JP2007088504A - Substrate heat treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate heat treatment apparatus for simplifying temperature control in cooling. <P>SOLUTION: Operating liquid is heated in a placing stand 1 by a heater 7 so that a substrate W on the placing stand 1 can be heated, and a cooling medium is supplied to a supply pipe 13, and the steam of the operating liquid in the placing stand 1 is cooled so that the substrate W can be cooled. Furthermore, the supply of the cooling medium to the supply pipe 13 is stopped after a temperature decreases to the neighborhood of a cooling temperature, and a temperature decreases in such a status that the cooling medium is not supplied afterwards so that a temperature can be smoothly changed. Therefore, even when the heat pipe-structure placing stand 1 whose thermal capacity is small is installed, temperature control in cooling can be simplified. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate heat treatment apparatus that heat-treats a circular semiconductor wafer or glass substrate (hereinafter simply referred to as a substrate), and more particularly to an apparatus that employs a heat pipe structure to reduce the heat capacity of a mounting table. .

  Conventionally, as this type of apparatus, for example, a mounting table having a heat pipe structure, a heater attached to the mounting table, a cooling plate attached to the mounting table, and a supply pipe for supplying a cooling medium to the cooling plate, Are provided.

  In the substrate heat treatment apparatus having such a configuration, since the heat capacity of the mounting table is small, heating and cooling by the heater can be rapidly performed, and the in-plane uniformity of temperature can be enhanced.

However, the conventional example having such a configuration has the following problems.
That is, in the conventional apparatus, when the cooling medium is circulated through the supply pipe when the mounting table is cooled, the mounting table having a small heat capacity is often too cold, and heating by the heater and cooling by the cooling plate are frequently performed alternately. There is a problem that temperature control during cooling is complicated due to necessity.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate heat treatment apparatus that can simplify temperature control during cooling.

In order to achieve such an object, the present invention has the following configuration.
That is, the invention described in claim 1 is a substrate heat treatment apparatus that includes a mounting table having a heat pipe structure and places a substrate on the mounting table for heat treatment, and heating means for heating the working fluid in the mounting table. And a cooling means attached to the mounting table for cooling the vapor of the working fluid in the mounting table, and a supply pipe for supplying a cooling medium to the cooling means. .

  [Operation / Effect] According to the invention described in claim 1, the heating means heats the working liquid in the mounting table to heat the substrate on the mounting table, and supplies the cooling medium to the supply pipe to mount the mounting table. The substrate is cooled by cooling the vapor of the working fluid inside. Therefore, temperature control during cooling can be simplified.

  Further, in the present invention, the mounting table includes a flat portion having an internal space below the mounting surface on which the substrate is mounted, and a hydraulic fluid chamber formed on the lower surface of the flat portion and communicating with the internal space. It is preferable to have it (claim 2).

  Moreover, in this invention, it is preferable that the said cooling means is attached to the lower surface of the mounting base mentioned above (Claim 3).

  Further, in the present invention, there are two hydraulic fluid chambers, which are disposed with the central portion of the mounting table interposed therebetween, and the cooling means is positioned between the two hydraulic fluid chambers. It is preferable that it is attached to (Claim 4).

  According to the substrate heat treatment apparatus according to the present invention, the heating unit heats the working liquid in the mounting table, the substrate on the mounting table is heated, the cooling medium is supplied to the supply pipe, and the working liquid in the mounting table is supplied. Cool by cooling the steam. Therefore, temperature control during cooling can be simplified.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram illustrating a schematic configuration of a substrate heat treatment apparatus according to an embodiment, FIG. 2 is a plan view of a mounting table, and FIG. 3 is a plan view of a cooling plate.

  The mounting table 1 employs a heat pipe structure to increase the in-plane uniformity of the temperature distribution while making the heat capacity extremely small, and the substrate W is mounted on the mounting surface 1a corresponding to the upper surface thereof. A plurality of metal small spheres (not shown) are fitted on the mounting surface 1a, and the substrate W is supported in a point contact state to prevent heat treatment unevenness, but the small spheres are omitted. The substrate W may be supported in a surface contact state.

  The flat part 3 in the upper part of the mounting table 1 has a cavity formed therein. The internal space 3a is decompressed due to the heat pipe structure, and a plurality of pillars 3b are erected so as to supplement the strength in the vertical direction.

  On the lower surface of the flat portion 3, two hydraulic fluid chambers 5 having recesses are provided so as to sandwich the central portion in plan view. In these hydraulic fluid chambers 5, a heater 7 corresponding to a heating unit is built in and hydraulic fluid 9 is stored. Examples of the working fluid 9 include water.

  Further, the hydraulic fluid chamber 5 communicates with the internal space 3a of the flat portion 3, and the mounting table 1 has a heat pipe structure. That is, the vapor of the working fluid 9 moves through the internal space 3a or transfers the latent heat of vaporization.

  A cooling plate 11 corresponding to the cooling means in the present invention is attached to a central portion of the flat portion 3 in plan view, that is, a position sandwiched between the two hydraulic fluid chambers 5.

  The cooling plate 11 is formed, for example, by bonding two metal plates having high thermal conductivity, and a flow path 11a is cut off on the mating surface. The flow path 11a is meandered in order to make the flow path length as long as possible, and has an inlet 11b formed at the center of the cooling plate 11 and an outlet 11c formed beside it. Communicate.

  Although heat is less likely to be radiated in the central portion of the mounting table 1a than in the peripheral portion, the cooling efficiency can be improved by providing the cooling plate 11 in the central portion in this way. Therefore, heat can be efficiently absorbed and a rapid cooling process is possible.

  A supply pipe 13 is attached to the inlet 11b of the cooling plate 11 described above, while a discharge pipe 15 is attached to the outlet 11c. The supply pipe 13 and the discharge pipe 15 are connected to the heat exchanger 17.

  The heat exchanger 17 stores the cooling medium and cools the cooling medium to the tank 21 for cooling the cooling medium to the cooling temperature T by the cooling water supply pipe 19 and the delivery pipe 22 connected to the supply pipe 13. When the pressure of the cooling medium sent out from the pump 23 exceeds a certain value, the pump 23 that sends out the refrigerant from the tank 21, the recovery pipe 25 that guides the cooling medium discharged through the discharge pipe 15 to the tank 21, and the sending pipe 22 And a relief valve 27 for bypassing the recovery pipe 25.

  In recent heat treatment for excimer laser, the heating temperature is often set in the range of 70 to 150 ° C. Therefore, a fluororesin oil is preferable as the cooling medium, and specifically perfluoropolyether is preferable. More specifically, a cooling medium commercialized under the trade name GALDEN HT200 (AUSIMONT, Italy) may be mentioned.

  By the way, when water is used as the cooling medium, the heating temperature of the substrate W may exceed the boiling point of water, so there is a risk of steam explosion, and the supply pipe 13, the discharge pipe 15, the cooling plate 11, etc. It must be strong enough to withstand it. Then, there is a problem that the heat capacity of the mounting table 1 is inevitably increased and the temperature lowering performance is lowered. However, since this perfluoropolyether has a boiling point of about 200 ° C., even if it leaks like water, it does not cause such a problem while being safe for the human body.

  An electromagnetic on-off valve 29 is provided between the supply pipe 13 and the delivery pipe 22. The electromagnetic on / off valve 29 is controlled to be opened and closed by a controller 31.

  The controller 31 is a power switch 35 for connecting an AC power source to the heater 7 based on temperature information from a thermometer 33 embedded in the mounting table 1 so that the temperature of the substrate W on the mounting surface 1a can be measured. ON / OFF control.

  Next, the flow of processing by the substrate heat treatment apparatus having the above-described configuration will be described with reference to the flowchart of FIG. In this example, the case where the temperature of the mounting surface 1a of the mounting table 1 is lowered to a new set temperature for heating the substrate using a cooling medium will be described as an example.

  The pump 23 is always operating, and the cooling water is constantly circulated through the cooling pipe 19. In the initial state, the electromagnetic on-off valve 29 is closed. Therefore, the cooling medium is returned to the tank 21 through the relief valve 27 and the recovery pipe 25 and is cooled by the cooling water.

Step S1
The controller 31 turns on the power switch 35 to energize the heater 7 and heats the mounting surface 1a to a predetermined heating temperature. In this substrate heat treatment apparatus, since the mounting table 1 has a heat pipe structure, the temperature of the mounting surface 1a quickly rises to the heating temperature.

Step S2
After confirming that the placement surface 1a has reached the heating temperature, the substrate W is placed on the placement surface 1a using a transfer robot (not shown) or manually. From this point, the substrate W is subjected to heat treatment.

Step S3
After the substrate W is placed on the placement surface 1a for a predetermined time and subjected to a predetermined heat treatment, the substrate W is unloaded by a transfer robot (not shown), and the controller 31 turns off the power switch 35 and supplies it to the heater 7. End energization.

Step S4
Next, in order to process the substrate W at a new set temperature, the controller 31 opens the electromagnetic on-off valve 29 in order to set the temperature of the mounting surface 1a of the mounting table 1 to a new set temperature.

  As a result, the cooling medium is fed into the delivery pipe 22, the pressure of the cooling medium decreases, and the relief valve 27 is automatically closed. That is, the bypass formed by the relief valve 27 is closed. As a result, the cooling medium from the heat exchanger 17 is supplied into the cooling plate 11 through the supply pipe 13 and acts to cool the whole from the center of the lower surface of the mounting table 1.

Step S5
The controller 31 monitors the temperature information of the thermometer 33 and branches the process depending on whether or not the temperature has approached the cooling temperature T as a new set temperature.

  Specifically, step S5 is repeatedly executed until the temperature of the mounting surface 1a obtained from the temperature information is within a deviation Ta (for example, 2 ° C.) with respect to the cooling temperature T, and is within the deviation Ta. Then, the process proceeds to step S6.

Step S6
When the temperature of the mounting surface 1 a falls within the deviation Ta of the cooling temperature T, the controller 31 closes the electromagnetic on-off valve 29. As a result, the supply of the cooling medium to the cooling plate 11 is stopped, and thereafter, the temperature of the mounting surface 1a is lowered to the cooling temperature T by natural heat dissipation.

  By the way, when the electromagnetic on-off valve 29 is closed, the pressure in the delivery pipe 22 is increased and the relief valve 27 is automatically opened. Thus, a bypass is formed again, and the cooling medium is circulated through the tank 21 and cooled to the cooling temperature T.

  In this way, when the supply of the cooling medium is stopped, the cooling medium can continue to absorb heat by circulating the cooling medium inside the heat exchanger 17, so that the next time cooling is necessary. It can cope with rapid cooling.

  In the substrate heat treatment apparatus as described above, since the supply of the cooling medium to the supply pipe 13 is stopped after the temperature is lowered to around the cooling temperature T, the temperature is lowered after the cooling medium is not supplied. Thus, the temperature can be changed gradually. Therefore, even if the mounting table 1 having a heat pipe structure with a small heat capacity is provided, temperature control during cooling can be simplified.

  The present invention can be modified as follows.

  (1) The cooling plate 11 may be provided not only in the central portion of the lower surface of the mounting table 1 but also in the peripheral portion. Further, when the peripheral portion is thick and the temperature is less likely to decrease than the central portion, a cooling plate may be provided only in the peripheral portion.

  (2) Instead of the cooling plate 11, a cooling pipe may be adopted, and the cooling pipe may be provided along the lower surface of the mounting table 1.

  (3) The heat pipe structure is not limited to the form of the above-described embodiment. For example, a plurality of columnar heat pipes may be erected in the flat portion 3 of the mounting table 1. Good. In particular, when the plate surface temperature is controlled with high accuracy during cooling, a structure in which a wick material such as glass fiber is attached to the inner wall surface of the decompressed internal space is preferable.

  (4) As the cooling medium, ethylene glycol, nitrogen, air, helium or the like can be further selected.

  (5) In the above embodiment, the temperature of the mounting surface 1a of the mounting table 1 has been described as being lowered to a new set temperature for heating the substrate. The present invention is also applicable to the case where the temperature of the mounting surface 1a of the mounting table 1 is cooled to a predetermined cooling temperature after the substrate W is heated, and the substrate W is cooled as it is.

It is a schematic block diagram of the substrate heat processing apparatus which concerns on an Example. It is a top view of a mounting base. It is a top view of a cooling plate. It is a flowchart with which operation | movement description is provided.

Explanation of symbols

W ... Substrate 1 ... Mounting table 11 ... Cooling plate 13 ... Supply piping 15 ... Discharge piping 17 ... Heat exchanger 19 ... Cooling piping 21 ... Tank 25 ... Recovery piping 27 ... Relief valve 29 ... Electromagnetic on-off valve 31 ... Controller

Claims (4)

In a substrate heat treatment apparatus that includes a mounting table of a heat pipe structure and mounts a substrate on the mounting table and performs heat treatment,
Heating means for heating the working fluid in the mounting table,
A cooling means attached to the mounting table for cooling the vapor of the working fluid in the mounting table;
A supply pipe for supplying a cooling medium to the cooling means;
A substrate heat treatment apparatus comprising: The substrate heat treatment apparatus according to claim 1,
The mounting table includes a flat portion having an internal space below the mounting surface on which the substrate is mounted, and a hydraulic fluid chamber formed on the lower surface of the flat portion and communicating with the internal space. A substrate heat treatment apparatus. The substrate heat treatment apparatus according to claim 1 or 2,
The substrate heat treatment apparatus, wherein the cooling means is attached to the lower surface of the mounting table. The substrate heat treatment apparatus according to claim 2 or 3,
The hydraulic fluid chamber has two, and is disposed with the central portion of the mounting table interposed therebetween,
The substrate heat treatment apparatus, wherein the cooling means is attached at a position sandwiched between the two hydraulic fluid chambers.

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