JP2007094088A - Display device - Google Patents

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Publication number
JP2007094088A
JP2007094088A JP2005284360A JP2005284360A JP2007094088A JP 2007094088 A JP2007094088 A JP 2007094088A JP 2005284360 A JP2005284360 A JP 2005284360A JP 2005284360 A JP2005284360 A JP 2005284360A JP 2007094088 A JP2007094088 A JP 2007094088A
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JP
Japan
Prior art keywords
led light
light emitting
color
display device
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005284360A
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Japanese (ja)
Inventor
Koichi Takao
浩市 高尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2005284360A priority Critical patent/JP2007094088A/en
Publication of JP2007094088A publication Critical patent/JP2007094088A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To improve the contrast between LED light emitting bodies which illuminate and LED light emitting bodies which do not illuminate in a display device which displays characters and patterns by blinking on/off control of LED light emission bodies arranged in a matrix. <P>SOLUTION: The LED light emitting bodies 10 of an LED display device of the present invention each comprises an LED light emitting element 11 as a light source, lead terminals 15a and 15b for supplying a current to the LED light emitting element, and a resin mold 12 serving as a lens. The LED light emitting element 11 is covered with the resin mold 12, whose color is different from the light emission color of the LED light emitting element 11. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、マトリクス状に配列された複数のLED発光体の点滅制御により、文字や図形を表示する表示装置に関し、特に表示内容のコントラストの向上に関するものである。   The present invention relates to a display device that displays characters and figures by controlling blinking of a plurality of LED light emitters arranged in a matrix, and particularly to an improvement in contrast of display contents.

従来から広告宣伝用の媒体として、複数のLED発光体をパネル全体にマトリクス状に配列して、個々のLED発光体の点滅制御により、文字や図形等による情報表示をする表示装置がある。   2. Description of the Related Art Conventionally, as a medium for advertising, there is a display device in which a plurality of LED light emitters are arranged in a matrix form on the entire panel, and information is displayed by characters, graphics, etc. by controlling blinking of the individual LED light emitters.

このような表示装置に使用されるLED発光体は、図3のLED発光体の断面図に示されるようにリード端子4a、4b、LED発光素子3及びLED発光素子3を覆うように形成され、レンズの役目を果たす樹脂モールド2などから構成される。   The LED light emitter used in such a display device is formed so as to cover the lead terminals 4a and 4b, the LED light emitting element 3 and the LED light emitting element 3 as shown in the sectional view of the LED light emitter of FIG. It is composed of a resin mold 2 that serves as a lens.

通常、単色のLED発光体の場合、不点灯の場合でも発光色をわかるようにするため図3の樹脂モールド2の色は、発光色に近い色で着色されている。   In general, in the case of a single color LED illuminant, the color of the resin mold 2 in FIG.

しかしながら、夜間などの周囲が暗い環境下で表示する場合は、不点灯のLED発光体は、点灯しているLED発光体とのコントラストが明確になり、視認性は良いが、昼間などの周囲が明るい環境下においては、不点灯であっても着色が、発光色に近いため、コントラストが不明確になり、見づらくなる。   However, when the display is performed in a dark environment such as at night, the non-lighted LED light emitter has a clear contrast with the lighted LED light emitter, and the visibility is good, In a bright environment, even when the lamp is not lit, the coloring is close to the emission color, so the contrast becomes unclear and difficult to see.

この対応としては、点灯させるLED発光体に多く電流を流すことで輝度を上げ、点灯と不点灯のLED発光体の輝度の差を大きくとることにより、コントラストを上げることが可能であるが、消費電力が大きくなるという新たな課題が発生する。   As a countermeasure for this, it is possible to increase the brightness by passing a large amount of current through the LED emitter to be lit, and to increase the contrast between the lit and unlit LED emitters. A new problem arises that electric power increases.

このような課題に鑑み、近年では、マトリクッス状に配列された複数のLED発光体と概ね同じピッチで形成された多数の開口を有する黒色板状のマスク部材をLED発光体が露出可能となるように配置することにより、コントラストの向上を図る構成がある(例えば、特許文献1)。   In view of such a problem, in recent years, the LED light emitter can be exposed through a black plate-like mask member having a large number of openings formed at substantially the same pitch as a plurality of LED light emitters arranged in a matrix. There is a configuration in which the contrast is improved by arranging them in (for example, Patent Document 1).

この構成によれば、コントラストの向上のため、LED発光体に流す電流を増加させる必要がない。
特開2003−173149号公報
According to this configuration, it is not necessary to increase the current flowing through the LED light emitter for improving the contrast.
JP 2003-173149 A

しかしながら、先行文献1の構成は、新たな部材が必要になり、コストの面で課題があるとともに、組立ての点においても容易ではないという課題がある。   However, the structure of the prior art document 1 requires a new member, and has a problem in terms of cost and a problem that it is not easy in terms of assembly.

本発明は、前記課題に鑑み、消費電力を増加させる必要がなく、且つ新規部材を必要とせずコントラストの向上を図ることができる表示装置を提供することを目的とする。   In view of the above-described problems, an object of the present invention is to provide a display device that does not need to increase power consumption and can improve contrast without requiring a new member.

上記目的を達成するために、本発明の請求項1記載の発明は、マトリクス状に配置された複数のLED発光体の点滅制御により文字や図形を表示する表示装置において、前記LED発光体はLED発光素子の発光色とレンズとなる樹脂モールドの色が異なる色である。   In order to achieve the above object, according to a first aspect of the present invention, there is provided a display device for displaying characters and figures by controlling blinking of a plurality of LED light emitters arranged in a matrix, wherein the LED light emitter is an LED. The light emission color of the light emitting element is different from the color of the resin mold serving as a lens.

係る構成によれば、点灯しているLED発光体の発光色と不点灯のLED発光体の色が異なるため、コントラストが向上し、視認性を向上させることができる。   According to such a configuration, since the light emission color of the lit LED light emitter is different from the color of the non-lighted LED light emitter, the contrast is improved and the visibility can be improved.

また、請求項2記載の発明は、請求項1記載の前記LED発光体の前記樹脂モールドの色は、前記発光色の色に比べ暗色系の色である。   According to a second aspect of the present invention, the color of the resin mold of the LED light emitter according to the first aspect is a darker color than the color of the luminescent color.

係る構成によれば、更にコントラスト比が大きくなり、視認性を向上させることができる。   According to such a configuration, the contrast ratio is further increased, and visibility can be improved.

以上のように、本発明によれば、発光色とLED発光体を構成する樹脂モールドの色を異なる色にするだけで、コントラストの向上を図ることができるため、LED発光体に流す電流を増加させる必要がないとともに、新規部材も必要としない。   As described above, according to the present invention, since the contrast can be improved only by changing the color of the light emitting resin and the resin mold constituting the LED light emitting body, the current flowing through the LED light emitting body is increased. It is not necessary to make them, and no new members are required.

以下本発明の実施の形態について、図面を参照しながら説明する。   Embodiments of the present invention will be described below with reference to the drawings.

図1は、本発明の表示装置に係るLED発光体の構成を示す断面図である。   FIG. 1 is a cross-sectional view illustrating a configuration of an LED light emitter according to a display device of the present invention.

図1に示されるように、LED発光体10は、光源となるLED発光素子11と、LED発光素子に電流を流すためのリード端子15a、15bと、LED発光素子11は、レンズとなる樹脂モールド12により覆われ、樹脂モールド12の色は、LED発光素子11の発光色と異なる色で着色されている。   As shown in FIG. 1, an LED light emitter 10 includes an LED light emitting element 11 that serves as a light source, lead terminals 15 a and 15 b that allow current to flow through the LED light emitting element, and the LED light emitting element 11 that is a resin mold that serves as a lens. 12 and the resin mold 12 is colored in a color different from the emission color of the LED light emitting element 11.

例えば、発光色が燈色のLED発光素子11であって、樹脂モールド12の色を半透明の青色系の色で着色されたLED発光体10を発光させると、LED発光素子11からの光は、減衰することなく燈色に発光する。   For example, if the LED light emitting element 11 having a light emission color of amber and having the resin mold 12 colored with a semi-transparent blue color is made to emit light, the light from the LED light emitting element 11 is emitted. It emits amber light without decaying.

即ち、このようなLED発光体10を用いて、図2の外観図に示すように表示装置20を構成し、「営業中」という文字を発光させた場合、「営業中」という文字の点灯部25とそれ以外の不点灯部21の色が異なるため、コントラストが明確になり、視認性が向上することになる。   That is, when such a LED light emitting body 10 is used to form the display device 20 as shown in the external view of FIG. 25 and the other non-lighting portions 21 are different in color, so the contrast becomes clear and the visibility is improved.

更に、樹脂モールド12の色を暗色系に色に着色することにより、点灯しているLED発光体と不点灯のLED発光体とのコントラスト比が大きくなるため、更に視認性の向上を図ることができる。   Further, by coloring the resin mold 12 in a dark color, the contrast ratio between the lit LED light emitter and the non-lighted LED light emitter is increased, so that the visibility can be further improved. it can.

なお、従来から不点灯の場合でも発光色がわかるように、樹脂モールドの色を発光色に近い色に着色していることに関しては説明したが、表示装置のように多数のLED発光体を基板上に実装する場合、予め発光色が判明したLED発光体がテーピングされたものから自動で実装されるため、発光色を人間の目で判別する必要がないことは、言うまでもない。   In addition, although it has been described that the resin mold is colored to a color close to the emission color so that the emission color can be seen even in the case of non-lighting, a large number of LED emitters are mounted on the substrate like a display device. Needless to say, in the case of mounting above, since the LED illuminant whose emission color is known in advance is automatically mounted from the taped one, it is not necessary to discriminate the emission color with human eyes.

本発明は、複数のLED発光体の点滅により、文字や図形を表示する表示装置における点灯部と不点灯部のコントラスト比を上げる上で、有用な技術である。   The present invention is a useful technique for increasing the contrast ratio between a lighting part and a non-lighting part in a display device that displays characters and figures by blinking a plurality of LED light emitters.

本発明の表示装置に係るLED発光体の断面図Sectional drawing of the LED light-emitting body which concerns on the display apparatus of this invention. 本発明の表示装置の表示状態を示す外観図FIG. 3 is an external view showing a display state of the display device of the present invention. 従来の表示装置に係るLED発光体の断面図Sectional drawing of the LED light-emitting body which concerns on the conventional display apparatus.

符号の説明Explanation of symbols

2、12 樹脂モールド
3、11 LED発光素子
2,12 Resin mold 3,11 LED light emitting element

Claims (2)

マトリクス状に配置された複数のLED発光体の点滅制御により文字や図形を表示する表示装置において、前記LED発光体はLED発光素子の発光色とレンズとなる樹脂モールドの色が異なる色であることを特徴とする表示装置。 In a display device that displays characters and figures by controlling blinking of a plurality of LED light emitters arranged in a matrix, the LED light emitter has a color different from the light emission color of the LED light emitting element and the color of the resin mold serving as a lens. A display device. 前記LED発光体の前記樹脂モールドの色は、前記発光色の色に比べ暗色系の色であることを特徴とする請求項1記載の表示装置。 The display device according to claim 1, wherein a color of the resin mold of the LED light emitter is a darker color than the color of the light emission color.
JP2005284360A 2005-09-29 2005-09-29 Display device Pending JP2007094088A (en)

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012027871A1 (en) * 2010-09-03 2012-03-08 Cree Huizhou Opto Limited Led package with contrasting face
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
US9035439B2 (en) 2006-03-28 2015-05-19 Cree Huizhou Solid State Lighting Company Limited Apparatus, system and method for use in mounting electronic elements
US8362605B2 (en) 2006-04-26 2013-01-29 Cree Huizhou Opto Limited Apparatus and method for use in mounting electronic elements
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US10892383B2 (en) 2007-10-31 2021-01-12 Cree, Inc. Light emitting diode package and method for fabricating same
US11791442B2 (en) 2007-10-31 2023-10-17 Creeled, Inc. Light emitting diode package and method for fabricating same
US9722158B2 (en) 2009-01-14 2017-08-01 Cree Huizhou Solid State Lighting Company Limited Aligned multiple emitter package
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
WO2012027871A1 (en) * 2010-09-03 2012-03-08 Cree Huizhou Opto Limited Led package with contrasting face
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces

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