JP2007121805A - Method for manufacturing color-filter substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a color-filter substrate which reduces deflection of a photomask by a simple method and forms a plurality of color filters by performing patterning processes, such as pattern exposure and developing, by using the photomask that is fixed and held in a mask holder. <P>SOLUTION: The method for manufacturing the color-filter substrate is capable of obtaining a color-filter substrate, having reduced dimensional variation over the entire surface of the processed substrate and superior pattern shape reproducibility, by first fixing and holding the photomask, in a state of vertically placing the photomask, further putting the photomask in a horizontal state and setting the maskholder in an exposure apparatus, and performing pattern exposure of the photoprocess in a black matrix forming process, a color-filter forming process, and a columnar spacer forming process. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a color filter substrate for a liquid crystal display device, and more particularly, to a method for manufacturing a color filter substrate for manufacturing a color filter substrate by performing patterning processing such as pattern exposure and development while reducing the deflection of a photomask. .

In recent years, with the increase in large color televisions, notebook computers, and portable electronic devices, there has been a remarkable increase in demand for liquid crystal displays, particularly color liquid crystal display panels.
In general, the most widely used liquid crystal cell driving method in the liquid crystal display panel is a vertical electric field driving type using a TN (twisted nematic) method and an STN (super twisted nematic) method. Development of a liquid crystal cell driving method by IPS (In Plane Switching) is also in progress.

  As a color filter substrate used in a color liquid crystal display panel, on a transparent substrate, a colored filter composed of a black matrix, a red filter, a green filter, a blue filter, a columnar spacer, etc. is patterned using a photomask, such as pattern exposure and development. It is formed through a photolithography process that performs processing.

A method for manufacturing the color filter substrate will be described below.
6A to 6G are partial schematic cross-sectional views illustrating an example of a method for manufacturing a color filter substrate.
First, a black photosensitive resin in which carbon black is dispersed in an acrylic resin is applied on a transparent substrate 11 with a spinner or the like to form a black photosensitive resin layer 21 (see FIG. 6A), pattern exposure, A black matrix 21a is formed by performing a patterning process such as development (see FIG. 6B).

  Next, a red photosensitive resin solution in which a red pigment is dispersed in an acrylic photosensitive resin is applied to the transparent substrate on which the black matrix 21a is formed using a spinner or the like to form a red photosensitive resin layer. The red filter 31R ′ is formed by performing a series of patterning processes such as pattern exposure and development using the photomask (see FIG. 6C).

  Next, a green photosensitive resin solution in which a green pigment is dispersed in an acrylic photosensitive resin is applied on a transparent substrate on which the black matrix 21a and the red filter 31R ′ are formed using a spinner or the like, and the green photosensitive resin layer is applied. And a series of patterning processes such as pattern exposure and development using a predetermined photomask to form a green filter 32G ′ (see FIG. 6D).

  Next, a blue photosensitive resin solution in which a blue pigment is dispersed in an acrylic photosensitive resin is applied onto a transparent substrate on which the black matrix 21a, the red filter 31R ′, and the green filter 32G ′ are formed using a spinner or the like, A blue photosensitive resin layer is formed, and a series of patterning processes such as pattern exposure and development are performed using a predetermined photomask to form a blue filter 33B ′, on the transparent substrate 11 on which the black matrix 21a is formed. A colored filter 30 including a red filter 31R ′, a green filter 32G ′, and a green filter 33B ′ is formed (see FIG. 6E).

Next, an indium tin oxide-based alloy target is sputtered to form a transparent conductive film on the black matrix 21a, the red filter 31R ′, the green filter 32G ′, and the blue filter 33B ′ on the transparent substrate 11, and the transparent electrode 41 is formed (see FIG. 6F).
Next, an acrylic clear resist is applied using a spinner or the like to form a photosensitive resin layer, and a series of patterning processes such as pattern exposure and development are performed using a predetermined photomask, so that the columnar spacers 51 are formed. A color filter substrate on which a black matrix 21a, a colored filter 30 including a red filter 31R ′, a green filter 32G ′, and a green filter 33B ′, a transparent electrode 41, and a columnar spacer 51 are formed on the transparent substrate 11. 200 can be obtained (see FIG. 6G).

In the pattern exposure process using a photomask in the manufacturing process of the color filter substrate, a proximity (proximity) exposure apparatus has been adopted in order to prevent occurrence of common defects during pattern exposure and improve throughput. Yes.
In addition, the recent increase in size of liquid crystal panels has led to the development of processing substrate sizes as large as 1 m or more, and photomasks used for pattern exposure are also becoming increasingly larger.

The proximity exposure apparatus includes an exposure light irradiation unit (not shown in particular), a mask holder 61 that holds a photomask 60, and a work stage 61 that holds a processing substrate 10. As the stage 61 moves up and down, the photomask 60 and the processing substrate 10 are positioned. Further, the gap between the photomask 60 and the processing substrate 10 is finely adjusted using an optical sensor or the like. (See Figure 4)
Here, since the processing substrate 10 is attracted to the work stage 61 having high planar accuracy, the flatness of the processing substrate 10 is ensured. However, the photomask 60 is formed by the vacuum chuck 62 only at the outer periphery of the mask holder 61. Since the photomask 60 is fixed and held, when the photomask 60 is increased in size, the photomask 60 is bent by its own weight.

As a result, a phenomenon occurs in which the exposure gap between the photomask 60 and the processing substrate 10 is large at the outer peripheral portion and becomes small due to the deflection at the central portion.
If pattern exposure is carried out in this state, variations in pattern dimensions corresponding to variations in the gap amount occur, which adversely affects pattern dimensions and shape reproducibility on the processing substrate 10, which is a problem.

  As a method of eliminating the deflection of the photomask, the photomask is fixed and held on the lower surface of the mask stage by vacuum suction, the work stage is lifted and brought into contact with the photomask, and the photomask and the work stage are spread over the entire surface. And make parallel contact. At this time, the vacuum suction of the photomask by the mask stage is once released. There has been proposed a method in which vacuum suction of a photomask is started and the photomask is fixedly held on the mask stage in a state where distortion and deflection of the photomask are corrected by the force applied to the photomask from the work stage (for example, a patent Reference 1).

The method of correcting the distortion and deflection of the photomask by adhering the photomask and the work stage over the entire surface is effective in correcting the distortion and deflection of the photomask, but the pattern surface of the photomask However, since it comes into contact with and in close contact with the work stage, there are problems such as scratching the pattern of the photomask, attaching dust and the like, and newly generating defects such as scratches and foreign matter on the photomask.
JP 2003-167355 A

The present invention has been devised in view of the above-described problems, and reduces the deflection of a photomask by a simple method, and performs patterning processing such as pattern exposure and development using a photomask fixedly held on a mask holder. It is an object of the present invention to provide a method for manufacturing a color filter substrate for forming a plurality of colored filters.

  In order to achieve the above object in the present invention, in the present invention, at least a black photosensitive resin layer on a transparent substrate is subjected to patterning processing such as pattern exposure and development using a photomask to form a black matrix. A matrix forming step, a colored filter forming step in which a colored photosensitive resin layer is subjected to patterning processing such as pattern exposure and development using a photomask to form a plurality of colored filters, a transparent electrode forming step, and a transparent photosensitive resin In a manufacturing method of a color filter substrate having a columnar spacer forming step of forming a columnar spacer by performing patterning processing such as pattern exposure and development using a photomask, the photomask is first placed in a state in which the mask holder is placed vertically. Hold the mask holder in a horizontal position and set the mask holder on the exposure tool. Te is obtained by the method for manufacturing a color filter substrate and performing pattern exposure.

According to the method for manufacturing a color filter substrate of the present invention, a mask holder on which a photomask with less deflection is fixed and set is set in a proximity exposure apparatus, and the photoprocessing of the color filter substrate is performed. A color filter substrate with little dimensional variation and excellent pattern shape reproducibility can be obtained.
In addition, since the photomask can be easily fixed and held on the mask holder with little deflection and can be set in the exposure apparatus, the processing time in a series of exposure processes can be shortened.

Hereinafter, embodiments of the present invention will be described.
1 (a) to (f), FIGS. 2 (g) to (l), and FIGS. 3 (m) to (p) are schematic partial cross-sectional views showing an embodiment of the method for producing a color filter substrate of the present invention. FIGS. 5 (a) and 5 (b) show a state in which the photomask is fixed and held in a state where the mask holder is placed vertically, and the mask holder is set in the exposure apparatus in a horizontal state. An explanatory view is shown respectively. In the method for manufacturing a color filter substrate of the present invention, the photomask can be fixedly held on the mask holder with a small amount of deflection, and can be set on the exposure apparatus. A small color filter substrate with excellent pattern shape reproducibility can be obtained.

The method for producing the color filter substrate of the present invention will be described below.
First, a black photosensitive resin solution in which carbon black is dispersed in an acrylic resin is applied on a transparent substrate 11 by using a spinner or the like, and dried to form a black photosensitive resin layer 21 (see FIG. 1A).
Here, as the transparent substrate 11, a glass substrate such as low expansion glass, non-alkali glass, or quartz glass, a plastic film, or the like can be used.

  Next, a photomask 60b for forming a black matrix in which a light shielding region and a transmission region are formed at predetermined positions on the transparent substrate 12 is manufactured. As shown in FIGS. 5A and 5B, first, as shown in FIGS. The peripheral portion of the photomask 60b is fixed and held by the vacuum chuck 62 with the 61 placed vertically (see FIG. 5A), and the mask holder 61 holding the photomask 60b fixed and held in a horizontal state is proxied. Set in a Mitty exposure apparatus (not shown) (see FIG. 5B).

Next, pattern exposure such as development is performed on the black photosensitive resin layer 21 (see FIG. 1B), and a black matrix 21a is formed at a predetermined position on the transparent substrate 11 (FIG. 1C). reference).
Here, an exposure gap of 50 to 300 μm is set between the exposure mask 60Hb and the transparent substrate 11 on which the black photosensitive resin layer 21 is formed.

  Next, a red photosensitive resin solution in which a red pigment (for example, a dianthraquinone pigment) is dispersed in an acrylic photosensitive resin is applied onto a transparent substrate on which the black matrix 21a is formed using a spinner or the like. A conductive resin layer 31R is formed (see FIG. 1D).

  Next, a photomask 60R for forming a red filter in which a transmissive region and a light-shielding region are formed at predetermined positions on the transparent substrate 12 is manufactured. As shown in FIGS. 5A and 5B, first, as shown in FIGS. The peripheral portion of the photomask 60R is fixed and held by the vacuum chuck 62 with the 61 placed vertically (see FIG. 5A), and the mask holder 61 holding the photomask 60R fixed and held in the horizontal state is proxied. Set in a Mitty exposure apparatus (not shown) (see FIG. 5B).

Next, the red photosensitive resin layer 31R on the transparent substrate 11 is pattern-exposed with a predetermined exposure amount (see FIG. 1 (e)).
Here, an exposure gap of 50 to 300 μm is set between the exposure mask 60HR and the transparent substrate 11 on which the red photosensitive resin layer 31R is formed.

  Next, the green photosensitive resin layer 32R on which the pattern latent image is formed is developed with a dedicated developer, thereby forming a red filter 31R 'on the transparent substrate 11 (see FIG. 1 (f)).

  Next, a green photosensitive resin solution in which a green pigment (for example, phthalocyanine green pigment) is dispersed in an acrylic photosensitive resin is used on a transparent substrate 11 on which a black matrix 21a and a red filter 31R ′ are formed using a spinner or the like. To form a green photosensitive resin layer 32G (see FIG. 2G).

  Next, a green filter forming photomask 60G in which a light shielding region and a transmission region are formed at predetermined positions on the transparent substrate 12 is manufactured. As shown in FIGS. 5A and 5B, first, as shown in FIGS. The peripheral portion of the photomask 60G is fixed and held by the vacuum chuck 62 with the 61 placed vertically (see FIG. 5A), and the mask holder 61 holding the photomask 60G fixed and held in a horizontal state is proxied. Set in a Mitty exposure apparatus (not shown) (see FIG. 5B).

Next, the green photosensitive resin layer 32G on the transparent substrate 11 is pattern-exposed with a predetermined exposure amount (see FIG. 2 (h)).
Here, an exposure gap of 50 to 300 μm is set between the exposure mask 60G and the transparent substrate 11 on which the green photosensitive resin layer 31G is formed.

  Next, a green filter 32G 'is formed on the transparent substrate 11 by developing the green photosensitive resin layer 32G on which the pattern latent image is formed with a dedicated developer (see FIG. 2 (i)).

  Next, a blue photosensitive resin solution in which a blue pigment (for example, phthalocyanine blue pigment) is dispersed in an acrylic photosensitive resin is applied to the transparent substrate 11 on which the black matrix 21a, the red filter 31R ′, and the green filter 32G ′ are formed. Is applied using a spinner or the like to form a blue photosensitive resin layer 33B (see FIG. 2 (j)).

Next, a photomask 60B for forming a blue filter in which a light shielding region and a transmission region are formed at predetermined positions on the transparent substrate 12 is manufactured. As shown in FIGS. 5A and 5B, first, as shown in FIGS. The peripheral portion of the photomask 60B is fixed and held by the vacuum chuck 62 with the 61 placed vertically (see FIG. 5A), and the mask holder 61 holding the photomask 60B fixed and held in a horizontal state is proxied. Set in a Mitty exposure apparatus (not shown) (see FIG. 5B).

Next, the blue photosensitive resin layer 33B on the transparent substrate 11 is subjected to pattern exposure with a predetermined exposure amount (see FIG. 2 (k)).
Here, an exposure gap of 50 to 300 μm is set between the exposure mask 60B and the transparent substrate 11 on which the green photosensitive resin layer 33B is formed.

  Next, a blue filter 33B ′ is formed on the transparent substrate 11 by developing the blue photosensitive resin layer 33B on which the pattern latent image is formed with a dedicated developer, and the black matrix 21a and the black matrix 21a are formed on the transparent substrate 11. The color filter 30 including the red color filter 31R ′, the green color filter 32G ′, and the green color filter 33B ′ is formed (see FIG. 2 (l)).

  Next, a transparent conductive film having a predetermined thickness made of indium tin oxide is formed on the colored filter 30 made of the red color filter 31R ′, the green color filter 32G ′, and the green color filter 33B ′ by sputtering an indium tin oxide alloy target. To form a transparent electrode 41 (see FIG. 3M).

  Next, an acrylic clear resist is applied onto the transparent substrate 11 on which the black matrix 21a, the red filter 31R ′, the green filter 32G ′, the green color filter 33B ′, and the transparent electrode 41 are formed using a spinner or the like, and transparent A photosensitive resin layer 51 is formed (see FIG. 3 (n)).

  Next, a columnar spacer forming photomask 60S in which a light shielding region and a transmission region are formed at predetermined positions on the transparent substrate 12 is manufactured. As shown in FIGS. 5A and 5B, first, as shown in FIGS. The peripheral portion of the photomask 60S is fixed and held by the vacuum chuck 62 with the 61 placed vertically (see FIG. 5A), and the mask holder 61 holding the photomask 60S fixed and held in a horizontal state is proxyed. Set in a Mitty exposure apparatus (not shown) (see FIG. 5B).

Next, the transparent photosensitive resin layer 51 on the transparent substrate 11 is subjected to pattern exposure with a predetermined exposure amount (see FIG. 3 (o)).
Here, an exposure gap of 50 to 300 μm is set between the exposure mask 60S and the transparent substrate 11 on which the transparent photosensitive resin layer 51 is formed.

  Next, the transparent photosensitive resin layer 51 on which the pattern latent image is formed is developed with a dedicated developer to form columnar spacers 51S at predetermined positions on the transparent substrate 11, and a black matrix is formed on the transparent substrate 11. 21a, a color filter substrate 100 formed with a color filter 30 including a red color filter 31R ′, a green color filter 32G ′, and a green color filter 33B ′, a transparent electrode 41, and a columnar spacer 51S is obtained (FIG. 3 (p )reference).

  It is known that when the photomask made of quartz glass of 500 × 500 mm and 5 mm thickness is fixed and held on the mask holder 61 by a normal method, it is bent about 30 μm at the center of the photomask. The deflection at the center of the photomasks 60b, 60R, 60G, 60B, and 60S used in this manufacturing method was reduced to 10 μm.

As described above, according to the method for manufacturing a color filter substrate of the present invention, the photomask can be fixedly held on the mask holder with little deflection and can be set in the exposure apparatus. It is possible to obtain a color filter substrate with little dimensional variation over the entire surface and excellent in pattern shape reproducibility.
In addition, since the photomask can be easily fixed and held on the mask holder with little deflection and can be set in the exposure apparatus, the processing time in a series of exposure processes can be shortened.

(A)-(f) is typical structure sectional drawing which shows a part of process of the manufacturing method of the color filter substrate of this invention. (G)-(l) is typical structure sectional drawing which shows a part of process of the manufacturing method of the color filter substrate of this invention. (M)-(p) is typical structure sectional drawing which shows a part of process of the manufacturing method of the color filter substrate of this invention. It is explanatory drawing which shows the fluctuation | variation state of the gap by the position with the process board | substrate 10 by the bending of the photomask 60. FIG. (A) is explanatory drawing which shows the state which has fixed and hold | maintained the peripheral part of the photomask with the vacuum chuck 62 in the state which set the mask holder 61 vertically. (B) is explanatory drawing which shows the state which has made the mask holder 61 in which the photomask was fixedly held horizontal. (A)-(g) is typical structure sectional drawing which shows an example of the manufacturing method of a color filter substrate.

Explanation of symbols

10 …… Processed substrate 11, 12 ... Transparent substrate 21 …… Black photosensitive resin layer 21a …… Black matrix 30 …… Colored filter 31R …… Red photosensitive resin layer 31R ′ …… Red filter 32G …… Green photosensitive Resin layer 32G '... Green filter 33B ... Blue photosensitive resin layer 33B' ... Blue filter 41 ... Transparent electrode 51 ... Columnar spacers 60, 60b, 60R, 60G, 60B, 60S ... Photomask 61 ... Mask holder 62 ... Vacuum chuck 71 ... Work stage 100, 200 ... Color filter substrate

Claims (1)

  At least a black photosensitive resin layer on a transparent substrate is subjected to patterning processing such as pattern exposure and development using a photomask to form a black matrix, and a colored photosensitive resin layer is patterned using a photomask. A patterning process such as patterning such as exposure and development, a colored filter forming process for forming a plurality of colored filters, a transparent electrode forming process, and a patterning process such as pattern exposure and development using a photomask for the transparent photosensitive resin layer In the manufacturing method of the color filter substrate having the columnar spacer forming step of forming the columnar spacer, the photomask is first fixedly held in a state where the mask holder is first placed vertically, and further, the mask holder is placed in an exposure apparatus in a horizontal state. Color fill characterized by setting and pattern exposure Method of manufacturing a substrate.

Images