JP2007070374A - High-frequency component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a high-frequency component that has excellent water resistance and dielectric characteristic and is simply produced. <P>SOLUTION: The high-frequency component 2 contains a fluorine-based inorganic compound in a matrix resin. The high-frequency component is useful as electronic components such as antenna component, relay component, connector component, etc. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component. More specifically, the present invention relates to an electronic component having excellent water resistance suitable for high frequency applications (particularly in the millimeter wave region).

  Conventionally, as a resin composition for electronic components suitable for high-frequency applications, a material having a low dielectric constant and dielectric loss and a small change in dielectric constant and dielectric loss with respect to environmental changes such as temperature and humidity is required. .

  For example, a printed circuit board using a polytetrafluoroethylene porous body as an insulating base material is disclosed. However, fluororesins such as polytetrafluoroethylene are poor in productivity, are expensive, and have poor adhesion. There was a problem in joining the conductor plates (Patent Document 1).

It is known that an inorganic substance is generally blended as a filler in a resin composition to reduce the amount of resin used or improve mechanical properties.
For example, a resin composition for molding an antenna substrate material for a high-frequency communication device containing a fibrous inorganic filler having specific dimensions and dielectric properties is disclosed. However, since the obtained molded product has low water resistance, However, there is a problem in that the dielectric loss increases and the dielectric loss increases (Patent Document 2).

  In addition, for example, a highly water-resistant resin molded product containing glass fiber powder subjected to a specific surface treatment is disclosed, but the manufacturing process is complicated because the manufacturing process is increased for imparting water resistance (patent) Reference 3).

On the other hand, a technology for improving thermal conductivity by compounding calcium fluoride into polyphenylene sulfide resin in a composite material and a circuit board (Patent Document 4), and a lubricating fine particle containing calcium fluoride in a thermoplastic resin in a thermoplastic film There has been reported a technique (Patent Document 5) for improving the scratch resistance of a resin film by containing.
Japanese Patent Publication No. 6-80875 Japanese Patent No. 2873541 JP 11-228170 A JP 2002-188007 A JP 7-216131 A

  An object of the present invention is to provide a high-frequency component that is excellent in water resistance and dielectric properties and is easy to manufacture.

  The present invention relates to a high-frequency component in which a fluorine-containing inorganic compound is contained in a matrix resin.

In the present invention, by blending a fluorine-based inorganic compound with a resin, a high-frequency material using a resin material that has excellent water resistance and less changes in dielectric constant and dielectric loss without requiring a surface treatment step of the inorganic compound. Parts can be realized.
Further, in the present invention, since it is not necessary to surface-treat the fluorine-based inorganic compound, the surface treatment agent volatilizes when the high melting point resin is melt-kneaded without causing the problem that the surface treatment effect cannot be obtained. High melting point resins can be used effectively.

  The high-frequency component of the present invention is characterized by using a resin material containing a fluorine-based inorganic compound in a matrix resin.

  In the present invention, the fluorine-based inorganic compound is at least one selected from the group consisting of calcium fluoride, magnesium fluoride, strontium fluoride and barium fluoride, preferably from the group consisting of calcium fluoride, magnesium fluoride and strontium fluoride. Various types of inorganic compounds are used. By containing the fluorine-based inorganic compound, water resistance can be imparted to the high-frequency component, so that desired dielectric properties can be stably exhibited. Since such an effect can be obtained without subjecting the fluorine-based inorganic compound to a surface treatment, the production of a high-frequency component is simplified.

The fluorine-based inorganic compound usually has a particle form and is dispersed in the high-frequency component.
The fluorine-based inorganic compound preferably has an average primary particle size of 0.01 to 100 μm, particularly 0.1 to 10 μm. Such fluorine-based inorganic compounds are easily available as commercial products. It is also possible to obtain a fluorine-based inorganic compound by collecting fluoride-based waste discharged from a semiconductor factory or the like and synthesizing it.

  In this specification, the average primary particle size is a value measured by a particle size distribution measuring device (manufactured by Horiba Seisakusho).

  The content of the fluorine-based inorganic compound is preferably 1 to 60% by weight, particularly 5 to 40% by weight, based on the matrix resin described later. By adjusting the content, there is a resin reinforcing effect. For example, the mechanical strength can be improved.

As the matrix resin, known thermoplastic resins, thermosetting resins, and photocurable resins known as matrix resins in the field of high-frequency components can be used.
Specific examples of the thermoplastic resin include, for example, ABS, polyethylene, polypropylene, chlorinated polyolefin, alicyclic polyolefin, polystyrene, syndiotactic polystyrene, modified polystyrene, polyphenylene ether, modified polyphenylene ether, polyamide resin, acrylic resin, polyacetal. , Polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polysulfone, polyphenylene sulfide, polyimide, polyamide imide, polyether imide, polyether ketone, liquid crystal polyester, thermoplastic fluororesin and the like. Preferable thermoplastic resins include alicyclic polyolefin, polypropylene, polystyrene, ABS, syndiotactic polystyrene, polybutylene terephthalate, polyphenylene sulfide, liquid crystal polyester, and the like. Since it is not necessary to surface-treat the fluorine-based inorganic compound in the present invention, the surface treatment agent volatilizes when melt-kneading a high melting point resin without causing problems such as the effect of surface treatment not being obtained, This is because a high melting point resin can be used effectively.

  Specific examples of the thermosetting resin include, for example, phenol resin, melamine resin, urea resin, amino resin, unsaturated polyester resin, diallyl phthalate resin, epoxy resin, silicone resin, urethane resin, thermosetting polyphenylene ether, thermosetting Type polyimide and the like. Preferred thermosetting resins include epoxy resins, phenol resins, melamine resins and the like.

  Specific examples of the photocurable resin include, for example, epoxy acrylate, urethane acrylate, polyester acrylate, polyether acrylate, polybutadiene acrylate, and fluorinated acrylate.

Among the matrix resins, polypropylene, polystyrene, cyclic polyolefin, polyphenylene ether, syndiotactic polystyrene, polyphenylene sulfide, liquid crystal polyester, thermoplastic fluororesin, and the like are preferable from the viewpoint of dielectric characteristics, particularly dielectric loss.
From the viewpoint of moldability and production cost, thermoplastic resins, particularly cyclic polyolefin, polypropylene, polystyrene, polybutylene terephthalate and the like are preferable.

  One matrix resin may be used alone, or two or more matrix resins may be used in combination.

  The high frequency component may contain additives such as an antioxidant, a flame retardant, and a lubricant in addition to the above-described fluorine-based inorganic compound and matrix resin.

  Examples of the antioxidant, flame retardant, and mold release agent include phenolic antioxidants, halogen flame retardants, phosphate ester flame retardants, and higher fatty acid lubricants. The content of the antioxidant, the flame retardant, and the mold release agent is not particularly limited as long as the object of the present invention is achieved.

  High frequency components can be manufactured by various methods depending on the type of matrix resin used.

  Specifically, for example, when a thermoplastic resin is used as the matrix resin, first, the matrix resin, the fluorine-based inorganic compound, and other additives are melt-kneaded to obtain a resin composition. Next, it is molded into a predetermined shape by an injection molding method, an extrusion molding method, a transfer molding method, or the like, and cooled to obtain a high-frequency component.

  For example, when a thermosetting resin is used as the matrix resin, first, a low molecular weight monomer capable of forming the matrix resin, a fluorine-based inorganic compound, a curing agent, and other additives are mixed, and a raw material composition is prepared. obtain. Next, the raw material composition is polymerized and cured while being molded into a predetermined shape by an injection molding method, a compression molding method, or the like to obtain a high-frequency component.

  For example, when using a photocurable resin as the matrix resin, first, a low molecular weight monomer capable of forming the matrix resin, a fluorine-based inorganic compound, a curing agent, a photopolymerization initiator, and other additives are mixed. A raw material composition is obtained. Next, the raw material composition is polymerized and cured while being molded into a predetermined shape by an ultraviolet curing method or the like to obtain a high-frequency component.

  The high frequency component of the present invention may be used for any application as long as it is used as an electronic component for high frequency applications. Examples of such applications include antenna parts, relay parts, connector parts, and the like.

  When the high-frequency component of the present invention is used as, for example, an antenna component, any member can be used as long as it is a resin member in various types of high-frequency antennas such as a monoconical antenna, a lens antenna, a horn antenna, and a loop antenna. Is also useful. Specifically, for example, it is useful as a truncated cone part 2 in a monoconical antenna 1 as shown in FIG. 1, a dielectric lens in a lens antenna, a dielectric waveguide in a horn antenna, and a dielectric substrate in a loop antenna.

  When the high-frequency component of the present invention is used as, for example, a relay component, it is useful as any member as long as it is a resin member in a relay for high-frequency applications. For example, it is useful to use as the base member 11 in the high frequency relay 10 as shown in FIG. FIG. 2 is an exploded view showing various components of the relay.

  When the high-frequency component of the present invention is used as, for example, a connector component, it is useful as any member as long as it is a resin member in a connector for high-frequency applications. For example, it is useful to use as the housing member 21 in the high frequency connector 20 as shown in FIG.

  The high-frequency component of the present invention is also useful as a base member for a high-frequency substrate.

Example 1
After melt-kneading a mixture of 90 parts by weight of a cyclic olefin polymer (ZEONOR 1420R; manufactured by Nippon Zeon Co., Ltd.) and 10 parts by weight of calcium fluoride (manufactured by Wako Pure Chemical Industries, Ltd.), the mixture was 80 mm × 50 mm × 3 mm by injection molding. Molded into a shape to obtain a test piece.

(Example 2)
A test piece was obtained in the same manner as in Example 1 except that 10 parts by weight of magnesium fluoride (manufactured by Wako Pure Chemical Industries, Ltd.) was used instead of calcium fluoride.

(Example 3)
A test piece was obtained in the same manner as in Example 1 except that 10 parts by weight of strontium fluoride (Wako Pure Chemical Industries, Ltd.) was used instead of calcium fluoride.

(Comparative Example 1)
A test piece was obtained in the same manner as in Example 1 except that hydrophobized fused silica (UFP-30; manufactured by Denki Kagaku Kogyo Co., Ltd.) was used instead of calcium fluoride.

(Comparative Example 2)
A test piece was obtained in the same manner as in Example 1, except that non-hydrophobized fused silica (UFP-30; manufactured by Denki Kagaku Kogyo Co., Ltd.) was used instead of calcium fluoride.

(Reference Example 1)
A test piece was obtained in the same manner as in Example 1 except that calcium fluoride was not used.

(Evaluation)
The specimens were evaluated for the following items.
-Water resistance Water resistance was evaluated based on the water absorption rate. The change in water absorption was measured based on a water absorption test defined in ISO 62. In detail, the water absorption was measured about the test piece which was stored for 24 hours in the dry state of temperature 50 degreeC, took out in the environment of temperature 23 degreeC, and was immersed in water for 24 hours and 100 hours.

• Dielectric loss Dielectric loss was measured by the resonator perturbation method. As a measuring instrument, a network analyzer (manufactured by Agilent Technologies) and a 5 GHz resonator were used. Specifically, a test piece stored for 24 hours in a dry state at a temperature of 50 ° C. is taken out in an environment at a temperature of 23 ° C., and immediately after taking out (initial), immersed in water for 24 hours and 100 hours, the dielectric loss is measured. It was measured.

It can be seen that the water resistance is increased by blending the hydrophobic filler (Comparative Examples 1 and 2).
Further, the test piece containing the hydrophobized fused silica and the test piece containing the fluorinated inorganic compound have slightly higher water resistance than the test piece containing the fluorinated inorganic compound.

  From the above, the hydrophobized fused silica has been surface-treated, while the fluorine-based inorganic compound has almost the same performance despite being not surface-treated. It can be seen that if selected, the manufacturing process (surface treatment process) can be omitted and equivalent water resistance can be obtained. Therefore, the use of a fluorine-based inorganic compound is a very effective means.

The high frequency component of the present invention is useful as an electronic component for high frequency applications such as an antenna component, a relay component, and a connector component.
When the high-frequency component of the present invention is used for an antenna component, it is most effective to apply to millimeter-wave radio (for example, 30 GHz to 300 GHz) where the adverse effect of water is great. The antenna component has a remarkable transmission loss due to water absorption in the millimeter wave region, and the transmission characteristics are greatly deteriorated. However, since the high frequency component of the present invention is excellent in water resistance, it has excellent transmission properties even in such a millimeter wave region. This is because it can be effectively demonstrated.
When the high-frequency component of the present invention is used as a relay component, it is effective to use it as a base material having a microstrip line configuration. Since the high frequency component of the present invention is excellent in water resistance, it can effectively exhibit excellent transmission characteristics.
Even when the high-frequency component of the present invention is used as a connector component, excellent transmission characteristics can be effectively exhibited.

The schematic of an example of the antenna which can apply the high frequency component of this invention is shown. The schematic exploded view of an example of the relay which can apply the high frequency components of this invention is shown. The schematic of an example of the connector which can apply the high frequency component of this invention is shown.

Explanation of symbols

  1: antenna, 2: truncated cone part, 10: relay, 11: base member, 20: connector, 21: housing member.

Claims (4)

  A high-frequency component in which a fluorine-containing inorganic compound is contained in a matrix resin.   The high-frequency component according to claim 1, wherein the fluorine-based inorganic compound is at least one inorganic compound selected from the group consisting of calcium fluoride, magnesium fluoride, and strontium fluoride.   The high-frequency component according to claim 1 or 2, wherein the content of the fluorine-based inorganic compound is 1 to 60% by weight. The high-frequency component according to any one of claims 1 to 3, wherein the fluorine-based inorganic compound has an average primary particle size of 0.01 to 100 µm.

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