JP2007067200A - Method and device for manufacturing capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of polymerizer and capacitor for stably and efficiently realizing the formation of a solid state electrolytic layer upon manufacturing the solid state electrolytic capacitor with the solid state electrolytic layer, through current carrying technique employing an anode substrate with a dielectric oxide film formed on the surface thereof as an anode. <P>SOLUTION: Upon forming the solid state electrolytic layer by the current carrying technique employing the anode substrate with the dielectric oxide film formed on the surface thereof as the anode, the current carrying is effected by employing an anode collector comprising a conductive sponge. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for manufacturing a capacitor using an energization method, and more particularly to a method and an apparatus for manufacturing a capacitor that collectively form a polymer layer on a plurality of metal substrates. The method and apparatus for producing a capacitor of the present invention are particularly useful in the production of a solid electrolytic capacitor.

  In recent years, with the digitization of electrical equipment and the speeding up of personal computers, small and large-capacitance capacitors and low-impedance capacitors in the high-frequency region are required. Recently, a solid electrolytic capacitor using a conductive polymer having electronic conductivity as a solid electrolyte has been proposed.

  A basic element of a solid electrolytic capacitor is generally formed by forming a dielectric oxide film on an anode base (conductive base) made of a metal foil having a large specific surface area that has been etched, and a solid semiconductor as an electrode facing the outside. (Hereinafter referred to as a solid electrolyte) A layer is formed, and a conductor layer such as a conductive paste is preferably formed. Usually, in order to ensure insulation between the solid electrolyte (cathode portion) and the anode, a masking layer is further provided, and electrodes are appropriately added.

In general, a dielectric oxide film is formed on an anode substrate, and is polymerized to be immersed in a monomer solution that becomes a solid electrolyte. The anode substrate is a “+” electrode and the monomer solution is a “−” electrode (for example, stainless steel). A solid electrolyte layer is formed by conducting polymerization by energization (hereinafter also referred to as “power feeding”).
In general, since the anode substrate has a small size and it is desirable to process a plurality of pieces at once, usually, a plurality of elements are processed simultaneously using a supporting member. That is, as shown in FIG. 1, a plurality of anode substrates 2 are attached to a support member (referred to as a temporary bar) 1 (FIG. 1 (a)), and each anode substrate 2 is immersed in a monomer solution 3 (FIG. 1). (B)) and then conducting electropolymerization by energizing the temporary bar to form a solid electrolyte layer having a required thickness. The product portion 4 is separated from the remaining piece 5 to obtain a solid electrolytic capacitor element. Actually, a plurality of temporary bars are held in the frame, and the support members held in the frame are collectively processed (see FIGS. 2 to 3 described later).

In this case, it is preferable that a voltage is applied to each conductor 2 under basically the same conditions. For this reason, a method is adopted in which a “+” electrode is connected to each of the support members, or a metal current collector connected to a “+” power supply is brought into contact with a plurality of support members in common to supply power. (For example, JP-A-11-150044 (Patent Document 1), JP-A-2003-86467 (Patent Document 2), etc.).
However, in order to connect the “+” electrode to each of the support members, a large number of “+” electrode terminals and a circuit therefor are required, which complicates the apparatus configuration. In addition, continuity of the “+” electrode terminal may deteriorate over time due to liquid splashing, air oxidation, or the like during formation.
On the other hand, in order for the metal current collector connected to the “+” power source to contact the plurality of support members in common, uniform contact between the metal current collector and the support member must be realized. However, for example, since the support member is repeatedly used and bending and distortion accumulate each time, the position of the support member in the frame may be slightly displaced. When a flat plate is pressed as a current collector, the contact between the metal current collector and the support member is poor, uneven or unstable, which is one of the causes of chemical product defects and product quality variations. It was.
As a method of forming a solid electrolyte layer (semiconductor layer) as an electrode of a capacitor, for example, energization described in Japanese Patent Application Laid-Open No. 2000-188239 (Patent Document 3) and Japanese Patent Application Laid-Open No. Hei 2-299213 (Patent Document 4). There is a method by a method. These also have the same problems as in the case of chemical conversion described above.

Japanese Patent Laid-Open No. 11-150044 JP-A-2003-86467 JP 2000-188239 A JP-A-2-299213

  Therefore, an object of the present invention is to stabilize the electrolytic polymerization for forming a solid electrolyte layer, particularly the electrolytic polymerization to a large number of the substrates, including forming a solid electrolyte layer on an anode substrate on which a dielectric oxide film is formed. It is an object of the present invention to provide an electrolytic polymerization method and an electrolytic polymerization apparatus for efficiently realizing the above.

The inventors of the present invention have solved the above problems and devised a method for performing polymerization by an efficient and effective energization technique, and as a result, the above problems are caused by energization using an anode current collector containing a metal sponge. As a result, the present invention has been completed.
That is, this invention relates to the manufacturing method of the solid electrolytic capacitor including the process by the superposition | polymerization method and superposition | polymerization apparatus which are shown below, and the said superposition | polymerization method.

1. In a method for manufacturing a solid electrolytic capacitor in which a solid electrolyte layer is formed by an energization technique using an anode substrate having a dielectric oxide film formed on a surface as an anode, the energization is performed using an anode current collector including a conductive sponge. And a capacitor manufacturing method.
2. A plurality of anode bases fixed to a conductive support member are collectively immersed in a monomer solution that is polymerized to become a solid electrolyte, and the anode current collector is brought into close contact with the conductive support member to conduct electricity. 2. A method for producing a capacitor as described in 1.
3. 3. The method of manufacturing a capacitor as described in 2 above, wherein a plurality of conductive support members are held in a frame body, and an anode current collector is brought into close contact with the plurality of conductive support members held in the frame body and energized.
4). 4. The method for producing a capacitor according to any one of 1 to 3, wherein the conductive sponge is a metal sponge.
5. 5. The method for producing a capacitor as described in 4 above, wherein the metal sponge is an assembly of metal foils or metal wires intertwined with each other.
6). 6. The method for producing a capacitor as described in 4 or 5 above, wherein the metal sponge is a stainless sponge.
7). 7. The method for producing a capacitor according to any one of 1 to 6, wherein the conductive sponge is a sponge containing an abrasive.
8). 8. The method for producing a capacitor as described in 7 above, wherein the abrasive is selected from the group consisting of aluminum oxide, silicon oxide, cerium oxide, titanium oxide, silicon carbide, and diamond.
9. 9. The method for producing a capacitor as described in 7 or 8 above, wherein the abrasive has an average particle diameter of 1 to 120 μm.
10. 10. The method for producing a capacitor according to any one of 7 to 9, wherein the abrasive is fixed to the conductive sponge with a binder.
11. 11. The method for producing a capacitor as described in any one of 1 to 10 above, wherein the anode substrate has a porous layer on the surface.
12 12. The method for producing a capacitor according to any one of 1 to 11, wherein the anode substrate is selected from the group consisting of aluminum, tantalum, niobium, titanium, zirconium, magnesium, silicon, alloys thereof, and niobium monoxide.
13. In an apparatus for manufacturing a capacitor in which a solid electrolyte layer is formed by polymerizing a monomer by an energization technique using an anode substrate having a dielectric oxide film formed on the surface as an anode, the energization is performed through an anode current collector including a conductive sponge. Capacitor manufacturing apparatus characterized by the above.
14 14. The apparatus for producing a capacitor as described in 13 above, comprising a frame capable of holding a plurality of anode base support members, an anode current collector including a conductive sponge, and a monomer solution tank having a cathode portion.
15. 15. The capacitor according to 14, wherein the anode current collector is a member obtained by attaching a conductive sponge to one side of a metal plate, and further includes a mechanism for closely attaching the conductive sponge to a support member held by the frame body Manufacturing equipment.
16. A current collector material, wherein an abrasive is fixed to a conductive sponge using a binder containing a conductive polymer.

  According to the present invention, it is possible to stably and efficiently perform formation of a solid electrolyte layer on an anode substrate on which a dielectric oxide film is formed, in particular, polymerization on a large number of the substrates. For example, it is possible to stably and efficiently carry out a solid electrolyte layer forming step required in the production of a solid electrolytic capacitor, and it is possible to stably obtain a product with improved electrical characteristics.

Hereinafter, the method and apparatus of the present invention will be described more specifically.
As described above, the method of the present invention is a method for producing a solid electrolytic capacitor in which a solid electrolyte layer is formed by an energization technique using an anode substrate having a dielectric oxide film formed on the surface as an anode, and the energization is performed by an anode assembly including a conductive sponge. It is characterized by using an electric body.

  Although the anode current collector may be brought into direct contact with a plurality of anode substrates, the present invention is particularly useful in a method for collectively treating a plurality of anode substrates fixed to a conductive support member. That is, a plurality of anode bases fixed to a conductive support member are immersed in, for example, a monomer solution, and the anode current collector is brought into close contact with the conductive support member to conduct electricity. Such a method is suitable for a process in which an anode substrate for a solid electrolytic capacitor is attached to a conductive support member (the above-described temporary bar) and polymerization is performed by an energization method using this as a processing unit. This is useful when the conductive support member is held in the frame and the plurality of conductive support members held in the frame are collectively processed.

An example of the method of the present invention in this embodiment is schematically shown in FIG.
FIG. 2 shows a state in which a plurality of anode bases 15 are attached to the conductive support member 10 and are fitted into the frame 36. In the figure, only the surface of the foremost support member 10 is visible and the support member 10 behind it is only visible at the upper end, but the anode base 15 is attached to the lower end of any of the support members.
The figure shows a state in which a plurality of anode bases 15 are attached to the conductive support member 10 and are fitted into the frame 36. In the figure, the anode lead portion of the anode substrate 15 having the anode lead is attached to the conductive support member 10, but as shown in FIG. 1, the anode substrate having no anode lead (the anode substrate 2 in FIG. 1) is conductive. You may attach to the supporting member 10 (in FIG. 1, the supporting member 1). For attachment, welding or soldering may be used directly.
In the figure, the frame body 36 includes receiving end blocks 38 and 39 having slits 37 corresponding to the conductive support member 10, and leg portions 41 and 42.

In the polymerization treatment of the present invention, the apparatus shown in FIG. 2 is moved onto, for example, a monomer solution tank, and the anode substrate 15 on which the dielectric oxide film is formed is immersed to a desired depth. Next, the anode current collector 20 is placed on the conductive support member 10, and pressure is applied downward as shown by the arrow in the drawing to bring the anode current collector 20 into close contact with the conductive support member 10. For example, the frame 36 is placed and fixed so that the legs 41 and 42 are caught on the wall surface of the monomer solution tank (not shown). Next, the anode current collector 20 is pressed onto the conductive support member 10 by an appropriate pressing means. The bottom surface of the anode current collector 20 is basically a flat surface. However, when pressed against the conductive support member 10, the anode current collector 20 is deformed so as to wrap around its upper end and is in close contact therewith. At this time, when the conductive sponge is made of metal and / or contains an abrasive, an effect of polishing the contact surface with each conductive support member 10 also occurs.
Although not shown in the figure, the anode current collector 20 is connected to the “+” pole of the power source by a conventional method.
In FIG. 2, the anode current collector 20 is placed on the conductive support member 10 and pressure is applied downward to bring the anode current collector 20 into close contact with the upper end of the conductive support member 10. The current collector 20 is a rigid skeleton of a comb-shaped member, and a conductive sponge is provided in a portion that contacts the comb teeth, and the teeth are inserted between the adjacent conductive support members 10, and a lateral force is applied to make the conductive material conductive. You may comprise so that a sponge part may closely_contact | adhere to the upper surface of the electroconductive support member 10. FIG.
As described above, the anode current collector 20 may be in close contact with any portion of the conductive support member 10. However, since the monomer solution tank is usually located below the conductive support member 10, the conductive support member It is preferable to adhere to the upper end surface or the upper side surface of 10.

In the present invention, since the anode current collector includes a conductive sponge, it is assumed that the shape and position of the conductive support member are non-uniform by applying pressure while being in close contact with the metal substrate or the conductive support member. However, since the anode current collector is deformed and securely adheres to the upper end of the support member, good energization can be realized.
In addition, although the material of an electroconductive support member is not specifically limited, Iron, aluminum, copper, or these alloys, surface plating products, and surface covering products are mentioned. An example of an alloy is stainless steel.

  The conductive sponge may be a sponge member made of a conductor. However, in this application, “sponge” refers to a material having a cavity or void inside and exhibiting elasticity of a certain degree, and in addition to a normal sponge-like porous body, a so-called “metal” in which metal foils (ribbons) are entangled with each other. It also includes an assembly of metal foils or metal wires that are intertwined with each other, such as “sponge” or steel wool in which metal wires are intertwined with each other (herein these are collectively referred to as “metal sponges”). In the present invention, these metal sponges are preferably used. The foil or wire constituting the metal sponge may be any size and shape that exhibits flexibility (and desirably some degree of elasticity). Depending on the type of metal, for example, a metal foil having a thickness of 0.01 to 0.5 mm, preferably 0.01 to 0.1 mm, a width of 0.01 to 1 cm, preferably about 0.1 to 3 mm. Materials. A wire having a diameter of about 0.01 to 0.5 mm may be used. However, these numerical values are shown as a guide and do not limit the present invention.

The material of the conductive sponge is not particularly limited, but a metal or an alloy that can maintain good conductivity even in a high humidity environment is preferable. An example of such a metal is stainless steel. Since stainless steel has a certain degree of hardness, it is also useful in that the surface of the support member can be scraped and brought into contact with a fresh surface.
Furthermore, it is preferable that the conductive sponge contains an abrasive because the effect of maintaining a fresh support member surface is further enhanced. The abrasive is preferably carried on a metal sponge so as to avoid mixing into the monomer solution as much as possible. The abrasive may simply be carried in the network structure of the conductive sponge, but the abrasive may be fixed to the conductive sponge using a binder in order to carry the abrasive more reliably.
Examples of the material for the abrasive include aluminum oxide, silicon oxide, cerium oxide, titanium oxide, silicon carbide, and diamond.
The average particle size of the abrasive is preferably 1 to 300 μm, more preferably 5 to 100 μm because it may be difficult to be carried by the conductive sponge if it is too large or too small.
As the binder, a resin generally used as a binder (for example, a phenol resin, a urethane resin, a melamine resin, a urea resin, an acrylic resin, a polyester resin, an epoxy resin, a styrene resin, a vinyl resin, etc.) can be used. A resin (for example, a conductive polymer used as a solid electrolyte) is preferable.
The anode current collector may be a composite material of a conductive sponge portion and another member. Examples of materials that can be combined with the conductive sponge include rigid materials such as metal plates and ceramic plates, and elastic materials such as rubber plates. If the combination of the metal plate and the conductive sponge portion is used, it is easy to apply pressure from the metal plate side to closely adhere the conductive sponge portion to the metal substrate or the conductive support member. A conductive sponge portion may be attached to a part of the metal portion having a slag. Moreover, a connection part with an external power supply can be provided on the metal plate, and the conductive sponge part can be disposable. In the aspect which can be disposable, since the good conductivity of the surface of a conductive sponge is always maintained, it is especially preferable. In order to combine the conductive sponge with the metal plate, the whole is wrapped with a wire, a key-like portion is provided on the metal plate, and the conductive sponge is hooked or pierced, and a clamp means is provided on the metal plate to sandwich the conductive sponge. What is necessary is just to take the method of fixing.

The present invention can be applied to various anode substrates for solid electrolytic capacitors. The anode substrate is preferably porous. Moreover, as an anode base | substrate, Preferably the valve action metal, the oxide of the valve action metal which has electroconductivity, etc. are mentioned. Examples of such anode substrates include aluminum, tantalum, niobium, titanium, zirconium, magnesium, silicon or alloys thereof, and oboxide.
As a method of forming a dielectric oxide film on the surface of such an anode substrate, a known method or the like can be used. For example, when a porous tantalum sintered body is used, a dielectric oxide film is formed by anodic oxidation in an aqueous solution containing boric acid, phosphoric acid, adipic acid, or a sodium salt or an ammonium salt thereof. be able to.
As described above, the solid electrolyte layer is formed on the anode substrate on which the dielectric oxide film is thus formed. The formation of the solid electrolyte layer may be repeated a plurality of times together with re-chemical conversion.
Thereafter, if necessary, a conductor layer such as a carbon paste layer or a silver paste layer may be formed on the solid electrolyte layer and packaged to form a capacitor.

The apparatus of the present invention is characterized by having an anode current collector containing a conductive sponge, and is an apparatus for forming a solid electrolyte layer on an anode substrate on which a dielectric oxide film is formed by an energization technique, preferably a plurality of A frame body capable of holding the anode substrate, an anode current collector including a conductive sponge, and a polymer solution tank having a cathode portion. As described above, the shape of the frame body 36 is not particularly limited in the present invention, but the form shown in FIG. 2 or 3 is given as an example. As shown in FIG. 3, the apparatus of the present invention preferably includes a combination of a metal plate 25 and a conductive sponge 20, and includes a mechanism for bringing the conductive sponge into close contact with the support member held by the frame body. .
The present invention also provides a current collector material in which an abrasive is fixed to a conductive sponge using a binder containing a conductive polymer. Although this current collector material can be suitably used in the above-mentioned method and apparatus, it can be widely used in other technical fields as a current collector material when energizing a metal electrode plate.

Hereinafter, the present invention will be described more specifically with reference to examples. Note that these are illustrative examples, and the present invention is not limited to these examples.
Example 1
As a support member to which an anode substrate on which a dielectric oxide film is formed is attached, an anode substrate 32 having a dielectric oxide film formed on a stainless steel support member having a length of 250 mm, a width of 20 mm, and a thickness of 2 mm, leaving 30 mm on the left and right. The individual pieces were aligned and connected at equal intervals and equal dimensions by welding the lead portions.
The anode substrate on which the dielectric oxide film is formed has a CV 100,000 μF · V / g tantalum sintered body having an anode lead (size 4.5 × 3.3 × 1 mm, mass 81 mg, 3.3 × 1 mm from the lead wire 0.29). mmφ is exposed on the surface of 7mm) with 1% phosphoric acid aqueous solution at 80 ° C, 9V for 8 hours, and tantalum pentoxide is the main component on the inner pore surface and outer surface of the sintered body and part of the lead wire A dielectric layer is formed.
Two hundred supporting members to which the anode substrate on which this dielectric oxide film was formed were attached were prepared, and these supporting members were inserted into the frame at intervals of 6 mm and fixed in parallel.

An aqueous solution (monomer solution) containing 10% by mass of 3,4-ethylenedioxythiophene, 3% by mass of anthraquinone-2-sulfonic acid, and 20% by mass of ethylene glycol was placed in a solid electrolyte layer forming container (monomer solution tank), and The frame was positioned and installed on this container so that only the sintered body portion attached to the support member was immersed in the monomer solution.
As the anode-side current collector, a stainless steel plate with a length of 1290 mm, width 20 mm, and thickness 1 mm fixed to a stainless steel sponge with a wire is used, and the anode-side current collector is supported with the stainless steel sponge facing down. The stainless steel sponge and the supporting member were brought into close contact with each other by placing on the member and pressing the surface of the stainless steel plate.
Polymerization was carried out by applying current at a constant current of 25 mA for 2 hours with the anode side current collector as the anode side and the solid electrolyte layer forming container as the cathode. Thereafter, the frame body was pulled up, and washed with water, washed with ethanol and dried sequentially.

Next, in order to repair a minute LC (leakage current) defect in the dielectric layer, re-forming (80 ° C., 30 minutes, 7 V) was performed.
Polymerization and re-chemical conversion by the current application method were repeated 20 times, followed by washing with water, washing with alcohol, and drying to form a solid electrolyte layer that was the cathode of the capacitor.
Subsequently, only the sintered body portion was sequentially dipped and dried in the carbon paste layer and the silver paste layer to form a capacitor element having a conductor layer and a cathode portion.

Thereafter, the capacitor element was removed from the support member, and the capacitor element was placed and connected to a separately prepared copper alloy lead frame. Then, it was covered with an epoxy resin to produce 640 chip capacitors.
The capacity and ESR of the capacitor produced above were measured by the following method. The measurement results are shown in Table 1.
Capacitor capacity: The capacity was measured at room temperature and 120 Hz using an LCR measuring instrument manufactured by Hewlett-Packard Company.
ESR value: The equivalent series resistance of the capacitor was measured at 100 kHz.

Comparative Example 1
640 solid electrolytic capacitors were obtained under the same conditions as in Example 1 except that the current collector structure was a stainless steel flat plate having a length of 1290 mm, a width of 20 mm, and a thickness of 1 mm without having a sponge structure portion. Table 1 shows the electrical characteristics of the solid electrolytic capacitor thus obtained.

上記の結果に示されるように、本発明によれば、集電体と支持部材間の接触が確実なものとなり、コンデンサ素子の固体電解質層形成が安定し、固体電解コンデンサの種々の電気特性が改善され収率が向上する。

As shown in the above results, according to the present invention, the contact between the current collector and the support member is ensured, the formation of the solid electrolyte layer of the capacitor element is stable, and various electrical characteristics of the solid electrolytic capacitor are obtained. The yield is improved.

このように、研磨材を坦持した導電性スポンジを用いると、良好な特性を長時間維持することができる。 Example 2
After dipping in an isopropanol solution containing 17% by mass of 3,4-ethylenedioxythiophene in which 20% by mass of aluminum oxide having an average particle diameter of 50 μm is dispersed in the same stainless steel sponge as used in Example 1, 5 ° C. at 25 ° C. The mixture was allowed to stand for minutes, and then immersed in a mixed aqueous solution containing 20% by mass of an oxidizing agent (ammonium persulfate) and 3% by mass of a dopant (sodium naphthalene-2-sulfonate) to conduct oxidative polymerization. This impregnation step and polymerization step were repeated a total of 8 times. However, in the second and subsequent times, an isopropanol solution containing 3,4-ethylenedioxythiophene not containing aluminum oxide was used. In this manner, a stainless steel sponge having a conductive polymer as a binder and carrying an abrasive was obtained.
A solid electrolytic capacitor was prepared in the same manner as in Example 1 using this stainless steel sponge. The electrical characteristics of the obtained solid electrolytic capacitor were the same as in Example 1.
Furthermore, the same supporting member and stainless steel sponge were repeatedly used 100 times to produce a solid electrolytic capacitor. Table 2 shows the electrical characteristics of the solid electrolytic capacitor prepared for the 100th time.
Example 3
Example 1 was repeated 100 times with the same support member and stainless steel sponge to produce a solid electrolytic capacitor. Table 2 shows the electrical characteristics of the solid electrolytic capacitor prepared for the 100th time.

As described above, when a conductive sponge carrying an abrasive is used, good characteristics can be maintained for a long time.

  According to the method of the present invention, the polymer layer can be formed efficiently and stably by an energization method. In particular, it is useful in the production of solid electrolytic capacitors, and is effective in improving the production efficiency of solid electrolytic capacitors and improving the quality of products.

The schematic diagram which shows an example of the manufacturing process of a solid electrolytic capacitor. The schematic diagram which shows an example of the method of this invention. The schematic diagram which shows an example of the apparatus of this invention.

Explanation of symbols

1 Support member (temporary bar)
2 Anode substrate (formed with dielectric oxide film)
3 Treatment liquid 4 Anode substrate (solid electrolyte layer formed product)
5 Anode Base 10 Support Member 15 Metal Base 20 Conductive Sponge 25 Metal Plate 36 Frame 37 Slit 38, 39 Receiving Block 41, 42 Leg

Claims (16)

  In a method for manufacturing a solid electrolytic capacitor in which a solid electrolyte layer is formed by an energization technique using an anode substrate having a dielectric oxide film formed on a surface as an anode, the energization is performed using an anode current collector including a conductive sponge. And a capacitor manufacturing method.   A plurality of anode bases fixed to a conductive support member are collectively immersed in a monomer solution that is polymerized to become a solid electrolyte, and the anode current collector is brought into close contact with the conductive support member for energization. Item 14. A method for manufacturing a capacitor according to Item 1.   The method for manufacturing a capacitor according to claim 2, wherein a plurality of conductive support members are held in a frame, and an anode current collector is brought into close contact with the plurality of conductive support members held in the frame to conduct electricity.   The method for producing a capacitor according to claim 1, wherein the conductive sponge is a metal sponge.   The method of manufacturing a capacitor according to claim 4, wherein the metal sponge is a metal foil or an assembly of metal wires intertwined with each other.   6. The method of manufacturing a capacitor according to claim 4, wherein the metal sponge is a stainless sponge.   The method for manufacturing a capacitor according to claim 1, wherein the conductive sponge is a sponge containing an abrasive.   The method for manufacturing a capacitor according to claim 7, wherein the abrasive is selected from the group consisting of aluminum oxide, silicon oxide, cerium oxide, titanium oxide, silicon carbide, and diamond.   The method for producing a capacitor according to claim 7 or 8, wherein the abrasive has an average particle diameter of 1 to 120 µm.   The method for producing a capacitor according to claim 7, wherein the abrasive is fixed to the conductive sponge with a binder.   The method for producing a capacitor according to claim 1, wherein the anode substrate has a porous layer on the surface.   The method for producing a capacitor according to claim 1, wherein the anode base is selected from the group consisting of aluminum, tantalum, niobium, titanium, zirconium, magnesium, silicon, alloys thereof, and niobium monoxide.   In an apparatus for manufacturing a capacitor in which a solid electrolyte layer is formed by polymerizing a monomer by an energization technique using an anode substrate having a dielectric oxide film formed on the surface as an anode, the energization is performed through an anode current collector including a conductive sponge. Capacitor manufacturing apparatus characterized by the above.   The capacitor manufacturing apparatus according to claim 13, comprising: a frame body capable of holding a plurality of anode base support members; an anode current collector including a conductive sponge; and a monomer solution tank having a cathode portion.   The anode current collector is a member formed by attaching a conductive sponge to one side of a metal plate, and further includes a mechanism for closely attaching the conductive sponge to a support member held by the frame. Capacitor manufacturing equipment.   A current collector material, wherein an abrasive is fixed to a conductive sponge using a binder containing a conductive polymer.

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