JP2007115846A - Spacer for supporting circuit board and circuit board unit using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a spacer for supporting a circuit board in which an arbitrary number of circuit boards are isolated only by a given interval so as to be easily laminated. <P>SOLUTION: The spacers 10 for supporting a circuit board are inserted into through-holes 32a to 32c formed in a plurality of circuit boards 30a to 30c, for laminating the circuit boards 30a to 30c by isolating them only by a predetermined interval. The spacer 10 comprises: shafts 14 which connect a plurality of steps 20a to 20c for mounting the circuit boards 30a to 30c in a tapering stepwise condition, and are inserted into the through-holes 32a to 32c; and latch detents 16a to 16c which are projected to a radially outward direction in the respective steps 20a to 20c to be elastically deformed. The latch detents 16a to 16c are provided at locations corresponding to each thickness of the circuit boards 30a to 30c in the respective steps 20a to 20c. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a spacer for laminating a plurality of circuit boards and a circuit board unit in which a plurality of circuit boards are laminated.

  In recent electronic devices, the scale of an electric circuit to be mounted has been increased with the improvement in performance, while the demand for reduction in size and weight is high, and the size of a circuit board cannot be increased. Thus, an electric circuit is divided into a plurality of circuit boards, and another circuit board is placed on one circuit board so as to be parallel in the vertical direction, and these are electrically connected. .

  When stacking such circuit boards, upper and lower circuits are used to avoid electrical troubles such as damage to electronic parts and short circuits due to contact between the electronic parts mounted on the circuit board and the circuit board stacked on the upper side. Between the boards, screw-type or snap-fit support members (spacers) are arranged, and in order to electrically connect each circuit board, connectors are provided at corresponding positions on the upper and lower circuit boards. (For example, refer to Patent Documents 1 and 2).

  However, in the case of a screw-type spacer, in addition to an increase in the number of parts, there are problems in assembly workability, and in a snap-fit type spacer, there are problems that three or more circuit boards cannot be stacked. In addition, an expensive connector member is required to connect the upper and lower circuit boards, which increases the cost.

  On the other hand, as shown in FIG. 5, the pin-type terminal 104 is inserted into the through-hole 102 provided in the circuit board 100, and the through-hole 102 and the pin-type terminal 104 are soldered, whereby the stacked circuit board 100 is electrically connected. And a circuit board stacking structure in which a predetermined interval is provided between the circuit boards 100 by interposing the spacers 106 inserted into the pin-type terminals 104 between the circuit boards 100. (For example, see Patent Document 3).

In the above laminated structure, it is difficult to place solder only in a very narrow gap between the through hole 102 and the pin-type terminal 104, and the solder 108 is deposited on the surface of the circuit board 100. When the spacer 106 interposed therebetween contacts the deposited solder 108, there is a possibility that the soldering between the through hole 102 and the pin-type terminal 104 may be broken and disconnected, and the connection reliability is low. is there.
JP 2003-283072 A JP 2003-163431 A JP 2002-374049 A

  The present invention has been made in view of the above problems, and an object thereof is to provide a circuit board supporting spacer capable of easily laminating an arbitrary number of circuit boards and a circuit board unit using the same.

  The invention according to claim 1 is a circuit board support spacer that is inserted into through holes formed in a plurality of circuit boards, and is stacked with the circuit boards being separated by a predetermined interval. A plurality of stepped portions connected in a tapered staircase shape, a shaft portion inserted into the through hole, and an elastically deformable locking claw projecting radially outward at each stepped portion The locking claw is provided at a position corresponding to the thickness of the circuit board in each step portion.

  The invention according to claim 2 is a circuit board support spacer that is inserted into through holes formed in a plurality of circuit boards, and is stacked with the circuit boards being separated by a predetermined interval. A plurality of stepped portions connected to each other in a tapered step shape, and a shaft portion inserted into the through-hole, and for electrically connecting the circuit board to at least the surface of the stepped portion A metal plating process is performed.

According to a third aspect of the present invention, there is provided a circuit board unit in which a plurality of circuit boards are separated from each other by a predetermined interval, and a shaft part formed by connecting a plurality of step parts for mounting the circuit boards in a tapered step shape. And an elastically deformable locking claw provided on each step portion and projecting in the radially outward direction, and the locking claw is provided at a position corresponding to the thickness of the circuit board in each step portion. A circuit board supporting spacer, wherein the circuit board has a dimension larger than the outer diameter of the stepped portion at the stacked position and smaller than the outer diameter of the stepped portion below the stepped portion. Holes are provided,
The circuit board is sandwiched between an upper end surface of the step portion having a size larger than the diameter of the through hole and the locking claw.

  According to a fourth aspect of the present invention, there is provided a circuit board unit in which a plurality of circuit boards are separated from each other by a predetermined interval, and a shaft part formed by connecting a plurality of step parts for mounting the circuit boards in a tapered step shape. A circuit board supporting spacer having a metal plating layer for electrically connecting the circuit board to at least the surface of the step part, and the circuit board has an outer diameter of the step part at the stacked position. A dimension that is larger and smaller than the outer diameter of the step below the step is provided with a through hole and a land portion at the periphery of the through hole, and the circuit board is larger than the diameter of the through hole. The land portion and the metal plating layer are soldered to each other.

  According to the present invention, an arbitrary number of circuit boards can be easily stacked, and the stacked circuit boards can be electrically connected at low cost.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view of a circuit board support spacer 10 according to the first embodiment, and FIG. 2 is a cross-sectional view of the circuit board unit 1 according to the first embodiment, using the circuit board support spacer 10. It is a fragmentary sectional view showing the state where circuit boards 30a-30c were supported.

  As shown in FIG. 1, a circuit board supporting spacer (hereinafter simply referred to as a spacer) 10 of this embodiment is a spacer 10 for laminating three circuit boards 30a to 30c, and is made of polyethylene, polypropylene, or the like. This is an integrally molded product made of synthetic resin, and has a shaft portion 14 and locking claws 16a to 16c that project from the outer peripheral surface thereof.

The shaft portion 14 includes a base portion 18 and three step portions 20a to 20c which are connected to each other in a tapered step shape so that the diameter thereof is smaller than that of the base portion 18 and gradually increases toward the upper side. That is, the outer diameter dimensions of the base portion 18, the lower step portion (upper step portion) 20 a, the middle step portion (middle step portion) 20 b, and the upper step portion (lower step portion) 20 c are respectively d _b , d ₁ , d ₂ , If d ₃ , then d _b > d ₁ > d ₂ > d ₃ . On the outer peripheral surfaces of the step portions 20a to 20c, locking claws 16a to 16c that are formed in a taper-shaped cross section extending downward and are elastically deformable are provided from the upper end surfaces of the base portion 18, the lower step portion 20a, and the middle step portion 20b. The protrusion is provided at a height corresponding to the thickness of the circuit board 30. Note that the locking claws 16a to 16c may be provided over the entire outer peripheral surface of each step 20a to 20c, or may be provided at predetermined intervals in the circumferential direction.

As shown in FIG. 2, through-holes 32a to 32c having different inner diameters are formed in the three circuit boards 30a to 30c to be stacked. Specifically, a through hole 32a provided on the circuit board 30a which is supported on the lower part has an outer diameter d _b is less than the inner diameter of the larger and the base portion than the lower outer diameter d _1, supported in the middle through holes 32b provided on the circuit board 30b that is has a Little inner diameter than the outer diameter d ₁ of the large and the lower portion 20a than the outer diameter d ₂ of the middle portion 20b, the circuit substrate supported in the upper through hole 32c provided in 30c has an outer diameter _{d 2} smaller than the inner diameter of the large and middle portion 20b than the outer diameter _{d 3} of the upper portion 20c.

  Further, the lengths of both ends of the locking claws 16a to 16c protruding from the step portions 20a to 20c are slightly larger than the inner diameters of the through holes 32a to 32c. It can be inserted into each of the through holes 32a to 32c while being elastically deformed.

  In FIG. 2, only one through hole 32 a to 32 c is shown enlarged for each circuit board 30 a to 30 c, but in order to stably stack each circuit board 30 a to 30 c, through holes are provided at a plurality of places. 32 a to 32 c are preferably provided and supported by the plurality of spacers 10.

  In order to obtain a circuit board unit by separating and laminating the circuit boards 30a to 30c by a predetermined interval using the spacer 10 configured as described above, first, the circuit board 30a is provided on the lower circuit board 30a. The spacer 10 is press-fitted into the formed through-hole 32a, whereby the locking claw 16a provided in the lower step portion 20a is inserted while being elastically deformed, and a circuit is formed between the locking claw 16a and the upper end surface of the base portion 18. The substrate 30a can be held.

  Next, the spacer 10 is press-fitted into the through-hole 32b provided in the circuit board 30b supported in the middle stage, so that, similarly to the circuit board 30a, between the locking claw 16b and the upper end surface of the lower stage part 20a. The circuit board 30b can be clamped.

  Finally, the spacer 10 is press-fitted into the through hole 32c provided in the circuit board 30c supported on the upper stage, and between the locking claw 16c and the upper end surface of the middle stage part 20b, as in the case of the circuit boards 30a and 30b. The circuit board 30a can be held between the two.

  In this way, the circuit boards 30a and 30b supported at the lower stage and the middle stage are laminated by being separated by an interval corresponding to the height of the lower stage part 20a, and the circuit boards 30b and 30c supported at the middle stage and the upper stage are laminated. Thus, it is possible to obtain the circuit board unit 1 which is laminated by being separated by an interval corresponding to the height of 20b.

  In this embodiment, the spacer has the shaft portion 14 formed by connecting the three step portions 20a to 20c. However, the present invention is not limited to this, and any number (2, 4, 5... N) may be connected in a tapered staircase shape, so that a number of circuit boards equal to the number of provided stages can be isolated and supported by a predetermined distance.

  In the case of the spacer 10 of the present embodiment, even when three or more circuit boards are stacked, the circuit board 30 can be supported by being separated by a predetermined interval by press-fitting the spacers. Excellent in properties.

(Second Embodiment)
FIG. 3 is a cross-sectional view of the circuit board unit 2 according to the second embodiment, and is a partial cross-sectional view showing a state in which the circuit boards 30 a to 30 c are supported using the spacer 50. The same components as those shown in FIG. 2 are denoted by the same reference numerals, and redundant description thereof is omitted.

  As shown in FIG. 3, at least the surface of each step 20a-20c of the spacer 50 is subjected to a metal plating process to form a metal plating layer 52, and each through-hole provided in each circuit board 30a-30c. Land portions 34a, 34b, and 34c that are electrically connected to the electric circuits formed on the circuit boards 30a to 30c are formed on the peripheral portions of the holes 32a to 32c, respectively.

  In order to stack the circuit boards 30a to 30c separately by a predetermined distance using the spacer 50 having such a configuration, first, the spacer 50 is inserted into the through hole 32a provided in the circuit board 30a supported in the lower stage. The land portion 34a and the metal plating layer 52 are soldered 60a. Next, the spacer 50 is inserted into the through hole 32b provided in the circuit board 30b supported in the middle stage, and the land portion 34b and the metal plating layer 52 are soldered 60b. Finally, the spacer 50 is inserted into the through hole 32c provided in the circuit board 30c supported on the upper stage, and the land portion 34c and the metal plating layer 52 are soldered 60c.

  In this manner, the circuit boards 30a to 30c are respectively supported by being separated from each other by a predetermined interval by being placed on the upper end surfaces of the base portion 18, the lower step portion 20a, and the middle step portion 20b, and the land portions 34a to 34c. Circuit board unit 2 electrically connected by soldering 60a-60c of 34c and metal plating layer 52 can be obtained.

  According to the spacer 50 of the present embodiment, the circuit boards 30a to 30c can be supported by being separated by a predetermined interval, and the stacked circuit boards 30a to 30c can be electrically connected without using an expensive connector member. In addition, since the spacer 50 and the circuit boards 30a to 30c are fixed by soldering, there is no possibility that the spacer breaks the soldering and breaks, and the connection reliability is high.

  In this embodiment, the spacer has the shaft portion 14 formed by connecting the three step portions. However, the present invention is not limited to this, and an arbitrary number (2, 4, 5) is used. ... the stepped portions of n) may be connected in a tapered staircase shape, so that a number of circuit boards equal to the number of provided stages are separated and supported by a predetermined distance, and each circuit board is electrically connected. Can do.

(Example of change)
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  FIG. 4 is a cross-sectional view of the circuit board unit 3 according to the modified example, and is a partial cross-sectional view showing a state in which the circuit boards 30 a to 30 c are supported using the spacer 70. The same components as those shown in FIGS. 2 and 3 are denoted by the same reference numerals, and redundant description thereof is omitted.

  This modified example combines the characteristics of the first and second embodiments described above. That is, the spacer 70 according to the present modification includes the first claw 16 a to 16 c that protrudes radially outward from the outer peripheral surface of the three step portions 20 a to 20 c connected in a tapered step shape. The surface of the spacer 10 according to the embodiment, specifically, at least the surfaces of the step portions 20a to 20c and the locking claws 16a to 16c are subjected to a metal plating process to form a metal plating layer 72.

  In order to stack the circuit boards 30a to 30c using the spacer 70 having such a configuration, the spacer 70 is first press-fitted into the circuit board 30a supported in the lower stage, and then the land portion 34a and the metal plating layer 52 are soldered. Do 62a. Next, as in the case of the circuit board 30a supported at the lower stage, the spacer 70 is press-fitted and soldered 62b to the circuit board 30b supported at the middle stage, and finally, the spacer 70 is applied to the circuit board 30c supported at the upper stage. The circuit board unit 3 is obtained by performing the press-fitting and soldering 62c.

  In the obtained circuit board unit 3, the circuit boards 30 a to 30 c are sandwiched between the locking claws 16 a to 16 c and the upper end surfaces of the base portion 18 and the step portions 20 a and 20 b, and therefore receive an upward external force. However, there is no fear of breaking the soldering 62a to 62c and disconnection, and the connection reliability can be further improved.

It is a perspective view of the circuit board support spacer which concerns on 1st Embodiment. It is a fragmentary sectional view showing the state where the circuit board was supported using the circuit board support spacer concerning a 1st embodiment. It is a fragmentary sectional view showing the state where the circuit board was supported using the circuit board support spacer concerning a 2nd embodiment. It is a fragmentary sectional view showing the state where the circuit board was supported using the circuit board support spacer concerning a modification. It is the front view which showed the laminated structure of the conventional circuit board.

Explanation of symbols

1, 2, 3 ... Circuit power supply unit 10, 50, 70 ... Circuit board support spacer 14 ... Shaft part 16a, 16b, 16c ... Locking claw 18 ... Base part 20a, 20b, 20c ... Step part 30a, 30b, 30c ... Circuit boards 32a, 32b, 32c ... Through holes 34a, 34b, 34c ... Land part 52 ... Metal plating layer

Claims (4)

A circuit board supporting spacer that is inserted into through holes formed in a plurality of circuit boards and is laminated by separating the circuit boards by a predetermined distance,
A plurality of stepped portions for mounting the circuit board are concatenated in a tapered step shape, and a shaft portion inserted into the through hole, and an elastic deformation projecting radially outward at each stepped portion. A circuit board support spacer, wherein the circuit board support spacer is provided at a position corresponding to the thickness of the circuit board in each step portion. A circuit board supporting spacer that is inserted into through holes formed in a plurality of circuit boards and is laminated by separating the circuit boards by a predetermined distance,
A plurality of stepped portions for mounting the circuit board are connected in a tapered staircase shape, and a shaft portion is inserted into the through hole, and the circuit board is electrically connected to at least the surface of the stepped portion. A spacer for supporting a circuit board, wherein a metal plating process for connection to the substrate is performed. In a circuit board unit in which a plurality of circuit boards are separated by a predetermined interval and stacked,
A shaft portion formed by connecting a plurality of stepped portions for mounting the circuit board in a tapered staircase shape, and an elastically deformable locking claw provided on each stepped portion and projecting in the radially outward direction. The latching claw has a circuit board supporting spacer provided at a position corresponding to the thickness of the circuit board in each step portion;
The circuit board is provided with a through hole formed in a size larger than the outer diameter of the stepped portion at the stacked position and smaller than the outer diameter of the stepped portion below the stepped portion,
The circuit board unit, wherein the circuit board is sandwiched between an upper end surface of the step portion having a size larger than the diameter of the through hole and the locking claw. In a circuit board unit in which a plurality of circuit boards are separated by a predetermined interval and stacked,
A circuit board comprising a shaft part formed by connecting a plurality of stepped parts for mounting the circuit board in a tapered step shape and a metal plating layer for electrically connecting the circuit board to at least the surface of the stepped part. Having support spacers,
The circuit board is formed to have a size larger than the outer diameter of the stepped portion at the stacked position and smaller than the outer diameter of the stepped portion below the stepped portion, and a land portion at a peripheral portion of the throughhole and the throughhole. Is provided,
The circuit board unit, wherein the circuit board is placed on an upper end surface of the step portion having a size larger than the diameter of the through hole, and the land portion and the metal plating layer are soldered.

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