JP2007117833A - Thin film formation method and thin film forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin film formation method capable of adjusting an amount of a liquid drop delivered at a real time and preventing generation of failure, and a thin film forming apparatus. <P>SOLUTION: In the thin film formation method, an ink of a function liquid delivered from an ink jet head 20 is deposited on a substrate to form a thin film. A volume of the ink i delivered by the ink jet head 20 is measured and an amount of the ink delivered by the ink jet head 20 is controlled based on the measured volume of the ink i. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a thin film forming method and a thin film forming apparatus for forming a thin film by landing droplets of a functional liquid on a substrate.

In recent years, it has been proposed to form a functional film (thin film) by using a droplet discharge method in which functional liquid ink (droplets) is discharged by a droplet discharge head, a so-called inkjet method (for example, Patent Document 1). , 2). In general, the inkjet method forms a thin film by repeatedly landing ink ejected from a plurality of nozzles provided on a droplet discharge head on the substrate while relatively moving the substrate and the droplet discharge head. Is. This inkjet method ejects minute ink in dots, so it is extremely accurate in terms of ink size and pitch uniformity, and it consumes more liquid than conventional coating techniques such as spin coating. There is little waste. Furthermore, an arbitrary pattern can be directly formed without using a patterning technique such as photolithography. For this reason, for example, it is applied to the formation of thin films such as a color filter of a liquid crystal device and a light emitting layer of an organic EL device.
Japanese Patent Laid-Open No. 9-118024 Japanese Patent Laid-Open No. 11-248927

  By the way, when a functional film is formed on a substrate using the above-described ink jet method, a partition called a bank is usually formed in order to prevent the ink from spreading, and a dot area defined by the bank is formed. Ink is applied by an inkjet method. In this case, since the film thickness of the functional film depends on the discharge amount of the ink discharged from the nozzles of the droplet discharge head, the ink discharge amount is accurately grasped so that the functional film thickness is uniform. In addition, it is necessary to manage the ink discharge amount.

  However, in a display device such as the above-described liquid crystal device or organic EL device, the larger the display, the more difficult it is to manage ink between the dot areas arranged in a dot matrix, and the amount of ink discharged between the dot areas. Variation tends to occur.

  Therefore, in the thin film formation method using the inkjet method, the weight of ink ejected from the droplet ejection head is measured, and the ink ejection amount is adjusted based on the measured weight of ink. ing. Specifically, for example, after forming a thin film of the substrate in units of, for example, 10 sheets or 20 sheets, the ink is ejected to a tray of a separately provided electronic balance, the weight of the ink is measured, and the measured ink The ink discharge amount is obtained from the weight of the ink, and when the value is out of the standard, the drive voltage applied to the drive element of the droplet discharge head is adjusted until a predetermined discharge amount is obtained.

  However, in this thin film forming method, if ink ejection failure occurs between measurements, there is a possibility that the substrate produced during that time will be defective. In addition, there is no method for detecting missing during actual drawing or temporal change of the head, and defects are often found for the first time after completion of the inspection.

  The present invention has been proposed in view of such conventional circumstances, and provides a thin film forming method and a thin film forming apparatus capable of adjusting the discharge amount of droplets in real time and preventing the occurrence of defects. The purpose is to provide.

In order to achieve this object, a thin film forming method according to the present invention is a thin film forming method for forming a thin film by landing droplets of a functional liquid ejected by a droplet ejecting means on a substrate. It is characterized in that the volume of a droplet discharged from the discharge means is measured, and the discharge amount of the droplet discharged from the droplet discharge means is controlled based on the measured volume of the droplet.
According to such a thin film forming method, since the discharge amount of the droplet discharged by the droplet discharge means can be obtained from the volume of the droplet discharged by the droplet discharge means, the thin film is formed on the substrate, The discharge amount of droplets can be adjusted in real time, and occurrence of defects can be prevented.

On the other hand, a thin film forming apparatus according to the present invention is a thin film forming apparatus for forming a thin film by landing functional liquid droplets on a substrate, and includes a liquid droplet ejecting means for ejecting functional liquid droplets, Volume measuring means for measuring the volume of a droplet discharged by the discharging means, and control means for controlling the discharge amount of the droplet discharged by the droplet discharging means based on the volume of the droplet measured by the volume measuring means; It is characterized by providing.
According to such a thin film forming apparatus, the control unit controls the droplet discharge unit based on the droplet volume measured by the volume measuring unit, and adjusts the discharge amount of the droplet discharged by the droplet discharge unit. As a result, the amount of droplets discharged can be adjusted in real time while forming a thin film on the substrate, and the occurrence of defects can be prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, various structures are illustrated using drawings, but the structures shown in these drawings may be shown with different dimensions from the actual structures in order to show the characteristic parts in an easy-to-understand manner. is there.

(Thin film forming equipment)
First, a thin film forming apparatus according to an embodiment of the present invention will be described.
FIG. 1 is a perspective view showing an appearance of a thin film forming apparatus according to an embodiment of the present invention.
As shown in FIG. 1, the thin film forming apparatus includes a liquid discharge device 10 installed on a base 9, a substrate transfer device 11 arranged near the base 9, and a control unit arranged beside the base 9. 12 is mainly provided. In addition, the droplet discharge device 10 installed on the base 9 can be covered with a cover 13 as necessary.

  As shown in FIG. 2, the droplet discharge device 10 includes a table 46 on which a substrate 31 on which a functional film is to be formed is placed, and functional liquid ink (liquid) on the substrate 31 placed on the table 46. An ink jet head (droplet discharge head) 20 which is a droplet discharge means for discharging droplets) is mainly provided.

  Among these, the table 46 can be moved and positioned in the Y direction by the first moving mechanism 14, and can be swung and positioned in the θz direction by the motor 44. On the other hand, the inkjet head 20 can be moved and positioned in the X direction by the second moving mechanism 16, and can be moved and positioned in the Z direction by the linear motor 62. The inkjet head 20 can be swung and positioned in the α, β, and γ directions by motors 64, 66, and 68, respectively. Thereby, in the droplet discharge device 10, the relative position and posture of the substrate 31 placed on the table 46 and the ink discharge surface 20P of the head 20 can be accurately controlled. .

  The droplet discharge device is provided with a capping unit 22 for capping the ink discharge surface 20P during standby of the droplet discharge device 10 in order to prevent the nozzles in the head 20 from drying. Further, in order to remove clogging of the nozzles in the head 20, a cleaning unit 24 for sucking the inside of the nozzles is provided. The cleaning unit 24 can also wipe the ink discharge surface 20P in order to remove dirt on the ink discharge surface 20P in the head 20.

  As shown in FIG. 3, the ink jet head 20 mainly includes a head main body 90, a nozzle plate 92 attached to one surface of the head main body 90, and piezoelectric elements 98 attached to various surfaces of the head main body 90. Yes.

  A plurality of nozzles 91 for discharging droplets are arranged in an array on the nozzle plate 92 that forms the ink discharge surface. The head main body 90 is formed with a plurality of pressure chambers 93 communicating with the nozzles 91. Each pressure chamber 93 is connected to a reservoir 95, and the reservoir 95 is connected to an ink inlet 96. The ink 21 is supplied from the ink introduction port 96 through the reservoir 95 to each pressure chamber 93. On the other hand, a flexible diaphragm 94 is attached to the upper end surface of the head main body 90. Piezo elements 98 are provided on opposite sides of the pressure chambers 93 with the diaphragm 94 interposed therebetween. The piezo element 98 is obtained by sandwiching a piezoelectric material such as PZT between electrodes. The electrodes are connected to a control unit 70 described later.

  When a drive voltage is applied from the control unit 70 to the piezo element 98, the piezo element 98 is expanded or contracted. When the piezoelectric element 98 contracts and deforms, the pressure in the pressure chamber 93 decreases, and the ink 21 flows from the reservoir 95 into the pressure chamber 93. Further, when the piezo element 98 is expanded and deformed, the pressure in the pressure chamber 93 is increased, and the droplet of the ink 21 is ejected from the nozzle 91. The droplet discharge conditions can be controlled by controlling the driving voltage applied to the piezo element 98.

  In addition to the above-described piezo method for changing the pressure in the pressure chamber by deformation of the piezo element, a method for changing the pressure in the pressure chamber by heating the ink to generate bubbles (bubbles), etc. Various known techniques can be applied. Of these, the piezo method is superior in that it does not adversely affect the composition of the material because the ink is not heated.

  As shown in FIG. 1, the substrate transport device 11 includes a robot 51 that transports the substrate 31 between the substrate housing portion 50 that houses the substrate 31 and the table 46 of the droplet discharge device 10 described above. . The robot 51 includes a base 52 placed on the installation surface, a lift shaft 53 that moves up and down relative to the base 52, a first arm 54 that rotates about the lift shaft 53, and a first arm. And a suction pad 56 provided on the lower surface of the distal end of the second arm 55. The robot 51 can transport the substrate 31 by attracting the substrate 31 to the suction pad 64.

  As shown in FIG. 1, the control unit 12 includes a computer 60 that controls each unit in the apparatus, an input device 61 such as a keyboard and a mouse that perform various operations, and a CRT (display that displays screens corresponding to various operations. It comprises a display device 62 such as a Cathode-Ray Tube (LCD) or LCD (Liquid Crystal Display). The computer 60 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like, expands a control program stored in the ROM to a RAM (Random Access Memory), and controls the control program. The CPU controls each part according to the program. The input unit 61 outputs signals corresponding to various operations to the CPU, and the display unit 62 displays a screen according to the signals supplied from the CPU.

  As shown in FIG. 4, the computer 60 includes a control unit 70 that controls the amount of ink ejected by the inkjet head 20 based on the volume of ink ejected by the inkjet head 21. The control unit 70 is connected to a volume measuring unit 71 that measures the volume of the ink, and calculates the ejection amount of the ink ejected by the inkjet head 20 from the volume of the ink measured by the volume measuring unit 71, and this calculation Based on the result, the ejection amount of the ink ejected by the inkjet head 20 is feedback-controlled.

  Specifically, as shown in FIG. 4, the control unit 70 mainly includes an A / D converter 72, a DSP (Digital Signal Processor) 73, and a D / A converter 74. Among these, the A / D converter 72 converts the measurement data measured by the volume measuring unit 71 into a digital signal. When the measurement data is supplied from the A / D converter 71, the DSP 72 calculates the ejection amount of the ink ejected by the inkjet head 20 according to the control program recorded therein, and the calculation result and the reference ejection amount of the ink When the ink discharge amount is out of the reference range, a drive signal for adjusting the drive voltage of the inkjet head 20 is supplied to the D / A converter 74 so that the ink discharge amount falls within the reference range. Output. The D / A converter 74 converts the drive signal supplied from the DSP 73 into an analog signal and outputs the analog signal to the inkjet head 20.

  For example, as shown in FIG. 5, the volume measuring unit 71 includes a light emitting unit 72 that emits light and a light receiving unit 73 that receives light emitted from the light emitting unit, and the light emitting unit 72, the light receiving unit 73, and the like. Are arranged opposite to each other on both sides in the Y direction across the substrate 31. The light emitting unit 72 includes a light source 74 composed of a He—Ne semiconductor laser or the like that emits laser light L having a predetermined wavelength, a condensing optical system 75 that condenses the laser light emitted from the light source 74, and this light condensing. A separation optical system 76 that separates the laser light collected by the optical system 75 and a calibration system 77 that calibrates the laser light emitted from the light source 74 are provided. The light receiving unit 73 includes a light receiving element (PD: Photo Detector) 78 that detects the laser light emitted from the light emitting unit 72, and I / V (current / voltage) conversion that amplifies a light receiving signal detected by the light receiving element 78. And an amplifier 79.

  The volume measuring unit 71 is synchronized with the movement of the inkjet head 20 in the X direction so that the ink i always crosses the optical path of the laser light L between the light emitting unit 72 and the light receiving unit 73. It is possible to move. In addition, the space | interval between the board | substrate 31 mounted in the table 46 and the ink discharge surface 20P of the inkjet head 20 is set, for example to 0.5 mm. Further, in this measurement, an arbitrary nozzle may be selected from a plurality of nozzles provided in the inkjet head 20, and the volume of ink ejected from the nozzle may be measured.

  The volume measuring unit 71 can always measure the volume of ink ejected from the inkjet head 20. Therefore, the control unit 70 can constantly monitor the amount of ink ejected by the inkjet head 20 by the volume measuring unit 71 constantly measuring the volume of ink.

  FIG. 6 is a graph showing the relationship between the ink volume and the ink ejection amount. As shown in the graph of FIG. 6, the ink volume and the ink discharge amount are in a proportional relationship. The volume measuring unit 71 can calculate the volume of the ink from the waveform detected when the ink i crosses the optical path of the laser light L. Therefore, by measuring the volume of ink discharged from the inkjet head 20, the amount of ink discharged can be determined.

  Thereby, for example, even when the nozzles are clogged or the ink discharge amount varies between the nozzles in a short time, the ink discharge amount can be obtained and the drive voltage can be corrected instantaneously. Therefore, in this thin film forming apparatus, it is possible to stably form the functional film on the substrate 31 with a uniform film thickness while suppressing variations in the amount of ink discharged from the inkjet head 20.

  As described above, in the thin film forming apparatus to which the present invention is applied, the functional film is formed on the substrate 31 by obtaining the ejection amount of the ink ejected by the inkjet head 20 from the volume of the ink ejected by the inkjet head 21. In addition, the ink discharge amount can be adjusted in real time, so that the occurrence of defects can be prevented.

(Thin film formation method)
Next, a thin film forming method according to an embodiment of the present invention will be described.
In this embodiment, a case where an organic EL device that is one of electro-optical devices is manufactured will be described as an example. This organic EL device constitutes an active matrix display device. 7 to 9 are manufacturing process cross-sectional views showing the steps of the manufacturing process of the organic EL device forming the active matrix display device using the EL display element.

  First, as shown in FIG. 7A, a transparent display substrate 502 is subjected to a plasma CVD (Chemical Vapor Deposition) method using tetraethoxysilane (TEOS), oxygen gas, or the like as a source gas as necessary. A base protective film (not shown) which is a silicon oxide film having a thickness dimension of about 2000 to 5000 angstroms is formed. Next, the temperature of the display substrate 502 is set to about 350 ° C., and a semiconductor film 520a which is an amorphous silicon film having a thickness of about 300 to 700 angstroms is formed on the surface of the base protective film by plasma CVD. . Thereafter, a crystallization step such as laser annealing or solid phase growth is performed on the semiconductor film 520a to crystallize the semiconductor film 520a into a polysilicon film. Here, in the laser annealing method, for example, a line beam having a beam length of about 400 nm is used with an excimer laser, and the output intensity is about 200 mJ / cm 2. As for the line beam, the line beam is scanned so that a portion corresponding to about 90% of the peak value of the laser intensity in the short dimension direction overlaps each region.

  Next, as illustrated in FIG. 7B, the semiconductor film 520a is patterned to form an island-shaped semiconductor film 520b. On the surface of the display substrate 502 provided with the semiconductor film 520b, a gate insulating film 521a which is a silicon oxide film or a nitride film having a thickness of about 600 to 1500 angstroms by plasma CVD using TEOS or oxygen gas as a source gas. Form. The semiconductor film 520b serves as a channel region and a source / drain region of the current thin film transistor 510, but a semiconductor film (not shown) serving as a channel region and a source / drain region of the switching thin film transistor 509 is also formed at different cross-sectional positions. ing. That is, in the manufacturing process shown in FIGS. 7 to 9, two types of switching thin film transistors 509 and a current thin film transistor 510 are formed at the same time. However, since they are formed in the same procedure, only the current thin film transistor 510 will be described in the following description. Description of the switching thin film transistor 509 is omitted.

  Next, as illustrated in FIG. 7C, a conductive film which is a metal film of aluminum, tantalum, molybdenum, titanium, tungsten, or the like is formed by sputtering and then patterned to form the gate electrode 510A. In this state, high-temperature phosphorus ions are implanted to form source / drain regions 510a and 510b in the semiconductor film 520b in a self-aligned manner with respect to the gate electrode 510A. Note that a portion where impurities are not introduced becomes a channel region 510c.

  Next, as shown in FIG. 7D, after an interlayer insulating film 522 is formed, contact holes 523 and 524 are formed, and relay electrodes 526 and 527 are embedded in the contact holes 523 and 524.

Next, as illustrated in FIG. 7E, the signal line 504, the common power supply line 505, and the scanning line (not illustrated in FIG. 7) are formed over the interlayer insulating film 522. At this time, each wiring of the signal line 504, the common power supply line 505, and the scanning line is formed to be sufficiently thick without being restricted by a thickness dimension necessary for the wiring. Specifically, each wiring may be formed to have a thickness dimension of about 1 to 2 μm, for example. Here, the relay electrode 527 and each wiring may be formed in the same process.
At this time, the relay electrode 526 is formed of an ITO film described later.

  Then, an interlayer insulating film 530 is formed so as to cover the upper surface of each wiring, and a contact hole 532 is formed at a position corresponding to the relay electrode 526. An ITO film is formed so as to fill the contact hole 532, and this ITO film is patterned to electrically connect the source / drain region 510a to a predetermined position surrounded by the signal line 504, the common power supply line 505, and the scanning line. A pixel electrode 511 connected to is formed.

Here, in FIG. 7E, a portion sandwiched between the signal line 504 and the common power supply line 505 corresponds to a predetermined position where the optical material is selectively disposed. A step 535 is formed between the predetermined position and the periphery by the signal line 504 and the common power supply line 505.
Specifically, the predetermined position is lower than the surrounding area, and a concave step 535 is formed.

  Next, using the thin film forming apparatus shown in FIG. 1, an EL light emitting material that is a functional liquid material is discharged onto the display substrate 502 on which the above-described pretreatment has been performed. That is, as shown in FIG. 8A, the functionality for forming the hole injection layer 513A corresponding to the lower layer portion of the light emitting element 140 with the upper surface of the display substrate 502 subjected to the pretreatment facing upward is formed. An optical material 540A, which is a solution precursor dissolved in a solvent as a liquid, is ejected using the above-described droplet ejection device 10 and selectively applied to a predetermined position area surrounded by a step 535. To do.

  As an optical material 540A for forming the hole injection layer 513A by this ejection, polyphenylene vinylene whose polymer precursor is polytetrahydrothiophenylphenylene, 1,1-bis- (4-N, N-ditolylaminophenyl) ) Cyclohexane, tris (8-hydroxyquinolinol) aluminum and the like are used.

  At the time of ejection, the liquid optical material 540A having fluidity tends to spread in the plane direction because of its high fluidity, but the step 535 is formed so as to surround the applied position. Unless the discharge amount per one time of the optical material 540A is made extremely large, the optical material 540A is prevented from spreading beyond the predetermined position beyond the step 535.

  Next, as illustrated in FIG. 8B, the solvent of the liquid optical material 540 </ b> A is evaporated by heating or light irradiation to form a solid thin hole injection layer 513 </ b> A over the pixel electrode 511. 8A and 8B are repeated as many times as necessary, and finally, a hole injection layer 513A having a sufficient thickness is formed as shown in FIG. 8C.

  Next, as shown in FIG. 9A, in a state where the upper surface of the display substrate 502 is directed upward, a solvent as a functional liquid for forming the organic semiconductor film 513B in the upper layer portion of the light emitting element 513 is used. The dissolved optical material 540B, which is a dissolved organic fluorescent material, is discharged using the thin film forming apparatus shown in FIG. 1 and is selectively applied in a predetermined position surrounded by a step 535. To do. Note that the optical material 540B is also prevented from spreading outside the predetermined position beyond the step 535 in the same manner as the above-described ejection of the optical material 540A.

  As an optical material 540B for forming the organic semiconductor film 513B by this discharge, cyanopolyphenylene vinylene, polyphenylene vinylene, polyalkylphenylene, 2,3,6,7-tetrahydro-11-oxo-1H · 5H · 11H (1 ) Penzobilano [6,7,8-ij] -quinolidine-10-carboxylic acid, 1,1-bis- (4-N, N-ditolylaminophenyl) cyclohexane, 2-13.4'-dihydroxyphenyl)- 3,5,7-trihydroxy-1-benzopyrylium perchlorate, tris (8-hydroxyquinolinol) aluminum, 2,3 · 6 · 7-tetrahydro-9-methyl-11-oxo-1H · 5H · 11H ( 1) Benzopyrano [6,7,8-ij] -quinolidine, aromatic diamine derivative (TD P), oxydiazole dimer (OXD), oxydiazole derivative (PBD), distilarylene derivative (DSA), quinolinol metal complex, beryllium-benzoquinolinol complex (Bebq), triphenylamine derivative (MTDATA), distyryl Derivatives, pyrazoline dimer, rubrene, quinacridone, triazole derivatives, polyphenylene, polyalkylfluorene, polyalkylthiophene, azomethine zinc complex, polyphyllin zinc complex, benzoxazole zinc complex, phenanthroline europium complex and the like are used.

Next, as illustrated in FIG. 9B, the solvent of the optical material 540B is evaporated by heating, light irradiation, or the like, so that a solid thin organic semiconductor film 513B is formed over the hole injection layer 513A.
9A and 9B are repeated as many times as necessary, and finally an organic semiconductor film 513B having a sufficient thickness is formed as shown in FIG. 9C. The light-emitting element 513 is configured by the hole injection layer 513A and the organic semiconductor film 513B. Finally, as shown in FIG. 9D, the reflective electrode 512 is formed on the entire surface of the display substrate 502 or in a stripe shape, and the display device 501 is manufactured.

  As described above, in this embodiment, since the thin film forming apparatus shown in FIG. 1 described above is used, materials that are wasted in the manufacturing process of the organic EL device can be reduced, and high-quality organic materials can be manufactured at low cost. An EL device can be manufactured. Moreover, according to this embodiment, since it manufactures using the droplet discharge apparatus 10 provided with the inkjet head 20 mentioned above, about organic EL apparatus (board | substrate) which makes a large-screen display apparatus more quickly and with high resolution Can be manufactured. The droplet discharge device 10 can perform stable film formation with a uniform film thickness while suppressing variations in the discharge amount of the ink discharged from the inkjet head 20. Therefore, it is possible to manufacture a large-screen organic EL device at a high quality and at a low cost while preventing the occurrence of defects.

  The thin film forming apparatus and the thin film forming method of the present embodiment are not limited to the above-described manufacturing of the organic EL device, but are widely applied when forming a functional film such as forming a metal wiring or a color filter of a liquid crystal device. Is possible. In either case, the functional film can be formed with high accuracy.

(Electronics)
Next, an electronic apparatus including the organic EL device will be described.
FIG. 10A is a perspective view showing an example of a mobile phone. In FIG. 10A, reference numeral 1000 denotes a mobile phone main body, and reference numeral 1001 denotes a display unit including the organic EL device of the above embodiment. FIG. 10B is a perspective view illustrating an example of a wristwatch type electronic device. In FIG. 10B, reference numeral 1100 denotes a watch body, and reference numeral 1101 denotes a display unit including the organic EL device of the above embodiment. FIG. 10C is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In FIG. 10C, reference numeral 1200 denotes an information processing apparatus, reference numeral 1202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing apparatus body, and reference numeral 1206 denotes a display unit including the organic EL device of the above embodiment.

  Since the organic EL device of the electronic apparatus shown in FIG. 10 is manufactured using the thin film forming apparatus and the thin film forming method of the above-described embodiment, a high quality image can be displayed and no malfunction occurs. Can be offered at a price.

  The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention, and the specific materials and configurations described in the embodiment. These are merely examples, and can be changed as appropriate.

It is a perspective view which shows a thin film forming apparatus. It is a perspective view which shows a droplet discharge device. It is sectional drawing which shows an inkjet head. It is a block diagram which shows a control part. It is a block diagram which shows a volume measurement part. 5 is a graph showing the relationship between ink volume and ink discharge amount. It is sectional drawing which shows the procedure of the manufacturing process of an organic electroluminescent apparatus. It is sectional drawing which shows the procedure of the manufacturing process of an organic electroluminescent apparatus. It is sectional drawing which shows the procedure of the manufacturing process of an organic electroluminescent apparatus. It is a perspective view which shows an electronic device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Droplet discharge apparatus, 11 ... Board | substrate conveyance apparatus, 12 ... Computer, 20 ... Inkjet head (droplet discharge means), 70 ... Control part, 71 ... Volume measurement part, 72 ... Light emission part, 73 ... Light reception part

Claims (2)

A thin film forming method for forming a thin film by landing droplets of a functional liquid discharged by a droplet discharge means on a substrate,
Thin film formation characterized in that the volume of a droplet discharged by the droplet discharge means is measured and the discharge amount of the droplet discharged by the droplet discharge means is controlled based on the measured volume of the droplet Method. A thin film forming apparatus for forming a thin film by landing droplets of a functional liquid on a substrate,
Droplet discharge means for discharging droplets of the functional liquid;
Volume measuring means for measuring the volume of a droplet discharged by the droplet discharging means;
A thin film forming apparatus comprising: a control unit that controls a discharge amount of a droplet discharged by the droplet discharge unit based on a volume of the droplet measured by the volume measuring unit.

Images