized by comprising provided so as to be offset in the opposite direction.

  After inserting the insertion portion of the optical element module into the insertion hole of the photoelectric circuit board, the optical element module is heated, and the solder balls attached to the surface of the module side connection pad of the optical element module are dissolved. When the board-side connection pads of the optoelectric wiring board and the solder are electrically connected by heating and melting, a suction force is generated between the module-side connection pads and the board-side connection pads due to the surface tension of the melted solder.

  Here, the center of the module side connection pad is shifted from the center of the board side connection pad in a direction opposite to the direction in which each optical element is pressed against the end face of the optical waveguide corresponding to the optical element. Thus, the suction force acts in a direction in which each optical element in the insertion portion is pressed against the end face of the optical waveguide corresponding to the optical element.

  Thus, each optical element on the insertion portion and the optical waveguide corresponding to the optical element are automatically aligned by the surface tension of the molten solder.

  Therefore, the optical signal is not greatly attenuated between the optical element module and the optoelectric wiring board.

  In addition, in a state where the optical element module is mounted on the photoelectric wiring board, the light emitted from the optical element is directly incident on the optical waveguide in the photoelectric wiring board, and the light transmitted through the optical waveguide is Since the light directly enters the optical element, it is not necessary to form a waveguide, a lens, or a reflecting mirror on the insertion portion or the substrate. Therefore, the optical element module can be configured at low cost.

  The invention according to claim 2 corresponds to each optical element and the optical element by engaging with a second alignment structure provided on the photoelectric wiring board in the vicinity of the optical element of the insertion portion. The optical element module according to claim 1, wherein a first alignment structure that aligns with an end face of the optical waveguide is formed.

  When the insertion portion of the optical element module is inserted into the insertion hole of the photoelectric circuit board and the optical element module is heated to reflow the solder, the first alignment provided in the insertion portion is caused by the surface tension of the molten solder. The structure and the second alignment structure provided on the photoelectric wiring board are more firmly engaged. Thereby, each optical element on the insertion portion and the optical waveguide corresponding to the optical element are accurately aligned, so that the attenuation of the optical signal between the optical element module and the photoelectric wiring board is reduced. Further effectively prevented.

  The invention described in claim 3 relates to the optical element module according to claim 2, wherein the first alignment structure is a convex portion provided between two adjacent optical elements.

  As the insertion portion provided in the optical element module of the present invention, for example, an insertion portion formed from a thin plate or block of a semiconductor material such as silicon, gallium arsenide, or gallium indium arsenide is used.

  In such an insertion portion, an electrical wiring is formed in the thin plate or block, and at the same time, a conventional semiconductor process such as diffusing a dopant in a predetermined region is used. An optical element such as a surface emitting semiconductor laser (VCSEL) element or a photodiode element can be formed on the surface opposite to the end face of the waveguide. The convex portion serving as the first alignment structure can be formed by adhering a thin plate, block, or strip material between the optical elements thus formed.

  As an opto-electric wiring board on which the optical element module is mounted, there is one in which a recess functioning as a second alignment structure is provided in a portion sandwiched between two adjacent optical waveguides on the wall surface of the insertion hole. When the optical element module is mounted on the temporary electrical wiring board, the convex part of the optical element module and the concave part of the photoelectric wiring board are engaged, and the optical element and the optical waveguide are aligned.

  The invention according to claim 4 is the pair of fence-like structures provided along the insertion direction of the insertion portion so that the first alignment structure sandwiches the optical element. The present invention relates to an optical element module.

  Since the fence-like structure provided in the optical element module is a strip-like structure and easily elastically deforms, when the optical element module is mounted on an optoelectric wiring board, the fence-like structure and the Mechanical stress acting between the two alignment structures is absorbed by the fence-like structure. Therefore, the fence-like structure and the second alignment structure are prevented from being damaged by the mechanical stress.

  Such a fence-like structure is formed of polyimide resin or the like.

  The invention according to claim 5 relates to the optical element module according to claim 4, wherein the fence-like structure optically insulates two adjacent optical paths.

  In the optical element module, two adjacent optical elements are optically insulated by the fence-like structure, so that the optical paths formed by these optical elements are also optically insulated from each other. Therefore, it is effectively prevented that an optical signal leaks between two adjacent optical elements to cause interference.

  The invention according to claim 6 relates to the optical element module according to claim 2, wherein the first alignment structure is a recess provided between two adjacent optical elements.

  In the optical element module, after forming an optical element by a semiconductor process on a thin plate or block of the semiconductor material, a recess can be formed between the optical elements by a technique such as laser etching.

  Further, as the optoelectric wiring board on which the optical element module is mounted, there is one in which a convex portion functioning as a second alignment structure is provided in a portion sandwiched between two adjacent optical waveguides on the wall surface of the insertion hole. is there. When the optical element module is mounted on the temporary electrical wiring board, the concave portion of the optical element module and the convex portion of the photoelectric wiring board are engaged, and the optical element and the optical waveguide are aligned.

  The invention according to claim 7 relates to the optical element module according to any one of claims 1 to 6, wherein the optical element is selected from a photodiode and a surface emitting semiconductor laser element.

  Both the photodiode and the surface emitting semiconductor laser can be formed on the insertion portion by a normal semiconductor process. In addition, a large number of surface emitting semiconductor lasers can be formed on a single wafer, and a highly uniform laser beam can be obtained.

  The invention according to claim 8 relates to the optical element module according to any one of claims 1 to 7, wherein the input chip is mounted in a groove provided in the substrate.

  After the insertion portion is inserted into the groove, the electrical connection pad provided in the insertion portion and the electrical connection pad on the substrate are connected with a conductive epoxy resin, thereby inserting the electronic circuit on the substrate. At the same time as the optical element on the part is electrically connected, the insertion part is firmly fixed on the substrate.

  In the microchip module, the groove for erecting the insertion portion can be easily formed on the substrate by a dicing saw. Therefore, processing for erecting the insertion portion on the substrate is easy.

  According to a ninth aspect of the present invention, the substrate included in the optical element module receives a drive chip on which a driver circuit for driving the optical element is formed or an electrical signal obtained by converting light received by the optical element. It is a chip | tip, It is related with the optical element module of any one of Claims 1-8.

  In the optical element module, the driver circuit for driving the optical element and the receiver circuit for receiving the electrical signal obtained by converting the light received by the optical element are formed on the substrate side. It is not necessary to form an electronic circuit for this purpose. It is only necessary to form an optical element and electrical wiring for connecting the optical element to a driver circuit or a receiver circuit on the substrate. Therefore, the configuration of the insertion portion can be greatly simplified, and the size of the insertion portion can be greatly reduced.

  A tenth aspect of the present invention is an opto-electric wiring board on which the optical element module according to any one of the first to ninth aspects is mounted while having an optical waveguide, and the optical element module insertion portion An insertion hole into which the module is inserted is formed, and a module-side connection pad provided on the substrate of the optical element module and a board-side connection pad that is electrically connected by heating and melting the solder are provided on the surface. The board-side connection pad is provided such that the center is shifted in the direction in which each optical element is pressed against the end face of the optical waveguide corresponding to the optical element with respect to the center of the module-side connection pad. The present invention relates to an opto-electric wiring board.

  The surface of the module-side connection pad of the optical element module is heated after the insertion portion of the optical element module is inserted into the insertion hole of the optoelectric wiring board, as described in claim 1. When the solder balls attached to the substrate are melted and electrically connected by heating and melting the board-side connection pads of the photoelectric wiring board and the solder, the module-side connection pads and the board-side connection pads are brought about by the surface tension of the melted solder. A suction force is generated between

  Here, since the center of the board-side connection pad is shifted from the center of the module-side connection pad in a direction in which each optical element is pressed against the end face of the optical waveguide corresponding to the optical element, the suction force Acts in the direction in which each optical element in the insertion portion is pressed against the end face of the optical waveguide corresponding to the optical element.

  Thereby, each optical element on the said insertion part and the optical waveguide corresponding to the said optical element are aligned correctly.

  The invention according to claim 11 corresponds to each optical element and each optical element in the optical element module by engaging with the first alignment structure in the optical element module when the optical element module is mounted. 11. The photoelectric wiring according to claim 10, wherein a second alignment structure for alignment with the end face of the optical waveguide is formed in the vicinity of the end face of the optical waveguide on the wall surface of the insertion hole. Regarding the substrate.

  The invention according to claim 12 relates to the optoelectric wiring board according to claim 11, wherein the second alignment structure is a recess formed between end faces of two adjacent optical waveguides.

  A thirteenth aspect of the present invention relates to the optoelectric wiring board according to the eleventh aspect, wherein the second alignment structure is a convex portion formed between end faces of two adjacent optical waveguides.

  In these photoelectric wiring boards, the convex portions or concave portions formed on the insertion module side engage with the concave portions or convex portions formed on the photoelectric wiring board, thereby aligning the optical element and the optical waveguide. Is done.

  Accordingly, each optical element and the optical waveguide corresponding to the optical element are mechanically aligned, so that the alignment is performed reliably.

  The invention described in claim 14 relates to the optoelectronic wiring board according to any one of claims 10 to 13, which has a plurality of layers of the optical waveguide.

  According to the optoelectronic wiring board, a complicated photoelectric circuit can be easily configured.

  The invention according to claim 15 is an optoelectronic composite comprising the optical element module according to any one of claims 1 to 9 mounted on the photoelectric circuit board according to any one of claims 10 to 14. It relates to an assembly.

  Since the optoelectronic composite assembly is formed simply by inserting the insertion portion of the optical element module into the insertion hole of the optoelectric wiring board, it is inexpensive and has a good yield.

  As described above, according to the present invention, the optical element module and the optical circuit board in which the optical element and the optical waveguide are automatically positioned by the surface tension of the molten solder when the solder is heated and melted, and the optical element, respectively. An optoelectronic composite assembly in which a module is mounted on the optoelectric wiring board is provided.

1. Embodiment 1
The optical element module, optoelectric wiring board, and optoelectronic composite assembly according to the present invention will be described below.

1-1 Optical Element Module As shown in FIG. 1, the optical element module 10 according to Embodiment 1 includes a substrate 4 and an insertion portion 2 erected on the substrate 4.

  As shown in FIGS. 1 to 4, the insertion section 2 includes a substrate 20, four surface-emitting semiconductor laser (VCSEL) elements 22 formed on the substrate 20, and each surface-emitting semiconductor laser element 22. It has eight fence-like structures 24 formed on both sides, and four connection pads 26 formed on the substrate 20 and electrically connected to the respective surface-emitting type semiconductor laser elements 22. . The fence-like structure 24 is an example of a first alignment structure in the present invention.

  As the substrate 20, a semiconductor material such as silicon, gallium arsenide, or gallium indium arsenide formed into a rectangular or square plate shape can be used.

  When the substrate 20 is made of a semiconductor material, the surface emitting semiconductor laser element 22 can be formed in a predetermined region of the substrate 20 by a normal semiconductor process such as molecular beam epitaxy.

  The fence-like structure 24 can be formed by adhering a strip material formed of a polyimide resin colored black to both sides of each surface emitting semiconductor laser element 22 in the substrate 20. In addition to the fence-like structure 24, the first alignment structure includes a fence-like structure 25 having an isosceles right-angled triangular cross section as shown in FIG. The first alignment structure may be a concave portion 27 or a convex portion 29 formed between two adjacent surface emitting semiconductor laser elements 22 as shown in FIGS.

  The substrate 4 is a drive chip on which a driver circuit for driving the surface emitting semiconductor laser element 22 is formed. As shown in FIGS. 1 to 3, the side of the substrate 4 facing the optoelectric wiring substrate 5 when mounted. A groove 42 for inserting the insertion portion 2 is formed on the surface.

  In the vicinity of the groove 42, four connection pads 44 for electrically connecting the driver circuit of the substrate 4 to the surface emitting semiconductor laser element 22 of the insertion portion 2 are formed.

  On the surface of the substrate 4 on the side where the grooves 42 are formed, ten connection pads 46 for connecting the driver circuit to the electrical wiring of the photoelectric wiring substrate 5 are further formed. Solder balls 48 are placed on the connection pads 46. The connection pad 46 corresponds to the module side connection pad in the present invention.

  As shown in FIGS. 8 and 9, the connection pad 46 has a center in the direction a in which the insertion portion 2 should be pressed in the insertion hole 60 described later with respect to the center of the connection pad 53 of the photoelectric wiring board 5 described later. Are positioned so that they are offset in the opposite direction. In FIG. 8, the broken line indicates the position of the connection pad 53 of the photoelectric wiring board 5.

  The insertion portion 2 may be provided with a photodiode (PD) element 23 in place of the surface emitting semiconductor laser element 22. In this case, as the substrate 4, a receiving chip in which a receiver circuit for receiving an electrical signal obtained by converting an optical signal received by the photodiode element is used instead of the driver circuit. Hereinafter, among the optical element modules 10, those using the insertion portion 2 in which the surface emitting semiconductor laser element 22 is formed are referred to as “VCSEL module 11”, and those using the insertion portion 2 in which the photodiode element 23 is formed. It may be referred to as “PD module 12”.

  In addition, as shown in FIG. 17, the optical element module 10 embeds a surface emitting semiconductor laser element 22 or a photodiode element 23 in the substrate 4 to derive light from the surface emitting semiconductor laser element 22 or light. An optical waveguide 21A for introducing light into the diode element 23 is provided in the insertion portion 2, a reflecting mirror 21B is formed at the end of the optical waveguide 21A, and the surface emitting semiconductor laser element 22 or the photodiode element is passed through the optical waveguide 21A and the reflecting mirror 21B. 23 and the one that transmits and receives light between the core 58 of the sheet-like optical waveguide layer 56 of the photoelectric wiring substrate 5 are also included.

  Hereinafter, a manufacturing procedure of the optical element module 10 will be described.

  First, as shown in FIGS. 2 and 3, the insertion portion 2 is inserted into the groove 42 of the substrate 4. Next, as shown in FIG. 1, the connection pad 26 of the insertion portion 2 and the connection pad 44 of the substrate 4 are connected by a conductive epoxy resin 30. Thereby, the surface emitting semiconductor laser element 22 or the photodiode 23 of the insertion part 2 and the driver circuit or receiver circuit of the board | substrate 4 are electrically connected.

1-2 Photoelectric Wiring Board The photoelectric wiring board 5 on which the optical element module 10 is mounted is a board on which, for example, a large-scale central processing unit (MPU), a primary cache memory, a DRAM, and the like are mounted. As shown in FIG. 10, the electric wiring layer 52 includes two layers and a single optical wiring layer 54 located between the electric wiring layers 52.

  In the electric wiring layer 52, a low-speed side electric wiring for forming a power supply line and transmitting / receiving a low-speed signal, and between the MPU, the primary cache memory, the RAM, the VCSEL module 11 and the PD module 12 are provided. High-speed electrical wiring for transmitting and receiving clock signals and high-speed logic signals is formed.

  Further, as shown in FIGS. 9 and 10, the photoelectric circuit board 5 has two insertion holes 60 for inserting the insertion portions 2 of the optical element module 10, with respect to the surface of the photoelectric circuit board 5. It is drilled in the orthogonal direction.

  The solder balls 48 are reflowed around the insertion holes 60 on the surface of the electrical wiring layer 52 on the front side, that is, the side where the insertion holes 60 are formed, so as to be electrically connected to the connection pads 46 of the optical element module 10. Ten connection pads 53 are provided. The connection pad corresponds to the board-side connection pad in the present invention.

  As shown in FIGS. 8 to 10, the connection pad 53 is positioned with respect to the center of the connection pad 46 of the optical element module 10 so as to be shifted in the direction a in which the insertion portion 2 should be pressed in the insertion hole 60. Yes.

  A sheet-like optical waveguide layer 56 is embedded in the optical wiring layer 54. As shown in FIGS. 11 to 14 and 16, the sheet-like optical waveguide layer 56 includes four rows of cores 58 that function as optical waveguides, and a clad 57 that surrounds the cores 58. The core 58 and the clad 57 are made of materials that are optically transparent but have different refractive indexes. An example of such a material is polysilane. The core 58 can be formed by pattern exposure of polysilane with ultraviolet rays to lower the refractive index.

  As shown in FIGS. 12 and 13, the end surfaces of the four cores 58 are exposed on the end surface on the light incident or exiting side of the sheet-like optical waveguide layer 56. And the convex part 59 is formed between the two adjacent cores 58 in the said end surface. The convex portion 59 is an example of the second alignment structure in the present invention. As shown in FIGS. 11 to 15, the fence-like structure 24, the fence-like structure 25, or the concave portion in the VCSEL module 11 and the PD module 12. 27, the surface emitting semiconductor laser element 22 and the optical diode 23 are aligned with the end face of the core 58.

  In the sheet-like optical waveguide layer 56, a recess 59A may be formed as shown in FIG. The concave portion 59 </ b> A engages with the convex portion 29 formed in the insertion portion 2 to align the surface emitting semiconductor laser element 22 and the optical diode 23 with the end surface of the core 58.

  As shown in FIG. 9 and FIG. 10, the fence-like structure 24, the fence-like structure 25, the concave portion 27, or the convex portion 29 is formed on the wall surface of the insertion hole 60 facing the sheet-like optical waveguide layer 56. In order to be able to insert the inserted portion 2, it is formed in a wave shape that is recessed or protruded according to the position of the fence-like structure 24 or the like.

1-3 Mounting Procedure Hereinafter, a procedure for configuring the optoelectronic composite assembly 100 by mounting the VCSEL module 11 and the PD module 12 on the photoelectric circuit board 5 will be described.

  First, the insertion portion 2 of the VCSEL module 11 is inserted into one of the insertion holes 60 of the optoelectric wiring board 5, and the insertion portion of the PD module 12 is inserted into the other. When the VCSEL module 11 and the PD module 12 are fully inserted into the insertion hole 60, the height direction positions of the surface emitting semiconductor laser element 22 and the photodiode element 23 are regulated by the insertion hole 60. The position in the left-right direction is regulated by the fence-like structure 24, the fence-like structure 25, or the concave portion 27 engaging with the convex portion 59, or the convex portion 29 engaging with the concave portion 59 </ b> A. As a result, the end face of the core 58 is aligned with the surface emitting semiconductor laser element 22 and the photodiode element 23.

  When the VCSEL module 11 and the PD module 12 are inserted, the respective VCSEL module 11 and the PD module 12 are heated to melt the solder balls 48. As a result, the insertion portion of the VCSEL module 11 and the PD module 12 between the connection pad 46 of the VCSEL module 11 and the PD module 12 and the connection pad 53 of the photoelectric circuit board 5 as shown by an arrow a in FIG. Surface tension is generated in a direction in which the surface emitting semiconductor laser element 22 and the photodiode element 23 provided in 2 are pressed against the end face of the core 58 in the photoelectric wiring substrate 5. Then, when the solder is hardened, the substrate 4 of the VCSEL module 11 and the PD module 12 and the electrical wiring of the photoelectric wiring substrate 5 are electrically connected. As a result, the VCSEL module 11 and the PD module 12 are fixed to the photoelectric wiring board 5, and the driver circuit in the VCSEL module 11 and the receiver circuit in the PD module 12 are electrically connected to the high-speed side electric wiring in the photoelectric wiring board 5. Connected.

1-4 Features In the optoelectronic composite assembly 100, the fence-like structure 24, the fence-like structure 25, the concave portion 27, or the convex portion 29 in the insertion portion 2 of the VCSEL module 11 and the PD module 12 is provided in the photoelectric wiring substrate 5. The protrusion 59 or the recess 59A formed in the sheet-like optical waveguide layer 56 is engaged. At the same time, the force in the direction in which the surface emitting semiconductor laser element 22 and the photodiode element 23 are pressed against the end face of the core 58 in the photoelectric circuit board 5 by the surface tension of the molten solder ball 48 causes the driver circuit in the VCSEL module 11. And acts between the PD module 12 and the optoelectric wiring board 5.

  As a result, the individual surface emitting semiconductor laser elements 22 and the photodiode elements 23 are reliably positioned and fixed with the end surfaces of the opposing cores 58. Therefore, the laser light can be directly incident on the core 58 from the surface emitting semiconductor laser element 22 in the VCSEL module 11, and the laser light transmitted through the core 58 can be directly received by the photodiode element 23 in the PD module 12. Therefore, since it is not necessary to provide a mirror or a lens for converting the optical path in any of the VCSEL module 11, the PD module 12, and the photoelectric wiring substrate 5, the optoelectronic composite assembly 100 can be configured at low cost.

  Further, since the fence-like structure 24 or the fence-like structure 25 is formed of black polyimide resin, the mechanical stress generated when engaging with the convex portion 59 is the fence-like structure 24 or the fence-like structure 25. In addition to being able to absorb without difficulty, signal light is prevented from leaking between adjacent surface emitting semiconductor laser elements 22 and photodiodes 23.

  The optoelectronic wiring board 5 used in the optoelectronic composite assembly 100 is not limited to the one shown in FIGS. 8 to 10, and is a two-dimensional optical waveguide type in which the cores 58 are formed in a grid pattern. An opto-electric wiring board or an opto-electric wiring board having two or more optical wiring layers 54 is also used.

  The present invention can be used for various electronic devices as long as the device has an optical circuit and an electric circuit. Such electronic devices include electrophotographic copying machines, electrophotographic printers, servers, and various computers.

FIG. 1 is a perspective view showing a configuration of an optical element module according to Embodiment 1. FIG. FIG. 2 is a perspective view illustrating the optical element module according to Embodiment 1 where an insertion portion is mounted on a substrate. FIG. 3 is a perspective view showing the optical element module according to Embodiment 1 where the insertion portion is mounted on the substrate. FIG. 4 is an end view showing a positional relationship between the surface emitting semiconductor laser element and the fence-like structure in the insertion portion. FIG. 5 is an end view showing another example of a fence-like structure in the optical element module of Embodiment 1. FIG. 6 is an end view showing an example in which a recessed portion is provided between the optical elements in place of the fence-like structure in the insertion part of the optical element module according to the first embodiment. FIG. 7 is an end view showing an example in which a protrusion is provided between the optical elements in place of the recessed portion in the insertion part of the optical element module according to the first embodiment. FIG. 8 is a schematic diagram showing the relative positional relationship between the connection pads of the optical element module of Embodiment 1 and the connection pads of the optoelectric wiring board of Embodiment 1. FIG. 9 is a schematic cross-sectional view showing a state where the insertion portion of the optical element module of Embodiment 1 is inserted into the insertion hole of the photoelectric wiring board of Embodiment 1 and the solder balls are melted. FIG. 10 is a perspective view showing the configuration of the opto-electric wiring board according to Embodiment 1, and the optical element module shown in FIG. 1 mounted on the opto-electric wiring board. FIG. 11 is a plan view of a sheet-like optical waveguide layer provided in the optoelectric wiring board according to the first embodiment. FIG. 12 is an end view of the sheet-like optical waveguide layer shown in FIG. FIG. 13 is a partial perspective view of the sheet-like optical waveguide layer shown in FIG. FIG. 14 is a plan view showing the engagement relationship between the second alignment structure formed on the end face of the sheet-like optical waveguide layer shown in FIG. 11 and the fence-like structure provided in the insertion portion of the optical element module. is there. 15 shows another example of the fence-like structure provided in the insertion portion of the optical element module, and the fence-like structure and the second alignment structure provided in the sheet-like optical waveguide shown in FIG. It is a top view which shows engagement relationship. FIG. 16 is a plan view showing another example of the first alignment structure provided in the optical element module, the second alignment structure provided in the optoelectric wiring board, and their engagement relationship. 17 is a schematic cross-sectional view showing another example of the optical element module of the present invention and the relative positional relationship between the insertion portion of the optical element module and the sheet-like optical waveguide layer of the photoelectric wiring board shown in FIG. It is.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 Insertion part 4 Board | substrate 5 Photoelectric wiring board 10 Optical element module 11 VCSEL module 12 PD module 20 Board | substrate 22 Surface emitting semiconductor laser element 23 Photodiode element 24 Fence-like structure 25 Fence-like structure 26 Connection pad 27 Recess 29 Convex Part 30 Conductive epoxy resin 42 Groove 44 Connection pad 46 Connection pad 48 Solder ball 52 Electrical wiring layer 54 Optical wiring layer 56 Sheet-like optical waveguide layer 57 Cladding 58 Core 59 Convex part 59A Concave part 60 Insertion hole 100 Optoelectronic composite assembly

Claims (15)

An optical element module mounted on an optoelectric wiring board on which an optical waveguide is formed,
At the time of mounting, the function of emitting light to the optical waveguide and the light transmitted through the optical waveguide are inserted into the insertion hole formed in the photoelectric wiring board so as to intersect the optical waveguide. An insertion portion provided with an optical element having at least one of functions of receiving light;
A board on which the insertion portion protrudes;
The substrate is provided with a module-side connection pad that is electrically connected by heating and melting the substrate-side connection pad provided on the surface of the opto-electric wiring board and solder,
The module side connection pad is provided such that the center is shifted in a direction opposite to the direction in which each optical element is pressed against the end face of the optical waveguide corresponding to the optical element with respect to the center of the board side connection pad. An optical element module characterized by comprising:   In the vicinity of the optical element of the insertion portion, each optical element and an end face of the optical waveguide corresponding to the optical element are engaged by engaging with a second alignment structure provided on the photoelectric wiring board. The optical element module according to claim 1, wherein a first alignment structure for alignment is formed.   The optical element module according to claim 2, wherein the first alignment structure is a convex portion provided between two adjacent optical elements.   The optical element module according to claim 2, wherein the first alignment structure is a pair of fence-like structures provided along an insertion direction of the insertion portion so as to sandwich the optical element.   The optical element module according to claim 4, wherein the fence-like structure optically insulates two adjacent optical paths.   The optical element module according to claim 2, wherein the first alignment structure is a recess provided between two adjacent optical elements.   The optical element module according to claim 1, wherein the optical element is selected from a photodiode and a surface emitting semiconductor laser element.   The optical element module according to claim 1, wherein the input chip is mounted in a groove provided in the substrate.   The substrate is a driving chip on which a driver circuit for driving the optical element is formed, or a receiving chip on which a receiver circuit for receiving an electric signal obtained by converting light received by the optical element is formed. The optical element module according to any one of the above. An optical wiring board on which the optical element module according to any one of claims 1 to 9 is mounted while having an optical waveguide,
With an insertion hole into which the insertion part of the optical element module is inserted,
Board-side connection pads that are electrically connected by heating and melting the module-side connection pads and solder provided on the substrate of the optical element module are provided on the surface,
The board-side connection pad is provided such that the center thereof is shifted with respect to the center of the module-side connection pad in a direction in which each optical element is pressed against the end face of the optical waveguide corresponding to the optical element. A characteristic optoelectric wiring board.   By engaging the first alignment structure in the optical element module when the optical element module is mounted, the alignment of each optical element in the optical element module and the end face of the optical waveguide corresponding to each optical element is achieved. The optoelectric wiring board according to claim 10, wherein the second alignment structure to be performed is formed in the vicinity of the end face of the optical waveguide on the wall surface of the insertion hole.   The optoelectric wiring board according to claim 11, wherein the second alignment structure is a recess formed between end faces of two adjacent optical waveguides.   The optoelectric wiring board according to claim 11, wherein the second alignment structure is a convex portion formed between end faces of two adjacent optical waveguides.   The optoelectric wiring board according to claim 10, comprising a plurality of the optical waveguides.   The optoelectronic composite assembly which mounts the optical element module of any one of Claims 1-9 on the optoelectric wiring board of any one of Claims 10-14.

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