JP2007107734A - Heat medium conduction heating plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat medium conduction heating plate capable of reducing a thickness of the heating plate and having high temperature uniformity and temperature rising/falling efficiency. <P>SOLUTION: In this heat medium conduction heating plate provided with a heat medium conduction passage in its thick inner portion, and performing heat treatment on a treated object by the heat of conducted heat medium, closed chambers 1a having a circular cross-section are formed in the thick inner portion of the heating plate 1 in a state of being vertically and horizontally communicated and intersected with each other, the gas-liquid two phase heat medium is sealed in the closed chambers 1a, and a heat medium conduction pipe 2 in which the heat medium for heating the heating plate 1 is circulated, is laid in a state of penetrating through the closed chambers 1a along the closed chambers 1a. By applying this layout, a contact face of the heat medium conduction pipe 2 and the gas-liquid two phase heat medium can be increased, and the temperature uniformity and temperature rising/falling efficiency can be improved. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a heat medium flow heating plate that heats a heat medium through a wall thickness.

  When casing electrical parts with a resin mold or the like, a casing heating mold (heating plate) is often used. As shown in FIG. 2, the heating plate in this case encloses a heat medium flow passage 1a through which the heat medium that heats the heating plate 1 flows and a gas-liquid two-phase heat medium that averages the temperature of the heating plate 1. A sealed chamber 1b is formed inside the wall.

In such a conventional heat medium flow heating plate, since the heat medium flow channel 1a and the sealed chamber 1b are formed separately, the heat medium flow heating plate becomes thick, the heating plate is heavy and difficult to handle, There were problems such as poor temperature uniformity and elevating temperature efficiency.

The problem to be solved by the present invention is to reduce the thickness of the heat medium flow heating plate and to provide a heat medium flow heating plate with good temperature uniformity and elevating temperature efficiency, and to solve such problems. is there.

The present invention provides a heat medium flow heating plate in which a heat medium flow path is formed inside the wall thickness and heats the processed material by the heat of the flowing heat medium, and a gas-liquid two-phase is formed inside the wall thickness of the heating plate. A sealed chamber for enclosing the heat medium is formed, and a heat medium flow pipe penetrating the sealed chamber is arranged.

  In the present invention, since the heat medium flow tube passing through the sealed chamber enclosing the gas-liquid two-phase heat medium is provided, the thickness and width of the heat medium flow heating plate can be reduced, and the heat medium The contact surface between the flow tube and the gas-liquid two-phase heat medium is increased, and a heat medium flow heating plate having high temperature uniformity and high temperature raising / lowering temperature efficiency can be obtained.

In order to reduce the thickness of the heating plate and to provide a heat medium flow heating plate with good temperature uniformity and temperature elevating temperature efficiency, a sealed chamber with a gas-liquid two-phase heat medium sealed inside the thickness of the heating plate is provided. This was realized by providing a tube through which a heat medium for heating a heating plate penetrating the sealed chamber was passed.

  FIG. 1 is a cross-sectional view (a) of a heat medium flow heating plate according to an embodiment of the present invention and a partial cross-sectional perspective view (b) showing an enlarged internal structure. As shown in FIG. 1 (b), a sealed chamber 1a having a circular cross-section that encloses a gas-liquid two-phase heat medium (not shown) is formed on the entire inner surface of the heating plate 1 by means of a drill or the like. The heat medium flow pipe 2 through which the heat medium flows is disposed so as to penetrate the sealed chamber 1a extending in the vertical direction, for example. The end of the heating plate 1 in the sealed chamber 1a is sealed after injecting a gas-liquid two-phase heat medium, but the heat medium flow pipe 2 is led out to the outside.

  When the heating plate 1 configured as described above is heated, when a heating medium heated to a predetermined temperature is passed through the tube 2, the gas-liquid two-phase heating medium contacting the tube 2 extends over the entire surface of the heating plate 1. The latent heat is moved to uniformly heat the entire surface of the heating plate 1. In this case, a contact surface between the gas-liquid two-phase heat medium and the heat medium flow pipe 2 through which the heat medium flows is large, so that a heat medium flow heating plate with high temperature uniformity and high temperature efficiency is obtained.

It is sectional drawing (a) and the partial cross-section perspective view (b) which expands and shows an internal structure of the heat-medium flow heating plate which concerns on the Example of this invention. It is sectional drawing of the conventional heat carrier flow heating plate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat-medium flow heating plate 1a Sealed chamber which encloses gas-liquid two-phase heat medium 2 Heat medium flow pipe

Claims (1)

In the heat medium flow heating plate in which the heat medium flow path is formed inside the wall thickness and heats the processed material by the heat of the flowing heat medium, a gas-liquid two-phase heat medium is placed inside the wall thickness of the heating plate. A heat medium flow heating plate, wherein the heat medium flow heating plate is formed by forming a sealed chamber to be sealed and arranging a heat medium flow tube penetrating the sealed chamber.