JP2007109085A - 発熱制御方法、装置およびシステム - Google Patents

発熱制御方法、装置およびシステム Download PDF

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Publication number
JP2007109085A
JP2007109085A JP2005300507A JP2005300507A JP2007109085A JP 2007109085 A JP2007109085 A JP 2007109085A JP 2005300507 A JP2005300507 A JP 2005300507A JP 2005300507 A JP2005300507 A JP 2005300507A JP 2007109085 A JP2007109085 A JP 2007109085A
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JP
Japan
Prior art keywords
heat generation
control
application
generation state
control method
Prior art date
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Pending
Application number
JP2005300507A
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English (en)
Japanese (ja)
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JP2007109085A5 (cg-RX-API-DMAC7.html
Inventor
Kenichi Adachi
健一 安達
Tetsuji Tamura
哲司 田村
Itsuki Takiguchi
巖 瀧口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Computer Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Computer Entertainment Inc filed Critical Sony Computer Entertainment Inc
Priority to JP2005300507A priority Critical patent/JP2007109085A/ja
Priority to PCT/JP2006/314385 priority patent/WO2007043231A1/ja
Priority to US12/067,315 priority patent/US8068940B2/en
Publication of JP2007109085A publication Critical patent/JP2007109085A/ja
Publication of JP2007109085A5 publication Critical patent/JP2007109085A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Debugging And Monitoring (AREA)
  • Stored Programmes (AREA)
  • Executing Machine-Instructions (AREA)
JP2005300507A 2005-10-14 2005-10-14 発熱制御方法、装置およびシステム Pending JP2007109085A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005300507A JP2007109085A (ja) 2005-10-14 2005-10-14 発熱制御方法、装置およびシステム
PCT/JP2006/314385 WO2007043231A1 (ja) 2005-10-14 2006-07-20 発熱制御方法および発熱制御装置
US12/067,315 US8068940B2 (en) 2005-10-14 2006-07-20 Method and apparatus for controlling heat generation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300507A JP2007109085A (ja) 2005-10-14 2005-10-14 発熱制御方法、装置およびシステム

Publications (2)

Publication Number Publication Date
JP2007109085A true JP2007109085A (ja) 2007-04-26
JP2007109085A5 JP2007109085A5 (cg-RX-API-DMAC7.html) 2008-02-28

Family

ID=37942493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005300507A Pending JP2007109085A (ja) 2005-10-14 2005-10-14 発熱制御方法、装置およびシステム

Country Status (3)

Country Link
US (1) US8068940B2 (cg-RX-API-DMAC7.html)
JP (1) JP2007109085A (cg-RX-API-DMAC7.html)
WO (1) WO2007043231A1 (cg-RX-API-DMAC7.html)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009193509A (ja) * 2008-02-18 2009-08-27 Fujitsu Ltd 情報処理装置、情報処理方法、情報処理プログラム
KR20130014229A (ko) * 2011-07-29 2013-02-07 삼성전자주식회사 단말기 온도 제어 방법 및 이를 지원하는 단말기
JP2014006905A (ja) * 2012-06-21 2014-01-16 Apple Inc 熱制御装置及び方法
JP2017534946A (ja) * 2014-09-03 2017-11-24 ゼットティーイー コーポレーションＺｔｅ Ｃｏｒｐｏｒａｔｉｏｎ 熱処理の方法及び装置
JP2018183235A (ja) * 2017-04-24 2018-11-22 株式会社ユニバーサルエンターテインメント 遊技機
JP2018183211A (ja) * 2017-04-24 2018-11-22 株式会社ユニバーサルエンターテインメント 遊技機
JP2018183234A (ja) * 2017-04-24 2018-11-22 株式会社ユニバーサルエンターテインメント 遊技機
US11231758B2 (en) 2018-12-26 2022-01-25 Renesas Electronics Corporation Semiconductor device, thermo-control device, and methods
US11347198B2 (en) 2020-09-04 2022-05-31 Apple Inc. Adaptive thermal control system
WO2022269878A1 (ja) * 2021-06-24 2022-12-29 ソニーグループ株式会社 情報処理装置及び情報処理システム
WO2023074196A1 (ja) 2021-10-25 2023-05-04 ソニーグループ株式会社 情報処理装置、遠隔操作装置、情報処理方法および遠隔操作方法

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KR101840852B1 (ko) * 2011-10-10 2018-03-22 삼성전자주식회사 모바일 장치의 표면 온도 관리 방법 및 멀티칩 패키지의 메모리 열관리 방법
WO2013073188A1 (ja) * 2011-11-15 2013-05-23 パナソニック株式会社 車載用光ディスク装置
US9274805B2 (en) * 2012-02-24 2016-03-01 Qualcomm Incorporated System and method for thermally aware device booting
US9250666B2 (en) * 2012-11-27 2016-02-02 International Business Machines Corporation Scalable data collection for system management
DE102015007245B4 (de) * 2015-06-05 2024-09-19 Audi Ag Verfahren zum Betreiben einer Datenbrilleneinrichtung und Datenbrilleneinrichtung

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JP2000298782A (ja) * 1999-04-14 2000-10-24 Mitsubishi Electric Corp プラント監視装置
JP2004295883A (ja) * 2003-03-27 2004-10-21 Internatl Business Mach Corp <Ibm> チップの熱応答の方法およびコンピュータ装置

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US7194646B1 (en) * 1989-10-30 2007-03-20 Texas Instruments Incorporated Real-time thermal management for computers
US6463396B1 (en) * 1994-05-31 2002-10-08 Kabushiki Kaisha Toshiba Apparatus for controlling internal heat generating circuit
US7822996B2 (en) * 1995-12-07 2010-10-26 Texas Instruments Incorporated Method for implementing thermal management in a processor and/or apparatus and/or system employing the same
US6029119A (en) * 1996-01-16 2000-02-22 Compaq Computer Corporation Thermal management of computers
US6823516B1 (en) * 1999-08-10 2004-11-23 Intel Corporation System and method for dynamically adjusting to CPU performance changes
US6948082B2 (en) * 2002-05-17 2005-09-20 International Business Machines Corporation Method and apparatus for software-assisted thermal management for electronic systems
KR20050093825A (ko) * 2003-01-13 2005-09-23 코닌클리케 필립스 일렉트로닉스 엔.브이. 디스크 드라이브 장치
WO2004092907A2 (en) * 2003-04-14 2004-10-28 Netbotz, Inc. Extensible sensor monitoring, alert processing and notification system and method
US20040268159A1 (en) * 2003-06-30 2004-12-30 Microsoft Corporation Power profiling
US7451332B2 (en) * 2003-08-15 2008-11-11 Apple Inc. Methods and apparatuses for controlling the temperature of a data processing system
US7127625B2 (en) * 2003-09-04 2006-10-24 Hewlett-Packard Development Company, L.P. Application management based on power consumption
US7287173B2 (en) * 2003-12-19 2007-10-23 Intel Corporation Method for computing power consumption levels of instruction and recompiling the program to reduce the excess power consumption
US7194641B2 (en) * 2004-01-22 2007-03-20 International Business Machines Corporation Method and apparatus for managing power and thermal alerts transparently to an operating system in a data processing system with increased granularity in reducing power usage and thermal generation
US20050200627A1 (en) * 2004-03-11 2005-09-15 Intel Corporation Techniques for graphics profiling
US7529947B2 (en) * 2004-03-31 2009-05-05 Marvell International Ltd. Determining power consumption of an application
US8024544B2 (en) * 2004-05-13 2011-09-20 International Business Machines Corporation Free resource error/event log for autonomic data processing system
US7343579B2 (en) * 2004-11-30 2008-03-11 Physical Sciences Reconfigurable environmentally adaptive computing
US7194645B2 (en) * 2005-02-09 2007-03-20 International Business Machines Corporation Method and apparatus for autonomic policy-based thermal management in a data processing system
US20070027580A1 (en) * 2005-07-14 2007-02-01 Ligtenberg Chris A Thermal control of an electronic device for adapting to ambient conditions
US7624318B2 (en) * 2005-09-27 2009-11-24 International Business Machines Corporation Method and apparatus for automatically identifying multiple combinations of operational and non-operational components on integrated circuit chips with a single part number

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000298782A (ja) * 1999-04-14 2000-10-24 Mitsubishi Electric Corp プラント監視装置
JP2004295883A (ja) * 2003-03-27 2004-10-21 Internatl Business Mach Corp <Ibm> チップの熱応答の方法およびコンピュータ装置

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009193509A (ja) * 2008-02-18 2009-08-27 Fujitsu Ltd 情報処理装置、情報処理方法、情報処理プログラム
KR101894282B1 (ko) * 2011-07-29 2018-09-03 삼성전자 주식회사 단말기 온도 제어 방법 및 이를 지원하는 단말기
KR20130014229A (ko) * 2011-07-29 2013-02-07 삼성전자주식회사 단말기 온도 제어 방법 및 이를 지원하는 단말기
JP2013033469A (ja) * 2011-07-29 2013-02-14 Samsung Electronics Co Ltd 端末機温度制御方法及びこれをサポートする端末機
JP2014006905A (ja) * 2012-06-21 2014-01-16 Apple Inc 熱制御装置及び方法
KR101526051B1 (ko) * 2012-06-21 2015-06-04 애플 인크. 열적 제어 장치 및 방법론
US9383789B2 (en) 2012-06-21 2016-07-05 Apple Inc. Thermal control apparatus and methodology
JP2017534946A (ja) * 2014-09-03 2017-11-24 ゼットティーイー コーポレーションＺｔｅ Ｃｏｒｐｏｒａｔｉｏｎ 熱処理の方法及び装置
JP2018183235A (ja) * 2017-04-24 2018-11-22 株式会社ユニバーサルエンターテインメント 遊技機
JP2018183211A (ja) * 2017-04-24 2018-11-22 株式会社ユニバーサルエンターテインメント 遊技機
JP2018183234A (ja) * 2017-04-24 2018-11-22 株式会社ユニバーサルエンターテインメント 遊技機
US11231758B2 (en) 2018-12-26 2022-01-25 Renesas Electronics Corporation Semiconductor device, thermo-control device, and methods
US11347198B2 (en) 2020-09-04 2022-05-31 Apple Inc. Adaptive thermal control system
WO2022269878A1 (ja) * 2021-06-24 2022-12-29 ソニーグループ株式会社 情報処理装置及び情報処理システム
WO2023074196A1 (ja) 2021-10-25 2023-05-04 ソニーグループ株式会社 情報処理装置、遠隔操作装置、情報処理方法および遠隔操作方法

Also Published As

Publication number Publication date
US20090292404A1 (en) 2009-11-26
US8068940B2 (en) 2011-11-29
WO2007043231A1 (ja) 2007-04-19

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