JP2007115624A - Transparent light emitting coated film and its forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transparent coated film which emits light by making electric current flow. <P>SOLUTION: This is a transparent coated film in which a conductor layer (A), dielectric layer (B), light emitter layer (C), conductor layer (D), and surface layer (E) are formed on a substrate in the order of (A), (B), (C), (D), and (E), and each of the above layers (A)-(E) is formed by paint composition and emits light by making the electric current flow. The dielectric layer (B) and the light emitter layer (C) are formed by a paint composition which contains powder having a particle size of 0.38 μm or less and a binder component. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a transparent luminescent coating film and a method for forming the same.

  EL devices composed of a plurality of layers such as a fluorescent layer are widely used as various display devices and backlights. The formation of each layer constituting the EL element has been generally performed by a vapor deposition method, an inkjet method, an ultraviolet irradiation method, or a screen printing method.

  On the other hand, by forming each of the above-mentioned layers by painting, a coating film that emits light on a substrate having a large area or a three-dimensional shape, which was impossible with the conventional methods, is formed. (See Patent Document 1). However, since the conductor layer, dielectric layer and phosphor layer obtained by this method are opaque, a transparent luminescent coating film cannot be obtained.

On the other hand, an organic EL element which is transparent and can control light emission by turning on / off current is disclosed, but this is obtained by laminating each layer into a film and obtained by painting a paint. It is not (refer patent document 2).
JP 2004-259572 A JP-A-2005-97774

  An object of the present invention is to provide a transparent coating film obtained by painting and capable of controlling light emission with or without energization.

The transparent coating film of the present invention has a conductor layer (A), a dielectric layer (B), a light emitter layer (C), a conductor layer (D), and a surface layer (E) (A) on a substrate. ), (B), (C), (D), and (E) in this order, and the layers (A) to (E) are formed of the coating composition, and emit light when an electric current is applied.
The dielectric layer (B) can be formed of a coating composition containing a high dielectric powder having a particle size of 0.38 μm or less and a binder component, and the phosphor layer (C) is 0. It can be formed by a coating composition containing a phosphor powder having a particle size of .38 μm or less and a binder component. Furthermore, the conductor layer (A) and the conductor layer (D) can each be formed of a coating composition containing a conductive substance, and the surface layer (E) is formed of a clear coating composition. be able to.
The method for forming a transparent luminescent coating film of the present invention comprises a conductive layer (A), a dielectric layer (B), a luminescent layer (C), a conductive layer (D), a surface layer (E) on a substrate. ) In the order of (A), (B), (C), (D), and (E), each layer is formed by painting.

  The light-emitting coating film of the present invention is transparent when no current is applied and emits light when current is applied. For this reason, the light-emitting coating film of the present invention can be seen through the base color when not emitting light, and the appearance changes greatly by emitting light when energized. The present invention can be applied to large structures such as display boards, building components such as doors and walls, and articles such as cars, furniture, and mobile phones. In addition, since the formation of the transparent light-emitting coating film of the present invention is performed by a normal coating method, there is no need for a special apparatus like a patterning method such as screen printing used for forming a conventional EL element. It is also possible to obtain a large-area light emitter.

  Hereinafter, the transparent light-emitting coating film according to the present invention and the structure of the forming method will be described. The term “transparent” in the present specification refers to a state in which, when this coating film is placed on newspaper, for example, the letters of the newspaper can be seen through and read, and so-called translucent material can be included. Specifically, the transmittance measured with a spectrophotometer is 60% or more.

  In the luminescent coating film of the present invention, the conductor layer (A), the dielectric layer (B), the luminescent layer (C), the conductor layer (D), and the surface layer (E) are on the base material (A). , (B), (C), (D), (E) in order, it is a multi-layer coating film in which each layer is formed by painting, is transparent when no current is passed, and emits light when current is passed To do.

  The base material is not particularly limited as long as a layer can be formed thereon with a paint. For example, inorganic substances such as glass, and organic substances such as resins and plastics can be used. Furthermore, the base material is not limited to a plate shape, and may have a three-dimensional shape. Moreover, the said base material may comprise the surface of a structure.

  In the luminescent coating film of this invention, the said conductor layer (A) exists in the surface of the said base material. The conductor layer (A) is formed by applying a coating composition containing a conductive substance. Examples of the conductive substance include conductive polymers such as polyacetylene, polypyrrole, polythiophene, polyparaphenylene vinylene, polyethylenedioxythiophene, polyaniline, and polyacetone.

  The coating composition containing the conductive material for forming the conductor layer (A) usually contains a solvent. The amount of the solvent in the coating composition is not particularly limited as long as a transparent film is obtained after drying. For example, the ratio of the conductive material to the solvent is such that the concentration of the conductive material is 1. The value is preferably at least mass%. For example, water, acetone, ethanol, or ethyl acetate can be used as the solvent. The coating composition may contain an additive for adjusting the physical properties of the coating film.

  Further, as the conductive substance, an inorganic conductive substance can be used instead of the conductive polymer. For example, indium tin oxide (ITO) is preferably used as the inorganic conductive material. When the inorganic conductive material is used, since the inorganic conductive material itself does not have a film-forming property as compared with the conductive polymer, a binder component is generally used in combination. Examples of the binder component include acrylic resin, polyester resin, epoxy resin, urethane resin, and fluorine resin. In addition, the binder component includes a curing agent such as a melamine compound, an optionally blocked isocyanate, an epoxy compound, and a curing agent such as a dryer when the resin has an unsaturated bond. It may be included. The mass ratio between the inorganic conductive material and the binder component is not particularly limited as long as it becomes a transparent layer after drying, but the amount of the inorganic conductive material is smaller than the mass of the binder component. Is preferred.

The conductor layer (A) is formed by applying a coating composition containing the conductive substance on the substrate and drying it. The coating composition can be applied by various known and commonly used methods such as roll coater coating, spray coating, roller coating, brush coating, and dip coating. Further, the coating film can be dried by conditions suitable for the coating composition used, for example, room temperature drying or heat drying.
The film thickness of the conductive layer (A) is preferably 5 to 10 μm, for example.

  In addition, the electrode for applying a voltage with respect to the said conductor layer (A) is installed in the said electroconductive layer (A). The method for installing this electrode will be described in the coating method described later.

In the transparent light-emitting coating film of the present invention, the dielectric layer (B) is formed on the conductor layer (A) by coating.
The coating composition for forming the dielectric layer (B) contains a high dielectric powder and a binder component. The high dielectric powder is preferably a high dielectric constant such as titanium oxide, barium titanate, lead titanate, strontium titanate.

  The particle diameter of the high dielectric powder is preferably 0.38 μm or less. Since the particle diameter corresponding to a wavelength outside the visible region is 0.38 μm, if the particle diameter of the high dielectric powder is larger than this value, the resulting coating film may not be transparent. The upper limit value is determined by the transmission of the sieve. On the other hand, the lower limit of the particle diameter of the high dielectric powder is not particularly defined, but can be set to 0.01 μm, for example. This value can be obtained by a measuring instrument such as laser light scattering in addition to the above sieve.

  In the coating composition for forming the dielectric layer (B), the mass ratio of the high dielectric powder and the binder component is not particularly limited as long as a transparent layer is obtained after drying. A preferable mass ratio of the high dielectric powder / binder component is 1/100 to 10/1 in terms of solid content.

  As the binder component contained in the coating composition, those described for the conductor layer (A) can be used. The coating composition may contain an additive for adjusting the physical properties of the coating film.

  The dielectric layer (B) is formed by applying a coating composition for forming the dielectric layer (B) on the previously formed conductor layer (A) and drying it. . About the application | coating and drying, the content demonstrated in the said conductor layer (A) is applicable. The film thickness of the conductive layer (A) is preferably 5 to 10 μm, for example.

  In the luminescent coating film of the present invention, the luminescent layer (C) is formed on the dielectric layer (B). For the formation of the light emitting layer (C), a light emitting layer forming coating composition comprising a light emitting powder and a binder component is used. As the above-mentioned phosphor powder, for example, a powder obtained by adding Cu, Mn, Al, Cl, Br, or the like as an activator to zinc sulfide or zinc selenide is preferable.

  Further, as described above, the particle diameter of the phosphor powder is preferably 0.38 μm or less. If the particle diameter is larger than 0.38 μm, the resulting layer may not be transparent. Although the lower limit of the particle diameter of the said light-emitting body powder is not specifically limited, For example, it can be set as 0.01 micrometer.

  The phosphor layer forming coating composition is obtained by dissolving the phosphor powder in a binder component. The mass ratio of the phosphor powder to the binder is preferably such that the phosphor powder is less than the binder component, more preferably 4/100 or less in terms of the phosphor powder / binder component mass ratio.

As the binder component contained in the phosphor coating composition, those described in the conductor layer (A) can be used. The coating composition may contain an additive for adjusting the physical properties of the coating film. Further, for the application and drying, the contents described for the conductor layer (A) can be applied.
The film thickness of the transparent luminescent layer (C) is preferably 10 to 40 μm, for example.

In the luminescent coating film of the present invention, the conductor layer (D) is formed on the luminescent layer (C). The formation of the conductor layer (D) can be performed based on the method described in the conductor layer (A). The film thickness of the conductive layer (D) is preferably 5 to 10 μm, for example.
The coating composition for forming the conductor layer (D) may be the same as or different from the coating composition for forming the conductor layer (A). Moreover, the electrode for applying a voltage is installed in the said conductor layer (D) similarly to the said conductor layer (A).

  In the luminescent coating film of the present invention, the surface layer (E) is formed as the uppermost layer on the conductor layer (D). For the formation of the surface layer (E), a clear coating composition is used. The clear coating composition is not special, and those containing the binder component described in the conductor layer (A) can be used. About the application | coating and drying, the content demonstrated in the said conductor layer (A) is applicable. It is preferable that the film thickness of the said transparent surface layer (E) is 20-50 micrometers, for example.

  The light emitting coating film of the present invention is a multilayer comprising the conductor layer (A), the dielectric layer (B), the light emitter layer (C), the conductor layer (D), and the surface layer (E). Although it is a coating film and the film thickness of this multilayer coating film is not specifically limited, For example, it is 45-120 micrometers.

  Next, the formation method of the transparent light emitting coating film of this invention is demonstrated. The method for forming a transparent luminescent coating film of the present invention comprises a conductive layer (A), a dielectric layer (B), a luminescent layer (C), a conductive layer (D), a surface layer (E) on a substrate. ) In the order of (A), (B), (C), (D), and (E), each layer is formed by painting. Regarding the formation of each of the above layers, since the contents described in the respective layers forming the light-emitting coating film are applied as they are, the prevention of the interphase between the respective layers and the installation of the electrodes will be described below.

  In the method for forming a light-emitting coating film of the present invention, when the next layer is formed on the previously formed layer, a state in which mixing between the two layers is prevented, that is, the surface of the previously formed layer is It is necessary to be in a state where it is not dissolved by application of the coating composition for forming the next layer. Therefore, it is preferable that the layer before coating is cured in advance, but it is not always necessary that the curing is completely completed, and the layer is cured to such an extent that a mixed layer is not formed with the previously formed layer. Once advanced, a coating composition for forming the next layer can be applied. In addition, it is preferable to use a coating composition for forming the previously formed layer and the next layer that is hardly compatible with each other.

  Moreover, in the formation method of the light emitting coating film of this invention, an electrode is installed with respect to the said conductor layer (A) and conductor layer (D). When this electrode is placed on the conductor layer (A), for example, before coating the coating composition for forming the dielectric layer (B), the end of the conductor layer (A) is formed. After applying a mask to the part with a tape or the like, the coating composition for forming the dielectric layer (B) is applied, and then the mask is removed to apply the dielectric layer (B) on the top. The conductor layer (A) portion that is not exposed can be exposed, and an electrode can be placed on it. In addition, when performing with respect to the said conductor layer (D), the coating composition for forming the said dielectric material layer (B) becomes a clear coating composition.

  The light-emitting coating film of the present invention is obtained by the above-described forming method. On the base material, the conductive layer (A), the dielectric layer (B), the light-emitting layer (C), and the conductive layer (D ) And the surface layer (E) are formed in the order of (A), (B), (C), (D), and (E).

  Hereinafter, although an example and a comparative example are given and explained still more concretely, the present invention is not limited only to these examples. % And parts are based on mass unless otherwise specified.

Production Example 1: Production of Coating Composition a-1 Containing Conductive Substance 5 parts of conductive substance solution EL-P3040 (manufactured by AGFA, 3.5% polyethylenedioxythiophene solution which is a conductive polymer) and 5 parts of ethyl acetate was added to T.C. The mixture was stirred with a K homodisper to obtain a coating composition a-1 containing a conductive substance.

Production Examples 2 to 5: Production of Coating Compositions a-2 to a-5 Containing Conductive Substances In Production Example 1, the amount of the conductive polymer as the conductive substance and the kind and amount of the solvent are shown in Table 1. Coating compositions a-2 and a-3 containing conductive materials were obtained in the same manner except that the composition was changed to the above formula. Further, in Production Example 1, a coating composition a- containing a conductive material was prepared in the same manner except that an inorganic conductive material was used in the formulation shown in Table 1 instead of the conductive polymer as the conductive material. 4 and a-5 were obtained.

Production Example 6: Production of coating composition b-1 for forming dielectric layer (B) High dielectric powder BT-01 (manufactured by Sakai Chemical Industry Co., Ltd., barium titanate, particle size 0.1 μm) 0.1 Part, ethyl acetate 4 parts, dispersant 0.1 part, acrylic resin (manufactured by Nippon Paint Co., Ltd., solid content 51%, hydroxyl value 70, number average molecular weight 7000), 3.9 parts, curing agent (isocyanate-based curing agent, Japan In the same manner as in Production Example 1, 1.5 parts of T.P. The mixture was stirred with K homodisper to obtain a coating composition b-1 for forming the dielectric layer (B).

Production Examples 7 to 11: Production of Coating Compositions b-2 to b-6 for Forming Dielectric Layer (B) In Production Example 6, the types and amounts of high dielectric powders were changed to those shown in Table 1. Except for the above, coating compositions b-2 to b-4 for forming the dielectric layer (B) were obtained in the same manner.

Production Example 12: Production of luminescent material layer-forming coating composition c-1 Phosphor powder GG64 (manufactured by Sylvania, zinc sulfide added with copper as an activator) 0.1 part, ethyl acetate 4 parts, dispersion 0.1 part of an agent, 1.94 parts of an acrylic resin (manufactured by Nippon Paint, solid content 51%, hydroxyl value 70, number average molecular weight 7000), curing agent (isocyanate-based curing agent, manufactured by Nippon Paint, solid content 75% ) 0.742 parts as in Production Example 1 The mixture was stirred with K homodisper to obtain a light emitting layer forming coating composition c-1.

Production Examples 13 and 14: Production of the phosphor layer-forming coating compositions c-2 and c-3 In Production Example 12, except that the type and amount of the phosphor powder were changed to the formulations shown in Table 1, the same method was used. Thus, luminous body-forming coating compositions c-2 and c-3 were obtained.

Production Example 15: Production of clear coating composition e-1 11 parts acrylic resin ( manufactured by Nippon Paint Co., Ltd., solid content 51%, hydroxyl value 70, number average molecular weight 7000), curing agent (isocyanate-based curing agent, produced by Nippon Paint Co., Ltd.) In the same manner as in Production Example 1, T. A clear coating composition e-1 was obtained by mixing and stirring with K homodisper.

実施例
透明なアクリル板を用意し、その表面に、製造例１で得られた導電性物質を含んでいる塗料組成物ａ−１をスプレーで塗布した。これを温風乾燥機で１１０℃にて１時間乾燥し、導電体層（Ａ−１）を得た。上記導電体層（Ａ−１）は透明で、その膜厚は１０μｍであった。このようにして得られた導電体層（Ａ−１）の端部の一部に対して、テープでマスキングを施してから、製造例６で得られた誘電体層（Ｂ）を形成するための塗料組成物ｂ−１を、上記導電体層（Ａ−１）の形成と同様にして塗布および乾燥を行い、膜厚１０μｍの誘電体層（Ｂ−１）を形成した。

Example A transparent acrylic plate was prepared, and the coating composition a-1 containing the conductive material obtained in Production Example 1 was applied to the surface by spraying. This was dried with a hot air dryer at 110 ° C. for 1 hour to obtain a conductor layer (A-1). The said conductor layer (A-1) was transparent and the film thickness was 10 micrometers. In order to form the dielectric layer (B) obtained in Production Example 6 after masking with tape a part of the end of the conductor layer (A-1) thus obtained. The coating composition b-1 was applied and dried in the same manner as in the formation of the conductor layer (A-1) to form a dielectric layer (B-1) having a thickness of 10 μm.

  Next, the phosphor layer-forming coating material c-1 obtained in Production Example 12 was applied and dried in the same manner as the formation of the conductor layer (A-1), and the phosphor layer (C -1) was formed. Further, using the coating composition a-1 containing the conductive material obtained in Production Example 1, a conductor layer (D-1) having a thickness of 10 μm was formed in the same manner as described above.

After this conductor layer (D-1) is formed, the conductor layer (D-1) is masked with a tape on a part of the opposite end of the previously masked part, and then manufactured. The clear coating e-1 obtained in Example 15 was applied and dried in the same manner as the formation of the conductor layer (A-1) to form a surface layer (E-1) having a thickness of 25 μm. Thereby, the multilayer which consists of a conductor layer (A-1), a dielectric material layer (B-1), a light-emitting body layer (C-1), a conductor layer (D-1), and a surface layer (E-1). A coating film was obtained. The thickness of this multilayer coating film was 75 μm. Moreover, when this multilayer coating film was placed on a newspaper, the letters of the newspaper were seen through, could be read, and were transparent. When the transmittance of the multilayer coating film was measured, it was 60 to 70%. (Device name: spectrophotometer UV-1650PC, manufactured by Shimadzu Corporation, condition: average value of transmittance measured at 380-780 nm)
Remove the two masks applied when forming the multilayer coating film, place electrodes on the conductor layer (A-1) and conductor layer (D-1), and apply a voltage of 200 V at an AC voltage of 950 Hz. As a result, it was confirmed that the multilayer coating film emitted light with a luminance of 0.6 cd / m ² .

  In addition, about the formation of a conductor layer (A-1) and a conductor layer (D-1), it replaces with the coating composition a-1 containing an electroconductive substance, and the coating material obtained by manufacture example 2-5 Instead of the compositions a-2 to a-5 and the coating composition b-1 for forming the dielectric layer (B), the coating compositions b-1 to 1 obtained in Production Examples 6 to 9 were used. When b-4 was replaced with the coating composition c-1 for forming the phosphor layer, and the coating compositions c-2 and c-3 obtained in Production Examples 12 and 13 were used, respectively, A transparent luminescent coating film could be obtained.

Comparative Example In the above examples, the coating composition b-5 or b-6 obtained in Production Examples 10 and 11 was used instead of the coating composition b-1 for forming the dielectric layer (B). A multilayer coating film was formed in the same manner except for the above. Moreover, it replaced with the coating composition c-1 for light-emitting body layers, and formed the multilayer coating film similarly except having used the coating composition c-3 obtained by manufacture example 14. FIG. However, since the layers obtained from the coating composition used instead of these were not transparent, the three multilayer coating films were not transparent.

  Since the transparent light-emitting coating film of the present invention can control light emission with or without energization and can be suitably obtained by painting, it can be applied to structures, building components, and articles that require design properties. it can.

It is sectional drawing of the light emitting coating film which shows one aspect | mode of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Light-emitting coating film, 2 ... Base material, 3 ... Conductor layer, 4 ... Dielectric layer, 5 ... Light emitter layer, 6 ... Conductor layer, 7 ... Surface layer

Claims (6)

On the substrate, the conductor layer (A), the dielectric layer (B), the light emitter layer (C), the conductor layer (D), and the surface layer (E) are (A), (B), (C). , (D), (E), a transparent coating film in which the layers (A) to (E) are formed of a coating composition and emit light when an electric current is applied. The coating film according to claim 1, wherein the dielectric layer (B) is formed of a coating composition containing a high dielectric powder having a particle size of 0.38 μm or less and a binder component. The coating film according to claim 1 or 2, wherein the phosphor layer (C) is formed of a coating composition containing a phosphor powder having a particle size of 0.38 µm or less and a binder component. The said conductor layer (A) and the said conductor layer (D) are the coating films as described in any one of Claims 1-3 formed of the coating composition containing a conductive substance, respectively. The said surface layer (E) is a coating film as described in any one of Claims 1-4 formed of the clear coating composition. On the substrate, the conductor layer (A), the dielectric layer (B), the light emitter layer (C), the conductor layer (D), and the surface layer (E) are (A), (B), (C). A method for forming a transparent light-emitting coating film, wherein each layer is formed by painting in the order of (D) and (E).

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