JP2007067330A - Sheet-type fluid circulating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet-type fluid circulating apparatus with flexibility, attaining low profile and weight reduction, capable of avoiding electromagnetic noises for malfunctioning electronic apparatuses. <P>SOLUTION: The sheet-type fluid circulating apparatus is configured to include a fluid path 15, having a closed structure provided in an inner space of a flexible sheet 11 of a stacked configuration, a fluid filled in the fluid path 15, fluid transport units 20, 30 provided in at least a part of the fluid path 15 of the flexible sheet 11 to circulate the fluid in the fluid path 15, an electromagnetic shield film 42 formed on at least either the front or the rear sides of the flexible sheet 11, a control circuit unit for controlling the fluid transport units 20, 30, and a ground section for grounding the electromagnetic shielding film 42. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a sheet-like fluid circulation device that prevents the influence of electromagnetic waves on an electronic device such as a personal computer and cools, keeps, or heats the device at a constant temperature.

  In an electronic device such as a personal computer, a heat dissipation measure is indispensable because heat generated by an electronic device such as a central processing unit (CPU) causes malfunction of an electronic circuit and greatly affects the product life. In addition to the recent increase in CPU performance, the amount of heat generation has increased, and the heat generation density inside the housing has increased due to the demand for smaller, thinner, and lighter devices. It is an important issue to take measures against heat dissipation.

  In the case of the conventional method in which the heat generating portion is cooled by the heat radiating fan, there are problems of weight, volume increase and noise due to the fan. On the other hand, using a heat pipe, which is a cooling device with excellent heat transport characteristics, the heat of the heat generating part such as CPU is transferred to the heat sink on the bottom of the PC housing or the display side to dissipate heat Are also used.

  However, in order to respond to the further thinning, weight reduction, and miniaturization of electronic devices in recent years, it is necessary to take a heat dissipation measure that effectively uses the limited space in the casing to the maximum. However, since the conventional heat pipe uses a metal tube container, there are problems such as lack of flexibility because the weight is relatively large and the thickness is thick.

  In response to such a problem, a sheet-like heat pipe using a container made of a film material instead of a conventional metal tube container has been developed (see, for example, Patent Document 1).

  FIG. 4 is a schematic diagram showing a cross-sectional structure of the sheet-like heat pipe shown in the above example. In addition, this cross-sectional structure has shown the cross-sectional structure orthogonal to the longitudinal direction of a sheet-like heat pipe. In this sheet-like heat pipe, a working fluid is sealed in a film-like sheet-like container 100 formed by vacuum-sealing two metal foils 101. The inside of the film sheet container 100 is partitioned into a plurality of steam flow paths 104 by a plurality of spacers (framework materials) 103. Further, wicks 105 for refluxing the working fluid are formed on both upper and lower surfaces of the steam flow path 104. The two metal foils 101 are bonded together with a sealant layer 106.

  In the case of this structure, it is necessary to narrow the gap of the steam flow path 104 in order to ensure sufficient flexibility as a sheet-like heat pipe. However, when the gap between the steam flow paths 104 is narrowed, the fluid resistance increases, and as a result, the circulation flow rate of the working fluid is limited, so that the heat radiation capability is limited.

  A cooling device that cools a circuit board on which electronic components are mounted by combining a small drive pump and a cooling plate as an active method that actively circulates fluid rather than a passive method like a cooling method using a heat pipe Has also been developed. In the case of this method, the size of the pump is a problem, and in order to use it for an electronic device such as a notebook personal computer, a technique for coupling and integrating the micropump with the flexible sheet is required.

As for the micropump, a method using the principle of an electrostatic actuator has been developed (for example, see Patent Document 2). A pump using such an electrostatic force can be manufactured by a simple process, can have a small configuration, and can control a minute flow rate of fluid.
JP 2001-165854 A Japanese Patent Laid-Open No. 06-264870

  The micro pump of the above example using the principle of the electrostatic actuator uses a silicon substrate, and is for controlling a minute flow rate formed by forming and processing a polyimide resin layer on the substrate. . Further, in this example, neither a disclosure nor a suggestion is made about a method and a structure in which a fluid is circulated by filling a flow path of a flexible sheet, for example.

  In addition, a pump using electrostatic force has a simple manufacturing process, but if it is disposed close to an electronic device that is vulnerable to electromagnetic noise, a malfunction may occur.

  The present invention has been made in view of such circumstances, and is a sheet-like fluid circulation that has flexibility, can be reduced in thickness and weight, and can avoid electromagnetic noise that causes malfunction of electronic equipment. An object is to provide an apparatus.

  In order to solve the above problems, a sheet-like fluid circulation device according to the present invention is provided inside a flexible insulating sheet having a laminated structure, and has a fluid flow path having a sealed structure, and a fluid filled in the flow path. A fluid transporting means for circulating a fluid in the flow path, and an electromagnetic wave formed on at least one of the front and back surfaces of the flexible insulation sheet. It comprises a shield film and a grounding means for grounding the electromagnetic shield film.

  With this configuration, the fluid filled in the flow path of the flexible insulating sheet can be circulated by the fluid transporting means formed using at least a part of the flow path. Even if the fluid transportation means is driven for fluid circulation, the electronic device can be prevented from being affected by electromagnetic noise, and the electronic device can be stably operated. Further, since the fluid transporting means is formed integrally with the flow path and the flow path has a closed structure, it is possible to prevent fluid from leaking even when the fluid circulation device is operated.

  Further, in the above configuration, the fluid transporting means may be an electrostatic drive pump provided on a flexible insulating sheet. Alternatively, a piezoelectric drive pump may be used.

  Further, in the case of an electrostatic drive pump, a plurality of conductor patterns are provided on a part of opposing surfaces of the flow path of the flexible insulating sheet, and a control circuit is provided on the plurality of conductor patterns in the fluid moving direction. Alternatively, the voltage may be sequentially applied.

  By adopting such a configuration, it is possible to ensure a structure in which the flow path is securely sealed, thus preventing fluid leakage during operation and preventing damage due to fluid leakage even when used in electronic equipment. Can do.

  In the above configuration, the fluid transporting means may be a heat pipe including a steam channel provided in the channel and a capillary channel for refluxing the fluid. By setting it as such a structure, since the electromagnetic shielding film | membrane is provided in the flexible heat pipe, not only can a heat-generating part be cooled, but electromagnetic noise can be prevented simultaneously.

  Further, in the above configuration, the electromagnetic shielding film may be a film in which a conductive material is formed by a physical film forming method or a printing method. Furthermore, the electromagnetic shielding film may be formed of a conductive material in a mesh shape.

  By adopting such a configuration, even if the fluid transporting means is arranged close to the electronic device, it is possible to prevent electromagnetic noise generated from the fluid transporting means from affecting the electronic device. Furthermore, electromagnetic noise radiated from the outside to the electronic device can be effectively prevented. In addition, the electromagnetic shielding film should just be formed in at least one of the front and back of a flexible insulating sheet. It is desirable to form an insulating protective film so as to cover this electromagnetic shield film.

  In the above configuration, a heating device, a cooling fin, or an electronic cooling device may be brought into close contact with a part of the flow path to heat, cool, or hold the temperature of the fluid.

  With this configuration, when the heat generating part of the electronic device is cooled using a part of the flow path of the fluid circulation device, the heat generating part is heated by bringing the cooling fan or the electronic cooling device into close contact. The fluid can be efficiently cooled. In the bio field, such as electronic equipment or genetic analyzers, when it is necessary to keep a constant temperature, the temperature of the fluid is kept constant using an electronic cooling device or a heating device or a combination thereof. If fluid is circulated, constant temperature can be maintained.

  In the present invention, the fluid transport means and the electromagnetic shielding film are integrally formed on the flexible insulating sheet, so that the fluid is circulated to cool, heat or hold the electronic device and other devices, and Electromagnetic noise for electronic equipment can also be prevented. As a result, there is a great effect that a stable and highly reliable operation of an electronic device that requires cooling, heating or constant temperature maintenance can be ensured.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the dimensions in the thickness direction, the width direction, and the length direction are enlarged and displayed for easy explanation of the configuration.

(First embodiment)
1A and 1B are diagrams showing a configuration of a sheet-like fluid circulation device according to a first embodiment of the present invention, in which FIG. 1A is a plan view, FIG. 1B is a cross-sectional view along the line A-A, and FIG. ) Is a cross-sectional view along the line BB.

  A sheet-like fluid circulation device 10 according to the present embodiment is provided inside a flexible insulating sheet 11 having a laminated structure, and has a fluid flow path 15 having a sealed structure, and a fluid (see FIG. Fluid transport means 20 and 30 provided in a part of the flow path 15 of the flexible insulating sheet 11 and circulating fluid in the flow path 15, and at least the front and back surfaces of the flexible insulating sheet 11 An electromagnetic shielding film 42 formed on one of the surfaces, a control circuit (not shown) for driving the fluid transporting means, and a grounding means (not shown) for grounding the electromagnetic shielding film 42 are provided. Consists of configuration.

  Furthermore, in the case of the sheet-like fluid circulation device 10 of the present embodiment, the fluid transporting means 20 and 30 are constituted by electrostatic drive pumps provided on the flexible insulating sheet 11. These fluid transporting means 20 and 30 have eight displacement generators 21 to 28 and 31 to 38 that deform the flexible insulating sheet 11 by applying a voltage, respectively. The displacement generators 21 to 28 and 31 to 38 are applied with voltages set by a control circuit (not shown) for a set time.

  In the present embodiment, when the flexible insulating sheet 11 of the sheet-like fluid circulation device 10 is brought into close contact with, for example, a heat generating portion of an electronic device, the flow path 15 provided with the fluid transporting means 20 and 30 is provided. It is fabricated so as to be in close contact with the heat generating part.

  The displacement generating parts 21 to 28 and 31 to 38 of the fluid transporting means 20 and 30 face each other on the surfaces of the upper layer sheet 12 and the lower layer sheet 13 as can be seen from FIGS. 1 (a) and 1 (b). It consists of the conductor pattern provided in this way. Further, as shown in FIG. 1B, a part of the upper layer sheet 12 and the lower layer sheet 13 is formed so as to protrude from the spacer 14 for bonding them, and is connected by a flexible wiring board in this region. The

  An electromagnetic shield film 42 is formed on almost the entire surface of the lower layer sheet 13. The electromagnetic shield film 42 can be formed of, for example, a conductive material by a physical film forming method or a printing method. For example, a metal such as copper or aluminum may be formed by vacuum deposition. Or you may form in the whole surface or mesh shape using paste which has electroconductivity, such as carbon and a silver paste. An insulating protective film 43 for protecting the electromagnetic shield film 42 is provided on the lower sheet 13. The insulating protective film 43 is provided with an opening, connected to the flexible wiring board, and connected to the grounding means via the flexible wiring board.

  As described above, in the sheet-like fluid circulation device 10 according to the present embodiment, the fluid circulates through the flow path 15 provided in the flexible insulating sheet 11 by the fluid transporting means 20 and 30. Therefore, if the heating device, the cooling fin, or the electronic cooling device is in close contact with a part of the flow path 15, the temperature of the fluid can be heated or cooled or kept at a constant temperature. If the electronic device is brought into close contact with the position of the flowing flow path 15, the electronic device can be heated or cooled or kept at a constant temperature.

  The flexible insulating sheet 11 is configured by laminating an upper layer sheet 12 and a lower layer sheet 13 made of resin such as polyimide resin, polyester resin, polyethylene terephthalate resin, and the like, with a spacer 14 made of similar resin. The flow path 15 can be formed by providing the flow path 15 in the spacer 14 in advance and bonding the upper layer sheet 12 and the lower layer sheet 13 together.

  In addition, the fluid transporting means 20 and 30 are constituted by electrostatic drive pumps in the present embodiment. This electrostatic drive pump has a plurality of displacement generators 21 to 28 and 31 to 38. These displacement generating portions 21 to 28 and 31 to 38 are configured by conductive films provided on the opposing surfaces of the upper layer sheet 12 and the lower layer sheet 13. These conductor films can be used by forming, for example, an aluminum film or a copper film by vapor deposition or sputtering.

  In addition, in order to make a deformation | transformation easy, you may make thinner only the upper layer sheet | seat 12 of the area | region part in which the displacement generation parts 21-28 and 31-38 of the fluid transport means 20 and 30 are provided. . Alternatively, only the region portion may be made of a material that is more easily elastically deformed.

  It is desirable to use high resistance water as the fluid. Ethylene glycol may be added. When ethylene glycol is added, it can be used even in cold regions. Further, any fluid other than water that has a low viscosity can be used without any particular limitation.

  Hereinafter, the mechanism of the fluid transporting means 20 and 30 for circulating the fluid in the sheet-like fluid circulation device 10 according to the present embodiment will be briefly described. Since the two fluid transporting means 20 and 30 are disposed at relatively distant positions and are the flexible insulating sheet 11, the flow path 15 is locally expanded or dented due to the pressure of the fluid. Thus, each fluid transport means 20, 30 can be operated separately and independently. Hereinafter, the fluid transporting unit 20 will be described, but the same applies to the fluid transporting unit 30. The case where the fluid flows counterclockwise in the flow path 15 in FIG. 1A will be described.

  First, the displacement generating part 21 of the fluid transporting means 20 is deformed to close the flow path 15 substantially. Since the flow path 15 is pushed by this deformation, the fluid existing in this region is pushed out in both directions. For this purpose, voltages that attract each other are applied to the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 by a control circuit (not shown). For example, when a positive voltage is applied to the conductor film of the lower layer sheet 13, a negative voltage is applied to the conductor film of the upper layer sheet 12. For example, when the distance between the conductor film of the upper sheet 12 and the conductor film of the lower sheet 13 is 100 μm, a voltage of about 100 V may be applied.

  Next, the displacement generator 22 is similarly deformed while the displacement generator 21 is deformed and the flow path 15 is closed. In order to cause this deformation, a voltage that attracts the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 is applied in the same manner as the displacement generator 21. By applying this voltage, the displacement generator 22 is deformed in the same manner as the displacement generator 21. When the displacement generator 22 is deformed, the displacement generator 21 is deformed in advance and the flow path 15 is almost closed, so that the fluid is pushed leftward in FIG.

  Next, the displacement generating part 23 is deformed and the flow path 15 is substantially closed while the displacement generating part 22 is deformed and the flow path 15 is substantially closed. At the same time, the displacement generator 21 is returned to the original state. For this purpose, a voltage is applied so that the conductor film of the upper layer sheet 12 attracts the conductor film of the lower layer sheet 13, as in the displacement generating unit 22. On the other hand, a voltage is applied to the displacement generator 21 so that the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 repel each other. If the voltage of the same direction as the voltage applied to the conductor film of the lower layer sheet 13 is applied to the conductor film of the upper layer sheet 12, both repel each other by an electrostatic force, so that the flow path 15 can be opened. By this deformation operation, the fluid in the displacement generation unit 23 is pushed out to the left in FIG.

  Next, the displacement generator 24 is deformed and the channel 15 is substantially closed while the displacement generator 23 is deformed and the channel 15 is substantially closed. At the same time, the displacement generator 22 is returned to its original state and the displacement generator 21 is closed. For this purpose, a voltage that attracts the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 is applied as in the case of the displacement generator 23. On the other hand, a voltage is applied to the displacement generator 22 so that the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 are repelled. If the voltage of the same direction as the voltage applied to the conductor film of the lower layer sheet 13 is applied to the conductor film of the upper layer sheet 12, both repel each other by an electrostatic force, so that the flow path 15 can be opened.

  Thereby, the fluid of the displacement generation part 24 is pushed out in the left direction of FIG. On the other hand, the fluid flows into the displacement generator 22 and the adjacent displacement generators 21 and 23 are closed.

  Next, the displacement generators 21 and 24 are deformed and the flow path 15 is substantially closed, and the displacement generators 22 and 25 are deformed to substantially close the flow path 15. At the same time, the displacement generator 23 is returned to the original state. For this purpose, a voltage that attracts the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 is applied as in the displacement generating units 21 and 24. On the other hand, a voltage is applied to the displacement generator 23 so that the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 are repelled. If the voltage of the same direction as the voltage applied to the conductor film of the lower layer sheet 13 is applied to the conductor film of the upper layer sheet 12, both repel each other by an electrostatic force, so that the flow path 15 can be opened.

  Thereby, the fluid of the displacement generation parts 22 and 25 is each pushed out in the left direction of FIG.

  Next, the displacement generators 23 and 26 are deformed and the channel 15 is substantially closed while the displacement generators 22 and 25 are deformed and the channel 15 is substantially closed. At the same time, the displacement generators 21 and 24 are returned to their original states. For this purpose, a voltage that attracts the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 is applied in the same manner as the displacement generators 22 and 25. On the other hand, a voltage is applied to the displacement generators 21 and 24 so that the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13 repel each other. If the voltage of the same direction as the voltage applied to the conductor film of the lower layer sheet 13 is applied to the conductor film of the upper layer sheet 12, both repel each other by an electrostatic force, so that the flow path 15 can be opened.

  Thereby, the fluid of the displacement generating parts 23 and 26 is pushed out to the left in FIG.

  By repeating the above operation, the fluid in the flow path 15 provided with the fluid transporting means 20 can be continuously pushed out to the left in FIG. When this operation is also performed for the fluid transport means 30, the fluid can be circulated counterclockwise as a whole.

  FIG. 2 is a diagram showing a configuration for cooling a circuit board used in an electronic device using the sheet-like fluid circulation device 10, wherein (a) is a plan view and (b) is a line BB. FIG. In FIG. 2, components of the sheet-like fluid circulation device 10 are not denoted by reference numerals, but will be described below with reference numerals based on the reference numerals of FIG.

  Flexible wiring boards 44 and 55 are connected to the sheet-like fluid circulation device 10 for connection to the conductor films of the respective displacement generating parts 21 to 28 and 31 to 38 of the fluid transporting means 20 and 30. The flexible wiring board 44 is connected to the conductor films of the displacement generating parts 21 to 28 of the fluid transport means 20. That is, for example, the conductor film provided on the upper layer sheet 12 and the conductor film provided on the lower layer sheet 13 are connected to the wiring pattern 47 of the flexible wiring board 44. The wiring pattern 47 is provided on both surfaces of the flexible wiring board 44 and is connected to the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13, respectively.

  Similarly, the displacement generators 22 to 28 are connected to the wiring patterns 48 to 54 of the flexible wiring board 44, respectively. Furthermore, the wiring patterns 46 provided on both sides are connected to the electromagnetic shield film 42 provided on the lower layer sheet 13.

  The other flexible wiring board 55 is connected to the conductor film of the displacement generating parts 31 to 38 of the fluid transport means 30. That is, for example, the conductor film provided on the upper layer sheet 12 and the conductor film provided on the lower layer sheet 13 are connected to the wiring pattern 57 of the flexible wiring board 55. The wiring pattern 57 is provided on both surfaces of the flexible wiring board 55 and is connected to the conductor film of the upper layer sheet 12 and the conductor film of the lower layer sheet 13, respectively.

  Similarly, the displacement generators 32 to 38 and the wiring patterns 58 to 64 of the flexible wiring board 55 are connected to each other. Furthermore, the wiring patterns 46 provided on both sides are connected to the electromagnetic shield film 42 provided on the lower layer sheet 13.

  The wiring patterns 47 to 54 and 57 to 64 of these flexible wiring boards 44 and 55 are connected to a control circuit (not shown). The wiring patterns 46 of the flexible wiring boards 44 and 55 are connected to a grounding means (not shown).

  In this way, the sheet-like fluid circulation device 10 to which the flexible wiring boards 44 and 55 are connected is placed on a circuit board 66 on which an electronic component 65 composed of a semiconductor element such as a CPU, a passive component, a weak heat-resistant component, and the like is mounted. It is in close contact with the electronic component 65 that needs to be cooled.

  On the other hand, the heat radiation fin 67 is disposed in close contact with a part of the flow path 15 of the sheet-like fluid circulation device 10. The heat dissipating fins 67 are forcibly cooled by a fan (not shown).

  When the fluid transporting means 20 and 30 of the sheet-like fluid circulation device 10 are driven in close contact with each other, the fluid cooled by the heat dissipating fins 67 circulates counterclockwise by the fluid transporting means 20 and 30 and causes the electronic component 65 to pass through. Cooling. Since the sheet-like fluid circulation device 10 has flexibility, it can be brought into close contact with the electronic components 65, but the flexible insulating sheet 11 is thus uneven. However, by deforming the flow path 15 itself by the fluid transporting means 20 and 30, the fluid can be circulated even in an uneven state.

  Moreover, since the electromagnetic shielding film 42 is provided on the lower layer sheet 13, electromagnetic noise generated from the fluid transporting means 20, 30 can be effectively shielded. Furthermore, since the entire surface of the flow path 15 is covered with the electromagnetic shielding film 42, the fluid can be prevented from leaking to the outside and can be used stably for a long period of time.

  In this embodiment, the electromagnetic shielding film 42 is provided only on the lower layer sheet 13 side, but may be provided on the upper layer sheet 12 side. By providing both sides, the influence of electromagnetic noise from the fluid transporting means 20 and 30 can be effectively shielded not only against the electronic components 65 of the circuit board 66 but also against other electronic devices. Further, prevention of leakage of fluid to the outside can be further improved.

  In the present embodiment, the example in which the sheet-like fluid circulation device is used for cooling the circuit board has been described, but the present invention is not limited to this. For example, it can be used even when it is necessary to keep the analysis piece at a constant temperature in the electronic equipment or biotechnology field. In this case, when it is necessary to keep the temperature lower than room temperature, the electronic cooling device may be brought into close contact with the heat dissipating fins to cool the fluid. In addition, a heater may be used when it is desired to heat and hold at a constant temperature. In these cases, a temperature sensor may be installed in a device to be maintained at a constant temperature, and the temperature of the electronic cooling device or the heating temperature of the heater may be controlled based on the temperature measurement result.

(Second Embodiment)
FIG. 3 is a cross-sectional view of a sheet-like fluid circulation device according to the second embodiment of the present invention. In the present embodiment, a fluid flow path having a hermetically sealed structure, a fluid filled in the flow path, and a flow path of the flexible insulation sheet are provided inside the flexible insulating sheet having a laminated structure. A fluid transporting means for circulating the fluid in the flow path, an electromagnetic shield film formed on the front and back surfaces of the flexible insulating sheet, and a grounding means for grounding the electromagnetic shield film ing.

  The fluid transport means is a heat pipe composed of a steam channel provided in the entire channel and a capillary channel for refluxing the fluid.

  In the heat pipe of the present embodiment, the upper sheet 74 and the lower sheet 78 face each other through a flexible spacer 79, and these are hermetically sealed by seal members 82 provided at both ends. A steam channel 81 and a capillary channel 80 are formed in a plurality of channels formed by the lower sheet 78 and the spacer 79. Note that the heat pipe shown in FIG. 3 has a sheet shape that is long in the direction perpendicular to the paper surface.

  The upper sheet 74 has a three-layer configuration in which a conductive film 72 is formed between the resin films 71 and 73. Similarly, the lower sheet 78 has a three-layer structure in which a conductive film 76 is formed between the resin films 75 and 77. The conductive films 72 and 76 are commonly connected at a portion not shown, and are connected to a ground G which is a grounding means.

  The sheet-like fluid circulation device configured as described above, that is, a heat pipe, is placed on a heat generating component 84 such as a semiconductor element such as a CPU, as in the first embodiment. The heat generating component 84 is mounted on the circuit board 83 and constitutes an electronic circuit including other electronic components (not shown). The heat generated by the heat generating component 84 is transferred to the fluid of the heat pipe, which is a sheet-like fluid circulation device, and is vaporized and flows to the radiating fin region provided in the depth direction perpendicular to the paper surface by the vapor channel 81. In the radiating fin region, the vapor is cooled to become a liquid. This liquid travels through the capillary channel 80 and again flows into the region of the heat generating component 84. By repeating this, the heat generating component 84 can be efficiently cooled.

  Further, in the present embodiment, conductive films 72 and 76 are formed on the upper sheet 74 and the lower sheet 78 of the sheet-like fluid circulation device, respectively, and the conductive films 72 and 76 form the circuit board 83. The electromagnetic noise to the electronic components including the heat-generating component 84 mounted on can be effectively shielded.

  Moreover, since these conductive films 72 and 76 have an effect of preventing gas permeation from the upper sheet 74 and the lower sheet 78, the reliability of the heat pipe can also be improved.

  The sheet-like fluid circulation device of the present invention includes a flow path provided in a flexible insulating sheet, a fluid filled in the flow path, and a fluid transport provided in a part of the flow path of the flexible insulating sheet. Means, an electromagnetic shielding film formed on at least one of the front and back surfaces of the flexible insulating sheet, and a grounding means for grounding the electromagnetic shielding film. In addition to preventing the influence of electromagnetic waves, the device can be cooled, kept warm, or heated to a certain temperature, which is useful for electronic devices and the bio field.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the sheet-like fluid circulation apparatus concerning the 1st Embodiment of this invention, (a) is a top view, (b) is sectional drawing along the AA line, (c) is B- Sectional view along line B It is a figure which shows the structure for cooling the circuit board used for an electronic device using the sheet-like fluid circulation apparatus concerning the embodiment, (a) is a top view, (b) is a BB line A sectional view along Sectional drawing of the sheet-like fluid circulation apparatus concerning the 2nd Embodiment of this invention Schematic diagram showing the cross-sectional structure of the sheet-like heat pipe shown in the conventional example

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet-like fluid circulation apparatus 11 Flexible insulating sheet 12 Upper layer sheet 13 Lower layer sheet 14, 79, 103 Spacer 15 Flow path 20, 30 Fluid transport means 21, 22, 23, 24, 25, 26, 27, 28, 31 , 32, 33, 34, 35, 36, 37, 38 Displacement generating part 42 Electromagnetic shield film 43 Insulating protective film 44, 55 Flexible wiring board 46, 47, 48, 49, 50, 51, 52, 53, 54, 57 , 58, 59, 60, 61, 62, 63, 64 Wiring pattern 65 Electronic component 66, 83 Circuit board 67 Radiation fin 71, 73, 75, 77 Resin film 72, 76 Conductive film 74 Upper sheet 78 Lower sheet DESCRIPTION OF SYMBOLS 80 Capillary flow path 81,104 Steam flow path 82 Seal member 84 Heat-generating component 100 Film-like sheet container 101 Metal foil 1 5 wick 106 sealant layer

Claims (8)

A fluid flow path provided inside a flexible insulating sheet having a laminated structure and having a sealed structure;
A fluid filled in the flow path;
A fluid transport means provided in at least a part of the flow path of the flexible insulating sheet and circulating the fluid in the flow path;
An electromagnetic shielding film formed on at least one of the front and back surfaces of the flexible insulating sheet;
A sheet-like fluid circulation device comprising grounding means for grounding the electromagnetic shielding film. The sheet-like fluid circulation device according to claim 1, wherein the fluid transporting means is an electrostatic drive type pump provided on the flexible insulating sheet. The sheet-like fluid circulation device according to claim 1, wherein the fluid transporting means is a piezoelectric drive pump provided on the flexible insulating sheet. The electrostatic drive pump has a plurality of conductor patterns on opposing surfaces of a part of the flow path of the flexible insulating sheet, and controls the plurality of conductor patterns toward the fluid movement direction. The sheet-like fluid circulation device according to claim 2, comprising a configuration in which a voltage is sequentially applied by the step. 2. The sheet-like fluid according to claim 1, wherein the fluid transporting means is a heat pipe including a vapor channel provided in the channel and a capillary channel for refluxing the fluid. Circulation device. The sheet-like fluid circulation device according to any one of claims 1 to 5, wherein the electromagnetic shielding film is a film formed of a conductive material by a physical film forming method or a printing method. The sheet-like fluid circulation device according to claim 6, wherein the electromagnetic shielding film is formed of a conductive material in a mesh shape. The heating device, the cooling fin, or the electronic cooling device is brought into close contact with a part of the flow path, and the temperature of the fluid is heated, cooled, or held, according to any one of claims 1 to 7. The sheet-like fluid circulation device described.

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