JP2007096773A - Dielectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dielectric device capable of securing high flexibility in design while being made to be small in size and low in height. <P>SOLUTION: A first opening 41 of a resonation unit Q1 is to be opened in a third outer surface 23 and faced toward a direction of a second outer surface 22 opposing to the third outer surface 23 therefrom. The first opening 41 comprises a first inner conductor 61 therein, and the first inner conductor 61 is to be linked to an outer conductor film 3 in the third outer surface 23. A second opening 51 is to be opened in a first outer surface 21 which is not covered all over its whole surface by the outer conductor film 3, and is to be linked to the first opening 41 at inner portion of the dielectric base substance 1 while providing a second inner conductor 81 therein. The second inner conductor 81 whose one end is located at the first outer surface 21 is to be linked its other end to the first inner conductor 61. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a dielectric resonator and a dielectric device such as a dielectric filter or a duplexer.

  This type of dielectric device is used in a high frequency region such as a quasi-microwave band, a microwave band, a millimeter wave band, or a submillimeter wave band. More specific application examples include satellite communication devices, mobile communication devices, wireless communication devices, high frequency communication devices, or base stations for these communication devices.

  Conventionally, a resonator or a dielectric filter used for a mobile phone or the like is configured by combining a plurality of resonator portions each having a single through hole in a dielectric base. The length obtained by dividing 1/4 of the wavelength λ of the free space by the square root of the relative dielectric constant of the material constituting the dielectric substrate.

  When configuring a dielectric filter, a plurality of resonators are coupled with a separately prepared coupling circuit, or a plurality of through holes are provided on one outer surface of a dielectric substrate formed in a substantially rectangular parallelepiped. The metallization is applied to the outer surface except for one surface and the inside of the through hole, and each through hole is used as a resonator portion.

  In the case of a dielectric filter using a dielectric substrate, an additional element such as a capacitor is added to the resonator portion, or a conductor pattern is formed on one surface without metallization to constitute the additional element. Furthermore, a structure is adopted in which the balance of the electromagnetic field coupling distribution is intentionally broken by coupling grooves by an electric field or a magnetic field by providing grooves or recesses in the dielectric substrate itself.

  However, in the conventional resonator and dielectric filter, when it is desired to shorten the length of the resonator for miniaturization, it is necessary to separately configure a load capacity as described above, and it is added to the resonator. The structure in which elements are added has a large number of parts and is not suitable for miniaturization.

  Furthermore, in a structure in which a capacitor or the like is formed on one surface of the resonator by using a conductor pattern, it is necessary to form a complicated and precise conductor pattern on one surface of the dielectric substrate. Costs increase and negatively affect yield.

  As means for solving the above-described problems, Patent Document 1 has a hole structure including a first hole and a second hole in a resonance part, and a second hole is provided at an end of the first hole. A novel crossed dielectric device is disclosed. The first inner conductor provided in the first hole and the second inner conductor provided in the second hole are made continuous with each other.

According to the dielectric device having this hole structure, the length of the dielectric substrate can be shortened to obtain a desired resonance frequency, and a reduction in size and height can be achieved.
Japanese Patent No. 3329450

  An object of the present invention is to provide a dielectric device capable of ensuring a high degree of freedom in design while further improving the technique described in Patent Document 1 and reducing the size and height.

  In order to solve the above-described problem, a dielectric device according to the present invention first includes a dielectric substrate and at least one resonance unit. The dielectric substrate has a conductor film on the outer surface. The resonating part includes a first hole and a second hole. The first hole is provided in the dielectric base, and one end opens on one surface of the outer surface, and extends from the one surface toward the opposing outer surface. The first hole includes a first inner conductor therein, and the first inner conductor is continuous with the outer conductor film. The second hole is provided in the dielectric substrate, opens to an outer surface not facing the one surface and not covered with the outer conductor film, and the first hole is formed inside the dielectric substrate. It continues to the hole. The second hole includes a second inner conductor therein, and one end of the second inner conductor is continuous with the first inner conductor inside the dielectric base.

  As described above, in the dielectric device according to the present invention, the resonating unit includes the first hole and the second hole, and the second end is opposite to the opening surface of the first hole. A hole structure in which the holes are crossed is obtained.

  In this hole structure, the first inner conductor provided in the first hole and the second inner conductor provided in the second hole are made continuous with each other. Since the first inner conductor of the first hole faces the conductor film via the dielectric substrate, a large capacitance is generated between the first inner conductor film and the conductor film. For this reason, the dielectric device according to the present invention resonates at a frequency lower than its electrical length with respect to the length of the dielectric substrate viewed in the axial direction of the second hole. In other words, the length of the dielectric substrate can be shortened to obtain a desired resonance frequency, and a reduction in size and height can be achieved.

  Further, according to the present invention, as a characteristic configuration different from that of Patent Document 1, the first inner conductor provided in the first hole is continuous with the outer conductor film, and instead, the second hole Opening is made on the outer surface not covered with the conductor film. With such a structure, since the wide outer surface where the second hole opens becomes an open end surface, the surface can be used as a pattern formation region for characteristic adjustment or an electronic component mounting region. It is possible to secure a high degree of design freedom in the miniaturization and low profile.

  The device according to the present invention can be used as a device that widely covers a resonator, an oscillator, a dielectric filter, or a duplexer (also referred to as a duplexer or an antenna duplexer). Of these, when used as a resonator, a single resonating unit may be sufficient. When used for a dielectric filter or a duplexer, there are a plurality of resonance parts.

  As described above, according to the present invention, a dielectric device capable of ensuring a high degree of freedom in design while further improving the technique described in Patent Document 1 and reducing the size and height. Specifically, a resonator, an oscillator, a dielectric filter, or a duplexer can be provided.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. However, it goes without saying that the technical scope of the present invention is not limited to these illustrated embodiments.

  1 is a perspective view of a dielectric resonator according to the present invention, FIG. 2 is a perspective view of the dielectric resonator shown in FIG. 1 viewed from the back side, and FIG. 3 is a cross-section taken along line 3-3 in FIG. 4 and 4 are cross-sectional views taken along line 4-4 of FIG. The illustrated dielectric resonator includes a dielectric substrate 1 and one resonance part Q1. The dielectric substrate 1 is formed in a substantially hexahedron shape having a first outer surface 21 to a sixth outer surface 26 using a known dielectric ceramic, and the second outer surface 22 to the second outer surface 22 except for the first outer surface 21. Most of the sixth outer surface 26 is covered with the outer conductor film 3. The outer conductor film 3 generally has copper or silver as a main component and is formed by means such as baking or plating.

  The resonating part Q1 includes a first hole 41 and a second hole 51. The first hole 41 is provided in the dielectric substrate 1, and one end thereof opens to the third outer surface 23, and extends from the third outer surface 23 toward the second outer surface 22 that is an opposing surface thereof. The first hole 41 includes a first inner conductor 61 inside. The first inner conductor 61 is formed as an electrode film by the same material and means as the outer conductor film 3. Unlike this, the first inner conductor 61 may be filled so as to fill a part or the whole of the first hole 41. The first inner conductor 61 is continuous with the outer conductor film 3 on the third outer surface 23. This point is different from the prior art described in Patent Document 1.

  The second hole 51 is also provided in the dielectric substrate 1. One end of the second hole 51 opens to the first outer surface 21 that is not covered by the outer conductor film 3, and the second hole 51 extends from the first outer surface 21 to the fourth outer surface 24 that is the opposite surface. The first hole 41 is continued inside the dielectric substrate 1.

  The second hole 51 includes a second inner conductor 81 inside. The second inner conductor 81 has one end located on the first outer surface 21 and the other end continuing to the first inner conductor 61. Since the first outer surface 21 is not covered with the outer conductor film 3, the second inner conductor 81 is not continuous with the outer conductor film 3. Accordingly, the first outer surface 21 is an open end surface. The second inner conductor 81 is formed of the same material and means as the first inner conductor 61. The second inner conductor 81 may be filled so as to fill a part or the whole of the second hole 51. Another feature of the present invention is that the second hole 51 and the second inner conductor 81 open to the first outer surface 21 that is not covered by the outer conductor film 3.

  In the illustrated embodiment, the second hole 51 has a substantially circular shape with an inner diameter D2, and the first hole 41 has a horizontal inner diameter D11 that is larger than a vertical inner diameter D12 as viewed in FIG. It has a large, substantially rectangular hole shape. The inner diameter D11 in the lateral direction is larger than the inner diameter D2 of the second hole 51. Therefore, the other end of the second hole 51 is connected to the first hole 41 within the lateral width of the first hole 41. As for the 1st hole 41, it is preferred that a corner is circular. In this figure, D11> D12, but it is also possible to satisfy D11 ≦ D12. In this figure, the first hole 41 further protrudes in the depth direction by a distance X1 from the connection region with the second hole 51 (see FIG. 3). Further, the distance d0 between the first outer surface 21 in which the second hole 51 is open and the first hole 41 is equal to the distance between the surface 24 facing the second hole 51 and the first hole 41. It is longer than the distance d1 (see FIG. 3). That is, d0> d1.

  Between the first inner conductor 61 provided on the inner surface of the first hole 41 and the outer conductor film 3 provided on the second outer surface 22, the fourth outer surface 24 to the sixth outer surface 26, There are dielectric layers 71 to 74 having thicknesses d1 to d4 (see FIGS. 3 and 4). Further, the terminal 11 is provided on the second outer surface 22 with a gap g21 between the outer conductor film 3 and the second outer surface 22. The terminal 11 is coupled to the first inner conductor 61 by a capacitance C02 through the dielectric layer 72.

  As described above, in the resonance part Q1, the first hole 41 has one end opened to the third outer surface 23, continuous with the outer conductor film 3, and the second outer surface facing the third outer surface 23. Head to 22. One end of the second hole 51 opens to the first outer surface 21 that is not covered by the outer conductor film 3, and extends from the first outer surface 21 toward the opposing fourth outer surface 24, and the other end. The dielectric substrate 1 is continuous with the first hole 41 inside the dielectric substrate 1.

  In this hole structure, since the first inner conductor 61 and the second inner conductor 81 are continuous with each other, the first hole 41 and the second hole 51 constitute one electric circuit. The first inner conductor 61 faces the outer conductor film 3 on the second outer surface 22 and the surface 24 to the sixth outer surface 26 via the dielectric layers 71 to 74. Accordingly, capacitive coupling occurs between the first inner conductor 61 and the outer conductor film 3.

  A plurality of the first holes 41 can be provided. In this case, each of the first holes 41 opens on a different surface, and the first inner conductor provided in each of the first holes 41 is continuous with the second inner conductor 81 inside the dielectric substrate 1. For example, in the embodiment shown in FIG. 1 to FIG. 4, one or a plurality of first holes 41 are provided from the direction intersecting with the second holes 51 and intersected with the end portions of the second holes 51. The respective inner conductors are made to be continuous with the second inner conductor 81 in the manner shown in FIGS. In the embodiment of FIGS. 1 to 4, the hexahedral dielectric substrate 1 is used, and therefore the third outer surface 23, the second outer surface 22, and the fourth outer surface 24 to the sixth outer surface 26 are used. Thus, the additional structure of the first hole 41 described above can be realized.

  As described above, the first inner conductor 61 provided in the first hole 41 faces the outer conductor film 3 through the dielectric layers 71, 73, and 74 of the dielectric substrate 1. A large capacitance is generated between the inner conductor film 61 and the outer conductor film 3. For this reason, the dielectric device according to the present invention resonates at a frequency lower than the electrical length with respect to the length L1 of the dielectric substrate 1 viewed in the axial direction of the second hole 51. In other words, in order to obtain a desired resonance frequency, the length L1 of the dielectric substrate 1 can be shortened, and a reduction in size and height can be achieved.

  Further, the distance d0 between the first outer surface 21 in which the second hole 51 is open and the first hole 41 is equal to the distance between the surface 24 facing the second hole 51 and the first hole 41. In the case of an embodiment that is longer than the distance (thickness) d1 and satisfies d0> d1, a capacitance according to the dimension of the distance (thickness) d1 can be acquired.

  Further, as a structural feature of the dielectric device according to the present invention, the first inner conductor 61 provided in the first hole 41 is continuous with the outer conductor film 3, and the second hole 51 is formed in the outer conductor film. 3 opens to the first outer surface 21 not covered by 3. The end portion of the second inner conductor 81 is naturally located on the first outer surface 21 not covered with the outer conductor film 3 and is separated from the outer conductor film 3. With such a structure, the wide first outer surface 21 where the second hole 51 opens serves as an open end surface, so that the surface is used as a pattern formation region for characteristic adjustment or an electronic component mounting region. It can be used, and a high degree of freedom in design can be ensured in the miniaturization and low profile.

  FIG. 5 is a perspective view showing another embodiment of the dielectric resonator, and FIG. 6 is a sectional view taken along line 6-6 of FIG. In the figure, the same components as those shown in FIGS. 1 to 4 are denoted by the same reference numerals, and redundant description will be omitted as much as possible. In the embodiment shown in FIGS. 5 and 6, the first hole 41 penetrates between the third outer surface 23 and the second outer surface 22. The terminal 11 is provided on the second outer surface 22 so as to face the second inner conductor 81 provided in the second hole 51 via the dielectric substrate 1. Also in the case of the dielectric resonator shown in the embodiment shown in FIGS. 5 and 6, the first outer surface 21 where the second hole 51 and the second inner conductor 81 open is covered with the outer conductor film 3. Therefore, while the size and the height are reduced, the plane area of the first outer surface 21 can be used to form a pattern, mount an electronic component, and the like, and a high degree of design freedom can be secured.

  7 is a perspective view showing an embodiment of the dielectric filter according to the present invention, FIG. 8 is a perspective view of the dielectric filter shown in FIG. 7 as viewed from the back side, and FIG. 9 is a sectional view taken along line 9-9 of FIG. It is. In these drawings, the terminal 11 is formed of a continuous conductor film straddling the second outer surface 22 and the fourth outer surface 24.

  10 is a perspective view showing an embodiment of a dielectric filter according to the present invention, FIG. 11 is a perspective view of the dielectric filter shown in FIG. 10 as seen from the back side, and FIG. 12 is a sectional view taken along line 12-12 in FIG. 13 is a cross-sectional view taken along line 13-13 of FIG. These drawings show an example of a dielectric filter having two resonance parts Q1 and Q2. Each of the resonance parts Q1 and Q2 is integrated by sharing the dielectric substrate 1.

  The resonating part Q <b> 1 includes a first hole 41 and a second hole 51. The first hole 41 and the second hole 51 can employ any of the structures shown and described above. One end of the first hole 41 opens in the third outer surface 23, and extends from the third outer surface 23 toward the second outer surface 22. The first hole 41 includes a first inner conductor 61 inside. The first inner conductor 61 is continuous with the outer conductor film 3 on the third outer surface 23.

  The second hole 51 has one end opened to the first outer surface 21 that does not face the third outer surface 23, and the other end connected to the other end of the first hole 41 inside the dielectric substrate 1. One end of the second inner conductor 81 provided in the second hole 51 opens to the first outer surface 21 that is not covered by the outer conductor film 3, and the other end is the first inside the dielectric substrate 1. The inner conductor 61 is continuous.

  The resonance part Q2 has substantially the same structure as the resonance part Q1, and includes a first hole 42 and a second hole 52. The first hole 42 and the second hole 52 may employ any of the structures shown and described in FIGS.

  In the dielectric filter shown in FIGS. 10 to 13, since the resonance part Q2 has the same structure as that of the resonance part Q1, the description of the resonance part Q1 can be applied to the resonance part Q2 with respect to its function and advantage. The action of the dielectric filter as a whole may further take into account the coupling between the resonance part Q1 and the resonance part Q2.

  Whether the coupling between the resonance part Q1 and the resonance part Q2 is capacitive coupling or inductive coupling determines whether the inner conductors 61 and 62 of the first holes 41 and 42 constituting the resonance parts Q1 and Q2 are used. And the capacitance formed between the inner conductors 61 and 62 of the first holes 41 and 42 and the outer conductor film 3. When the former is strong, capacitive coupling is dominant in Q1 and Q2, and when the latter is strong, inductive coupling is dominant.

  Further, according to the present invention, as a characteristic configuration, the first inner conductors 61 and 62 provided in the first holes 41 and 42 are connected to the outer conductor film 3. 52 opens in the first outer surface 21 not covered with the outer conductor film 3. With such a structure, since the wide first outer surface 21 in which the second holes 51 and 52 are opened becomes an open end surface, the surface is a region where conductor patterns 811 and 821 for characteristic adjustment are formed, Alternatively, it can be used as an area for mounting electronic components (not shown), and a high degree of freedom in design can be ensured while being downsized and reduced in height.

  Referring to FIGS. 11 and 13, the second outer surface 22 of the dielectric substrate 1 is provided with a first terminal 11 and a second terminal 12 that serve as input / output terminals. The first terminal 11 is provided at a position facing the first hole 41 via the dielectric layer 72 having a thickness d21, and is electrically insulated from the outer conductor film 3 by the insulating gap g21.

  The second terminal 12 is provided at a position facing the first hole 42 via the dielectric layer 75 having a thickness d22, and is electrically insulated from the outer conductor film 3 by the insulating gap g22.

  The distance between the first and second terminals 11 and 12 and the first inner conductors 61 and 62 of the first holes 41 and 42 is determined by the thickness of the dielectric layer therebetween, the dielectric constant and the area thereof. A coupling capacity is generated. It is not essential that the first and second terminals 11 and 12 overlap the first inner conductors 61 and 62 of the first holes 41 and 42. You may provide in the position which opposes partially or does not oppose. The insulating gaps g21 and g22 may be continued as one gap.

  FIG. 14 is a perspective view showing another embodiment of the dielectric filter according to the present invention. The feature of the embodiment shown in FIG. 14 is that the first and second terminals 11 and 12 are arranged at positions close to the first outer surface 21, overlap the second holes 51 and 52, and the second terminals This is in the point of being electrically coupled to the inner conductors 81 and 82. In the case of the dielectric resonator shown in FIG. 14 as well, the first outer surface 21 in which the second hole 51 and the second inner conductors 81 and 82 are opened is not covered with the outer conductor film 3, and therefore, the small size is small. With the reduction in height and height, it is possible to form a conductor pattern or mount an electronic component using the plane area of the first outer surface 21, and to ensure a high degree of design freedom. .

  FIG. 15 is a perspective view showing another embodiment of the dielectric filter according to the present invention. The feature of the embodiment shown in FIG. 15 is that the first and second terminals 11 and 12 are arranged at positions close to the first outer surface 21, overlap the second holes 51 and 52, and are formed in the holes. The second inner conductors 81 and 82 are electrically coupled to each other, and the first holes 41 and 42 penetrate between the third outer surface 23 and the second outer surface 22. is there. Also in the case of the dielectric resonator shown in FIG. 15, the first outer surface 21 in which the second holes 51 and 52 and the second inner conductors 81 and 82 are opened is not covered with the outer conductor film 3. It is possible to form a pattern or mount an electronic component by utilizing the plane area of the first outer surface 21 while being reduced in size and height, and has a high degree of design freedom. It can be secured.

  Next, the frequency attenuation characteristics of the embodiments shown in FIGS. 10 to 13, 14 and 15 will be described with reference to FIGS. First, FIG. 16 shows the frequency attenuation characteristic of the dielectric filter having the structure shown in FIGS. 10 to 13, and FIG. 17 shows the frequency attenuation characteristic of the dielectric filter described in Patent Document 1. The dielectric filter described in Patent Document 1 will be described by borrowing the illustration of FIGS. 10 to 13, and the first inner conductors 61 and 62 formed in the first holes 41 and 42 are the third ones. On the outer surface 23, the second inner conductors 81 and 82 separated from the outer conductor film 3 by the gap and provided in the second holes 51 and 52 are connected to the outer conductor film 3 on the first outer surface 21. It has a structure.

  When comparing FIG. 16 with FIG. 17, in the case of the dielectric filter according to the present invention, a clear attenuation pole appears in the frequency region of 3600 to 4100 (MHz) on the higher frequency side than the pass band.

  Next, FIG. 18 compares the frequency attenuation characteristic (curve A1) of the dielectric filter shown in FIGS. 10 to 13 with the frequency attenuation characteristic (curve B1) of the dielectric filter shown in FIG. FIG. In the frequency attenuation characteristics shown by the curves A1 and B1, only a slight shift of the attenuation pole is recognized.

  19 shows the frequency attenuation characteristic of the dielectric filter shown in FIG. 14, and FIG. 20 shows the frequency attenuation characteristic of the dielectric filter shown in FIG. As can be seen from FIG. 20, a low-frequency attenuation pole appears in the very vicinity of the pass frequency band (around 4100 MHz). Therefore, it can be said that the structure shown in FIG.

  FIG. 21 is a perspective view showing another embodiment of the dielectric filter according to the present invention. A feature of the embodiment shown in FIG. 21 is that the first outer surface 21 of the dielectric substrate 1 has a recess 101. The recess 101 includes second holes 51 and 52 constituting the resonance parts Q1 and Q2.

  According to the embodiment of FIG. 21, the coupling characteristics between the resonance part Q1 and the resonance part Q2 and each resonance frequency can be adjusted by selecting the dimension of the recess 101.

  22 is a perspective view showing another embodiment of the dielectric filter according to the present invention, and FIG. 23 is a sectional view taken along line 23-23 of FIG. In the illustrated embodiment, the first hole 41 includes a large diameter portion 411 and a small diameter portion 412. The large diameter portion 411 opens in the third outer surface 23, and the small diameter portion 412 continues below the large diameter portion 411. The first hole 42 also includes a large diameter portion 421 and a small diameter portion 422, the large diameter portion 421 opens to the third outer surface 23, and the small diameter portion 422 is continuous below the large diameter portion 421.

  In the case of the embodiments shown in FIGS. 22 and 23, the coupling characteristics and the resonance frequencies between the resonance part Q1 and the resonance part Q2 are selected by selecting the hole diameters of the large diameter parts (411, 421), (511, 521). Can be adjusted.

  24 is a perspective view showing a dielectric filter having three resonance parts Q1, Q2, and Q3, FIG. 25 is a perspective view of the dielectric filter shown in FIG. 24 as viewed from the back side, and FIG. 26 is a sectional view taken along line 26, and FIG. 27 is a sectional view taken along line 27-27 in FIG.

  Each of the resonating parts Q1, Q2, and Q3 is integrated with the dielectric substrate 1 in common. The dielectric substrate 1 is covered with the outer conductor film 3 for most of the surface except for the first outer surface 21.

  The resonating part Q1 includes a first hole 41 and a second hole 51. The resonance part Q <b> 2 includes a first hole 42 and a second hole 52. The resonance part Q3 includes a first hole 43 and a second hole 53. The individual structures and relative relationships of the first holes 41 to 43 and the second holes 51 to 53 are as described above.

  In the embodiment, in the resonance part Q2 located between the resonance parts Q1 and Q3, the depth of the first hole 42 is shallower than the resonance parts Q1 and Q3, and the thickness d12 of the dielectric layer 71 is the resonance part Q1. , Larger than the thicknesses d11 and d13 of the dielectric layer 71 in Q3. Therefore, the capacitance of the resonance part Q2 is smaller than the capacitances of the resonance parts Q1 and Q3.

  The first terminal 11 is disposed on the second outer surface 22 at a position corresponding to the first hole 41 while being electrically insulated from the outer conductor film 3 by the insulating gap g21.

  The second terminal 12 is disposed on the second outer surface 22 at a position corresponding to the third hole 43 while being electrically insulated from the outer conductor film 3 by the insulating gap g22.

  FIG. 28 is a perspective view showing another embodiment of the dielectric filter having three resonating portions Q1, Q2, and Q3, and FIG. 29 is a cross-sectional view thereof. The basic structure of the embodiment shown in FIGS. 28 and 29 is the same as that of the embodiment shown in FIGS. 24 to 27, but the first holes 41 to 43 constituting the resonance parts Q1 to Q3 are vertically long. Is different.

  In any of the dielectric resonators illustrated in FIGS. 21 to 29, the first outer surface 21 in which the second holes 51, 52, 53 and the second inner conductors 81, 82, 82 are opened is formed by the outer conductor film 3. It is not covered. Therefore, it is possible to form a pattern, mount an electronic component, etc. by using the plane area of the first outer surface 21 while being reduced in size and height, and has a high degree of design freedom. It can be secured.

  The dielectric device according to the present invention can be used as a device that covers a wide range of dielectric resonators, dielectric filters, or duplexers. Among these, the dielectric resonator and the dielectric filter have been described in detail with reference to FIGS. For the sake of space, the description of these is given above. However, it is obvious that more resonating parts can be provided, and that there can be many combinations of the illustrated and described embodiments. It is.

  Next, a duplexer which is another important application example of the dielectric device according to the present invention will be described.

  30 is a perspective view of the duplexer according to the present invention, FIG. 31 is a perspective view of the duplexer shown in FIG. 30 as viewed from the back side, and FIG. 32 is a cross-sectional view taken along line 32-32 of FIG. The illustrated duplexer has six resonance parts Q1 to Q6. Each of the resonating parts Q1 to Q6 is integrated by sharing the dielectric substrate 1. The dielectric substrate 1 is covered with the outer conductor film 3 in most of the surface except for one surface which becomes the first outer surface 21.

  Among the resonating parts Q1 to Q6, the resonating part Q1 is a combination of the first hole 41 and the second hole 51, the resonating part Q2 is a combination of the first hole 42 and the second hole 52, and the resonating part Q3. Includes combinations of the first hole 43 and the second hole 53, respectively. The resonance part Q4 is a combination of the first hole 44 and the second hole 54, the resonance part Q5 is a combination of the first hole 45 and the second hole 55, and the resonance part Q6 is a combination of the first hole 46 and the second hole 55. Each of the combinations with the holes 56 is included.

  The individual structures of the first holes (41 to 46) and the second holes (51 to 56) and the details of the relative relationship are as described with reference to FIGS. The first holes (41 to 46) have first inner conductors (61 to 66), and the second holes (51 to 56) have second inner conductors (81 to 86).

  Since the duplexer is used as an antenna duplexer, one of the resonance units Q1 to Q3 and the resonance units Q4 to Q6 is for transmission and the other is for reception. Since the transmission frequency and the reception frequency are different from each other, the resonance characteristics of the resonance parts Q1 to Q3 and the resonance characteristics of the resonance parts Q4 to Q6 are different from each other.

  Among the resonance parts Q1 to Q3 on the transmission side, in the first hole 41 included in the resonance part Q1, the first terminal 11 provided on the second outer surface 22 has a dielectric layer formed by the dielectric substrate 1. Are connected through.

  Among the resonance portions Q4 to Q6, the third terminal 13 provided on the second outer surface 22 of the dielectric substrate 1 is provided in the first hole 46 included in the resonance portion Q6. Combined through layers. The details of capacitive coupling in this case are also as already described.

  Furthermore, the second terminal 12 for antenna connection is connected to the first holes 43 and 44 of the intermediate resonance portions Q3 and Q4 on the second outer surface 22 side.

  The first to third terminals 11 to 13 are arranged on the second outer surface 22 in a state of being electrically insulated from the outer conductor film 3 by the insulating gaps g21 to g23. The first to third terminals 11 to 13 can be used for imposing on the mounting substrate.

  In the resonance parts Q1 to Q3, the first holes 41 to 43 are vertically long, and the first holes 44 to 46 of the resonance parts Q4 to Q6 are horizontally long. The first holes 41 to 43 of the resonance parts Q1 to Q3 are smaller in distance to the outer conductor film 3 than the first holes 44 to 46 of the resonance parts Q4 to Q6. Accordingly, the resonating parts Q1 to Q3 show inductive coupling, and the resonating parts Q4 to Q6 show capacitive coupling.

  Although illustration is omitted, it is needless to say that various structures (see FIGS. 1 to 15) exemplified for the dielectric resonator or the dielectric filter can be applied to the duplexer.

  The present invention is not limited to the above specific examples. In the dielectric substrate 1 that forms the plurality of resonance portions Q1 to Q6, the first holes 41 to 46 formed from a surface other than the first outer surface 21 do not necessarily have to be formed from the same side surface. You may install in a suitable side surface according to the convenience of input / output terminal and adjustment. Further, by configuring the fourth outer surface 24 facing the first outer surface 21 so as not to be covered with the outer conductor film 3, a λ / 2 type dielectric resonator can be obtained.

1 is a perspective view of a dielectric resonator according to the present invention. It is the perspective view which looked at the dielectric resonator shown in FIG. 1 from the back side. FIG. 3 is a sectional view taken along line 3-3 in FIG. 1. FIG. 4 is a cross-sectional view taken along line 4-4 of FIG. It is a perspective view which shows another Example of a dielectric resonator. FIG. 6 is a sectional view taken along line 6-6 of FIG. It is a perspective view which shows the Example of the dielectric material filter based on this invention. It is the perspective view which looked at the dielectric filter shown in FIG. 7 from the back side. FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 7. It is a perspective view which shows the Example of the dielectric material filter based on this invention. It is the perspective view which looked at the dielectric material filter shown in FIG. 10 from the back side. 12 is a sectional view taken along line 12-12 of FIG. FIG. 13 is a sectional view taken along line 13-13 of FIG. It is a perspective view which shows another Example of the dielectric material filter based on this invention. It is a perspective view which shows another Example of the dielectric material filter based on this invention. It is a figure which shows the frequency attenuation characteristic of the dielectric material filter which has the structure shown in FIGS. It is a figure which shows the frequency attenuation characteristic of the dielectric material filter described in patent document 1. FIG. It is a figure which compares and shows the frequency attenuation characteristic (curve A1) of the dielectric filter shown in FIGS. 10-13, and the frequency attenuation characteristic (curve B1) of the dielectric filter shown in FIG. It is a figure which shows the frequency attenuation characteristic of the dielectric material filter shown in FIG. It is a figure which shows the frequency attenuation characteristic of the dielectric material filter shown in FIG. It is a perspective view which shows another Example of the dielectric material filter based on this invention. . It is a perspective view which shows another Example of the dielectric material filter based on this invention. FIG. 23 is a cross-sectional view taken along line 23-23 in FIG. 22. It is a perspective view which shows the dielectric filter which has three resonance parts Q1, Q2, and Q3. It is the perspective view which looked at the dielectric material filter shown in FIG. 24 from the back side. 26 is a sectional view taken along line 26-26 in FIG. 24, and FIG. 27 is a sectional view taken along line 27-27 in FIG. FIG. 27 is a sectional view taken along line 27-27 in FIG. 26. It is a perspective view which shows another Example of the dielectric filter which has three resonance parts Q1, Q2, and Q3. It is a cross-sectional view of the dielectric filter shown in FIG. 1 is a perspective view of a duplexer according to the present invention. It is the perspective view which looked at the duplexer shown in FIG. 30 from the back side. FIG. 32 is a cross-sectional view taken along line 32-32 of FIG. 30.

Explanation of symbols

1 Dielectric substrate 21-26 External surface
3 Outer conductor film 41-46 1st hole 51-56 2nd hole

Claims (14)

A dielectric device including a dielectric substrate and at least one resonance part,
The dielectric substrate has a conductor film on the outer surface,
The resonating part includes a first hole and a second hole,
The first hole is
Provided on the dielectric base, one end is open on one surface of the outer surface, and is directed from the one surface toward the opposite outer surface, and includes a first inner conductor therein, and the first inner conductor is the outer conductor. Connected to the membrane,
The second hole is
Provided on the dielectric base, open to an outer surface not facing the one surface and not covered with the outer conductor film, connected to the first hole inside the dielectric base, Comprising a second inner conductor;
The second inner conductor has one end connected to the first inner conductor inside the dielectric substrate.
Dielectric device. The dielectric device according to claim 1, comprising:
The other end of the first hole protrudes in the depth direction from the connection region with the second hole,
A terminal provided on an outer surface of the dielectric substrate, the terminal being electrically connected to the first inner conductor provided at the other end of the first hole via the dielectric substrate; Bound to the
Dielectric device.   3. The dielectric device according to claim 1, wherein the resonance unit includes a plurality of resonance units, and each of the resonance units is electrically coupled to each other via the dielectric substrate. . A dielectric device according to any one of claims 1 to 3, wherein
The terminals include a first terminal and a second terminal,
The first terminal is provided on the dielectric base, and is electrically coupled to at least one of the resonating units,
The second terminal is provided on the dielectric base and is electrically coupled to at least one other of the resonance unit,
Dielectric device.   5. The dielectric device according to claim 4, wherein the first terminal is provided on the outer surface of the dielectric base, and is electrically connected to the first inner conductor via the dielectric base. Bonding dielectric device.   5. The dielectric device according to claim 4, wherein the first terminal is provided on the outer surface of the dielectric substrate, and is electrically connected to the second inner conductor via the dielectric substrate. Joining device.   5. The dielectric device according to claim 4, wherein the second terminal is provided on the outer surface of the dielectric substrate, and is electrically connected to the first inner conductor via the dielectric substrate. Joining device.   5. The dielectric device according to claim 4, wherein the second terminal is provided on the outer surface of the dielectric substrate, and is electrically connected to the second inner conductor via the dielectric substrate. Bonding dielectric device.   4. The dielectric device according to claim 3, wherein the plurality of resonating portions include step-shaped recesses, and the recesses are formed on an outer surface where the second hole is opened, and are formed therein. A dielectric device including a plurality of the second holes in common.   10. The dielectric device according to claim 1, wherein the first hole includes a large-diameter portion and a small-diameter portion, and the large-diameter portion opens on the one surface, and the small-diameter portion is formed. The part is a dielectric device connected to the large diameter part.   9. The dielectric device according to claim 1, wherein the second hole includes a large-diameter portion and a small-diameter portion, and the large-diameter portion is open to the second hole. A dielectric device which opens to a surface to be connected and the small diameter portion is continuous with the large diameter portion.   The dielectric device according to claim 3, wherein the dielectric device is a dielectric filter.   The dielectric device according to claim 3, wherein the dielectric device is a duplexer. 14. The dielectric device according to claim 13, further comprising three or more resonating parts and first to third terminals, wherein the first terminal is electrically connected to at least one of the resonating parts. And the second terminal is electrically coupled to at least one other of the resonating unit, and the third terminal is electrically coupled to at least one of the remaining resonating units. Dielectric device.