JP2007096843A - Mobile terminal device - Google Patents

Mobile terminal device Download PDF

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JP2007096843A
JP2007096843A JP2005284436A JP2005284436A JP2007096843A JP 2007096843 A JP2007096843 A JP 2007096843A JP 2005284436 A JP2005284436 A JP 2005284436A JP 2005284436 A JP2005284436 A JP 2005284436A JP 2007096843 A JP2007096843 A JP 2007096843A
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Prior art keywords
circuit board
acoustic transducer
terminal device
housing
holding member
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Inventor
Kousuke Takahashi
恒輔 高橋
Yasuhiko Owada
靖彦 大和田
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Kyocera Corp
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Kyocera Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a mobile terminal device which can increase the volume of a back cavity of an acoustic converter and the hermeticity of the same, and can be improved in sound quality without structural restrictions along with the reduction in size and thickness of the overall device. <P>SOLUTION: A holding member 13 is for holding a speaker 4, and it comprises a holder 13a for holding the speaker 4, an extended portion 13b which is extended in the outer peripheral direction of the speaker 4 from the opening 2-side end of the holder 13a and is abutted against the internal surface of a housing 1, and a rib 13c which is extended from the edge of the extended portion 13b and is abutted against a circuit board 3. The holding member 13 is so arranged as to seal the back cavity 12 as a back face-side space of the speaker 4 which is formed between the holding member 13 and the circuit board 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、携帯電話等の携帯端末装置に関し、特に、音楽等の再生時における音質向上を図ることができるようにした携帯端末装置に関するものである。   The present invention relates to a mobile terminal device such as a mobile phone, and more particularly to a mobile terminal device capable of improving sound quality during reproduction of music or the like.

一般に、携帯電話等の携帯端末装置は、筐体の内部に音響変換器としてのスピーカが内蔵されており、該スピーカより、待受け時には電話やメールの着信音を鳴らしたり、通話時には音声を出力したりするようになっている。   In general, a portable terminal device such as a mobile phone has a built-in speaker as an acoustic transducer inside the housing, and from the speaker, a ring tone for a telephone or mail is emitted during standby, or a voice is output during a call. It has come to be.

図8は従来の携帯端末装置の一例を示すものであって、筐体1の表面所要箇所に、外部と内部とを連通する開口部2を形成し、該筐体1の開口部2が設けられる面に対向して略平行となるように前記筐体1内部に回路基板3を配置し、該回路基板3と前記開口部2との間における前記筐体1内部に、前記開口部2から音声の入出力を行うスピーカ4を、ホルダー部材5を介して配置した構成を有している。   FIG. 8 shows an example of a conventional portable terminal device. An opening 2 that communicates the outside with the inside is formed at a required surface of the housing 1, and the opening 2 of the housing 1 is provided. A circuit board 3 is disposed inside the casing 1 so as to face and parallel to the surface to be formed, and from the opening 2 to the inside of the casing 1 between the circuit board 3 and the opening 2. A speaker 4 for inputting and outputting audio is arranged via a holder member 5.

前記ホルダー部材5は、その中央に配置穴6が設けられた略リング状をなすと共にその内周部に嵌合溝7が設けられて、スピーカ4の前面側周縁部を保持する前面側保持部8と、スピーカ4の背面側周縁部を保持する背面側保持部9とが形成され、前記前面側保持部8の表面を前記筐体1の内面に密着させ、且つ前記背面側保持部9と連設される基板側取付部10を回路基板3の表面に密着させ、これにより、スピーカ4の外周部を包持するようになっている。   The holder member 5 is formed in a substantially ring shape with an arrangement hole 6 provided in the center thereof, and a fitting groove 7 is provided in the inner peripheral portion thereof, so that the front side holding portion that holds the front side peripheral portion of the speaker 4 is provided. 8 and a rear side holding portion 9 that holds the rear peripheral edge portion of the speaker 4, the surface of the front side holding portion 8 is brought into close contact with the inner surface of the housing 1, and the rear side holding portion 9 The board-side mounting portion 10 that is continuously provided is brought into close contact with the surface of the circuit board 3, thereby holding the outer peripheral portion of the speaker 4.

尚、図8に示されるような構造の携帯端末装置と関連する一般的技術水準を示すものとしては、例えば、特許文献1がある。
特開平10−42383号公報
For example, Patent Document 1 shows a general technical level related to the mobile terminal device having the structure shown in FIG.
Japanese Patent Laid-Open No. 10-42383

ところで、従来の携帯端末装置の場合、着信音を鳴らすことができる機能だけを有していれば良かったため、音質についてはあまり重要視されておらず、音が多少割れていても通用していたが、近年の携帯端末装置の場合、「着メロ(登録商標)」、「着うた(登録商標)」等、音楽を聴く仕様が要求されるようになっており、音を如何に大きく且つ音質を如何に良くするかが、開発を進める上で非常に重要なポイントとなっている。   By the way, in the case of a conventional portable terminal device, it was sufficient if it had only a function capable of ringing a ringtone, so the sound quality was not considered so important, and it was valid even if the sound was somewhat broken However, in recent mobile terminal devices, specifications for listening to music such as “Ringtone (registered trademark)” and “Chaku-Uta (registered trademark)” are required, and how loud and high-quality sound is. How to improve it is a very important point in the development.

ここで、音質を良くするためには、スピーカ4の前面側空間としてのフロントキャビティ11の大きさと密閉度を確保すると共に、スピーカ4の背面側空間としてのバックキャビティ12の大きさと密閉度を確保する必要がある。   Here, in order to improve the sound quality, the size and the sealing degree of the front cavity 11 as the front side space of the speaker 4 are secured, and the size and the sealing degree of the back cavity 12 as the back side space of the speaker 4 are secured. There is a need to.

しかしながら、図8に示されるような従来の携帯端末装置では、近年、特に要求度の増している全体の小型・薄型化に伴う構造上の制約から、スピーカ4の前面側のフロントキャビティ11を大きくすることはほとんど限界に来ており、又、回路基板3の筐体1内面に対向する面上にはたくさんの電子部品(図示せず)が実装されることに加えて、ホルダー部材5はスピーカ4の背面側を保持する背面側保持部9と基板側取付部10とが連設されているため、前記バックキャビティ12を大きくすることもできず、音質向上を図ることが困難となっていた。   However, in the conventional portable terminal device as shown in FIG. 8, the front cavity 11 on the front side of the speaker 4 is made larger due to the structural restrictions accompanying the overall downsizing and thinning that have recently been increasing in demand. In addition to mounting many electronic components (not shown) on the surface of the circuit board 3 facing the inner surface of the housing 1, the holder member 5 is a speaker. Since the back side holding part 9 for holding the back side of 4 and the substrate side mounting part 10 are connected in series, the back cavity 12 cannot be enlarged and it is difficult to improve sound quality. .

本発明は、斯かる実情に鑑み、全体の小型・薄型化に伴う構造上の制約を受けることなく、音響変換器のバックキャビティの容積を増大させ且つ密閉性を高めることができ、音質向上を図り得る携帯端末装置を提供しようとするものである。   In view of such circumstances, the present invention can increase the volume of the back cavity of the acoustic transducer and improve the sealing performance without being restricted by the structure due to the overall downsizing and thinning, thereby improving the sound quality. An object of the present invention is to provide a portable terminal device that can be realized.

本発明は、外部と内部とを連通する開口部を有する筐体と、
該筐体の開口部が設けられる面に対向して前記筐体内部に配置される回路基板と、
該回路基板と前記開口部との間における前記筐体内部に配置され且つ前記開口部を介して音声の入出力を行う音響変換器と、
該音響変換器を保持する保持部材と
を備えた携帯端末装置において、
前記保持部材は、
前記音響変換器の側部を保持すると共に、前記回路基板との間に間隙を有して配置される保持部と、
該保持部の前記開口部側端部から前記音響変換器の外周方向に延設されると共に、前記筐体の内面に当接される延設部と、
該延設部の周縁から前記回路基板側に延び、その端部が前記回路基板に当接されるリブ部と
を備えて構成され、且つ
前記回路基板との間に形成される前記音響変換器の背面側空間を密閉するように構成されることを特徴とする携帯端末装置にかかるものである。
The present invention includes a housing having an opening that communicates the outside with the inside;
A circuit board disposed inside the casing so as to face a surface on which the opening of the casing is provided;
An acoustic transducer that is disposed inside the housing between the circuit board and the opening and that inputs and outputs audio through the opening;
In a portable terminal device comprising a holding member that holds the acoustic transducer,
The holding member is
Holding the side portion of the acoustic transducer, and a holding portion disposed with a gap between the circuit board;
An extending portion that extends from the opening-side end of the holding portion in the outer peripheral direction of the acoustic transducer and contacts the inner surface of the housing;
The acoustic transducer that includes a rib portion that extends from a peripheral edge of the extending portion toward the circuit board and whose end is in contact with the circuit board, and is formed between the circuit board and the acoustic transducer. The present invention relates to a portable terminal device that is configured to seal a rear side space of the portable terminal device.

又、前記保持部は、前記音響変換器と前記開口部が設けられる筐体内面との間に前面側空間が形成されるように前記音響変換器を保持する構成とすることにより、音量増大を図る上で有効となる。   In addition, the holding unit is configured to hold the acoustic transducer so that a front-side space is formed between the acoustic transducer and an inner surface of the housing in which the opening is provided, thereby increasing the volume. Effective in planning.

又、前記音響変換器は、前記回路基板との間に該回路基板と電気接続される電気接続部材を有する構成とすることにより、電気配線構造を簡素化する上で有効となる。   In addition, the acoustic transducer is effective in simplifying the electrical wiring structure by having an electrical connection member electrically connected to the circuit board between the circuit board and the circuit board.

又、前記音響変換器は、前記回路基板との間に設けられる付勢部材によって前記筐体内面側に付勢される構成とすることにより、保持部並びに延設部と筐体内面との当接を確実化し、前面側空間又は背面側空間の密閉度を向上させる上で有効となる。   Further, the acoustic transducer is configured to be biased toward the inner surface of the housing by a biasing member provided between the circuit board and the holding portion, the extending portion, and the inner surface of the housing. It is effective in ensuring contact and improving the degree of sealing of the front side space or the back side space.

又、前記保持部材は、自己粘着性を有する材質で形成される構成とすることにより、保持部材と筐体内面並びに回路基板との当接をより確実化し、前面側空間並びに背面側空間の密閉度を向上させる上で有効となる。   Further, the holding member is made of a material having self-adhesiveness, so that the contact between the holding member, the inner surface of the housing and the circuit board is further ensured, and the front side space and the rear side space are sealed. It is effective in improving the degree.

又、前記回路基板は、前記筐体内面に対向する面上に電子部品が実装され、
前記保持部材は、前記背面側空間内に前記電子部品を収納するように配置される構成とすることにより、保持部材の配置自由度を増し、且つ背面側空間の容積を増大させて音質向上を図る上で有効となる。
The circuit board has an electronic component mounted on a surface facing the inner surface of the housing.
The holding member is arranged so as to house the electronic component in the back side space, thereby increasing the degree of freedom in arranging the holding member and increasing the volume of the back side space to improve sound quality. Effective in planning.

更には、前記保持部材は、前記リブ部が前記回路基板に当接する部位と前記電子部品に当接する部位とを有し、当接する電子部品に沿った段差形状を有するように形成される構成とすることにより、保持部材の配置自由度をより向上させ、且つ背面側空間の容積を増大させて音質向上を図る上で有効となる。   Further, the holding member has a portion where the rib portion abuts on the circuit board and a portion abuts on the electronic component, and is formed to have a step shape along the abutting electronic component. This is effective in improving the sound quality by further improving the degree of freedom of arrangement of the holding members and increasing the volume of the back side space.

本発明の携帯端末装置によれば、全体の小型・薄型化に伴う構造上の制約を受けることなく、音響変換器のバックキャビティの容積を増大させ且つ密閉性を高めることができ、音質向上を図り得るという優れた効果を奏し得る。   According to the portable terminal device of the present invention, the volume of the back cavity of the acoustic transducer can be increased and the sealing performance can be enhanced without being restricted by the structure due to the overall downsizing and thinning, thereby improving the sound quality. An excellent effect can be achieved.

以下、本発明の実施の形態を添付図面を参照して説明する。   Embodiments of the present invention will be described below with reference to the accompanying drawings.

ここで説明する実施の形態は、本発明を携帯端末装置としての携帯電話機に適用した場合のものである。   The embodiment described here is a case where the present invention is applied to a mobile phone as a mobile terminal device.

図1に示す如く、この実施の形態に係る携帯電話機20は、第一の筐体1と、該第一の筐体1の厚さ方向に重ね合わせ可能な第二の筐体1´と、これら二つの筐体1,1´を相互に折り畳み自在に連結するヒンジ部21とを備えている。尚、前記ヒンジ部21は、二つの筐体1,1´の各基端部1a,1a´同士を連結するように配されている。   As shown in FIG. 1, a mobile phone 20 according to this embodiment includes a first casing 1 and a second casing 1 ′ that can be overlapped in the thickness direction of the first casing 1. A hinge portion 21 is provided for connecting the two casings 1 and 1 'so that they can be folded together. In addition, the said hinge part 21 is distribute | arranged so that each base end part 1a, 1a 'of two housing | casing 1,1' may be connected.

前記第一の筐体1の表面(二つの筐体1,1´を折り畳んだ状態において第二の筐体1´に対向する第一の筐体1の面)には、各種の押圧可能な操作キー22を備えたキー操作部23、及び通話用のマイクロフォン部24等が設けられる一方、前記第一の筐体1の内部には、操作キー22の操作等に応じて各種制御を行う制御手段を構成する回路基板3(図2〜図6に図示)が設けられており、前記第一の筐体1の背面には、図示していないスピーカが配置されており、本発明は、このスピーカの取付構造を一例としている。   Various pressures can be applied to the surface of the first casing 1 (the surface of the first casing 1 facing the second casing 1 ′ when the two casings 1 and 1 ′ are folded). A key operation unit 23 including an operation key 22 and a microphone unit 24 for calling are provided. On the inside of the first casing 1, various controls are performed in accordance with the operation of the operation key 22 and the like. A circuit board 3 (shown in FIGS. 2 to 6) constituting the means is provided, and a speaker (not shown) is disposed on the back surface of the first casing 1. A speaker mounting structure is taken as an example.

尚、前記第二の筐体1´の表面(二つの筐体1,1´を折り畳んだ状態において第一の筐体1に対向する第二の筐体1´の面)には、各種情報を表示するLCD(Liquid Crystal Display)等の表示部25、及び受話用のスピーカ部26が設けられている。   In addition, on the surface of the second casing 1 ′ (the surface of the second casing 1 ′ facing the first casing 1 when the two casings 1 and 1 ′ are folded), various information Is provided with a display unit 25 such as an LCD (Liquid Crystal Display) and a speaker unit 26 for receiving a call.

そして、図2は本発明を実施する形態の第一例であって、図中、図8と同一の符号を付した部分は同一物を表わしており、弾性を有するゴム系の材質で形成され且つ保持部13aと延設部13bとリブ部13cとを有してスピーカ4を保持する保持部材13を、回路基板3との間に形成されるスピーカ4の背面側空間としてのバックキャビティ12を密閉するように配置したものである。   FIG. 2 is a first example of an embodiment for carrying out the present invention. In the figure, the portions denoted by the same reference numerals as those in FIG. 8 represent the same thing, and are formed of a rubber-based material having elasticity. The holding member 13 having the holding portion 13a, the extending portion 13b, and the rib portion 13c and holding the speaker 4 and the back cavity 12 as a back side space of the speaker 4 formed between the circuit board 3 and the holding member 13 are provided. It is arranged so as to be sealed.

前記保持部13aは、前記回路基板3との間に間隙を有して保持部材13の略中心部に配置され、前記スピーカ4の側部を保持し、該スピーカ4と前記開口部2が設けられる筐体1内面との間に前面側空間としてのフロントキャビティ11が形成されるようなっている。   The holding portion 13 a is disposed at a substantially central portion of the holding member 13 with a gap between the holding portion 13 and the circuit board 3, holds the side portion of the speaker 4, and the speaker 4 and the opening 2 are provided. A front cavity 11 as a front side space is formed between the inner surface of the casing 1 to be formed.

前記延設部13bは、前記保持部13aの開口部2側端部から前記スピーカ4の外周方向に延設されると共に、前記筐体1の内面に当接されるようになっている。   The extending portion 13b extends from the end of the holding portion 13a on the opening 2 side in the outer peripheral direction of the speaker 4 and is in contact with the inner surface of the housing 1.

前記リブ部13cは、前記延設部13bの周縁から前記回路基板3側に延び、その端部が前記回路基板3に当接されるようになっている。   The rib portion 13c extends from the peripheral edge of the extended portion 13b to the circuit board 3 side, and an end thereof is in contact with the circuit board 3.

一方、前記スピーカ4は、前記回路基板3との間に該回路基板3と電気接続される電気接続部材14を有し、該電気接続部材14を図2に示す如く弾性部材であるバネ端子(付勢手段)で構成することにより、前記スピーカ4を前記筐体1内面側に付勢するようにしてある。尚、前記電気接続部材14をバネ端子で構成する代わりに、コネクタ付きの線材とし、該コネクタを前記回路基板3に接続して前記スピーカ4と前記回路基板3とを電気接続し、前記コネクタ付きの線材とした電気接続部材14とは別に弾性部材等の付勢部材を設け、該付勢部材によって前記スピーカ4を前記筐体1内面側に付勢するようにしても良い。   On the other hand, the speaker 4 has an electrical connection member 14 electrically connected to the circuit board 3 between the speaker board 4 and the electrical connection member 14 as a spring terminal (elastic member as shown in FIG. 2). The speaker 4 is urged toward the inner surface of the housing 1 by the urging means. Instead of configuring the electrical connecting member 14 with a spring terminal, a wire with a connector is used, the connector is connected to the circuit board 3 to electrically connect the speaker 4 and the circuit board 3, and the connector is attached. An urging member such as an elastic member may be provided in addition to the electrical connection member 14 as the wire, and the speaker 4 may be urged toward the inner surface of the housing 1 by the urging member.

前記回路基板3の前記筐体1内面に対向する面上には、種々の電子部品15が実装され、前記保持部材13は、前記バックキャビティ12内に前記電子部品15を収納するように配置してある。   Various electronic components 15 are mounted on the surface of the circuit board 3 facing the inner surface of the housing 1, and the holding member 13 is disposed so as to accommodate the electronic components 15 in the back cavity 12. It is.

次に、上記図示例の作用を説明する。   Next, the operation of the illustrated example will be described.

前記保持部材13に延設部13bを設けると共に、回路基板3に当接するリブ部13cを設けたことにより、前記スピーカ4のバックキャビティ12を密閉した状態でその容積を増大させることが可能となり、音質を向上させることが可能となる。   By providing the holding member 13 with the extending portion 13b and the rib portion 13c that contacts the circuit board 3, it is possible to increase the volume of the speaker 4 with the back cavity 12 sealed, Sound quality can be improved.

前記保持部13aは、前記スピーカ4と前記開口部2が設けられる筐体1内面との間にフロントキャビティ11が形成されるように前記スピーカ4を保持するため、音量増大を図ることが可能となる。   Since the holding portion 13a holds the speaker 4 so that the front cavity 11 is formed between the speaker 4 and the inner surface of the housing 1 where the opening 2 is provided, the volume can be increased. Become.

前記スピーカ4は、前記回路基板3との間に該回路基板3と電気接続される電気接続部材14を有しているため、電気配線構造を簡素化することが可能となり、しかも、前記電気接続部材14を弾性部材等の付勢部材であるバネ端子で構成することにより、前記スピーカ4を前記筐体1内面側に付勢するようにしてあるため、保持部13a並びに延設部13bと筐体1内面との当接を確実化し、フロントキャビティ11の密閉度を向上させることが可能となる。   Since the speaker 4 includes an electrical connection member 14 that is electrically connected to the circuit board 3 between the speaker 4 and the circuit board 3, it is possible to simplify the electrical wiring structure, and the electrical connection. Since the member 14 is configured by a spring terminal which is an urging member such as an elastic member, the speaker 4 is urged toward the inner surface side of the housing 1, so that the holding portion 13 a and the extending portion 13 b are connected to the housing. The contact with the inner surface of the body 1 can be ensured, and the degree of sealing of the front cavity 11 can be improved.

又、前記回路基板3の前記筐体1内面に対向する面上には電子部品15が実装されているが、前記保持部材13は、前記バックキャビティ12内に前記回路基板3上の電子部品15を収納するように配置されるため、保持部材13の配置自由度を増し、且つバックキャビティ12の容積を増大させて音質向上を図ることが可能となる。   An electronic component 15 is mounted on the surface of the circuit board 3 facing the inner surface of the housing 1, and the holding member 13 is mounted in the back cavity 12 on the electronic component 15 on the circuit board 3. Therefore, it is possible to increase the degree of freedom of arrangement of the holding member 13 and increase the volume of the back cavity 12 to improve sound quality.

因みに、前記保持部材13を、弾性を有するゴム系の材質で形成した場合、保持部材13の延設部13bの厚さtをおよそ1[mm]程度にすれば、保持部13a及び延設部13bは、撓むことなく筐体1内面にしっかりと貼り付く形となる。   Incidentally, when the holding member 13 is formed of a rubber-based material having elasticity, if the thickness t of the extending portion 13b of the holding member 13 is about 1 [mm], the holding portion 13a and the extending portion are formed. 13b becomes a form firmly stuck to the inner surface of the housing 1 without bending.

又、前記保持部材13のリブ部13cの厚さTに関しては、およそ2[mm]程度にすれば、回路基板3の表面に密着させることが可能となる。   Further, the thickness T of the rib portion 13c of the holding member 13 can be brought into close contact with the surface of the circuit board 3 by setting it to about 2 [mm].

こうして、全体の小型・薄型化に伴う構造上の制約を受けることなく、スピーカ4のバックキャビティ12の容積を増大させ且つ密閉性を高めることができ、音質向上を図り得る。   In this manner, the volume of the back cavity 12 of the speaker 4 can be increased and the sealing performance can be improved without being restricted by the structure accompanying the overall reduction in size and thickness, and sound quality can be improved.

図3は本発明を実施する形態の第二例であって、図中、図2と同一の符号を付した部分は同一物を表わしており、基本的な構成は図2に示すものと同様であるが、本図示例の特徴とするところは、図3に示す如く、前記リブ部13cの回路基板3に当接する部分の幅Wを広げてフランジ部13dを形成すると共に、該フランジ部13dを前記回路基板3との間で挟み込むように保持するリブ16を前記筐体1内面から延設した点にある。   FIG. 3 shows a second example of an embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 2 denote the same components, and the basic configuration is the same as that shown in FIG. However, as shown in FIG. 3, the present embodiment is characterized in that the flange portion 13d is formed by increasing the width W of the portion of the rib portion 13c that contacts the circuit board 3, and the flange portion 13d. In that the rib 16 is extended from the inner surface of the housing 1 so as to be sandwiched with the circuit board 3.

前述の如く、リブ部13cの回路基板3に当接する部分の幅を広げてフランジ部13dを形成すると共に、該フランジ部13dを前記回路基板3との間で挟み込むように保持するリブ16を前記筐体1から延設すると、フランジ部13dが回路基板3の表面に確実に密着し、保持部材13のリブ部13cの厚さが薄くても、スピーカ4のバックキャビティ12の密閉度をより向上させることが可能となる。   As described above, the flange portion 13d is formed by increasing the width of the portion of the rib portion 13c that contacts the circuit board 3, and the rib 16 that holds the flange portion 13d so as to be sandwiched between the circuit board 3 and the rib 16 is provided. When extending from the housing 1, the flange portion 13 d is securely attached to the surface of the circuit board 3, and the sealing degree of the back cavity 12 of the speaker 4 is further improved even if the rib portion 13 c of the holding member 13 is thin. It becomes possible to make it.

因みに、弾性を有するゴム系の材質で形成した保持部材13の場合、前記リブ部13cのフランジ部13dの幅Wは、およそ5[mm]程度にすれば良い。   Incidentally, in the case of the holding member 13 formed of an elastic rubber-based material, the width W of the flange portion 13d of the rib portion 13c may be about 5 [mm].

図4は本発明を実施する形態の第三例であって、図中、図2と同一の符号を付した部分は同一物を表わしており、基本的な構成は図2に示すものと同様であるが、本図示例の特徴とするところは、図4に示す如く、前記保持部材13を、スチレン系ポリマー或いはスチレン系エラストマー等の自己粘着性を有する材質で形成した点にある。尚、前記筐体1内面には、前記保持部材13の位置決めをしやすくするために、保持部材13の外形形状に合わせたリブ17を突設してある。   FIG. 4 is a third example of an embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 2 denote the same components, and the basic configuration is the same as that shown in FIG. However, the feature of this illustrated example is that the holding member 13 is made of a self-adhesive material such as styrene polymer or styrene elastomer as shown in FIG. In addition, ribs 17 corresponding to the outer shape of the holding member 13 are provided on the inner surface of the housing 1 so as to facilitate positioning of the holding member 13.

前記スチレン系ポリマー或いはスチレン系エラストマー等は、広い温度範囲で高弾性、抗張力に優れ、自己粘着性を有する材料であり、成形時における金型からの抜きに関し融通性が高いため、アンダーカット形状を形成することが容易で、成形の自由度が高い。   The styrenic polymer or styrenic elastomer is a material having high elasticity and tensile strength over a wide temperature range and having self-adhesiveness, and has high flexibility with respect to removal from the mold during molding. It is easy to form and has a high degree of molding freedom.

そして、前述の如く、保持部材13を、スチレン系ポリマー或いはスチレン系エラストマー等の自己粘着性を有する材質で形成すると、保持部材13の保持部13a及び延設部13bは、筐体1内面にしっかりと貼り付くため、延設部13bの厚さtはおよそ0.5[mm]程度にも薄くすることが可能となる。   As described above, when the holding member 13 is formed of a self-adhesive material such as a styrene polymer or a styrene elastomer, the holding portion 13a and the extending portion 13b of the holding member 13 are firmly attached to the inner surface of the housing 1. Therefore, the thickness t of the extending portion 13b can be reduced to about 0.5 [mm].

又、前記保持部材13のリブ部13cの厚さTに関しては、およそ1〜1.5[mm]程度にしても、回路基板3の表面に密着させることが可能となる。   Further, the thickness T of the rib portion 13c of the holding member 13 can be brought into close contact with the surface of the circuit board 3 even when the thickness T is about 1 to 1.5 [mm].

この結果、前記保持部材13と筐体1内面並びに回路基板3との当接をより確実化し、スピーカ4のフロントキャビティ11並びにバックキャビティ12の密閉度をより向上させることが可能となる。   As a result, the contact between the holding member 13 and the inner surface of the housing 1 and the circuit board 3 can be further ensured, and the degree of sealing of the front cavity 11 and the back cavity 12 of the speaker 4 can be further improved.

図2、図3、及び図4にはそれぞれ、前記回路基板3の表面に実装された電子部品15と干渉しないようにその外周を包囲する形でリブ部13cを回路基板3に密着させた例を示したが、図5に示す如く、電子部品15を避けずに、前記保持部材13のリブ部13cが前記回路基板3に当接する部位と前記電子部品15に当接する部位とを有するようにしても良い。尚、前記保持部材13のリブ部13cの平断面形状は、必ずしも真四角である必要は無く、電子部品15の配置に合わせて自由な形状にすることができる。又、図5中、18は前記回路基板3上に形成された接点としてのスピーカパターンであり、前記電気接続部材14を弾性部材等の付勢部材であるバネ端子で構成した場合に、該バネ端子が前記スピーカパターン18に接触するようになっている。   2, 3, and 4, an example in which the rib portion 13 c is closely attached to the circuit board 3 so as to surround the outer periphery so as not to interfere with the electronic component 15 mounted on the surface of the circuit board 3. However, as shown in FIG. 5, without avoiding the electronic component 15, the rib portion 13 c of the holding member 13 has a portion that contacts the circuit board 3 and a portion that contacts the electronic component 15. May be. The flat cross-sectional shape of the rib portion 13c of the holding member 13 does not necessarily have to be a square, and can be set freely according to the arrangement of the electronic component 15. In FIG. 5, reference numeral 18 denotes a speaker pattern as a contact point formed on the circuit board 3, and when the electrical connecting member 14 is constituted by a spring terminal which is an urging member such as an elastic member, the spring The terminal is in contact with the speaker pattern 18.

ここで、例えば、図5のVIa−VIa断面部分のようにリブ部13cが電子部品15とぶつかる箇所については、図6(a)に示す如く、電子部品15の上から外側にリブ部13cを膨らませて段差形状を有するようにし、該電子部品15を覆うことで回路基板3と密着させることができる。   Here, for example, as shown in FIG. 6A, the rib portion 13 c is formed from the top to the outside of the electronic component 15 at a location where the rib portion 13 c collides with the electronic component 15, as in the VIa-VIa cross section of FIG. 5. By inflating it so as to have a stepped shape and covering the electronic component 15, it can be brought into close contact with the circuit board 3.

又、図5のVIb−VIb断面及びVIc−VIc断面部分のように大きな電子部品15が存在している場合には、図6(b)及び図6(c)に示す如く、電子部品15の上面にそのままリブ部13cを密着させることもできる。尚、図6(a)に示すものと同様に、電子部品15の上から外側にリブ部13cを膨らませるだけのスペースがある場合には、それでも良い。   Further, when there is a large electronic component 15 such as the VIb-VIb cross section and the VIc-VIc cross section in FIG. 5, as shown in FIGS. 6 (b) and 6 (c), The rib portion 13c can be brought into close contact with the upper surface as it is. As in the case shown in FIG. 6A, if there is a space for expanding the rib portion 13 c from the top to the outside of the electronic component 15, that may be used.

更に又、図5のVII部のように電子部品15が密集している場合には、図7に示す如く、複数個の電子部品15に被せられる程度にリブ部13cの厚さを厚くし、各電子部品15の形状に合致した段差形状としての凹部19を形成し、密着させることもできる。尚、電子部品15に対し保持部材13のリブ部13cを押し付けたとしても、スチレン系ポリマー或いはスチレン系エラストマー等は高弾性を有するため、電子部品15を傷付けたりする心配は無い。   Furthermore, when the electronic parts 15 are densely packed as in the VII part of FIG. 5, the thickness of the rib part 13c is increased so as to cover the plurality of electronic parts 15 as shown in FIG. It is also possible to form a concave portion 19 as a step shape matching the shape of each electronic component 15 and make it closely contact. Even if the rib portion 13c of the holding member 13 is pressed against the electronic component 15, the styrene polymer or the styrene elastomer has high elasticity, so there is no fear of damaging the electronic component 15.

即ち、前述の如く、前記保持部材13のリブ部13cが前記回路基板3に当接する部位と前記電子部品15に当接する部位とを有し、当接する電子部品15に沿った段差形状を有するように形成すると、保持部材13の配置自由度をより向上させ、且つバックキャビティ12の容積を増大させて音質向上を図る上で有効となる一方、携帯端末装置の落下時等に電子部品15に加わる衝撃を保持部材13によって吸収し、電子部品15の破損を回避することも可能となる。   That is, as described above, the rib portion 13c of the holding member 13 has a portion that contacts the circuit board 3 and a portion that contacts the electronic component 15, and has a step shape along the contacting electronic component 15. This is effective in improving the degree of freedom of arrangement of the holding member 13 and improving the sound quality by increasing the volume of the back cavity 12, while being added to the electronic component 15 when the mobile terminal device is dropped. The impact can be absorbed by the holding member 13 and the electronic component 15 can be prevented from being damaged.

尚、本発明の携帯端末装置は、上述の図示例にのみ限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々変更を加え得ることは勿論である。又、携帯電話機以外の携帯端末装置に本発明を適用可能であることは言うまでもない。   In addition, the portable terminal device of the present invention is not limited to the above-described illustrated examples, and various modifications can be made without departing from the scope of the present invention. Needless to say, the present invention can be applied to portable terminal devices other than cellular phones.

本発明を適用する携帯電話機の一例を示す斜視図である。It is a perspective view which shows an example of the mobile telephone to which this invention is applied. 本発明を実施する形態の第一例の側断面図である。It is a sectional side view of the 1st example of the form which carries out the present invention. 本発明を実施する形態の第二例の側断面図である。It is a sectional side view of the 2nd example of the form which carries out the present invention. 本発明を実施する形態の第三例の側断面図である。It is a sectional side view of the 3rd example of the form which carries out the present invention. 本発明を実施する形態の各例における保持部材の回路基板に対する密着面を示す斜視図である。It is a perspective view which shows the contact surface with respect to the circuit board of the holding member in each example of embodiment which implements this invention. (a)は図5のVIa−VIa断面図、(b)は図5のVIb−VIb断面図、(c)は図5のVIc−VIc断面図である。5A is a cross-sectional view taken along the line VIa-VIa in FIG. 5, FIG. 5B is a cross-sectional view taken along the line VIb-VIb in FIG. 5, and FIG. 回路基板に配置される電子部品に沿った保持部材の段差形状を示す斜視図であって、図5のVII部相当図である。FIG. 7 is a perspective view showing a step shape of a holding member along an electronic component arranged on a circuit board, and is a view corresponding to a VII portion in FIG. 5. 従来の携帯端末装置の一例を示す側断面図である。It is a sectional side view which shows an example of the conventional portable terminal device.

符号の説明Explanation of symbols

1 筐体
2 開口部
3 回路基板
4 スピーカ(音響変換器)
11 フロントキャビティ(前面側空間)
12 バックキャビティ(背面側空間)
13 保持部材
13a 保持部
13b 延設部
13c リブ部
14 電気接続部材(付勢部材)
15 電子部品
20 携帯電話機(携帯端末機器)
DESCRIPTION OF SYMBOLS 1 Case 2 Opening part 3 Circuit board 4 Speaker (acoustic transducer)
11 Front cavity (front side space)
12 Back cavity (back side space)
13 holding member 13a holding portion 13b extending portion 13c rib portion 14 electrical connecting member (biasing member)
15 Electronic Components 20 Mobile Phone (Mobile Terminal Equipment)

Claims (7)

外部と内部とを連通する開口部を有する筐体と、
該筐体の開口部が設けられる面に対向して前記筐体内部に配置される回路基板と、
該回路基板と前記開口部との間における前記筐体内部に配置され且つ前記開口部を介して音声の入出力を行う音響変換器と、
該音響変換器を保持する保持部材と
を備えた携帯端末装置において、
前記保持部材は、
前記音響変換器の側部を保持すると共に、前記回路基板との間に間隙を有して配置される保持部と、
該保持部の前記開口部側端部から前記音響変換器の外周方向に延設されると共に、前記筐体の内面に当接される延設部と、
該延設部の周縁から前記回路基板側に延び、その端部が前記回路基板に当接されるリブ部と
を備えて構成され、且つ
前記回路基板との間に形成される前記音響変換器の背面側空間を密閉するように構成されることを特徴とする携帯端末装置。
A housing having an opening communicating with the outside and the inside;
A circuit board disposed inside the casing so as to face a surface on which the opening of the casing is provided;
An acoustic transducer that is disposed inside the housing between the circuit board and the opening and that inputs and outputs audio through the opening;
In a portable terminal device comprising a holding member that holds the acoustic transducer,
The holding member is
Holding the side portion of the acoustic transducer, and a holding portion disposed with a gap between the circuit board;
An extending portion that extends from the opening-side end of the holding portion in the outer peripheral direction of the acoustic transducer and contacts the inner surface of the housing;
The acoustic transducer that includes a rib portion that extends from a peripheral edge of the extending portion toward the circuit board and whose end is in contact with the circuit board, and is formed between the circuit board and the acoustic transducer. A portable terminal device configured to seal the back side space of the mobile phone.
前記保持部は、前記音響変換器と前記開口部が設けられる筐体内面との間に前面側空間が形成されるように前記音響変換器を保持することを特徴とする請求項1記載の携帯端末装置。   2. The portable device according to claim 1, wherein the holding unit holds the acoustic transducer such that a front-side space is formed between the acoustic transducer and an inner surface of the housing in which the opening is provided. Terminal device. 前記音響変換器は、前記回路基板との間に該回路基板と電気接続される電気接続部材を有することを特徴とする請求項1又は2記載の携帯端末装置。   The portable terminal device according to claim 1, wherein the acoustic transducer includes an electrical connection member that is electrically connected to the circuit board between the acoustic transducer and the circuit board. 前記音響変換器は、前記回路基板との間に設けられる付勢部材によって前記筐体内面側に付勢されることを特徴とする請求項1乃至3のうちいずれか一つに記載の携帯端末装置。   4. The mobile terminal according to claim 1, wherein the acoustic transducer is urged toward the inner surface of the housing by an urging member provided between the circuit board and the circuit board. 5. apparatus. 前記保持部材は、自己粘着性を有する材質で形成されていることを特徴とする請求項1乃至4のうちいずれか一つに記載の携帯端末装置。   The portable terminal device according to any one of claims 1 to 4, wherein the holding member is formed of a self-adhesive material. 前記回路基板は、前記筐体内面に対向する面上に電子部品が実装され、
前記保持部材は、前記背面側空間内に前記電子部品を収納するように配置されることを特徴とする請求1乃至5のうちいずれか一つに項記載の携帯端末装置。
The circuit board has an electronic component mounted on a surface facing the inner surface of the housing,
The portable terminal device according to claim 1, wherein the holding member is disposed so as to accommodate the electronic component in the back side space.
前記保持部材は、前記リブ部が前記回路基板に当接する部位と前記電子部品に当接する部位とを有し、当接する電子部品に沿った段差形状を有するように形成されることを特徴とする請求項6記載の携帯端末装置。   The holding member has a portion where the rib portion abuts on the circuit board and a portion abuts on the electronic component, and is formed to have a step shape along the abutting electronic component. The mobile terminal device according to claim 6.
JP2005284436A 2005-09-29 2005-09-29 Mobile terminal device Pending JP2007096843A (en)

Priority Applications (1)

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Family

ID=37981984

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Country Link
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294652A (en) * 2007-05-23 2008-12-04 Kyocera Corp Portable electronic equipment
US8165316B2 (en) 2008-02-20 2012-04-24 Fujitsu Toshiba Mobile Communications Limited Portable terminal
JP2012129941A (en) * 2010-12-17 2012-07-05 Panasonic Corp Loudspeaker call device
WO2015100663A1 (en) * 2013-12-30 2015-07-09 刘骏涛 Miniature audio electronic
WO2019109416A1 (en) * 2017-12-04 2019-06-13 歌尔股份有限公司 Sound emission device module and electronic apparatus
WO2019137192A1 (en) * 2018-01-10 2019-07-18 歌尔股份有限公司 Sound-emitting apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008294652A (en) * 2007-05-23 2008-12-04 Kyocera Corp Portable electronic equipment
US8165316B2 (en) 2008-02-20 2012-04-24 Fujitsu Toshiba Mobile Communications Limited Portable terminal
JP2012129941A (en) * 2010-12-17 2012-07-05 Panasonic Corp Loudspeaker call device
WO2015100663A1 (en) * 2013-12-30 2015-07-09 刘骏涛 Miniature audio electronic
WO2019109416A1 (en) * 2017-12-04 2019-06-13 歌尔股份有限公司 Sound emission device module and electronic apparatus
WO2019137192A1 (en) * 2018-01-10 2019-07-18 歌尔股份有限公司 Sound-emitting apparatus
US11178494B2 (en) 2018-01-10 2021-11-16 Goertek Inc. Sound generating device

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