JP2007129128A - Method of manufacturing capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase capacity and prolong service life of a capacitor in which a dielectric layer and a metal thin-film layer are laminated and formed by vapor deposition. <P>SOLUTION: The method of manufacturing a capacitor consists of a first process of forming a capacitor element mother body 3 by vapor deposition; a second process of pressing the mother body 3 and cutting into a line form, and forming metallicon electrodes 8 to form capacitor element lines; a third process of attaching leading-out electrode terminals 9 to form capacity elements 10; and a fourth process of housing each capacitor element 10 in a resin case 12 having an opening, and then, filling a gap with a filling resin 13. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a capacitor used in an electronic device, which is a capacitor in which a capacitor element is resin-molded in a case.

  In recent years, capacitors in in-vehicle DC / DC converters have been strongly required to be improved in capacitance and miniaturized by increasing current. In particular, in the case of an in-vehicle use for a multilayer film capacitor, it is indispensable to reduce the size and increase the capacity under the usage environment. As a means for achieving a small size and large capacity in a laminated film capacitor, a method of manufacturing a capacitor as follows can be considered.

  First, a capacitor element base body in which a dielectric layer and a metal thin film layer are laminated by vapor deposition is formed. Next, the capacitor element base is pressed and cut, and further molten metal is sprayed on both end surfaces to form a metallicon electrode, then cut to a required capacity, and a lead electrode terminal is attached to form a capacitor element. As a result, the dielectric can be made thinner than a conventional capacitor using a dielectric film such as polypropylene or polyethylene terephthalate, so that a large capacity can be achieved.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 11-147272 A

  However, in such a conventional configuration, when the number of stacked metal thin film layers and dielectric layers is increased from, for example, about 3000 layers to 6000 layers in order to further increase the capacitance, the metal thin film layer As a result, the adhesive strength between the dielectric layer and the dielectric layer is reduced, and it is not possible to secure the required strength of the capacitor product during actual use. Had.

  In order to solve the above-mentioned conventional problems, the present invention accommodates a capacitor element formed by laminating a dielectric layer and a metal thin film layer in a resin case having an opening, and a gap between the capacitor element and the resin case. And a step of filling a filling resin.

  According to the method for manufacturing a capacitor of the present invention, in order to increase the capacity of a capacitor in which a dielectric layer and a metal thin film layer are stacked by vapor deposition, the product of a product caused by an interlayer adhesive force decreased by increasing the number of stacked layers is used. A reduction in strength can be covered, and furthermore, a capacitor can be manufactured by coating a capacitor element with a coating resin, thereby preventing corrosion of the metal thin film layer due to a corrosive component contained in the filling resin.

  As a result, a small-sized and large-capacitance capacitor can be realized, the capacity reduction rate can be reduced, and a longer life can be expected.

  Embodiment 1 of the present invention will be described below with reference to the drawings. The description of the same parts and processes as those of the conventional capacitor will be omitted.

(Embodiment)
FIG. 1 is a schematic diagram of a laminated film forming machine used in the first step in the present embodiment.

  Reference numeral 1 denotes a film forming machine, and the inside of the film forming machine 1 is evacuated. Reference numeral 2 denotes a cylindrical support in the film forming machine. The support 2 rotates in the film forming machine, and a dielectric layer and a metal thin film layer are laminated on the support 2 to form a capacitor element to be described later. The mother body 3 is formed.

  Next, the film forming process will be described. First, in a state where a vacuum is maintained, a resin material that is cured by ultraviolet rays or an electron beam in the dielectric forming portion 1c is heated and evaporated, a thin film of the resin material is formed on the surface of the support 2, and ultraviolet rays or A thin film of a resin material is cured by irradiation with an electron beam and the like, and further, the support 2 is rotated repeatedly. ) Is formed in a portion which becomes one outermost layer of the capacitor element. Next, in the margin forming portion 1a, oil or the like for forming a portion called a margin which becomes a metal non-deposition portion is applied to the metal thin film layer. Thus, when the metal thin film layers face each other with the dielectric layer in between, the function as a capacitor can be achieved.

  Further, in order to form a metal thin film layer, a metal such as aluminum or zinc is vapor deposited in the metal vapor deposition portion 1b, and then the resin material is heated and evaporated in the dielectric formation portion 1c in the same manner as the protective layer. A thin film of a resin material is formed thereon, and the dielectric film is formed by curing the resin thin film at the curing portion 1d.

  Then, the formation of the dielectric layer and the metal thin film layer is repeated, and after the predetermined number of layers is reached, a protective layer is formed in the same manner as the one outermost layer of the element on the other outermost layer of the element. To do. Further, the thickness of the protective layer, dielectric layer, and metal thin film layer to be formed is measured by a non-contact method such as X-ray or light reflection amount in the measurement unit 1e, and based on the result, the resin material or The amount of evaporation of the metal or the rotation speed of the support 2 is increased or decreased and controlled. If necessary, oxidation treatment or the like is performed in the surface treatment unit 1f.

  And the formed capacitor | condenser element base | substrate 3 is taken out from the taking-out part 1g.

  Note that the number of laminated dielectric layers and metal thin film layers is in the order of several thousand layers, and in this embodiment, 6000 layers.

  2A to 2C and FIGS. 3A and 3B are schematic views of the second step in the present embodiment. As shown in FIG. 2B, the capacitor element base 3 stacked on the cylindrical support 2 in FIG. 2A has a curved surface that is difficult to work in a later process. The press machine 4 is pressed so as to be substantially planar.

  Next, as shown in FIG. 2 (c), the cutting machine 5 cuts the strip 3a with a predetermined width. As shown in FIG. 3 (a), the metal frame 6 has a cut surface on the same plane. As shown in FIG. 3B, molten metal such as zinc is sprayed on the cut surface by a spraying machine 7 to form a metallicon electrode 8 to form a capacitor element strip 3b. After the metallicon electrode 8 is formed, a treatment for improving the electrical characteristics of the metallicon electrode 8 is performed by electrode polishing (not shown) or cleaning.

  FIGS. 4A and 4B are schematic views of the third step in the present embodiment.

  As shown in FIG. 4A, reference numeral 5 denotes a cutting machine, which cuts the capacitor element strip 3b according to the required capacity to obtain a capacitor element piece 3c. Further, as shown in FIG. 4B, the capacitor element 10 is formed by arranging the capacitor element pieces 3 c so as to have a predetermined capacity of the final product and attaching the lead electrode terminal 9 to the metallicon electrode 8. In the present embodiment, three capacitor element pieces 3c are stacked.

  5 and 6 are schematic views of the fourth step in the present embodiment. 11 is a liquid coating resin stored in the bathtub. The entire vicinity of the tip of the lead electrode terminal 9 is left so that the entire capacitor element 10 is coated with the coating resin 11. In the present embodiment, vinyl ester resin is used as the coating resin 11.

  This prevents the metal thin film layer of the capacitor element 10 from being corroded by a corrosive component contained in the filling resin 13 described later, can reduce the capacity reduction rate of the capacitor product, and dramatically improve the product life. There is an effect.

  Conventionally, when an epoxy resin is used for the filling resin 13, the acid anhydride contained in the curing agent added for the purpose of curing the filling resin 13 results in corrosion of the metal thin film layer of the capacitor element 10. As a result, capacity reduction occurred. In particular, in a state where the interlayer adhesion between the dielectric layer and the metal thin film layer was reduced, the penetration of the acid anhydride into the interlayer was remarkable, and the capacity reduction occurred in a short time.

  However, in the embodiment of the present invention, the capacitor element 10 is coated with the coating resin 11 made of the vinyl ester resin having a barrier property against the acid anhydride, so that it is included in the curing agent in the epoxy resin that is the filling resin 13. Corrosion of the metal thin film layer by the acid anhydride can be prevented.

  In FIG. 6, reference numeral 12 denotes a resin case having an opening, which is large enough to accommodate the capacitor element 10.

  A filling resin 13 fills a gap between the resin case 12 and the capacitor element 10 by a filling machine 13a. In this embodiment, as described above, an epoxy resin is used, and a curing agent containing an acid anhydride is added.

  In this way, by accommodating the capacitor element 10 in the resin case 12, indirect layer generation caused by increasing the number of layers, which is a problem of increasing the capacity of a capacitor in which a dielectric layer and a metal thin film layer are formed by vapor deposition. It is possible to cover a decrease in strength of the capacitor element due to a decrease in adhesion.

  Through the above steps, it is possible to realize a large-capacity capacitor in which a dielectric layer and a metal thin film layer are formed by vapor deposition, and furthermore, it is possible to obtain a capacitor with a small capacity reduction rate and an expected long life. Is.

  As described above, according to the method for manufacturing a capacitor according to the present invention, it is possible to provide a capacitor having a small size and a large capacity, capable of reducing the rate of decrease in the capacity of the product, and dramatically improving the service life. This is useful for noise removal in converters.

Schematic diagram of the laminated film forming machine used in the first step in the present embodiment (A)-(c) is the schematic of the 2nd process in this Embodiment. (A) And (b) is the schematic diagram of the 2nd process in this Embodiment. (A) And (b) is the schematic diagram of the 3rd process in this Embodiment. Outline diagram of fourth step in the present embodiment Outline diagram of fifth step in the present embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Film forming machine 2 Support body 3 Capacitor element base 3a Article 3b Capacitor element article 3c Capacitor element piece 4 Press machine 5 Cutting machine 6 Frame 7 Spraying machine 8 Metallicon electrode 9 Lead electrode terminal 10 Capacitor element 11 Coating resin 12 Resin case 13 Filling Resin 13a filling machine

Claims (4)

A protective layer formed by laminating a resin on a support that circulates in a vacuum, and an element layer that generates a capacitance as a capacitor by alternately laminating metal thin film layers and dielectric layers divided by a margin portion A first step of separating the capacitor element matrix comprising the two protective layers and the element layer from the support after the protective layer formed by laminating the resin is sequentially formed by vapor deposition; and After pressing, cut into strips, spraying molten metal on both end surfaces to form metallicon electrodes, and then cutting the capacitor element strips according to the required capacity A third step of attaching a lead electrode terminal to form a capacitor element; and after accommodating the capacitor element in a resin case having an opening, the resin case and the capacitor element A fourth step the method of manufacturing the capacitor consisting of filling with the filling resin a gap between. In the fourth step, before the capacitor element is accommodated in the resin case, the capacitor element is immersed in a liquid coating resin to coat the entire capacitor element except a part of the lead electrode terminal. The method for producing a capacitor according to claim 1. The method for manufacturing a capacitor according to claim 1, wherein in the fourth step, the filling resin is an epoxy resin. 3. The method of manufacturing a capacitor according to claim 2, wherein in the fourth step, the coating resin is a vinyl ester resin.

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