JP2007079219A - Direct drawing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a direct drawing device capable of further reducing the size of a pixel of an image to be drawn. <P>SOLUTION: A light-emitting pixel array is configured by arranging a plurality of light-emitting pixels that emit light into at least one line. A light-shielding mask having apertures formed and arranged corresponding to the light-emitting pixels in such a manner that a part of light emitting from the light-emitting pixel passes the corresponding aperture and the entire region in each aperture is used to pass the light emitting from the corresponding light-emitting pixel, and that light incident to a region out of the aperture is blocked. A stage holds an exposure object having a photosensitive film formed on the surface. A condensing optical system condenses light beams emitting from the light-emitting pixels and passing the corresponding apertures of the light-shielding mask onto the exposure object held on the stage. A moving mechanism moves one of the exposure object held on the stage and the condensing optical system with respect to the other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a direct drawing apparatus, and more particularly to a direct drawing apparatus that can directly draw a circuit pattern on a photoresist film formed on a printed circuit board.

  Known methods for drawing a circuit pattern on a photoresist film on a printed circuit board include contact exposure, reduced projection exposure, and proximity exposure using a photomask on which a circuit pattern is formed. As the number of printed circuit boards is increased, the photomasks must be manufactured for each type of printed circuit board. For this reason, a direct drawing method that does not use a photomask attracts attention.

  A photoresist pattern direct drawing apparatus disclosed in Patent Document 1 below will be described. An exposure light source having edge-emitting electroluminescence (EL) elements arranged in an array is arranged above the substrate. The light emission of each EL element is on / off controlled by the control circuit. Light emitted from each EL element is irradiated onto the substrate by the condensing optical system.

  A desired pattern can be drawn by controlling on / off of light emission of each EL element while moving one of the exposure light source and the substrate in a direction orthogonal to the direction in which the EL elements are arranged.

  Patent Document 2 below discloses a print head for an electrophotographic printer using a light emitting diode (LED) array chip. The light emitting portions are arranged in two rows and in a staggered manner. By arranging them in two rows and in a staggered manner, the print dot density can be increased.

Japanese Patent Laid-Open No. 5-80524 JP 2000-289250 A

  In an electrophotographic apparatus using an LED array, an erecting equal-magnification image of the light emitting portion of each LED is usually formed on the surface of an exposure object by a selfoc lens array. For this reason, the size of the pixels constituting the image is equal to the size of the light emitting portion of the LED array. In the case of exposing a photosensitive film, the pixel size of an image to be drawn generally depends on the sensitivity of the photosensitive film and the light intensity distribution of an erect life-size image on the surface of the photosensitive film. The size is considered to be approximately the same as the size of the light emitting portion.

  In addition, the light emitting portion of the LED array may be formed at a position slightly deviated from the design position due to manufacturing variations. When the position of the light emitting portion is shifted, the position of the formed equal-magnification image formed by the SELFOC lens array is also shifted. Since this deviation is very small, there is no problem in a normal electrophotographic apparatus. However, in a direct drawing apparatus for forming a circuit pattern on a printed circuit board, a positional deviation of pixels to be drawn causes a disconnection or a short circuit of wiring.

  The objective of this invention is providing the direct drawing apparatus which can make the pixel of the image drawn smaller. Another object of the present invention is to provide a direct drawing apparatus that is less likely to cause pixel displacement of a drawn image.

  According to an aspect of the present invention, a light-emitting pixel array in which a plurality of light-emitting pixels that emit light are arranged in at least one column, and an opening is formed corresponding to the light-emitting pixel, and light emitted from the light-emitting pixels A light-shielding mask that partially displaces light that is emitted from the corresponding light-emitting pixel and passes through the corresponding opening, and blocks light incident on areas other than the opening. And a stage for holding an exposure object having a photosensitive film formed on the surface, and light emitted from the light emitting pixels and passing through a corresponding opening of the light shielding mask on the exposure object held on the stage There is provided a direct drawing apparatus having a condensing optical system for condensing and a moving mechanism for moving one of the exposure object held on the stage and the condensing optical system with respect to the other.

  According to another aspect of the present invention, a light emitting pixel array in which a plurality of light emitting pixels that emit light are arranged in at least one column, a stage that holds an exposure target having a photosensitive film formed on a surface thereof, and the light emitting pixels A microlens array including a selfoc lens array disposed at a position where emitted light is incident and a microlens disposed corresponding to the light emitting pixel at a position where light transmitted through the selfoc lens array is incident Wherein the microlens condenses the light emitted from the corresponding light emitting pixels and passed through the selfoc lens array on the surface of the exposure object held on the stage; and Provided is a direct drawing apparatus having an exposure object held on a stage and a moving mechanism for moving one of the light emitting pixel arrays with respect to the other. It is.

  According to still another aspect of the present invention, a light-emitting pixel array in which a plurality of light-emitting pixels that emit light are arranged in at least one row, a stage that holds an exposure target having a photosensitive film formed on a surface thereof, and the light-emitting pixels A condensing optical system for condensing the light emitted from each of the exposure object held on the stage, and one of the exposure object and the condensing optical system held on the stage with respect to the other There is provided a direct drawing apparatus having a moving mechanism for moving the light and a condensing position detecting means for measuring relative positions of a plurality of condensing regions of light emitted from the plurality of light emitting pixels.

  The effective light-emitting pixel size is limited by the opening, and the pixel of the drawn image can be reduced. Furthermore, since the effective light emitting pixel position is defined by the opening, it is possible to prevent image disturbance due to variations in the light emitting pixel position. With the microlens, a condensing region formed on the exposure object can be reduced. This makes it possible to reduce the pixels of the rendered image. By measuring the relative position of the condensing region of the light emitted from the light emitting pixels, it is possible to compensate for the positional deviation by shifting the timing of light emission during drawing.

  1A and 1B show a front view and a plan view of a direct drawing apparatus according to the first embodiment, respectively. An XY stage 2 is attached on the base 1. On the XY stage 2, a printed circuit board 10 that is an object to be exposed is held. A photosensitive film made of a dry film resist (DF resist) or a solder resist that is exposed to ultraviolet light is provided on the surface of the printed circuit board 10. An XYZ orthogonal coordinate system is defined in which a plane parallel to the surface of the printed circuit board 10 held on the XY stage 2 is an XY plane.

  The XY stage 2 can be moved in the X-axis direction and the Y-axis direction by the moving mechanism 8. The moving mechanism 8 is controlled by the control device 4. An exposure light source 3 is disposed above the printed circuit board 10 held on the XY stage 2. The exposure light source 3 includes a number of light emitting diodes (LEDs) arranged in a direction parallel to the Y axis. Each of the LEDs emits ultraviolet light having a wavelength in the range of 350 nm to 410 nm. Light emitted from each light emitting portion of the LED is incident on a predetermined position on the surface of the exposure object 10 held on the XY stage 2. A region where light enters is referred to as a “condensing region”. The condensing region is arranged in a direction parallel to the Y axis on the surface of the exposure object 10. The detailed structure of the exposure light source 3 will be described later with reference to FIGS. 2A and 2B.

  Two condensing position detectors 6 are fixed on the upper surface of the XY stage 2. The condensing position detector 6 can measure the position where light is actually incident by receiving the light emitted from the LED of the exposure light source 3. As the condensing position detector 6, for example, a quadrant photodetector can be used.

  Two CCD cameras 7 are arranged above the XY stage 2. The CCD camera 7 detects the position of the exposure object 10 by observing the alignment mark formed on the exposure object 10. Furthermore, the position of the condensing position detector 6 can be measured by arranging the condensing position detector 6 in the field of view of the CCD camera 7.

  Detection results by the condensing position detector 6 and the CCD camera 7 are input to the control device 4. The control device 4 controls the moving mechanism 8 on the basis of the detection results input from the condensing position detector 6 and the CCD camera 7 and image data given in advance, and a plurality of components constituting the exposure light source 3. LED light emission timing control is performed.

  A cooling device 5 is thermally coupled to the exposure light source 3 and cools the exposure light source 3. A coolant channel is formed in the cooling device 5. The refrigerant is introduced from the refrigerant introduction path 5a into the flow path in the cooling device 5, and the refrigerant flowing through the flow path is discharged through the refrigerant discharge path 5b.

  FIG. 2A shows a partial cross-sectional view of the exposure light source 3 and the exposure object 10. The exposure light source 3 includes a light emitting pixel array 30, a light shielding mask 32, and a condensing optical system 34. The light emitting pixel array 30 includes a large number of light emitting pixels 31 arranged along a virtual straight line parallel to the Y axis. Each of the light emitting pixels 31 is constituted by, for example, an LED, and the light emission wavelength is in the ultraviolet region.

  A light shielding mask 32 is disposed on the path of light emitted from the light emitting pixels 31. An opening 33 corresponding to the light emitting pixel 31 is formed in the light shielding mask 32.

  FIG. 2B shows the positional relationship between the light emitting pixels 31 and the openings 33. When viewed from a line of sight parallel to the Z axis, the opening 33 is smaller than the light emitting pixel 31, and each of the openings 33 is disposed at a position included in the corresponding light emitting pixel 31. A part of the light emitted from the light emitting pixel 31 passes through the opening 33 corresponding to the light emitting pixel 31, and the remaining components are shielded by the light shielding mask 32. Further, the light emitted from the corresponding light emitting pixel 31 passes through the entire area in the opening 33.

  Returning to FIG. 2A, the description will be continued. A condensing optical system 34 is disposed between the light shielding mask 32 and the exposure target 10. The condensing optical system 34 forms an erecting equal-magnification image of the opening 33 formed in the light shielding mask 32 on the surface of the exposure object 10. When the opening 33 is a square, depending on the size, the vertex may be rounded due to the resolution limit, and an image close to a circle may be formed. As the condensing optical system 34, for example, a Selfoc lens array in which a number of Selfoc lenses having a central axis parallel to the Z axis are two-dimensionally arranged along a plane parallel to the XY plane can be used.

  The exposure object 10 has a laminated structure in which a resin core substrate 10A, a copper foil 10B, and a photosensitive film 10C are laminated in this order. The photosensitive film 10C is formed of, for example, a DF resist or a solder resist. In the photosensitive film 10C, the area where the equal-size image of the opening 33 is formed is exposed to form a latent image.

  While moving the XY stage 2 shown in FIGS. 1A and 1B in the X-axis direction, the light emitting pixels 31 emit light based on the image data to be drawn, whereby a latent image of the image to be drawn is formed on the photosensitive film 10C. Can be formed. By developing the photosensitive film 10C on which the latent image is formed, an image (pattern) made of the photosensitive film 10C is formed.

  The equal-magnification image of the opening 33 is distributed discretely in the Y-axis direction. For this reason, it is not possible to draw a continuous pattern in the Y-axis direction only by moving it once in the X-axis direction. The exposure object 10 is moved in the Y-axis direction by the size of the opening 33 in the Y-axis direction, and the second drawing is performed while moving the exposure object 10 in the X-axis direction at that position. By repeating the movement in the Y-axis direction and the drawing while moving in the X-axis direction, a pattern continuous in the Y-axis direction can be drawn.

  In the first embodiment, the size of the pixel (dot) on the surface of the exposure object 10 is determined by the size of the opening 33 formed in the light shielding mask 32. Since the opening 33 is smaller than the light emitting pixel 31, the pixel of the image drawn can be made small compared with the case where the light shielding mask 32 is not disposed. This makes it possible to increase the dot density of the image.

  FIG. 3 shows the positional relationship between the light emitting pixels and the light shielding mask of the direct drawing apparatus according to the second embodiment. In the second embodiment, four light emitting pixel arrays 30a to 30d are arranged. Each of the light emitting pixel arrays 30a to 30d includes a plurality of light emitting pixels 31a to 31d arranged at a pitch P in the Y-axis direction. The light emitting pixel arrays 30a to 30d are arranged in this order in the X-axis direction.

  The light emitting pixels 31b to 31d of the light emitting pixel arrays 30b to 30d in the second row to the fourth row respectively correspond to the light emitting pixels 31a of the light emitting pixel array 30a in the first row by 1/4 of the pitch P in the Y-axis direction. It is arranged at a position displaced by 4 and 3/4.

  In the second embodiment, instead of the light shielding mask 32 shown in FIG. 2A, a large light shielding mask 32a in which openings are two-dimensionally distributed is arranged. In the light shielding mask 32a of the second embodiment, an opening 33a is formed at a position corresponding to the light emitting pixel 31a in the first row. Similarly, the openings 33b to 33d are formed in the light emitting pixels 31b to 31d in the second to fourth rows. When viewed with a line of sight parallel to the Z-axis, each of the openings 33a to 33d is included in the corresponding light emitting pixel 31a to 31d. The openings 33a to 33d corresponding to the light emitting pixels in each row are arranged at a pitch P in the Y-axis direction.

  The openings 33b to 33d in the second to fourth rows are formed at positions where the openings 33a in the first row are displaced by 1/4, 2/4, and 3/4 of the pitch P in the Y-axis direction, respectively. ing. Each of the openings 33a to 33d is a square having sides parallel to the X-axis direction and the Y-axis direction, and the length of one side is 1/4 of the pitch P. The openings 30a to 30d are distributed without gaps in the Y-axis direction as a whole.

  For this reason, the images of the openings 33a to 33d are distributed on the surface of the exposure object 10 with no gap in the Y-axis direction. When the exposure amount on the outer periphery of the image of the openings 33a to 33d is equal to the threshold value at which the photosensitive film 10C shown in FIG. 2A is developed, that is, the dimension of the pattern that is exposed and developed by the images of the openings 33a to 33d. However, when the dimensions of the openings 33a to 33d are substantially the same, a pattern continuous in the Y-axis direction can be formed by performing drawing while moving the exposure object 10 in the X-axis direction.

  When the exposure amount on the outer periphery of the image of the openings 33a to 33d is smaller than the development threshold value, the developed pattern is smaller than the openings 33a to 33d. In such a case, the openings 33a to 33d may be slightly enlarged so that the openings 33a to 33d are distributed with a slight weight in the Y-axis direction as a whole. Thus, by increasing the openings 33a to 33d, the patterns formed by the openings 33a to 33d can be arranged without gaps in the Y-axis direction.

  In the second embodiment, the case where the light emitting pixels 31a to 31d and the openings 33a to 33d are arranged in four rows is shown, but they may be arranged in two rows, three rows, or five rows or more. Also in this case, the light emitting pixels and the openings may be arranged so that the pattern formed on the photosensitive film 10C by the openings is distributed without gaps in the Y-axis direction as a whole.

  FIG. 4 shows a cross-sectional view of the exposure light source 3 and the exposure object 10 according to the third embodiment. In the third embodiment, the light shielding mask 32 of the first embodiment shown in FIG. 2A is removed, and a microlens array 40 is disposed between the condensing optical system 34 and the exposure object 10 instead. Has been. The microlens array 40 includes microlenses 41 arranged at positions corresponding to the light emitting pixels 31.

  The light emitted from the light emitting pixels 31 is collected by the condensing optical system 34 and then collected by the corresponding microlens 41. As a result, an image smaller than the light emitting pixel 31 is formed on the surface of the exposure object 10. For this reason, the pixels constituting the image drawn on the photosensitive film 10 </ b> C (pixels of the drawn image) are smaller than the light emitting pixels 31.

  Next, a drawing method will be described. After drawing while moving the exposure target object 10 in the X-axis direction, the exposure target object 10 is displaced in the Y-axis direction by the size of the pixel of the drawn image in the Y-axis direction. In this state, drawing is performed while further moving in the X-axis direction. In this way, an image including a pattern continuous in the Y-axis direction can be formed by alternately repeating the drawing process while moving the exposure object in the X-axis direction and the displacement in the Y-axis direction. it can.

  An image with a higher dot density can be formed on the surface of the exposure object 10 than in the case where an equal-magnification image of the light emitting pixels 31 is formed.

  FIG. 5 shows the positional relationship between the light emitting pixels and the light shielding mask of the direct drawing apparatus according to the fourth embodiment. In the first embodiment shown in FIG. 2B, the case where the light emitting pixels 31 are arranged in a line at an equal pitch in the Y-axis direction is shown. However, there may be variations in the position of the light emitting pixels 31 due to variations in the manufacturing process. In the fourth embodiment shown in FIG. 5, the light emitting pixels 31 are arranged at positions shifted from the designed positions in the X-axis direction and the Y-axis direction.

  The position of the opening 33 of the light shielding mask 32 hardly varies. Even when the position of the light emitting pixel 31 is deviated from the design position, the opening 33 is included in the corresponding light emitting pixel 31 when viewed from a line of sight parallel to the Z axis.

  As described with reference to FIGS. 2A and 2B, the condensing optical system 34 forms an erecting equal-magnification image of the opening 33 on the surface of the exposure target 10. For this reason, even if the position of the light emitting pixel 31 varies, the position of the image on the surface of the exposure object 10 does not vary. For this reason, it is possible to prevent image disturbance due to variations in the positions of the light emitting pixels 31.

  FIG. 6 shows the positional relationship between the light emitting pixels and the light shielding mask of the direct drawing apparatus according to the fifth embodiment. In the sixth embodiment, a plurality of light emitting pixels 31j are arranged on both sides of the virtual straight line 45. The first side light emitting pixels 31j are arranged in a direction parallel to the virtual straight line 45, and the opposite second side light emitting pixel 31j is a line-symmetrical position of the first side light emitting pixels 31j with respect to the virtual straight line 45. Is arranged. The light emitting pixel array 30j is arranged so that the virtual straight line 45 is inclined with respect to the Y axis.

  An opening 33j of the light shielding mask 32j is formed corresponding to the light emitting pixel 33j. Attention is paid to the first opening 33j1 and the second opening 33j2 that are adjacent to each other on the first side, and the third opening 33j3 on the second side that is disposed at a symmetrical position of the first opening 33j1. The distance Py1 between the centers of the first opening 33j1 and the third opening 33j3 in the Y-axis direction and the distance Py2 between the centers of the third opening 33j3 and the second opening 33j2 in the Y-axis direction are The virtual straight line 45 is inclined with respect to the Y axis so as to be equal.

  Since the distances Py1 and Py2 between the centers are equal, the pixels constituting the image can be evenly distributed in the Y-axis direction by drawing while moving the exposure object 10 in the X-axis direction. Compared with the case where the light emitting pixels and the openings are arranged in a line, the pixel density in the Y-axis direction can be increased.

  When these openings are arranged so that the pattern formed on the photosensitive film 10C by the first opening 33j1 and the pattern formed on the photosensitive film 10C by the third opening 33j3 overlap or contact each other in the Y-axis direction. As in the case of the second embodiment shown in FIG. 3, by performing drawing once while moving in the X-axis direction, an image including a pattern continuous in the Y-axis direction can be formed.

  Next, a direct drawing apparatus according to the sixth embodiment will be described with reference to FIGS. In addition, FIG. 1A, FIG. 1B, and FIG. 4 are referred as needed. In the sixth embodiment, a light source having the same structure as that of the exposure light source 3 according to the third embodiment shown in FIG. 4 is used.

  FIG. 7 shows a schematic plan view of the condensing position detector 6 composed of a four-divided photodetector. A UV orthogonal coordinate system is defined on the upper surface of the condensing position detector 6. First to fourth light receiving regions 50a to 50d are arranged in the first to fourth quadrants of the UV orthogonal coordinate system, respectively. Each of the first to fourth light receiving regions 50a to 50d is, for example, a square. The first to fourth light receiving regions 50 a to 50 d are line targets with respect to the U axis and the V axis, and have four-fold rotational symmetry with respect to the origin 52. The interval between the light receiving regions adjacent to each other across the U axis or the V axis is defined as W. The first to fourth light receiving regions 50a to 50d can measure the amount of received light independently. The condensing position detector 6 has an XY stage whose upper surface is the same height as the surface of the exposure object 10, the U axis is parallel to the X axis, and the V axis is parallel to the Y axis. 2 is fixed.

  When the condensing position detector 6 is disposed immediately below the one light emitting pixel 31 shown in FIG. 4, the light emitted from the light emitting pixel 31 is incident on a part of the upper surface of the condensing position detector 6. A circular condensing region 51 is formed. When the center of the condensing area 51 coincides with the origin 52 of the UV coordinates, the light amounts measured in the first to fourth light receiving areas 50a to 50d are all equal. When the center of the condensing area 51 is deviated from the origin 52, the amount of light measured in the first to fourth light receiving areas 50a to 50d varies. When the light amount is measured in at least three light receiving regions among the first to fourth light receiving regions 50a to 50d, the magnitude of the shift and the direction of the shift of the light collecting region 51 are obtained based on the measured light amounts. be able to.

  In order to detect the deviation of the light collection region 51, it is necessary to use a light collection position detector 6 having a distance W that is at least narrower than the diameter of the light collection region 51. Further, in order to increase the detection accuracy of the deviation, it is preferable to use a space W that is 50% or less of the diameter of the light collection region 51.

  The function of the control device 4 shown in FIG. 1A will be described. The control device 4 stores image data to be drawn. By controlling the XY stage 2, the condensing position detector 6 is arranged immediately below one light emitting pixel 31. The light emitting pixel 31 is caused to emit light, and the measurement result of the received light amount by the condensing position detector 6 is received. From this measurement result, the center position of the light condensing region of the light emitted from the light emitting pixel 31 can be measured.

  FIG. 8 shows an example of the relative position of the light collection region 51 of the light emitted from the plurality of light emitting pixels 31. One light emitting pixel among the plurality of light emitting pixels 31 is set as a reference light emitting pixel. The position 55 in the X-axis direction at the center of the condensing region 51 (0) of the light emitted from the reference light emitting pixel is referred to as an X-direction reference position.

  Deviations D1, D2,... From the X-direction reference position 55 at the center of the condensing areas 51 (1), 51 (2),. Ask and remember. When the XY stage 2 is moved in the X-axis direction and the light emitting pixel 31 emits light to perform drawing, the shift amounts D1, D2,... Are compensated based on the image data to be drawn. The light emission timing of the light emitting pixel 31 is controlled.

  It is possible to compensate for the shift amounts D1, D2,... In the X-axis direction of the condensing region 51, and to form an image without distortion in the X-axis direction. For example, a straight line pattern parallel to the Y axis can be prevented from becoming a curve.

  In the sixth embodiment, when the condensing region 51 of the light-emitting pixel 31 is shifted in the Y-axis direction from the designed position, the shift cannot be corrected. However, since the linear pattern parallel to the X-axis direction is formed by causing the same light emitting pixel 31 to emit light, the drawn pattern is prevented from becoming a curve.

  In the above embodiment, the exposure object 10 is moved with respect to the exposure light source 3, but the exposure light source 3 may be moved with respect to the exposure object 10.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

FIG. 1A is a front view of a direct drawing apparatus according to the first embodiment, and FIG. 1B is a plan view thereof. FIG. 2A is a sectional view of an exposure light source and an exposure object of the direct drawing apparatus according to the first embodiment, and FIG. 2B is a diagram showing a positional relationship between the light emitting pixels and the openings. It is a figure which shows the positional relationship of the light emission pixel and opening of a direct drawing apparatus by a 2nd Example. It is sectional drawing of the exposure light source and exposure target object of the direct drawing apparatus by a 3rd Example. It is a figure which shows the positional relationship of the light emission pixel and opening of a direct drawing apparatus by a 4th Example. It is a figure which shows the positional relationship of the light emission pixel and opening of a direct drawing apparatus by a 5th Example. It is a top view of the condensing position detector of the direct drawing apparatus by a 6th Example. It is a figure which shows an example of arrangement | positioning of the condensing area | region of the direct drawing apparatus by 6th Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 2 XY stage 3 Exposure light source 4 Control apparatus 5 Cooling apparatus 6 Condensing position detector 7 CCD camera 8 Moving mechanism 10 Exposure target object 30 Light emitting pixel array 31 Light emitting pixel 32 Light shielding mask 33 Aperture 34 Condensing optical system 40 Micro Lens array 41 Micro lens 45 Virtual straight lines 50a to 50d Light receiving area 51 Condensing area 52 Origin 55 X-direction reference position

Claims (6)

A light emitting pixel array in which a plurality of light emitting pixels emitting light are arranged in at least one column;
An opening is formed corresponding to the light emitting pixel, a part of the light emitted from the light emitting pixel passes through the corresponding opening, and the entire area within each opening is emitted from the corresponding light emitting pixel. A light shielding mask that shields light incident on a region other than the opening,
A stage for holding an exposure object having a photosensitive film formed on the surface;
A condensing optical system for condensing the light emitted from the light emitting pixels and passing through the corresponding opening of the light shielding mask onto the exposure target held on the stage;
A direct drawing apparatus having an exposure object held on the stage and a moving mechanism for moving one of the condensing optical system with respect to the other.   The direct drawing apparatus according to claim 1, wherein the condensing optical system includes a Selfoc lens array, and an erecting equal-magnification image of the opening of the light shielding mask is formed on a surface of an exposure target held on the stage.   The direct drawing apparatus according to claim 1, wherein the light emitting pixel is configured by a light emitting portion of a light emitting diode that emits ultraviolet light. A light emitting pixel array in which a plurality of light emitting pixels emitting light are arranged in at least one column;
A stage for holding an exposure object having a photosensitive film formed on the surface;
A selfoc lens array disposed at a position where light emitted from the light emitting pixels is incident;
A microlens array including a microlens arranged corresponding to the light emitting pixel at a position where light transmitted through the selfoc lens array is incident, the microlens being emitted from the corresponding light emitting pixel and The microlens array for condensing the light that has passed through the selfoc lens array on the surface of the exposure object held on the stage;
A direct drawing apparatus comprising: an exposure object held on the stage; and a moving mechanism for moving one of the light emitting pixel array with respect to the other. A light emitting pixel array in which a plurality of light emitting pixels emitting light are arranged in at least one column;
A stage for holding an exposure object having a photosensitive film formed on the surface;
A condensing optical system for condensing the light emitted from each of the light emitting pixels onto an exposure object held on the stage;
A moving mechanism for moving one of the exposure object held on the stage and the condensing optical system with respect to the other;
A direct drawing apparatus comprising: condensing position detecting means for measuring relative positions of a plurality of condensing areas of light emitted from the plurality of light emitting pixels.   Further, while moving one of the exposure object held on the stage and the condensing optical system in the first direction with respect to the other, the plurality of condensing regions detected by the condensing position detecting means The direct drawing apparatus according to claim 5, further comprising a control device that controls a light emission timing of the light emitting pixel based on a relative shift amount with respect to the first direction and image data to be drawn.

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