JP2007131661A - Adhesive composition and adhesive sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive composition and an adhesive sheet uniformly peelable without generating staining on an adherend with residual adhesive, etc., or forming partial adhesion on the whole adherend surface. <P>SOLUTION: An adhesive layer composed of an adhesive composition containing thermally expansible small spheres and an adhesive is applied to a substrate film or sheet to obtain an adhesive sheet. The difference of height between the highest point H1 and the lowest point H3 of the adhesive layer after the expansion of the thermally expansible small spheres is ≤100 μm, and the sheet satisfies the formula S<SB>H1-H2</SB>/S<SB>0</SB>=0.4 to 10 wherein S<SB>0</SB>is a specified surface area and the S<SB>H1-H2</SB>is the surface area from the highest point H1 on the irregular adhesive surface to H2 (a specified height defined by H1-20 μm). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive sheet that use a pressure-sensitive adhesive composition containing thermally expandable microspheres in a pressure-sensitive adhesive layer, and whose adhesiveness decreases or disappears when heated to a predetermined temperature or more. The present invention relates to a pressure-sensitive adhesive composition that can be uniformly peeled when heated without causing contamination due to adhesive residue or the like on the adherend and partial adhesion on the entire adherend surface, and a pressure-sensitive adhesive sheet using the same.

  A releasable adhesive sheet that can be attached to an adherend with an appropriate adhesive force and can be easily peeled off after it has been used and is no longer needed, such as an envelope or a case for storing precision machines. Seal parts, wallpaper, labels, mounting of car bumpers, electric wires, etc., backing sheet in flexible printed circuit board (FPC) manufacturing process, mask material in plating process, semiconductor wafer cutting process, and monolithic ceramic capacitor pieces It is widely used in the electrical and electronic industry as a temporary fixing sheet in the chemical processing step. As such a releasable sheet, a pressure-sensitive adhesive sheet (for example, see Patent Documents 1 to 4) provided with a pressure-sensitive adhesive layer containing thermally expandable microspheres has been proposed and used.

  When the pressure-sensitive adhesive sheet disclosed in Patent Documents 1 to 4 is heated, the contact area with the adherend is reduced by generating irregularities at the interface between the adherend and the pressure-sensitive adhesive layer. It will be lowered. Therefore, the adherend can be easily separated as compared with other types of pressure-sensitive adhesive sheets. Moreover, an initial peeling force can be made high also in a releasable adhesive sheet. Therefore, when processing an adherend, it is used in various processes such as a process in which a strong force is applied, for example, a process for slicing a multilayer ceramic capacitor, a process of immersing in a processing solution, etc. .

However, the unevenness height and density of the pressure-sensitive adhesive surface layer when peeling the adherend by heating to generate unevenness at the interface between the adherend and the pressure-sensitive adhesive layer and reducing the contact area with the adherend. It is difficult to control the contact uniformly, and there is a case where the contact area is insufficiently reduced in a part where there are few convex parts and there are many concave parts or where the height of the convex part is uneven, and partial adhesion may be caused. As a result, there is a problem that uniform peeling on the entire adherend surface is prevented, and contamination due to adhesive residue is caused, resulting in a decrease in work efficiency and processing accuracy. This problem is particularly seen when the initial peel force is set high or when the adherend is miniaturized.
JP-A-11-302614 JP 2000-351947 A JP 2002-69422 A JP 2003-160765 A

  The present invention has been made in view of such problems of the prior art, and the problem is that the adhesion to the adherend is excellent, and after completion of processing, the adherend is applied. An object of the present invention is to provide a pressure-sensitive adhesive composition that can be uniformly peeled without causing contamination due to adhesive residue or the like and partial adhesion on the entire adherend surface, and a pressure-sensitive adhesive sheet using the same.

  As a result of intensive studies to solve the above problems, the inventors of the present invention have provided a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer comprising a pressure-sensitive adhesive composition containing thermally expandable microspheres and a pressure-sensitive adhesive is provided on a substrate. Ratio of the area of the pressure-sensitive adhesive layer before expanding the heat-expandable microspheres and the area of the specific area of the pressure-sensitive adhesive layer after expanding the heat-expandable microspheres, and after expanding the heat-expandable microspheres By adjusting the level difference of the unevenness on the surface of the adhesive layer to a specific range, when peeling from the adherend, the adherend may be contaminated by adhesive residue or partially adhere to the entire adherend surface. The present invention has been completed by finding that it can be uniformly peeled off.

  That is, this invention provides the following adhesive compositions and an adhesive sheet using the same.

[1] The physical property of the pressure-sensitive adhesive layer measured by the following physical property measurement test is expressed by the following formula (1)
H1-H3 ≦ 100 μm (1)
And equation (2)
S _H1-H2 / S ₀ = 0.4 to 10 (2)
A pressure-sensitive adhesive composition comprising thermally expandable microspheres and a pressure-sensitive adhesive characterized by satisfying
[Physical property measurement test]
A pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive and thermally expandable microspheres on one side of a transparent polyethylene terephthalate film having a thickness of 100 μm was prepared, and the surface area of the pressure-sensitive adhesive layer (S ₀ ) is measured.
Subsequently, the pressure-sensitive adhesive sheet is heated at a temperature of +20 to 60 ° C. of the expansion temperature of the heat-expandable microspheres contained in the pressure-sensitive adhesive layer, and the highest point of unevenness on the surface of the pressure-sensitive adhesive layer formed on the S ₀ , H2 at a position 20 μm lower than the highest point, and H3 at the lowest point, and the surface area (S _H1-H2 ) in the range from H1 to H2 was determined.

[2] The pressure-sensitive adhesive composition according to the above [1], comprising thermally expandable microspheres having an average particle size of 5 to 50 μm and a standard deviation of particle size distribution by laser diffraction scattering method of 5.0 μm or less.

[3] The pressure-sensitive adhesive composition according to the above [1] or [2], comprising 10 to 75 parts by mass of the thermally expandable microspheres with respect to 100 parts by mass of the pressure-sensitive adhesive.

[4] The pressure-sensitive adhesive composition according to any one of [1] to [3], wherein the pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive having in its molecular structure an active group capable of reacting with a crosslinking agent.

[5] The pressure-sensitive adhesive composition according to any one of [1] to [4], wherein at least one surface is a contact surface with an adherend.

[6] A pressure-sensitive adhesive sheet, wherein a pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition according to any one of [1] to [5] is formed on a substrate.

  The pressure-sensitive adhesive layer formed from the pressure-sensitive adhesive composition of the present invention or the pressure-sensitive adhesive sheet provided with the same on the substrate has excellent adhesion to the adherend, and when heated to a predetermined temperature or higher, the pressure-sensitive adhesive The surface state of the layer expands uniformly due to the thermally expandable microspheres contained in the layer, and the adhesiveness decreases or disappears. Thereby, after attaching the adherend, when it becomes unnecessary, such as completion of processing, it can be peeled uniformly without causing contamination due to adhesive residue etc. or partial adhesion on the entire adherend surface, Workability, productivity, etc. are improved.

  BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described below, but the present invention is not limited to the following embodiment, and is based on the ordinary knowledge of those skilled in the art without departing from the gist of the present invention. It should be understood that modifications and improvements as appropriate to the following embodiments also fall within the scope of the present invention.

One embodiment of the pressure-sensitive adhesive of the present invention is as follows.
[1] Adhesive composition The adhesive composition of the present invention contains at least thermally expandable microspheres and an adhesive, and the physical properties of the adhesive layer using the adhesive composition are measured as follows. It is measured by a test and satisfies the following formulas (1) and (2).
H1-H3 ≦ 100 μm (1)
And S _H1-H2 / S ₀ = 0.4 to 10 (2)

[Physical property measurement test]
A pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive and thermally expandable microspheres was prepared on one side of a transparent polyethylene terephthalate film having a thickness of 100 μm, and the surface area of the pressure-sensitive adhesive layer (S ₀ ).
Subsequently, the pressure-sensitive adhesive sheet is heated at a temperature of +20 to 60 ° C. of the expansion temperature of the heat-expandable microspheres contained in the pressure-sensitive adhesive layer, and the highest point of unevenness on the surface of the pressure-sensitive adhesive layer formed on the S ₀ , H2 at a position 20 μm below the highest point, and H3 at the lowest point, and the surface area (S _H1-H2 ) in the range from H1 to H2 was determined.

Here, any method may be used for measuring each physical property, but for example, it can be measured using a three-dimensional shape measuring microscope. A specific measuring method using a three-dimensional shape measuring microscope is as follows.
Height difference of the pressure-sensitive adhesive surface irregularities, measures the height H1-H3 of the between the highest point H1 and the lowest point H3 of the formed in the observation area S ₀ adhesive surface irregularities. Then dense degree of the adhesive surface irregularities, the surface area S _H1-H2 in the range of H2 of 20μm lower position from the highest point H1 of formed in the observation area S ₀ adhesive surface irregularities measure, S _H1-H2 Is divided by S ₀ to obtain the density of the unevenness.

  In the physical property measurement test, the reason why H2 is 20 μm lower than the highest point H1 is that when a position lower than 20 μm is selected, the surface area increases remarkably regardless of the pressure-sensitive adhesive composition, and the above formula ( This is because it is difficult to make a difference in the numerical value of 2), and on the other hand, in the case of a position higher than 20 μm, it becomes easy to be influenced by thermally expandable microspheres having a large particle size, and thus the reliability of the parameters is lowered. When the position 20 μm lower than H1 is lower than H3, H3 is set to H2.

When the value of the formula (1) exceeds 100 μm, the adherend is displaced from the adhesive layer when it is peeled from the adherend after precision processing, for example, punching after forming a printed circuit with a fine pattern or dicing processing of MLCC. It is not preferable because the adherend may be scratched or damaged during the transport process. From the viewpoint of uniform peelability and productivity, the value of the formula (1) is preferably 80 μm or less, particularly preferably 60 μm or less.
When the value of the formula (2) is less than 0.4, the projections are sparse or a large number of recesses are present, and a sufficient reduction in contact area cannot be obtained, resulting in non-uniform peelability. On the other hand, when the value exceeds 10, the pressure-sensitive adhesive tends to cohesively break, and as a result, adhesive residue is generated on the adherend, which is not preferable. From the viewpoint of uniform peelability and prevention of adhesive residue, the value of the formula (2) is preferably 0.5 to 5.0, more preferably 0.5 to 3.0.

  The pressure-sensitive adhesive composition of the present invention contains components such as (a) thermally expandable microspheres, (b) pressure-sensitive adhesive, (c) cross-linking agent used as required, and (d) tackifying resin. By adjusting the kind and / or content ratio of the components as appropriate, it is prepared so as to satisfy the above formulas (1) and (2) at the same time.

  (A) As a thermally expansible microsphere, the microsphere which encapsulated the substance which expands easily by gasification by heating in the shell which has elasticity can be mentioned as a suitable example. Examples of the substance that easily gasifies and expands by heating include isobutane, propane, and pentane. A preferable example of the shell is a shell formed of a hot-melt material or a material that is destroyed by thermal expansion. Examples of the substance forming the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone. Examples of commercially available products of thermally expandable microspheres include “Microsphere” (trade name, manufactured by Matsumoto Yushi Seiyaku Co., Ltd.).

  The heat-expandable microspheres may be appropriately selected in consideration of the use temperature of the pressure-sensitive adhesive sheet and having a suitable gasification temperature (thermal expansion temperature). Specifically, it is preferable to use one whose thermal expansion temperature is 25 ° C. or higher than the processing temperature at the time of cutting, fragmenting and the like of the adherend adhered to the adhesive sheet. The “thermal expansion temperature” in the present specification refers to the thermal expansion start temperature in TMA measurement. Further, the volume expansion coefficient of the thermally expandable microsphere is preferably 5 times or more, more preferably 7 times or more, and particularly preferably 10 times or more. When the volume expansion coefficient of the thermally expandable microsphere is equal to or higher than the above value, the adhesive force of the adhesive layer can be efficiently reduced by heat treatment. In addition, it is preferable that the shell of the thermally expandable microsphere has an appropriate strength that does not rupture even when the shell expands to the volume expansion coefficient. What is necessary is just to select the magnitude | size of a thermally expansible microsphere suitably by the use of an adhesive sheet. Specifically, the mass average particle size is preferably 5 to 50 μm.

  Moreover, it is preferable to use the heat-expandable microsphere after adjusting its particle size distribution. The particle size distribution may be adjusted by classifying and removing particles having a relatively large particle size contained in the heat-expandable microspheres to be used with a centrifugal air classifier, dry classifier, sieving machine, or the like. By removing large particle size particles compared to the average particle size and sharpening the particle size distribution, improve the smoothness of the surface of the pressure-sensitive adhesive layer to be formed and make the surface shape uniform when heated Can do. Specifically, the standard deviation of the particle size distribution of the heat-expandable microspheres is desirably 5.0 μm or less, preferably 4.5 μm or less, and more preferably 4.0 μm or less. When the standard deviation is larger than 5.0 μm, the difference in height of the pressure-sensitive adhesive surface layer after heat expansion becomes large, and accordingly, a surface shape with uneven unevenness density is formed. As a result, the values of the formulas (1) and (2) cannot be satisfied at the same time, and as a result, uniform peeling cannot be obtained.

  Moreover, it becomes easy to adjust the thickness of the adhesive layer formed by classifying a thermally expansible microsphere. For example, when the thickness of the pressure-sensitive adhesive layer is set to about 20 μm, in addition to using thermally expandable microspheres having a mass average particle size of about 8 μm, those having a mass average particle size of about 15 μm, For example, thermally expandable microspheres obtained by classifying and removing particles having a particle diameter of 20 μm or more can be used. Thus, according to the method of classifying thermally expandable microspheres, the thermally expandable microspheres used so far can be used as they are. Therefore, it is not necessary to newly grasp expansion characteristics, behavior, etc., and development time can be shortened and development efficiency can be improved.

What is necessary is just to select suitably the mixture ratio of a thermally expansible microsphere so that the unevenness | corrugation of the adhesive layer surface after heating can fully be formed, Usually, 10-75 mass parts with respect to 100 mass parts of (b) adhesives. Range.
When the blending ratio of the heat-expandable microspheres is less than 10 parts by mass, the convex portions of the pressure-sensitive adhesive surface layer after the heat treatment tend to be less likely to be peeled off. Since unevenness is formed on the surface of the pressure-sensitive adhesive layer before the spheres are expanded, it is not preferable because the adhesion with the adherend before the heat treatment tends to decrease. A preferable blending ratio is 15 to 65 parts by mass, more preferably 18 to 60 parts by mass in terms of adhesion to the adherend before expanding the thermally expandable microspheres and releasability from the adherend after expansion. is there.
Moreover, it is preferable that the mixture ratio of a thermally expansible microsphere shall be 25 mass parts or more with respect to 100 mass parts of adhesives from the surface of the surface unevenness density after thermal expansion of Formula (2).

  These thermally expandable microspheres may be used alone or in combination of two or more. As combinations of two or more, (1) combinations with different gases (encapsulated substances), (2) combinations with different mass average particle sizes, (3) combinations with different materials constituting the shell, (4) Combinations having different thicknesses and combinations (5) (1) to (4) can be mentioned. Here, it is preferable to combine two or more kinds of thermally expandable microspheres because it is possible to suppress the wrinkling of the pressure-sensitive adhesive layer. Specifically, the first thermally expandable microsphere and the second thermally expandable microsphere having a mass average particle size larger than that of the first thermally expandable microsphere may be used in combination. Further preferred.

  Generally, the time required for peeling off the adhesive sheet is determined by the type of thermally expandable microspheres to be blended. For example, when the thermally expandable microspheres reach the peak of expansion at 120 ° C. for 30 minutes, the heating condition for peeling is usually 120 ° C. for 30 minutes. However, the heating time may exceed 30 minutes depending on the work process and schedule. When the heating time exceeds 30 minutes, the expanded adhesive layer is deflated. For example, when heated at 120 ° C. for 30 minutes, the expansion ratio of the pressure-sensitive adhesive layer is about 3 times, whereas when heated at 120 ° C. for 90 minutes, the expansion ratio of the pressure-sensitive adhesive layer is about 1.5 times. . The wrinkle of the pressure-sensitive adhesive layer causes re-adhesion between the adherend and the pressure-sensitive adhesive layer, and the adherend may not be easily peeled from the pressure-sensitive adhesive sheet.

  (B) The pressure-sensitive adhesive may be appropriately selected from the pressure-sensitive adhesives conventionally used when forming a pressure-sensitive adhesive layer containing heat-expandable microspheres. It is preferable to use an acrylic pressure-sensitive adhesive in view of the uneven shape formed on the surface of the pressure-sensitive adhesive layer, the initial pressure-sensitive adhesive force, and the removability. Even when an acrylic pressure-sensitive adhesive is used, there is no particular limitation as long as the physical properties of the above formulas (1) and (2) can be adjusted at the same time. However, it is preferable to use an acrylic pressure-sensitive adhesive having an acid value of 30 or more. By setting the acid value of the acrylic pressure-sensitive adhesive to 30 or more, a sufficient crosslinking density can be obtained when crosslinking is performed using a crosslinking agent. Moreover, since the unreacted functional group which did not react with a crosslinking agent becomes easy to react with a base material, since the adhesiveness of a base material and an adhesive layer improves, it is preferable. Note that the unreacted functional group easily reacts with the adherend. Accordingly, the adhesion with the adherend is sufficiently exhibited even under high temperature conditions, and the adhesion between the base material and the pressure-sensitive adhesive layer is improved after the expansion of the thermally expandable microspheres.

  From the viewpoint of improving the adhesion to the substrate or adherend, the acid value of the acrylic pressure-sensitive adhesive is more preferably 40 to 50. As used herein, “acid value” refers to the amount (mg) of potassium hydroxide required to neutralize free fatty acids and resin acids contained in 1 g of a sample (acrylic adhesive). It is measured according to K 0070 and can be calculated by the neutralization titration method from the following formula (3).

Acid value A = B × F × 5.661 / S (3)
[B: amount of 0.1 ml / l potassium hydroxide ethanol solution used for measurement, F: factor of 0.1 mol / l potassium hydroxide ethanol solution, S: mass of sample (g), 5.611 : Formula weight of potassium hydroxide (56.11 × 1/10)]

  The weight average molecular weight of the acrylic pressure-sensitive adhesive is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000, and particularly preferably 200,000 to 1,000,000. When the weight average molecular weight of the acrylic pressure-sensitive adhesive is within the above range, it has sufficient peeling force to perform high-precision processing, and there is no adhesion of the pressure-sensitive adhesive layer to the adherend, and peeling after processing The property is also good.

  The acrylic pressure-sensitive adhesive is preferably one that can react with the crosslinking agent. The acrylic pressure-sensitive adhesive includes a copolymer of an acrylic acid alkyl ester and / or a methacrylic acid alkyl ester and a monomer having a functional group capable of reacting with a crosslinking agent. Examples of the "alkyl ester" of acrylic acid alkyl ester and methacrylic acid alkyl ester include, for example, methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester. Hexyl ester, heptyl ester, octyl ester, isooctyl ester, 2-ethylhexyl ester, isodecyl ester, dodecyl ester, tridecyl ester, pentadecyl ester, octadecyl ester, nonadecyl ester, eicosyl ester, etc. . Examples of the functional group capable of reacting with the crosslinking agent include a carboxyl group and a hydroxyl group.

  Examples of the monomer whose functional group capable of reacting with the crosslinking agent is a carboxyl group include acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. . Moreover, as a monomer whose functional group is a hydroxyl group, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl acrylate, hydroxybutyl methacrylate, hydroxyhexyl acrylate, Examples include hydroxyhexyl methacrylate, hydroxyoctyl acrylate, hydroxyoctyl methacrylate, hydroxydecyl acrylate, hydroxydecyl methacrylate, hydroxylauryl acrylate, and hydroxylauryl methacrylate.

  Monomers having a functional group capable of reacting with a crosslinking agent can be used alone or in combination of two or more. The ratio between the (meth) acrylic acid alkyl ester and the monomer having a functional group capable of reacting with the crosslinking agent is preferably in the range of 92: 8 to 98: 2 in terms of mass ratio. If the blending ratio of the monomer having a functional group capable of reacting with the crosslinking agent is less than this range, the peelability between the adherend and the adhesive layer is impaired when the thermally expandable microspheres expand. There is a tendency. On the other hand, when there are many compounding ratios of the monomer which has a functional group which can react with a crosslinking agent than this range, it exists in the tendency for the adhesive force of a to-be-adhered body and an adhesive layer to become scarce. From the viewpoint of improving the adhesion and peelability between the adherend and the pressure-sensitive adhesive layer, the ratio between the (meth) acrylic acid alkyl ester and the monomer having a functional group capable of reacting with the crosslinking agent is More preferably, the ratio is 95: 5 to 93: 7.

  If desired, other monomers other than the (meth) acrylic acid alkyl ester and the monomer having a functional group capable of reacting with the crosslinking agent may be used in combination. Examples of other monomers include styrene, vinyl acetate, acrylonitrile, acrylamide, polyethylene glycol acrylate, N-vinyl pyrrolidone, and tetrafurfuryl acrylate.

  The acrylic pressure-sensitive adhesive can be obtained by radical copolymerization of monomer components. The copolymerization method in this case is conventionally known, and examples thereof include an emulsion polymerization method, a solution polymerization method, a bulk polymerization method, a suspension polymerization method, and a photopolymerization method. Moreover, it is preferable that the glass transition temperature of an acrylic adhesive is -50--20 degreeC. When the glass transition temperature is higher than -20 ° C, the adhesive force between the adherend and the pressure-sensitive adhesive layer tends to decrease. On the other hand, when the glass transition temperature is less than −50 ° C., adhesive residue tends to be generated at the time of peeling after the heat treatment, and the peelability tends to be difficult. From the viewpoint of improving the adhesion and peelability between the adherend and the pressure-sensitive adhesive layer, the glass transition temperature of the acrylic pressure-sensitive adhesive is more preferably −40 ° C. to −25 ° C.

  In the formed pressure-sensitive adhesive layer, the acrylic pressure-sensitive adhesive may be cross-linked with (c) a cross-linking agent used as desired. (C) A crosslinking agent should just be selected suitably according to the acrylic adhesive to be used, and there is no restriction | limiting in particular. Specific examples of the crosslinking agent include an isocyanate crosslinking agent, a metal chelate crosslinking agent, and an epoxy crosslinking agent. Among these, from the viewpoint of improving the peelability from the adherend after heating to a temperature at which the thermally expandable microspheres expand, and preventing the adhesive residue on the adherend, an epoxy crosslinking agent is used. It is preferable to use it. Examples of the epoxy crosslinking agent include bisphenol epoxy resins (for example, bisphenol A type, bisphenol F type, bisphenol AD type), phenol novolac type epoxy resins, ethylene glycol diglycidyl ether, 1,6-hexanediol glycidyl ether, Trimethylolpropane triglycidyl ether, diglycidyl aniline, diglycidyl amine, N, N, N ′, N′-tetraglycidyl-m-xylenediamine, 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane Etc.

  In terms of adhesiveness to the adherend at normal temperature and releasability from the adherend after expansion of the thermally expandable microspheres, a polyfunctional epoxy crosslinking agent is preferable, and a tetrafunctional epoxy crosslinking agent is further provided. preferable. Specific examples include N, N, N ′, N′-tetraglycidyl-m-xylenediamine and 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane. However, these epoxy-based crosslinking agents tend to slow the crosslinking reaction rate. For this reason, when the crosslinking reaction is insufficient, the cohesive force of the pressure-sensitive adhesive layer becomes low, and the adhesive surface is not glued. In some cases, the rest or the like is likely to occur. Accordingly, in order to accelerate the crosslinking reaction, (1) a catalyst such as amine is added, (2) a monomer having an amine functional group is used as a constituent of the pressure-sensitive adhesive, and (3) an aziridine type is used as the crosslinking agent. It is desirable to use a crosslinking agent in combination. In particular, it is preferable to add a tertiary amine having a catalytic effect to a crosslinking agent such as N, N, N ′, N′-tetraglycidyl-m-xylenediamine.

A crosslinking agent may be used independently or may be used in combination of 2 or more type. The blending ratio of the cross-linking agent may be appropriately selected so that the pressure-sensitive adhesive layer has a preferable elastic modulus together with the above-described thermally expandable microspheres, the acrylic pressure-sensitive adhesive, and a tackifier resin described later, if desired. There is no particular limitation. However, the ratio of the cross-linking agent contained in the pressure-sensitive adhesive composition is preferably 0.5 equivalent or less with respect to the acrylic pressure-sensitive adhesive because adhesion to the substrate is improved. When the ratio of the cross-linking agent exceeds 0.5 equivalent in terms of the acrylic pressure-sensitive adhesive, the adhesive strength with the adherend tends to decrease, and the thermally expandable microsphere is heated and expanded before the adherend and This is not preferable because the adhesive layer tends to peel off. From the viewpoint of adhesion to the substrate and the adherend, the proportion of the crosslinking agent contained in the pressure-sensitive adhesive composition is 1 × 10 ^{−3 to} 0.3 equivalent in terms of the acrylic pressure-sensitive adhesive. Further preferred.

When the elastic modulus at 20 ° C. of the pressure-sensitive adhesive layer is in the range of 1.0 × 10 ⁴ Pa or more and less than 1.0 × 10 ⁶ Pa, the initial peeling force tends to decrease, so that the adhesive layer is in close contact with the adherend. May decrease. For this reason, the case where the processing accuracy of a to-be-adhered body and a process yield fall is also assumed. Therefore, it is preferable that the pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer contains (d) a tackifying resin because it is easy to adjust the adhesion to the adherend near normal temperature. As the tackifier resin, those having a softening point of 120 ° C. or higher are preferable. Specific examples of the tackifying resin include α-pinene-based, β-pinene-based, dipentene-based, terpene-phenol-based terpene-based resins; gum-based, wood-based, tall oil-based natural rosins; Examples thereof include rosin resins such as rosin derivatives obtained by subjecting rosin to hydrogenation, disproportionation, polymerization, maleation, esterification, etc .; petroleum resins; coumarone-indene resins.

Among these, those having a softening point in the range of 120 to 160 ° C are more preferable, and those having a softening point in the range of 150 to 160 ° C are particularly preferable. When a tackifying resin having a softening point within the above range is used, not only is there little contamination and adhesive residue on the adherend, but it is possible to further improve the adhesion to the adherend in the work environment. Become. Moreover, it is easy to adjust the elastic modulus of the pressure-sensitive adhesive layer within a desired predetermined range, and even if the elastic modulus of the pressure-sensitive adhesive layer is less than 1.0 × 10 ⁶ Pa, the initial peeling force can be increased. It is preferable because it is possible. Furthermore, when a terpene phenol-based tackifying resin is used as the tackifying resin, not only the adherend is contaminated and the adhesive residue is small, but also the tackiness with the adherend in an environment of 50 to 90 ° C. is improved. At the same time, after expansion of the thermally expandable microspheres, it can be more easily peeled off from the adherend.

  The blending ratio of the tackifying resin may be appropriately selected so that the elastic modulus of the pressure-sensitive adhesive layer can be adjusted within a desired numerical range, and is not particularly limited. However, it is preferable to set it as 10-100 mass parts with respect to 100 mass parts of acrylic adhesive from the surface of the elasticity modulus of an adhesive layer and initial stage peeling force. When the mixing ratio of the tackifying resin is less than 10 parts by mass with respect to 100 parts by mass of the acrylic pressure-sensitive adhesive, the adherence of the adherend during work tends to decrease. On the other hand, when it is more than 100 parts by mass, the sticking property with the adherend at room temperature decreases. From the standpoint of adhesion to the adherend and stickability at normal temperature, the blending ratio of the tackifier resin is more preferably 15 to 50 parts by mass with respect to 100 parts by mass of the acrylic adhesive. Moreover, it is preferable that the hydroxyl value of tackifying resin is 30 or more. If the hydroxyl value of the tackifying resin is less than 30, adhesive residue may easily occur on the adherend during peeling.

[Adhesive sheet]
In order to obtain the pressure-sensitive adhesive sheet of this embodiment, first, a pressure-sensitive adhesive composition containing the above-described components is dissolved or dispersed in a suitable solvent, and the pressure-sensitive adhesive layer-forming coating having a solid content concentration of 20 to 50% by mass is prepared. Prepare a working solution. Next, the prepared pressure-sensitive adhesive layer-forming coating solution is applied directly to at least one surface of the base material or via a suitable intermediate layer and dried according to a conventional method, so that the pressure-sensitive adhesive has a thickness of 15 to 100 μm. It is desirable to form an agent layer, preferably 15 to 70 μm, more preferably 20 to 60 μm. In addition, when the thickness of the pressure-sensitive adhesive layer is more than 100 μm, cohesive failure tends to occur at the time of peeling after heat treatment, and good peelability may not be obtained. In addition, energy for sufficiently expanding the thermally expandable microspheres does not reach the entire removable pressure-sensitive adhesive, and a uniform surface shape necessary for peeling may not be formed. For this reason, even after the heat treatment, it is difficult to peel off the adherend unless an extra force is applied. On the other hand, when the thickness of the pressure-sensitive adhesive layer is less than 15 μm, it may be difficult to obtain sufficient adhesive strength with the adherend. In addition, considering the average particle diameter of thermally expandable microspheres that are substantially available, it may be difficult to achieve a thickness of less than 15 μm.

  When forming the adhesive of this embodiment on a base material, the material in particular of a base material is not restrict | limited, According to the utilization field of an adhesive sheet, it can select suitably. For example, the base material is composed of a synthetic resin such as polyethylene terephthalate, polyethylene naphthalate, polyethylene, polycarbonate, triacetylcellulose, cellophane, polyimide, polyamide, polyphenylene sulfide, polyetherimide, polyethersulfone, aromatic polyamide, polysulfone, etc. Can do. The substrate may be transparent or may be colored by blending various pigments and dyes. Moreover, the base material by which the surface was processed into the mat shape can also be used.

  When the adhesive sheet is used in the field where it is exposed to an environment of about 50 to 90 ° C. for a long time, the heat shrinkage rate defined by JIS C 2318 is 0.5% or less in order to avoid dimensional change and curling. It is preferable to use a substrate, and it is more preferable to use a 0.2% or less substrate. Specifically, a polyethylene terephthalate film and a polyethylene naphthalate film having a heat shrinkage of 0.2% or less may be selected.

  The thickness of a base material can be suitably selected according to the utilization field of an adhesive sheet. Specifically, the thickness of the substrate is preferably 25 to 250 μm. When the adhesive sheet is used for holding an adherend during cutting and fragmenting, the thickness of the substrate is preferably 25 to 250 μm. However, when the adherend is a ceramic sheet and the pressure-sensitive adhesive sheet is used for holding when the ceramic sheet is fragmented, the thickness of the substrate is preferably 100 to 188 μm.

  The substrate can contain known additives, heat stabilizers, oxidation stabilizers, weathering stabilizers, ultraviolet absorbers, antistatic agents, and the like. Moreover, in order to improve the adhesiveness of a base material and an adhesive layer, surface treatment is performed to the surface where the adhesive layer of a base material is arrange | positioned, and / or between a base material and an adhesive layer. It is preferable to interpose an intermediate layer having adhesiveness. Examples of the surface treatment include (1) discharge treatment such as corona discharge treatment and glow discharge treatment, (2) plasma treatment, (3) flame treatment, (4) ozone treatment, and (5) ultraviolet treatment, electron beam, and radiation treatment. Ionizing active ray treatment such as (6) surface roughening treatment such as sand mat treatment and hairline treatment, and (7) chemical treatment. Moreover, as an intermediate | middle layer, the adhesiveness with base materials, such as an adhesive layer which does not contain a thermally expansible microsphere from an adhesive layer, can use a thing higher than an expandable microsphere containing adhesive layer, for example. . In addition, it is preferable that the thickness of an intermediate | middle layer is 1-100 micrometers, and it is still more preferable that it is 10-50 micrometers from a viewpoint of adhesiveness with a base material and productivity.

  In addition, depending on the amount of volatile matter remaining in the pressure-sensitive adhesive layer (residual volatile matter amount), it may affect the adhesiveness between the pressure-sensitive adhesive layer and the substrate, the peelability from the adherend after heating, and the adhesive residue. May affect. Accordingly, the residual volatile content in the pressure-sensitive adhesive layer is preferably 4% by mass or less, and more preferably 2% by mass or less. In addition, various conventionally used additives such as surfactants, lubricants, stabilizers, viscosity modifiers, and the like can be added to the pressure-sensitive adhesive layer forming coating solution.

EXAMPLES Hereinafter, although this invention is demonstrated concretely based on an Example, this invention is not limited to these Examples.
In addition, about the adhesive composition and adhesive sheet of an Example and a comparative example, the standard deviation of a thermally expansible microsphere, the thickness of an adhesive layer, the height difference of the unevenness | corrugation formed in an adhesive layer, Six items of surface area, 180 ° peeling force and peelability were evaluated. These items were evaluated by the following methods.

[standard deviation]
The measurement was performed by a laser diffraction scattering method using a microtrack (MICROTRAC HRA MODEL No. 9320-X100, manufactured by Nikkiso Co., Ltd.).

[Adhesive layer thickness]
Using a micrometer, the thickness including the two PET sheets was measured and calculated by subtracting the thickness of the two PET sheets from the measured value.

[Altitude difference (μm)]
The pressure-sensitive adhesive sheet was heated on a hot plate at 120 ° C. for 1 minute. After cooling, three-dimensional surface shape measuring microscope (VK-9500, manufactured by Keyence Corporation) was used, the height between the specific surface area S ₀ highest point H1 and the lowest point of the formed pressure-sensitive adhesive surface irregularities on H3 H1 -Measure H3.

[Surface area]
The pressure-sensitive adhesive sheet was heated on a hot plate at 120 ° C. for 1 minute. After standing to cool, using a three-dimensional surface shape measuring microscope (VK-9500, manufactured by Keyence Corporation), the surface area in the range of H2 at a position 20 μm lower than the highest point H1 of the adhesive surface layer unevenness formed on the specific area S _0. Measure _SH1-H2 . A value obtained by dividing this S _H1-H2 by S ₀ was obtained.

[180 ° peeling force (N / 25mm)]
A 10 mm wide adhesive sheet was affixed to the surface of the green sheet under conditions of 23 ° C. and 65% RH, and left for 0.5 hours to prepare a measurement sample. The 180 ° peel force was measured under the conditions of 23 ° C. and 65% RH. The measured 180 ° peeling force value was converted to a value (N / 25 mm) when a 25 mm width adhesive sheet was used.

[Peelability]
A 5 cm × 5 cm green sheet was used as the adherend, and a 5 cm × 5 cm adhesive sheet was attached to the surface, followed by heating on a hot plate at 120 ° C. for 1 minute. After standing to cool, it was visually evaluated at room temperature (23 ° C.) whether or not the adhesive layer of the adhesive sheet was peeled off from the adherend.

Example 1
6 parts by mass of thermally expandable microspheres A (average particle size: 15 μm, standard deviation: 4.8 μm), 3 parts by mass of thermally expandable microspheres B (average particle size: 7.7 μm, standard deviation: 3.6 μm), Acrylic adhesive (acrylic acid-butyl acrylate copolymer, mass average molecular weight: 510,000, glass transition temperature: -32 ° C., acid value: 46) 27 parts by mass, terpene phenol tackifying resin (softening point: 150 ° C.) 5 parts by mass, 0.15 parts by mass of an epoxy-based crosslinking agent (N, N, N ′, N′-tetraglycidyl-m-xylenediamine) and 61.85 parts by mass of toluene are uniformly mixed and dissolved. An adhesive layer forming coating solution was prepared. The pressure-sensitive adhesive layer-forming coating solution was applied onto a polyethylene terephthalate sheet having a thickness of 100 μm with a baker-type applicator and sufficiently dried at 80 ° C. to form a pressure-sensitive adhesive layer having a thickness of 41 μm. A re-peelable pressure-sensitive adhesive sheet (Example 1) was prepared by disposing a PET sheet having a thickness of 38 μm whose one surface was subjected to silicone release treatment on the surface of the pressure-sensitive adhesive layer. Table 1 shows the measurement results of the physical property values of this pressure-sensitive adhesive sheet and the evaluation results of various properties.

(Example 2)
As the thermally expandable microsphere, 4 parts by mass of thermally expandable microsphere A (average particle size: 15 μm, standard deviation: 3.5 μm), thermally expandable microsphere B (average particle size: 7.7 μm, standard deviation: 3) .6 μm) A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 2 parts by mass were used. Table 1 shows the measurement results of the physical property values of this pressure-sensitive adhesive sheet and the evaluation results of various properties.

(Example 3)
As the thermally expandable microspheres, 6 parts by mass of thermally expandable microsphere A (average particle size: 15 μm, standard deviation: 3.5 μm), thermally expandable microsphere B (average particle size: 7.7 μm, standard deviation: 3) .6 μm) A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 3 parts by mass were used. Table 1 shows the measurement results of the physical property values of this pressure-sensitive adhesive sheet and the evaluation results of various properties.

Example 4
As the thermally expandable microsphere, 4 parts by mass of thermally expandable microsphere A (average particle size: 9.9 μm, standard deviation: 2.3 μm), thermally expandable microsphere B (average particle size: 6.7 μm, standard deviation) : 2.3 μm) A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 2 parts by mass were used. Table 1 shows the measurement results of the physical property values of this pressure-sensitive adhesive sheet and the evaluation results of various properties.

(Comparative Example 1)
As the thermally expandable microsphere, 4 parts by mass of thermally expandable microsphere A (average particle size: 15 μm, standard deviation: 4.8 μm), thermally expandable microsphere B (average particle size: 7.7 μm, standard deviation: 3) .6 μm) A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 2 parts by mass were used. Table 1 shows the measurement results of the physical property values of this pressure-sensitive adhesive sheet and the evaluation results of various properties.

(Comparative Example 2)
As the thermally expandable microsphere, 4 parts by mass of thermally expandable microsphere A (average particle diameter: 15 μm, standard deviation: 6.2 μm), thermally expandable microsphere B (average particle diameter: 7.7 μm, standard deviation: 3) .6 μm) A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that 2 parts by mass were used. Table 1 shows the measurement results of the physical property values of this pressure-sensitive adhesive sheet and the evaluation results of various properties.

  From the result of Table 1, since the unevenness | corrugation was formed when the adhesive sheet of Examples 1-4 was made to peel from an adherend compared with the adhesive sheet of Comparative Examples 1 and 2, uniform peeling is formed. You can see that it is obtained. In Comparative Example 1, since the height difference of the unevenness exceeds 100 μm, even though the unevenness was formed, it was not possible to support the adherend only by the convex portion, and the convex portion was broken. As a result of an increase in the contact area with the adherend, the peelability is lowered, and in Comparative Example 2, since the value of the formula (2) is less than 0.4, unevenness is formed on the convex portion. Since a sufficient reduction in contact area between the bonded body and the body cannot be obtained, the peelability is reduced.

  The pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet of the present invention can peel the pressure-sensitive adhesive sheet from the adherend uniformly and reliably by controlling the uneven shape of the pressure-sensitive adhesive layer surface when the thermally expandable microspheres are expanded. Highly accurate adherend processing can be performed.

Claims (6)

The physical properties of the pressure-sensitive adhesive layer measured by the following physical property measurement test are expressed by the following formula (1).
H1-H3 ≦ 100 μm (1)
And equation (2)
S _H1-H2 / S ₀ = 0.4 to 10 (2)
A pressure-sensitive adhesive composition comprising thermally expandable microspheres and a pressure-sensitive adhesive characterized by satisfying
[Physical property measurement test]
A pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive and thermally expandable microspheres on one side of a transparent polyethylene terephthalate film having a thickness of 100 μm was prepared, and the surface area of the pressure-sensitive adhesive layer (S ₀ ) is measured.
Subsequently, the pressure-sensitive adhesive sheet is heated at a temperature of +20 to 60 ° C. of the expansion temperature of the heat-expandable microspheres contained in the pressure-sensitive adhesive layer, and the highest point of unevenness on the surface of the pressure-sensitive adhesive layer formed on the S ₀ , H2 at a position 20 μm below the highest point, and H3 at the lowest point, and the surface area (S _H1-H2 ) in the range from H1 to H2 was determined.   2. The pressure-sensitive adhesive composition according to claim 1, comprising thermally expandable microspheres having an average particle diameter of 5 to 50 μm and a standard deviation of a particle size distribution by a laser diffraction scattering method of 5.0 μm or less.   The pressure-sensitive adhesive composition according to claim 1 or 2, comprising 10 to 75 parts by mass of the thermally expandable microspheres with respect to 100 parts by mass of the pressure-sensitive adhesive.   The pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive having in its molecular structure an active group capable of reacting with a crosslinking agent.   The pressure-sensitive adhesive composition according to claim 1, wherein at least one surface is a contact surface with an adherend.   A pressure-sensitive adhesive sheet, wherein a pressure-sensitive adhesive layer made of the pressure-sensitive adhesive composition according to claim 1 is formed on a substrate.