JP2007087619A - Method of manufacturing film, method of manufacturing device, device, electrooptical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a film capable of improving uniformity of the film by reducing film thickness irregularity, to provide a method of manufacturing an electrooptical device, and to provide the electrooptical device and electronic equipment. <P>SOLUTION: A material solution 26 of a hole injection layer, material solutions 27R, 27G and 27B of luminescent layers, a material solution 28 of an electron injection layer and a solvent solution 52 for film thickness adjustment are applied to element formation areas 10 of an organic EL display by superposing them on one another and dried. The solutions are selected such that the material solution 26 of a hole injection layer and the material solutions 27R, 27G and 27B of luminescent layers are incompatible with each other, the material solutions 27R, 27G and 27B of luminescent layers and the material solution 28 of an electron injection layer are incompatible with each other, and the material solution 28 of an electron injection layer and the solvent solution 52 for film thickness adjustment are incompatible with each other. Since the respective material solutions applied by being superposed on one another are incompatible with one another, they are dried in a flat form and each film is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a film manufacturing method, a device manufacturing method, a device, an electro-optical device, and an electronic apparatus.

In recent years, flat panel displays used in electronic devices such as personal computers and mobile phones are increasingly required to have higher density, higher image quality, and longer life.
As a flat panel display, for example, when unevenness occurs in the film thickness of the hole injection layer / transport layer, the light emitting layer, and the electron injection layer of the elements constituting the pixel in the organic EL display device, light emission color unevenness and luminance unevenness occur, In addition, a portion where a lot of electricity flows is created, and the life is shortened. Therefore, it is effective to make the film thickness uniform in order to achieve a long lifetime and high image quality. In the step of forming the hole injection layer / transport layer, light emitting layer, and electron injection layer, droplets are discharged onto the substrate. In many cases, a polymer material is applied by a droplet discharge method. After applying the functional liquid in the bank, it was dried to form a film. At that time, there is a problem that the liquid material flows during the drying process and the uniformity of the film thickness decreases.
Furthermore, a difference in molecular partial pressure of the solvent to be evaporated occurs between the end portion and the central portion in the pixel region on the substrate, resulting in uneven drying speed. The difference in the drying time of the liquid applied on the pixel reduces the uniformity of the film thickness within the pixel. As shown in Patent Document 1, as a method for improving the uniformity of film thickness, a functional liquid is applied to a non-display area where pixels are not arranged, and an end portion and a central portion in the pixel region on the substrate A method for controlling the drying time of a functional liquid by bringing the molecular partial pressure difference of the evaporating solvent closer is introduced.

JP 2002-222695 A (page 6, FIG. 3)

However, in the method disclosed in Patent Document 1, it is necessary to enlarge the non-display area for discharging droplets, and the area of the display area of the substrate is reduced. Further, in Patent Document 1, the uniformity of the film thickness at the end portion of the display area can be improved, but the problem that the film thickness uniformity of the entire display area is lowered cannot be solved.
The present invention has been made in view of the above problems, and its object is to provide a film manufacturing method, a device manufacturing method, a device, an electro-optical device, and an electronic apparatus that can improve film thickness uniformity. It is to provide.

  In order to solve the above-described problems, the film manufacturing method of the present invention is a film manufacturing method in which a plurality of films are stacked by disposing a plurality of functional liquids on the substrate, and the film is formed on the substrate. The first functional liquid, which is a liquid, is applied, the first layer disposing step of disposing the first layer, and the second functional liquid incompatible with the first functional liquid are applied on the first layer. And a second layer disposing step of disposing the second layer, and a drying step of drying the first layer and the second layer.

  According to this, the liquid 2nd functional liquid is arrange | positioned on the liquid 1st functional liquid. Since the first functional liquid and the second functional liquid are incompatible, the boundary surface between the first functional liquid and the second functional liquid is in a flat state due to surface tension. And by drying in this state, the film thickness becomes uniform. Therefore, the uniformity of the film thickness of the first layer can be improved.

  The film manufacturing method of the present invention is a film manufacturing method in which a plurality of functional liquids are arranged on a substrate to form a plurality of films, and the first functional liquid is a functional liquid on the substrate. A first layer disposing step of disposing the first layer, a second functional liquid incompatible with the first functional liquid being applied on the first layer, and the second layer A second layer disposing step of disposing a second functional liquid and a third functional liquid that is incompatible with the second functional liquid on the second layer and disposing the third layer And a drying step of drying the first layer, the second layer, and the third layer.

  According to this, the liquid second functional liquid is disposed on the liquid first functional liquid, and the liquid third functional liquid is disposed on the second functional liquid. Since the first functional liquid and the second functional liquid are incompatible, and the second functional liquid and the third functional liquid are incompatible, the first functional liquid and the second functional liquid The boundary surface between the liquid and the boundary surface between the second functional liquid and the third functional liquid are in a flat state due to surface tension. And drying in this state reduces film thickness unevenness. Therefore, the uniformity of the film thickness of the first layer and the second layer can be improved.

  The film manufacturing method of the present invention is a film manufacturing method in which a plurality of functional liquids are arranged on a substrate to form a plurality of films, and the first functional liquid is a functional liquid on the substrate. A first layer disposing step of disposing the first layer, a second functional liquid incompatible with the first functional liquid being applied on the first layer, and the second layer A second layer disposing step for disposing a solvent, a solvent disposing step for disposing a solvent incompatible with the second functional liquid on the second layer, a first layer, a second layer, and a solvent. And a drying step of drying.

  According to this, the liquid second functional liquid is disposed on the liquid first functional liquid, and the liquid solvent is disposed on the liquid second functional liquid. Since the first functional liquid and the second functional liquid are incompatible, and the second functional liquid and the solvent are incompatible, the boundary surface between the first functional liquid and the second functional liquid Then, the boundary surface between the second functional liquid and the solvent becomes flat due to surface tension. And drying in this state reduces film thickness unevenness. Therefore, the uniformity of the film thickness of the first layer and the second layer can be improved.

  The film manufacturing method of the present invention is a film manufacturing method in which a plurality of functional liquids are arranged on a substrate to form a plurality of films, and the first functional liquid is a functional liquid on the substrate. A first layer disposing step of disposing the first layer, a second functional liquid incompatible with the first functional liquid being applied on the first layer, and the second layer A second layer disposing step of disposing a second functional liquid and a third functional liquid that is incompatible with the second functional liquid on the second layer and disposing the third layer A process, a solvent disposing process for disposing a solvent incompatible with the third functional liquid on the third layer, and drying for drying the first layer, the second layer, the third layer, and the solvent And a process.

  According to this, the liquid second functional liquid is disposed on the liquid first functional liquid, and the liquid third functional liquid is disposed on the liquid second functional liquid. The Further, a liquid solvent is disposed on the liquid third functional liquid. The first functional liquid and the second functional liquid are incompatible, and the second functional liquid and the third functional liquid are incompatible. Furthermore, since the third functional liquid and the solvent are incompatible, the boundary surface between the first functional liquid and the second functional liquid, and the boundary surface between the second functional liquid and the third functional liquid The boundary surface between the third functional liquid and the solvent becomes flat due to surface tension. And by drying in this state, the film thickness nonuniformity of each film | membrane reduces. Therefore, the uniformity of the film thicknesses of the first layer, the second layer, and the third layer can be improved.

In the method for producing a film of the present invention, the drying step may be performed using a vacuum drying method.
According to this, among the liquid functional liquids and solvents arranged in layers, the liquid arranged on the surface is gradually dried to a viscosity at which liquid flow does not occur by the reduced pressure drying method, so it is arranged on the surface most. The liquid is dried in a flat form as compared with the case of drying by vacuum drying, heating, or energy ray irradiation. Accordingly, since the liquid disposed under the liquid on the most surface cannot flow, the liquid is dried in a flat state as compared with the case where the liquid is dried by vacuum drying, heating, or irradiation with energy rays. As a result, it is possible to improve the uniformity of the film thickness of each arranged layer.

In the method for producing a film of the present invention, the method of disposing the functional liquid or the solvent may be performed using a droplet discharge method.
According to this, by using the droplet discharge method, the consumption of the functional liquid is not wasted compared to other coating techniques such as spin coating, and the amount and position of the functional liquid disposed on the substrate can be controlled. Easy to do.

A device manufacturing method of the present invention is a device manufacturing method using the above-described film manufacturing method, wherein the device has a hole injection layer, a light emitting layer, and an electron injection layer, and the first layer has , A hole injection layer, and the second layer may be a light emitting layer.
According to this, since the uniformity of the film thickness of the first layer can be improved, the film thickness uniformity of the hole injection layer can be improved. Furthermore, when it has a solvent arrangement | positioning process, the uniformity of the film thickness of a light emitting layer can be improved.

A device manufacturing method of the present invention is a device manufacturing method using the above-described film manufacturing method, wherein the device has a hole injection layer, a light emitting layer, and an electron injection layer, and the first layer has The light emitting layer, and the second layer may be an electron injection layer.
According to this, since the uniformity of the film thickness of the first layer can be improved, the uniformity of the film thickness of the light emitting layer can be improved. Furthermore, when it has a solvent arrangement | positioning process, the uniformity of the film thickness of an electron injection layer can be improved.

A device manufacturing method of the present invention is a device manufacturing method using the above-described film manufacturing method, and the device includes an electron injection layer, a light emitting layer, and a hole injection layer, The layer may be an electron injection layer and the second layer may be a light emitting layer.
According to this, since the uniformity of the thickness of the first layer can be improved, the uniformity of the thickness of the electron injection layer can be improved. Furthermore, when it has a solvent arrangement | positioning process, the uniformity of the film thickness of a light emitting layer can be improved.

A device manufacturing method of the present invention is a device manufacturing method using the above-described film manufacturing method, and the device includes an electron injection layer, a light emitting layer, and a hole injection layer, The layer may be a light emitting layer and the second layer may be a hole injection layer.
According to this, since the uniformity of the film thickness of the first layer can be improved, the uniformity of the film thickness of the light emitting layer can be improved. Furthermore, when it has a solvent arrangement | positioning process, the uniformity of the film thickness of a positive hole injection layer can be improved.

A device manufacturing method of the present invention is a device manufacturing method using the above-described film manufacturing method, wherein the device has a hole injection layer, a light emitting layer, and an electron injection layer, and the first layer has , A hole injection layer, the second layer may be a light emitting layer, and the third layer may be an electron injection layer.
According to this, since the uniformity of the film thickness of the first and second layers can be improved, the film thickness uniformity of the hole injection layer and the light emitting layer can be improved. Furthermore, when it has a solvent arrangement | positioning process, the uniformity of the film thickness of an electron injection layer can be improved.

A device manufacturing method of the present invention is a device manufacturing method using the above-described film manufacturing method, and the device includes an electron injection layer, a light emitting layer, and a hole injection layer, The layer may be an electron injection layer, the second layer may be a light emitting layer, and the third layer may be a hole injection layer.
According to this, since the uniformity of the film thickness of the first and second layers can be improved, the uniformity of the film thickness of the electron injection layer and the light emitting layer can be improved. Furthermore, when it has a solvent arrangement | positioning process, the uniformity of the film thickness of a positive hole injection layer can be improved.

The device of the present invention is manufactured using the above-described device manufacturing method.
According to this, this device is manufactured by a manufacturing method capable of improving the uniformity of film thickness in at least one of the electron injection layer, the light emitting layer, and the hole injection layer. Therefore, a device having a layer with improved film thickness uniformity can be obtained.

The gist of the electro-optical device of the present invention is to include the above-described device.
According to this, since the device described above is a device having a layer with improved film thickness uniformity, the electro-optical device provided with this device is an electro-optical device with improved luminance uniformity. Can do.

The gist of the electronic apparatus of the present invention is that the electro-optical device described above is provided as a display unit.
According to this, since the above-described electro-optical device is an electro-optical device with improved luminance uniformity, an electronic apparatus including the electro-optical device as a display unit has improved luminance uniformity. It can be set as the electronic device provided with the display part.

(First embodiment)
Hereinafter, a first embodiment of an organic electroluminescence display embodying the present invention (hereinafter referred to as “organic EL display”) will be described with reference to FIGS.
FIG. 1 is a planar schematic circuit layout diagram of the organic EL display of the present invention, and FIG. 2 is a cross-sectional view of the organic EL display taken along the line aa in FIG.

  As shown in FIG. 1, an organic EL display 1 as an electro-optical device includes a display unit 2 and a flexible circuit board 3 connected to the lower side of the display unit 2.

  The display unit 2 includes a substrate 4. In this embodiment, the substrate 4 is made of a glass plate. As shown in FIGS. 1 and 2, the substrate 4 includes a substantially quadrangular display region 5 at the approximate center thereof. In the display area 5, as shown in FIG. 1, m × n pixels 6 are formed in a matrix. A pair of scanning line drive circuits 8 and an inspection circuit 9 are formed on the substrate 4 in an area other than the display area 5 (hereinafter referred to as a non-display area 7).

  In the display area 5, m groups of n pixels 6 are formed per row. It consists of a red organic EL element 10R as a device that emits red light, a green organic EL element 10G as a device that emits green light, and a blue organic EL element 10B as a device that emits blue light. One pixel is used as a structural unit. The organic EL elements for color 10R, 10G, and 10B are arranged in the order of the organic EL element for red 10R, the organic EL element for green 10G, and the organic EL element for blue 10B along the X direction (column direction) in FIG. ing.

  That is, the organic EL elements 10R, 10G, and 10B for each color are arranged along the X direction in FIG. 1 with the organic EL element 10R for red, the organic EL element 10G for green, the organic EL element 10B for blue, and the organic EL element 10R for red. , Green organic EL elements 10G,... In addition, organic EL elements 10R, 10G, and 10B of the same color are arranged along the Y direction (row direction) in FIG. The organic EL elements for color 10R, 10G, and 10B are arranged at equal intervals with the adjacent organic EL elements for color 10R, 10G, and 10B.

  As shown in FIG. 2, each color organic EL element 10 </ b> R, 10 </ b> G, 10 </ b> B is formed on a circuit forming layer 4 b formed on the substrate 4. The circuit formation layer 4b includes circuit elements such as the thin film transistors 11 for driving the respective pixels 6 formed in the display area 5, and the scanning line driving circuit 8 or the inspection circuit 9 formed in the non-display area 7. It is a layer in which circuit elements to be formed are formed. In addition, in a region corresponding to the display region 5 on the circuit forming layer 4b, a bank 12 that partitions each organic EL element 10R, 10G, 10B in a matrix is formed.

The surface of the bank 12 has liquid repellency. The bank 12 may be made of a material having liquid repellency, for example, a fluorine resin. Further, the bank 12 may be a bank whose pattern is formed using a material having no liquid repellency, for example, a resin such as an acrylic resin or a polyimide resin, and whose surface is made liquid repellant by CF ₄ plasma treatment or the like. .

  A pixel electrode 13 is formed on each of the bottoms of the concave regions (hereinafter referred to as element forming regions 10) partitioned by the banks 12 on the circuit forming layer 4b. Each pixel electrode 13 is electrically connected to the corresponding thin film transistor 11 through a contact hole 14. On each pixel electrode 13, a hole injecting and transporting layer (hereinafter referred to as a hole injecting layer 15) as a first layer, light emitting layers 16 R, 16 G, and 16 B as second layers, and a third layer The functional layer 18 is formed by laminating layers as films in the order of the electron injecting and transporting layer (hereinafter referred to as the electron injecting layer 17).

  The hole injection layer 15 has a function of generating and propagating holes upon receiving the voltage of the pixel electrode 13, and the thickness of the layer is formed uniformly by the manufacturing method of the present invention. In this embodiment, a material containing poly (3,4-ethylenedioxythiophene) (hereinafter referred to as PEDOT) and polystyrene sulfonic acid (hereinafter referred to as PSS) as an insulating material as its forming material. Is adopted.

  The light emitting layers 16R, 16G, and 16B are layers made of an organic light emitting material that emits light, and the thicknesses of the layers are uniformly formed by the manufacturing method of the present invention. In the present embodiment, a material containing MEHPPV (poly (3-methoxy, 6- (3-ethylhexyl) paraphenylenevinylene) is used as a material for forming the red light-emitting layer 16 R. Formation of the green light-emitting layer 16 G A material containing a mixed solution of polydioctylfluorene and F8BT (an alternating copolymer of dioctylfluorene and benzothiadiazole) is used as a material, and a material containing polydioctylfluorene is used as a material for forming the blue light emitting layer 16B. is doing.

  The electron injection layer 17 has a function of transmitting electrons to the light emitting layers 16R, 16G, and 16B, and the thickness of the layer is uniformly formed by the manufacturing method of the present invention. In this embodiment, a material containing a bisacetylacetonate / calcium complex (Ca (acac) 2) is used as a material for forming the layer.

  A cathode 19 is formed over the entire surface of the functional layer 18 and the bank 12, and electrons are caused to flow through the electron injection layer 17. A part of the cathode 19 is formed so as to cover the non-display area 7. The cathode 19 is made of a conductive material having optical transparency. In this embodiment, the cathode 19 has an aluminum thin film formed by a vapor deposition method.

  Then, the pixel electrode 13, the hole injection layer 15, the light emitting layer 16R, the electron injection layer 17, and the cathode 19 described above are laminated to constitute the red organic EL element 10R. Further, the pixel electrode 13, the hole injection layer 15, the light emitting layer 16G, the electron injection layer 17, and the cathode 19 are laminated to constitute the green organic EL element 10G. Similarly, the pixel electrode 13, the hole injection layer 15, the light emitting layer 16B, the electron injection layer 17, and the cathode 19 are laminated to constitute the blue organic EL element 10B.

  A sealing portion 20 made of a light transmissive material is formed so as to cover the entire surface of the cathode 19. As shown in FIG. 1, a pair of scanning line driving circuits 8 are arranged in the non-display area 7 on the substrate 4 so as to sandwich the display area 5 described above. Each scanning line driving circuit 8 outputs a scanning signal for selecting a desired group of pixels 6 in the m-row pixels 6 group described above. Further, as shown in FIG. 1, an inspection circuit 9 is formed in the non-display area 7 on the Y arrow direction side of the display area 5 on the substrate 4. The inspection circuit 9 is a circuit for inspecting whether the organic EL elements 10R, 10G, and 10B for each color are normally driven, and the organic EL display 1 is driven and inspected before shipping.

  As shown in FIG. 1, a data line driving circuit 21 and a control circuit 22 are formed on the flexible circuit board 3. The data line driving circuit 21 outputs driving signals for the organic EL elements 10R, 10G, and 10B for the respective colors to the group of pixels 6 in the row selected by the scanning line signal output from the scanning line driving circuit 8. The light emission luminance of each color organic EL element 10R, 10G, 10B is determined by this drive signal. Thereby, the color and light emission luminance of each pixel 6 are determined.

  The control circuit 22 is a circuit for comprehensively controlling the driving of the scanning line driving circuit 8 and the data line driving circuit 21, generates various control signals, and uses the generated control signals as the scanning line driving circuit 8 and the data line. Each is output to the drive circuit 21.

  In the organic EL display 1 configured as described above, the scanning line driving circuit 8 and the data line driving circuit 21 are controlled and driven by various control signals output from the control circuit 22, and the organic EL elements 10R, 10G, and The light emission luminance of 10B is controlled. As a result, a desired image is displayed on the display area 5.

Next, in manufacturing the organic EL display 1, a droplet discharge device 30 for forming the hole injection layer 15, the light emitting layers 16R, 16G, and 16B and the electron injection layer 17 by the droplet discharge method is described with reference to FIGS. explain. FIG. 3 is a schematic perspective view of the droplet discharge device. FIG. 4 is a schematic perspective view of the head portion of the droplet discharge device, and FIG. 5 is a cross-sectional view of the main portion of the head portion.
There are various types of droplet discharge devices, but a device using an ink jet method is preferable. The ink jet method is suitable for microfabrication because it can eject fine droplets.

FIG. 3 is a perspective view showing the configuration of the droplet discharge device 30. By the droplet discharge device 30, the hole injection layer material liquid 26 as the first functional liquid constituting the hole injection layer 15 and the light emission as the second functional liquid constituting the light emitting layers 16R, 16G, and 16B. The layer material liquids 27R, 27G, 27B, the electron injection layer material liquid 28 as the third functional liquid constituting the electron injection layer 17, and the film thickness adjusting solvent liquid 52 as the solvent are discharged and applied.
As shown in FIG. 3, the droplet discharge device 30 includes a base 31 formed in a rectangular parallelepiped shape. In the present embodiment, the longitudinal direction of the base 31 is the Y direction, and the direction orthogonal to the Y direction is the X direction.

  On the upper surface 31a of the base 31, a pair of guide rails 32a and 32b extending in the Y direction are provided so as to protrude over the entire width in the Y direction. On the upper side of the base 31, a stage 33 constituting a scanning means provided with a linear motion mechanism (not shown) corresponding to the pair of guide rails 32a and 32b is attached. The linear movement mechanism of the stage 33 is, for example, a screw type linear movement mechanism including a screw shaft (drive shaft) extending in the Y direction along the guide rails 32a and 32b and a ball nut screwed to the screw shaft. The drive shaft is connected to a Y-axis motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in units of steps. When a drive signal corresponding to a predetermined number of steps is input to the Y-axis motor, the Y-axis motor rotates normally or reversely, and the stage 33 corresponds to the same number of steps along the Y-axis direction. The robot moves forward or backward (scans in the Y direction) at a predetermined speed.

  A mounting surface 34 is formed on the upper surface of the stage 33, and a suction-type substrate chuck mechanism (not shown) is provided on the mounting surface 34. When the substrate 4 is placed on the placement surface 34, the substrate 4 is positioned and fixed at a predetermined position on the placement surface 34 by the substrate chuck mechanism.

  A pair of support bases 35a and 35b are erected on both sides in the X direction of the base 31, and a guide member 36 extending in the X direction is installed on the pair of support bases 35a and 35b. The guide member 36 is formed so that the width in the longitudinal direction is longer than the X direction of the stage 33, and one end of the guide member 36 projects to the support base 35 a side.

  On the upper side of the guide member 36, a storage tank 37 for storing the liquid to be discharged is provided. On the other hand, below the guide member 36, a guide rail 38 extending in the X direction is provided so as to protrude over the entire width in the X direction.

  The carriage 39 arranged so as to be movable along the guide rail 38 is formed in a substantially rectangular parallelepiped shape. The linear movement mechanism of the carriage 39 is, for example, a screw type linear movement mechanism having a screw shaft (drive shaft) extending in the X direction along the guide rail 38 and a ball nut screwed to the screw shaft. The drive shaft is connected to an X-axis motor (not shown) that receives a predetermined pulse signal and rotates forward and backward in steps. When a drive signal corresponding to a predetermined number of steps is input to the X-axis motor, the X-axis motor rotates forward or reversely, and the carriage 39 moves forward or backward along the X direction by the amount corresponding to the same number of steps. Move (scan in X direction).

  Further, as shown in FIG. 4, the first to sixth droplet discharge heads 45 to 50 protrude in parallel to each other in the X direction on the lower surface of the carriage 39 (the surface on the stage 33 side: the head arrangement surface 39a). It is installed. Nozzle plates P1 to P6 are provided on the lower surfaces of the first to sixth droplet discharge heads 45 to 50, respectively. In the nozzle plates P1 to P6, a plurality of nozzles N1 to N6 are arranged at predetermined intervals in the X direction.

FIG. 5 is a cross-sectional view of a main part for explaining the structure of the first to sixth droplet discharge heads 45 to 50. As shown in FIG. 5, a cavity 51 is formed at a position above the nozzle plates P1 to P6 and facing the nozzles N1 to N6. The hole injection layer material liquid 26 stored in the storage tank 37 is supplied to the cavity 51 of the first droplet discharge head 45. The light emitting layer material liquids 27R, 27G, and 27B stored in the storage tank 37 are supplied to the cavities 51 of the second to fourth droplet discharge heads 46, 47, and 48. Similarly, the material liquid 28 of the electron injection layer stored in the storage tank 37 is supplied to the cavity 51 of the fifth droplet discharge head 49, and the cavity 51 of the sixth droplet discharge head 50 is The film thickness adjusting solvent liquid 52 stored in the storage tank 37 is supplied.
Above the cavity 51, a vibration plate 53 that vibrates in the vertical direction and expands and contracts the volume in the cavity 51 and a piezoelectric element 54 that expands and contracts in the vertical direction and vibrates the vibration plate 53 are disposed.
The piezoelectric element 54 expands and contracts in the vertical direction to vibrate the diaphragm 53, and the diaphragm 53 expands and contracts the volume in the cavity 51. Thereby, the material liquid and the film thickness adjusting solvent liquid 52 of the functional layer 18 supplied into the cavity 51 are discharged through the nozzles N1 to N6.

  The first droplet discharge head 45 discharges micro droplets 55 as droplets of the material liquid 26 of the hole injection layer. Similarly, the second droplet discharge head 46 discharges micro droplets 56R of the light emitting layer material liquid 27R, and the third droplet discharge head 47 discharges micro droplets 56G of the light emitting layer material liquid 27G. The fourth droplet discharge head 48 discharges the minute droplets 56B of the material liquid 27B of the light emitting layer. The fifth droplet discharge head 49 discharges the minute droplets 57 of the material liquid 28 of the electron injection layer, and the sixth droplet discharge head 50 is not compatible with the solvent of the material liquid 28 of the electron injection layer. A fine droplet 58 of a film thickness adjusting solvent liquid 52 made of a solvent is discharged.

  When the first to sixth droplet discharge heads 45 to 50 receive the nozzle drive signal for controlling and driving the piezoelectric element 54, the piezoelectric element 54 expands and the diaphragm 53 increases the volume in the cavity 51. to shrink. As a result, the material liquid 26 of the hole injection layer corresponding to the reduced volume is ejected from the nozzle N1 of the first droplet ejection head 45 as the micro droplet 55. Further, from the nozzles N2, N3, and N4 of the second to fourth droplet discharge heads 46, 47, and 48, the material liquids 27R, 27G, and 27B of the light emitting layer corresponding to the reduced volume are microdroplets 56R, 56G, and 56B. Are discharged. Similarly, from the nozzle N5 of the fifth droplet discharge head 49, the material liquid 28 of the electron injection layer corresponding to the reduced volume is discharged as the fine droplet 57, and from the nozzle N6 of the sixth droplet discharge head 50. The film thickness adjusting solvent liquid 52 corresponding to the reduced volume is ejected as fine droplets 58.

Next, a method for manufacturing the hole injection layer 15, the light emitting layers 16R, 16G, and 16B and the electron injection layer 17 using the above-described droplet discharge device 30 will be described with reference to FIGS. FIG. 6 is a flowchart of a method for manufacturing the hole injection layer, the light emitting layer, and the electron injection layer, and FIGS. 7 to 9 are diagrams for explaining the droplet discharge operation of the droplet discharge device.
Since the formation of each layer other than the hole injection layer 15, the light emitting layers 16R, 16G, and 16B and the electron injection layer 17 is performed by a known apparatus and method, description of the manufacturing method is omitted.

  First, the movement of the stage 33 of the droplet discharge device 30 and the operation of the first to sixth droplet discharge heads 45 to 50 will be briefly described. The substrate 4 in which the bank 12 is formed and the pixel electrode 13 is formed in the bank 12 (element formation region 10) is arranged and fixed on the mounting surface 34 of the stage 33. Then, after setting the carriage 39 (first to sixth droplet discharge heads 45 to 50) at a predetermined position in the X direction, the stage 33 (substrate 4) is moved in the Y direction. Then, minute droplets 55, 56R, 56G, 56B, 57, and 58 are sequentially ejected to the element forming region 10 of the substrate 4 that passes directly below the first to sixth droplet ejection heads 45 to 50 in the Y direction. The operation to perform is performed.

At this time, the microelement 55 is applied to the red element formation region 10 formed on the substrate 4 by passing directly under the first droplet ejection head 45. Next, the fine liquid droplets 56R are applied immediately below the second liquid droplet ejection head 46, and the fine liquid droplets 57 are applied directly below the fifth liquid droplet ejection head 49. Yes. Further, the minute droplets 58 are applied by passing directly under the sixth droplet discharge head 50.
In the blue element formation region 10, the minute droplets 56 </ b> B are applied not from the second droplet discharge head 46 but from the third droplet discharge head 47. Even in the green element formation region 10, the micro droplets 56 </ b> G are applied from the fourth droplet discharge head 48, not the second droplet discharge head 46.

Next, steps of a manufacturing process corresponding to the device manufacturing method will be described with reference to the flowchart of FIG.
In FIG. 6, steps S <b> 1 to S <b> 5 are steps for manufacturing with the same droplet discharge device 30. Step S <b> 1 corresponds to a first layer arranging step, and is a step of applying a hole injection layer material liquid 26, which is a first functional liquid, to a predetermined element formation region 10 on the substrate 4. Next, the process proceeds to step S2. Step S2 corresponds to the second layer arranging step, and is a step of applying the light emitting layer material liquids 27R, 27G, and 27B as the second functional liquid. Next, the process proceeds to step S3. Step S3 corresponds to a third layer arranging step, and is a step of applying the electron injection layer material liquid 28 as the third functional liquid. Next, the process proceeds to step S4. Step S4 corresponds to a solvent arrangement step, and is a step of applying the film thickness adjusting solvent liquid 52. Next, the process proceeds to step S5. In step S 5, the hole injection layer material liquid 26, the light emitting layer material liquids 27 R, 27 G, and 27 B, the electron injection layer material liquid 28, and the film thickness are formed in all the element formation regions 10 to be coated on the substrate 4. If the adjustment solvent liquid 52 is not applied, the process proceeds to step S1, and if applied, the process proceeds to step S6. Step S6 corresponds to a drying process, and the material liquid 26 for the hole injection layer, the material liquids 27R, 27G, and 27B for the light emitting layer, the material liquid 28 for the electron injection layer, and the film thickness adjusting solvent liquid 52 are dried. This is a step of forming the layer 18.

Next, the manufacturing method will be described in detail with reference to FIGS. 7 to 9 in association with the steps shown in FIG.
FIGS. 7A and 7B are diagrams corresponding to step S1. As shown in FIG. 7A, first, microdroplets 55 of the material liquid 26 of the hole injection layer are ejected and applied to the element formation region 10 from the nozzle N1 of the first droplet ejection head 45. (Step S1). As a result, as shown in FIG. 7B, the hole injection layer material liquid 26 is applied in the element formation region 10.
FIG. 7C and FIG. 8A are diagrams corresponding to step S2. As shown in FIG. 7C, the light emitting layer material liquid 27R is very small from the nozzle N2 of the second liquid droplet ejection head 46 to each element forming region 10 where the hole injection layer material liquid 26 is applied. The droplet 56R is ejected and applied (step S2). As a result, as shown in FIG. 8A, in each element forming region 10, a liquid reservoir is formed in which the material liquid 26 for the hole injection layer and the material liquid 27R for the light emitting layer are applied in an overlapping manner.

  8B and 8C are diagrams corresponding to step S3. As shown in FIG. 8B, a minute liquid of the material liquid 28 of the electron injection layer is applied from the nozzle N5 of the fifth droplet discharge head 49 to each element forming region 10 to which the material liquid 27R of the light emitting layer is applied. Drops 57 are discharged and applied (step S3). As a result, as shown in FIG. 8C, the hole injection layer material liquid 26, the light emitting layer material liquid 27 </ b> R, and the electron injection layer material liquid 28 were applied to each element formation region 10 in an overlapping manner. A liquid pool is formed.

  FIGS. 9A and 9B are diagrams corresponding to step S4. As shown in FIG. 9A, a fine liquid of the film thickness adjusting solvent liquid 52 is applied from the nozzle N6 of the sixth droplet discharge head 50 to the element forming region 10 where the material liquid 28 of the electron injection layer is applied. Drops 58 are discharged and applied (step S4). As a result, as shown in FIG. 8B, each element formation region 10 includes a hole injection layer material liquid 26, a light emitting layer material liquid 27R, an electron injection layer material liquid 28, and a film thickness adjusting solvent. A liquid reservoir in which the liquid 52 is applied in layers is formed.

  Similarly, in the green and blue element formation regions 10, the fine droplets 55 of the material liquid 26 of the hole injection layer are discharged and applied to the element formation region 10 from the nozzle N 1 of the first droplet discharge head 45. (Step S1), the hole injection layer material liquid 26 is applied. Next, in the green element formation region 10, the minute droplets 56G of the material liquid 27G for the green light emitting layer are discharged and applied from the nozzle N3 of the third droplet discharge head 47 (step S2), thereby forming the elements. In the region 10, a liquid reservoir is formed in which the material liquid 26 for the hole injection layer and the material liquid 27G for the light emitting layer are applied in an overlapping manner. In the blue element formation region 10, the minute droplets 56 </ b> B of the material liquid 27 </ b> B of the blue light emitting layer are discharged and applied from the nozzle N <b> 4 of the fourth droplet discharge head 48 (step S <b> 2). 10, a liquid pool is formed in which the hole injection layer material liquid 26 and the light emitting layer material liquid 27 </ b> B are applied in an overlapping manner.

Subsequently, fine droplets 57 of the electron injection layer material liquid 28 are discharged and applied from the nozzle N5 of the fifth droplet discharge head 49 onto the light emitting layer material liquids 27G and 27B (step S3). A fine droplet 58 of the film thickness adjusting solvent liquid 52 is discharged and applied onto the material liquid 28 of the injection layer from the nozzle N6 of the sixth droplet discharge head 50 (step S4). As a result, the material liquid 26 for the hole injection layer, the material liquids 27G and 27B for the light emitting layer, the material liquid 28 for the electron injection layer, and the film thickness adjusting solvent liquid 52 are applied to each element forming region 10 in an overlapping manner. A liquid pool is formed.
When the material liquid of each functional layer is applied to all the element forming regions 10 to be applied, the application is finished (step S5).

In this embodiment, water, which is a polar solvent, is used as a solvent or dispersion medium for the material liquid 26 for the hole injection layer and the material liquid 28 for the electron injection layer. On the other hand, in the present embodiment, xylene, which is a nonpolar solvent, is used as the solvent or dispersion medium for the light emitting layer material liquids 27R, 27G, 27B and the film thickness adjusting solvent liquid 52.
Therefore, the material liquid 26 for the hole injection layer and the material liquids 27R, 27G, and 27B for the light emitting layer are not compatible with each other, so that the interface between the two liquids is almost flat due to surface tension and gravity. It becomes. Similarly, the boundary surfaces between the light emitting layer material liquids 27R, 27G, and 27B and the electron injection layer material liquid 28 and the boundary surfaces between the electron injection layer material liquid 28 and the film thickness adjusting solvent liquid 52 are substantially the same. It becomes a flat state.

  FIG. 9C corresponds to step S6. As shown in FIG. 9C, the substrate 4 is dried in the drying process (step S6). In this embodiment, drying is performed under vacuum (1 torr (133.3 Pa)) at room temperature for 20 minutes, whereby the solvent or the dispersion medium is removed. At this time, in the element formation region 10, the material liquid 26 for the hole injection layer, the material liquids 27R, 27G, and 27B for the light emitting layer and the material liquid 28 for the electron injection layer are solidified. A functional layer 18 including a hole injection layer 15, light emitting layers 16 R, 16 G, and 16 B and an electron injection layer 17 is formed on the pixel electrode 13.

  Next, similarly to the cross section shown in FIG. 2, aluminum is vapor-deposited on the electron injection layer 17, the bank 12, and the circuit formation layer 4 b by vapor deposition to form the cathode 19. Further, a sealing portion 20 made of a light transmissive material is formed on the cathode 19. Thereby, the display part 2 is manufactured.

As described above, this embodiment has the following effects.
(1) According to the present embodiment, according to the steps shown in FIG. 6, the material liquid 26 for the hole injection layer and the light emitting layer are formed on the pixel electrode 13 in each element forming region 10 formed in the display region 5 of the substrate 4. The material liquids 27R, 27G, and 27B, the electron injection layer material liquid 28, and the film thickness adjusting solvent liquid 52 are sequentially applied and dried.
The solvent or dispersion medium of the material liquid 26 for the hole injection layer and the material liquid 28 for the electron injection layer employs water, which is a polar solvent, and the material liquids 27R, 27G, and 27B for the light emitting layer and the film thickness adjusting solvent. As the solvent or dispersion medium of the liquid 52, xylene, which is a nonpolar solvent, was adopted. Accordingly, the material liquid 26 for the hole injection layer and the material liquids 27R, 27G, and 27B for the light emitting layer are incompatible, and the material liquids 27R, 27G, and 27B for the light emitting layer and the material liquid 28 for the electron injection layer are out of phase. It becomes soluble. Furthermore, the electron injection layer material liquid 28 and the film thickness adjusting solvent liquid 52 are incompatible.
In the drying process, the film thickness adjusting solvent liquid 52 evaporates in a vacuum while the film thickness adjusting solvent liquid 52 moves to the bank 12. Since the material liquid 28 of the electron injection layer and the film thickness adjusting solvent liquid 52 are incompatible, the boundary surface between the two liquids is separated and is flat due to surface tension and gravity. Therefore, when the film thickness adjusting solvent liquid 52 is applied as compared with the case where the film thickness adjusting solvent liquid 52 is not applied, the material liquid 28 of the electron injection layer is dried in a state where it is difficult to move to the bank 12, An electron injection layer 17 is formed. As a result, the electron injection layer 17 can improve the film thickness uniformity.
Similarly, the material liquid 28 for the electron injection layer and the material liquids 27R, 27G, and 27B for the light emitting layer are incompatible, and the light emitting layers 16R, 16G, and 16B are disposed on the material liquids 27R, 27G, and 27B for the light emitting layer. Compared with drying without applying the material liquid 28 for the electron injection layer, the uniformity of the film thickness can be improved. The material liquids 27R, 27G, 27B of the light emitting layer and the material liquid 26 of the hole injection layer are incompatible, and the hole injection layer 15 is formed of the material of the light emitting layer on the material liquid 26 of the hole injection layer. Compared with the case where the liquids 27R, 27G, and 27B are dried without being applied, the film thickness uniformity can be improved.

  (2) According to this embodiment, the film of each layer of the hole injection layer 15, the light emitting layers 16R, 16G, and 16B, and the electron injection layer 17 is compared with the case of drying each layer after applying the material liquid of each layer. Thus, a flat film thickness can be obtained, so that a uniform film thickness can be obtained. Therefore, when a voltage is applied to the organic EL elements 10R, 10G, and 10B, current flows at the same current density throughout the film. As a result, there is no portion where a current with a high current density partially flows and the deterioration is accelerated, so that the organic EL elements 10R, 10G, and 10B having a long lifetime can be obtained.

  (3) According to the present embodiment, when a voltage is applied to the organic EL elements 10R, 10G, and 10B, current flows through the entire film at substantially the same current density. Accordingly, there is no portion where a current having a high current density partially flows and the luminance is higher than that of other portions, so that the organic EL elements 10R, 10G, and 10B with little variation in luminance can be obtained.

(4) According to the present embodiment, the second to sixth droplet ejection heads 46 to 46 that are ejected to the element formation region 10 at the same position as the element formation region 10 that is ejected by the nozzle N1 of the first droplet ejection head 45. The 50 nozzles N2 to N6 are arranged on the same line in the direction in which the substrate 4 is scanned. Accordingly, since the first to sixth droplet discharge heads 45 to 50 can discharge the element forming region 10 at the same point in a single scan, a highly productive apparatus can be obtained.
(5) According to this embodiment, since the functional liquid is applied by the droplet discharge method, the position and the discharge amount can be accurately controlled and applied.

(6) According to the present embodiment, since the electron injection layer 17 can be formed flat without applying a functional liquid such as a solvent to the non-display area 7, it is not necessary to widen the non-display area 7. Therefore, the organic EL display 1 having a small area of the non-display region 7 can be obtained.
(Second Embodiment)

Next, an electronic apparatus including the organic EL display 1 according to the first embodiment described above will be described.
FIG. 10 is a schematic perspective view showing an example in which the organic EL display 1 is mounted on a personal computer. As shown in FIG. 10, the main body of a personal computer 100 as an electronic device includes a display device 101 as a display unit that displays information. The display device 101 is provided with the organic EL display 1 manufactured according to the first embodiment. The display device 101 arranged in the personal computer 100 has the effect that there is no unevenness in luminance of the display unit because the organic EL display 1 that is manufactured according to the above-described embodiment and has no uneven luminance is mounted. It becomes an electronic device.

Note that the present invention is not limited to the above-described embodiment, and various changes and improvements can be added. A modification will be described below.
(Modification 1) In the above embodiment, the vacuum drying method is adopted in the drying step, but the drying may be performed by a reduced pressure drying method. FIG. 11 is a schematic side sectional view showing the structure of the vacuum drying apparatus.
As shown in FIG. 11, the reduced pressure drying apparatus 200 is an apparatus that performs a reduced pressure drying method in which a substrate W coated with the liquid L is accommodated in a chamber 201 and the solvent of the liquid L is evaporated and dried under reduced pressure. is there.

  The chamber 201 includes a first chamber 202 on the upper side and a second chamber 203 on the lower side in the drawing, and the volume of the second chamber 203 is larger than the volume of the first chamber 202. The partition part 204 which partitions off is provided. On the first chamber 202 side of the partition wall portion 204, a mounting table 205 on which the substrate W is mounted is provided. The partition wall 204 is provided with two communication ports 206 that communicate with the first chamber 202 and the second chamber 203 of the chamber 201 along the side of the mounting table 205. A communication valve 207 in which a rotation shaft 207 a is connected to a motor attached to the outer wall portion of the chamber 201 is provided at a portion where the two communication ports 206 are opened.

A connection hole 208 is provided near the upper center of the first chamber 202, and one of pipes 209 that can introduce nitrogen (N ₂ ) gas, which is an inert gas, is connected to the first chamber 202. A vacuum gauge 210 capable of measuring the reduced pressure state in the first chamber 202 is provided on the side wall portion of the first chamber 202. A connection hole 211 is provided near the center of the lower portion (bottom surface) of the second chamber 203, and one of the pipes 212 is connected thereto. The other of the pipes 212 is connected to a vacuum pump 214 that can depressurize the second chamber 203 via a vacuum valve 213. A vacuum gauge 215 capable of measuring the reduced pressure state in the second chamber 203 is provided on the side wall of the second chamber 203. The vacuum gauge 215 and the vacuum pump 214 are also electrically connected to the controller, and the controller can detect the output (pressure value) of the vacuum gauge 215 and control the exhaust speed of the vacuum pump 214.

The substrate W coated with the liquid L is installed in the vacuum drying apparatus of this modification, and the communication valve 207 is opened to reduce the pressure to a predetermined pressure. Next, when the liquid L evaporates and the pressure in the first chamber 202 rises, the communication valve 207 is opened, and after the pressure in the first chamber 202 is lowered, the communication valve 207 is closed. Thereafter, the vacuum pump 214 is operated to reduce the pressure in the second chamber 203 to a predetermined pressure.
In this way, by controlling the evaporation rate of the liquid L on the substrate W, the distribution of the vapor pressure inside the first chamber 202 can be made uniform, so that it is not affected by the pressure difference depending on the location of the vapor partial pressure. Can be dried. Therefore, in the first embodiment, the hole injection layer material liquid 26, the light emitting layer material liquids 27R, 27G, and 27B, the electron injection layer material liquid 28, and the film thickness adjustment applied to the element formation region 10 of the substrate 4 are used. When the solvent solution 52 is dried by the reduced pressure drying apparatus of the present modification, the film can be dried without being affected by the pressure difference depending on the location of the vapor partial pressure. The organic EL elements 10R, 10G, and 10B having the functional layer 18 having a uniform thickness can be obtained.

  (Modification 2) In the first embodiment, the material liquid 26 for the hole injection layer, the material liquids 27R, 27G, and 27B for the light emitting layer, the material liquid 28 for the electron injection layer, and the film thickness adjusting solvent liquid 52 are used. Although continuous discharge was performed by the droplet discharge device 30, each material liquid may be applied by another droplet discharge device. The applied liquid may be moved to another droplet discharge device so as not to be dried, and the liquid of the next layer may be applied.

  (Modification 3) In the first embodiment, the functional layer 18 is formed by laminating the hole injection layer 15, the light emitting layers 16 R, 16 G, and 16 B, and the electron injection layer 17 in this order on each pixel electrode 13. Although the cathode 19 was formed on the functional layer 18, it is not restricted to this. After the hole injection layer material liquid 26, the light emitting layer material liquids 27R, 27G, and 27B and the film thickness adjusting solvent liquid 52 are applied and dried, the electron injection layer 17 has a bisacetylacetonate / calcium complex (Ca A material containing (acac) 2) may be formed by vapor deposition.

  (Modification 4) In the first embodiment, the cathode 19 is formed of an aluminum thin film by vapor deposition, but an ITO (Indium Tin Oxide) thin film may be formed by sputtering.

(Modification 5) In the first embodiment, the material of the light emitting layer is MEHPPV (poly (3-methoxy, 6- (3-ethylhexyl) paraphenylenevinylene), F8BT (dioctylfluorene and benzothiadiazole) Coalescence) and polydioctylfluorene are employed, but not limited thereto.
As a material for forming the light emitting layer, (poly) fluorene derivative (PF), (polyparaphenylene vinylene derivative (PPV), polyphenylene derivative (PP), polyparaphenylene derivative (PPP), polyvinylcarbazole (PVK), polythiophene derivative, poly Polysilanes such as methylphenylsilane (PMPS), etc. may also be adopted, and polymer materials such as perylene dyes, coumarin dyes, rhodamine dyes, rubrene, perylene, A low molecular material such as 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6 or quinacridone can be doped.
In addition, polyvinyl carbazole, polyfluorene polymer derivatives, and the like may be employed.

  (Modification 6) In the first embodiment, the functional layer 18 is formed by laminating the hole injection layer 15, the light emitting layers 16 R, 16 G, and 16 B, and the electron injection layer 17 in this order on each pixel electrode 13. Although the cathode 19 is formed on the functional layer 18, this stacking order may be reversed. On each pixel electrode, the electron injection layer, the light emitting layer, the light emitting layer, the hole injection layer, and the film thickness adjusting solvent are applied in this order and dried. , A hole injection layer, and a functional layer laminated in this order, and an anode may be formed on the functional layer. By applying a voltage between each pixel electrode and the anode so that each pixel electrode becomes a cathode, an organic EL element capable of emitting light can be obtained. Even in this case, the same effect as the first embodiment can be obtained.

  (Modification 7) In the first embodiment, xylene, which is a nonpolar solvent, is used as the solvent or dispersion medium of the material liquids 27R, 27G, and 27B of the light emitting layer and the solvent liquid 52 for adjusting the film thickness. A nonpolar solvent such as mesitylene may be used.

  (Modification 8) In the first embodiment, drying is performed by vacuum drying, but the solvent may be removed by heat treatment or nitrogen gas flow.

  (Modification 9) In the first embodiment, the material liquid 26 for the hole injection layer, the material liquids 27R, 27G, and 27B for the light emitting layer, the material liquid 28 for the electron injection layer, and the film thickness adjusting solvent liquid 52 are used. Although the functional layer 18 was formed by applying and drying, the present invention is not limited to this. The hole injection layer material liquid 26, the light emitting layer material liquids 27R, 27G, and 27B and the film thickness adjusting solvent liquid 52 are applied and dried, and then the electron injection layer material liquid 28 is applied and dried to perform electron injection. The layer 17 may be formed.

  (Modification 10) In the first embodiment, the hole injection layer material liquid 26, the light emitting layer material liquids 27R, 27G, and 27B, the electron injection layer material liquid 28, and the film thickness adjusting solvent liquid 52 are applied. Then, the functional layer 18 was formed by drying, but this is not restrictive. After applying the hole injection layer material liquid 26 and drying to form the hole injection layer 15, the light emission layer material liquids 27R, 27G, 27B, the electron injection layer material liquid 28, and the film thickness adjusting solvent liquid 52. May be applied and dried to form the functional layer 18.

  (Modification 11) In Modification 6, the electron injection layer material liquid, the light emitting layer material liquid, the hole injection layer material liquid, and the film thickness adjusting solvent liquid are applied in this order on each pixel electrode. Although it dried and formed the functional layer, it is not restricted to this. After applying and drying the electron injection layer material solution, the light emitting layer material solution and the film thickness adjusting solvent solution in this order, the hole injection layer material solution and the film thickness adjusting solvent solution are applied and dried in this order. Thus, a functional layer may be formed.

  (Modification 12) In the modification 6, the electron injection layer material liquid, the light emitting layer material liquid, the hole injection layer material liquid, and the film thickness adjusting solvent liquid are applied in this order on each pixel electrode. Although it dried and formed the functional layer, it is not restricted to this. After applying and drying the electron injection layer material liquid and the film thickness adjusting solvent liquid in this order, the light emitting layer material liquid, the hole injection layer material liquid and the film thickness adjusting solvent liquid are applied and dried in this order. Thus, a functional layer may be formed.

1 is a front view of an organic EL display according to a first embodiment. Sectional drawing of an organic electroluminescent display. The perspective view which shows a droplet discharge apparatus. The perspective view which shows a droplet discharge head. Sectional drawing which shows a droplet discharge head. The flowchart which shows the manufacturing process of an organic electroluminescent display. (A)-(c) is a figure for demonstrating the manufacturing method of an organic electroluminescent display. (A)-(c) is a figure for demonstrating the manufacturing method of an organic electroluminescent display. (A)-(c) is a figure for demonstrating the manufacturing method of an organic electroluminescent display. The perspective view which shows the electronic device of 2nd Embodiment. Sectional drawing which shows a reduced pressure drying apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Organic EL display as an electro-optical device, 4 ... Board | substrate, 10R, 10G, 10B ... Organic EL element as a device, 15 ... Hole injection layer as 1st layer, 16R, 16G, 16B ... 2nd A light emitting layer as a layer, 17 an electron injection layer as a third layer, 26 a material liquid of a hole injection layer as a first functional liquid, 27R, 27G, 27B, a light emitting layer as a second functional liquid 28 ... Material liquid of electron injection layer as third functional liquid, 52 ... Solvent liquid for adjusting film thickness as solvent, 100 ... Personal computer as electronic device, 101 ... Display device as display unit.

Claims (15)

A method of manufacturing a film, which is formed by stacking a plurality of films by disposing a plurality of functional liquids on a substrate,
Applying a first functional liquid, which is the functional liquid, on the substrate, and arranging a first layer;
Applying a second functional liquid incompatible with the first functional liquid on the first layer, and arranging a second layer;
And a drying step of drying the first layer and the second layer. A method of manufacturing a film, which is formed by stacking a plurality of films by disposing a plurality of functional liquids on a substrate,
Applying a first functional liquid, which is the functional liquid, on the substrate, and arranging a first layer;
Applying a second functional liquid incompatible with the first functional liquid on the first layer, and arranging a second layer;
Applying a third functional liquid incompatible with the second functional liquid on the second layer, and arranging a third layer;
A method for producing a film, comprising: a drying step of drying the first layer, the second layer, and the third layer. A method of manufacturing a film, which is formed by stacking a plurality of films by disposing a plurality of functional liquids on a substrate,
Applying a first functional liquid, which is the functional liquid, on the substrate, and arranging a first layer;
Applying a second functional liquid incompatible with the first functional liquid on the first layer, and arranging a second layer;
A solvent disposing step of disposing a solvent incompatible with the second functional liquid on the second layer;
And a drying step of drying the first layer, the second layer, and the solvent. A method of manufacturing a film, which is formed by stacking a plurality of films by disposing a plurality of functional liquids on a substrate,
Applying a first functional liquid, which is the functional liquid, on the substrate, and arranging a first layer;
Applying a second functional liquid incompatible with the first functional liquid on the first layer, and arranging a second layer;
Applying a third functional liquid incompatible with the second functional liquid on the second layer, and arranging a third layer;
A solvent disposing step of disposing a solvent incompatible with the third functional liquid on the third layer;
A method for producing a film, comprising: a drying step of drying the first layer, the second layer, the third layer, and the solvent. It is a manufacturing method of the film according to any one of claims 1 to 4,
The said drying process is performed using the reduced pressure drying method, The manufacturing method of the film | membrane characterized by the above-mentioned. It is a manufacturing method of the film according to any one of claims 1 to 4,
A method for producing a film, wherein the method of disposing the functional liquid or the solvent is a droplet discharge method. A device manufacturing method using the film manufacturing method according to any one of claims 1, 3, 5-6,
The device has a hole injection layer, a light emitting layer, and an electron injection layer,
The device according to claim 1, wherein the first layer is the hole injection layer, and the second layer is the light emitting layer. A device manufacturing method using the film manufacturing method according to any one of claims 1, 3, 5-6,
The device has a hole injection layer, a light emitting layer, and an electron injection layer,
The device according to claim 1, wherein the first layer is the light emitting layer, and the second layer is the electron injection layer. A device manufacturing method using the film manufacturing method according to any one of claims 1, 3, 5-6,
The device has an electron injection layer, a light emitting layer, and a hole injection layer,
The device manufacturing method, wherein the first layer is the electron injection layer, and the second layer is the light emitting layer. A device manufacturing method using the film manufacturing method according to any one of claims 1, 3, 5-6,
The device has an electron injection layer, a light emitting layer, and a hole injection layer,
The device according to claim 1, wherein the first layer is the light emitting layer, and the second layer is the hole injection layer. A device manufacturing method using the film manufacturing method according to any one of claims 2 and 4-6,
The device has a hole injection layer, a light emitting layer, and an electron injection layer,
The device manufacturing method, wherein the first layer is the hole injection layer, the second layer is the light emitting layer, and the third layer is the electron injection layer. A device manufacturing method using the film manufacturing method according to any one of claims 2 and 4-6,
The device has an electron injection layer, a light emitting layer, and a hole injection layer,
The device manufacturing method, wherein the first layer is the electron injection layer, the second layer is the light emitting layer, and the third layer is the hole injection layer.   It manufactured using the manufacturing method of the device as described in any one of Claims 7-12.   An electro-optical device comprising the device according to claim 13. An electronic apparatus comprising the electro-optical device according to claim 14 as a display unit.

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