JP2007073948A - Method of fabricating semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of fabricating a semiconductor device with higher reliability. <P>SOLUTION: The method of fabricating the semiconductor device includes a step of forming a first conductive layer on a substrate; a step of forming a second conductive layer containing conductive particles (also referred to as conductive fine particles) of gold, silver, or copper, and a resin on the first conductive layer; and a step of irradiating the second conductive layer with a laser beam to expand an area (part), where the first conductive layer and the second conductive layer come into contact with each other. Since the method includes the step of irradiating the second conductive layer with the laser beam, even when the second conductive layer composed of the conductive particles and the resin is formed on the first conductive layer, it is possible to expand the part where the first conductive layer and the second conductive layer come into contact with each other, and to repair an faulty electrical connection between the first conductive layer and the second conductive layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a method for manufacturing a semiconductor device and a semiconductor device. A semiconductor device includes a transistor.

In recent years, development of semiconductor devices capable of transmitting and receiving data without contact has been underway. Such a semiconductor device is called an RFID (Radio Frequency IDentification), an RF chip, an RF tag, an IC chip, an IC tag, an IC label, a wireless chip, a wireless tag, an electronic chip, an electronic tag, a wireless processor, a wireless memory, or the like. (For example, see Patent Document 1), introduction has already begun in some fields.
JP 2004-282050 A

An object of the present invention is to provide a semiconductor device and a manufacturing method thereof that can improve reliability. It is another object of the present invention to provide a method for manufacturing a semiconductor device that can improve productivity.

It is another object of the present invention to provide a semiconductor device and a manufacturing method thereof in which reliability is improved by improving an electrical connection failure. In particular, it is an object to improve poor electrical connection between the first conductive layer and the second conductive layer when the second conductive layer containing conductive particles is formed on the first conductive layer. To do.

The method for manufacturing a semiconductor device of the present invention includes a step of forming a first conductive layer over a substrate, a step of forming a second conductive layer over the first conductive layer, a first conductive layer, and a second conductive layer. A step of irradiating the laminate of the conductive layers with a laser beam. By irradiating the laser beam, the portion where the first conductive layer and the second conductive layer are in contact with each other can be increased, and electrical connection can be made more reliable. Therefore, reliability can be improved. As the first conductive layer, a layer containing titanium, tungsten, chromium, aluminum, tantalum, nickel, zirconium, hafnium, vanadium, iridium, niobium, lead, platinum, molybdenum, cobalt, or rhodium is formed. As the second conductive layer, a layer containing silver, gold, or copper is formed.

In the method for manufacturing a semiconductor device of the present invention, a stacked body including a thin film transistor is provided over a first substrate, and heat treatment is performed to separate the stacked body from the first substrate, and over the second substrate. Providing a laminate. The first substrate is provided with an adhesive layer whose adhesive force is reduced by heat treatment, and the second substrate is provided with an adhesive layer whose adhesive force is increased by heat treatment. Therefore, by performing heat treatment, two steps of separating the stacked body from the first substrate and providing the stacked body over the second substrate can be performed simultaneously. In this manner, by using two substrates provided with adhesive layers having different properties, the process can be simplified and productivity can be improved.

The method for manufacturing a semiconductor device of the present invention includes at least one of the above two steps. In the method for manufacturing a semiconductor device of the present invention, a step of forming a peeling layer over a first substrate, a step of forming a first insulating layer over the peeling layer, and a transistor over the first insulating layer are formed. A step, a step of forming a second insulating layer over the transistor, and a step of forming a first conductive layer connected to the source or drain of the transistor through an opening provided in the second insulating layer. A step of forming a second conductive layer on the same layer as the first conductive layer, a step of forming a third conductive layer so as to be in contact with the second conductive layer, and a laser beam on the third conductive layer And irradiating. The second conductive layer is a source wiring or a drain wiring. The third conductive layer is a connection terminal connected to the outside. The second conductive layer and the third conductive layer are electrically connected. The step of forming the second conductive layer and the step of forming the third conductive layer may be performed simultaneously.

In addition to the above steps, the third insulating layer is selected so that a part of the third conductive layer is exposed on the second insulating layer, the first conductive layer, and the third conductive layer. Forming the first insulating layer, irradiating the second insulating layer and the third insulating layer with a laser beam to form an opening that exposes the release layer, and the second insulating layer on the surface of the third insulating layer. And a laminated body including the first insulating layer and the transistor from the first substrate, using the second substrate as a boundary with the inside of the peeling layer or the interface between the peeling layer and the first insulating layer as a boundary. Separating the substrate, providing a third substrate on the surface of the first insulating layer, separating the second substrate from the surface of the second insulating layer, and an opening provided in the third insulating layer Forming a fourth conductive layer connected to the third conductive layer through the portion, and a fifth conductive layer on the fourth conductive layer and the fourth substrate. As is the layer are electrically connected, and a step of providing a fourth substrate on the third insulating layer.

In the above method for manufacturing a semiconductor device, the first substrate is a glass substrate. Further, a layer containing tungsten or molybdenum is formed as the separation layer. In addition, a layer containing titanium, tungsten, chromium, aluminum, tantalum, nickel, zirconium, hafnium, vanadium, iridium, niobium, lead, platinum, molybdenum, cobalt, or rhodium is formed as the second conductive layer. In addition, a layer containing silver, gold, or copper is formed as the third conductive layer. In addition, a layer containing silver, gold, or copper is formed as the fourth conductive layer.

The semiconductor device of the present invention includes a transistor, a first insulating layer provided on the transistor, and a first conductive layer connected to the source or drain of the transistor through an opening provided in the first insulating layer. A second conductive layer provided on the same layer as the first conductive layer, a first insulating layer, a first conductive layer, and a second conductive layer provided on the second conductive layer. Have. Further, a third conductive layer provided so as to fill the opening provided in the second insulating layer and in contact with the second conductive layer, and an opening provided in the second insulating layer are filled. A fourth conductive layer provided in contact with the third conductive layer; a second insulating layer; a third insulating layer provided on the fourth conductive layer; and an opening provided in the third insulating layer A fifth conductive layer electrically connected to the fourth conductive layer through the third conductive layer, a third insulating layer, and a substrate provided on the fifth conductive layer.

In the semiconductor device having the above structure, the second conductive layer is a layer containing titanium, tungsten, chromium, aluminum, tantalum, nickel, zirconium, hafnium, vanadium, iridium, niobium, lead, platinum, molybdenum, cobalt, or rhodium. . The third conductive layer is a layer containing silver, gold, or copper. The fourth conductive layer is a layer containing silver, gold, or copper. Further, the fifth conductive layer functions as an antenna.

The method for manufacturing a semiconductor device of the present invention includes a step of forming a first conductive layer on a substrate, gold, silver, or copper conductive particles (also referred to as conductive fine particles) and a resin on the first conductive layer. A step of forming a second conductive layer including: a step of irradiating the second conductive layer with a laser beam to increase an area (part) where the first conductive layer and the second conductive layer are in contact with each other; including. The first conductive layer is formed by a sputtering method, an evaporation method, a CVD method, or a droplet discharge method. Preferably, the first conductive layer is formed by a sputtering method. Further, the second conductive layer is formed by a printing method. Preferably, the second conductive layer is formed by a screen printing method. The second conductive layer is made of conductive particles and resin, and is in a paste form. The method for manufacturing a semiconductor device of the present invention includes the step of irradiating a laser beam, so that the first conductive layer and the second conductive layer made of resin are formed on the first conductive layer. The portion where the conductive layer and the second conductive layer are in contact with each other can be increased, and an electrical connection failure between the first conductive layer and the second conductive layer can be improved.

According to the present invention having the above-described configuration, reliability can be improved by making the electrical connection of the stacked body of the plurality of conductive layers more reliable. In addition, by using a substrate provided with an adhesive layer having different properties, a plurality of steps can be performed at the same time to improve productivity.

Embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details can be variously changed without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments below. Note that in the structures of the present invention described below, the same reference numerals are used in common in different drawings.

A semiconductor device of the present invention and a manufacturing method thereof will be described with reference to cross-sectional views of FIGS. 1 to 7 and top views of FIGS. 1A is FIG. 8A, FIG. 1B is FIG. 8B, FIG. 2B is FIG. 8C, FIG. 5A is FIG. FIGS. 5B and 9B are FIGS. 9B and 9C, FIGS. 6A and 10B are FIGS. 10A and 10B, and FIG. 6B is a top view of FIG. FIG.

First, the insulating layer 11 is formed over one surface of the substrate 10 (see FIG. 1A). Next, the peeling layer 12 is formed over the insulating layer 11. Subsequently, an insulating layer 13 is formed on the release layer 12.

The substrate 10 is a substrate having an insulating surface, for example, a glass substrate, a plastic substrate, a quartz substrate, or the like. Preferably, a glass substrate or a plastic substrate is used as the substrate 10. This is because it is easy to create a glass substrate and a plastic substrate having a side of 1 meter or more, and it is easy to create a desired shape such as a square shape. Then, for example, when a glass substrate or a plastic substrate having a square shape and one side of 1 meter or more is used, productivity can be significantly improved. Such an advantage is a great advantage as compared with the case of using a circular silicon substrate having a diameter of about 30 cm at the maximum.

The insulating layers 11 and 13 are formed of silicon oxide, silicon nitride, silicon oxide containing nitrogen, silicon nitride containing oxygen, or the like by vapor deposition (CVD), sputtering, or the like. . The insulating layer 11 serves to prevent the impurity element from the substrate 10 from entering the upper layer. However, the insulating layer 11 may not be formed if it is not necessary.

The release layer 12 is formed by sputtering or the like using tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), niobium (Nb), nickel (Ni), cobalt (Co), zirconium (Zr), An element selected from zinc (Zn), ruthenium (Ru), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir), silicon (Si) or the like, or an alloy material containing the element as a main component Alternatively, a layer containing a compound material is formed as a single layer or a stacked layer. Note that the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

When the separation layer 12 has a single-layer structure, preferably tungsten, molybdenum, a mixture of tungsten and molybdenum, tungsten oxide, tungsten oxynitride, tungsten nitride oxide, molybdenum oxide, molybdenum oxynitride Forming a layer containing any one of molybdenum nitride oxide, oxide of tungsten and molybdenum mixture, oxynitride of tungsten and molybdenum mixture, and nitride oxide of tungsten and molybdenum mixture.

In the case where the separation layer 12 has a stacked structure, it is preferable that a layer containing tungsten, molybdenum, or a mixture of tungsten and molybdenum be formed as the first layer, and a tungsten oxide, a molybdenum oxide, or tungsten be formed as the second layer. A layer containing an oxide of a mixture of molybdenum and molybdenum, an oxynitride of tungsten, an oxynitride of molybdenum, or an oxynitride of a mixture of tungsten and molybdenum is formed.

In the case of forming a stacked structure of tungsten and tungsten oxide as the peeling layer 12, first, a layer containing tungsten is formed as the peeling layer 12, and a layer containing silicon oxide is formed as the insulating layer 13 thereabove. By doing so, the fact that a layer containing tungsten oxide is formed between the layer containing tungsten and the layer containing silicon oxide may be utilized. The same applies to the case where a layer containing tungsten nitride, tungsten oxynitride, tungsten oxynitride, or the like is formed. After forming a layer containing tungsten, a layer containing silicon nitride on the upper layer, oxygen A silicon nitride layer containing nitrogen and a silicon oxide layer containing nitrogen are preferably formed.

Next, a plurality of transistors 14 are formed over the insulating layer 13. In this step, thin film transistors are formed as the plurality of transistors 14.

Each of the plurality of transistors 14 includes a semiconductor layer 50, a gate insulating layer (also referred to as an insulating layer) 51, and a conductive layer 52 that is a gate (also referred to as a gate electrode). The semiconductor layer 50 includes impurity regions 53 and 54 that function as a source or a drain, and a channel formation region 55. An impurity element imparting N-type (for example, phosphorus (P) or arsenic (As)) or an impurity element imparting P-type (for example, boron (B)) is added to the impurity regions 53 and 54. The impurity region 54 is an LDD (Lightly Doped Drain) region.

In each of the plurality of transistors 14, a gate insulating layer 51 is provided on the semiconductor layer 50, a top gate type in which a conductive layer 52 is provided on the gate insulating layer 51, and a gate insulating layer 51 is provided on the conductive layer 52. The bottom gate type in which the semiconductor layer 50 is provided on the gate insulating layer 51 may be used. Further, the one or more transistors selected from the plurality of transistors 14 may be multi-gate transistors having two or more gate electrodes and two or more channel formation regions.

Further, although only the plurality of transistors 14 are formed on the substrate 10, the present invention is not limited to this configuration. Elements provided on the substrate 10 are appropriately adjusted depending on the use of the semiconductor device. For example, in the case of having a function of transmitting and receiving data without contact, a plurality of transistors may be formed over the substrate 10 or a plurality of transistors and a conductive layer functioning as an antenna may be formed over the substrate 10. In the case of having a function of storing data, a plurality of transistors and memory elements (eg, transistors and memory transistors) may be formed over the substrate 10. In the case where the circuit has a function of controlling a circuit, a function of generating a signal, or the like (for example, a CPU or a signal generation circuit), a plurality of transistors may be formed over the substrate 10. In addition to the above, other elements such as a resistor (also referred to as a resistor) and a capacitor (also referred to as a capacitor) may be formed as needed.

Next, insulating layers 15 to 17 are formed over the plurality of transistors 14. The insulating layers 15 to 17 are formed using a silicon oxide, a silicon nitride, a polyimide, a vapor deposition method, a sputtering method, an SOG (spin on glass) method, a droplet discharge method (for example, an ink jet method), or the like. It is formed using acrylic, siloxane, oxazole resin, or the like. Siloxane has, for example, a skeleton structure formed of a bond of silicon and oxygen, and has an organic group containing at least hydrogen (eg, an alkyl group or aromatic hydrocarbon), a fluoro group, or an organic group containing at least hydrogen as a substituent. A fluoro group is used. The oxazole resin is, for example, photosensitive polybenzoxazole. Oxazole resin has a low relative dielectric constant (about 2.9) compared to a relative dielectric constant (about 3.2 to 3.4) of polyimide or the like, and thus can suppress the generation of parasitic capacitance of the semiconductor device. . Further, by suppressing the generation of parasitic capacitance, the semiconductor device can perform high-speed operation.

In the above configuration, three insulating layers (insulating layers 15 to 17) are formed over the plurality of transistors 14, but the present invention is not limited to this configuration. The number of insulating layers provided on the plurality of transistors 14 is not limited.

Next, openings are formed in the insulating layers 15 to 17, and conductive layers connected to the sources (also referred to as source regions and source electrodes) or drains (also referred to as drain regions and drain electrodes) of the plurality of transistors 14. 19 to 24 and conductive layers 18 and 25 are formed (see FIGS. 1A and 8A). The conductive layers 18 and 25 and the conductive layers 19 to 24 are provided in the same layer. The conductive layers 18 and 25 are terminals connected to the outside, and the conductive layers 19 to 24 are source wirings or drain wirings. The conductive layers 18 and 25 are electrically connected to the conductive layers 19 to 24. A signal supplied from the outside is supplied to the plurality of transistors 14 via the conductive layers 18 and 25 and the conductive layers 19 to 24.

The conductive layers 18 to 25 are elements selected from, for example, titanium, tungsten, chromium, aluminum, tantalum, nickel, zirconium, hafnium, vanadium, iridium, niobium, lead, platinum, molybdenum, cobalt, or rhodium by sputtering, Alternatively, an alloy material containing these elements as a main component or a compound material such as an oxide or nitride containing these elements as a main component is formed as a single layer or a stacked layer. Examples of the laminated structure of the conductive layers 18 to 25 include, for example, a three-layer structure of titanium, aluminum, and titanium, a five-layer structure of titanium, titanium nitride, aluminum, titanium, and titanium nitride, titanium, titanium nitride, and silicon added. And a five-layer structure of aluminum, titanium, and titanium nitride.

Next, conductive layers 26 and 27 are formed so as to be in contact with the conductive layers 18 and 25 (see FIGS. 1B and 8B). As the conductive layers 26 and 27, a layer containing gold, silver, or copper is formed by a screen printing method, a droplet discharge method, or the like. Preferably, a screen printing method may be used to form a paste containing silver fine particles (a material in which silver fine particles and a resin are mixed). This is because the screen printing method can reduce the production time and the apparatus is inexpensive. Moreover, it is because silver has a low resistance value.

Next, a laser beam capable of melting one or both of the conductive layers 26 and 27 and the conductive layers 18 and 25 is irradiated (see FIG. 2A). Before the laser beam irradiation, the conductive layer 18 and the conductive layer 26 and the conductive layer 25 and the conductive layer 27 were in partial contact. However, the conductive layer 18, the conductive layer 26, and the conductive layer 25 are irradiated by the laser beam irradiation. And the portion where the conductive layer 27 contacts can be increased. Therefore, the electrical connection between the conductive layer 18 and the conductive layer 26 and the conductive layer 25 and the conductive layer 27 can be made more reliable, and the reliability can be improved. Laser beams are classified into gas lasers, liquid lasers, and solid lasers according to the medium. Free lasers, semiconductor lasers, and X-ray lasers are classified according to oscillation characteristics. It may be used. However, a gas laser or a solid laser is preferably used, and a solid laser is more preferably used. In the present invention, either a continuous wave laser beam or a pulsed laser beam may be used.

Next, the insulating layer 28 is selectively formed over the insulating layer 17 and the conductive layers 19 to 24 (see FIGS. 2B and 8C). Openings 29 and 30 are provided in the insulating layer 28. The conductive layers 26 and 27 are exposed through the openings 29 and 30.

Note that the openings 29 and 30 are not in a shape that exposes the entire surface of the conductive layers 26 and 27 but in a shape that exposes a part of the surfaces of the conductive layers 26 and 27. Specifically, the openings 29 and 30 are preferably shaped so that the central portions of the conductive layers 26 and 27 are exposed. This is because in a later process, transposition is performed at an accurate position with a high yield. If the insulating layer 28 is provided so that the entire surface of the conductive layers 26 and 27 is exposed, a region where both the conductive layers 26 and 27 and the insulating layer 28 are not provided may occur. . In the subsequent transposition process, since the insulating layer 28 and the substrate 48 are bonded, if there is a region where one of the conductive layers 26 and 27 and the insulating layer 28 is not provided, the transposition cannot be performed accurately. There is a case. However, in the above process, the insulating layer 28 is selectively provided so that the central portions of the conductive layers 26 and 27 are exposed. Then, since there is no region where one of the conductive layers 26 and 27 and the insulating layer 28 is not provided, transposition can be performed accurately.

The insulating layer 28 is formed of an insulating resin such as an epoxy resin, an acrylic resin, and a polyimide resin with a thickness of 5 to 200 μm, preferably 15 to 35 μm. In addition, the insulating layer 28 is formed uniformly using a screen printing method, a droplet discharge method, or the like. Preferably, a screen printing method is used. This is because the screen printing method can reduce the production time and the apparatus is inexpensive. Next, heat treatment is performed as necessary.

Next, an opening 31 is formed so that at least a part of the peeling layer 12 is exposed (see FIGS. 3A and 8D). This step is preferably performed by laser beam irradiation because the processing time is short. The laser beam is applied to the substrate 10, the insulating layer 11, the release layer 12, and the insulating layers 13, 15 to 17 and 28. Further, the laser beam is irradiated from the surface of the insulating layer 28. The opening 29 is formed so that at least a part of the release layer 12 is exposed. Therefore, an opening 29 is provided at least in the insulating layers 13, 15 to 17 and 28. In the illustrated configuration, the laser beam reaches the insulating layer 11, and the insulating layers 11, 13, 15-17, and 28 are divided. The laser beam may be divided up to the substrate 10.

Ablation processing is used in the step of irradiating the laser beam. Ablation processing is processing using a phenomenon in which a molecular bond of a portion irradiated with a laser beam, that is, a portion absorbing a laser beam is cut, photodecomposed and vaporized. In other words, the opening 31 is formed by irradiating a laser beam to break molecular bonds at certain portions of the insulating layer 11, the peeling layer 12, the insulating layers 13, 15 to 17, 28, photodecompose, and vaporize. is doing.

The laser may be a solid-state laser having a wavelength of 150 to 380 nm in the ultraviolet region. Preferably, an Nd: YVO ₄ laser with a wavelength of 150 to 380 nm may be used. The reason is that the Nd: YVO ₄ laser having a wavelength of 150 to 380 nm is more easily absorbed by the substrate than other high wavelength lasers and can be ablated. Moreover, it is because the workability is good without affecting the periphery of the processed part.

Next, a substrate 48 is provided over the insulating layer 28 (see FIG. 3B). The substrate 48 is a substrate in which the insulating layer 32 and the adhesive layer 43 are stacked, and is a heat-peelable substrate. The adhesive layer 43 is a layer whose adhesive strength is reduced by heat treatment, for example, a layer made of a material that utilizes softening during heating of a thermoplastic adhesive, a material mixed with microcapsules or a foaming agent that expands by heating. A layer made of a material obtained by imparting heat melting property or heat decomposability to a thermosetting resin, or a layer using deterioration of interface strength due to water intrusion and accompanying expansion of the water absorbent resin.

Next, the stacked body including the plurality of transistors 14 is separated from the substrate 10 using the substrate 48 (see FIG. 4A). Separation of the stacked body including the plurality of transistors 14 from the substrate 10 is performed inside the separation layer 12 or with the separation layer 12 and the insulating layer 13 as a boundary. In the configuration shown in the figure, the separation is performed using the interface between the peeling layer 12 and the insulating layer 13 as a boundary. Thus, by using the substrate 48, the separation process can be performed easily and in a short time.

Next, heat treatment is performed to provide a substrate 49 on the surface of the insulating layer 13 and separate the stacked body including the plurality of transistors 14 from the substrate 48 (see FIG. 4B). The substrate 49 is a substrate in which the insulating layer 33 and the adhesive layer 44 are laminated. The adhesive layer 44 is a layer whose adhesive force is increased by heat treatment, and corresponds to a layer containing a thermoplastic resin. The thermoplastic resin corresponds to, for example, polyethylene, polystyrene, polypropylene, polyvinyl chloride, or the like.

As described above, since the substrate 48 is a heat-peeling substrate, the adhesive force between the substrate 48 and the insulating layer 28 is reduced by heat treatment, and the stacked body including the plurality of transistors 14 is separated from the substrate 48. Is done. At the same time, the thermoplastic resin on the surface of the substrate 49 is cured by the heat treatment, and the adhesive force between the insulating layer 13 and one surface of the substrate 49 is increased. Thus, by using the two substrates 48 and 49 provided with the adhesive layers having different properties, the step of separating the laminate from the substrate 48 and the step of providing the laminate on the substrate 49 are performed simultaneously. Can do. Accordingly, the manufacturing time can be shortened.

Next, if necessary, the conductive layers 26 and 27 are again irradiated with a laser beam. This is because the electrical connection between the conductive layer 18 and the conductive layer 26 and between the conductive layer 25 and the conductive layer 27 may be defective due to the influence of the above-described separation process, in order to improve such a defect. It is. Therefore, if not necessary, the step of irradiating the laser beam may not be performed.

Next, conductive layers 34 and 35 are formed so as to be in contact with the conductive layers 26 and 27 (see FIGS. 5A and 9A). As the conductive layers 34 and 35, a layer containing gold, silver, or copper is formed using a screen printing method, a droplet discharge method, or the like. Preferably, a screen printing method is used to form a paste containing silver fine particles (a material in which silver fine particles and a resin are mixed). This is because the screen printing method can reduce the production time and the apparatus is inexpensive. Moreover, it is because silver has a low resistance value. Next, heat treatment is performed as necessary.

Next, the substrate 49 and the insulating layers 13, 15 to 17, and 28 are irradiated with a laser beam to form openings 36 (see FIGS. 5B, 9 B, and 9 C).

Next, a substrate 37 provided with an antenna (a conductive layer functioning as an antenna) 45 and a capacitor 46 is prepared (see FIGS. 6A and 10A). Each of the antenna 45 and the capacitor 46 is formed using a screen printing method, a droplet discharge method, or the like. FIG. 6A illustrates conductive layers 38 and 39 that are part of the antenna 45. The anisotropic conductive layer 40 is a material in which a conductive filler is provided in an adhesive, and is also referred to as ACP (Anisotropic Conductive Paste). The anisotropic conductive layer 40 is uniformly formed using a screen printing method, a droplet discharge method, or the like.

Next, the substrate 49 and the substrate 37 are attached to each other using the anisotropic conductive layer 40 (see FIGS. 6B and 10B). Next, if necessary, the insulating layer 28 and the anisotropic conductive layer 40 are bonded. At this time, one or both of the pressure treatment and the heat treatment are performed by a flip chip bonder, a die bonder, an ACF bonding machine, a crimping machine, or the like.

Note that the conductive layer 35 and the conductive layer 39 may be in direct contact (see FIG. 6B). An anisotropic conductive layer 40 may be provided between the conductive layer 35 and the conductive layer 39.

Note that a substrate may be further provided over the surface of the stacked body including the plurality of transistors 14 (see FIG. 7). Specifically, a substrate may be newly provided on one or both surfaces of the substrate 49 and the substrate 37. In the illustrated configuration, the substrate 41 is provided on the surface of the substrate 49, and the substrate 42 is provided on the surface of the substrate 37. By providing the substrates 41 and 42, the strength can be further improved. Sealing of the stacked body including the plurality of transistors 14 by the substrates 41 and 42 is performed by melting a surface layer of each of the substrates 41 and 42 or an adhesive layer of each surface of the substrates 41 and 42 by heat treatment. . Moreover, a pressurizing process is also performed as needed.

In the above embodiment mode, the stacked body including the plurality of transistors 14 is separated from the substrate 10 (see FIG. 4A); however, the present invention is not limited to this mode. After forming the conductive layers 18 to 25 (see FIG. 1A), the substrate 10 may be thinned.

In order to reduce the thickness of the substrate 10, the other surface of the substrate 10 is ground using a grinding device (for example, a grinding machine). Preferably, grinding is performed until the thickness of the substrate 10 becomes 100 μm or less. Next, the other surface of the ground substrate 10 is polished using a polishing apparatus (for example, a polishing pad, polishing abrasive grains (for example, cerium oxide)). Preferably, polishing is performed until the thickness of the substrate 10 is 50 μm or less, preferably 20 μm or less, more preferably 5 μm or less. In order to reduce the thickness of the substrate 10, one or both of grinding and polishing of the substrate 10 may be performed. Moreover, before performing a grinding process and a grinding | polishing process, it is good to provide the layer for the purpose of protection on the conductive layers 18-25 as needed. In addition, after the grinding process and the polishing process, one or both of a cleaning process and a drying process for removing dust may be performed as necessary.

The thickness of the thinned substrate 10 is appropriately determined in consideration of the time required for the grinding process and the polishing process, the time required for the subsequent cutting process, the use of the semiconductor device, the strength required for the use of the semiconductor device, and the like. Good. For example, when improving the productivity by shortening the time of the grinding process and the polishing process, the thickness of the substrate 10 after polishing is preferably about 50 μm. In the case where the time required for the subsequent cutting step is shortened to improve productivity, the thickness of the substrate 10 after polishing is preferably 20 μm or less, more preferably 5 μm or less. Further, when the semiconductor device is attached to a thin article or embedded, the thickness of the substrate 10 after polishing is preferably 20 μm or less, more preferably 5 μm or less. Further, the lower limit of the thickness of the thinned substrate 10 is not particularly limited. The substrate 10 may be thinned until the substrate 10 is removed (until the thickness of the substrate 10 becomes 0 μm).

Next, conductive layers 26 and 27 are formed so as to be in contact with the conductive layers 18 and 25 (see FIG. 1B). Next, the conductive layers 26 and 27 are irradiated with a laser beam (see FIG. 2A). Next, the insulating layer 28 is selectively formed (see FIG. 2B). Next, a laser beam is irradiated to form the opening 31 (see FIG. 3A). In the illustrated configuration, the substrate 10 is not cut when the opening 31 is formed. However, when the substrate 10 is thinned, the substrate 10 may be cut. Then, the step of separating the stacked body including the plurality of transistors 14 from the substrate 10 may be omitted. Subsequent steps are similar to those described above (see FIGS. 3B, 4, 5, and 6). If the thinned substrate 10 is left without separating the stacked body including the plurality of transistors 14 from the substrate 10, entry of harmful gas, water, and impurity elements can be suppressed. Therefore, deterioration and destruction can be suppressed and reliability can be improved. Further, the barrier property can be improved.

The structure of the semiconductor device of the present invention will be described with reference to FIG. The semiconductor device 100 of the present invention includes an arithmetic processing circuit 101, a memory circuit 103, an antenna 104, a power supply circuit 109, a demodulation circuit 110, and a modulation circuit 111.

The arithmetic processing circuit 101 performs instruction analysis, control of the storage circuit 103, output of data to be transmitted to the modulation circuit 111, and the like based on a signal input from the demodulation circuit 110.

The memory circuit 103 includes a circuit including a memory element and a control circuit that controls data writing and data reading. The memory circuit 103 stores at least an identification number of the semiconductor device itself. The identification number is used to distinguish from other semiconductor devices. The memory circuit 103 includes an organic memory, a DRAM (Dynamic Random Access Memory), a SRAM (Static Random Access Memory), a FeRAM (Ferroelectric Random Access Memory), a mask ROM (Read Only Memory ROM). One or a plurality of types selected from Electrically Programmable Read Only Memory (EEPROM), EEPROM (Electrically Erasable Programmable Read Only Memory), and flash memory. An organic memory is a memory having a structure in which a layer containing an organic compound is sandwiched between a pair of conductive layers. Since the organic memory has a simple structure, the manufacturing process can be simplified and the cost can be reduced. Further, since the structure is simple, the area of the stacked body can be easily reduced, and high integration can be easily realized. Moreover, it is non-volatile and does not need to contain a battery. Therefore, it is preferable to use an organic memory as the memory circuit 103.

The antenna 104 converts the carrier wave supplied from the reader / writer 112 into an AC electrical signal. The antenna 104 is subjected to load modulation by the modulation circuit 111. The power supply circuit 109 generates a power supply voltage using the AC electrical signal converted by the antenna 104 and supplies the power supply voltage to each circuit.

The demodulation circuit 110 demodulates the AC electrical signal converted by the antenna 104 and supplies the demodulated signal to the arithmetic processing circuit 101. The modulation circuit 111 applies load modulation to the antenna 104 based on the signal supplied from the arithmetic processing circuit 101.

The reader / writer 112 receives the load modulation applied to the antenna 104 as a carrier wave. Further, the reader / writer 112 transmits a carrier wave to the semiconductor device 100. The carrier wave is an electromagnetic wave emitted from the reader / writer 112.

By using the transistor included in the semiconductor device of the present invention to form the above circuit, a function of transmitting and receiving data without contact can be provided.

The semiconductor device 125 of the present invention can be used for various articles and various systems by utilizing a function of transmitting and receiving data without contact. Articles include, for example, keys (see FIG. 12A), banknotes, coins, securities, bearer bonds, certificates (driver's license, resident's card, etc.), books, containers (pets, etc.) 12 (B)), accessories (such as bags and glasses, see FIG. 12 (C)), packaging containers (wrapping paper, bottles, etc., see FIG. 12 (D)), recording media (discs, video tapes, etc.) Vehicles (bicycles, etc.), foods, clothing, daily necessities, electronic devices (liquid crystal display devices, EL display devices, television devices, portable terminals, etc.). The semiconductor device of the present invention is fixed by being attached or embedded on the surface of an article having various shapes as described above.

The system is a distribution / inventory management system, an authentication system, a distribution system, a production history system, a book management system, and the like. By utilizing the functions of the semiconductor device of the present invention, the system is highly functional and multifunctional. And high added value. For example, a semiconductor device of the present invention is provided inside an identification card, and a reader / writer 121 is provided at the entrance of a building or the like (see FIG. 12E). The reader / writer 121 reads an authentication number in an identification card owned by each person and supplies information related to the read authentication number to the computer 122. Based on the information supplied from the reader / writer 121, the computer 122 determines whether to permit entry or exit from the room. As described above, by utilizing the function of the semiconductor device of the present invention, it is possible to provide an entrance / exit management system that improves user convenience and realizes high added value.

An example of a substrate provided with a conductive layer used in the semiconductor device of the present invention will be described. Examples of the substrate provided with the conductive layer include the following two. The conductive layer functions as an antenna or connection wiring.

One is that a conductive layer is provided on a substrate. The conductive layer is made of copper, silver, gold, aluminum, titanium, or the like. The exposed portion of the conductive layer is plated with gold or the like to prevent oxidation.

The other is that a conductive layer is provided over a substrate and a protective layer is provided over the conductive layer. The protective layer includes an insulating resin, and the insulating resin is, for example, an epoxy resin, a silicon resin, or a synthetic rubber resin. The protective layer has an opening at a desired location, and the conductive layer is exposed through the opening.

Note that when the conductive layer 221 over the substrate 220 functions as an antenna, the shape of the conductive layer 221 is not limited (see FIGS. 16A to 16D). For example, linear (dipole antenna, etc., see FIG. 16A), rectangular parallelepiped (patch antenna, etc., see FIG. 16B), ring (loop antenna, spiral antenna, etc., see FIG. 16C) ), Ribbon shape (see FIG. 16D), and the like. Then, when a stacked body 222 including a plurality of transistors is attached to the substrate 220 over which the conductive layer 221 is provided, a semiconductor device capable of transmitting and receiving data without contact is completed.

Further, the material for forming the conductive layer is not particularly limited. For example, gold, silver, copper, or the like may be used as the material, and silver having a low resistance value may be used. There is no particular limitation on the manufacturing method, and a sputtering method, a screen printing method, a droplet discharge method, or the like is preferably used.

Note that when the antenna is directly attached to the surface of the metal film, an eddy current is generated in the metal film by the magnetic flux passing through the surface of the metal film. Such an eddy current is generated in the opposite direction to the magnetic field of the reader / writer. Therefore, it is preferable to prevent the generation of eddy current by sandwiching a ferrite or metal thin film sheet having high magnetic permeability and low high-frequency loss between the antenna and the conductive layer.

In the semiconductor device of the present invention, it is preferable to use an antistatic substrate capable of suppressing the generation of electric charges in order to suppress the influence of static electricity. An antistatic substrate will be described with reference to FIG. In the following description, the antistatic substrate is roughly divided into five.

The first is a substrate in which an insulating layer 251 and a layer 252 containing a conductive material are provided over the insulating layer 251 (see FIG. 17A). As the layer 252 containing a conductive material, a layer containing a metal such as aluminum, gold, zinc, or indium tin oxide is formed by a plating method, an evaporation method, a sputtering method, or the like. Alternatively, a layer including a conductive paint is formed as the layer 252 including a conductive material. The conductive paint is a material in which fine powder of a conductive material (carbon black, silver particles, etc.) is mixed in the paint.

The second is a substrate in which an insulating layer 253 is provided and a hydrophilic layer 254 is provided on the surface of the insulating layer 253 (see FIG. 17B). In order to make it hydrophilic, treatment with acid and surface treatment with plasma are used. The third is a substrate including an insulating layer 255 mixed with a conductive material (see FIG. 17C). As the conductive material, metal powder, carbon black, carbon fiber, or the like is used.

As in the above three substrates, the electric charge charged on the substrate is discharged and one end thereof is grounded, whereby the electric charge can be easily removed. Therefore, the influence of static electricity can be suppressed.

The fourth is a substrate in which an insulating layer 256 and a layer 257 containing an antistatic agent are provided over the insulating layer 256 (see FIG. 17D). The fifth is a substrate including an insulating layer 258 mixed with an antistatic agent (see FIG. 17E). Antistatic agents are classified into anionic antistatic agents, cationic antistatic agents, amphoteric antistatic agents, and nonionic antistatic agents. Anionic antistatic agents include alkyl sulfonates, cationic antistatic agents include tetraalkylammonium salts, amphoteric antistatic agents include alkylbetaines, and nonionic antistatic agents. Examples include glycerin fatty acid esters.

By using an antistatic agent like the above two substrates, leakage of charges charged on the substrate can be promoted. Therefore, the influence of static electricity can be suppressed.

For the insulating layers 251, 253, 256, silicone, polyethylene, polypropylene, polystyrene, AS resin, ABS resin (resin in which three of acrylonitrile, butadiene and styrene are polymerized), acrylic resin, polyvinyl chloride, polyacetal, polyamide, polycarbonate , Modified polyphenylene ether, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate, polysulfone, polyethersulfone, polyphenylene sulfide, polyamideimide, polymethylpentene, phenol resin, urea resin, melamine resin, epoxy resin, diallyl phthalate resin, It is formed using a saturated polyester resin, polyimide, polyurethane or the like.

In addition, the substrate (also referred to as a base, a film, or a tape) is preferably flexible. An adhesive layer may be provided on the surface of the substrate. The adhesive layer is a layer containing an adhesive. The surface of the substrate may be coated with silicon dioxide (silica). The coating can maintain waterproofness even in a high temperature and high humidity environment. The surface may be coated with a material containing carbon as a main component (for example, diamond-like carbon). The strength is increased by the coating, and deterioration and destruction of the stacked body including the plurality of transistors 14 can be suppressed.

The semiconductor device of the present invention has a plurality of transistors. Each of the plurality of transistors includes a semiconductor layer, a gate insulating layer, and a gate electrode. An example of a method for manufacturing a semiconductor layer included in each of the plurality of transistors is described below.

First, an amorphous semiconductor layer is formed by sputtering, LPCVD, plasma CVD, or the like. Next, laser crystallization, RTA (Rapid Thermal Anneal), thermal crystallization using a furnace annealing furnace, thermal crystallization using a metal element that promotes crystallization, heat using a metal element that promotes crystallization The amorphous semiconductor layer is crystallized by using a combination of a crystallization method and a laser crystallization method, and a crystallized semiconductor layer is formed. Next, the crystallized semiconductor layer is processed into a desired shape.

Note that among the above manufacturing methods, a method in which a crystallization method accompanied by heat treatment and a crystallization method in which a continuous wave laser or a laser beam oscillated at a frequency of 10 MHz or higher is irradiated is preferably used. By irradiation with a continuous wave laser or a laser beam oscillated at a frequency of 10 MHz or higher, the surface of the crystallized semiconductor layer can be flattened. By planarizing the surface of the crystallized semiconductor layer, the gate insulating layer above the semiconductor layer can be thinned, and the breakdown voltage of the gate insulating layer can be improved.

Of the above manufacturing methods, a continuous wave laser or a laser beam that oscillates at a frequency of 10 MHz or higher is preferably used. A semiconductor layer which is crystallized by scanning in one direction while irradiating a continuous wave laser or a laser beam oscillating at a frequency of 10 MHz or more has a characteristic that crystals grow in the scanning direction of the beam. By arranging the transistor in accordance with the scanning direction in the channel length direction (the direction in which carriers flow when the channel formation region is formed) and adopting the following method as a method for forming the gate insulating layer, A transistor with small variation and high field-effect mobility can be obtained.

Next, an example of a method for manufacturing a gate insulating layer included in each of the plurality of transistors is described. The gate insulating layer is preferably formed by oxidizing or nitriding the surface of the semiconductor layer by performing plasma treatment. For example, the plasma treatment is performed by introducing a rare gas (He, Ar, Kr, Xe, or the like) and a mixed gas (oxygen, nitrogen oxide, ammonia, nitrogen, hydrogen, or the like). When excitation of plasma in this case is performed by introducing microwaves, high-density plasma can be generated at a low electron temperature. By oxidizing or nitriding the surface of the semiconductor layer with oxygen radicals (which may include OH radicals) or nitrogen radicals (which may also include NH radicals) generated by such high-density plasma, 5 to 10 nm. The insulating layer is formed on the semiconductor layer. This insulating layer having a thickness of 5 to 10 nm is preferably used as the gate insulating layer.

Note that the reaction by the treatment using the high-density plasma in this case is a solid-phase reaction, and thus the interface state density between the gate insulating layer and the semiconductor layer can be extremely low. Such a high-density plasma treatment directly oxidizes (or nitrides) a semiconductor layer (crystalline silicon or polycrystalline silicon), so that variation in thickness of the formed gate insulating layer can be extremely reduced. In addition, since it is not strongly oxidized even at the crystal grain boundary of crystalline silicon, a very preferable state is obtained. That is, by performing solid-phase oxidation of the surface of the semiconductor layer by the high-density plasma treatment shown here, the gate insulating layer has good uniformity and low interface state density without causing an abnormal oxidation reaction at the grain boundary. Can be formed.

Note that as the gate insulating layer included in the transistor, only an insulating layer formed by high-density plasma treatment may be used, or in addition to an insulating layer formed by high-density plasma treatment, CVD using plasma or thermal reaction is used. Alternatively, an insulating layer such as silicon oxide, silicon oxynitride, or silicon nitride may be stacked by a method. In any case, a transistor including an insulating layer formed by high-density plasma as part or all of a gate insulating layer can reduce variation in characteristics.

In some cases, a semiconductor layer and a gate insulating layer included in the transistor and other insulating layers are formed by plasma treatment. Such plasma treatment is preferably performed at an electron density of 1 × 10 ¹¹ cm ⁻³ or more and an electron temperature of plasma of 1.5 eV or less. More specifically, it is preferable that the electron density is 1 × 10 ¹¹ cm ⁻³ or more and 1 × 10 ¹³ cm ⁻³ or less and the plasma electron temperature is 0.5 eV or more and 1.5 eV or less.

When the electron density of plasma is high and the electron temperature in the vicinity of an object to be processed (for example, a semiconductor layer included in a transistor, a gate insulating layer, or the like) is low, damage to the object to be processed can be prevented. In addition, since the electron density of plasma is as high as 1 × 10 ¹¹ cm ⁻³ or higher, an oxide or nitride formed by oxidizing or nitriding an object to be processed using plasma treatment is a CVD method. Compared with a thin film formed by sputtering or the like, the film thickness is excellent in uniformity and a dense film can be formed. In addition, since the electron temperature of plasma is as low as 1.5 eV or less, oxidation or nitridation treatment can be performed at a lower temperature than conventional plasma treatment or thermal oxidation. For example, even when plasma treatment is performed at a temperature lower than 100 degrees below the strain point of a glass substrate, an oxide or nitride can be formed by sufficiently oxidizing or nitriding the object to be processed.

The experiment and the result of examining the difference in resistance value before and after irradiating the laminated conductive layer with the laser beam, and the cross-sectional structure after irradiating the laminated conductive layer with the laser beam Description will be made with reference to 13 to 15.

In the experiment, two samples, sample A and sample B, were prepared. Sample A was formed by stacking a first conductive layer 222, a second conductive layer 223, a third conductive layer 224, a fourth conductive layer 225, and a fifth conductive layer 226 over a substrate 221. In addition, sixth conductive layers 227 and 228 were formed over the fifth conductive layer 226 (see a schematic cross-sectional view of the sample A in FIG. 13A).

In the sample B, similarly to the sample A, the first conductive layer 222, the second conductive layer 223, the third conductive layer 224, the fourth conductive layer 225, and the fifth conductive layer 226 are stacked over the substrate 221. Formed. In addition, two sixth conductive layers were formed over the fifth conductive layer 226, and then the surface of the sixth conductive layer was irradiated with an Nd: YVO ₄ laser having a wavelength of 266 nm. As a result, sixth conductive layers 229 and 230 irradiated with the laser beam were formed (see the schematic diagram of the cross section of the sample B in FIG. 13B).

Note that the first conductive layer 222 is a layer containing titanium, the second conductive layer 223 is a layer containing titanium nitride, the third conductive layer 224 is a layer containing aluminum, and the fourth conductive layer. 225 is a layer containing titanium, and the fifth conductive layer 226 is a layer containing titanium nitride. The sixth conductive layers 227, 228, 229, and 230 were layers containing silver paste. The silver paste contained epoxy resin and silver fine particles.

Next, the resistance value between the sixth conductive layers 227 and 228 of Sample A and the resistance value between the sixth conductive layers 229 and 230 of Sample B were measured. As a result, the resistance value of Sample A was 4.00Ω, and the resistance value of Sample B was 0.14Ω. From this result, it was found that the resistance value was lowered by irradiating the laser beam.

Next, sample C was prepared. Sample C was formed by stacking a first conductive layer 202, a second conductive layer 203, a third conductive layer 204, a fourth conductive layer 205, and a fifth conductive layer 206 over a substrate 201. In addition, a sixth conductive layer 207 was formed over the fifth conductive layer 206 (see schematic views of the cross section and the top surface of the sample C in FIGS. 14A and 14B). The first conductive layer 202 is a layer containing titanium, the second conductive layer 203 is a layer containing titanium nitride, the third conductive layer 204 is a layer containing aluminum, and the fourth conductive layer 205 is The fifth conductive layer 206 was a layer containing titanium nitride, and the sixth conductive layer 207 was a layer containing silver paste.

Next, the sixth conductive layer 207 was irradiated with an Nd: YVO ₄ laser having a wavelength of 266 nm (a schematic view of a cross section and an upper surface of the sample C in FIGS. 14C and 14D, FIGS. 15A and 15B). )reference). 14C and 15B, a region 211 is a region irradiated with a laser beam, and a region 213 is a region not irradiated with a laser beam.

FIG. 15A is a FIB (Focused Ion Beam System) image of the area 210 in FIG. 14C. FIG. 15B is a schematic diagram of FIG. 15A. In FIG. 15B, the conductive layer 212 corresponds to a stacked body of the first conductive layer 202 to the fifth conductive layer 206. As a result of observing the cross section of the sample C, the portion 208 where the fifth conductive layer 206 and the sixth conductive layer 207 are in contact with each other was increased by the laser beam irradiation. In addition, by irradiation with the laser beam, part of the third conductive layer 204, part of the fourth conductive layer 205, and part of the fifth conductive layer 206 are melted, and the third conductive layer 204 and the sixth conductive layer 206 are melted. A portion 209 in contact with the conductive layer 207 was formed. In this manner, by irradiating the laser beam, the portion where the stacked body of the first conductive layer 202 to the fifth conductive layer 206 and the sixth conductive layer 207 are in contact with each other can be increased. Therefore, the resistance value between the stacked body of the first conductive layer 202 to the fifth conductive layer 206 and the sixth conductive layer 207 can be reduced.

4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. 4A and 4B illustrate a semiconductor device and a manufacturing method thereof according to the present invention. FIG. 11 illustrates a semiconductor device of the present invention. FIG. 11 illustrates a semiconductor device of the present invention. The figure which shows an experiment and its result. The figure which shows an experiment and its result. The figure which shows an experiment and its result. FIG. 11 illustrates a semiconductor device of the present invention. The figure which shows the board | substrate of an antistatic type.

Claims (10)

Forming a first conductive layer on the substrate;
Forming a second conductive layer containing conductive particles of gold, silver or copper and a resin so as to be in contact with the first conductive layer;
A method for manufacturing a semiconductor device, comprising: irradiating the second conductive layer with a laser beam to increase an area where the first conductive layer and the second conductive layer are in contact with each other. Forming transistors on the substrate,
Forming an insulating layer on the transistor;
Forming a first conductive layer connected to a source or a drain of the transistor through an opening provided in the insulating layer;
Forming a second conductive layer containing conductive particles of gold, silver or copper and a resin so as to be in contact with the first conductive layer;
A method for manufacturing a semiconductor device, comprising: irradiating the second conductive layer with a laser beam to increase an area where the first conductive layer and the second conductive layer are in contact with each other. Forming a release layer on the substrate,
Forming a first insulating layer on the release layer;
Forming a transistor on the first insulating layer;
Forming a second insulating layer on the transistor;
Forming a first conductive layer connected to a source or a drain of the transistor through an opening provided in the second insulating layer;
Forming a second conductive layer containing conductive particles of gold, silver or copper and a resin so as to be in contact with the first conductive layer;
Irradiating the second conductive layer with a laser beam to increase the contact area between the first conductive layer and the second conductive layer;
A third insulating layer is selectively formed on the second insulating layer and the second conductive layer so that a part of the second conductive layer is exposed;
Irradiating the second insulating layer and the third insulating layer with a laser beam to form an opening that exposes the release layer;
In the semiconductor device, the stacked body including the first insulating layer and the transistor is separated from the substrate with the inside of the peeling layer or the interface between the peeling layer and the first insulating layer as a boundary. Manufacturing method. Forming a release layer on the first substrate;
Forming a first insulating layer on the release layer;
Forming a transistor on the first insulating layer;
Forming a second insulating layer on the transistor;
Forming a first conductive layer connected to a source or a drain of the transistor through an opening provided in the second insulating layer;
Forming a second conductive layer containing conductive particles of gold, silver or copper and a resin so as to be in contact with the first conductive layer;
Irradiating the second conductive layer with a laser beam to increase the contact area between the first conductive layer and the second conductive layer;
A third insulating layer is selectively formed on the second insulating layer and the second conductive layer so that a part of the second conductive layer is exposed;
Irradiating the second insulating layer and the third insulating layer with a laser beam to form an opening that exposes the release layer;
Using the second substrate provided on the surface of the third insulating layer, the inside of the release layer or the interface between the release layer and the first insulating layer as a boundary from the first substrate, the first substrate Separating the insulating layer and the stacked body including the transistor;
Providing a third substrate on the surface of the first insulating layer and separating the second substrate from the surface of the second insulating layer;
Forming a third conductive layer connected to the second conductive layer through an opening provided in the third insulating layer;
The fourth substrate is provided on the third insulating layer so that the third conductive layer is electrically connected to the fourth conductive layer on the fourth substrate. A method for manufacturing a semiconductor device. In any one of Claims 1 thru | or 4,
A layer containing titanium, tungsten, chromium, aluminum, tantalum, nickel, zirconium, hafnium, vanadium, iridium, niobium, lead, platinum, molybdenum, cobalt, or rhodium is formed as the first conductive layer. A method for manufacturing a semiconductor device. In any one of Claims 1 thru | or 4,
The method for manufacturing a semiconductor device, wherein the first conductive layer is formed by a sputtering method. In any one of Claims 1 thru | or 4,
The method for manufacturing a semiconductor device, wherein the second conductive layer is formed by a screen printing method. In any one of Claims 1 thru | or 3,
The method for manufacturing a semiconductor device, wherein the substrate is a glass substrate. In claim 4,
The method for manufacturing a semiconductor device, wherein the first substrate is a glass substrate. In claim 3 or claim 4,
A method for manufacturing a semiconductor device, wherein a layer containing tungsten is formed as the separation layer.