JP2007073880A5 - - Google Patents
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- Publication number
- JP2007073880A5 JP2007073880A5 JP2005262122A JP2005262122A JP2007073880A5 JP 2007073880 A5 JP2007073880 A5 JP 2007073880A5 JP 2005262122 A JP2005262122 A JP 2005262122A JP 2005262122 A JP2005262122 A JP 2005262122A JP 2007073880 A5 JP2007073880 A5 JP 2007073880A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid storage
- pressure
- processing chamber
- storage means
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000007788 liquid Substances 0.000 claims 12
- 238000001514 detection method Methods 0.000 claims 8
- 239000000463 material Substances 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 238000007599 discharging Methods 0.000 claims 3
Claims (2)
前記排気ラインに設けられた差圧検出手段で前記処理室の圧力を外気との差圧で検出する検出値に基づき、前記貯液手段と外部とが連通する状態となる様に前記貯液手段を制御し、前記貯液手段に貯溜された前記処理ガス中の液化物を前記外部へ排出する工程とを有する半導体の製造方法。The liquid storage means is arranged so that the liquid storage means communicates with the outside based on a detection value detected by the differential pressure detection means provided in the exhaust line with the pressure difference between the processing chamber and the outside air. And a step of discharging the liquefied material in the processing gas stored in the liquid storage means to the outside.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005262122A JP4813854B2 (en) | 2005-09-09 | 2005-09-09 | Substrate processing apparatus and semiconductor manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005262122A JP4813854B2 (en) | 2005-09-09 | 2005-09-09 | Substrate processing apparatus and semiconductor manufacturing method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007073880A JP2007073880A (en) | 2007-03-22 |
JP2007073880A5 true JP2007073880A5 (en) | 2008-10-16 |
JP4813854B2 JP4813854B2 (en) | 2011-11-09 |
Family
ID=37935045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005262122A Active JP4813854B2 (en) | 2005-09-09 | 2005-09-09 | Substrate processing apparatus and semiconductor manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4813854B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100883768B1 (en) * | 2008-08-22 | 2009-02-18 | 주식회사 미래보 | Apparatus for protecting over-flow of reactive gas into liquid collector in manufacturing process of semi-conductors |
JP6342370B2 (en) * | 2015-09-07 | 2018-06-13 | 株式会社東芝 | Semiconductor manufacturing apparatus and removal apparatus for semiconductor manufacturing apparatus |
JP7175782B2 (en) * | 2019-01-25 | 2022-11-21 | 株式会社東芝 | Silicon-containing material forming device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3592923B2 (en) * | 1998-02-13 | 2004-11-24 | 東京エレクトロン株式会社 | Exhaust device |
JP3396431B2 (en) * | 1998-08-10 | 2003-04-14 | 東京エレクトロン株式会社 | Oxidation treatment method and oxidation treatment device |
JP3543949B2 (en) * | 1999-11-09 | 2004-07-21 | 東京エレクトロン株式会社 | Heat treatment equipment |
JP3554847B2 (en) * | 2001-07-30 | 2004-08-18 | 東京エレクトロン株式会社 | Heat treatment equipment |
JP2003318172A (en) * | 2002-04-19 | 2003-11-07 | Tokyo Electron Ltd | Film forming method, deducing method for film forming and processing time correction expression, film forming device, and program |
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2005
- 2005-09-09 JP JP2005262122A patent/JP4813854B2/en active Active
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