JP2007086642A - Image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image display device that can reduce the manufacturing cost by shortening wiring, without impairing the strength of a reinforcing frame. <P>SOLUTION: The device includes an envelope 10, the reinforcing frame 30 attached to the back substrate of the envelope, a plurality of circuit boards 50 mounted on the reinforcing frame, and the wiring 62 that electrically connects the connections, arranged in the peripheries of the back substrate with the connections of the circuit board. The reinforcing frame has a pair of first framing member 32, extending substantially in parallel with the long side of the back substrate and a pair of second framing member 34 extending substantially in parallel with a narrow side of the back substrate. The first framing member is formed by extrusion materials, respectively, and has peripheries facing the peripheries of the back substrate that protrudes to the envelope side. The second framing member is formed by the extrusion materials, respectively, and has peripheries facing to the peripheries of the back substrate protruding to the envelope side. The wiring passes through the outside of the peripheries of the reinforcement frame, starting from the circuit board to be laid to the connections. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an image display device, and more particularly to a flat image display device provided with a reinforcing frame.

  In recent years, various flat-type image display devices have been developed as next-generation lightweight and thin display devices that replace cathode ray tubes (hereinafter referred to as CRTs). Such an image display device includes a liquid crystal display (hereinafter referred to as LCD) that controls the intensity of light using the orientation of liquid crystal, and a plasma display panel (hereinafter referred to as PDP) that emits phosphors by plasma discharge ultraviolet rays. Field emission display (hereinafter referred to as FED) that emits a phosphor with an electron beam of a field emission electron emission device, and a surface conduction electron emission display that emits a phosphor with an electron beam of a surface conduction electron emission device (hereinafter referred to as FED). Hereinafter referred to as SED).

  For example, FEDs and SEDs generally have a front substrate and a rear substrate that are arranged to face each other with a predetermined gap therebetween, and these substrates constitute an envelope by joining the peripheral portions to each other. A phosphor layer is formed on the inner surface of the front substrate, and a plurality of electron-emitting devices for exciting the phosphor layer are provided on the inner surface of the rear substrate. When displaying an image, an anode voltage is applied to the phosphor layer, the electron beam emitted from the electron-emitting device is accelerated by the anode voltage and collides with the phosphor layer, and the phosphor emits light to display the image. To do.

  With such FEDs and SEDs, the thickness of the envelope can be reduced to a few millimeters, which makes it lighter and thinner than CRTs currently used as television and computer displays. It can be achieved and power saving can be achieved.

  In recent years, with the increase in the size of image display devices, the substrates constituting the envelope have also increased in size. However, as the size increases, the strength of the envelope decreases, the resonance frequency decreases, the weight increases, and so on. Therefore, a structure has been proposed in which a reinforcing frame is attached to the back side of a back substrate made of a glass substrate for the purpose of increasing the mechanical strength of the envelope. As such a reinforcing frame, a structure in which a metal plate having substantially the same size as the back substrate is attached to the entire back surface of the back substrate, or a rectangular frame-shaped metal frame along the outer peripheral edge of the back substrate. A fixed structure has been proposed (for example, Patent Documents 1 and 2).

Various electronic components such as a power supply and a drive circuit are mounted on the reinforcing frame. These electronic components are connected to the peripheral part of the back substrate of the envelope via, for example, a flexible printed wiring board. In this case, the flexible printed wiring board is pulled out from the peripheral edge of the reinforcing frame, and is routed outside the peripheral edge to be connected to the back substrate side.
JP 2000-10493 A JP-A-11-146305

In the above-described FED or SED, the peripheral edge of the reinforcing frame is bent in the direction opposite to the envelope and stands up for the purpose of improving the strength of the reinforcing frame. In this case, the height of the peripheral edge of the reinforcing frame is high. Therefore, it is necessary to lengthen the wiring board when connecting the flexible printed wiring board by drawing the outer side of the peripheral part of the reinforcing frame from the driving circuit part to the back substrate side of the envelope. The number of such flexible printed wiring boards increases as the size of the image display device increases, and a large amount of flexible printed wiring boards are required as a whole.
However, the flexible printed wiring board is relatively expensive, and the length of the flexible printed wiring board is preferably as short as possible in order to reduce the manufacturing cost. Similarly, the metal plate constituting the reinforcing frame is relatively expensive, and it is desirable that the area is smaller.

  The present invention has been made in view of the above points, and it is an object of the present invention to provide an image display device capable of shortening the wiring and reducing the manufacturing cost without impairing the strength of the reinforcing frame.

In order to achieve the above object, an image display device according to an aspect of the present invention includes an envelope including a front substrate having a display surface, a rectangular rear substrate disposed opposite to the front substrate, and the rear substrate. A reinforcing frame that is attached to the outer surface of the reinforcing frame and that reinforces the envelope; a plurality of circuit boards mounted on the reinforcing frame; a connecting portion provided on a peripheral edge of the rear substrate; and the circuit board and the connecting portion And a wiring electrically connected to each other,
The reinforcing frame is a pair of first frame members that extend substantially parallel to the long side of the back substrate, respectively, and a pair that extends substantially parallel to the short side of the back substrate and connects the first frame member. A second frame member,
Each of the first frame members is formed of an extruded material, and has a peripheral edge that protrudes toward the envelope side and faces the peripheral edge of the back substrate, and each of the second frame members is formed of an extruded material. And has a peripheral edge that protrudes toward the envelope and faces the peripheral edge of the rear substrate, and the wiring passes from the circuit board to the connection portion through the outside of the peripheral edge of the reinforcing frame. Has been routed.

  According to the aspect of the present invention, it is possible to provide an image display device capable of reducing the length of the wiring and reducing the manufacturing cost while maintaining the strength of the reinforcing frame.

Hereinafter, an embodiment in which an image display device according to the present invention is applied to an SED will be described in detail with reference to the drawings.
1 and 2 show the display surface side and the back side of the SED, respectively, and FIG. 5 shows the internal structure of the SED. As shown in FIGS. 1 and 5, the SED includes a front substrate 11 and a rear substrate 12 each made of a rectangular glass substrate as insulating substrates, and these substrates are arranged to face each other with a gap of 1 to 2 mm. ing. The front substrate 11 and the rear substrate 12 are joined to each other at peripheral edges via a rectangular frame-shaped member 13, and the space surrounded by the front substrate 11, the rear substrate 12 and the frame-shaped member 13 is maintained in a vacuum state. A rectangular envelope 10 is formed. Between the inner periphery of the front substrate 11 and the frame member 13 and between the inner periphery of the rear substrate 12 and the frame member 13, for example, a low melting point metal sealing material such as indium or an indium alloy, frit, etc. They are joined by a low melting point sealing material such as glass.

  As shown in FIG. 5, a plurality of plate-like spacers 14 are provided inside the envelope 10 in order to support an atmospheric pressure load applied to the front substrate 11 and the rear substrate 12. These spacers 14 are arranged in a direction parallel to the long side of the envelope 10 and are arranged at predetermined intervals along a direction parallel to the short side. The shape of the spacer 14 is not particularly limited to this, and for example, a columnar spacer or the like can be used.

  A phosphor screen 15 that functions as a display surface is provided on the inner surface side of the front substrate 11. The phosphor screen 15 includes a phosphor layer 16 that emits red, green, and blue light and a matrix-like black light absorption layer 17. A metal back 20 made of aluminum or the like is formed on the phosphor screen 15, and a getter film (not shown) is formed on the metal back 20.

  On the inner surface side of the back substrate 12, a large number of surface-conduction electron-emitting devices 18 are provided as electron-emitting sources that excite electrons by colliding with the phosphor layer 16. The electron-emitting devices 18 are arranged in a plurality of columns and a plurality of rows corresponding to each pixel, and are positioned to face the respective phosphor layers 16. Each electron-emitting device 18 includes an electron emitting portion (not shown) and a pair of device electrodes for applying a voltage to the electron emitting portion. As shown in FIGS. 1 and 5, a large number of wirings 21 for driving the electron-emitting devices 18 are formed in a matrix on the inner surface of the rear substrate 12, and end portions thereof are formed on the peripheral portion of the rear substrate 12. Has been withdrawn. A connection terminal 22 is provided at the end of each wiring 21.

  When displaying an image in the SED configured as described above, an anode voltage is applied to the metal back 20, and the electron beam emitted from the electron-emitting device 18 is accelerated by the anode voltage to collide with the phosphor screen 15. . As a result, the phosphor layer 16 of the phosphor screen 15 is excited to emit light and display an image.

  As shown in FIGS. 2 to 5, the SED includes a reinforcing frame 30 that is attached to the outer surface side of the back substrate 12 and reinforces the envelope 10. Here, the inner surface side of the front substrate 11 and the inner surface side of the rear substrate 12 indicate inner sides where the front substrate 11 and the rear substrate 12 face each other, and the outer surface side of the front substrate 11 and the outer surface side of the rear substrate 12 are The inner side and the opposite side where the front substrate 11 and the rear substrate 12 face each other are shown.

  The reinforcing frame 30 includes a pair of elongated first frame members 32 and a pair of elongated second frame members 34, and a rectangular support plate 56. The 1st frame member 32 and the 2nd frame member 34 are each formed with the extrusion material which consists of aluminum, for example.

  Each first frame member 32 includes a hollow rod-shaped first high-strength portion 32a having a rectangular cross section, a flat mounting portion 32b extending from the first high-strength portion and extending along the outer surface of the back substrate 12. And an upright portion 32c formed along the extending end of the mounting portion 32b and constituting a peripheral portion. The standing portion 32 c protrudes from the mounting portion 32 b toward the back substrate 12 and extends in parallel with the first high-strength portion 32 a.

  Similarly, each second frame member 34 is a hollow rod-shaped second high-strength portion 34 a having a rectangular cross section, and a flat mounting extending from the second high-strength portion and extending along the outer surface of the back substrate 12. The part 34b and the upright part 34c formed along the extending end of the mounting part 34b and constituting the peripheral part are integrally provided. The standing portion 34c protrudes from the mounting portion 34b toward the rear substrate 12 and extends in parallel with the second high-strength portion 34a.

As shown in FIGS. 2 and 3, both end portions of each second frame member 34 are fixed to the first frame member 32 to connect the first frame members 32 to each other. Thereby, the 1st and 2nd frame members 32 and 34 are formed in the substantially well shape as a whole. Guide slots 32d and 34d extending in the longitudinal direction are formed in the first high strength portion 32a and the second high strength portion 34a, respectively. And each end of the 1st high intensity | strength part 32a and the 2nd high intensity | strength part 34a is mutually connected by the connection member 60 penetrated by the 1st and 2nd guide slots 32d and 34d.
The support plate 56 made of aluminum is disposed in a space surrounded by the first and second high-strength portions 32a and 34a, and both side edges thereof are fixed to the first high-strength portion.

  As shown in FIGS. 1, 2, 4, and 5, the reinforcing frame 30 is fixed to the envelope 10 by sticking a plurality of locations on the outer surface side of the back substrate 12 with an adhesive 51, a double-sided tape 52, and the like. Has been. Except for the adhesive 51 and the double-sided tape 52, the reinforcing frame 30 faces the back substrate 12 with a slight gap. The double-sided tape 52 functions as a spacer that controls the thickness of the adhesive 51.

  In a state of being fixed to the envelope 10, the reinforcing frame 30 covers the entire back substrate 12, and its long side and short side extend substantially parallel to the long side and short side of the back substrate. In the first frame member 32, the first high-strength portions 32 a extend in parallel with the long sides of the back substrate 12 at intervals. The mounting part 32b of each first frame member 32 extends between the first high-strength part 32a and the long side of the back substrate 12 in parallel with the back substrate. The standing portion 32c protrudes from the mounting portion 32b toward the back substrate 12 and faces the peripheral edge of the back substrate.

  In the second frame member 34, the second high-strength portion 34 a extends in parallel with the short side of the rear substrate 12 at a distance from the short side. The mounting portion 34b of each second frame member 34 extends between the second high-strength portion 34a and the short side of the back substrate 12 in parallel with the back substrate. The standing part 34c protrudes from the mounting part 34b to the back substrate 12 side and faces the peripheral edge of the back substrate.

  As shown in FIGS. 4 and 5, on the mounting portions 32b and 34b of the reinforcing frame 30, and on the support plate 56, a main power supply 50a, a high-voltage power supply 50b, a plurality of X driver boards 50c, and a plurality of Y driver boards 50d. Various accessory parts 50 including an analog board 50e, control boards 50f, 50g, and the like are attached. Most of the accessory component 50 is screwed to a stud 54 embedded in the reinforcing frame 30.

  The X driver substrate 50 c is mounted on the mounting portion 32 b of the first frame member 32, and is located side by side along the peripheral edge of the back substrate 12, here, the long side of the back substrate 12. The plurality of Y driver boards 50 d are fixed to the reinforcing frame 30 and arranged side by side along the short side of the back board 12.

  As shown in FIGS. 4 and 5, the connection portion 63 provided on each X driver board 50c and the connection terminal 22 provided on the inner peripheral edge of the back substrate 12 are formed by a plurality of wirings. The flexible printed wiring board 62 is electrically connected. Each flexible printed wiring board 62 is routed from the X driver board 50 c to the connection terminal 22 of the rear board 12 through the outer periphery of the reinforcing frame 30.

  Similarly, each Y driver substrate 50d and the connection terminal 22 provided on the peripheral edge of the back substrate 12 are connected by a flexible printed wiring board (not shown). Also in this case, each flexible printed wiring board is routed from the Y driver substrate 50d to the back substrate 12 side through the outer periphery of the reinforcing frame 30.

  According to the SED configured as described above, most of the reinforcing frame 30, that is, the first and second frame members 32 and 34 are configured by an extruded material. Therefore, the size of the aluminum plate used as the support plate 56 can be reduced, and the manufacturing cost of the reinforcing frame can be reduced.

  The peripheral portion of the reinforcing frame 30 protrudes toward the back substrate 12 and is positioned to face the peripheral portion of the back substrate. Therefore, when the flexible printed wiring board 62 is routed from the X driver board and the Y driver board as circuit boards to the connection terminals 22 of the rear board 12, the peripheral edge of the reinforcing frame 30 does not become an obstacle, and the flexible printed wiring board is shortened. be able to. As a result, the amount of flexible printed wiring boards used in the entire SED can be reduced, and the manufacturing cost can be reduced.

  Next explained is an SED according to the second embodiment of the invention. FIG. 6 is a partially broken view of the SED according to the second embodiment. As shown in FIG. 6, the SED includes a shield cover 64 made of an electromagnetically absorbable material, and a flexible printed wiring board that electrically connects the driver circuit and the back substrate 12 with the shield cover. Covering. The shield cover 64 that functions as a shield member is formed in a U-shaped cross section, for example, by an extruded aluminum material having a thickness of about 1 mm. The shield cover 64 is disposed so as to cover the flexible printed wiring board 62, the peripheral edge portion of the reinforcing frame 30, and the peripheral edge portion of the envelope 10, and one end portions thereof are the first high-strength portion 32a and the second high strength portion of the reinforcing frame 30. It is fixed to the strength part 34 a and the other end is fixed to the outer peripheral edge of the front substrate 11.

In the second embodiment, the other configurations of the SED are the same as those of the first embodiment described above, and the same reference numerals are given to the same portions, and detailed descriptions thereof are omitted.
According to the SED configured as described above, by covering the flexible printed wiring board 62 with the shield cover 64, electromagnetic waves emitted from the flexible printed wiring board can be shielded and leakage to the outside can be prevented. At the same time, noise entering the flexible printed wiring board from the outside can be shielded. In addition, the flexible printed wiring board is protected by the shield cover 64, so that the flexible printed wiring board can be surely prevented from being damaged in the SED manufacturing process, transportation, and assembly process. The shield cover 64 can improve the reliability of increasing the strength of the peripheral edge of the envelope 10.
In addition, also in 2nd Embodiment, the effect similar to 1st Embodiment can be acquired.

  In the second embodiment, the shield cover may be formed of an extruded aluminum material, a metal plate, a synthetic resin coated with a conductive paint, a carbon fiber reinforced composite material, or the like. Moreover, you may form a shield cover with the metal tape and adhesive tape which have electroconductivity.

The present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiments. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.
The present invention is not limited to the FED and SED, and can be applied to other flat image display devices such as a PDP.

FIG. 1 is a perspective view showing the appearance of an SED according to an embodiment of the present invention. FIG. 2 is a perspective view showing a back side of the SED and a reinforcing frame. FIG. 3 is an enlarged perspective view showing a part of the reinforcing frame. FIG. 4 is a perspective view showing a back surface side of the SED and a reinforcing frame on which electronic components are mounted. FIG. 5 is a cross-sectional view of the SED along line AA in FIG. FIG. 6 is a sectional view showing an SED according to a second embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Envelope, 11 ... Front substrate, 12 ... Back substrate, 15 ... Phosphor screen,
18 ... electron-emitting device, 22 ... connection terminal, 30 ... reinforcing frame,
32 ... 1st frame member, 32a ... 1st high intensity | strength part, 32b, 34b ... mounting part,
32c, 34c ... Standing portion, 34 ... Second frame member, 34a ... Second high-strength portion,
50 ... accessory parts, 50c ... X driver circuit, 50d ... Y driver circuit,
62 ... Flexible printed circuit board 63 ... Connection part 64 ... Shield cover

Claims (5)

An envelope comprising a front substrate having a display surface and a rectangular rear substrate disposed opposite to the front substrate, a reinforcement frame attached to the outer surface of the rear substrate and reinforcing the envelope, and the reinforcement A plurality of circuit boards mounted on a frame; a connection part provided at a peripheral edge of the rear substrate; and a wiring electrically connecting the circuit board and the connection part,
The reinforcing frame is a pair of first frame members that extend substantially parallel to the long side of the back substrate, respectively, and a pair that extends substantially parallel to the short side of the back substrate and connects the first frame member. A second frame member,
Each of the first frame members is formed of an extruded material, and has a peripheral edge that protrudes toward the envelope side and faces the peripheral edge of the back substrate, and each of the second frame members is formed of an extruded material. And has a peripheral edge protruding to the envelope side and facing the peripheral edge of the back substrate,
The image display device, wherein the wiring is routed from the circuit board to the connecting portion through the outer periphery of the reinforcing frame.   The image display device according to claim 1, wherein the plurality of circuit boards are provided side by side along a peripheral edge of the reinforcing frame, and the wiring is formed by a flexible printed wiring board. Each of the first frame members includes a first high-strength portion formed in a hollow bar shape, a flat mounting portion extending from the first high-strength portion and extending along the outer surface of the back substrate, and the mounting A standing part formed along the extended end of the part and constituting the peripheral part, and
Each of the second frame members includes a second high-strength portion formed in a hollow rod shape, a flat mounting portion extending from the second high-strength portion and extending along the outer surface of the back substrate, and the mounting A standing part formed along the extended end of the part and constituting the peripheral part, and
The image display device according to claim 1, wherein an accessory component including a circuit board is mounted on the mounting portion.   The image display apparatus according to claim 2, further comprising a shield member that covers the flexible printed wiring board and is fixed to the reinforcing frame and shields electromagnetic waves.   The phosphor layer formed on the inner surface of the front substrate and constituting the display surface, and a plurality of electron-emitting devices provided on the inner surface of the rear substrate for exciting the phosphor layer. 5. The image display device according to any one of 4.

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